CN114126764A - Nozzle and liquid ejecting apparatus - Google Patents

Nozzle and liquid ejecting apparatus Download PDF

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Publication number
CN114126764A
CN114126764A CN201980098460.3A CN201980098460A CN114126764A CN 114126764 A CN114126764 A CN 114126764A CN 201980098460 A CN201980098460 A CN 201980098460A CN 114126764 A CN114126764 A CN 114126764A
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CN
China
Prior art keywords
flow path
nozzle
liquid
inner diameter
peripheral surface
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Pending
Application number
CN201980098460.3A
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Chinese (zh)
Inventor
明永裕树
中森健太
境郁哉
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Asahi Sunac Corp
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Asahi Sunac Corp
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Publication date
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Publication of CN114126764A publication Critical patent/CN114126764A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/34—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to influence the nature of flow of the liquid or other fluent material, e.g. to produce swirl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
    • B05B1/08—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape of pulsating nature, e.g. delivering liquid in successive separate quantities ; Fluidic oscillators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
    • B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
    • B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
    • B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
    • B05B9/04—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
    • B05B9/0403—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump with pumps for liquids or other fluent material
    • B05B9/0423—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump with pumps for liquids or other fluent material for supplying liquid or other fluent material to several spraying apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/004—Arrangements for controlling delivery; Arrangements for controlling the spray area comprising sensors for monitoring the delivery, e.g. by displaying the sensed value or generating an alarm
    • B05B12/006—Pressure or flow rate sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
    • B08B2203/027—Pump details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
    • B08B2203/0288—Ultra or megasonic jets

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Nozzles (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The nozzle (20) has a flow path (21) through which the liquid flows and discharges the liquid toward the object (W), and the flow path (21) includes a vibration generation flow path (22) for generating a vibration flow in the liquid.

Description

Nozzle and liquid ejecting apparatus
Technical Field
The technology disclosed in the present specification relates to a nozzle and a liquid ejecting apparatus.
Background
Conventionally, there has been known a high-pressure spray apparatus for spraying a high-pressure cleaning liquid onto a surface of a flat panel display, a semiconductor wafer, or the like to clean the surface. In such a high-pressure cleaning apparatus, for the purpose of improving cleaning performance, a technique of applying ultrasonic waves to a cleaning liquid by an ultrasonic wave generating device and spraying the cleaning liquid has been proposed (see patent document 1).
Documents of the prior art
Patent document 1: japanese laid-open patent publication No. 11-204480
Disclosure of Invention
Problems to be solved by the invention
However, in the above-described configuration, it is necessary to provide an ultrasonic wave generator in the cleaning nozzle, and the apparatus configuration is easily complicated.
Means for solving the problems
The nozzle disclosed in the present specification is a nozzle that has a flow path through which a liquid flows and discharges the liquid toward a processing object, and the flow path includes a vibration generating flow path for generating a vibration flow in the liquid.
Further, the liquid ejecting apparatus disclosed in the present specification includes: and a high-pressure pump connected to the nozzle and pressurizing the liquid supplied to the nozzle.
Effects of the invention
According to the nozzle and the liquid ejecting apparatus including the nozzle disclosed in the present specification, since the nozzle includes the vibration generating flow path, it is not necessary to separately provide a device for generating a vibration flow such as an ultrasonic wave generating device, and the device configuration can be prevented from being complicated.
Drawings
Fig. 1 is an overall schematic diagram of a cleaning apparatus according to an embodiment.
Fig. 2 is a sectional view of a nozzle connected to a pipe in the embodiment.
Fig. 3 is a diagram schematically showing a state in which a liquid flows inside a vibration generation flow path in the embodiment.
Fig. 4 is a partially enlarged cross-sectional view of a nozzle according to a modification.
Fig. 5 is a schematic diagram of a test apparatus used in a test example for measuring the vibration frequency.
Fig. 6 is a diagram showing a waveform of a dynamic acceleration amplitude measured by an acceleration sensor in a test example in which the vibration frequency is measured.
