CN114153470B - Integrated circuit chip burner - Google Patents
Integrated circuit chip burner Download PDFInfo
- Publication number
- CN114153470B CN114153470B CN202111425438.0A CN202111425438A CN114153470B CN 114153470 B CN114153470 B CN 114153470B CN 202111425438 A CN202111425438 A CN 202111425438A CN 114153470 B CN114153470 B CN 114153470B
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- Prior art keywords
- plate
- mounting
- base
- mounting plate
- burning
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- 239000000523 sample Substances 0.000 claims abstract description 19
- 230000007246 mechanism Effects 0.000 claims abstract description 9
- 238000003825 pressing Methods 0.000 claims description 8
- 230000000712 assembly Effects 0.000 claims 1
- 238000000429 assembly Methods 0.000 claims 1
- 230000003028 elevating effect Effects 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010865 sewage Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F8/00—Arrangements for software engineering
- G06F8/60—Software deployment
- G06F8/61—Installation
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- Engineering & Computer Science (AREA)
- Software Systems (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention discloses an integrated circuit chip burner which comprises a base and a burning probe, wherein a longitudinal plate is arranged on the base, a lifting mechanism is arranged at the front end of the longitudinal plate and used for adjusting the height of the burning probe, a mounting plate is arranged on the base, four corners of the mounting plate are penetrated with mounting columns, the bottom ends of the mounting columns are fixed with the upper end face of the base, a limiting block positioned above the mounting plate is arranged at the upper end of the mounting columns, a buffer spring I positioned between the mounting plate and the base is sleeved on the mounting columns, two clamping pieces capable of being adjusted left and right are oppositely arranged on the mounting plate, and clamping grooves are formed in the opposite ends of the two clamping pieces. Compared with the prior art, the invention has the advantages that: the chip with different sizes can be quickly burnt, and the burning effect is good.
Description
Technical Field
The invention relates to the technical field of integrated circuit chip processing, in particular to an integrated circuit chip burner.
Background
Integrated circuits, or microcircuits, microchips, and die/chips, are one way of miniaturizing circuits in electronics and are often manufactured on semiconductor wafer surfaces, and the classification of integrated circuits is many and can be classified into analog or digital circuits: the programmable integrated circuit is mainly used for programming chips such as a singlechip/a memory, and the programmable integrated circuit can be divided into a universal programmable device, a mass-production programmable device and a special programmable device in function.
The existing chip writer is complex in operation, chips with different sizes are not convenient to clamp and fix in the chip writing process, and the existing chip writer lacks a certain buffer mechanism, so that the writing probe is easy to damage the surface of the chip in the pressing process.
Disclosure of Invention
The invention aims to overcome the technical defects and provide the environmental engineering sewage treatment equipment.
In order to solve the technical problems, the technical scheme provided by the invention is as follows: the utility model provides an integrated circuit chip burns record ware, includes base and burnt probe, be equipped with the longitudinal plate on the base, the front end of longitudinal plate is equipped with elevating system, elevating system is used for adjusting burnt probe's height, be equipped with the mounting panel on the base, four angles of mounting panel all run through there is the erection column, the bottom and the base up end of erection column are fixed, the upper end of erection column is equipped with the stopper that is located the mounting panel top, the cover is equipped with the buffer spring one that is located between mounting panel and the base on the erection column, be equipped with two clamp pieces that can control on the mounting panel relatively, two the relative one end of clamp piece all is equipped with the clamping groove.
As an improvement, elevating system is including setting up the mounting bracket at the preceding terminal surface of indulging the board, the bottom of mounting bracket is equipped with the mounting cylinder, the upper end of mounting bracket articulates there is the handle, the both sides that the handle is close to mounting bracket one end all articulate there is the arc connecting plate, two articulated between the arc connecting plate have the depression bar, the depression bar slides and sets up in the mounting cylinder, the bottom of depression bar is equipped with the lifter plate, the bottom of lifter plate is equipped with the U template, burn the probe and install on the U template.
As an improvement, the front end of the vertical plate is provided with two guide components which are respectively positioned at two sides of the mounting frame, the guide components comprise a top plate and a bottom plate which are fixed with the vertical plate, a guide pillar is connected between the top plate and the bottom plate, two sliding sleeves are oppositely arranged on the lifting plate, the guide pillar is respectively arranged in the two sliding sleeves in a sliding manner, and the bottom of the bottom plate and the lifting plate is connected with a buffer spring II and the buffer spring II is sleeved on the guide pillar.
As an improvement, the bottom of the clamping piece is relatively provided with two sliding blocks, the mounting plate is provided with a sliding groove which is in sliding fit with the sliding blocks, the middle part of the clamping piece is provided with a strip-shaped hole, a locking screw is arranged in the strip-shaped hole, and the bottom end of the locking screw is in threaded connection with the mounting plate.
As an improvement, the front end of the base is an inclined plane, an operation display screen, an operation switch and an indicator lamp are arranged on the inclined plane, and a burning program input port is arranged on the side face of the base.
