CN114133912B - Bi-component silicone structural adhesive with strong initial adhesion - Google Patents
Bi-component silicone structural adhesive with strong initial adhesion Download PDFInfo
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- CN114133912B CN114133912B CN202111428637.7A CN202111428637A CN114133912B CN 114133912 B CN114133912 B CN 114133912B CN 202111428637 A CN202111428637 A CN 202111428637A CN 114133912 B CN114133912 B CN 114133912B
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- 230000001070 adhesive effect Effects 0.000 title claims abstract description 34
- 239000000853 adhesive Substances 0.000 title claims abstract description 32
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 18
- 230000008569 process Effects 0.000 claims abstract description 16
- 239000003054 catalyst Substances 0.000 claims abstract description 14
- 239000004205 dimethyl polysiloxane Substances 0.000 claims abstract description 13
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims abstract description 13
- -1 polydimethylsiloxane Polymers 0.000 claims abstract description 13
- AMTWCFIAVKBGOD-UHFFFAOYSA-N dioxosilane;methoxy-dimethyl-trimethylsilyloxysilane Chemical compound O=[Si]=O.CO[Si](C)(C)O[Si](C)(C)C AMTWCFIAVKBGOD-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229940083037 simethicone Drugs 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 40
- 238000003756 stirring Methods 0.000 claims description 38
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 26
- 238000002156 mixing Methods 0.000 claims description 23
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 20
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 13
- 239000006229 carbon black Substances 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 11
- 238000006243 chemical reaction Methods 0.000 claims description 10
- 238000000227 grinding Methods 0.000 claims description 10
- 229910052757 nitrogen Inorganic materials 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 9
- PXGZUMCOTGAVEC-UHFFFAOYSA-N 3-[dimethoxy(penta-1,4-dien-3-yloxy)silyl]propane-1,1,1-triamine Chemical compound C(=C)C(O[Si](OC)(OC)CCC(N)(N)N)C=C PXGZUMCOTGAVEC-UHFFFAOYSA-N 0.000 claims description 3
- INJVFBCDVXYHGQ-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCN INJVFBCDVXYHGQ-UHFFFAOYSA-N 0.000 claims description 3
- 239000003208 petroleum Substances 0.000 claims description 3
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 claims description 3
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 claims description 3
- 239000007822 coupling agent Substances 0.000 abstract description 17
- 229920002545 silicone oil Polymers 0.000 abstract description 17
- 239000003431 cross linking reagent Substances 0.000 abstract description 9
- 239000012763 reinforcing filler Substances 0.000 abstract description 3
- 238000001035 drying Methods 0.000 abstract description 2
- 239000000945 filler Substances 0.000 abstract description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 14
- 238000013329 compounding Methods 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 12
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 5
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 5
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 5
- FMGBDYLOANULLW-UHFFFAOYSA-N 3-isocyanatopropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCN=C=O FMGBDYLOANULLW-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 3
- XCOASYLMDUQBHW-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)butan-1-amine Chemical compound CCCCNCCC[Si](OC)(OC)OC XCOASYLMDUQBHW-UHFFFAOYSA-N 0.000 description 3
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 3
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- 235000001674 Agaricus brunnescens Nutrition 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- LORADGICSMRHTR-UHFFFAOYSA-N cyclohexyl-diethoxy-methylsilane Chemical compound CCO[Si](C)(OCC)C1CCCCC1 LORADGICSMRHTR-UHFFFAOYSA-N 0.000 description 2
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 description 2
