CN114156378A - Single-side light-emitting LED packaging method - Google Patents

Single-side light-emitting LED packaging method Download PDF

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Publication number
CN114156378A
CN114156378A CN202111452837.6A CN202111452837A CN114156378A CN 114156378 A CN114156378 A CN 114156378A CN 202111452837 A CN202111452837 A CN 202111452837A CN 114156378 A CN114156378 A CN 114156378A
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CN
China
Prior art keywords
led
epoxy resin
led chip
glue
fluid
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Pending
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CN202111452837.6A
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Chinese (zh)
Inventor
曾少林
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Shenzhen Deming New Microelectronics Co ltd
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Shenzhen Deming New Microelectronics Co ltd
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Priority to CN202111452837.6A priority Critical patent/CN114156378A/en
Publication of CN114156378A publication Critical patent/CN114156378A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

The application provides a single-side light-emitting LED packaging method, which comprises the following steps: placing the LED prefabricated member inside the fence; tiling a fluid epoxy inside the fence to the top of the LED chip assembly; baking the LED prefabricated member paved with the fluid epoxy resin until the fluid epoxy resin is cured to form an epoxy resin layer; performing first cutting penetrating from the epoxy resin layer positioned between the adjacent LED chip assemblies to the surface of the support along the arrangement direction of the LED chip assemblies; filling the shading glue into the groove formed by the first cutting; and baking the LED prefabricated member filled with the shading glue until the shading glue is solidified to form a shading layer, and obtaining the LED packaging module. The application can effectively improve the sealing performance of the LED packaging module and prevent the LED packaging module from being affected with damp; in addition, the light source that the LED chip subassembly sent can follow the direction of perpendicular to support and shoot out, possesses better light-emitting efficiency.

Description

Single-side light-emitting LED packaging method
Technical Field
The application relates to the technical field of LED packaging, in particular to a single-side luminous LED packaging method.
Background
The LED chip is a solid semiconductor device, also called an LED light-emitting chip, and is a core component of an LED lamp. The main function of the LED chip is to convert electric energy into light energy, the core light-emitting part of the LED chip is a PN junction tube core formed by a P-type semiconductor and an N-type semiconductor, when minority carriers injected into the PN junction are combined with majority carriers, visible light, ultraviolet light or near infrared light can be emitted, but photons emitted by the PN junction area are non-directional, namely, the photons are emitted to all directions with the same probability, so that not all light generated by the tube core can be released, and the LED chip mainly depends on the quality of semiconductor materials, the structure and the geometric shape of the tube core, the internal structure of a package, the packaging material and the like.
In the manufacturing process of the LED lamp, the LED chip needs to be packaged, and wafer level chip packaging is an effective method for reducing cost. The wafer level chip packaging technology is a technology for obtaining a single finished chip by cutting after a whole wafer is subjected to packaging test, and the size of the packaged chip is consistent with that of a bare chip. The wafer level chip packaging technology changes the traditional packaging technology and meets the increasingly light, thin, short, small and low-price requirements of the market on microelectronic products. The size of chips manufactured by the wafer level chip packaging technology reaches a high degree of miniaturization, and the cost is significantly reduced as the size of chips is reduced and the size of wafers is increased.
In the existing wafer level chip packaging technology, glue is directly dispensed on the surface of an LED chip through a glue dispenser, and the surface tension of plastic sealant is utilized to form the shape of a lens above the LED chip, so that the LED chip is wrapped in the plastic sealant. The method has the disadvantages that the single LED chip needs to be subjected to glue dispensing in sequence, the shape of the lens completely depends on the surface tension of the plastic package glue, and the LED chip is easily coated unevenly or adhered to the substrate incompletely, so that the LED chip cannot work normally after being affected with damp; in addition, in the application fields of full-color screens, flash lamps and the like, the LED light source is required to be emitted along a single direction, and the LED packaging product manufactured by the method has a light leakage phenomenon, so that the effect of emitting the light source along the direction vertical to the substrate cannot be realized.
