CN114136447A - Method for measuring temperature, electronic equipment and computer readable storage medium - Google Patents

Abstract

The application relates to the field of electronic equipment, and discloses a method for measuring temperature, electronic equipment and a computer readable storage medium. The method comprises the steps of acquiring a first temperature of a measured object measured by an external temperature sensor; acquiring the temperature in the at least one electronic device measured by the at least one internal temperature sensor, and determining a corrected temperature according to the measured temperature in the at least one electronic device; determining a second temperature according to the first temperature and the correction temperature of the measured object measured by the external temperature sensor; and outputting the second temperature as the temperature of the measured object. The temperature of the measured object which is finally output is corrected, so that the temperature measurement precision of the mobile phone is improved.

Description

Method for measuring temperature, electronic equipment and computer readable storage medium

The present application claims priority from chinese patent application No. 202010924112.1 entitled "a method and electronic device for improving temperature measurement accuracy" filed on 04/09/2020, which is incorporated herein by reference in its entirety.

Technical Field

The present disclosure relates to the field of electronic devices, and more particularly, to a method for measuring temperature, an electronic device, and a computer-readable storage medium.

Background

All objects with a temperature above absolute zero are constantly exchanging heat with the surroundings, temperature being one of the most basic physical characteristics. The temperature is closely related to the life of people, and the temperature is not only used for managing the human health according to the human body temperature, but also used for facilitating the life according to the article temperature, and even used for carrying out related production work according to the object temperature. Therefore, how to acquire temperature information more conveniently and how to acquire more accurate temperature information become an important development direction of temperature measurement technology.

The common body temperature measuring devices in the market at present can be divided into two categories, namely contact thermometers and non-contact thermometers.

Common products of contact thermometers are mercury thermometers, electronic thermometers, and the like. The contact thermometer measures the temperature information of the measured object through the heat conduction effect. Although the temperature measurement accuracy is high, the method has the defects of fragility, insecurity, easy cross infection and the like.

Common products of the non-contact thermometer include forehead thermometers, ear thermometers, industrial thermometers, infrared temperature screeners and other infrared temperature measuring devices. Generally, based on technologies such as a thermocouple and a thermopile, infrared energy radiated by a measured object is collected by an infrared temperature sensor, and temperature information of the measured object is output. Although it has the advantages of fast measuring speed, sanitation and the like, the defects of relatively poor temperature measuring accuracy, relatively high equipment price and the like exist.

In addition, the two temperature measuring devices have the defect of difficult carrying, and a special temperature measuring device is needed for people to obtain temperature information.

Content of application

The embodiment of the application provides a method for measuring temperature, which is used for measuring the temperature precision of a mobile phone.

In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions:

in a first aspect, an embodiment of the present application discloses a method for measuring temperature of an electronic device (e.g., a mobile phone) including an external temperature sensor (e.g., an infrared temperature sensor) and an internal temperature sensor (e.g., a thermistor temperature sensor). The method for measuring the temperature comprises the following steps: acquiring a first temperature of a measured object (e.g., a person) measured by an external temperature sensor, the first temperature being an original temperature; the temperature within the electronic device measured from the internal temperature sensor is acquired and a corrected temperature is determined based on the measured temperature within the electronic device. The temperature value sensed by the internal temperature sensor can be measured by the internal temperature sensor in the mobile phone, and can represent the temperature value inside the mobile phone at the position where the sensor is arranged. If a plurality of such internal temperature sensors are provided at different locations within the handset, a plurality of such temperature values may be obtained. In this embodiment, the mobile phone is provided with two internal temperature sensors, but the number of the internal temperature sensors is not limited to this, and is, for example, one, three, four, and the like.

After determining the corrected temperature, the method of measuring the temperature further comprises: determining a second temperature according to the first temperature and the correction temperature of the measured object measured by the external temperature sensor; and outputting the second temperature as the temperature of the measured object.

According to an embodiment of the present application, the correction temperature is determined by calculation of the temperature within the mobile phone. The temperature of the measured object which is finally output is corrected, so that the temperature measurement precision of the mobile phone is improved.

In some possible implementations, the infrared temperature sensor (as an example of the external temperature sensor) of the above embodiments is further integrated with an internal temperature sensor. Namely, the infrared temperature sensor can measure the temperature of a human body outside the mobile phone and can also measure the temperature of a microenvironment where the infrared temperature sensor inside the mobile phone is located.

In one possible implementation of the first aspect, an absolute value of a difference between the second temperature and an actual temperature of the object to be measured is smaller than an absolute value of a difference between the first temperature and the actual temperature of the object to be measured. That is, the first temperature and the second temperature are different.

In one possible implementation of the first aspect, the determining the second temperature according to the first temperature and the corrected temperature of the measured object measured by the external temperature sensor includes: and determining a second temperature of the measured object according to the first temperature, the correction temperature and the first temperature correction algorithm.

In one possible implementation of the first aspect, the first temperature correction algorithm includes the following equation: t1 ═ K1 ═ T2+ K2 ═ Twd; where T1 denotes the first temperature, T2 denotes the second temperature, Twd denotes the correction temperature, and K1 and K2 denote the energy coefficients.

In one possible implementation of the first aspect, the determining a corrected temperature according to a temperature within the at least one electronic device measured by the at least one internal temperature sensor includes: a corrected temperature is determined based on the temperature within the at least one electronic device measured by the at least one internal temperature sensor and a second temperature correction algorithm.

In one possible implementation of the first aspect, the second temperature correction algorithm includes the following equation: twd ═ E1 × t1+ E2 × t2+ … … + Em × tm; wherein the number of the internal temperature sensors is m, m ≧ 1, Twd denotes a correction temperature, tm denotes a temperature within the electronic apparatus measured by the mth internal temperature sensor, and Em denotes a heat transfer coefficient between the mth internal temperature sensor and a spacer provided between the external temperature sensor and the outside of the electronic apparatus. Illustratively, t1 represents the operating microenvironment temperature at the location where the internal temperature sensor integrated with the infrared temperature sensor is located.

In one possible implementation of the first aspect, the temperature within the at least one electronic device includes a temperature of a particular heat-generating component and/or a temperature of a particular location within the electronic device. That is, the temperature in the mobile phone measured by the internal temperature sensor includes the temperature of a specific heat-generating component (for example, a baseband chip, an application processor, a radio frequency chip, a camera module, and other components) in the mobile phone. Alternatively, the temperature within the handset measured by the internal temperature sensor includes the temperature at a particular location within the handset. Or the temperature in the mobile phone measured by the internal temperature sensor comprises the temperature of a specific heating component in the mobile phone and the temperature of a specific position.

In one possible implementation of the first aspect described above, the corrected temperature is used to characterize a temperature of a spacer disposed between the ambient temperature sensor and an exterior of the electronic device.

However, the method for measuring temperature in the present application is not limited to the temperature correction of the measured object outside the mobile phone, and may be the temperature correction of any part in the mobile phone. The corrected temperature is the temperature of the spacer between the external temperature sensor and the object to be measured inside the mobile phone. The temperature value of any part in the mobile phone can be deduced and calculated by utilizing the measured temperature of any part obtained by the external temperature sensor and the temperature in at least one mobile phone obtained by the internal temperature sensor.

In a possible implementation of the first aspect, the spacer is a shielding sheet, the shielding sheet is used to seal and cover an opening formed in one side of a housing of the electronic device, and the ambient temperature sensor is capable of measuring the first temperature of the measured object through the opening and the shielding sheet.

In one possible implementation of the first aspect, the method further includes: displaying a temperature measurement interface; the temperature measuring operation from a user is received, and the first temperature of the measured object is measured through the external temperature sensor in response to the temperature measuring operation.

In one possible implementation of the first aspect, outputting the second temperature includes: and displaying the second temperature on the temperature measurement interface or playing the second temperature through voice.

In one possible implementation of the first aspect described above, the ambient temperature sensor is an infrared temperature sensor. The infrared temperature sensor may measure the temperature of the measured object using infrared rays. The infrared temperature sensor comprises a thermopile infrared temperature sensor, a thermocouple infrared temperature sensor, a thermal resistance infrared temperature sensor, a photovoltaic effect-based infrared temperature sensor, a photoelectron effect-based infrared temperature sensor and other different types, and the embodiment of the application does not limit the infrared temperature sensor.

In one possible implementation of the first aspect, an absolute value of a difference between the second temperature and an actual temperature of the object to be measured is equal to or less than 0.2 ℃. The temperature measurement precision of the mobile phone meets the national standard requirement of body temperature measurement (the difference between the temperature and the real temperature of a measured object is +/-0.2 ℃).

In a second aspect, the present application provides an electronic device comprising: the external temperature sensor is used for measuring a first temperature of the measured object; at least one internal temperature sensor for measuring a temperature within the at least one electronic device; a processor; a memory including instructions that, when executed by the processor, cause the electronic device to perform a method of measuring temperature comprising: acquiring a first temperature of a measured object measured by an external temperature sensor; acquiring the temperature in the at least one electronic device measured by the at least one internal temperature sensor, and determining a corrected temperature according to the measured temperature in the at least one electronic device; determining a second temperature according to the first temperature and the correction temperature of the measured object measured by the external temperature sensor; and the output device is used for outputting the second temperature as the temperature of the measured object.

In one possible implementation of the second aspect described above, the ambient temperature sensor is an infrared temperature sensor.

