CN114144012A

CN114144012A - Circuit board assembly, camera module and electronic equipment

Info

Publication number: CN114144012A
Application number: CN202110546747.7A
Authority: CN
Inventors: 万国良; 马忠科; 陈小凤; 其他发明人请求不公开姓名
Original assignee: Nanchang OFilm Optoelectronics Technology Co Ltd
Current assignee: Nanchang OFilm Optoelectronics Technology Co Ltd
Priority date: 2021-01-18
Filing date: 2021-05-19
Publication date: 2022-03-04
Also published as: CN217283571U

Abstract

The embodiment of the application discloses circuit board assembly, camera module and electronic equipment, circuit board assembly includes first flexible circuit board, first flexible circuit board includes first sub-flexible circuit board, sub-flexible circuit board of second and first support piece, the contained angle between the face of the sub-flexible circuit board of second and the face of first sub-flexible circuit board is greater than 0 and is less than 180, first support piece is located the first juncture of first sub-flexible circuit board and the sub-flexible circuit board of second, and the part of first sub-flexible circuit board is connected to the one end of first support piece, the part of the sub-flexible circuit board of second is connected to the other end of first support piece. This application embodiment can reduce the emergence of juncture fracture phenomenon through set up first support piece in the juncture, and can still keep two sub-flexible circuit board's contained angle after circuit board assembly actuates for a long time, guarantees the normal anti-shake performance of circuit board assembly on equipment such as cloud platform camera, extension circuit board assembly's life.

Description

Circuit board assembly, camera module and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to a circuit board assembly, a camera module and electronic equipment.

Background

With the development of science and technology, the shapes of circuit boards are diversified, for example, the shapes of circuit boards are not limited to simple flat plates and can have a certain bending angle. However, in the related art, when the flexible printed circuit board is bent and used in the field of anti-shake, the stress at the bent portion is concentrated, and thus the flexible printed circuit board is easily broken.

Disclosure of Invention

The embodiment of the application provides a circuit board assembly, camera module and electronic equipment, sets up first support piece through the juncture at two sub-flexible circuit boards, can strengthen the structural strength of juncture, reduces the emergence of phenomenon of rupture. The technical scheme is as follows;

in a first aspect, an embodiment of the present application provides a circuit board assembly, including a first flexible circuit board, the first flexible circuit board including:

a first sub flexible circuit board;

the second sub flexible circuit board is connected with the first sub flexible circuit board, and an included angle between the board surface of the second sub flexible circuit board and the board surface of the first sub flexible circuit board is larger than 0 degree and smaller than 180 degrees; and

the first supporting piece is positioned at a first junction of the first sub-flexible circuit board and the second sub-flexible circuit board, one end of the first supporting piece is connected with the part of the first sub-flexible circuit board, and the other end of the first supporting piece is connected with the part of the second sub-flexible circuit board.

According to the circuit board assembly, the first supporting piece is arranged at the junction of the two sub-flexible circuit boards, so that on one hand, the structural strength of the junction can be enhanced, and the occurrence of a fracture phenomenon is reduced; on the other hand also can still keep the contained angle of two sub-flexible circuit boards after circuit board assembly actuates for a long time, guarantee the normal anti-shake performance of circuit board assembly on equipment such as cloud platform camera, prolong circuit board assembly's life.

In some of these embodiments, the first support comprises:

the first supporting plate is attached to the first sub flexible circuit board and connected with the first sub flexible circuit board; and

the second supporting plate is attached to the second sub flexible circuit board and connected with the second sub flexible circuit board, and the second supporting plate is further connected with the first supporting plate.

Based on the above embodiment, the first support member is provided to include the first support plate and the second support plate, so that the first support member is simple in structure and convenient to produce and manufacture. In addition, the first supporting plate and the second supporting plate are respectively attached to the first sub flexible circuit board and the second sub flexible circuit board, so that the first supporting plate is connected with the first sub flexible circuit board, and the second supporting plate is connected with the second sub flexible circuit board.

In some of these embodiments, a second interface of the first support plate and the second support plate is provided separately from the first interface.

Based on above-mentioned embodiment, do benefit to the connection of first support piece and first flexible circuit board on the one hand, on the other hand, because the circuit board is great in the stress in the district of bending when actuating, consequently set up second juncture and first juncture separately, can also make first juncture have certain margin and release stress to reduce and even avoid first flexible circuit board to break off, extension circuit board assembly's life.

In some of these embodiments, there is a gap between the second interface and the first interface.

Based on the embodiment, the first junction can be more easily distorted and deformed to release stress, so that the stress concentration is avoided from generating a fracture phenomenon; meanwhile, the circuit at the gap can be prevented from being torn.

In some embodiments, the board surfaces of the first sub flexible circuit board include a first board surface and a second board surface which are opposite to each other, the board surfaces of the second sub flexible circuit board include a third board surface and a fourth board surface which are opposite to each other, the third board surface is connected with the first board surface, the fourth board surface is connected with the second board surface, the third board surface and the first board surface enclose to form outer corners of the first sub flexible circuit board and the second sub flexible circuit board,

the first supporting plate is attached to the first plate surface and connected with the first plate surface, and the second supporting plate is attached to the third plate surface and connected with the third plate surface.

Based on the above embodiment, the first supporting member is disposed on the side where the outer corners of the first sub flexible circuit board and the second sub flexible circuit board are located, so that the operation space is large, and the connection between the first supporting member and the first sub flexible circuit board and the connection between the first supporting member and the second sub flexible circuit board can be facilitated.

In some embodiments, a first chamfer structure is disposed at the first interface to form the gap.

Based on the above embodiment, the first junction and the second junction have a gap therebetween by the form of arranging the chamfer structure at the junction, and the production and the manufacture are convenient.

In some embodiments, the board surfaces of the first sub flexible circuit board include a first board surface and a second board surface which are opposite to each other, the board surfaces of the second sub flexible circuit board include a third board surface and a fourth board surface which are opposite to each other, the third board surface is connected with the first board surface, the fourth board surface is connected with the second board surface, the fourth board surface and the second board surface enclose an inner angle of the first sub flexible circuit board and the second sub flexible circuit board,

wherein, the laminating of first backup pad the second face and with the second face is connected, the laminating of second backup pad the fourth face and with the fourth face is connected.

Based on the above embodiment, through setting up first support piece in the one side at the interior angle place of first sub-flexible circuit board and second sub-flexible circuit board for the setting of first support piece is more hidden difficult impaired, and makes circuit board assembly's outward appearance structure more neat.

In some of these embodiments, a second chamfer structure is provided at the second interface to form the gap.

In some embodiments, the end of the first support plate connected to the second support plate and/or the end of the second support plate connected to the first support plate is provided with a notch.

Based on the embodiment, on one hand, the material can be saved, and the cost can be reduced; on the other hand, when the first supporting plate and the second supporting plate need to be connected, the connecting area can be reduced, and the connection is more convenient; or, when the first supporting plate and the second supporting plate are formed by bending one plate, the plate can be conveniently bent.