Fig. 7 is a graph showing a relationship between frequency and amplitude obtained by frequency-analyzing measured acceleration vibration in a test for measuring vibration frequency.
Fig. 8 is a graph showing a relationship between the set pressure and the removal rate of the high-pressure pump in a cleaning test using the nozzle having the configuration of the embodiment and the conventional nozzle.
Fig. 9 is a graph showing the particle diameter and velocity distributions measured by a shadow doppler particle analyzer for the ejected droplet particles ejected from the nozzle of the embodiment in an experiment for examining the particle diameter-velocity distribution of the ejected droplet particles.
Fig. 10 is a graph showing the particle diameter and velocity distributions measured by a shadow doppler particle analyzer for ejected droplet particles ejected from a conventional nozzle in a test for examining the particle diameter-velocity distribution of the ejected droplet particles.
Fig. 11 is a diagram showing a surface pressure distribution of the ejection liquid ejected from the nozzle of the embodiment in an experiment for examining the surface pressure distribution of the ejection liquid.
Fig. 12 is a diagram showing a surface pressure distribution of an ejection liquid ejected from a conventional nozzle in a test for examining the surface pressure distribution of the ejection liquid.
Detailed Description
[ summary of embodiments ]
The nozzle disclosed in the present specification is a member that has a flow path through which a liquid flows and ejects the liquid toward a processing object, and the flow path includes a vibration generating flow path for generating a vibration flow in the liquid.
Further, the liquid jet cleaning device disclosed in the present specification includes: and a high-pressure pump connected to the nozzle and pressurizing the liquid supplied to the nozzle.
According to the above configuration, since the nozzle includes the vibration generating flow path, it is not necessary to separately provide a device for generating a vibration flow such as an ultrasonic wave generating device, and the device configuration can be prevented from being complicated.
In the above configuration, the vibration generation flow path may include: a first flow path; a second flow path connected to a downstream side of the first flow path and having an inner diameter smaller than that of the first flow path; and a third flow path connected to a downstream side of the second flow path and having an inner diameter larger than that of the second flow path.
With this configuration, the liquid flowing through the vibration generating flow path can generate a vibrating flow with a simple configuration.
In the above configuration, the vibration generation flow path may include an acceleration flow path connected to a downstream side of the second flow path, and the acceleration flow path may include: an ejection port for ejecting the liquid; a straight line portion located on the side of the injection port and having a straight pipe shape with a circular cross section; and a reduced diameter portion which is continuous with the linear portion and has an inner diameter which is gradually reduced from an inlet port provided on the second flow path side to a connection end connected to the linear portion, wherein a ratio of a length dimension L1 to a diameter dimension D1 in the axial direction of the linear portion, namely, L1/D1, is 7.8 to 15, and at least a portion of the second flow path side in the reduced diameter portion constitutes the third flow path having an inner diameter larger than that of the second flow path. With this configuration, the cleaning performance can be improved.
In the above configuration, a ratio of an inner diameter of the second flow path to an inner diameter of a portion of the first flow path which is disposed adjacent to the second flow path may be 0.04 to 0.8. When the ratio is within this range, a sufficient oscillating flow can be generated in the liquid flowing inside the nozzle.
In the above configuration, the nozzle may include: a first inner peripheral surface defining the first flow path, a second inner peripheral surface defining the second flow path, and a step surface connecting the first inner peripheral surface and the second inner peripheral surface, wherein an angle between the step surface and the first inner peripheral surface is 90 ° to 150 °. When the angle is within this range, a sufficient oscillating flow can be generated in the liquid flowing inside the nozzle.
In the liquid ejecting apparatus having the above configuration, the ejection pressure from the nozzle by the pressurization of the high-pressure pump may be 1MPa to 30 MPa. When the injection pressure is within this range, the particle velocity and particle diameter of the atomized injection droplets injected from the nozzle are set to a size suitable for processing the object to be processed, and damage to the object to be processed and occurrence of an abnormality in the transport system can be avoided.