Compared with the prior art, the invention has the advantages that: according to the integrated circuit chip writer, the distance between the two clamping pieces can be flexibly adjusted through the strip-shaped holes and the locking screws, so that the two clamping grooves are adjusted to clamp and fix chips with different sizes, the problem that the writing is interrupted due to left and right shaking of the chips in the writing process can be prevented, the writing probe can be propped against the corresponding port of the chip through the lifting mechanism, rapid writing can be realized, a certain buffering effect can be achieved on the pressing down of the writing probe through the first buffer spring and the second buffer spring, and the situation that the chip is damaged due to the fact that the pressing down pressure of the writing probe is large is avoided.
Drawings
Fig. 1 is a schematic structural diagram of an integrated circuit chip writer according to the present invention.
Fig. 2 is an enlarged schematic view of the structure of fig. 1 a.
As shown in the figure: 1. the device comprises a base, 2, a burning probe, 3, a vertical plate, 4, a lifting mechanism, 5, a mounting plate, 6, a mounting column, 7, a limiting block, 8, a buffer spring I, 9, a clamping piece, 10, a clamping groove, 11, a mounting rack, 12, a mounting cylinder, 13, a handle, 14, an arc-shaped connecting plate, 15, a compression bar, 16, a lifting plate, 17, a top plate, 18, a bottom plate, 19, a guide pillar, 20, a sliding sleeve, 21, a buffer spring II, 22, a sliding groove, 23, a strip-shaped hole, 24, a locking screw, 25, an operation display screen, 26, a control switch, 27, an indicator light, 28, a burning program input port, 29 and a U-shaped plate.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Specific embodiments of the present invention will be further described below with reference to the accompanying drawings. Wherein like parts are designated by like reference numerals.
It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to directions in the drawings, and the words "inner" and "outer" refer to directions toward or away from, respectively, the geometric center of a particular component.
In order to make the contents of the present invention more clearly understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
The integrated circuit chip burner comprises a base 1 and a burning probe 2, wherein a longitudinal plate 3 is arranged on the base 1, the front end of the longitudinal plate 3 is provided with a lifting mechanism 4, the lifting mechanism 4 is used for adjusting the height of the burning probe 2, a mounting plate 5 is arranged on the base 1, four corners of the mounting plate 5 are penetrated with mounting columns 6, the bottom ends of the mounting columns 6 are fixed with the upper end face of the base 1, the upper ends of the mounting columns 6 are provided with limiting blocks 7 positioned above the mounting plate 5, a buffer spring 8 positioned between the mounting plate 5 and the base 1 is sleeved on the mounting columns 6, two clamping pieces 9 capable of being adjusted left and right are oppositely arranged on the mounting plate 5, and the opposite ends of the two clamping pieces 9 are provided with clamping grooves 10.
The elevating system 4 is including setting up the mounting bracket 11 at the preceding terminal surface of indulging board 3, the bottom of mounting bracket 11 is equipped with mounting cylinder 12, the upper end of mounting bracket 11 articulates there is handle 13, the both sides that handle 13 is close to mounting bracket 11 one end all articulate there is arc connecting plate 14, two articulated between the arc connecting plate 14 have depression bar 15, depression bar 15 slides and sets up in mounting cylinder 12, the bottom of depression bar 15 is equipped with lifter plate 16, the bottom of lifter plate 16 is equipped with U template 29, burning probe 2 installs on U template 29.
The front end of the vertical plate 3 is provided with two guide components which are respectively positioned at two sides of the mounting frame 11, the guide components comprise a top plate 17 and a bottom plate 18 which are fixed with the vertical plate 3, a guide pillar 19 is connected between the top plate 17 and the bottom plate 18, two sliding sleeves 20 are oppositely arranged on the lifting plate 16, the guide pillar 19 at two sides is respectively arranged in the two sliding sleeves 20 in a sliding manner, and the bottom of the bottom plate 18 and the lifting plate 16 is connected with a buffer spring II 21 and the buffer spring II 21 is sleeved on the guide pillar 19.
The bottom of the clamping piece 9 is relatively provided with two sliding blocks, the mounting plate 5 is provided with a sliding groove 22 which is in sliding fit with the sliding blocks, the middle part of the clamping piece 9 is provided with a strip-shaped hole 23, a locking screw 24 is arranged in the strip-shaped hole 23, and the bottom end of the locking screw 24 is in threaded connection with the mounting plate 5.
The front end of the base 1 is an inclined plane, an operation display screen 25, an operation switch 26 and an indicator lamp 27 are arranged on the inclined plane, and a burning program input port 28 is arranged on the side face of the base 1.
In the specific implementation of the invention, the distance between the two clamping sheets is adjusted by adjusting the locking screw according to the size of the chip, so that two sides of the chip are respectively clamped in the two clamping grooves, a computer connecting wire is connected with a burning program input port, the rotating handle is rotated, the rotating handle drives the arc-shaped connecting plate to rotate, so that the guide pillar descends, the guide pillar drives the lifting plate to descend, the lifting plate drives the burning probe to prop up to the corresponding port of the chip, and therefore rapid burning can be realized, the first buffer spring and the second buffer spring can play a certain buffering role on the pressing down of the burning probe, and the situation that the chip is damaged due to the fact that the pressing down pressure of the burning probe is large is avoided.