- CVQVSVBUMVSJES-UHFFFAOYSA-N dimethoxy-methyl-phenylsilane Chemical compound CO[Si](C)(OC)C1=CC=CC=C1 CVQVSVBUMVSJES-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- YLBPOJLDZXHVRR-UHFFFAOYSA-N n'-[3-[diethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CCO[Si](C)(OCC)CCCNCCN YLBPOJLDZXHVRR-UHFFFAOYSA-N 0.000 description 2
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- HXLAEGYMDGUSBD-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propan-1-amine Chemical compound CCO[Si](C)(OCC)CCCN HXLAEGYMDGUSBD-UHFFFAOYSA-N 0.000 description 1
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 1
- KSCAZPYHLGGNPZ-UHFFFAOYSA-N 3-chloropropyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)CCCCl KSCAZPYHLGGNPZ-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- SVGSGCAXNRHRII-UHFFFAOYSA-K CCCC[Sn](O)(O)O Chemical compound CCCC[Sn](O)(O)O SVGSGCAXNRHRII-UHFFFAOYSA-K 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 241000872198 Serjania polyphylla Species 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- XQBCVRSTVUHIGH-UHFFFAOYSA-L [dodecanoyloxy(dioctyl)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCCCCCC)(CCCCCCCC)OC(=O)CCCCCCCCCCC XQBCVRSTVUHIGH-UHFFFAOYSA-L 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- ZZNQQQWFKKTOSD-UHFFFAOYSA-N diethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OCC)(OCC)C1=CC=CC=C1 ZZNQQQWFKKTOSD-UHFFFAOYSA-N 0.000 description 1
- MNFGEHQPOWJJBH-UHFFFAOYSA-N diethoxy-methyl-phenylsilane Chemical compound CCO[Si](C)(OCC)C1=CC=CC=C1 MNFGEHQPOWJJBH-UHFFFAOYSA-N 0.000 description 1
- ZXPDYFSTVHQQOI-UHFFFAOYSA-N diethoxysilane Chemical compound CCO[SiH2]OCC ZXPDYFSTVHQQOI-UHFFFAOYSA-N 0.000 description 1
- YQGOWXYZDLJBFL-UHFFFAOYSA-N dimethoxysilane Chemical compound CO[SiH2]OC YQGOWXYZDLJBFL-UHFFFAOYSA-N 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- KOVKEDGZABFDPF-UHFFFAOYSA-N n-(triethoxysilylmethyl)aniline Chemical compound CCO[Si](OCC)(OCC)CNC1=CC=CC=C1 KOVKEDGZABFDPF-UHFFFAOYSA-N 0.000 description 1
- VNBLTKHUCJLFSB-UHFFFAOYSA-N n-(trimethoxysilylmethyl)aniline Chemical compound CO[Si](OC)(OC)CNC1=CC=CC=C1 VNBLTKHUCJLFSB-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000004590 silicone sealant Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- JCGDCINCKDQXDX-UHFFFAOYSA-N trimethoxy(2-trimethoxysilylethyl)silane Chemical compound CO[Si](OC)(OC)CC[Si](OC)(OC)OC JCGDCINCKDQXDX-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- PZJJKWKADRNWSW-UHFFFAOYSA-N trimethoxysilicon Chemical compound CO[Si](OC)OC PZJJKWKADRNWSW-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a double-component silicone structural adhesive with strong initial adhesion, which comprises a component A and a component B: the component A consists of 20-60 wt% of alpha, omega-dihydroxy polydimethylsiloxane, 2-10 wt% of silicone oil and 40-60 wt% of filler. The component B consists of 10-30wt% of simethicone, 30-50wt% of reinforcing filler, 10-30wt% of cross-linking agent, 10-30wt% of coupling agent and 0.01-0.5wt% of catalyst, wherein the coupling agent is compounded and activated by adopting two types of coupling agents. Compared with the traditional silicone structural adhesive, the adhesive has stronger initial adhesive force, higher curing speed and short stretch-break and surface drying time, can meet the various requirements of special buildings, automobiles, electronic appliances and the like, can shorten positioning and curing time, quickens process flow and improves process efficiency.
Description
Technical Field
The invention relates to the technical field of viscose, in particular to a strong primary adhesion bi-component silicone structural adhesive.
Background
The silicone structural adhesive has the characteristics of high strength, high load bearing capacity, aging resistance, fatigue resistance and corrosion resistance, has wide application in the bonding aspect of metal, ceramic, plastic, rubber, wood and other similar materials or different materials, is simple and convenient to construct, saves time and does not damage the original structure. However, silicone structural adhesives also have disadvantages, in which low initial adhesion, slow curing speed, and long curing time are the biggest problems.
