CN114160982A - Processing system and processing method of laser speckle microstructure - Google Patents
Processing system and processing method of laser speckle microstructure Download PDFInfo
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- CN114160982A CN114160982A CN202111479542.8A CN202111479542A CN114160982A CN 114160982 A CN114160982 A CN 114160982A CN 202111479542 A CN202111479542 A CN 202111479542A CN 114160982 A CN114160982 A CN 114160982A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/355—Texturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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Abstract
The invention provides a processing system and a processing method of a laser speckle microstructure, wherein the processing system comprises: a coherent light source; the shaping device, the scattering module and the substrate are sequentially positioned on one side of the coherent light source in a first direction; the first direction is directed by the coherent light source to the shaping device; a photosensitive medium on the first surface of the substrate; the first surface is a surface of the substrate facing the scattering module. The light source system consists of coherent light source, shaping device and scattering module. When the processing is carried out, the speckle pattern can be regulated and controlled by regulating and controlling the light source system, the full-field non-contact exposure is carried out on the surface of the photosensitive medium, then the light path of the light source system is designed, the range of the speckle light field is regulated and controlled, and the microstructure with large range and controllable appearance is prepared on the surface of the photosensitive medium at one time.
Description
Technical Field
The invention relates to the technical field of laser, in particular to a processing system and a processing method of a laser speckle microstructure.
Background
At present, in the field of microstructure preparation, optical-related microstructure preparation is mainly traditional photoetching and laser direct writing, wherein a mask is carried on the design of an optical system, when light emitted by a coherent light source passes through the designed optical system and the mask, an exposure area corresponding to the pattern of the mask can be obtained on the surface of a photosensitive medium, and then a photoetching process is continued to transfer a microstructure formed after the surface of the photosensitive medium is processed to the surface of a related material; the laser direct writing is generally to directly ablate the surface of the object to be formed by using a femtosecond scanning laser, and then directly write the specific microstructure shape according to the designed energy of the scanning line.
For the two microstructure preparation methods, the traditional photoetching method has strong controllability on microstructure morphology, full-field exposure is carried out, but a mask plate needs to be carried, so that the requirement on the mask plate process is increased; although the laser direct writing does not need a mask plate and has strong controllability on the microstructure appearance, the laser direct writing method has the problem of time consumption when preparing the complicated microstructure appearance due to non-full-field exposure and point-by-point scanning of the laser.
Disclosure of Invention
In view of the above, in order to solve the above problems, the present invention provides a processing system and a processing method for a laser speckle microstructure, and the technical scheme is as follows:
a processing system for laser speckle microstructures, the processing system comprising:
a coherent light source;
the shaping device, the scattering module and the substrate are sequentially positioned on one side of the coherent light source in a first direction;
the first direction is directed by the coherent light source to the shaping device;
a photosensitive medium on the first surface of the substrate;
the first surface is a surface of the substrate facing the scattering module.
Preferably, in the processing system of the laser speckle microstructure, the processing system further includes: a lens positioned between the scattering module and the substrate.
Preferably, in the processing system of the laser speckle microstructure, the geometric center of the coherent light source, the geometric center of the shaping device, the geometric center of the scattering module, and the geometric center of the substrate are located on a same virtual straight line, and have a certain distance in the first direction.
Preferably, in the processing system of the laser speckle microstructure, the geometric center of the lens and the geometric center of the substrate are on the same virtual straight line.
Preferably, in the processing system of the laser speckle microstructure, the processing system further includes:
an optical camera located outside the processing system.
A method of processing a laser speckle microstructure, the method comprising:
adjusting the range of the speckle light field;
adjusting the size of speckles;
adjusting exposure energy;
and (5) carrying out a processing technology.
Preferably, in the processing method of the laser speckle microstructure, the processing process includes a pattern transfer process of the microstructure.