In some of these embodiments, further comprising:

and the hard circuit board is arranged outside the hard circuit board when viewed along the direction perpendicular to the board surface of the hard circuit board, and the hard circuit board is used for being electrically connected with the external connecting piece through the first flexible circuit board.

Based on the above embodiment, by arranging the rigid circuit board, the lens assembly and other devices can be mounted on the rigid circuit board, and the torque force generated by the shaking of the devices can be released in the modes of distortion and deformation of the first flexible circuit board, so that the circuit board assembly is not easy to damage.

In some embodiments, the first flexible circuit board includes at least two first sub flexible circuit boards, all the first sub flexible circuit boards are arranged at intervals, every two adjacent first sub flexible circuit boards are connected through one second sub flexible circuit board, and one first supporting member is arranged at a first interface of the adjacent first sub flexible circuit boards and the adjacent second sub flexible circuit boards.

Based on the above embodiment, when the device arranged on the rigid circuit board shakes, the plurality of first sub flexible circuit boards and the plurality of second sub flexible circuit boards can be subjected to distortion deformation to release the torque force, so that the torque force can be dispersed on more sub flexible circuit boards, and the stress concentration on the single sub flexible circuit board can be prevented from being broken.

In some embodiments, the number of the first flexible circuit boards is two, when viewed in a direction perpendicular to the surface of the rigid circuit board, the two first flexible circuit boards are respectively located on two sides of the rigid circuit board, one end of each first flexible circuit board is electrically connected to the rigid circuit board, and the other end of each first flexible circuit board is electrically connected to the external connecting member.

Based on the embodiment, the two first flexible circuit boards are respectively arranged on the two sides outside the rigid circuit board, so that when devices on the rigid circuit board shake, the two first flexible circuit boards outside the rigid circuit board can generate torsional deformation to release stress, and the stress release effect is better.

In some embodiments, the board surface of the rigid circuit board has a first edge and a second edge opposite to each other, one end of each of the two first flexible circuit boards is located at the first edge and electrically connected to the rigid circuit board, and the other end of each of the two first flexible circuit boards is located at the second edge and electrically connected to the external connector.

Based on the embodiment, the interval utilization rate outside the rigid circuit board can be maximized, and the stress is more dispersed, so that the problem of breakage of the first flexible circuit board is avoided.

In some of these embodiments, the circuit board assembly further comprises:

each first flexible circuit board is electrically connected with the rigid circuit board through one second flexible circuit board, and the two second flexible circuit boards are connected into a whole or are separately arranged.

Based on the above embodiment, the second flexible circuit board and the first flexible circuit board are both flexible circuit boards, so that the second flexible circuit board and the first flexible circuit board can be directly formed by bending one flexible circuit board, and the manufacture is more convenient. Meanwhile, when the two second flexible circuit boards are separately arranged, the torsion of each second flexible circuit board and the first flexible circuit board connected with the second flexible circuit board is not interfered by the other second flexible circuit board and the other first flexible circuit board, and the stress release effect is better. The two second flexible circuit boards are connected into a whole, so that one ends of the two first flexible circuit boards, which are connected with the second flexible circuit boards, are positioned in the same plane, and the stress is distributed on the two first flexible circuit boards in a relatively balanced manner. Meanwhile, the two second flexible circuit boards are connected into a whole, so that the two second flexible circuit boards are conveniently connected with the two first flexible circuit boards and the hard circuit board.

In some of these embodiments, the circuit board assembly further comprises:

and each first flexible circuit board is electrically connected with the outer connecting piece through one third flexible circuit board, and the two third flexible circuit boards are arranged at intervals.

Based on the above embodiment, the third flexible circuit board and the first flexible circuit board are both flexible circuit boards, so that the third flexible circuit board and the first flexible circuit board can be formed by bending one flexible circuit board directly, and the manufacture is more convenient. Simultaneously, set up to two through the quantity with the third flexible circuit board for circuit board assembly can be applicable to the outer connecting piece that has two interfaces (for example, for making the structure of outer connecting piece smaller and exquisite, the outer connecting piece is provided with two interfaces and is located two of relative setting respectively on the surface), and application scope is wider. Through setting up two third flexible circuit boards at interval for the wrench movement of two third flexible circuit boards, with the wrench movement of two first flexible circuit boards that two third flexible circuit boards are connected can not produce the interference.

In some embodiments, two of the third flexible circuit boards are arranged at intervals when viewed in a direction parallel to the board surface of the rigid circuit board; or

Viewed in a direction perpendicular to the plate surface of the rigid circuit board, the two third flexible circuit boards are arranged at intervals; or

One of the third flexible circuit boards comprises a first electric connection section, a second electric connection section and a third electric connection section which are sequentially connected, wherein one end, far away from the second electric connection section, of the first electric connection section is electrically connected with the first flexible circuit board, one end, far away from the second electric connection section, of the third electric connection section is used for electrically connecting the external connecting piece, and the first electric connection section and the other third flexible circuit board are arranged at intervals when viewed in a direction perpendicular to the board surface of the rigid circuit board; and when viewed in a direction parallel to the surface of the rigid circuit board, the third electrical connection section and the other third flexible circuit board are arranged at intervals.

Based on the above embodiment, the structure of two third flexible circuit boards is more various, and application scope is wider.

In some embodiments, the rigid circuit board and the external connecting member are located on the same side of the two first flexible circuit boards when viewed in a direction parallel to the board surface of the rigid circuit board; or, the rigid circuit board and the outer connecting piece are positioned on opposite sides of the two first flexible circuit boards along a direction parallel to the board surface of the rigid circuit board.

Based on the embodiment, the structure of the circuit board assembly is more diversified, and a user can select a proper circuit board assembly according to conditions such as reserved space and the like.

In a second aspect, an embodiment of the present application provides a camera module, including:

a lens assembly for receiving a light signal of a subject;

the image processing assembly is arranged at the image side of the lens assembly and is used for receiving the optical signal of the shot object and converting the optical signal into an image signal; and

in any of the above circuit board assemblies, the rigid circuit board of the circuit board assembly is disposed on a side of the image processing assembly away from the object to be photographed so as to bear the image processing assembly and/or the lens assembly; the hard circuit board is also electrically connected with the image processing assembly so as to transmit the image signal to the outer connecting piece.

The camera module comprises the circuit board assembly, so that the effect of the circuit board assembly is achieved, and particularly, the first supporting piece is arranged at the junction of the two sub-flexible circuit boards, so that the structural strength of the junction can be enhanced, and the occurrence of a fracture phenomenon is reduced; on the other hand also can still keep the contained angle of two sub-flexible circuit boards after circuit board assembly actuates for a long time, guarantee the normal anti-shake performance of circuit board assembly on equipment such as cloud platform camera, prolong circuit board assembly's life.