The initial adhesion generally refers to initial surface adhesion between articles, and is generally weak within 3-24 hours after the construction of the two-component silicone structural adhesive is completed. Meanwhile, if the bonding force is formed for too long, the construction time is long, the bonded material is easy to deform in the moving process in the curing time, the bonding effect is invalid, the production efficiency of workshops is influenced, and the production cost is increased.
Therefore, the bi-component silicone structural adhesive is developed, so that the bi-component silicone structural adhesive has stronger initial adhesive force, can be cured quickly, has excellent long-term stability in the aspects of comprehensive properties such as mechanical strength, adhesive property and the like, can improve the service scene and construction efficiency of the bi-component silicone structural adhesive, and brings good economic benefit.
Disclosure of Invention
Aiming at the requirements of the prior art and practical application, the invention provides the double-component silicone structural adhesive with strong initial adhesion, which has strong initial adhesion, can be rapidly cured, has excellent long-term stability in the aspects of comprehensive properties such as mechanical strength, adhesive property and the like, and solves the problems of low initial adhesion, low curing speed and long curing time of the silicone structural adhesive.
The silicone structural adhesive provided by the invention comprises a component A and a component B: the component A consists of alpha, omega-dihydroxy polydimethylsiloxane 40-60 wt%, silicone oil 2-10 wt% and stuffing 30-50 wt%. The component B consists of 10 to 30 weight percent of simethicone, 30 to 50 weight percent of reinforcing filler, 10 to 30 weight percent of cross-linking agent, 10 to 30 weight percent of compound coupling agent and 0.01 to 0.5 weight percent of catalyst.
The compound coupling agent consists of a coupling agent A and a coupling agent B, wherein the ratio of the coupling agent A to the coupling agent B is not lower than 20%.
The coupling agent A is at least one of bis [3- (trimethoxy silicon) -propyl ] amine, gamma-glycidoxypropyl trimethoxy silane, gamma-glycidoxypropyl triethoxy silane, epoxycyclohexylmethyl dimethoxy silane, epoxycyclohexylmethyl diethoxy silane, 3-chloropropyl trimethoxy silane, 3-chloropropyl triethoxy silane and gamma- (2, 3-epoxypropoxy) propyl trimethoxy siloxane.
The coupling agent B is at least one of N-butyl aminopropyl trimethoxy silane, gamma-aminopropyl triethoxy silane, gamma-aminopropyl methyl dimethoxy silane, gamma-aminopropyl methyl diethoxy silane, N- (2-aminoethyl) -3-aminopropyl trimethoxy silane, N- (2-aminoethyl) -3-aminopropyl triethoxy silane, N- (2-aminoethyl) -3-aminopropyl methyl dimethoxy silane, N- (2-aminoethyl) -3-aminopropyl methyl diethoxy silane, anilinomethyl trimethoxy silane, anilinomethyl triethoxy silane and divinyl triaminopropyl trimethoxy silane.
The cross-linking agent is two or more of tetraethoxysilane, polyethyl silicate, methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, polymethyltriethoxysilane oligomer, phenyltrimethoxysilane, phenyltriethoxysilane, methylphenyldimethoxysilane, methylphenyldiethoxysilane, octyltrimethoxysilane, tetramethoxysilane, 1, 2-bis (trimethoxysilyl) ethane, diphenyldimethoxysilane and diphenyldiethoxysilane.
The cross-linking agent and the compound agent are activated for 10-100 hours after being stirred and heated to 50-100 ℃.
The viscosity of the d, omega-dihydroxy polydimethylsiloxane is 5000-100000 cs; the viscosity of the simethicone is 1000-15000 cs.
The filler is formed by mixing one or more of active calcium carbonate with the particle size of 10-40 nm and resin according to any proportion.
The resin is one or a mixture of more of mushroom vinyl resin, rosin resin and petroleum resin.
The active calcium carbonate is calcium carbonate with the surface treated by one or more of octamethyl cyclotetrasiloxane, hexamethyldisilazane, dimethyl dichlorosilane, rosin, fatty acid and stearic acid.
