CN114126255A - Manufacturing process of novel high-heat-conductivity high-order high-density printed circuit board - Google Patents
Manufacturing process of novel high-heat-conductivity high-order high-density printed circuit board Download PDFInfo
- Publication number
- CN114126255A CN114126255A CN202111365769.XA CN202111365769A CN114126255A CN 114126255 A CN114126255 A CN 114126255A CN 202111365769 A CN202111365769 A CN 202111365769A CN 114126255 A CN114126255 A CN 114126255A
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- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- circuit boards
- support sleeve
- manufacturing process
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention relates to a manufacturing process of a novel high-heat-conduction high-order high-density printed circuit board, belonging to the technical field of printed circuit board manufacturing, and comprising the following specific steps of: step S1, preparing a plurality of printed circuit board blanks, and cutting the printed circuit board blanks according to the required size by using a cutting machine to obtain a plurality of required printed circuit boards; step S2, marking points needing to be punched at two ends of a plurality of required printed circuit boards, and punching the printed circuit boards by adopting a punching machine according to the marked points to form through holes; the conical support sleeve I and the conical support sleeve II are arranged to support a plurality of groups of printed circuit boards, so that the printed circuit boards are highly protected, larger gaps can be reserved for two adjacent printed circuit boards, the heat dissipation effect of the printed circuit boards is ensured, and the condition that the lower layer of the printed circuit board is damaged due to excessive pressure is avoided.
Description
Technical Field
The invention belongs to the technical field of printed circuit board manufacturing, and particularly relates to a manufacturing process of a novel high-heat-conductivity high-order high-density printed circuit board.
Background
The high-density printed circuit board is a structural element formed by an insulating material supplemented with conductor wiring. Integrated circuits, transistors, diodes, passive components (e.g., resistors, capacitors, connectors, etc.), and other various electronic components are mounted on the final product. By connecting with the conductive wire, the electronic signal connection and the function can be formed. Thus, the printed circuit board is a platform for providing component connections for receiving the contact parts.
With the increasing integration of circuit boards, all the circuit boards are connected in a laminating mode, but the connection in the laminating mode causes the defects that the circuit board positioned at the lower layer is easily crushed and the circuit board positioned at the middle part cannot dissipate heat in time, so that the invention provides a manufacturing process of a novel high-heat-conduction high-order high-density printed circuit board.
Disclosure of Invention
In order to solve the technical problems mentioned in the background technology, the invention provides a preparation process of a super heat-resistant aluminum alloy wire.
The purpose of the invention can be realized by the following technical scheme:
a manufacturing process of a novel high-heat-conduction high-order high-density printed circuit board comprises the following specific steps:
step S1, preparing a plurality of printed circuit board blanks, and cutting the printed circuit board blanks according to the required size by using a cutting machine to obtain a plurality of required printed circuit boards;
step S2, marking points needing to be punched at two ends of a plurality of required printed circuit boards, and punching the printed circuit boards by adopting a punching machine according to the marked points to form through holes;
step S3, copper plating is carried out on the inner wall of the formed through hole;
step S4, pasting an annular elastic ring on the top surface of the printed circuit board and at the outer edge of the through hole;
step S5, preparing a plurality of first conical support sleeves and a plurality of second conical support sleeves, welding one end of the first conical support sleeve with a small diameter on the top surface of the printed circuit board, enabling the center of the first conical support sleeve to correspond to the center of the through hole, and welding one end of the second conical support sleeve with a large diameter on the bottom surface of the printed circuit board, enabling the center of the second conical support sleeve to correspond to the center of the through hole;
step S6, preparing a substrate for placing the printed circuit board, welding two positioning sleeves at the corresponding positions of the through holes on the substrate, and arranging internal threads on the inner walls of the positioning sleeves;
step S7, stacking a plurality of printed circuit boards from top to bottom in sequence, contacting the conical support sleeve II positioned at the bottom of the printed circuit board at the bottommost layer with the substrate, inserting the conical support sleeve II positioned on the printed circuit board at the upper part into the conical support sleeve I positioned on the printed circuit board at the lower part, and contacting the bottom surface of the conical support sleeve II with the annular elastic ring;
and step S8, sequentially penetrating the copper pipes through the through holes on the printed circuit boards from top to bottom and connecting the copper pipes with the positioning sleeves to ensure the electric communication of the circuit layers on the printed circuit boards, and fixing the stacked printed circuit boards to finally manufacture the high-heat-conductivity high-order high-density circuit board.