Compared with the prior art, the invention has the following beneficial effects:
the invention provides a processing system of a laser speckle microstructure, which consists of a coherent light source, a shaping device, a scattering module and a substrate. When the processing is carried out, the speckle pattern can be regulated and controlled by regulating and controlling the light source system, the full-field non-contact exposure is carried out on the surface of the photosensitive medium, then the light path of the light source system is designed, the range of the speckle light field is regulated and controlled, and the microstructure with large range and controllable appearance is prepared on the surface of the photosensitive medium at one time. Therefore, the invention can make the precision of the existing object with fine structure reach the level of micron or even submicron by simple, low-cost and high-efficiency process.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a processing system for a laser speckle microstructure according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a coherent light source light exit point of a processing system for a laser speckle microstructure according to an embodiment of the present invention;
fig. 3 is another schematic structural diagram of a processing system for a laser speckle microstructure according to an embodiment of the present invention;
fig. 4 is a schematic flow chart of a processing method of a laser speckle microstructure according to an embodiment of the present invention;
fig. 5 is an electron microscope image of a surface microstructure of a photosensitive medium processed by a laser speckle microstructure according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Based on the content recorded in the background art, in the invention creation process of the application, the inventor finds that when a microstructure morphology is prepared, a mask needs to be additionally carried in the traditional photoetching process, but the mask is low in cost, different masks need to be manufactured according to different structures, and the requirement on the mask process is increased, so that the method is undoubtedly huge in cost consumption. Although laser direct writing does not require a mask plate and directly prints a microstructure on the surface of the photosensitive medium by laser ablation, the method is time-consuming due to point-by-point scanning exposure, and the adopted light source device is expensive. In addition, a preparation method does not need a mask plate, but utilizes a sacrificial layer to prepare the microstructure, but the sacrificial layer needs to be changed differently when different microstructure morphologies are prepared by the method, so that the preparation process is complex and is not the optimal choice.
At present, the prior art for preparing microstructures also includes techniques for replicating microstructured surfaces, which are carried out by attaching a specific flexible thermosetting material to the surface of the microstructured material to be replicated and then obtaining a microstructure complementary to this surface. The most direct limitation of using other microstructure surface replications to produce microstructures is that the resulting microstructure topography is dependent on the microstructure topography being replicated, and thus, controllability is insufficient. Also, phase separation methods are not well-controlled to produce microstructures, which generally involve placing water droplets and a water-insoluble liquid in the same container, evaporating the water droplets from the solution by heating and solidifying the water-insoluble liquid using incompatible properties, so that pores remain in the solidified material after evaporation of the water droplets.
Based on these prior art drawbacks, the present application provides a processing system for laser speckle microstructures, comprising:
a coherent light source;
the shaping device, the scattering module and the substrate are sequentially positioned on one side of the coherent light source in a first direction;
the first direction is directed by the coherent light source to the shaping device;
a photosensitive medium on the first surface of the substrate;
the first surface is a surface of the substrate facing the scattering module.
The invention provides a processing system of a laser speckle microstructure, which consists of a coherent light source, a shaping device, a scattering module and a substrate. When the processing is carried out, the speckle pattern can be regulated and controlled by regulating and controlling the light source system, the full-field non-contact exposure is carried out on the surface of the photosensitive medium, then the light path of the light source system is designed, the range of the speckle light field is regulated and controlled, and the microstructure with large range and controllable appearance is prepared on the surface of the photosensitive medium at one time. Therefore, the invention can make the precision of the existing object with fine structure reach the level of micron or even submicron by simple, low-cost and high-efficiency process.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a processing system for a laser speckle microstructure according to an embodiment of the present invention.
The processing system of the laser speckle microstructure comprises:
a coherent light source 11;
a shaping device 12, a scattering module 13 and a substrate 14 which are positioned on one side of the coherent light source 11 in sequence in a first direction X;
said first direction X is directed by said coherent light source 11 towards said shaping device 12;
a photosensitive medium 15 on a first surface of the substrate 14;
the first surface is a surface of the substrate 11 facing the scattering module 13.