In one possible implementation of the second aspect, the method further includes: the one side of electronic equipment's casing is located to the trompil, and trompil department adopts and shelters from the sealed cover of piece, and ambient temperature sensor can see through the trompil and shelter from the piece and measure the first temperature of measurand.

Illustratively, the back side (the side facing the object to be tested) of the housing of the mobile phone is provided with an opening, and the front side (the side facing the user) of the housing of the mobile phone is provided with an output device (e.g. a display). In addition, a data processing unit (for example, the processor mentioned above) is integrated in the housing of the mobile phone, including but not limited to a data acquisition unit, an analog-to-digital conversion unit, a signal amplification unit, and the like. The display on one side of the shell is provided with a temperature display interface, and the display content comprises but is not limited to temperature information, distance information and the like. The information display includes but is not limited to text prompt, voice prompt, picture prompt, etc.

In one possible implementation of the second aspect described above, the shielding sheet is a window glass sheet.

In one possible implementation of the second aspect described above, the shielding sheet has an infrared transmittance above a set threshold for a specific infrared band.

In one possible implementation of the second aspect, the size of the opening is matched to a signal receiving area of the ambient temperature sensor.

In a third aspect, the present application provides an electronic device, comprising: the external temperature sensor is used for measuring a first temperature of the measured object; at least one internal temperature sensor for measuring a temperature within the at least one electronic device; a processor; a memory including instructions that, when executed by the processor, cause the electronic device to perform a method of measuring temperature as provided in any implementation of the first aspect.

In a fourth aspect, an embodiment of the present application discloses a computer-readable storage medium having instructions stored thereon, where the instructions, when executed on a computer, cause the computer to perform the method for measuring temperature provided in any implementation manner of the first aspect.

Drawings

Fig. 1 illustrates a schematic front view of a cell phone, according to some embodiments of the present application;

FIG. 2 illustrates a schematic diagram of a back side structure of a cell phone, according to some embodiments of the present application;

FIG. 3 illustrates a side view schematic and a measurement schematic of a cell phone, according to some embodiments of the present application;

FIG. 4 is a schematic diagram illustrating temperature measurement accuracy degradation due to heating of components in a high power scene, according to some embodiments of the present disclosure;

fig. 5 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

FIG. 6 shows a first flowchart of a method for measuring temperature provided by an embodiment of the present application;

FIG. 7 illustrates a second flowchart of a method of measuring temperature provided by an embodiment of the present application;

FIG. 8 is a graph illustrating the effect of a correction of a method of measuring temperature according to an embodiment of the present application;

FIG. 9 is a graph illustrating the effect of a window glass sheet temperature calculation on a method of measuring temperature according to an embodiment of the present application;

FIG. 10 is a schematic view of a thermometry interface illustrating a method of measuring temperature according to one embodiment of the present application;

FIG. 11 illustrates a block diagram of an electronic device provided by an embodiment of the present application;

fig. 12 shows a block diagram of a system on chip (SoC) provided by an embodiment of the present application.

Detailed Description

Hereinafter, specific embodiments of the present application will be described in detail with reference to the accompanying drawings.

The application provides a method for measuring temperature, which is used for terminal equipment such as a smart phone or wearable equipment (such as a watch and an earphone) integrated with a temperature measuring function, and is favorable for improving the temperature measuring precision of the terminal equipment.

Embodiments of the present application are explained below by taking a mobile phone as shown in fig. 1 to 3 as an example. In order to improve the portable type of temperature measuring equipment, let people can acquire temperature information more conveniently, the cell-phone of this application has integrated the temperature measurement function. Fig. 1 is a schematic diagram showing a front side (facing a user) of a mobile phone, fig. 2 is a schematic diagram showing a rear side (facing a measured object 9 described later) of the mobile phone, and fig. 3 is a schematic diagram showing a user using the mobile phone to measure a temperature of the measured object 9.

As shown in fig. 1 and 2, the temperature measuring function of the mobile phone is mainly realized by the external temperature sensor 4, the distance sensor 10, the display 3 and the control switch 8 which are arranged in the mobile phone. Illustratively, the control switch 8 (which may be a virtual key or a physical key) is used to activate and deactivate the ambient temperature sensor 4 and the distance sensor 10. The data processing unit 5 in the mobile phone receives the instruction of the control switch 8 to turn on or off the temperature measurement function of the mobile phone.

In addition, other temperature sensors are provided inside the handset, for example two internal temperature sensors 6, 7 are shown in fig. 1 and 2. The data processing unit 5 executes a temperature processing strategy using the temperature inside the mobile phone detected by the internal temperature sensors 6, 7. For example, when the temperatures reported by the internal temperature sensors 6 and 7 are lower than a certain threshold, the data processing unit 5 boosts the output voltage of the battery to avoid abnormal shutdown due to low temperature.

Illustratively, the back of the shell 1 of the mobile phone is provided with an opening, the outside temperature sensor 4 is arranged in the opening, and the size of the opening is matched with the signal receiving area of the outside temperature sensor 4. The opening is sealed and covered by a shielding sheet 2, and the shielding sheet 2 belongs to a spacer between an outside temperature sensor 4 and the outside of the mobile phone. The external temperature sensor 4 is used as a temperature measuring element in the mobile phone, and can measure the temperature of a measured object 9 (such as a human body) outside the mobile phone through the opening and the shielding sheet 2. The distance sensor 10 is used for providing the measured distance information between the measured object 9 and the mobile phone to the mobile phone so as to guide the user to measure the temperature of the measured object 9 by using the mobile phone in the correct distance range. In the process of measuring the temperature of the measured object 9 by using the mobile phone, the display 3 positioned on the front surface of the mobile phone can display the measured temperature and the distance information of the measured object 9.

The outside temperature sensor 4 in the above embodiment may be a non-contact temperature sensor, such as an infrared temperature sensor, which may measure the temperature of the measured object 9 using infrared rays. The infrared temperature sensor comprises a thermopile infrared temperature sensor, a thermocouple infrared temperature sensor, a thermal resistance infrared temperature sensor, a photovoltaic effect-based infrared temperature sensor, a photoelectron effect-based infrared temperature sensor and other different types, and the embodiment of the application does not limit the infrared temperature sensor. In the embodiments described below, the case where the external temperature sensor 4 is an infrared temperature sensor will be described as an example.

Accordingly, when the ambient temperature sensor 4 is an infrared temperature sensor, the shielding sheet 2 (spacer) in the above embodiment has not only dust-proof and water-proof properties for the hole in the mobile phone but also a high infrared transmittance. For example, the shielding sheet 2 is a window glass sheet (including but not limited to common glass, silicon material glass, zinc sulfide glass, etc.), and the infrared transmission band characteristic of the window glass sheet needs to match with the operating band of the non-contact temperature sensor used. In the present application, the window glass sheet has an infrared transmittance higher than a set threshold value for a specific infrared band (for example, a mid-infrared band or a far-infrared band). The higher the infrared transmittance of the window glass sheet, the better, for example, the threshold value is set to 80%, and the window glass sheet has an infrared transmittance for a specific infrared band of, for example, 95%. In the embodiments described below, the example in which the shielding sheet 2 is a window glass sheet will be described.

Because the temperature measuring function is integrated in the mobile phone, the mobile phone can generate heat and generate heat in the running process of the mobile phone, particularly after running for a period of time in a high-power-consumption scene. Heat is transferred to the spacer between the infrared temperature sensor and the human body by a heat conduction effect. That is, heat is transferred to the window glass sheet, causing the temperature of the window glass sheet to increase. Therefore, the temperature measured by the external temperature sensor 4 may include the temperature of the window glass sheet, which is not only the temperature of the measured object 9 outside the mobile phone. This causes the temperature measured by the external temperature sensor 4 to be inaccurate, thereby affecting the temperature measurement accuracy of the mobile phone.

The object 9 is exemplified as a human. As shown in fig. 4, the real temperature of a human being is exemplified as 37 ℃. The lowest temperature value of the human body measured by the external temperature sensor 4 is 36 ℃, which is lower than the real temperature of the human body by 37 ℃, and the error of the temperature value and the real temperature of the human body is about 1 ℃. This results in a temperature measurement accuracy that is difficult to meet the national standard requirements for body temperature measurement (within 0.2 ℃ of the true temperature).

In a conventional temperature calibration process, one or more temperature values of three temperatures, namely, the external environment temperature of the mobile phone, the temperature of the infrared temperature sensor or the microenvironment temperature of the position of the infrared temperature sensor, are usually combined to perform measurement compensation. However, the temperature of the window glass sheet is different from the external environment temperature of the mobile phone, the infrared temperature sensor and the microenvironment temperature of the position of the infrared temperature sensor. Therefore, the influence caused by the temperature change of the window glass sheet is difficult to eliminate through a conventional calibration process, the temperature measurement precision of the infrared temperature sensor integrated in the mobile phone is further influenced, and the phenomenon of inaccurate temperature measurement occurs.

To this end, the present application provides a method of measuring a temperature, determining a correction temperature by calculation of a temperature in a mobile phone, and regarding the correction temperature as a temperature of a window glass sheet. The temperature of the measured object 9 which is finally output is corrected, for example, the temperature of the window glass sheet is removed, so that the temperature measurement accuracy of the mobile phone is improved.