Furthermore, the cutting machine is used for cutting the printed circuit board blank plate and cooling the cut part by adopting a cooling device; the temperature of the printed circuit board blank is reduced, and burrs are avoided, so that the yield of the manufacturing process is improved.
Further, the positions of the marking points for each printed circuit board in step S2 are the same.
Further, in step S5, the size of the outer surface of the tapered support sleeve is matched with the size of the inner surface of the tapered support sleeve.
Furthermore, the annular elastic ring adhered in step S4 is made of rubber, so as to reduce the damage of the tapered support sleeve to the top surface of the printed circuit board.
Further, in step S7, when the second tapered support sleeve of the upper pcb is inserted into the first tapered support sleeve of the lower pcb, a gap is reserved between the first tapered support sleeve and the upper pcb.
Further, in step S8, the bottom end of the outer surface of the copper tube is provided with an external thread adapted to the internal thread on the inner wall of the positioning sleeve.
The invention has the beneficial effects that: the conical support sleeve I and the conical support sleeve II are arranged to support a plurality of groups of printed circuit boards, so that the printed circuit boards are prevented from being contacted with each other to extrude the printed circuit board below, the printed circuit boards are highly protected, larger gaps can be reserved for two adjacent printed circuit boards on one hand, the heat dissipation effect of the printed circuit boards is ensured, and the situation that the circuit board on the lower layer is damaged due to excessive pressure is avoided on the other hand; set up the through-hole on the circuit board in the position that toper support cover one and toper support cover two correspond simultaneously, the electric intercommunication on each circuit layer of being convenient for on the one hand, the convenient circuit board that piles up is fixed on the one hand, the completion is to the design that integrates of circuit board.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a high thermal conductivity high-order high-density circuit board according to the present invention;
FIG. 2 is a partial schematic view of the invention at A in FIG. 1.
In the drawings, the components represented by the respective reference numerals are listed below:
1. a printed circuit board; 2. a through hole; 3. an annular elastic ring; 4. a first conical support sleeve; 5. a second conical support sleeve; 6. a positioning sleeve; 7. copper tubing.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, a manufacturing process of a novel high-thermal-conductivity high-order high-density printed circuit board according to the present invention includes the following steps:
step S1, preparing a plurality of printed circuit board blanks, and cutting the printed circuit board blanks according to the required size by using a cutting machine to obtain a plurality of required printed circuit boards 1; the cutting machine is used for cutting the printed circuit board blank plate and cooling the cut part by adopting a cooling device;
step S2, marking points needing to be punched at two ends of a plurality of required printed circuit boards 1, and punching the printed circuit boards 1 by adopting a punching machine according to the marked points to form through holes 2; the position of the marking performed on each printed circuit board 1 is the same.
Step S3, copper plating is carried out on the inner wall of the formed through hole 2;
step S4, pasting an annular elastic ring 3 on the top surface of the printed circuit board 1 and at the outer edge of the through hole 2; the annular elastic ring adhered in the step S4 is made of rubber, so that the damage of the conical support sleeve two 5 to the top surface of the printed circuit board 1 can be reduced.
Step S5, preparing a plurality of first conical support sleeves 4 and a plurality of second conical support sleeves 5, welding one end of the first conical support sleeve 4 with a small diameter on the top surface of the printed circuit board 1, enabling the center of the first conical support sleeve 4 to correspond to the center of the through hole 2, welding one end of the second conical support sleeve 5 with a large diameter on the bottom surface of the printed circuit board 1, and enabling the center of the second conical support sleeve 5 to correspond to the center of the through hole 2; in step S5, the size of the outer surface of the second conical support sleeve 5 is matched with the size of the inner surface of the first conical support sleeve 4.