[ detailed description of the embodiments ]
Specific examples of the technology disclosed in the present specification will be described below with reference to the drawings. The present invention is not limited to these examples, but is defined by the claims, and all changes within the meaning and range equivalent to the claims are intended to be embraced therein.
< embodiment >
An embodiment will be described with reference to fig. 1 to 3. The cleaning apparatus 1 (corresponding to a liquid ejecting apparatus) according to the present embodiment is an apparatus for cleaning a processing object W (corresponding to a processing object) by ejecting liquid (ultrapure water) at high pressure. Examples of the object W to be processed include a flat panel display and a semiconductor wafer.
As shown in fig. 1, the cleaning apparatus 1 includes: a tank 11 for storing liquid, a high pressure pump 12, and a plurality of nozzles 20. The tank 11 and the high-pressure pump 12 are connected via a pipe 13, and the high-pressure pump 12 and the nozzle 20 are connected via a pipe 14.
The high-pressure pump 12 pressurizes the liquid supplied from the tank 11 and supplies the pressurized liquid to the nozzle 20. The high-pressure pump 12 pressurizes the liquid so that the ejection pressure of the liquid ejected from the nozzle 20 is 1MPa to 30 MPa. The injection pressure may be appropriately determined depending on the treatment object W, but when the injection pressure is less than 1MPa, the cleaning effect is reduced, and when the injection pressure exceeds 30MPa, there is a possibility that the treatment object W is damaged or an abnormality occurs in the transport system, and therefore, in order to obtain a preferable cleaning effect, it is preferable to pressurize the treatment object W so that the liquid is injected in a range of 1MPa to 30 MPa.
The nozzle 20 is a single fluid nozzle for ejecting the liquid supplied from the high-pressure pump 12 toward the object W to be processed, and as shown in fig. 2, includes: a pipe connection portion 30 connected to a pipe 14 connected to the high-pressure pump 12, a throttle hole portion 40 connected to the pipe connection portion 30, an acceleration portion 50 connected to the throttle hole portion 40, and a holding portion 60 holding these three components. The pipe connecting portion 30, the orifice portion 40, and the accelerator portion 50 are each separate bodies and are held by the holding portion 60 to be integrated. The pipe connection portion 30 has a supply flow path 33, the orifice portion 40 has a throttle flow path 43 (corresponding to a second flow path) connected to the supply flow path 33, and the acceleration portion 50 has an acceleration flow path 55 connected to the throttle flow path 43. As shown in fig. 2, the supply flow path 33, the throttle flow path 43, and the acceleration flow path 55 constitute a flow path 21 through which the liquid flows.
As shown in fig. 2, the pipe connecting portion 30 has a cylindrical shape as a whole, and includes a pipe fixing hole 31 and a supply flow path 33 connected to the pipe fixing hole 31. The pipe fixing hole 31 is opened in the outer peripheral surface of the pipe connecting portion 30, and a joint (not shown) connected to one end of the pipe 14 is fixed inside. The supply flow path 33 includes: a first supply passage 33A connected to the pipe fixing hole 31 and extending toward the central axis of the pipe connection portion 30; and a second supply passage 33B (corresponding to the first passage) connected to the first supply passage 33A and extending in a straight tube shape along the central axis of the pipe connecting portion 30. The second supply channel 33B has a first outlet 32 through which the liquid flows out on one of both end surfaces (the lower surface in fig. 2) of the pipe connecting portion 30.
As shown in fig. 2, the orifice 40 has a cylindrical shape as a whole and has an orifice flow path 43. The orifice passage 43 is a passage extending in a straight tube shape along the central axis of the orifice 40, and has a second inlet 41 on one end surface and a second outlet 42 on the other end surface of the orifice 40 to penetrate the orifice 40.