In some of these embodiments, further comprising:

the holder bracket is covered on the periphery of the lens component and is connected with the lens component;

the holder fixing seat is provided with an accommodating cavity, the holder support, the lens assembly, the image processing assembly and the rigid circuit board are all positioned in the accommodating cavity, the two first flexible circuit boards are respectively positioned at two sides outside the holder fixing seat, one end of each first flexible circuit board extends into the accommodating cavity to be electrically connected with the rigid circuit board, and the other end of each first flexible circuit board is used for being electrically connected with the outer connecting piece;

the driving device is connected with the holder support and the holder fixing seat so as to drive the holder support and the lens assembly to move relative to the holder fixing seat.

Based on above-mentioned embodiment, through setting up two first flexible circuit boards respectively in the outside of cloud platform fixing base, can increase the size of first flexible circuit board to can reduce the atress of first flexible circuit board in the unit area, through setting up cloud platform support and drive arrangement, and drive arrangement can drive cloud platform support and lens subassembly for the motion of cloud platform fixing base, can realize the anti-shake nature of lens subassembly, promote the shooting effect.

In a third aspect, an embodiment of the present application provides an electronic device, including any of the camera modules described above.

Based on the fact that the electronic equipment in the embodiment of the application comprises the circuit board assembly, the circuit board assembly has the effects of the circuit board assembly, and particularly, the first supporting piece is arranged at the junction of the two sub-flexible circuit boards, so that the structural strength of the junction can be enhanced, and the occurrence of a fracture phenomenon is reduced; on the other hand also can still keep the contained angle of two sub-flexible circuit boards after circuit board assembly actuates for a long time, guarantee the normal anti-shake performance of circuit board assembly on equipment such as cloud platform camera, prolong circuit board assembly's life.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a perspective view of a circuit board assembly according to an embodiment of the present disclosure, in which a first support is located at an outer corner of a first flexible circuit board;

FIG. 2 is a cross-sectional view of the circuit board assembly shown in FIG. 1;

FIG. 3 is a cross-sectional view of a first alternative of the circuit board assembly shown in FIG. 2;

FIG. 4 is a cross-sectional view of a second alternative to the circuit board assembly shown in FIG. 2;

fig. 5 is a cross-sectional view of a circuit board assembly provided by an embodiment of the present application, wherein a first support is located at an inner corner of a first flexible circuit board;

FIG. 6 is a cross-sectional view of a first alternative of the circuit board assembly shown in FIG. 5;

FIG. 7 is a cross-sectional view of a second alternative to the circuit board assembly shown in FIG. 5;

FIG. 8 is a cross-sectional view of a third alternative to the circuit board assembly shown in FIG. 5;

fig. 9 is a first perspective view of a first support member in a circuit board assembly according to an embodiment of the present disclosure;

fig. 10 is a second perspective view of a first support member in a circuit board assembly according to an embodiment of the present disclosure;

fig. 11 is a third perspective view of a first support member in a circuit board assembly according to an embodiment of the present disclosure;

FIG. 12 is an enlarged view of the structure of FIG. 11 at Q;

fig. 13 is a fourth perspective view of a first support in a circuit board assembly according to an embodiment of the present disclosure;

fig. 14 is a fifth perspective view of a first support member in a circuit board assembly according to an embodiment of the present disclosure;

fig. 15 is a sixth perspective view of a first support member in a circuit board assembly according to an embodiment of the present disclosure;

fig. 16 is a seventh perspective view of a first support member in a circuit board assembly according to an embodiment of the present disclosure;

fig. 17 is a perspective view of a circuit board assembly provided by an embodiment of the present application when the circuit board assembly includes a rigid circuit board, a second flexible circuit board, and a third flexible circuit board;

fig. 18 is a perspective view of a first alternative of the circuit board assembly shown in fig. 17;

fig. 19 is a perspective view of a second alternative to the circuit board assembly shown in fig. 17;

FIG. 20 is a partial view of a third alternative of the circuit board assembly shown in FIG. 17;

fig. 21 is a perspective view of a fourth alternative to the circuit board assembly shown in fig. 17;

fig. 22 is a side view of the circuit board assembly shown in fig. 17;

FIG. 23 is a side view of the first alternative of the circuit board assembly shown in FIG. 22;

FIG. 24 is a side view of a second alternative to the circuit board assembly shown in FIG. 22;

FIG. 25 is a side view of a third alternative of the circuit board assembly shown in FIG. 22;

fig. 26 is a perspective view of a partial structure of a camera module according to an embodiment of the present application;

fig. 27 is a cross-sectional view of a camera module according to an embodiment of the present application.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the application, as detailed in the appended claims.

With the development of science and technology, the shapes of circuit boards are diversified, for example, the shapes of circuit boards are not limited to simple flat plates and can have a certain bending angle. However, in the related art, when the first flexible printed circuit board is bent and used in the field of anti-shake, the stress at the bent portion is concentrated, and thus the first flexible printed circuit board is easily broken. Based on this, this application has proposed a circuit board subassembly, camera module and electronic equipment, aims at solving above-mentioned defect.

In a first aspect, embodiments of the present application provide a circuit board assembly 100. Referring to fig. 1 and 2, the circuit board assembly 100 includes a first flexible circuit board 110, where the first flexible circuit board 110 includes a first sub-flexible circuit board 111, a second sub-flexible circuit board 112, and a first supporting member 113, where the second sub-flexible circuit board 112 is connected to the first sub-flexible circuit board 111, and an included angle between a board surface of the second sub-flexible circuit board 112 and a board surface of the first sub-flexible circuit board 111 is greater than 0 ° and less than 180 °. The first supporting member 113 is located at a first junction a between the first sub-flexible circuit board 111 and the second sub-flexible circuit board 112, one end of the first supporting member 113 is connected to a portion of the first sub-flexible circuit board 111, and the other end of the first supporting member 113 is connected to a portion of the second sub-flexible circuit board 112.

In the circuit board assembly 100 of the embodiment of the application, the first supporting member 113 is disposed at the junction of the two sub-flexible circuit boards, so that on one hand, the structural strength of the junction can be enhanced, and the occurrence of a fracture phenomenon can be reduced; on the other hand, the included angle between the two sub-flexible circuit boards can be still maintained after the circuit board assembly 100 is actuated for a long time, so that the normal anti-shake performance of the circuit board assembly 100 on equipment such as a pan-tilt camera is ensured, and the service life of the circuit board assembly 100 is prolonged.

It is understood that the board surface of the circuit board may refer to a surface of the circuit board on which the wiring is laid. The circuit board may have a substantially plate-shaped structure, referring to fig. 2 and 5, the plate surface of the first sub-flexible circuit board 111 may include a first plate surface 111x and a second plate surface 111y which are opposite to each other, the plate surface of the second sub-flexible circuit board 112 may include a third plate surface 112x and a fourth plate surface 112y which are opposite to each other, the third plate surface 112x is connected to the first plate surface 111x, the fourth plate surface 112y is connected to the second plate surface 111y, an included angle between the third plate surface 112x and the first plate surface 111x may be greater than 0 ° and less than 180 °, and an included angle between the fourth plate surface 112y and the second plate surface 111y may be greater than 0 ° and less than 180 °.