Step S6, preparing a substrate for placing the printed circuit board 1, welding two positioning sleeves 6 at the positions corresponding to the through holes 2 on the substrate, and arranging internal threads on the inner walls of the positioning sleeves 6;
step S7, stacking a plurality of printed circuit boards 1 from top to bottom in sequence, contacting the conical support sleeve II 5 positioned at the bottom of the printed circuit board 1 at the bottom with a substrate, inserting the conical support sleeve II 5 positioned on the printed circuit board 1 above into the conical support sleeve I4 positioned on the printed circuit board 1 below, and contacting the bottom surface of the conical support sleeve II 5 with the annular elastic ring 3; in step S7, when the second tapered support sleeve 5 of the upper pcb 1 is inserted into the first tapered support sleeve 4 of the lower pcb 1, a gap is reserved between the first tapered support sleeve 4 and the upper pcb 1, and the reserved gap can ensure that the pcb 1 is not in contact with the first tapered support sleeve 4, thereby ensuring that the pcb 1 is not squeezed.
Step S8, sequentially passing the copper tubes 7 through the through holes on the printed circuit boards 1 from top to bottom, and connecting the copper tubes with the positioning sleeves 6 to ensure electrical communication of the circuit layers on the printed circuit boards 1, and fixing the stacked printed circuit boards 1, thereby finally manufacturing the high-thermal-conductivity high-order high-density circuit board. In step S8, the bottom end of the outer surface of the copper tube 7 is provided with an external thread matched with the internal thread on the inner wall of the positioning sleeve 6.
In particular practical applications
The printed circuit board 1 on any layer surface can not be pressed by the upper layer circuit board, the designed annular elastic ring 3 can buffer and absorb shock to the bottom of the conical support sleeve II 5, and the edge of the through hole 2 in the printed circuit board 1 can be protected, so that the service life of the whole high-heat-conduction high-order high-density circuit board is prolonged; meanwhile, under the action of the first conical support sleeve 4 and the second conical support sleeve 5, a larger gap can be reserved between two adjacent printed circuit boards 1, so that the stability of heat dissipation of the printed circuit boards 1 can be ensured; when any one of the circuit boards needs to be further maintained, the copper pipe 7 can be rotated, the external thread at the bottom end of the copper pipe 7 is separated from the internal thread on the inner wall of the positioning sleeve 6, so that the copper pipe 7 can be directly taken out, and then the printed circuit board 1 on the upper layer is sequentially taken down until the printed circuit board 1 needing to be maintained is exposed at the top, so that the printed circuit board can be conveniently maintained by a worker.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is merely exemplary and illustrative of the principles of the present invention and various modifications, additions and substitutions of the specific embodiments described herein may be made by those skilled in the art without departing from the principles of the present invention or exceeding the scope of the claims set forth herein.
Claims (7)
1. A manufacturing process of a novel high-heat-conduction high-order high-density printed circuit board is characterized by comprising the following steps of: the method comprises the following specific steps:
step S1, preparing a plurality of printed circuit board blanks, and cutting the printed circuit board blanks according to the required size by using a cutting machine to obtain a plurality of required printed circuit boards (1);
step S2, marking points needing to be punched on two ends of a plurality of printed circuit boards, and punching the printed circuit boards by adopting a punching machine according to the marked points to form through holes (2);
step S3, carrying out copper plating on the inner wall of the formed through hole (2);
step S4, pasting an annular elastic ring (3) on the top surface of the printed circuit board (1) and at the outer edge of the through hole (2);
step S5, preparing a plurality of first conical supporting sleeves (4) and a plurality of second conical supporting sleeves (5), and respectively welding the first conical supporting sleeves and the second conical supporting sleeves on the top surface and the bottom surface of the printed circuit board (1);
step S6, preparing a substrate, and welding two positioning sleeves (6) on the substrate;
step S7, stacking a plurality of printed circuit boards (1) from top to bottom in sequence;
and step S8, sequentially penetrating the copper pipes (7) through the through holes on the printed circuit boards (1) from top to bottom and connecting the copper pipes with the positioning sleeves (6).