The orifice 40 overlaps the pipe connecting portion 30 such that a surface (upper surface in fig. 2) having the second inlet 41 and a surface having the first outlet 32 are in contact with each other. The orifice 40 is disposed coaxially with the pipe connecting portion 30. The throttle flow path 43 communicates with the second supply flow path 33B.
As shown in fig. 2 and 3, the throttle flow passage 43 has an inner diameter D3 smaller than the inner diameter D2 of the second supply flow passage 33B. In other words, the inner diameter D3 of the second inflow port 41 is smaller than the inner diameter D2 of the first outflow port 32. A step surface 45 is disposed at a boundary position between the second supply flow path 33B and the throttle flow path 43. The stepped surface 45 is formed by a peripheral portion of the opening edge of the second inlet port 41 in the surface of the orifice portion 40 having the second inlet port 41, and connects the first inner peripheral surface 34 defining the second supply flow passage 33B provided in the pipe connecting portion 30 and the second inner peripheral surface 44 defining the orifice flow passage 43 provided in the orifice portion 40. The angle α 1 between the step surface 45 and the second inner peripheral surface 44 is 90 °.
As shown in fig. 2, the accelerator section 50 includes an accelerator section main body 51 having a columnar shape as a whole and a flange portion 52 extending from an outer peripheral surface of the accelerator section main body 51. The acceleration section main body 51 has an acceleration flow path 55. The acceleration passage 55 is a passage extending along the central axis of the acceleration unit main body 51, and has a third inlet 53 (corresponding to an inlet) on one end surface and a third outlet 54 (corresponding to an outlet) on the other end surface of the acceleration unit main body 51, and penetrates the acceleration unit main body 51.
The acceleration portion 50 overlaps the orifice portion 40 so that a surface having the third inlet 53 (an upper surface in fig. 2) and a surface having the second outlet 42 (a lower surface in fig. 2) abut against each other. The accelerator portion 50 is disposed coaxially with the pipe connecting portion 30 and the orifice portion 40. The acceleration flow path 55 communicates with the throttle flow path 43. The acceleration flow path 55 includes: a linear portion 57 which is located on the third outlet port 54 side and has a straight tubular shape with a circular cross section; and a reduced diameter portion 56 connected to the linear portion 57, the inner diameter of which is gradually reduced from the third inlet 53 on the throttle flow path 43 side to the linear portion 57. The inner peripheral surface of the reduced diameter portion 56 has a shape in which the inner diameter is gradually reduced from the third inlet port 53 to the linear portion 57 and smoothly continues to the linear portion 57 without a step. Most of the reduced diameter portion 56 adjacent to the throttle channel 43 is a large diameter portion 56A having an inner diameter larger than that of the throttle channel 43 (corresponding to a third channel: see also fig. 3). The straight portion 57 has an inner diameter slightly smaller than the throttle flow path 43.
As shown in fig. 3, the second supply passage 33B, the throttle passage 43, and the large diameter portion 56A constitute a vibration generating passage 22 for generating a vibration flow in the liquid flowing inside.
As shown in fig. 2, the holding portion 60 includes a circular bottom plate portion 61 and a cylindrical holding tube portion 62 extending from an outer peripheral edge of the bottom plate portion 61. The bottom plate portion 61 has an insertion hole 63 through which the acceleration portion main body 51 can be inserted. The acceleration portion 50 is held by the holding portion 60 by inserting the acceleration portion main body 51 of the acceleration portion 50 through the insertion hole 63, projecting most of the third outlet side from the holding portion 60 and abutting the flange portion 52 against the bottom plate portion 61. Further, the orifice portion 40 and a part of the pipe connection portion 30 on the first outlet 32 side are fixed inside the retainer tube portion 62.
When the cleaning apparatus 1 configured as described above is used to clean the object W, the liquid pressurized by the high-pressure pump 12 is supplied from the pipe fixing hole 31 into the nozzle 20, passes through the supply flow path 33, the throttle flow path 43, and the acceleration flow path 55, is discharged from the third outlet 54, and is discharged to the object W. Thereby performing cleaning.