The outside temperature sensor 4 is not limited to being mounted in the opening. In some possible embodiments, the back of the housing 1 of the handset is a transparent housing (transparent to the specific infrared band). Or the region of the case 1 corresponding to the outside temperature sensor 4 is set to a transparent case (transparent to a specific infrared band). The transparent shell belongs to a spacer between the external temperature sensor 4 and the measured object 9 outside the mobile phone. The external temperature sensor 4 can directly realize the temperature measurement of the measured object 9 outside the mobile phone through the transparent shell.

In the scenarios shown in fig. 1 to 3, a handset is provided as an example of the body of the terminal device. However, the present application is not limited thereto, and the body of the terminal device may be an electronic device having a temperature measurement function, such as a tablet computer, a notebook computer, an ultra-mobile personal computer (UMPC), a handheld computer, a netbook, a Personal Digital Assistant (PDA), a wearable device, and a virtual reality device.

Fig. 5 shows a schematic structural diagram of an electronic device 100 according to an embodiment of the present application. The structure of the mobile phone in the above embodiment may be the same as that of the electronic device 100. Specifically, the method comprises the following steps:

the electronic device 100 may include a processor 110, an external memory interface 120, an internal memory 121, a Universal Serial Bus (USB) connector 130, a charging management module 140, a power management module 141, a battery 142, an antenna 1, an antenna 2, a mobile communication module 150, a wireless communication module 160, an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, an earphone interface 170D, a sensor module 180, a key 190, a motor 191, an indicator 192, a camera 193, a display screen 194, a Subscriber Identification Module (SIM) card interface 195, and the like. The sensor module 180 may include a pressure sensor 180A, a gyroscope sensor 180B, an air pressure sensor 180C, a magnetic sensor 180D, an acceleration sensor 180E, a distance sensor 180F, a proximity light sensor 180G, a fingerprint sensor 180H, a temperature sensor 180J, a touch sensor 180K, an ambient light sensor 180L, a bone conduction sensor 180M, and the like.

It is to be understood that the illustrated structure of the embodiment of the present application does not specifically limit the electronic device 100. In other embodiments of the present application, electronic device 100 may include more or fewer components than shown, or some components may be combined, some components may be split, or a different arrangement of components. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

Processor 110 may include one or more processing units, such as: the processor 110 may include an Application Processor (AP), a Central Processing Unit (CPU), a modem processor, other general purpose processors, a Graphics Processing Unit (GPU), an Image Signal Processor (ISP), a controller, a video codec, a Digital Signal Processor (DSP), a baseband processor, and/or a neural-Network Processing Unit (NPU), an Application Specific Integrated Circuit (ASIC), an off-the-shelf Programmable Gate Array (FPGA) or other Programmable logic device, a Gate Array or transistor logic device, a discrete hardware component, and so on. The different processing units may be separate devices or may be integrated into one or more processors. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like. The structure of the data processing unit 5 of the above-described embodiment may be the same as that of the processor 110.

The processor can generate an operation control signal according to the instruction operation code and the timing signal to complete the control of instruction fetching and instruction execution.

A memory may also be provided in processor 110 for storing instructions and data. In some embodiments, the memory in the processor 110 is a cache memory. The memory may hold instructions or data that have just been used or recycled by the processor 110. If the processor 110 needs to reuse the instruction or data, it can be called directly from the memory. Avoiding repeated accesses reduces the latency of the processor 110, thereby increasing the efficiency of the system.

In some embodiments, processor 110 may include one or more interfaces. The interface may include an integrated circuit (I2C) interface, an integrated circuit built-in audio (I2S) interface, a Pulse Code Modulation (PCM) interface, a universal asynchronous receiver/transmitter (UART) interface, a Mobile Industry Processor Interface (MIPI), a general-purpose input/output (GPIO) interface, and a Subscriber Identity Module (SIM) interface.

MIPI interfaces may be used to connect processor 110 with peripheral devices such as display screen 194, camera 193, and the like. The MIPI interface includes a Camera Serial Interface (CSI), a Display Serial Interface (DSI), and the like. In some embodiments, processor 110 and camera 193 communicate through a CSI interface to implement the capture functionality of electronic device 100. The processor 110 and the display screen 194 communicate through the DSI interface to implement the display function of the electronic device 100.

The charging management module 140 is configured to receive charging input from a charger. The charger may be a wireless charger or a wired charger. In some wired charging embodiments, the charging management module 140 may receive charging input from a wired charger via the USB connector 130. In some wireless charging embodiments, the charging management module 140 may receive a wireless charging input through a wireless charging coil of the electronic device 100. The charging management module 140 may also supply power to the electronic device through the power management module 141 while charging the battery 142. For example, the power is supplied to the outside temperature sensor 4 and the distance sensor 10 in the above embodiments.

The electronic device 100 implements display functions via the GPU, the display screen 194, and the application processor. The GPU is a microprocessor for image processing, and is connected to the display screen 194 and an application processor. The GPU is used to perform mathematical and geometric calculations for graphics rendering. The processor 110 may include one or more GPUs that execute program instructions to generate or alter display information. The structure of the display 3 in the above embodiment may be the same as that of the display screen 194. When the mobile phone is used for the temperature measurement function, the display information on the display screen 194 is, for example, the temperature of the object 9.

The display screen 194 is used to display images, video, and the like. The display screen 194 includes a display panel. The display panel may adopt a Liquid Crystal Display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode (active-matrix organic light-emitting diode, AMOLED), a flexible light-emitting diode (FLED), a miniature, a Micro-oeld, a quantum dot light-emitting diode (QLED), and the like. In some embodiments, the electronic device 100 may include 1 or N display screens 194, with N being a positive integer greater than 1.

The internal memory 121 may be used to store computer-executable program code, which includes instructions. The internal memory 121 may include a program storage area and a data storage area. The storage program area may store an operating system, an application program (such as a sound playing function, an image playing function, etc.) required by at least one function, and the like. The storage data area may store data (such as audio data, phone book, etc.) created during use of the electronic device 100, and the like. In addition, the internal memory 121 may include a high-speed random access memory, and may further include a nonvolatile memory, such as at least one magnetic disk storage device, a flash memory device, a universal flash memory (UFS), and the like. The processor 110 executes various functional applications of the electronic device 100 and data processing by executing instructions stored in the internal memory 121 and/or instructions stored in a memory provided in the processor.

When the instructions are run on a computer, causing the electronic device to perform the method of measuring temperature provided herein, determine a corrected temperature by calculation of the temperature within the cell, and consider the corrected temperature as the temperature of the window glass sheet. The corrected temperature is used for correcting the original temperature measured by the infrared temperature sensor of the mobile phone, so that the temperature measurement precision of the mobile phone can be improved.

It will also be appreciated that the memory referred to in the embodiments of the application may be either volatile memory or nonvolatile memory, or may include both volatile and nonvolatile memory. The non-volatile Memory may be a Read-Only Memory (ROM), a Programmable ROM (PROM), an Erasable PROM (EPROM), an Electrically Erasable PROM (EEPROM), or a flash Memory. Volatile Memory can be Random Access Memory (RAM), which acts as external cache Memory. By way of example, but not limitation, many forms of RAM are available, such as Static random access memory (Static RAM, SRAM), Dynamic Random Access Memory (DRAM), Synchronous Dynamic random access memory (Synchronous DRAM, SDRAM), Double Data Rate Synchronous Dynamic random access memory (DDR SDRAM), Enhanced Synchronous SDRAM (ESDRAM), Synchronous link SDRAM (SLDRAM), and Direct Rambus RAM (DR RAM).

It should be noted that the memory described herein is intended to comprise, without being limited to, these and any other suitable types of memory.

The electronic device 100 may implement audio functions via the audio module 170, the speaker 170A, the receiver 170B, the microphone 170C, the headphone interface 170D, and the application processor. Such as music playing, recording, etc.

The audio module 170 is used to convert digital audio information into an analog audio signal output and also to convert an analog audio input into a digital audio signal. The audio module 170 may also be used to encode and decode audio signals. In some embodiments, the audio module 170 may be disposed in the processor 110, or some functional modules of the audio module 170 may be disposed in the processor 110.

The speaker 170A, also called a "horn", is used to convert the audio electrical signal into an acoustic signal. The electronic apparatus 100 can listen to music through the speaker 170A or listen to a handsfree call. It is also possible to play the temperature of the measured object 9 measured in the above embodiment.

A distance sensor 180F for measuring a distance. The electronic device 100 may measure the distance by infrared or laser. In some embodiments, taking a picture of a scene, electronic device 100 may utilize range sensor 180F to range for fast focus. The distance sensor 10 in the above-described embodiment may have the same structure as the distance sensor 180F.

The fingerprint sensor 180H is used to collect a fingerprint. The electronic device 100 can utilize the collected fingerprint characteristics to unlock the fingerprint, access the application lock, photograph the fingerprint, answer an incoming call with the fingerprint, and so on.

The temperature sensor 180J is used to detect temperature. In some embodiments, electronic device 100 implements a temperature processing strategy using the temperature detected by temperature sensor 180J. For example, when the temperature reported by the temperature sensor 180J exceeds a threshold, the electronic device 100 performs a reduction in performance of a processor located near the temperature sensor 180J, so as to reduce power consumption and implement thermal protection. In other embodiments, the electronic device 100 heats the battery 142 when the temperature is below another threshold to avoid the low temperature causing the electronic device 100 to shut down abnormally. In other embodiments, when the temperature is lower than a further threshold, the electronic device 100 performs boosting on the output voltage of the battery 142 to avoid abnormal shutdown due to low temperature. The outside temperature sensor 4 and the inside temperature sensors 6, 7 of the above-described embodiments may be the same in structure as the temperature sensor 180J.