In this embodiment, the coherent light source 11 may be a 360nm ultraviolet laser light source, and the coherent light source 11 is used for emitting laser light.
It should be noted that, because the light source system using laser speckle has very high requirements on the wavelength and coherence of the light source, a coherent light source 11 with excellent performance is needed, and the wavelength of the 360nm ultraviolet laser light source in various laser light sources is short, so that the coherence is very good, and the light source system is suitable for being applied to the light source system.
Optionally, the shaping device 12 is a flat-top light shaping device, and the flat-top light shaping device is used for changing the laser light emitted by the coherent light source into flat-top distributed light.
It should be noted that, because the light intensity of the incident beam emitted by the single-mode laser is gaussian distributed on the cross section, and the gaussian distribution has the characteristic that the intensity of the light is larger as the distance from the center of the beam is shorter, the light intensity distribution of the speckle pattern formed after scattering is obviously divided, and the light intensity is larger as the distance from the center of the beam is closer. The flat-top light shaper is arranged in front of the scattering module, incident light is converted from Gaussian distribution into flat-top distribution, and the light intensity of the flat-top distribution is consistent within a certain distance from the center of the light beam, and is rapidly reduced to zero after the light intensity is away from the certain distance, so that the light intensity distribution of the formed speckle pattern is consistent after scattering, and almost no redundant stray light exists.
Optionally, the scattering module 13 contains a medium of scattering material, and the scattering module 13 is configured to scatter the light emitted by the shaping device 14 in the flat-top distribution as laser speckle.
It should be noted that the laser speckle is formed because coherent light is scattered or transmitted after being reflected from a rough surface or passing through a medium containing a scattering material, and spots with irregular intensity distribution and random positions are formed. In the embodiment of the present invention, laser speckle is formed after laser light emitted from the coherent light source 11 passes through the scattering module 13.
Further, the substrate 14 is used to support the photosensitive medium 15, and the photosensitive medium 15 can be irradiated by the speckle light field to form an exposure surface corresponding to the speckle pattern in the speckle light field.
It should be noted that, in this embodiment, the speckle pattern generated by the processing system is referred to as an objective speckle pattern. The speckle width of the objective speckle pattern is:
wherein lambda is the laser wavelength, Z is the distance from the scattering module to the substrate, and D is the diameter of the scattering surface of the light beam impinging on the scattering module.
Optionally, the geometric center of the coherent light source 11, the geometric center of the shaping device 12, the geometric center of the scattering module 13, and the geometric center of the substrate 14 are located on a same virtual straight line, and have a certain distance in the first direction X.
Further, referring to fig. 2, fig. 2 is a schematic diagram of a light exit point of a coherent light source of a processing system of a laser speckle microstructure according to an embodiment of the present invention.
It should be noted that the geometric centers of the coherent light source 11, the shaping device 12, the scattering module 13 and the substrate 14 are located on the same straight line with the light exit point 18 of the coherent light source. Because the geometric centers of the coherent light source 11, the shaping device 12, the scattering module 13 and the substrate 14 are on the same virtual straight line when the processing system is manufactured, errors caused by different axes of the light tool center can be avoided after the light is emitted.
It should be noted that, since the distance between the coherent light source 11, the shaping device 12, the scattering module 13 and the substrate 14 needs to be changed to control the shape and intensity of the laser speckle, there is a certain distance therebetween in the first direction X.
Referring to fig. 3, fig. 3 is a schematic structural diagram of another processing system for a laser speckle microstructure according to an embodiment of the present invention.
Optionally, in another embodiment of the present application, the processing system further includes:
a lens 16 located between the scattering module 13 and the substrate 14.
In this embodiment, the lens 16 is located between the scattering module 13 and the substrate 14 of the above-described embodiment.