The nozzle 20 includes a vibration generation flow path 22, and can generate a vibration flow in the liquid flowing through the vibration generation flow path 22. This eliminates the need to separately provide a device for generating an oscillating flow, such as an ultrasonic wave generator, and thus can avoid complication of the structure of the cleaning apparatus 1. The vibration generation flow path 22 includes: a second supply channel 33B; a throttle flow path 43 connected to the downstream side of the second supply flow path 33B and having an inner diameter smaller than that of the second supply flow path 33B; and a large diameter portion 56A connected to the downstream side of the throttle flow path 43 and having an inner diameter larger than that of the throttle flow path 43. With this configuration, the liquid can be caused to flow in a vibrating manner with a simple configuration.
The mechanism of generating the vibration flow when the liquid flows through the vibration generating flow path 22 is considered as follows.
As shown in fig. 3, when the liquid flows from the second supply channel 33B into the throttle channel 43, the flow is peeled off from the edge of the second inlet 41, and the once peeled flow is again attached to the wall surface of the throttle channel 43. In fig. 3, point P1 is the peel point and point P2 is the reattachment point. Thereby, between the separation point P1 and the reattachment point P2, a vortex 71 is generated near the second inner peripheral surface 44. In the center of the vortex 71, the pressure is locally equal to or lower than the saturated vapor pressure, and bubbles (peeling bubbles) (cavitation) are generated in the center. The bubbles flow downstream when they reach a certain size. In this way, the formation and release of the peeling bubbles are intermittently repeated, and a periodic oscillating flow is generated.
When the vibration flow flows into the large diameter portion 56A, the peeling bubbles are gathered to form a cloud-like bubble cloud 72. The generated bubble cloud 72 periodically flows downstream of the acceleration flow path 55.
Here, the ratio (throttle ratio β) of the inner diameter D3 of the throttle flow path 43 to the inner diameter D2 of the second supply flow path 33B is expressed by the following expression (1). The throttle ratio β is preferably 0.04 to 0.8. When the throttle ratio β is within this range, a sufficient oscillating flow can be generated in the liquid flowing inside the nozzle 20.
β＝D3/D2……(1)
Further, by passing the liquid through the acceleration flow path 55, the ejection speed of the liquid ejected from the third outlet 54 can be increased. Here, according to the reynolds theory, the flow state of the liquid in the liquid flow path of the nozzle is a contracted flow region, a vortex region, and a turbulent flow region in this order from the base end side. The portion of the acceleration flow path 55 from the third inlet 53 to the straight portion 57 is formed without a step and is formed as a reduced diameter portion 56 having an inner diameter that gradually decreases, whereby the pressure loss can be reduced and the flow of the liquid introduced into the straight portion 57 can be improved. Further, by setting the ratio (L1/D1) of the axial length dimension L1 to the diameter dimension D1 of the straight portion 57 to 7.8 or more, the third outlet 54 which is the injection port of the liquid injected from the nozzle 20 can be disposed in the turbulent region, and the velocity of the liquid injected from the injection port can be sufficiently increased. This can further improve the cleaning performance. However, if (L1/D1) is too large, the particle size of the liquid to be discharged tends to increase, and the value of (L1/D1) is preferably 15 or less.
As described above, the cleaning performance can be improved by ejecting the liquid to which the oscillating flow is given by the nozzle 20 having the oscillation generating flow path 22 to the treatment object W. Further, the cleaning performance can be further improved by accelerating the liquid by the acceleration flow path 55 and discharging the liquid to the processing object W.
< modification example >
As shown in fig. 4, the angle α 2 between the step surface 81 and the second inner peripheral surface 44 need not be 90 °. The angle between the step surface 81 and the second inner peripheral surface 44 is preferably 90 ° to 150 °. This is because, when the angle is 150 ° or more, separation of the liquid flow is less likely to occur when the liquid flows from the second supply channel 33B into the throttle channel 43, and thus it is less likely to generate a sufficient vibrating flow for improving the cleaning ability.