The touch sensor 180K is also called a "touch device". The touch sensor 180K may be disposed on the display screen 194, and the touch sensor 180K and the display screen 194 form a touch screen, which is also called a "touch screen". The touch sensor 180K is used to detect a touch operation applied thereto or nearby. The touch sensor can communicate the detected touch operation to the application processor to determine the touch event type. Visual output associated with the touch operation may be provided through the display screen 194. In other embodiments, the touch sensor 180K may be disposed on a surface of the electronic device 100, different from the position of the display screen 194.

The keys 190 include a power-on key, a volume key, and the like. The keys 190 may be mechanical keys. Or may be touch keys. The electronic apparatus 100 may receive a key input, and generate a key signal input related to user setting and function control of the electronic apparatus 100. The structure of the control switch 8 in the above embodiment may be the same as that of the key 190.

The motor 191 may generate a vibration cue. The motor 191 may be used for incoming call vibration cues, as well as for touch vibration feedback. For example, touch operations applied to different applications (e.g., photographing, audio playing, etc.) may correspond to different vibration feedback effects. The motor 191 may also respond to different vibration feedback effects for touch operations applied to different areas of the display screen 194. Different application scenes (such as time reminding, receiving information, alarm clock, game and the like) can also correspond to different vibration feedback effects. The touch vibration feedback effect may also support customization, for example to prompt the handset to complete a temperature measurement of the object 9 being measured.

Before explaining the embodiments according to the present application with reference to the drawings, the following describes a process of measuring the temperature of the object 9 using a mobile phone with reference to fig. 1 to 4.

The temperature measurement process is described by taking the example that the user uses the mobile phone to measure the temperature of the human body. However, the object 9 in the present application is not limited to a human body, and may be another object 9 such as an animal (pet) or an article.

The user holds the mobile phone by hand, clicks the control switch 8, and the control switch 8 starts the infrared temperature sensor and the distance sensor 10. As shown in fig. 3, the user makes the back of the mobile phone face the temperature measurement portion (e.g., forehead) of the human body to measure the temperature. The user can see the temperature measurement prompt on the display 3 positioned on the front side of the mobile phone: please place the mobile phone at a distance of 1cm to 5cm from the object to be measured, click to start temperature measurement, and hold the mobile phone until the mobile phone vibrates. The infrared temperature sensor measures human body temperature data by receiving energy radiated by a human body (including radiation energy of the window glass sheet). At the same time, the distance sensor 10 measures the distance between the human body and the window glass sheet to guide the user to make temperature measurement. When the user feels the vibration of the mobile phone, the measured temperature of the human body displayed on the display 3 is as follows: 37 ℃ is carried out. So far, the user finishes the temperature measurement process of using the mobile phone to measure the temperature of the human body.

For common temperature measuring device such as mercury thermometer, forehead temperature rifle and ear temperature rifle, contain multiple heating element spare (including but not limited to baseband chip, application treater, radio frequency chip and camera module etc.) in the cell-phone of this application. In addition to the operation of the temperature measurement function, when various other functions of the mobile phone are operated, the heating element of the mobile phone generates heat due to power consumption factors, so that different areas of the mobile phone generate heat. As previously described, heat is transferred to the window glass sheet by the effect of heat conduction, causing the temperature of the window glass sheet to change. Therefore, when the infrared temperature sensor penetrates through the opening hole and the window glass sheet to measure the temperature of the human body, the temperature measured by the infrared temperature sensor mainly comprises two parts: the temperature of the human body and the temperature of the window glass sheet. Therefore, the temperature of the window glass piece is changed, which inevitably affects the accuracy of the temperature measurement of the mobile phone.

As shown in fig. 4, when the mobile phone is in a high power consumption scene (a light gray area in fig. 4) and when the high power consumption scene is turned off (a dark gray area in fig. 4), the temperature measurement accuracy of the infrared temperature sensor is reduced due to heat generated by the heat generating component in the mobile phone. As shown in fig. 4, the temperature of the human body, whose true temperature is 37 ℃, is measured using the mobile phone, and the lowest temperature value measured by the infrared temperature sensor is 36 ℃. That is, the measured temperature of the human body displayed on the display 3 is: at 36 ℃. But the real temperature of the human body is 37 ℃, and the error between the temperature measured by the mobile phone and the real temperature of the human body is about 1 ℃. This results in a temperature measurement accuracy that is difficult to meet the national standard requirements for body temperature measurement (within 0.2 ℃ of the true temperature). It should be noted that the performance of the decrease in the temperature measurement accuracy of the infrared temperature sensor includes, but is not limited to, a low measurement value, and possibly a temperature measurement value higher than the true temperature value of the measured object.

A method for measuring temperature provided by an embodiment of the present application will be described in detail below with reference to the accompanying drawings by taking a mobile phone as an example of an electronic device. According to the temperature measuring method, the corrected temperature is determined through calculation of the temperature in the mobile phone, the corrected temperature is regarded as the temperature of the window glass sheet, the output temperature of the human body is corrected, and therefore the temperature measuring precision of the mobile phone is improved.

The method for measuring the temperature of the mobile phone is described in detail below with reference to the flowchart shown in fig. 6.

Specifically, as shown in fig. 6, the method provided by the present embodiment includes the following steps:

s100: the measured temperature T1 of the measured object 9 measured from the outside temperature sensor 4 is acquired.

The subject 9 is exemplified as a human body. In this step, the measured temperature T1 of the human body is measured by the infrared temperature sensor, and the measured temperature T1 is taken as an original temperature, not the measured temperature of the human body finally displayed on the display 3. After ignoring the influence of air between the human body and the infrared temperature sensor within a Field of view (FOV) of the infrared temperature sensor, a measured temperature T1 obtained by the infrared temperature sensor is mainly determined by the temperature of the human body and the temperature of the window glass sheet together.

S200: the temperature in the mobile phone measured from the internal temperature sensor is acquired, and the correction temperature Twd is determined based on the measured temperature in the mobile phone.

As shown in fig. 1 to 3, in addition to an external temperature sensor 4 exemplified by an infrared temperature sensor, other temperature sensors are provided in a housing 1 of the mobile phone. Other Temperature sensors are, for example, contact Temperature sensors (for example, thermistor Temperature Sensors (NTCs) or thermopile Temperature sensors) for measuring the Temperature in the mobile telephone. That is, the other temperature sensors belong to the internal temperature sensor.

The temperature value sensed by the internal temperature sensor can be measured by the internal temperature sensor in the mobile phone, and can represent the temperature value inside the mobile phone at the position where the sensor is arranged. If a plurality of such internal temperature sensors are provided at different locations within the handset, a plurality of such temperature values may be obtained. Fig. 1 to 3 show two internal temperature sensors 6, 7, with which, correspondingly, temperature values in the two handsets can be detected by means of the two internal temperature sensors 6, 7. However, the number of the internal temperature sensors is not limited in the present application, and is, for example, one, three, four, etc.

The temperature in the mobile phone measured by the internal temperature sensors 6 and 7 includes the temperature of a specific heating component (for example, a baseband chip, an application processor, a radio frequency chip, a camera module, and other components) in the mobile phone. I.e. the temperature in the phone measured by the internal temperature sensor 6, 7 is the temperature of the working microenvironment where the internal temperature sensor 6, 7 is located. The operating microenvironment temperature at the location of the internal temperature sensors 6, 7 may be the temperature of one or more heat generating components in the vicinity of the sensors. That is, the temperature finally output by one internal temperature sensor 6, 7 may be the temperature transmitted by one or more heat generating components to the microenvironment where the internal temperature sensor 6, 7 is located.

In some possible embodiments, the temperature within the handset measured by the internal temperature sensors 6, 7 comprises the temperature at a particular location within the handset. For example, the temperature of the positions of the baseband chip, the application processor, the radio frequency chip, the camera module, and other components are set in the mobile phone. Alternatively, in some possible embodiments, the temperature in the mobile phone measured by the internal temperature sensor 6, 7 includes the temperature of a specific heat generating component and the temperature of a specific location in the mobile phone.

In some possible implementations, the infrared temperature sensor (as an example of the outside temperature sensor 4) of the above-described embodiment is further integrated with an internal temperature sensor. That is, the integrated internal temperature sensor is used to measure the temperature value inside the handset at the location where the infrared temperature sensor is placed. That is, the infrared temperature sensor may not only measure the temperature of the human body outside the mobile phone (T1 in the above embodiment), but also measure the microenvironment temperature T1 at the position of the infrared temperature sensor inside the mobile phone. For example, an infrared temperature sensor integrates an infrared probe and a thermistor probe. The infrared probe is used to measure the temperature of the human body outside the mobile phone (T1 in the above embodiment). The thermistor probe is used to measure the temperature in the mobile phone (t1 in the above embodiment).

Then, the working microenvironment temperature of the position measured by the other internal temperature sensors (the number is less than or equal to n, and n is more than or equal to 1) except the infrared temperature sensor is t 2-tn. That is, in the case where the infrared temperature sensor is integrated with the internal temperature sensor, the temperature in the at least one mobile phone measured by the internal temperature sensor includes: t1, t2, t3 … … tn.

It should be noted that the present application is not limited to integrating an internal temperature sensor in an infrared temperature sensor. In some possible embodiments, the infrared temperature sensor is used only to measure the temperature of the outside of the handset. Namely, the temperature value of the infrared temperature sensor at the position arranged in the mobile phone does not need to be obtained and is used as the basis for calculating the correction temperature.