Optionally, the lens 16 is a convex lens.
It should be noted that the lens 16 is a convex lens, which can collect light and increase the light intensity of coherent light.
Optionally, the geometric center of the lens 16 and the geometric center of the coherent light source 11 are located on the same virtual straight line, that is, the geometric center of the lens 16 and the light exit point 18 of the coherent light source are located on the same straight line.
Note that, in this embodiment, the speckle pattern generated by this processing system is referred to as a subjective speckle pattern. The speckle width of the subjective speckle pattern is:
wherein ZLTo penetrate throughDistance of mirror to substrate, DLIs the diameter of the scattering surface on the lens.
Optionally, the processing system further includes:
an optical camera 17 located outside the processing system.
It should be noted that since the room lights typically contain components of coherent light sources, the entire processing system should be placed in the optical darkroom 17.
Further, before formal microstructure processing based on laser speckle is carried out, the laser beam intensity distribution, the speckle pattern average contrast and speckle related parameters must be known, and then the related parameters are analyzed.
The coherent light source emits laser light, and the speckle pattern generated by the laser light follows Gaussian distribution in the process of beam transmission. The probability distribution of the speckle intensity pattern is:
wherein
For the speckle mean intensity, the probability density follows the negative exponential distribution law, and after variation, a negative exponential distribution function can be obtained:
speckles with such intensity distributions are called fully scattered speckles, meaning that the number of amplitude vectors of randomly scattered light approaches infinity, so that each phase is uniformly distributed over (-pi, pi).
Further, an average contrast C of the speckle pattern is calculated, which is defined as:
wherein sigmaIThe standard deviation of the light intensity is defined according to the variance of the light intensity:
from the above definitions it follows:
i.e., the average contrast C of the speckle pattern is always equal to 1, the contrast of the brightness and darkness of the speckle pattern is very apparent when it is viewed theoretically.
In reality, however, we cannot obtain a speckle pattern with an average contrast ratio satisfying 1, which is mainly limited by two factors.
Firstly, the speckle pattern is a non-complete scattering speckle pattern, once the phase of the phase amplitude vector of the random scattered light is not uniformly distributed, the average contrast C is smaller and smaller along with the increasing of the non-uniform degree, and when the random scattered light is lost and scattering does not occur, C is 0, and only a middle bright spot can be seen when the observation screen receives the light.
Secondly, the coherence of the coherent light source is limited, the coherence of the coherent light source is insufficient, the interference of light in a speckle light field can be influenced, and the average contrast of speckle patterns can be directly reduced. After the average contrast is insufficient, the most obvious feature of microstructure processing is that the microstructure surface prepared based on laser speckle is not neat and clear enough, which affects the efficacy of the final object, so we need to have careful requirements on the average contrast of speckle patterns.
In the device and the method for processing the microstructure based on the laser speckle, how to prepare microstructures with various shapes is the most important factor in the whole preparation process, so for real practical application, the application needs to carry out very independent adjustment on the light field range, the speckle width (d), the exposure power (P), the exposure time (T) and the exposure energy (E) in the speckle light field for exposure. The variation of these parameters can be designed by adjusting the processing system, which is also a cost saving and time saving aspect of the present application, and then these parameters are elaborated with reference to the embodiments.
First, according to the underlying speckle theory, the speckle width (d) is typically measured by the average of the autocorrelation function of the intensity of the light field.
In the above embodiment, it is known that, according to the different projection conditions, under the free space propagation condition, as shown in fig. 1, the formed speckle pattern is called an objective speckle pattern, and the speckle width thereof is:
wherein lambda is the laser wavelength, Z is the distance from the scattering module to the substrate, and D is the diameter of the scattering surface of the light beam impinging on the scattering module.
If the image of the scattering surface is collected by lens 16, as shown in FIG. 2, the resulting speckle pattern is called the subjective speckle pattern, and its speckle width is:
wherein ZLDistance of lens to substrate, DLIs the diameter of the scattering surface on the lens.