< test example >
1. Determination of vibration frequency
A test apparatus 100 shown in fig. 5 was prepared. A cavity 101 is prepared, and the cavity 101 includes a supply passage 103 having a supply port 102 at one end and a throttle passage 104 connected to the supply passage 103 and having an ejection port 105 at the other end. A high-pressure pump 108 is connected to the cavity 101 via a high-pressure hose 107 having a length of 10 m. In the cavity 101, an acceleration sensor 111 is attached to an ejection surface 106 having an ejection port 105. A pressure sensor 112 is attached to the high-pressure hose 107 at a position close to the cavity 101.
Using this test apparatus 100, water was injected from the cavity 101 at an injection pressure of 5MPa, and the acceleration vibration transmitted to the ejection surface 106 was measured by the acceleration sensor 111 (see fig. 6). The frequency analysis of the acceleration vibration confirmed that a peak was present near 8kHz (see fig. 7).
2. Cleaning test
A cleaning test was performed using a nozzle having a vibration generating flow path with the structure of the above-described embodiment (hereinafter referred to as a "nozzle of the embodiment") and a conventional nozzle having no vibration generating flow path (hereinafter referred to as a "conventional nozzle"). Using the nozzle of the embodiment and the conventional nozzle, a cleaning operation was performed on a sample in which polystyrene particles having a particle diameter of about 3 μm were adhered to the surface of a silicon wafer as a pseudo stain under the same conditions. The number of particles was counted by scanning the surface of the sample before and after cleaning with a dedicated scanner, and the removal rate was calculated by the following formula (2).
Removal rate (%) < 100 × { (number of particles before washing-number of particles after washing)/number of particles before washing } … … (2)
Tests were conducted with the set pressure of the high-pressure pump set at 5MPa, 8MPa, or 10 MPa. The spray distance (the linear distance from the discharge port of the nozzle to the sample) was set to 100 mm.
As shown in fig. 8, when the set pressure of the high-pressure pump is any of 5MPa, 8MPa, and 10MPa, the removal rate is about 20 to 35% higher in the case of using the nozzle of the embodiment than in the case of using the conventional nozzle. Thus, it can be said that the cleaning ability is higher when the nozzle of the embodiment is used than when the conventional nozzle is used.
3. Particle size-velocity distribution of jetted droplet particles
Using the nozzle of the embodiment and the conventional nozzle, water was injected at an injection pressure of 10MPa, and the particle diameter and velocity of the droplet particles injected at a position 100mm from the injection port of the nozzle were measured using a Shadow Doppler Particle Analyzer (SDPA).
As shown in fig. 9 and 10, the particle diameter-velocity distribution in the case of using the nozzle of the embodiment is substantially the same as that in the case of using the conventional nozzle, but the particle velocity is high and there are a little more particles having a large particle diameter.
4. Surface pressure distribution of the ejection liquid
Using the nozzle of the embodiment and the conventional nozzle, water was jetted at a jetting pressure of 10MPa toward a surface pressure sensor provided at a position 100mm away from the jetting port of the nozzle, and the surface pressure distribution of the jetted liquid was measured.
As shown in fig. 11 and 12, when the nozzle according to the embodiment is used, the spread of the surface pressure distribution is small as a whole, and the portion having a high surface pressure is concentrated in the center, as compared with the case of using the conventional nozzle. Thus, when the nozzle according to the embodiment is used, the straightness of ejected droplets becomes higher than that when a conventional nozzle is used. Although data is not shown in detail, in the case of using the conventional nozzle, the flow immediately after ejection of the water ejected from the nozzle is in a laminar flow and is changed to a turbulent flow as it moves away from the ejection port, but in the case of using the nozzle of the embodiment, the flow immediately after ejection is in a turbulent flow. It is considered that these cases also contribute to the improvement of the straightness of the ejected liquid droplets, thereby contributing to the improvement of the cleaning ability.