The temperature in the cell phone can affect the temperature of the window glass sheet. Therefore, referring to fig. 7, in the present embodiment, the data processing unit 5 (for example, a processor) in the mobile phone determines the corrected temperature Twd by the window glass temperature calculation algorithm according to the measured temperature in at least one mobile phone, and considers the corrected temperature Twd as the temperature of the window glass for correcting the originally measured temperature T1. That is, the corrected temperature is a temperature for characterizing the window glass sheet disposed between the outside temperature sensor 4 and the outside of the cellular phone. For convenience of presentation, the temperature of the window glass sheet is also denoted as Twd.

The specific implementation of determining the temperature Twd of the window glass sheet by means of the window glass sheet temperature calculation algorithm based on the measured temperature in the at least one mobile phone is described in detail below.

S300: the temperature T2 of the measured object 9 is determined from the measured temperature T1 and the corrected temperature Twd of the measured object 9 measured by the outside temperature sensor 4.

As shown in fig. 7, after the data processing unit 5 (for example, a processor) of the mobile phone determines the corrected temperature Twd, the original measured temperature T1 of the human body is obtained according to the infrared temperature sensor, and the temperature T2 of the human body is determined as the final temperature by a calibration algorithm (i.e., a temperature correction algorithm). The human body temperature T2 determined in this step is corrected based on the temperature Twd of the window glass, and is a temperature that is relatively accurate and close to the actual temperature of the human body. Therefore, the temperature measurement precision of the mobile phone is more accurate.

As described above, the measured temperature T1 obtained by the infrared temperature sensor is mainly determined by the human body temperature and the window glass sheet temperature Twd together. Therefore, in general, when the window glass sheet generates heat (receives heat transferred from the internal components of the mobile phone), the human body temperature T2 determined in this step is different from the measured temperature T1 of the human body. Illustratively, the body temperature T2 determined at this step is less than the measured temperature T1 of the body. Thus, the absolute value of the difference between the human body temperature T2 determined in this step and the actual temperature of the human body is smaller than the absolute value of the difference between the measured temperature T1 of the human body and the actual temperature of the human body.

The specific implementation of determining the final human body temperature T2 by means of a calibration algorithm based on the measured temperature T1 and the temperature Twd of the window glass pane is described in detail below.

S400: the temperature T2 of the object 9 is output.

The corrected human body temperature T2 determined in S300 is output, and the output mode includes, but is not limited to, text prompt, voice prompt, picture prompt, and the like.

Illustratively, the human body temperature T2 may be output by way of a text prompt. For example, the human body temperature T2 is displayed on the display 3 on the front surface of the casing 1 of the cellular phone.

Alternatively, the human body temperature T2 may be output by means of voice prompt. For example, after the user finishes measuring the temperature of the human body by using the mobile phone, the mobile phone informs the user that the current body temperature is 37 ℃ and the body temperature is normal through voice broadcast. Or, when the temperature of the human body measured by the user is too high, such as 40 ℃, the mobile phone tells the user that the current body temperature is 40 ℃ and the high fever state through voice broadcast.

In conclusion, the method for measuring the temperature corrects the human body temperature measured by the infrared temperature sensor by calculating the temperature Twd of the window glass sheet, so that the finally output human body temperature is accurate, and the temperature measurement precision of the mobile phone is improved.

It should be noted that the method for measuring temperature according to the present application is not limited to the temperature correction of the object 9 outside the mobile phone, and may be a method for correcting the temperature of any part in the mobile phone. The corrected temperature is the temperature of the spacer between the outside temperature sensor 4 and the object to be measured inside the mobile phone. Namely, the temperature value of any part in the mobile phone can be deduced and calculated by using the measured temperature of any part obtained by the external temperature sensor 4 and the temperature in at least one mobile phone obtained by the internal temperature sensor. The error between the measured temperature of any part in the mobile phone and the actual temperature of the part can reach within 0.5 ℃, and a temperature protection mechanism is efficiently and accurately provided for mobile phone equipment.

The specific implementation of determining the temperature Twd of the window glass sheet by the window glass sheet temperature calculation algorithm in S200 and how to determine the final human body temperature T2 by the calibration algorithm in S300 will be described in detail below.

First, how to determine the final human body temperature T2 through the calibration algorithm in S300 will be described.

As described in S100, the measured temperature T1 obtained by the infrared temperature sensor is mainly determined by the human body temperature T2 and the window glass sheet temperature Twd within the temperature measurement angle of view of the infrared temperature sensor. Particularly, the infrared energy is automatically radiated to the periphery by the human body and the window glass sheet continuously, so the energy Q received by the infrared temperature sensor_inEnergy Q radiated by the body being measured_objAnd energy Q radiated from the window glass_wdAnd (4) jointly determining. Namely, Q_in＝K1*Q_obj+K2*Q_wd. Wherein K1 and K2 are energy coefficients determined by the system conditions of the cell phone, such as transmittance, emissivity, etc. of the window glass sheet.

And according to the law of thermal radiation Q ═ sigma epsilon T⁴It is known that the energy Q radiated by the object is proportional to the fourth power of the temperature T of the object. Wherein σ is Stefan-Boltzmann constant and ε is the emissivity of the object. Therefore, the measured temperature T1 value obtained by the infrared temperature sensor is jointly determined by the human body temperature T2 and the window glass sheet temperature Twd. That is, T1 ═ f2(T2, Twd).

As mentioned above, when the window glass is affected by the heat-generating component in the mobile phone, the temperature of the window glass is greatly different from the ambient temperature, and the effect of the temperature of the window glass cannot be ignored. And this effect cannot be addressed by the following conventional calibration means: one or more temperature values of the external environment temperature of the mobile phone, the temperature of the infrared temperature sensor or the microenvironment temperature of the position of the infrared temperature sensor are selected to be combined for measurement compensation.

Therefore, in the present application, the temperature Twd of the window glass sheet is obtained by a window glass sheet temperature calculation method described later, and then the calculated temperature Twd of the window glass sheet is used to calculate the amount of energy that is emitted from the window glass sheet and received by the infrared temperature sensor. The partial energy value is subtracted from the total energy value received by the infrared temperature sensor, and the original measured temperature T1 of the measured human body is compensated and corrected to obtain a more accurate human body temperature T2, i.e., T2 ═ f3(T1, Twd).

That is, the calibration algorithm (temperature compensation correction algorithm) of the present application is mainly to subtract the energy portion radiated from the window glass sheet and received by the infrared temperature sensor from the total energy received by the infrared temperature sensor, so as to accurately obtain the energy radiated from the object to be measured 9 (human body) and received by the infrared temperature sensor, and further calculate the temperature of the object to be measured by the heat radiation law.

For example, the calibration algorithm for determining the final human body temperature T2 includes the following equation (1).

T1＝K1*T2+K2*Twd (1)

After the temperature Twd of the window glass sheet is obtained in S200, the obtained temperature Twd of the window glass sheet is substituted into equation (1), so as to obtain a more accurate human body temperature T2.

After the temperature correction, the temperature measurement error of the mobile phone is not affected by the temperature change of the window glass sheet caused by thermal interference when the power consumption scene operates, so that the temperature measurement precision is reduced. The temperature measurement accuracy after temperature correction based on the temperature of the window glass sheet is within +/-0.2 ℃, and the requirement of measuring the body temperature of a human body is met. That is, the absolute value of the difference between the human body temperature T2 and the actual temperature of the human body is 0.2 ℃.

FIG. 8 shows a schematic diagram of temperature measurement corrected by a calibration algorithm under high power consumption scene conditions. After the temperature correction scheme of S300 is corrected, the temperature measurement value of the mobile phone in a period of time in the high power consumption scene and the closed high power consumption scene is equal to the real temperature value of the human body. Namely, the temperature of the human body can still be accurately measured by the mobile phone under the condition of thermal interference. The final body temperature T2 will be presented on the display 3. The content presented on the display 3 includes, but is not limited to, information such as the final body temperature T2, distance data, and health tips.

According to the formula (1), K1 and K2 are pre-stored in the mobile phone as factory setting values of the mobile phone, and the measured temperature T1 can be obtained by real-time measurement of an infrared temperature sensor. Therefore, if the human body temperature T2 to be finally output is determined according to the formula (1), the temperature Twd of the window glass sheet needs to be determined first.

The specific implementation of determining the temperature Twd of the window glass sheet by the window glass sheet temperature calculation algorithm in S200 will be described in detail below.

In this embodiment, the window glass sheet temperature calculation algorithm (i.e., the temperature correction algorithm) includes the following formula (2).

Twd＝E1*t1+E2*t2+……+Em*tm (2)

Wherein m represents the number of the internal temperature sensors, m is more than or equal to 1, tm represents the temperature in the mobile phone measured by the mth internal temperature sensor, and Em represents the heat transfer coefficient between the mth internal temperature sensor and the window glass sheet arranged between the infrared temperature sensor and the outside of the mobile phone.

That is, the window glass sheet temperature calculation algorithm of the present application mainly measures the temperature value tm of the microenvironment where the temperature sensors are located through the temperature sensors (e.g., thermistor temperature sensors) at different positions in the mobile phone, and estimates the temperature of the window glass sheet by combining the relative spatial positions of the temperature sensors, the thermal conductivity, mass, specific heat capacity, and other physical properties of the mobile phone device.