The invention and its embodiments have been described above with no limitation, and the actual construction is not limited to the embodiments of the invention as shown in the drawings. In summary, if one of ordinary skill in the art is informed by this disclosure, a structural manner and an embodiment similar to the technical solution should not be creatively devised without departing from the gist of the present invention.
Claims (1)
1. An integrated circuit chip burner, includes base (1) and burns record probe (2), its characterized in that: the automatic burning device is characterized in that a vertical plate (3) is arranged on the base (1), a lifting mechanism (4) is arranged at the front end of the vertical plate (3), the lifting mechanism (4) is used for adjusting the height of the burning probe (2), a mounting plate (5) is arranged on the base (1), mounting columns (6) are penetrated at four corners of the mounting plate (5), the bottom end of the mounting column (6) is fixed with the upper end face of the base (1), a limiting block (7) arranged above the mounting plate (5) is arranged at the upper end of the mounting column (6), a buffer spring I (8) arranged between the mounting plate (5) and the base (1) is sleeved on the mounting column (6), two clamping pieces (9) capable of being adjusted left and right are arranged on the mounting plate (5), and clamping grooves (10) are formed in one ends of the two clamping pieces (9);
the lifting mechanism (4) comprises a mounting frame (11) arranged on the front end face of the vertical plate (3), a mounting cylinder (12) is arranged at the bottom end of the mounting frame (11), a handle (13) is hinged to the upper end of the mounting frame (11), arc-shaped connecting plates (14) are hinged to two sides, close to one end of the mounting frame (11), of each handle (13), a pressing rod (15) is hinged between the two arc-shaped connecting plates (14), the pressing rods (15) are slidably arranged in the mounting cylinder (12), lifting plates (16) are arranged at the bottom ends of the pressing rods (15), U-shaped plates (29) are arranged at the bottoms of the lifting plates (16), and the burning probes (2) are arranged on the U-shaped plates (29);
The front end of the vertical plate (3) is provided with two guide assemblies which are respectively positioned at two sides of the mounting frame (11), each guide assembly comprises a top plate (17) and a bottom plate (18) which are fixed with the vertical plate (3), a guide pillar (19) is connected between the top plate (17) and the bottom plate (18), two sliding sleeves (20) are arranged on the lifting plate (16), the guide pillars (19) at two sides are respectively arranged in the two sliding sleeves (20) in a sliding manner, the bottoms of the bottom plate (18) and the lifting plate (16) are connected with a buffer spring II (21) and the buffer spring II (21) is sleeved on the guide pillar (19);
The bottom of the clamping piece (9) is provided with two sliding blocks, the mounting plate (5) is provided with a sliding groove (22) which is in sliding fit with the sliding blocks, the middle part of the clamping piece (9) is provided with a strip-shaped hole (23), the strip-shaped hole (23) is internally provided with a locking screw (24), and the bottom end of the locking screw (24) is in threaded connection with the mounting plate (5);
the front end of the base (1) is an inclined plane, an operation display screen (25), an operation switch (26) and an indicator lamp (27) are arranged on the inclined plane, and a burning program input port (28) is arranged on the side face of the base (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111425438.0A CN114153470B (en) | 2021-11-27 | 2021-11-27 | Integrated circuit chip burner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111425438.0A CN114153470B (en) | 2021-11-27 | 2021-11-27 | Integrated circuit chip burner |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114153470A CN114153470A (en) | 2022-03-08 |
| CN114153470B true CN114153470B (en) | 2024-08-20 |
Family
ID=80458139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111425438.0A Active CN114153470B (en) | 2021-11-27 | 2021-11-27 | Integrated circuit chip burner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114153470B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208937856U (en) * | 2018-09-12 | 2019-06-04 | 深圳市龙祥卓越电子科技有限公司 | A kind of liquid crystal display module recording device |
| CN113221583A (en) * | 2021-06-03 | 2021-08-06 | 惠州西文思技术股份有限公司 | Intelligent chip burning equipment |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7288950B2 (en) * | 2002-08-07 | 2007-10-30 | Hoya Corporation | Contacting component, method of producing the same, and test tool having the contacting component |
| CN105824675A (en) * | 2016-03-24 | 2016-08-03 | 深圳市科美集成电路有限公司 | Circuit board burning tool, system and method |
| CN208271166U (en) * | 2018-06-06 | 2018-12-21 | 深圳市飞思卓科技有限公司 | Wiring board burning mechanism |
-
2021
- 2021-11-27 CN CN202111425438.0A patent/CN114153470B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208937856U (en) * | 2018-09-12 | 2019-06-04 | 深圳市龙祥卓越电子科技有限公司 | A kind of liquid crystal display module recording device |
| CN113221583A (en) * | 2021-06-03 | 2021-08-06 | 惠州西文思技术股份有限公司 | Intelligent chip burning equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114153470A (en) | 2022-03-08 |
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