An angle between the plate surface of the first sub flexible circuit board 111 and the plate surface of the second sub flexible circuit board 112 may be any value between 0 ° and 180 °. For example, in some embodiments, an included angle between the plate surface of the first sub-flexible circuit board 111 and the plate surface of the second sub-flexible circuit board 112 may be 90 °. The included angle between the plate surface of the first sub flexible circuit board 111 and the plate surface of the second sub flexible circuit board 112 is defined to be 90 °, so that the structures of the first sub flexible circuit board 111 and the second sub flexible circuit board 112 can be more compact. It is understood that the first sub-flexible circuit board 111 and the second sub-flexible circuit board 112 may be an integrally molded structure.

Referring to fig. 1 and 2, the first support 113 may include a first support plate 1131 and a second support plate 1132 connected to the first support plate 1131, wherein the first support plate 1131 is attached to the first sub-flexible circuit board 111 and is connected to the first sub-flexible circuit board 111; the second support plate 1132 is attached to the second sub-flexible circuit board 112 and connected to the second sub-flexible circuit board 112. By arranging the first support member 113 to include the first support plate 1131 and the second support plate 1132, the structure of the first support member 113 is simple, and the production and the manufacture are convenient. In addition, the first support plate 1131 and the second support plate 1132 are respectively attached to the first sub-flexible circuit board 111 and the second sub-flexible circuit board 112, so as to facilitate the connection between the first support plate 1131 and the first sub-flexible circuit board 111, and the connection between the second support plate 1132 and the second sub-flexible circuit board 112.

Further, in order to avoid the problem of fracture caused by large stress at the bending portion, the second boundary b between the first support plate 1131 and the second support plate 1132 may be separately disposed from the first boundary a. The first junction a and the second junction b are separately arranged, so that the connection between the first supporting member 113 and the first flexible circuit board 110 is facilitated, and on the other hand, the stress in the bending area is large when the circuit board acts, so that the first junction a can have a certain margin to release the stress due to the separate arrangement, the first flexible circuit board 110 is reduced or even prevented from being broken, and the service life of the circuit board assembly 100 is prolonged.

As can be understood from fig. 2 to 8, the separation of the second boundary b from the first boundary a may include the fitting of the second boundary b with the first boundary a, or a gap c is formed between the second boundary b and the first boundary a. Preferably, a gap c is formed between the second junction b and the first junction a, so that the first junction a is easier to distort and deform to release stress, and the phenomenon of stress concentration and breakage is avoided; meanwhile, the arrangement of the gap c can avoid the tearing of the line at the gap c.

The gap c between the second boundary b and the first boundary a can be realized in any form. For example, this may be achieved by providing a chamfered structure at the second interface b and/or the first interface a. The chamfering structure can comprise a right-angle chamfering structure and a fillet chamfering structure. The structure of the circuit board assembly 100 when the second boundary b and/or the first boundary a is provided with the chamfered structure will be described in detail below with reference to fig. 2 to 8:

in an implementable scheme, referring to fig. 2 to 4, the third board surface 112x and the first board surface 111x enclose to form outer corners of the first sub-flexible circuit board 111 and the second sub-flexible circuit board 112, at this time, in order to facilitate connection of the first supporting member 113 and the first sub-flexible circuit board 111 and the second sub-flexible circuit board 112, the first supporting member 113 may be disposed on a side where the outer corners of the first sub-flexible circuit board 111 and the second sub-flexible circuit board 112 are located, so that an operation space is large, and connection is convenient. Specifically, the first support plate 1131 may be attached to the first board surface 111x and connected to the first board surface 111x, and the second support plate 1132 may be attached to the third board surface 112x and connected to the third board surface 112 x. Wherein outer corners of the first and second sub

flexible circuit boards

111 and 112 may correspond to: an outer corner between a first line segment and a second line segment where the first sub flexible circuit board 111 and the second sub flexible circuit board 112 intersect with the first plane; the first plane is perpendicular to the boundary line of the first sub-flexible circuit board 111 and the second sub-flexible circuit board 112.

At this time, since the first boundary a is located inside the second boundary b, referring to fig. 3, the first chamfer structure 114 may be directly provided at the first boundary a to form the gap c. In addition, referring to fig. 4, the first boundary a and the second boundary b may be provided with a chamfer structure at the same time, and it should be noted that, when both the first boundary a and the second boundary b are provided with chamfer structures, the first chamfer structure 114 of the first boundary a should be arranged to be larger, and the second chamfer structure 1133 of the second boundary b should be arranged to be relatively smaller to form the gap c.

In another practical solution, referring to fig. 5 to 8, the fourth board surface 112y and the second board surface 111y enclose an inner angle of the first sub-flexible circuit board 111 and the second sub-flexible circuit board 112, at this time, in order to make the arrangement of the first supporting member 113 more hidden and make the appearance structure of the circuit board assembly 100 more neat, the first supporting member 113 may be disposed on one side of the inner angle of the first sub-flexible circuit board 111 and the second sub-flexible circuit board 112. Specifically, the first supporting plate 1131 may be attached to the second board surface 111y and connected to the second board surface 111y, and the second supporting plate 1132 may be attached to the fourth board surface 112y and connected to the fourth board surface 112 y. Wherein the inner angles of the first and second sub

flexible circuit boards

111 and 112 may correspond to: an inner angle between a first line segment and a second line segment where the first sub flexible circuit board 111 and the second sub flexible circuit board 112 intersect with the first plane; the first plane is perpendicular to the boundary line of the first sub-flexible circuit board 111 and the second sub-flexible circuit board 112.

At this time, since the second boundary b is located inside the first boundary a, referring to fig. 6, the second chamfered structure 1133 may be directly disposed at the second boundary b to form the gap c. In addition, referring to fig. 7 and fig. 8, a chamfer structure may be provided at both the first boundary a and the second boundary b, and it should be noted that, when both the first boundary a and the second boundary b are provided with chamfer structures, the second chamfer structure 1133 at the second boundary b should be set to be larger, and the first chamfer structure 114 at the first boundary a should be set to be relatively smaller to form the gap c.

The structure of the first support member 113 may be any structure as long as it can maintain the included angle between the first sub-flexible circuit board 111 and the second sub-flexible circuit board 112. For example, in some implementations, referring to fig. 1, the lengths of the first support plate 1131 and the second support plate 1132 along the first direction M may be equal, so that the edges of the first support member 113 formed by the first support plate 1131 and the second support plate 1132 are flush. Wherein the first direction M is parallel to the first support plate 1131 and the second support plate 1132. The above-mentioned first support plate 1131 and second support plate 1132 are limited, so that the structure of the first support member 113 is more regular and the aesthetic appearance is better.