For example, two other temperature sensors than one infrared temperature sensor are shown in fig. 1 to 3. Wherein, infrared temperature sensor is integrated with inside temperature sensor, and two other temperature sensor are inside temperature sensor 6, 7. That is, there are three internal temperature sensors inside the mobile phone, and m is 3, but the number of internal temperature sensors is not limited in the present application. Accordingly, equation (2) is: twd ═ E1 × t1+ E2 × t2+ E3 × t 3. Where t1 represents the operating microenvironment temperature at its location as measured by the internal temperature sensor into which the infrared temperature sensor is integrated. t2 represents the operating microenvironment temperature at which one of the internal temperature sensors 6 is located. t3 represents the temperature of the operating microenvironment at which the other internal temperature sensor 7 is located. E1 denotes the heat transfer coefficient between the infrared temperature sensor and the window glass sheet, E2 denotes the heat transfer coefficient between one of the internal temperature sensors 6 and the window glass sheet, and E3 denotes the heat transfer coefficient between the other internal temperature sensor 7 and the window glass sheet.

In some possible embodiments, t1 may be measured by an internal temperature sensor that is provided independently of the infrared temperature sensor.

As can be seen from the above equation (2), t1 to tm can collect electronic data measured in real time from the temperature sensors at the respective positions. Therefore, to determine the temperature Twd of the window glass sheet according to the formula (2), it is necessary to first determine E1 to Em. The determination process of E1 through Em in the window glass sheet temperature calculation algorithm will be described in detail below.

When a heating component in the mobile phone generates heat due to operation, the generated heat can be transmitted to each area (including the window glass sheet) of the mobile phone along structures such as a device support, a main board, a flexible circuit board and the like of the mobile phone in a heat conduction and heat radiation mode, so that the temperature of the area is increased. The temperature rise in a certain region can be represented by the following formula (3).

Tarea＝M*Tsource (3)

Wherein Tsource is the temperature of the heating element, M is the heat transfer coefficient between a certain area and the heating element, and M is determined by the framework stacking information of the whole mobile phone and the information such as the quality, the specific heat capacity and the heat transfer coefficient of the heat conducting material between the heating element and a heating point. For example, a baseband chip in a mobile phone generates heat, and the temperature rise at the window glass sheet is determined by multiplying the heat transfer coefficient between the baseband chip and the window glass sheet by the temperature of the baseband chip.

When a plurality of (n) heating components (including but not limited to a baseband chip, an application processor, a radio frequency chip, a camera module, etc.) are provided in the mobile phone, the above formula (3) is correspondingly expanded to the following formula (4).

Tarea＝ M1*Tsource1+ M2*Tsource2+……+ Mn*Tsourcen (4)

Wherein tsource is the temperature of the nth heating element, and Mn is the heat transfer coefficient between the nth heating element and a certain region.

In this application, the temperature sensor quantity of monitoring microenvironment temperature is 1 to m. For example, the temperature of the microenvironment in which the sensors are located is monitored in real time by one infrared temperature sensor and two internal temperature sensors 6, 7 in the above embodiments. These temperature sensors may be located just near the heat generating components. For example, the distance between the temperature sensor and the heating element is less than 0.5 cm. These temperature sensors may also be remote from the heat generating components. For example, the distance between the temperature sensor and the heating element is 0.5cm or more. Illustratively, two ambient temperature sensors 4 are disposed near (at a distance of less than 0.5cm) the main heat generating components (including but not limited to baseband chips, application processors, radio frequency chips, camera modules, etc.), and an infrared temperature sensor is disposed away (at a distance of more than 0.5cm) from the main heat generating components.

And the microenvironment temperature measured by a certain temperature sensor at a certain zone position is determined according to the following equation (5).

tm＝Taream＝M1m*Tsource1+M2m*Tsource2+……+Mnm*Tsourcen (5)

Tm represents the microenvironment temperature measured by the mth temperature sensor, n represents the nth heating element, m represents the mth temperature sensor, Mnm represents the heat transfer coefficient between the nth heating element and the mth temperature sensor, and Mnm is determined by the framework stacking information of the whole mobile phone and the information such as the quality, the specific heat capacity and the heat transfer coefficient of the heat conducting material between the nth heating element and the mth temperature sensor. Namely, the microenvironment temperature measured by the mth temperature sensor is determined by the n heat-generating components inside the mobile phone in combination with the corresponding heat transfer coefficients.

For example, the micro-environment temperatures t1 to t3 measured by one infrared temperature sensor and two internal temperature sensors in the above embodiments are respectively as follows. The three heat generating components are, for example, a baseband chip (denoted as Tsource1), an application processor (denoted as Tsource2) and a radio frequency chip (denoted as Tsource 3).

t1 is M11 Tsource1+ M21 Tsource2+ M31 Tsource3, and t1 represents the operating microenvironment temperature at the position measured by the infrared temperature sensor, and is determined by the temperatures of the three heat-generating components in the mobile phone. Where M11 represents a heat transfer coefficient between the first heat-generating component (baseband chip) and the infrared temperature sensor, M21 represents a heat transfer coefficient between the second heat-generating component (application processor) and the infrared temperature sensor, and M31 represents a heat transfer coefficient between the third heat-generating component (radio frequency chip) and the infrared temperature sensor.

t2 is M12 Tsource1+ M22 Tsource2+ M32 Tsource3, and t2 represents the operating microenvironment temperature of the location where one of the internal temperature sensors 6 is located, and is determined by the temperatures of the three heat-generating components in the mobile phone. Where M12 denotes a heat transfer coefficient between the first heat-generating component (baseband chip) and the internal temperature sensor 6, M22 denotes a heat transfer coefficient between the second heat-generating component (application processor) and the internal temperature sensor 6, and M32 denotes a heat transfer coefficient between the third heat-generating component (radio frequency chip) and the internal temperature sensor 6.

t3 is M13 by Tsource1+ M23 by Tsource2+ M33 by Tsource3, and t3 represents the operating microenvironment temperature of the location of the other internal temperature sensor 7, which is determined by the temperatures of the three heat-generating components in the mobile phone. Where M13 denotes a heat transfer coefficient between the first heat-generating component (baseband chip) and the internal temperature sensor 7, M23 denotes a heat transfer coefficient between the second heat-generating component (application processor) and the internal temperature sensor 7, and M33 denotes a heat transfer coefficient between the third heat-generating component (radio frequency chip) and the internal temperature sensor 7.

When the heat generated from all the heat generating components is transferred to the window glass, the temperature Twd of the window glass can be determined according to the following formula (6).

Twd＝M1wd*Tsource1+M2wd*Tsource2+……+Mnwd*Tsourcen (6)

Wherein, Twd represents the temperature of the window glass sheet, n represents the nth heating component, wd represents the window glass sheet, Mnwd represents the heat transfer coefficient between the nth heating component and the window glass sheet, and Mnwd is determined by the framework stacking information of the whole mobile phone and the information such as the quality, the specific heat capacity and the heat transfer coefficient of the heat conducting material between the nth heating component and the window glass sheet.

In the above formula (6), heat generation cannot be obtained directlyThe temperature of the components Tsource1 to Tsourcen. However, as can be seen from equation (5), the value of tm can be measured. Corresponding tm can be obtained through the measurement of m temperature sensors inside the mobile phone, such as t1, t2, and t 3. Then, the present application regards the m temperature sensors as a new heat source, and the energy generated by the new heat source is Qm ═ σ epsilon (tm)⁴. The temperature of the window glass sheet is determined by the energy radiated by the m temperature sensors as a new heat source.

For example, as a new heat source, an infrared temperature sensor radiates energy Q1 ═ σ ∈ (t1)⁴. One of the internal temperature sensors 6 is used as a new heat source, and the energy radiated outwards is Q2 ═ sigma epsilon (t2)⁴. Another internal temperature sensor 7 as a new heat source radiates energy Q3 ═ σ e (t3)⁴. Accordingly, the temperature of the window glass is determined by the energy radiated by the three temperature sensors (Q1, Q2, and Q3).

The formula (2) of the window glass sheet temperature calculation algorithm is obtained by substituting the formula (5) of the relation between the microenvironment temperature tm and Tsourcen into the formula (6): twd ═ E1 × t1+ E2 × t2+ … … Em tm. Namely Twd-f 1(t1, t2, t3 … … tm). And Em represents a heat transfer coefficient between the mth temperature sensor and the window glass sheet, and is determined by the structural stacking information of the whole intelligent equipment and the information such as the quality, the specific heat capacity and the heat transfer coefficient of a heat conducting material between the temperature sensor m and the window glass sheet. Exemplarily, in the present embodiment, Em ═ a × Knm × Knwd (where a is a constant coefficient, for example, 100).

The determination process for Em is as follows. The temperature measurement can be carried out under different heating scenes (different temperatures of heating elements). The temperature measurements tm of the individual temperature sensors are recorded, as well as the temperature measurements of the window pane. The temperature measurement value of each temperature sensor can be realized through the temperature detection function of the temperature sensor. The temperature measurement for the window glass sheet can be measured on the window glass sheet with a contact thermocouple, but is not limited to measuring the temperature with a contact thermocouple. A plurality of equations twd-f 1(t1, t2, t3 … …) are obtained, and the individual heat transfer coefficients Em can be derived by solving the simultaneous equations (e.g., using neural network algorithms and principal component analysis).