The reinforcing filler is formed by mixing one or two of carbon black or gas-phase white carbon black with the particle size of 0.3-10 nm.
The catalyst may be dibutyltin dilaurate, dibutyltin diacetate, dioctyltin dilaurate, monobutyl tin hydroxide or stannous octoate.
Detailed Description
When the following examples are used, the components A and B are uniformly mixed according to the volume ratio of 10:1, and then are coated on the surface of the cleaned material to be bonded in an extrusion mode, then the structural adhesive is scraped to a thickness of 6mm by a scraper, the structural adhesive is cured for 30min at room temperature, and then primary adhesion test is carried out on the structural adhesive, and a weight with a certain mass is hung on the structural adhesive to observe the bearing capacity of the structural adhesive. And secondly, after curing for 12 hours under standard conditions, measuring the tensile shear strength according to the test conditions of GB/T7124-2008.
Each comparative example and example scheme is listed below:
b component scheme | Silicone oil | Crosslinking agent | Coupling agent | Reflow process |
Comparative example 1 | 3000mPa·s | Single | Single | Without any means for |
Comparative example 2 | 3000mPa·s | Single | Single | Without any means for |
Comparative example 3 | 3000mPa·s | Single | Single | Without any means for |
Comparative example 4 | 3000mPa·s | Compounding | Compounding | Without any means for |
Comparative example 5 | 3000mPa·s | Compounding | Compounding | Has the following components |
Example 1 | 10000mPa·s | Compounding | Compounding | Has the following components |
Example 2 | 13000mPa·s | Compounding | Compounding | Has the following components |
Example 3 | 10000mPa·s | Compounding | Compounding | Has the following components |
Example 4 | 13000mPa·s | Compounding | Compounding | Has the following components |
Comparative example 1:
the component A (weight fraction): taking 100 parts of hydroxyl-terminated polydimethylsiloxane with the viscosity of 10000 mPas, adding 10 parts of 400 mPas dimethyl silicone oil into a kneader, stirring and dispersing, adding 100 parts of 70 nm-particle-size nano active calcium carbonate into the mixture in the stirring process after 5 minutes to enable the powder to be completely covered by the glue to form a self-leveling base material, controlling the reaction temperature to be 100 ℃, mixing for 1 hour to obtain a base material A, and grinding for later use.
The component B (weight fraction): according to the proportion of the component B, adding 100 parts of 3000 mPa.s dimethyl silicone oil and 100 parts of carbon black into a planetary machine, stirring in vacuum, keeping the temperature at 100 ℃ for 30min to obtain a base material B, adding 50 parts of propyl trimethoxysilane and 50 parts of 3-isocyanatopropyl trimethoxysilane, adding 1 part of catalyst, and stirring for 20min under the protection of nitrogen to obtain the base material.
And then the component A and the component B are vacuumized and uniformly mixed in a planetary mixer according to the mixing volume ratio of 10:1, and tested according to the conditions.
Comparative example 2:
the component A (weight fraction): taking 100 parts of hydroxyl-terminated polydimethylsiloxane with the viscosity of 10000 mPas, adding 10 parts of 400 mPas dimethyl silicone oil into a kneader, stirring and dispersing, adding 100 parts of 40 nm-particle-size nano active calcium carbonate into the mixture in the stirring process after 5 minutes to enable the powder to be completely covered by the glue to form a self-leveling base material, controlling the reaction temperature to be 100 ℃, mixing for 1 hour to obtain a base material A, and grinding for later use.
The component B (weight fraction): according to the proportion of the component B, adding 100 parts of 3000 mPa.s dimethyl silicone oil and 100 parts of carbon black into a planetary machine, stirring in vacuum, keeping the temperature at 100 ℃ for 30min to obtain a base material B, adding 50 parts of propyl trimethoxysilane and 50 parts of 3-isocyanatopropyl trimethoxysilane, adding 1 part of catalyst, and stirring for 20min under the protection of nitrogen to obtain the base material.