For example, in other embodiments, referring to fig. 9 to 16, the end of the first support plate 1131 connected to the second support plate 1132 and/or the end of the second support plate 1132 connected to the first support plate 1131 may be provided with a first notch d. Above-mentioned through setting up first breach d, on the one hand can save material, reduce cost. On the other hand, when the first support plate 1131 and the second support plate 1132 need to be connected, the connection area can be reduced, and the connection is more convenient; alternatively, bending of the first support plate 1131 and the second support plate 1132 is facilitated when the two plates are formed by bending one plate.

It is to be understood that, referring to fig. 9 to 16, the first gap d may be located at an end portion of the first support plate 1131 and/or the second support plate 1132, and referring to fig. 16, the first gap d may also be located inside the first support plate 1131 and/or the second support plate 1132. When the first gap d is located at an end of the first support plate 1131 and/or the second support plate 1132, and the second interface b of the first support plate 1131 and the second support plate 1132 is provided with the second chamfered structure 1133, the gap d may be located at an end of the second chamfered structure 1133. Specifically, referring to fig. 10 to 16, a length of the second chamfered structure 1133 along the first direction M may be smaller than a length of the first support plate 1131 along the first direction M, and a length of the second chamfered structure 1133 along the first direction M may also be smaller than a length of the second support plate 1132 along the first direction M, so that an edge of the first support member 113 collectively formed by the first support plate 1131, the second support plate 1132 and the second chamfered structure 1133 has a first gap d, wherein the first direction M is parallel to the first support plate 1131 and the second support plate 1132.

It is understood that the structure of the first support 113 may be: referring to fig. 12, second chamfered structure 1133 has a first side 11331, a second side 11332, and a third side 11333, first side 11331 being disposed opposite to second side 11332, and third side 11333 connecting first side 11331 and second side 11332; the first support plate 1131 has a fourth side 11311 and a fifth side 11312 connecting the fourth side 11311; the second support plate 1132 has a sixth side surface 11321 and a seventh side surface 11322 connecting the sixth side surface 11321; the fourth side 11311 is further connected to the first side 11331, the sixth side 11321 is further connected to the second side 11332, and the fifth side 11312 and the seventh side 11322 are located on the same side of the third side 11333, so that the portion of the fourth side 11311 located between the fifth side 11312 and the third side 11333, the portion of the sixth side 11321 located between the seventh side 11322 and the third side 11333, and the third side 11333 can enclose the first gap d. The above-mentioned production and manufacture are facilitated by the specific definition of the structure of the first support 113. In this embodiment, to reduce the weight of the whole circuit board assembly 100, the first support plate 1131, the second support plate 1132 and the second chamfered structure 1133 may be in a thin plate shape, the second chamfered structure 1133, the first support plate 1131 and the second support plate 1132 may have a first surface close to the first flexible circuit board 110 and a second surface away from the first surface, and the side surfaces may be surfaces connecting the first surface and the second surface.

Still further, referring to fig. 12, a portion of the fourth side 11311 forming the first notch d may be provided with a second notch e. Above-mentioned through setting up second breach e, material saving that can be further reduce cost. Specifically, the profile surface of the second notch e may include a first connection segment e1 and a second connection segment e 2. The first connecting section e1 is spaced apart from the first side surface 11331, and one end of the first connecting section e1 is connected to the fifth side surface 11312; one end of the second connecting segment e2 is connected to the first side surface 11331, and the other end of the second connecting segment e2 is connected to the end of the first connecting segment e1 away from the fifth side surface 11312. The second notch e is configured to extend to the fifth side surface 11312, that is, to the edge of the first support plate 1131, so as to facilitate the connection between the second chamfered structure 1133 and the first support plate 1131 or to form the second chamfered structure by bending. Further, in a direction from the first side surface 11331 to the first connecting section e1, a distance from the second connecting section e2 to the fifth side surface 11312 may gradually decrease. The above-mentioned through the restriction to the shape of second connector segment e2 for first backup pad 1131 from being close to second chamfered structure 1133 to keeping away from the direction of second chamfered structure 1133, the size can grow gradually, can make the structure distribution of first backup pad 1131 more even when saving material, guarantees the intensity of first backup pad 1131.

Further, referring to fig. 13, an end of the first connecting section e1 near the fifth side 11312 may be provided with a third notch f. By further providing the third notch f at the edge of the first connecting section e1, the material can be further saved.

The first support 113 includes two edges collectively formed by the first support plate 1131, the second support plate 1132 and the second chamfered structure 1133, and preferably, both of the edges may have the first notch d. Above-mentioned all set up first breach d through on two edges at first support piece 113, on the one hand can save material, and on the other hand also can make first support piece 113's intensity distribution more even, avoids appearing because of the too big phenomenon that causes first support piece 113 to damage of local atress.

Referring to fig. 16, when the first gap d is located inside the first support plate 1131 and/or the second support plate 1132, the number of the first gaps d in the first support plate 1131 and/or the second support plate 1132 may be multiple, and the multiple first gaps d inside may be uniformly distributed.

It is understood that the first support plate 1131, the second support plate 1132 and the second chamfered structure 1133 may be formed separately and then assembled together. The first support plate 1131, the second support plate 1132 and the second chamfered structure 1133 may also be an integrally formed structure. Through the integrated molding setting, the machine shaping of the first support member 113 can be made more convenient. Specifically, when the first support plate 1131, the second support plate 1132 and the second chamfered structure 1133 are integrally formed, the first support plate 1131, the second support plate 1132 and the second chamfered structure 1133 may be formed by bending a sheet of material.

The connection between the first support plate 1131 and the first sub-flexible circuit board 111 and the connection between the second support plate 1132 and the second sub-flexible circuit board 112 may be any. For example, in some embodiments, the first support plate 1131 and the first sub-flexible circuit board 111 may be connected by an adhesive, and the second support plate 1132 and the second sub-flexible circuit board 112 may also be connected by an adhesive. The connection between the first supporting member 113 and the first flexible circuit board 110 is realized by the adhesive, and the connection mode is simple and easy to operate. In the embodiment of the present application, the adhesive may be double-sided tape, epoxy resin, UV glue, quick-drying glue, or the like.

The shape of the first support 113 may be arbitrary. For example, the structure of the first support plate 1131 may be the same as or different from the structure of the second support plate 1132. When the first support plate 1131 and the second support plate 1132 have the same structure, the first support member 113 may have an axisymmetric structure, so that the first support member 113 generates the same constraint on the first sub-flexible circuit board 111 and the second sub-flexible circuit board 112. When the structure of the second support plate 1132 is the same as that of the first support plate 1131, the first support member 113 may not have an axisymmetric structure, as shown in fig. 14 and 15.

Referring to fig. 17, the circuit board assembly 100 may further include a rigid circuit board 120, and the first flexible circuit board 110 may be located outside the rigid circuit board 120 when viewed in a direction perpendicular to a board surface of the rigid circuit board 120, and the rigid circuit board 120 is configured to be electrically connected to the external connector 20 through the first flexible circuit board 110. By arranging the rigid circuit board 120, external devices such as the lens assembly 200 and the like can be mounted on the rigid circuit board 120 in the middle, and torque force generated by shaking of the devices can be released in a manner of twisting deformation and the like of the first flexible circuit board 110, so that the circuit board assembly 100 is not easily damaged.