Optionally, after analyzing the data, based on the foregoing embodiment of the present invention, in another embodiment of the present invention, a processing method for a laser speckle microstructure is provided, and referring to fig. 4, fig. 4 is a schematic flow chart of the processing method for a laser speckle microstructure provided by the embodiment of the present invention.
The processing method comprises the following steps:
s101: and adjusting the range of the speckle light field.
It should be noted that, for adjusting the range of the speckle light field, three methods are generally adopted:
the first is to change the diffusion angle of the scattering module.
The second is to change the distance between the scattering module and the substrate or the scattering module, the lens and the substrate.
The third is to additionally place diaphragms with different sizes and shapes of light passing openings on the light path. Similarly, the geometric center of the aperture should be collinear with the point of emergence 18 of the coherent source light ray.
S102: and adjusting the speckle size.
It should be noted that, according to the speckle width formula in the above embodiment, the size of the speckle can be directly adjusted by selecting the coherent light sources 11 with different wavelengths. A beam expander may also be used to change the diameter of the laser beam. Or in objective speckle projection, the distance from the scattering module to the substrate is changed; in subjective speckle projection, the speckle size can be adjusted by changing the distance from the lens to the substrate.
Optionally, the beam expander is generally not used for changing the placing positions of other optical devices, and therefore the method for adjusting the speckle size can be used.
S103: the exposure energy is adjusted.
The exposure energy (E) is the exposure power (P) and the exposure time (T). The exposure power (P) is the output power of the laser, the exposure power is directly determined by the instrument equipment matched with the coherent light source, and the output power can be directly adjusted by adjusting the equipment parameters; the exposure time (T) is the time that the speckle light field contacts the object to be shaped and is usually constrained by an electronic shutter placed behind the coherent light source. The adjustment of exposure energy is actually to adjust the light energy absorption condition of the photosensitive medium, generally, the photosensitive medium is not replaced at will, the light absorption coefficient of the photosensitive medium is constant, the light energy absorption condition of the photosensitive medium is not affected, the light energy absorption condition of the photosensitive medium determines whether the microstructure morphology on the surface of the photosensitive medium can be finally presented under the set parameters, and because the microstructure processing based on laser speckle has the characteristic of maskless full field, the exposure energy must be controlled not to be too large or too small, otherwise, the overexposure or underexposure phenomenon can be generated.
Taking a photosensitive medium as a positive photoresist (the positive photoresist is characterized in that an exposed area is dissolved in a developing solution, and a non-exposed area is left), under a determined exposure power, the long-time exposure can cause an overexposure phenomenon, at the moment, the surface of the photoresist is almost completely dissolved by the developing solution, and no microstructure is generated; short-time exposure can cause an underexposure phenomenon, and at the moment, only a small part of the surface of the photoresist can be dissolved by a developing solution, so that the microstructure is sparse. Within a certain proper range of exposure time, whether the exposure area of the photoresist is through in the medium after the developing step can be determined by adjusting the length of the exposure time. And the penetrated photoresist is followed by an etching process, the surface structure of the photoresist is moved downwards to the surface of the corresponding material, and the non-penetrated photoresist is followed by a soft lithography process, so that the surface structure of the photoresist is copied to the surface of the corresponding material.
In addition, since the laser beam is a gaussian beam, the center of the exposed area on the surface of the photosensitive medium receives more energy and the edge receives less energy according to the characteristics of the gaussian distribution mentioned above, so that the depth of the entire exposed area after development is deeper at the center and shallower at the edge, which is not favorable for the photosensitive medium to form a uniform microstructure.
And the flat-top light beam after passing through the flat-top shaping device is used, and the energy received by the exposure area on the surface of the photosensitive medium is consistent according to the characteristic of the aforementioned flat-top distribution, so that the depth of the photosensitive medium after being developed is integrally consistent for the whole exposure area, and the uniform microstructure of the photosensitive medium is favorably formed.