And then the component A and the component B are vacuumized and uniformly mixed in a planetary mixer according to the mixing volume ratio of 10:1, and tested according to the conditions.
Comparative example 3:
the component A (weight fraction): taking 100 parts of hydroxyl-terminated polydimethylsiloxane with the viscosity of 10000 mPas, adding 10 parts of 400 mPas dimethyl silicone oil into a kneader, stirring and dispersing, adding 95 parts of 40 nm-particle-size nano active calcium carbonate and 5 parts of rosin resin into the mixture in the stirring process after 5 minutes, so that the powder is completely covered by the glue to form a self-leveling base material, controlling the reaction temperature to be 100 ℃, mixing for 1h to obtain the base material A, and grinding for later use.
The component B (weight fraction): according to the proportion of the component B, adding 100 parts of 3000 mPa.s dimethyl silicone oil and 100 parts of carbon black into a planetary machine, stirring in vacuum, keeping the temperature at 100 ℃ for 30min to obtain a base material B, adding 50 parts of propyl trimethoxysilane and 50 parts of 3-isocyanatopropyl trimethoxysilane, adding 1 part of catalyst, and stirring for 20min under the protection of nitrogen to obtain the base material.
And then the component A and the component B are vacuumized and uniformly mixed in a planetary mixer according to the mixing volume ratio of 10:1, and tested according to the conditions.
Comparative example 4:
the component A (weight fraction): taking 100 parts of hydroxyl-terminated polydimethylsiloxane with the viscosity of 10000 mPas, adding 10 parts of 400 mPas dimethyl silicone oil into a kneader, stirring and dispersing, adding 100 parts of 30 nm-particle-size nano active calcium carbonate into the mixture in the stirring process after 5 minutes to enable the powder to be completely covered by the glue to form a self-leveling base material, controlling the reaction temperature to be 100 ℃, mixing for 1 hour to obtain a base material A, and grinding for later use.
The component B (weight fraction): according to the proportion of the component B, 100 parts of 10000 mPa.s dimethyl silicone oil and 100 parts of carbon black are added into a planetary machine for vacuum stirring, the temperature is stabilized at 100 ℃ and kept for 30min to obtain a base material B, then 20 parts of polymethyl triethoxysilane, 30 parts of propyl trimethoxysilane, 30 parts of gamma-aminopropyl trimethoxysilane and 10 parts of epoxy cyclohexyl methyl diethoxysilane are added, and then 1 part of catalyst is added for stirring for 20min under the protection of nitrogen.
And then the component A and the component B are vacuumized and uniformly mixed in a planetary mixer according to the mixing volume ratio of 10:1, and tested according to the conditions.
Comparative example 5:
the component A (weight fraction): taking 100 parts of hydroxyl-terminated polydimethylsiloxane with the viscosity of 10000 mPas, adding 10 parts of 400 mPas dimethyl silicone oil into a kneader, stirring and dispersing, adding 100 parts of 30 nm-particle-size nano active calcium carbonate into the mixture in the stirring process after 5 minutes to enable the powder to be completely covered by the glue to form a self-leveling base material, controlling the reaction temperature to be 100 ℃, mixing for 1 hour to obtain a base material A, and grinding for later use.
The component B (weight fraction): according to the proportion of the component B, 100 parts of 10000 mPa.s dimethyl silicone oil and 100 parts of carbon black are added into a planetary machine to be stirred in vacuum, the temperature is stabilized at 100 ℃ and kept for 30min to obtain a base material B, then 20 parts of polymethyl triethoxysilane, 30 parts of propyl trimethoxysilane, 30 parts of gamma-aminopropyl trimethoxysilane and 10 parts of epoxy cyclohexyl methyl diethoxysilane which are activated for 50h at 60 ℃ are added, and then 1 part of catalyst is added to be stirred for 20min under the protection of nitrogen to obtain the base material B.
And then the component A and the component B are vacuumized and uniformly mixed in a planetary mixer according to the mixing volume ratio of 10:1, and tested according to the conditions.