Furthermore, in order to improve the stress releasing performance of the first flexible circuit board 110, referring to fig. 18, the first flexible circuit board 110 may include at least two first sub-flexible circuit boards 111, all the first sub-flexible circuit boards 111 are disposed at intervals, every two adjacent first sub-flexible circuit boards 111 may be connected through one second sub-flexible circuit board 112, and a first supporting member 113 may be disposed at a first boundary a between the adjacent first sub-flexible circuit boards 111 and the adjacent second sub-flexible circuit boards 112. Through the above arrangement, when the device disposed on the rigid circuit board 120 shakes, the plurality of first sub flexible circuit boards 111 and the plurality of second sub flexible circuit boards 112 can both be distorted and deformed to release the torque force, so that the torque force can be dispersed on more sub flexible circuit boards, and the stress concentration on the single sub flexible circuit board can be prevented from breaking.

Furthermore, the number of the first flexible circuit boards 110 may be two, and when viewed in a direction perpendicular to the surface of the rigid circuit board 120, the two first flexible circuit boards 110 may be respectively located at two sides of the rigid circuit board 120, and one end of each first flexible circuit board 110 is electrically connected to the rigid circuit board 120, and the other end of each first flexible circuit board 110 is electrically connected to the outer connector 20. As the first flexible circuit boards 110 are respectively disposed on two sides outside the rigid circuit board 120, when devices on the rigid circuit board 120 shake, the two first flexible circuit boards 110 outside the rigid circuit board 120 can both generate torsional deformation to release stress, and the stress release effect is better.

Further, referring to fig. 17, the board surface of the rigid circuit board 120 has a first edge 121 and a second edge 122 opposite to each other, one end of each of the two first flexible circuit boards 110 may be located at the first edge 121 and electrically connected to the rigid circuit board 120, and the other end of each of the two first flexible circuit boards 110 may be located at the second edge 122 and electrically connected to the outer connector 20. Through the arrangement, the interval utilization rate outside the rigid circuit board 120 can be maximized, so that the stress is more dispersed, and the problem of fracture of the first flexible circuit board 110 is avoided. It is understood that all the sub-flexible circuit boards in the first flexible circuit board 110 may be disposed at an included angle greater than 0 ° and less than 180 ° with the rigid circuit board 120. Preferably, all the sub-flexible circuit boards in the first flexible circuit board 110 may be disposed at an angle of 90 ° with respect to the rigid circuit board 120. The inner angle of the first sub flexible circuit board 111 and the second sub flexible circuit board 112 may be an included angle between the first sub flexible circuit board 111 and the second sub flexible circuit board 112 near the rigid circuit board 120, and the outer angle of the first sub flexible circuit board 111 and the second sub flexible circuit board 112 may be an included angle between the first sub flexible circuit board 111 and the second sub flexible circuit board away from the rigid circuit board 120.

It is understood that, referring to fig. 17, the circuit board assembly 100 may further include two second flexible circuit boards 140, and each of the first flexible circuit boards 110 may be electrically connected to the rigid circuit board 120 through one second flexible circuit board 140. The second flexible circuit board 140 and the first flexible circuit board 110 are both flexible circuit boards, so that the two flexible circuit boards can be directly formed by bending one flexible circuit board, and the manufacture is more convenient. Referring to fig. 19 and 21, two of the second flexible circuit boards 140 may be connected as a single body; referring to fig. 17 and 18, two of the second flexible circuit boards 140 may be separately provided. When the two second flexible circuit boards 140 are separately disposed, the torsion of each second flexible circuit board 140 and the first flexible circuit board 110 connected thereto can be prevented from being interfered by the other second flexible circuit board 140 and the other first flexible circuit board 110, and the stress release effect is better. By integrally connecting the two second flexible circuit boards 140, the ends of the two first flexible circuit boards 110 connected with the second flexible circuit boards 140 can be located in the same plane, so that the distribution of stress on the two first flexible circuit boards 110 is relatively balanced. Meanwhile, the two second flexible circuit boards 140 are connected into a whole, which facilitates the connection between the two second flexible circuit boards 140 and the two first flexible circuit boards 110 and the hard circuit board 120.

Still further, referring to fig. 19, the circuit board assembly 100 may further include two third flexible circuit boards 130, each of the first flexible circuit boards 110 may be electrically connected to the outer connector 20 through one of the third flexible circuit boards 130, and the two third flexible circuit boards 130 are spaced apart from each other. Because the third flexible circuit board 130 and the first flexible circuit board 110 are both flexible circuit boards, the third flexible circuit board and the first flexible circuit board can be directly formed by bending one flexible circuit board, and the manufacture is more convenient. Meanwhile, by setting the number of the third flexible circuit boards 130 to two, the circuit board assembly 100 may be applied to the external connection member 20 having two interfaces (e.g., in order to make the structure of the external connection member 20 smaller, the external connection member 20 is provided with two interfaces and is located on two surfaces which are oppositely disposed, respectively), and the application range is wider. By disposing the two third flexible circuit boards 130 at an interval, the twisting of the two third flexible circuit boards 130 and the twisting of the two first flexible circuit boards 110 connected to the two third flexible circuit boards 130 do not interfere with each other.

The two third flexible circuit boards 130 may be arranged at intervals: in some implementations, two of the third flexible circuit boards 130 are spaced apart from each other when viewed in a direction parallel to the board surface of the rigid circuit board 120. In other embodiments, referring to fig. 20, two third flexible circuit boards 130 are spaced apart from each other when viewed in a direction perpendicular to the board surface of the rigid circuit board 120. In still other practical solutions, referring to fig. 19, one of the third flexible circuit boards 130 includes a first electrical connection section 131, a second electrical connection section 132, and a third electrical connection section 133 connected in sequence, where an end of the first electrical connection section 131 away from the second electrical connection section 132 is electrically connected to the first flexible circuit board 110, an end of the third electrical connection section 133 away from the second electrical connection section 132 is used for electrically connecting the external connection member 20, and the first electrical connection section 131 is spaced from another third flexible circuit board 130 as viewed in a direction perpendicular to the board surface of the rigid circuit board 120; the third electrical connection section 133 is spaced apart from another third flexible circuit board 130 when viewed in a direction parallel to the board surface of the rigid circuit board 120. Through the above arrangement, the structures of the two third flexible circuit boards 130 are more various, and the application range is wider.

Still further, referring to fig. 18 and 19, in some implementations, the external connector 20 may be aligned with one of the third flexible circuit boards 130 to cause the other third flexible circuit board 130 to be wired in an offset manner. Referring to fig. 20, in other implementations, the external connector 20 may be aligned with the middle of the two third flexible circuit boards 130, so that the two third flexible circuit boards 130 are wired in a symmetrical combination manner. Referring to fig. 17, in still other implementations, the external connector 20 may be aligned with two third flexible circuit boards 130 at the same time.