S104: and (5) carrying out a processing technology.
It should be noted that the processing technology is various microstructure processing technologies based on laser speckle
Further, optionally, the processing process includes a pattern transfer process of the microstructure.
Further, in order to intuitively feel the feasibility of the application, the application provides a microstructure obtained based on laser speckle lithography.
Referring to fig. 5, fig. 5 is an electron microscope image of the surface microstructure of the photosensitive medium processed by the laser speckle microstructure according to the embodiment of the present invention.
As shown in fig. 5, the microstructure topography of the surface of the photosensitive medium, which is caused by the transfer of the laser speckle pattern onto the photosensitive medium, can be clearly seen.
It should be noted that, in the conventional lithography, when a large-area microstructure needs to be prepared, the conventional lithography depending on a mask can only be gradually performed by lithography and then spliced, which is a huge loss in cost and time, while the laser speckle lithography can be performed to process a large-area microstructure at one time, which is time-saving and labor-saving, and is undoubtedly a great advantage for things requiring a large-area microstructure, such as wood articles, glass articles, the surface of which is specially engraved in a large area or solar cells, to prepare a large-area microstructure, thereby increasing the light energy capture.
The invention can also effectively prepare the surface disordered microstructure, the surface disordered structure is reasonably utilized, the surface of the material can often have super lyophobic property (water, oil and the like), or an object is directly designed to be overlapped by a plurality of layers of disordered microstructure surfaces layer by layer, the specific effect of the object and the light path design of the corresponding overlapped layer are required to be further explored, and the invention can also be applied to the preparation of the micro sensor, and the sensor prepared by the method has very large excavation space no matter the type, the sensitivity, the output efficiency and the size.
Furthermore, the mask in traditional photoetching can be designed into a random disordered microporous structure, and the microstructure appearance corresponding to the similar speckle pattern can be obtained by attaching the photosensitive medium.
The processing system and the processing method for the laser speckle microstructure provided by the invention are described in detail above, and the principle and the implementation mode of the invention are explained by applying specific examples, and the description of the examples is only used for helping to understand the method and the core idea of the invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
It should be noted that, in the present specification, the embodiments are all described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
It is further noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include or include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. A system for processing a laser speckle microstructure, the system comprising:
a coherent light source;
the shaping device, the scattering module and the substrate are sequentially positioned on one side of the coherent light source in a first direction;
the first direction is directed by the coherent light source to the shaping device;
a photosensitive medium on the first surface of the substrate;
the first surface is a surface of the substrate facing the scattering module.
2. The processing system of claim 1, further comprising: a lens positioned between the scattering module and the substrate.
3. The processing system of claim 1, wherein the geometric center of the coherent light source, the geometric center of the shaping device, the geometric center of the scattering module, and the geometric center of the substrate are on a same virtual straight line and are spaced apart in the first direction.
4. The processing system of claim 2, wherein the lens geometric center is on the same virtual straight line as the base geometric center.
5. The processing system of claim 1, further comprising:
an optical camera located outside the processing system.
6. A processing method of a laser speckle microstructure is characterized by comprising the following steps:
adjusting the range of the speckle light field;
adjusting the size of speckles;
adjusting exposure energy;
and (5) carrying out a processing technology.
7. The process of claim 6 wherein the process comprises a pattern transfer process of microstructures.
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| CN116242252A (en) * | 2023-05-11 | 2023-06-09 | 之江实验室 | Scattering imaging method with positioning and size measuring functions |
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| CN116242252A (en) * | 2023-05-11 | 2023-06-09 | 之江实验室 | Scattering imaging method with positioning and size measuring functions |
| CN116242252B (en) * | 2023-05-11 | 2023-08-15 | 之江实验室 | Scattering imaging method with positioning and size measuring functions |
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Application publication date: 20220311 |