Disclosure of Invention
In view of the above, the present application is proposed to provide a single-sided light emitting LED packaging method that overcomes or at least partially solves the above problems, comprising:
a single-side light-emitting LED packaging method is used for packaging an LED prefabricated member to obtain an LED packaging module; the LED prefabricated part comprises a support and a plurality of LED chip assemblies which are arranged on the support in an array mode, and gaps are formed between every two adjacent LED chip assemblies; the method comprises the following steps:
placing the LED pre-form inside a fence; the top of the fence is higher than the top of the LED prefabricated member;
tiling a fluid epoxy inside the fence to the top of the LED chip assembly;
baking the LED prefabricated member paved with the fluid epoxy resin until the fluid epoxy resin is cured to form an epoxy resin layer;
performing first cutting penetrating the epoxy resin layer between the adjacent LED chip assemblies to the surface of the support along the arrangement direction of the LED chip assemblies;
filling light-shielding glue into the groove formed by the first cutting;
and baking the LED prefabricated member filled with the shading glue until the shading glue is cured to form a shading layer, and obtaining the LED packaging module.
Preferably, said tiling a fluid epoxy inside said fence to the top of said LED chip assembly comprises:
spreading a fluid epoxy resin inside the fence to a preset height at the top of the LED chip assembly; the preset height is 1/3-2 times the thickness of the LED chip assembly.
Preferably, the temperature of the LED pre-form is maintained at 50-80 ℃ while the fluid epoxy is spread inside the enclosure on top of the LED chip assembly.
Preferably, the baking treatment of the LED preform tiled with the fluid epoxy resin until the fluid epoxy resin is cured to form an epoxy resin layer includes:
and baking the LED prefabricated member paved with the fluid epoxy resin at the temperature of 130-150 ℃ until the fluid epoxy resin is cured to form the epoxy resin layer.
Preferably, the baking the LED preform filled with the light shielding glue until the light shielding glue is cured to form a light shielding layer includes:
and baking the LED prefabricated member filled with the light shielding glue at the temperature of 100-150 ℃ until the light shielding glue is cured to form the light shielding layer.
Preferably, the method further comprises the following steps:
and along the arrangement direction of the LED chip assemblies, performing second cutting on the shading layer penetrating to the bottom of the support to obtain a plurality of LED packaging monomers.
Preferably, the fluid epoxy resin has a viscosity of 17000-38000cps and a viscosity retention time of 0.15-3.5 h.
Preferably, the bending strength of the epoxy resin layer is not less than 13.9kg/mm2The hardness is 88-92HD, and the water absorption is less than 0.8 Wt%.
Preferably, the light shielding glue is black light shielding glue or white light shielding glue; the black shading glue is a mixture of fluid epoxy resin and carbon; the white shading glue is a mixture of fluid epoxy resin and boron nitride.
Preferably, the LED chip assemblies are arranged on the surface of the support in a manner of 10-20 rows by 25-50 columns.
The application has the following advantages:
in an embodiment of the application, the LED prefabricated member is arranged inside the fence; the top of the fence is higher than the top of the LED prefabricated member; tiling a fluid epoxy inside the fence to the top of the LED chip assembly; baking the LED prefabricated member paved with the fluid epoxy resin until the fluid epoxy resin is cured to form an epoxy resin layer; performing first cutting penetrating the epoxy resin layer between the adjacent LED chip assemblies to the surface of the support along the arrangement direction of the LED chip assemblies; filling light-shielding glue into the groove formed by the first cutting; baking the LED prefabricated member filled with the shading glue until the shading glue is solidified to form a shading layer, and obtaining the LED packaging module, so that the epoxy resin layer is fully coated outside the LED chip assembly and is stably connected with the bracket, the sealing performance of the LED packaging module can be effectively improved, and the LED packaging module is prevented from being affected with damp; in addition, the light source that the LED chip subassembly sent can be followed the perpendicular to the direction of support is jetted out, possesses better light-emitting efficiency.
Drawings
In order to more clearly illustrate the technical solutions of the present application, the drawings needed to be used in the description of the present application will be briefly introduced below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive labor.
Fig. 1 is a flowchart illustrating steps of a method for packaging a single-sided LED according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of a fence, an LED preform and an epoxy layer in a single-sided light emitting LED packaging method according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a fence, an LED preform, an epoxy layer, and a light shielding layer in a single-sided light emitting LED packaging method according to an embodiment of the present disclosure.