It is understood that referring to fig. 18 and 19, a second supporting member may be disposed at the interface of the first flexible circuit board 110 and the second flexible circuit board 140. Specifically, the second supporting member may be selectively disposed at the outer side of the first flexible circuit board 110 and the second flexible circuit board 140, and may also be disposed at the inner side of the first flexible circuit board 110 and the second flexible circuit board 140. The second supporting members on the two second flexible circuit boards 140 may be shared or may be separately provided. The structure of the second support member may be the same as that of the first support member 113, and thus, a detailed description thereof is omitted. It should be noted that, when the second supporting member is disposed inside the first flexible circuit board 110 and the second flexible circuit board 140, referring to fig. 21, when the size of the second flexible circuit board 140 is smaller so that the first flexible circuit board 110 is closer to the rigid circuit board 120, one end of the second supporting member may be connected to the first flexible circuit board 110, and the other end of the second supporting member may be connected to the rigid circuit board 120.

Similarly, referring to fig. 21, a third supporting member may be disposed at the interface between the first flexible circuit board 110 and the third flexible circuit board 130. The structure of the third support member is the same as that of the first support member 113, and thus, the description thereof is omitted. The third supporting members on the two third flexible circuit boards 130 may be shared or may be separately provided.

In this application, first support piece 113, second support piece and third support piece can select materials such as metal, plastic to make for use, and the design effect is stable.

In some implementations, referring to fig. 22 and 23, the rigid circuit board 120 and the external connector 20 may be located on the same side of the two first flexible circuit boards 110 as viewed in a direction parallel to the board surface of the rigid circuit board 120. Since the two first flexible circuit boards 110 are respectively located at two sides outside the rigid circuit board 120 when viewed in a direction perpendicular to the board surface of the rigid circuit board 120, when viewed in a direction parallel to the board surface of the rigid circuit board 120, the situation that the rigid circuit board 120 is located at one side of the two first flexible circuit boards 110 only includes the situation that the rigid circuit board 120 is located above or below the two first flexible circuit boards 110. The above-defined situation that the rigid circuit board 120 and the external connector 20 are located on the same side of the two first flexible circuit boards 110 may be: the rigid circuit board 120 and the outer connector 20 are both located above the two first flexible circuit boards 110, or both located below the two first flexible circuit boards 110. In other implementable solutions, referring to fig. 24 and 25, the rigid circuit board 120 and the external connector 20 are located on opposite sides of the two first flexible circuit boards 110 in a direction parallel to the board surface of the rigid circuit board 120. The hard circuit board 120 and the outer connector 20 defined above are located on opposite sides of the two first flexible circuit boards 110: one of the rigid circuit board 120 and the external connector 20 is located above the two first flexible circuit boards 110, and the other is located below the two first flexible circuit boards 110. Through the arrangement, the structure of the circuit board assembly 100 is more diversified, and a user can select the appropriate circuit board assembly 100 according to conditions such as reserved space and the like. It is understood that referring to fig. 22 to 25, the slope of the first flexible circuit board 110 may also be adjusted adaptively according to the use requirement.

In a second aspect, the present embodiment provides a camera module 10. Referring to fig. 26 and 27, the camera module 10 may include a lens assembly 200, an image processing assembly 300, and any of the circuit board assemblies 100 described above. The lens assembly 200 is used for receiving an optical signal of a subject; the image processing assembly 300 is disposed at the image side of the lens assembly 200, and is configured to receive an optical signal of the subject and convert the optical signal into an image signal; the rigid circuit board 120 of the circuit board assembly 100 is disposed on a side of the image processing assembly 300 away from the subject to carry the image processing assembly 300 and/or the lens assembly 200; the hard circuit board 120 is also electrically connected to the image processing assembly 300 to transmit the image signal to the external connector 20.

The camera module 10 according to the embodiment of the present application includes the circuit board assembly 100, so that the above effects of the circuit board assembly 100 are achieved, and specifically, by providing the first supporting member 113 at the junction of the two sub-flexible circuit boards, on one hand, the structural strength of the junction can be enhanced, and the occurrence of a fracture phenomenon can be reduced; on the other hand, the included angle between the two sub-flexible circuit boards can be still maintained after the circuit board assembly 100 is actuated for a long time, so that the normal anti-shake performance of the circuit board assembly 100 on equipment such as a pan-tilt camera is ensured, and the service life of the circuit board assembly 100 is prolonged.

In some practical solutions, referring to fig. 26 and 27, the camera module 10 may further include a pan/tilt bracket 400, a pan/tilt holder 500, and a driving device. The holder bracket 400 is covered on the periphery of the lens assembly 200 and connected with the lens assembly 200; cloud platform fixing base 500 is provided with and holds chamber G, cloud platform support 400 lens subassembly 200 image processing subassembly 300 and rigid circuit board 120 all is located hold chamber G, two first flexible circuit board 110 is located the outer both sides of cloud platform fixing base 500 respectively, and one end extends to hold in the chamber G and with rigid circuit board 120 electricity is connected, and the other end is used for being connected with outer connecting piece 20 electricity. The driving device is connected to the holder bracket 400 and the holder fixing base 500 to drive the holder bracket 400 and the lens assembly 200 to move relative to the holder fixing base 500, so as to realize the anti-shake performance of the lens assembly 200. Above-mentioned through setting up two first flexible circuit board 110 in the outer both sides of cloud platform fixing base 500 respectively, can increase first flexible circuit board 110's size to can reduce the atress of first flexible circuit board 110 in the unit area, for avoiding cloud platform fixing base 500 to hinder first flexible circuit board 110 to take place deformation, can have the clearance between cloud platform fixing base 500 and the first flexible circuit board 110. Of course, in order to reduce the material consumption of the first flexible circuit board 110 and to achieve miniaturization of the electronic device, the gap between the holder fixing base 500 and the first flexible circuit board 110 may be set to be small, so that the inner boundary line of the first flexible circuit board 110 is as close as possible to the outer boundary line of the holder fixing base 500. Through setting up cloud platform support 400 and drive arrangement, and drive arrangement can drive cloud platform support 400 and lens subassembly 200 for the motion of cloud platform fixing base 500, can realize lens subassembly 200's anti-shake nature, promote the shooting effect.

The structure of the driving means may be arbitrary. For example, the driving device may include a stator and a rotor, the stator may be fixedly disposed on the holder fixing base 500 and electrically connected to the circuit board assembly 100, the rotor may be fixedly disposed on the holder support 400, and the stator and the rotor may be magnetically coupled to drive the holder support 400 and the lens assembly 200 to move along a predetermined direction. Specifically, the stator may include a plurality of electromagnetic induction coils that collectively form a first magnetic field, and the rotor may include a plurality of permanent magnets that collectively form a second magnetic field that is coupled with the first magnetic field. The first magnetic field is changed by changing the magnitude and direction of the current in the electromagnetic induction coil, and the rotor moves relative to the stator to drive the holder bracket 400 and the lens assembly 200 to move along the predetermined direction under the magnetic coupling effect of the first magnetic field and the second magnetic field.