For example, 3 temperature sensors are provided in a mobile phone as an example. In a call heating scene, the temperature measurement values of the 3 temperature sensors are recorded as t11, t12 and t13, and the temperature measurement value of the window glass sheet is recorded as twd 1. In the scene of heat generation by photographing, the temperature measurement values of the 3 temperature sensors are recorded as t21, t22 and t23, and the temperature measurement value of the window glass sheet is recorded as twd 2. Under the game playing heating scene, the temperature measurement values of the 3 temperature sensors are recorded as t31, t32 and t33, and the temperature measurement value of the window glass sheet is recorded as twd 3. Thus, simultaneous formulas of twd ═ f1(t1, t2, t3) are obtained as shown in the following formulas (7) to (9).

Twd1＝E1*t11+E2*t12+E3*t13 (7)

Twd2＝E1*t21+E2*t22+E3*t23 (8)

Twd3＝E1*t31+E2*t32+E3*t33 (9)

In equations (7) to (9), the respective heat transfer coefficients E1, E2, and E3 are unknown numbers, and the others are known numbers. By solving the above simultaneous equations (7) to (9), the respective heat transfer coefficients E1, E2, and E3 can be derived. In some possible embodiments, factors such as the heating frequency of the heating component and the distance from the window glass sheet can be considered, and each deduced heat transfer coefficient can be finely adjusted according to a principal component analysis method. In addition, the heat transfer coefficient Em varies from handset to handset, depending on the layout of the devices inside the handset. After determining the heat transfer coefficient Em, the heat transfer coefficient Em may be stored in the handset.

Thus, the complete calculation algorithm formula (2) of the window glass sheet temperature can be obtained after determining each heat transfer coefficient Em. When the temperature of a human body is measured by using a mobile phone, the temperature twd of the window glass sheet can be obtained through microenvironment temperature measurement values t 1-tm of the temperature sensors 1-m.

Fig. 9 is a schematic view showing the results of the correlation verification calculation for determining the accuracy of the temperature Twd of the window glass sheet by the formula (2). Fig. 9 shows a schematic diagram of calculation of window glass sheet temperature derivation in a high power consumption scenario. The thin solid line curve is the measured temperature value of the window glass sheet, the dotted line curve is the calculated temperature value of the window glass sheet calculated by the formula (2), and the thick solid line curve is the temperature calculation error of the window glass sheet (the calculation error is the measured temperature value-the calculated temperature value).

As shown in fig. 9, it can be seen that when the mobile phone operates in a high power consumption scene, the temperature of the window glass sheet may increase due to thermal interference generated by the heat generating components in the mobile phone due to power consumption. When the high-power-consumption scene is closed, the temperature of the window glass sheet can be gradually cooled. It can be seen from the error curve (thick solid curve) that the temperature calculation error (temperature accuracy) of the window glass sheet is within +/-0.5 ℃, even within +/-0.2 ℃. That is, the difference between the temperature Twd of the window glass sheet determined by the formula (2) and the actual temperature of the window glass sheet is within ± 0.5 ℃, and may even be within ± 0.2 ℃.

Therefore, the mobile phone of the present application can accurately determine the temperature Twd of the window glass sheet by the above formula (2). Therefore, the human body temperature T2 displayed on the display 3 of the mobile phone is accurate, and the error of the human body temperature T2 and the real human body temperature is within +/-0.2 ℃.

Fig. 10 shows the temperature measurement interface 30 of the mobile phone, and the side interface 30 is, for example, a display after the user clicks the temperature measurement APP on the mobile phone. The side interface 30 is displayed with a "start temperature measurement" button and a temperature display area. In addition, the temperature measurement interface 30 also displays a temperature measurement operation guide: and placing the mobile phone at a position 1cm to 5cm away from the measured object, clicking to start temperature measurement, and holding the mobile phone until the mobile phone vibrates.

In some possible embodiments, the method for measuring temperature provided by the present application further includes: the temperature measurement interface 30 is displayed on the display 3. As shown in a of fig. 10, the processor of the handset receives a thermometry operation from the user, for example, clicking "start thermometry" on the thermometry interface 30. The processor of the mobile phone responds to the temperature measurement operation, and measures the measured temperature T1 of the human body through the external temperature sensor 4 described in the above embodiment, so as to complete the temperature measurement of the human body. After the mobile phone completes the temperature measurement of the human body by the temperature measurement method of the above embodiment, the temperature measurement interface 30 of the mobile phone can be used as a temperature output device. That is, as shown in b of fig. 10, the human body temperature T2(37 ℃) is displayed on the temperature measurement interface 30 of the cellular phone. However, the temperature output device of the mobile phone is not limited to the temperature measuring interface 30 of the mobile phone, and may be a speaker, for example, and the body temperature T2 is played by a voice of the speaker.

In addition, as shown in b in fig. 10, after the mobile phone completes the temperature measurement of the human body, the temperature measurement interface 30 of the mobile phone may display two keys of "start temperature measurement" and "save temperature" in addition to the measured temperature of the human body. The temperature of the human body can be continuously measured again by clicking 'start temperature measurement'. The current measured temperature of the human body can be saved by clicking on the "save temperature".

In summary, the method for measuring temperature provided by the application calculates the temperature of the window glass sheet corresponding to the infrared temperature sensor based on the temperature information of the infrared temperature measuring device and the internal temperature sensor. And then, correcting and calculating the initial temperature measurement value of the infrared temperature sensor by utilizing the temperature information of the window glass sheet, thereby improving the temperature measurement precision of the mobile phone. After the temperature correction, the temperature measurement error of the mobile phone is not affected by the temperature change of the window glass sheet caused by thermal interference when the power consumption scene operates, so that the temperature measurement precision is reduced. That is, the difficulty that the temperature of the window glass sheet is increased due to the operation of heating components in the mobile phone, so that the temperature measuring precision of the mobile phone is reduced is overcome. The temperature measurement accuracy after temperature correction based on the temperature of the window glass sheet is within +/-0.2 ℃, and the requirement of measuring the body temperature of a human body is met.

Referring now to FIG. 11, shown is a block diagram of an electronic device 400 in accordance with one embodiment of the present application. The electronic equipment has the function of realizing the behavior of the electronic equipment in any one of the method embodiments. The functions can be realized by hardware, and the functions can also be realized by executing corresponding software by hardware. The hardware or software includes one or more modules corresponding to respective sub-functions of the above-described functions. In particular, the electronic device may be a user device.

The electronic device 400 may include one or more processors 401 coupled to a controller hub 403. For at least one embodiment, the controller hub 403 communicates with the processor 401 via a multi-drop Bus such as a Front Side Bus (FSB), a point-to-point interface such as a QuickPath Interconnect (QPI), or similar connection 406. Processor 401 executes instructions that control general types of data processing operations. In one embodiment, the Controller Hub 403 includes, but is not limited to, a Graphics Memory Controller Hub (GMCH) (not shown) and an Input/Output Hub (IOH) (which may be on separate chips) (not shown), where the GMCH includes a Memory and a Graphics Controller and is coupled to the IOH.

The electronic device 400 may also include a coprocessor 402 and memory 404 coupled to the controller hub 403. Alternatively, one or both of the memory and GMCH may be integrated within the processor (as described herein), with the memory 404 and coprocessor 402 coupled directly to the processor 401 and controller hub 403, with the controller hub 403 and IOH in a single chip.

The Memory 404 may be, for example, a Dynamic Random Access Memory (DRAM), a Phase Change Memory (PCM), or a combination of the two. Memory 404 may include one or more tangible, non-transitory computer-readable media for storing data and/or instructions therein. A computer-readable storage medium has stored therein instructions, and in particular, temporary and permanent copies of the instructions. The instructions may include: instructions that, when executed by at least one of the processors, cause the electronic device 400 to implement the method shown in fig. 6. The instructions, when executed on a computer, cause the computer to perform the methods disclosed in any one or combination of the embodiments above.

In one embodiment, the coprocessor 402 is a special-purpose processor, such as, for example, a high-throughput MIC (man Integrated Core) processor, a network or communication processor, compression engine, graphics processor, GPGPU (General-purpose computing on graphics processing unit), embedded processor, or the like. The optional nature of coprocessor 402 is represented in FIG. 11 by dashed lines.

In one embodiment, the electronic device 400 may further include a Network Interface Controller (NIC) 406. Network interface 406 may include a transceiver to provide a radio interface for electronic device 400 to communicate with any other suitable device (e.g., front end module, antenna, etc.). In various embodiments, the network interface 406 may be integrated with other components of the electronic device 400. The network interface 406 may implement the functions of the communication unit in the above-described embodiments.

The electronic device 400 may further include an Input/Output (I/O) device 405. I/O405 may include: a user interface designed to enable a user to interact with the electronic device 400; the design of the peripheral component interface enables peripheral components to also interact with the electronic device 400; and/or sensors are designed to determine environmental conditions and/or location information associated with electronic device 400.

It is noted that fig. 11 is merely exemplary. That is, although fig. 11 shows that the electronic device 400 includes a plurality of devices, such as a processor 401, a controller hub 403, a memory 404, etc., in practical applications, a device using the methods of the present application may include only a part of the devices of the electronic device 400, and for example, may include only the processor 401 and the network interface 406. The nature of the alternative device in fig. 11 is shown in dashed lines.