The reference numbers in the drawings of the specification are as follows:
1. an LED prefabricated part; 11. a support; 12. an LED chip assembly; 2. an epoxy resin layer; 3. a light-shielding layer; 4. and (4) fencing.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, the present application is described in further detail with reference to the accompanying drawings and the detailed description. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that, in any embodiment of the present application, the LED packaging method is used for packaging an LED preform 1 to obtain an LED packaging module; the LED prefabricated member 1 comprises a support 11 and a plurality of LED chip assemblies 12 arrayed on the support 11, and gaps are formed between the adjacent LED chip assemblies 12.
Referring to fig. 1 to 3, in an embodiment of the present application, a method for packaging a single-sided light emitting LED is provided;
the method comprises the following steps:
s110, placing the LED prefabricated member 1 inside a fence 4; the top of the fence 4 is higher than the top of the LED prefabricated member 1;
s120, spreading fluid epoxy resin on the top of the LED chip assembly 12 inside the fence 4;
s130, baking the LED prefabricated member 1 paved with the fluid epoxy resin until the fluid epoxy resin is cured to form an epoxy resin layer 2;
and S140, performing first cutting penetrating the epoxy resin layer 2 between the adjacent LED chip assemblies 12 to the surface of the bracket 11 along the arrangement direction of the LED chip assemblies 12.
S150, filling the shading glue into the groove formed by the first cutting;
s160, baking the LED prefabricated member 1 filled with the shading glue until the shading glue is solidified to form a shading layer 3, and obtaining the LED packaging module.
In the embodiment of the present application, the LED preform 1 is fabricated by placing it inside the enclosure 4; the top of the fence 4 is higher than the top of the LED prefabricated member 1; tiling a fluid epoxy inside the fence 4 to the top of the LED chip assembly 12; baking the LED prefabricated member 1 paved with the fluid epoxy resin until the fluid epoxy resin is cured to form an epoxy resin layer 2; performing first cutting penetrating the epoxy resin layer 2 between the adjacent LED chip assemblies 12 to the surface of the bracket 11 along the arrangement direction of the LED chip assemblies 12; filling light-shielding glue into the groove formed by the first cutting; baking the LED prefabricated member 1 filled with the shading glue until the shading glue is cured to form a shading layer 3, so as to obtain the LED packaging module, wherein the epoxy resin layer 2 is fully coated outside the LED chip assembly 12 and is stably connected with the bracket 11, so that the sealing performance of the LED packaging module can be effectively improved, and the LED packaging module is prevented from being affected with damp; in addition, the light source that LED chip subassembly 12 sent can follow the perpendicular to the direction of support 11 is penetrated, possesses better light-emitting efficiency.
Next, a method of packaging a single-sided light emitting LED in the present exemplary embodiment will be further described.
Placing the LED prefabricated member 1 inside the fence 4 as described in the step S110; the top of the fence 4 is higher than the top of the LED pre-form 1.
The fence 4 is a prefabricated packaging mold with the size matched with that of the LED prefabricated member 1. When the LED prefabricated member 1 is placed inside the fence 4, the inner wall of the fence 4 is attached to the edge of the LED prefabricated member 1, and the top of the fence 4 is higher than the top of the LED prefabricated member 1 by a first preset value; the first preset value is 1/3-2 times the thickness of the LED chip assembly 12.
As set forth in step S120, a fluid epoxy is laid down inside the pen 4 to the top of the LED chip assembly 12.
And (3) paving the fluid epoxy resin on the surface of the LED prefabricated member 1 through a glue dispenser. The fluid epoxy resin is flattened to fill the gap sufficiently and to cover the sides and top of the LED chip assembly 12.
The LED preform 1 tiled with the fluid epoxy is baked until the fluid epoxy is cured to form an epoxy layer 2 in the step S130.
And enabling the surface, which is tiled with the fluid epoxy resin, of the LED prefabricated part 1 to face upwards, and placing the whole structure formed by the fence 4, the LED prefabricated part 1 and the fluid epoxy resin in a baking machine for baking until the fluid epoxy resin is cured on the surface of the LED prefabricated part 1 to form the epoxy resin layer 2.
As described in step S140, the epoxy resin layer 2 between the adjacent LED chip assemblies 12 is first cut through to the surface of the support 11 along the arrangement direction of the LED chip assemblies 12.
The width of the first cut is less than the gap, preferably 1/5-1/3 of the gap.
In step S150, a light-shielding glue is filled into the groove formed by the first cutting.
And filling the shading glue into the groove through a glue dispenser. The shading glue can be fully filled in the groove after being flattened.