Example 1:
the component A (weight fraction): 100 parts of hydroxyl-terminated polydimethylsiloxane with the viscosity of 20000 mPas is taken, then 10 parts of 400 mPas simethicone is added into a kneader for stirring and dispersing, 95 parts of nano active calcium carbonate with the particle size of 20nm and 5 parts of mushroom vinyl resin are added into the mixture in the stirring process after 5 minutes, so that the powder is completely covered by the glue to form a self-leveling base material, the reaction temperature is controlled to be 100 ℃, and the base material A is obtained after mixing for 1 hour, and grinding is carried out for later use.
The component B (weight fraction): according to the proportion of the component B, 100 parts of 10000 mPa.s dimethyl silicone oil and 100 parts of carbon black are added into a planetary machine for vacuum stirring, the temperature is stabilized at 100 ℃ and kept for 30min to obtain a base material B, then 20 parts of methyltrimethoxysilane, 30 parts of propyl orthosilicate, 30 parts of N-butylaminopropyl trimethoxysilane and 20 parts of gamma-glycidoxypropyl trimethoxysilane are added after activation for 50h at 70 ℃, and then 1 part of catalyst is added for stirring for 20min under the protection of nitrogen.
And then the component A and the component B are vacuumized and uniformly mixed in a planetary mixer according to the mixing volume ratio of 10:1, and tested according to the conditions.
Example 2:
the component A (weight fraction): 100 parts of hydroxyl-terminated polydimethylsiloxane with the viscosity of 20000 mPas is taken, then 10 parts of 400 mPas simethicone is added into a kneader for stirring and dispersing, 90 parts of nano active calcium carbonate with the particle size of 20nm and 10 parts of rosin resin are added into the mixture in the stirring process after 5 minutes, so that the powder is completely covered by the adhesive to form a self-leveling base material, the reaction temperature is controlled to be 100 ℃, and the base material A is obtained after mixing for 1 hour, and grinding is carried out for later use.
The component B (weight fraction): according to the proportion of the component B, adding 100 parts of 13000 mPa.s dimethyl silicone oil and 100 parts of carbon black into a planetary machine, stirring in vacuum, keeping the temperature at 100 ℃ for 30min to obtain a base material B, adding 20 parts of methyltrimethoxysilane, 30 parts of propyl orthosilicate, 30 parts of N-butylaminopropyl trimethoxysilane and 20 parts of gamma-glycidoxypropyl trimethoxysilane after activation for 50h at 90 ℃, adding 1 part of catalyst, and stirring for 20min under the protection of nitrogen to obtain the modified silicone.
And then the component A and the component B are vacuumized and uniformly mixed in a planetary mixer according to the mixing volume ratio of 10:1, and tested according to the conditions.
Example 3:
the component A (weight fraction): taking 100 parts of hydroxyl-terminated polydimethylsiloxane with the viscosity of 60000 mPas, adding 2 parts of 400 mPas and 8 parts of 1000 mPas of simethicone into a kneader for stirring and dispersing, adding 85 parts of 20 nm-particle-size nano active calcium carbonate and 15 parts of petroleum resin into the mixture in the stirring process after 5min to enable the glue to completely cover the powder to form a self-leveling base material, controlling the reaction temperature to be 100 ℃, mixing for 1h to obtain the base material A, and grinding for later use.
The component B (weight fraction): according to the proportion of the component B, 100 parts of 10000 mPa.s dimethyl silicone oil and 100 parts of carbon black are added into a planetary machine for vacuum stirring, the temperature is stabilized at 100 ℃ and kept for 30min to obtain a base material B, 10 parts of tetramethoxysilane, 20 parts of octyl trimethoxysilane, 40 parts of N- (2-aminoethyl) -3-aminopropyl triethoxysilane and 20 parts of divinyl triaminopropyl trimethoxysilane are added after the base material B is activated at 70 ℃ for 72h, and then 1 part of catalyst is added for stirring for 20min under the protection of nitrogen.
And then the component A and the component B are vacuumized and uniformly mixed in a planetary mixer according to the mixing volume ratio of 10:1, and tested according to the conditions.