2. The manufacturing process of the novel high-thermal-conductivity high-order high-density printed circuit board according to claim 1, wherein: the cutting machine is used for cutting the printed circuit board blank and cooling the cut part by adopting a cooling device.
3. The manufacturing process of the novel high-thermal-conductivity high-order high-density printed circuit board according to claim 1, wherein: in step S2, the positions of the marking points for each printed circuit board (1) are the same.
4. The manufacturing process of the novel high-thermal-conductivity high-order high-density printed circuit board according to claim 1, wherein: in step S5, the size of the outer surface of the second conical support sleeve (5) is matched with the size of the inner surface of the first conical support sleeve (4).
5. The manufacturing process of the novel high-thermal-conductivity high-order high-density printed circuit board according to claim 1, wherein: the annular elastic ring adhered in step S4 is made of rubber.
6. The manufacturing process of the novel high-thermal-conductivity high-order high-density printed circuit board according to claim 1, wherein: in step S7, when the second tapered support sleeve (5) of the upper pcb (1) is inserted into the first tapered support sleeve (4) of the lower pcb, a gap is reserved between the first tapered support sleeve (4) and the upper pcb (1).
7. The manufacturing process of the novel high-thermal-conductivity high-order high-density printed circuit board according to claim 1, wherein: and in the step S8, the bottom end of the outer surface of the copper pipe (7) is provided with an external thread matched with the internal thread on the inner wall of the positioning sleeve (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111365769.XA CN114126255B (en) | 2021-11-17 | 2021-11-17 | Novel manufacturing process of high-heat-conductivity high-order high-density printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111365769.XA CN114126255B (en) | 2021-11-17 | 2021-11-17 | Novel manufacturing process of high-heat-conductivity high-order high-density printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114126255A true CN114126255A (en) | 2022-03-01 |
| CN114126255B CN114126255B (en) | 2023-08-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111365769.XA Active CN114126255B (en) | 2021-11-17 | 2021-11-17 | Novel manufacturing process of high-heat-conductivity high-order high-density printed circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117202497A (en) * | 2023-10-24 | 2023-12-08 | 百强电子（深圳）有限公司 | Circuit board with crimping structure and manufacturing method of crimping structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108966483A (en) * | 2018-08-01 | 2018-12-07 | 四川海英电子科技有限公司 | A kind of manufacture craft of novel high thermal conductivity high-order high-density printed circuit board |
| CN208549051U (en) * | 2018-08-01 | 2019-02-26 | 四川海英电子科技有限公司 | A kind of New High Order high-density printed circuit board |
| CN214315732U (en) * | 2021-01-22 | 2021-09-28 | 杭州希山电子科技有限公司 | Multilayer high-precision printed circuit board |
-
2021
- 2021-11-17 CN CN202111365769.XA patent/CN114126255B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108966483A (en) * | 2018-08-01 | 2018-12-07 | 四川海英电子科技有限公司 | A kind of manufacture craft of novel high thermal conductivity high-order high-density printed circuit board |
| CN208549051U (en) * | 2018-08-01 | 2019-02-26 | 四川海英电子科技有限公司 | A kind of New High Order high-density printed circuit board |
| CN214315732U (en) * | 2021-01-22 | 2021-09-28 | 杭州希山电子科技有限公司 | Multilayer high-precision printed circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117202497A (en) * | 2023-10-24 | 2023-12-08 | 百强电子（深圳）有限公司 | Circuit board with crimping structure and manufacturing method of crimping structure |
| CN117202497B (en) * | 2023-10-24 | 2024-05-28 | 百强电子（深圳）有限公司 | Circuit board with crimping structure and manufacturing method thereof |
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| Publication number | Publication date |
|---|---|
| CN114126255B (en) | 2023-08-18 |
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