In step S160, the LED preformed unit 1 filled with the light-shielding glue is baked until the light-shielding glue is cured to form a light-shielding layer 3, so as to obtain the LED package module.
And enabling the surface, filled with the shading glue, of the LED prefabricated part 1 to face upwards, placing the whole structure consisting of the fence 4, the LED prefabricated part 1, the epoxy resin layer 2 and the shading glue in a baking machine for baking treatment until the shading glue is cured in the groove to form the shading layer 3, taking down the fence 4, and obtaining the LED packaging module.
In this embodiment, the spreading the fluid epoxy inside the enclosure 4 on top of the LED chip assembly 12 includes:
spreading a fluid epoxy inside the enclosure 4 to a preset height on top of the LED chip assembly 12; the predetermined height is 1/3-2 times, preferably 1/3, 1 or 2 times the thickness of the LED chip assembly 12.
In this embodiment, the temperature of the LED pre-form 1 is maintained at 50-80 ℃ while the fluid epoxy is spread inside the enclosure 4 on top of the LED chip assembly 12.
Specifically, the bottom of the LED preform 1 is heated to be kept at 50 to 80 ℃ when the fluid epoxy resin is filled, and the fluid epoxy resin is biased to liquid state in the flowing state in the temperature environment, so that the fluidity of the fluid epoxy resin on the surface of the LED preform 1 can be improved, and the flattening efficiency can be accelerated.
In this embodiment, the baking the LED preform 1 tiled with the fluid epoxy resin until the fluid epoxy resin is cured to form the epoxy resin layer 2 includes:
and baking the LED prefabricated member 1 paved with the fluid epoxy resin at the temperature of 130-150 ℃ until the fluid epoxy resin is cured to form the epoxy resin layer 2. Specifically, the baking temperature was set to 150 ℃.
In this embodiment, the baking the LED preformed unit 1 filled with the light shielding glue until the light shielding glue is cured to form the light shielding layer 3 includes:
and baking the LED prefabricated member 1 filled with the light shielding glue at the temperature of 100-150 ℃ until the light shielding glue is cured to form the light shielding layer 3. Specifically, the baking temperature was set to 150 ℃.
In this embodiment, the method further includes:
and secondly, cutting the shading layer 3 to penetrate to the bottom of the support 11 along the arrangement direction of the LED chip assemblies 12 to obtain a plurality of LED packaging monomers.
In this embodiment, the viscosity of the fluid epoxy resin is 17000-38000cps, and the viscosity retention time is 0.15-3.5 h. Specifically, the fluid epoxy resin can be selected from epoxy resin with the trademark DER 331.
In this example, the bending strength of the epoxy resin layer 2 is 13.9kg/mm or more2The hardness is 88-92HD, and the water absorption is less than 0.8 Wt%. The epoxy resin layer 2 has good toughness and moisture-proof and waterproof performance.
In this embodiment, the light-shielding glue is black light-shielding glue or white light-shielding glue; the black shading glue is a mixture of fluid epoxy resin and carbon; the white shading glue is a mixture of fluid epoxy resin and boron nitride.
In the present embodiment, the LED chip assemblies 12 are arranged on the surface of the support 11 in 10-20 rows by 25-50 columns, preferably 10 rows by 25 columns, 15 rows by 35 columns or 20 rows by 50 columns.
While preferred embodiments of the present application have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the true scope of the embodiments of the application.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.
The above method for packaging a single-sided light emitting LED provided by the present application is introduced in detail, and a specific example is applied in the present application to explain the principle and the implementation of the present application, and the description of the above embodiment is only used to help understand the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims (10)

1. A single-side light-emitting LED packaging method is used for packaging an LED prefabricated member to obtain an LED packaging module; the LED prefabricated part comprises a support and a plurality of LED chip assemblies which are arranged on the support in an array mode, and gaps are formed between every two adjacent LED chip assemblies; it is characterized by comprising:
placing the LED pre-form inside a fence; the top of the fence is higher than the top of the LED prefabricated member;
tiling a fluid epoxy inside the fence to the top of the LED chip assembly;
baking the LED prefabricated member paved with the fluid epoxy resin until the fluid epoxy resin is cured to form an epoxy resin layer;
performing first cutting penetrating the epoxy resin layer between the adjacent LED chip assemblies to the surface of the support along the arrangement direction of the LED chip assemblies;
filling light-shielding glue into the groove formed by the first cutting;
and baking the LED prefabricated member filled with the shading glue until the shading glue is cured to form a shading layer, and obtaining the LED packaging module.