< other embodiment >
(1) In the above embodiment, the nozzle 20 has the acceleration flow path 55, but for example, the third flow path may be a straight tubular flow path having a constant inner diameter.
(2) In the above embodiment, the pipe connection portion 30, the orifice portion 40, and the accelerator portion 50 are separate bodies, but for example, the pipe connection portion, the orifice portion, and the accelerator portion may be integrated, or any two of the pipe connection portion, the orifice portion, and the orifice portion and the accelerator portion may be integrated.
Description of the reference numerals
1 … cleaning device (liquid jet device)
12 … high-pressure pump
20 … nozzle
21 … flow path
22 … vibration generation flow path
33B … second supply channel (first channel)
34 … first inner peripheral surface
43 … throttle flow path (second flow path)
44 … second inner peripheral surface
45 … step surface
53 … third Inlet (inflow port)
55 … accelerated flow path
54 … third outflow port (jet port)
56 … reduced diameter portion
56A … major diameter part (third flow path)
57 … straight line part
W … washes an object (processing object).

Claims (7)

1. A nozzle having a flow path through which a liquid flows and ejecting the liquid toward a processing object,
the flow path is provided with a vibration generating flow path for generating a vibration flow in the liquid.
2. The nozzle of claim 1,
the vibration generation flow path has:
a first flow path;
a second flow path connected to a downstream side of the first flow path and having an inner diameter smaller than that of the first flow path; and
and a third flow path connected to a downstream side of the second flow path and having a larger inner diameter than the second flow path.
3. The nozzle of claim 2,
the vibration generation flow path includes an acceleration flow path connected to a downstream side of the second flow path,
the acceleration flow path has:
an ejection port that ejects the liquid;
a straight line portion located on the side of the injection port and having a straight tube shape with a circular cross section; and
a reduced diameter portion connected to the linear portion and having an inner diameter gradually reduced from an inlet port provided on the second flow path side to a connection end connected to the linear portion,
L1/D1, which is the ratio of the axial length L1 to the axial diameter D1, of the linear portion is 7.8 to 15,
at least a part of the reduced diameter portion on the second flow path side becomes the third flow path having a larger inner diameter than the second flow path.
4. The nozzle of claim 2 or 3,
the ratio of the inner diameter of the second flow path to the inner diameter of a portion of the first flow path that is disposed adjacent to the second flow path is 0.04 to 0.8.
5. The nozzle of any one of claims 2 to 4,
the nozzle is provided with: a first inner peripheral surface defining the first flow path, a second inner peripheral surface defining the second flow path, and a step surface connecting the first inner peripheral surface and the second inner peripheral surface,
the angle between the step surface and the second inner peripheral surface is 90 ° to 150 °.
6. A liquid ejecting apparatus includes:
the nozzle of any one of claims 1 to 5; and
and a high-pressure pump connected to the nozzle and pressurizing the liquid supplied to the nozzle.
7. The liquid ejection device according to claim 6,
the injection pressure from the nozzle by the pressurization of the high-pressure pump is 1MPa or more and 30MPa or less.
CN201980098460.3A 2019-07-24 2019-07-24 Nozzle and liquid ejecting apparatus Pending CN114126764A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/029014 WO2021014610A1 (en) 2019-07-24 2019-07-24 Nozzle and liquid injection device

Publications (1)

Publication Number Publication Date
CN114126764A true CN114126764A (en) 2022-03-01

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JP (1) JP7312486B2 (en)
KR (1) KR102658632B1 (en)
CN (1) CN114126764A (en)
TW (1) TWI711488B (en)
WO (1) WO2021014610A1 (en)

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JP7312486B2 (en) 2023-07-21
KR20220020389A (en) 2022-02-18
TWI711488B (en) 2020-12-01
US20220351985A1 (en) 2022-11-03
TW202103800A (en) 2021-02-01
WO2021014610A1 (en) 2021-01-28
JPWO2021014610A1 (en) 2021-01-28
KR102658632B1 (en) 2024-04-19

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