Referring to fig. 26 and 27, a fixing plate 134 may be disposed on the third flexible circuit board 130, and the fixing plate 134 may be connected to a housing 600 at the periphery of the holder fixing base 500. Specifically, referring to fig. 26, the camera module 10 may further include a housing 600 covering the holder fixing base 500 and the periphery of the second sub flexible circuit board 112, and the fixing plate 134 and the holder fixing base 500 may be connected to the housing 600. Above-mentioned through being connected third flexible circuit board 130 with casing 600 through fixed plate 134, only be located devices such as inside lens subassembly 200, cloud platform support 400 and actuate when can realizing the anti-shake, and devices such as third flexible circuit board 130, cloud platform fixing base 500 that are located the outside are motionless, promote user experience.

The cradle head 400 has a rotation center point, and a plane passing through the rotation center point and parallel to the surface of the rigid circuit board 120 is defined as a second plane, which may intersect with the first flexible circuit board 110. The aforesaid is crossing for setting up the position limit for with the second plane through first flexible circuit board 110, and owing to be close to the rotation center point department vibration amplitude more and less, so can make under the same exogenic action, the moment of torsion that makes first flexible circuit board 110 receive is littleer, can reduce the anti-shake angle of camera module 10, promotes camera module 10's stability, promotes camera module 10's imaging quality.

In a third aspect, an embodiment of the present application provides an electronic device. The electronic device may include any of the camera modules 10 described above. The electronic device may be any device having an image acquisition function. For example, the electronic device may be a pan-tilt camera, a smartphone, a wearable device, a computing device, a television, a vehicle, a monitoring device, and so forth.

Based on the fact that the electronic device in the embodiment of the present application includes the circuit board assembly 100, the above effects of the circuit board assembly 100 are achieved, and specifically, by providing the first supporting member at the junction of the two sub-flexible circuit boards, on one hand, the structural strength of the junction can be enhanced, and the occurrence of the fracture phenomenon can be reduced; on the other hand, the included angle between the two sub-flexible circuit boards can be still maintained after the circuit board assembly 100 is actuated for a long time, so that the normal anti-shake performance of the circuit board assembly 100 on equipment such as a pan-tilt camera is ensured, and the service life of the circuit board assembly 100 is prolonged.

In the description of the present application, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art. Further, in the description of the present application, "a plurality" means two or more unless otherwise specified. "and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship.

The above disclosure is only for the purpose of illustrating the preferred embodiments of the present application and is not to be construed as limiting the scope of the present application, so that the present application is not limited thereto, and all equivalent variations and modifications can be made to the present application.

Claims

1. A circuit board assembly comprising a first flexible circuit board, the first flexible circuit board comprising:

a first sub flexible circuit board;

2. The circuit board assembly of claim 1, wherein the first support comprises:

3. The circuit board assembly of claim 2, wherein a second interface of the first support plate and the second support plate is spaced apart from the first interface.

4. The circuit board assembly of claim 3, wherein a gap is provided between the second interface and the first interface.

5. The circuit board assembly of claim 4, wherein the board surfaces of the first sub-flexible circuit board comprise a first board surface and a second board surface which are opposite to each other, the board surfaces of the second sub-flexible circuit board comprise a third board surface and a fourth board surface which are opposite to each other, the third board surface is connected with the first board surface, the fourth board surface is connected with the second board surface, the third board surface and the first board surface enclose outer corners of the first sub-flexible circuit board and the second sub-flexible circuit board,

6. The circuit board assembly of claim 5, wherein the first interface is provided with a first chamfer feature to form the gap.

7. The circuit board assembly of claim 4, wherein the board surfaces of the first sub-flexible circuit board comprise a first board surface and a second board surface which are opposite to each other, the board surfaces of the second sub-flexible circuit board comprise a third board surface and a fourth board surface which are opposite to each other, the third board surface is connected with the first board surface, the fourth board surface is connected with the second board surface, and the fourth board surface and the second board surface enclose an inner corner of the first sub-flexible circuit board and the second sub-flexible circuit board,

8. The circuit board assembly of claim 7, wherein the second interface is provided with a second chamfered structure to form the gap.

9. The circuit board assembly according to claim 2, wherein the end of the first support plate connected to the second support plate and/or the end of the second support plate connected to the first support plate is provided with a notch.

10. The circuit board assembly of any one of claims 1 to 9, further comprising:

11. The circuit board assembly according to claim 10, wherein the first flexible circuit board includes at least two first sub-flexible circuit boards, all of the first sub-flexible circuit boards are spaced apart, every two adjacent first sub-flexible circuit boards are connected by one second sub-flexible circuit board, and the first supporting member is disposed at the first intersection of the adjacent first sub-flexible circuit boards and the adjacent second sub-flexible circuit boards.

12. The circuit board assembly according to claim 11, wherein the number of the first flexible circuit boards is two, when viewed in a direction perpendicular to the surface of the rigid circuit board, the two first flexible circuit boards are respectively located at two sides of the rigid circuit board, one end of each first flexible circuit board is electrically connected to the rigid circuit board, and the other end of each first flexible circuit board is electrically connected to the external connector.

13. The circuit board assembly of claim 12, wherein the board surface of the rigid circuit board has a first edge and a second edge opposite to each other, one end of each of the two first flexible circuit boards is located at the first edge and electrically connected to the rigid circuit board, and the other end of each of the two first flexible circuit boards is located at the second edge and electrically connected to the external connector.

14. The circuit board assembly of claim 12, wherein the circuit board assembly further comprises:

15. The circuit board assembly of claim 12, wherein the circuit board assembly further comprises:

16. The circuit board assembly of claim 15,

viewed in a direction parallel to the plate surface of the rigid circuit board, the two third flexible circuit boards are arranged at intervals; or

17. The circuit board assembly according to claim 12, wherein the rigid circuit board and the external connector are located on the same side of the two first flexible circuit boards as viewed in a direction parallel to a board surface of the rigid circuit board; or, the rigid circuit board and the outer connecting piece are positioned on opposite sides of the two first flexible circuit boards along a direction parallel to the board surface of the rigid circuit board.

18. The utility model provides a camera module which characterized in that includes:

a lens assembly for receiving a light signal of a subject;

the circuit board assembly of any one of claims 12 to 17, the rigid circuit board of the circuit board assembly being disposed on a side of the image processing assembly away from the subject to carry the image processing assembly and/or the lens assembly; the hard circuit board is also electrically connected with the image processing assembly so as to transmit the image signal to the outer connecting piece.

19. The camera module of claim 18, further comprising:

20. An electronic device, characterized by comprising the camera module of claim 18 or 19.