2. The LED packaging method of claim 1, wherein said tiling a fluid epoxy inside said fence on top of said LED chip assembly comprises:
spreading a fluid epoxy resin inside the fence to a preset height at the top of the LED chip assembly; the preset height is 1/3-2 times the thickness of the LED chip assembly.
3. The LED packaging method of claim 1, wherein the temperature of the LED pre-form is maintained at 50-80 ℃ while the fluid epoxy is spread inside the enclosure on top of the LED chip assembly.
4. The LED packaging method of claim 1, wherein said baking said LED pre-form tiled with said fluid epoxy until said fluid epoxy cures to form an epoxy layer comprises:
and baking the LED prefabricated member paved with the fluid epoxy resin at the temperature of 130-150 ℃ until the fluid epoxy resin is cured to form the epoxy resin layer.
5. The LED packaging method according to claim 1, wherein the baking the LED preform filled with the light shielding glue until the light shielding glue is cured to form a light shielding layer comprises:
and baking the LED prefabricated member filled with the light shielding glue at the temperature of 100-150 ℃ until the light shielding glue is cured to form the light shielding layer.
6. The LED packaging method of claim 1, further comprising:
and along the arrangement direction of the LED chip assemblies, performing second cutting on the shading layer penetrating to the bottom of the support to obtain a plurality of LED packaging monomers.
7. The method of claim 1, wherein the fluid epoxy has a viscosity of 17000-38000cps and a viscosity retention time of 0.15-3.5 h.
8. The LED packaging method of claim 1, wherein the epoxy layer has a bending strength of 13.9kg/mm or more2The hardness is 88-92HD, and the water absorption is less than 0.8 Wt%.
9. The LED packaging method according to claim 1, wherein the light shielding glue is black light shielding glue or white light shielding glue; the black shading glue is a mixture of fluid epoxy resin and carbon; the white shading glue is a mixture of fluid epoxy resin and boron nitride.
10. The LED packaging method of claim 1, wherein the LED chip assemblies are arranged on the surface of the support in 10-20 rows by 25-50 columns.
CN202111452837.6A 2021-11-30 2021-11-30 Single-side light-emitting LED packaging method Pending CN114156378A (en)

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Application Number Priority Date Filing Date Title
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103199179A (en) * 2013-04-18 2013-07-10 苏州东山精密制造股份有限公司 Light emitting diode (LED) light source and sealing method thereof
JP2019036705A (en) * 2017-08-17 2019-03-07 旭宇光電（深▲せん▼）股▲ふん▼有限公司 Smd type led delightless packaging method
WO2021051327A1 (en) * 2019-09-18 2021-03-25 京东方科技集团股份有限公司 Backlight module, display module, and display device
CN212967755U (en) * 2020-10-19 2021-04-13 江苏集萃有机光电技术研究所有限公司 Packaging cover plate, silicon-based organic light-emitting display panel and display device
CN112909147A (en) * 2019-11-19 2021-06-04 深圳Tcl新技术有限公司 Quantum dot LED and preparation method thereof
CN113380645A (en) * 2021-07-06 2021-09-10 深圳市德明新微电子有限公司 Packaging product and preparation method thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103199179A (en) * 2013-04-18 2013-07-10 苏州东山精密制造股份有限公司 Light emitting diode (LED) light source and sealing method thereof
JP2019036705A (en) * 2017-08-17 2019-03-07 旭宇光電（深▲せん▼）股▲ふん▼有限公司 Smd type led delightless packaging method
WO2021051327A1 (en) * 2019-09-18 2021-03-25 京东方科技集团股份有限公司 Backlight module, display module, and display device
CN112909147A (en) * 2019-11-19 2021-06-04 深圳Tcl新技术有限公司 Quantum dot LED and preparation method thereof
CN212967755U (en) * 2020-10-19 2021-04-13 江苏集萃有机光电技术研究所有限公司 Packaging cover plate, silicon-based organic light-emitting display panel and display device
CN113380645A (en) * 2021-07-06 2021-09-10 深圳市德明新微电子有限公司 Packaging product and preparation method thereof

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