Example 4:
the component A (weight fraction): 100 parts of hydroxyl-terminated polydimethylsiloxane with the viscosity of 20000 mpa.s is taken, then 10 parts of 400 mpa.s simethicone is added into a kneader for stirring and dispersing, 90 parts of nano active calcium carbonate with the particle size of 20nm and 10 parts of rosin resin are added into the mixture in the stirring process after 5 minutes, so that the powder is completely covered by the glue to form a self-leveling base material, the reaction temperature is controlled to be 100 ℃, and the base material A is obtained after mixing for 1 hour, and grinding is carried out for later use.
The component B (weight fraction): according to the proportion of the component B, 100 parts of 13000 mPa.s dimethyl silicone oil and 100 parts of carbon black are added into a planetary machine for vacuum stirring, the temperature is stabilized at 100 ℃ and kept for 30min to obtain a base material B, 30 parts of methylphenyl dimethoxy silane, 20 parts of diphenyl dimethoxy silane, 30 parts of gamma-glycidol ether oxypropyl triethoxy silane and 40 parts of N- (2-aminoethyl) -3-aminopropyl methyl diethoxy silane after being activated for 72h at 90 ℃ are added, and then 1 part of catalyst is added for stirring for 20min under the protection of nitrogen.
And then the component A and the component B are vacuumized and uniformly mixed in a planetary mixer according to the mixing volume ratio of 10:1, and tested according to the conditions.
The test results of each comparative example and each example are as follows:
from the results, compared with the traditional silicone structural adhesive, the two-component silicone structural adhesive provided by the invention has stronger initial adhesive force, faster curing speed and short stretch-break and surface drying time, can meet the various requirements of special buildings, automobiles, electronic appliances and the like, can shorten positioning and curing time, quicken process flow and improve process efficiency.
The technical description and the beneficial effects of the invention are as follows:
1. the invention expands the application range of the silicone structural adhesive and has good economic value.
2. The invention aims at improving the defect of low initial adhesive force and performance of the existing double-component silicone structural adhesive product, and obviously improves the initial adhesive force.
3. The silicone sealant disclosed by the invention has good weather resistance and is suitable for long-term use. The preparation process is simple, and conventional production equipment is used.
4. The invention can improve the shearing strength of the cross-linking agent and the coupling agent by activating the cross-linking agent and the coupling agent, and can balance the reactivity of the cross-linking agent and the coupling agent by selecting two types of coupling agents with different activities for compounding, can adjust the curing rate of the cross-linking agent and the coupling agent to achieve effective bonding, and can improve the comprehensive performance of products.
Claims (1)
1. The application of the two-component silicone structural adhesive in improving the initial adhesion is characterized in that the two-component silicone structural adhesive comprises an A component and a B component; the component A is prepared by the following method: taking 100 parts of hydroxyl-terminated polydimethylsiloxane with the viscosity of 60000 mPas, adding 2 parts of 400 mPas and 8 parts of 1000 mPas of simethicone into a kneader for stirring and dispersing, adding 85 parts of 20 nm-particle-size nano active calcium carbonate and 15 parts of petroleum resin into the mixture in the stirring process after 5min to enable the glue to completely cover the powder to form a self-leveling base material, controlling the reaction temperature to be 100 ℃, mixing for 1h to obtain a base material A, and grinding for later use; the component B is prepared by the following method: adding 100 parts of 10000 mPa.s simethicone and 100 parts of carbon black into a planetary machine for vacuum stirring, keeping the temperature at 100 ℃ for 30min to obtain a base material B, adding 10 parts of tetramethoxysilane, 20 parts of octyl trimethoxysilane, 40 parts of N- (2-aminoethyl) -3-aminopropyl triethoxysilane and 20 parts of divinyl triaminopropyl trimethoxysilane after the base material B is activated at 70 ℃ for 72h, adding 1 part of catalyst, and stirring for 20min under the protection of nitrogen to obtain the catalyst; and vacuumizing and uniformly mixing the component A and the component B in a planetary mixer according to the mixing volume ratio of 10:1, wherein the contents of the components are in parts by weight.
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