The embodiment of the present application further provides an apparatus, which is applied to an electronic device, and the apparatus is coupled to a memory, and is configured to read and execute instructions stored in the memory, so that the electronic device can execute the method flow related to the electronic device in any of the method embodiments. The memory may be integrated within the processor or may be separate from the processor. The device may be a chip (e.g., system on a chip) on the electronic device.

Referring now to fig. 12, shown is a block diagram of a SoC (System on Chip) 500 in accordance with an embodiment of the present application. In fig. 12, like parts have the same reference numerals. In addition, the dashed box is an optional feature of more advanced socs. In fig. 12, the SoC500 includes: an interconnect unit 550 coupled to the processor 510; a system agent unit 580; a bus controller unit 590; an integrated memory controller unit 540; a set or one or more coprocessors 520 which may include integrated graphics logic, an image processor, an audio processor, and a video processor; a Static Random-Access Memory (SRAM) unit 530; a Direct Memory Access (DMA) unit 560. In one embodiment, coprocessor 520 comprises a special-purpose processor, such as, for example, a network or communication processor, compression engine, GPGPU (General-purpose computing on graphics processing units, General-purpose computing on a graphics processing unit), high-throughput MIC processor, or embedded processor, among others.

Static Random Access Memory (SRAM) unit 530 may include one or more tangible, non-transitory computer-readable media for storing data and/or instructions. A computer-readable storage medium has stored therein instructions, and in particular, temporary and permanent copies of the instructions. The instructions may include: instructions that when executed by at least one of the processors cause the SoC to implement the method as shown in fig. 6. The instructions, when executed on a computer, cause the computer to perform the methods disclosed in the embodiments described above.

The method embodiments of the present application may be implemented in software, magnetic, firmware, etc.

Program code may be applied to input instructions to perform the functions described herein and generate output information. The output information may be applied to one or more output devices in a known manner. For purposes of this application, a processing system includes any system having a Processor such as, for example, a Digital Signal Processor (DSP), a microcontroller, an Application Specific Integrated Circuit (ASIC), or a microprocessor.

The program code may be implemented in a high level procedural or object oriented programming language to communicate with a processing system. The program code can also be implemented in assembly or machine language, if desired. Indeed, the mechanisms described herein are not limited in scope to any particular programming language. In any case, the language may be a compiled or interpreted language.

One or more aspects of at least one embodiment may be implemented by representative instructions stored on a computer-readable storage medium, which represent various logic in a processor, which when read by a machine causes the machine to fabricate logic to perform the techniques herein. These representations, known as "IP (Intellectual Property) cores," may be stored on a tangible computer-readable storage medium and provided to a number of customers or production facilities to load into the manufacturing machines that actually manufacture the logic or processors.

In some cases, an instruction converter may be used to convert instructions from a source instruction set to a target instruction set. For example, the instruction converter may transform (e.g., using a static binary transform, a dynamic binary transform including dynamic compilation), morph, emulate, or otherwise convert the instruction into one or more other instructions to be processed by the core. The instruction converter may be implemented in software, hardware, firmware, or a combination thereof. The instruction converter may be on the processor, off-processor, or partially on and partially off-processor.

It should be understood that, in various embodiments of the present application, the sequence numbers of the above-mentioned processes do not mean the execution sequence, some or all of the steps may be executed in parallel or executed sequentially, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.

Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.

It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the above-described systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.

In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the units is only one logical division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.

The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.

In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.

The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application or portions thereof that substantially contribute to the prior art may be embodied in the form of a software product stored in a storage medium and including instructions for causing a computer device (which may be a personal computer, a server, a network device or a terminal device, etc.) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: various media capable of storing program codes, such as a usb disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk, or an optical disk.

Relevant parts among the method embodiments of the application can be mutually referred; the apparatus provided in the respective apparatus embodiments is adapted to perform the method provided in the respective method embodiments, so that the respective apparatus embodiments may be understood with reference to the relevant parts in the relevant method embodiments.

The device structure diagrams given in the device embodiments of the present application only show simplified designs of the corresponding devices. In practical applications, the apparatus may comprise any number of transmitters, receivers, processors, memories, etc. to implement the functions or operations performed by the apparatus in the embodiments of the apparatus of the present application, and all apparatuses that can implement the present application are within the scope of the present application.

It will be understood by those skilled in the art that all or part of the steps in the method for implementing the above embodiments may be implemented by instructing the relevant hardware through a program, which may be stored in a storage medium readable by a device and includes all or part of the steps when executed, such as: FLASH, EEPROM, etc.

The above-mentioned embodiments, which further illustrate the objects, technical solutions and advantages of the present application, it should be understood that various embodiments may be combined, and the above-mentioned embodiments are only examples of the present application and are not intended to limit the scope of the present application, and any combination, modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the present application.

Claims (20)

1. A method of measuring temperature, characterized in that the method is applied to an electronic device comprising an external temperature sensor and at least one internal temperature sensor; the method comprises the following steps:

acquiring a first temperature of a measured object measured by the external temperature sensor;

acquiring the temperature measured in at least one electronic device from the at least one internal temperature sensor, and determining a corrected temperature according to the measured temperature in the at least one electronic device;

determining a second temperature according to the first temperature and the corrected temperature of the measured object measured by the external temperature sensor;

and outputting the second temperature as the temperature of the measured object.

2. The method of measuring temperature of claim 1, wherein an absolute value of a difference between the second temperature and an actual temperature of the object under test is less than an absolute value of a difference between the first temperature and the actual temperature of the object under test.

3. The method of measuring temperature according to claim 1, wherein the determining a second temperature based on the first temperature of the object to be measured by the ambient temperature sensor and the corrected temperature includes: and determining a second temperature of the measured object according to the first temperature, the correction temperature and a first temperature correction algorithm.

4. The method of measuring temperature of claim 3, wherein the first temperature correction algorithm comprises the following equation: t1 ═ K1 ═ T2+ K2 ═ Twd; wherein the content of the first and second substances,

t1 represents the first temperature, T2 represents the second temperature, Twd represents the correction temperature, and K1 and K2 represent energy coefficients.

5. The method of measuring temperature according to claim 1, wherein said determining the corrected temperature based on the temperature within the at least one electronic device measured by the at least one internal temperature sensor comprises: determining the corrected temperature based on the temperature within the at least one electronic device measured by the at least one internal temperature sensor and a second temperature correction algorithm.

6. The method of measuring temperature of claim 5, wherein the second temperature correction algorithm comprises the following equation: twd ═ E1 × t1+ E2 × t2+ … … + Em × tm; wherein the content of the first and second substances,

the number of the internal temperature sensors is m, m is more than or equal to 1, Twd represents the corrected temperature, tm represents the temperature in the electronic device measured by the mth internal temperature sensor, and Em represents the heat transfer coefficient between the mth internal temperature sensor and a spacer disposed between the external temperature sensor and the outside of the electronic device.

7. A method of measuring temperature as claimed in claim 1, wherein the temperature within the at least one electronic device comprises the temperature of a particular heat generating component and/or the temperature of a particular location within the electronic device.

8. The method of measuring temperature of any of claims 1 to 7, wherein the corrected temperature is used to characterize the temperature of a spacer disposed between the ambient temperature sensor and the exterior of the electronic device.

9. The method of measuring temperature according to claim 8, wherein the spacer is a cover sheet for sealing and covering an opening provided at one side of a housing of an electronic device, and the ambient temperature sensor is capable of measuring the first temperature of the object to be measured through the opening and the cover sheet.

10. The method of measuring temperature of claim 1, further comprising:

displaying a temperature measurement interface;

receiving temperature measurement operation from a user, and measuring the first temperature of the measured object through the external temperature sensor in response to the temperature measurement operation.

11. The method of measuring temperature of claim 10, wherein said outputting said second temperature comprises: and displaying the second temperature on the temperature measurement interface or playing the second temperature through voice.

12. The method of measuring temperature according to claim 1, wherein the ambient temperature sensor is an infrared temperature sensor.

13. The method of measuring temperature according to claim 1, wherein an absolute value of a difference between the second temperature and an actual temperature of the object to be measured is 0.2 ℃ or less.

14. An electronic device, comprising:

the external temperature sensor is used for measuring a first temperature of the measured object;

at least one internal temperature sensor for measuring a temperature within the at least one electronic device;

a processor;

a memory comprising instructions that, when executed by the processor, cause the electronic device to perform a method of measuring temperature comprising:

acquiring the first temperature of the measured object measured by the external temperature sensor;

obtaining a temperature within the at least one electronic device measured from the at least one internal temperature sensor and determining a corrected temperature based on the measured temperature within the at least one electronic device;

determining a second temperature according to the first temperature and the corrected temperature of the measured object measured by the external temperature sensor;

and the output device is used for outputting the second temperature as the temperature of the measured object.

15. The electronic device of claim 14, wherein the ambient temperature sensor is an infrared temperature sensor.

16. The electronic device of claim 14, further comprising: the trompil, the trompil is located one side of electronic equipment's casing, trompil department adopts and shelters from the sealed cover of piece, ambient temperature sensor can see through the trompil with shelter from the piece measurement measurand the first temperature.

17. The electronic device of claim 16, wherein the masking sheet is a window glass sheet.

18. The electronic device of claim 16, wherein the masking sheet has an infrared transmittance above a set threshold for a particular infrared band.

19. The electronic device of claim 16, wherein the aperture size matches a signal receiving area of the ambient temperature sensor.

20. A computer-readable storage medium having stored thereon instructions that, when executed on a computer, cause the computer to perform the method of measuring temperature of any of claims 1 to 13.

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