CN114125642A

CN114125642A - Earphone module

Info

Publication number: CN114125642A
Application number: CN202111519969.6A
Authority: CN
Inventors: 顾善勇; 王庆依
Original assignee: KING TONE INNOVATION
Current assignee: KING TONE INNOVATION
Priority date: 2021-12-13
Filing date: 2021-12-13
Publication date: 2022-03-01

Abstract

The embodiment of the invention discloses an earphone module, which comprises a shell and a sound conduction assembly arranged in the shell, wherein the sound conduction assembly comprises a loudspeaker unit, a moving iron unit and a microphone unit which are arranged on the same plane, and the loudspeaker unit, the moving iron unit and the microphone unit are electrically connected through a flexible circuit board. The shell comprises a loudspeaker sound channel and a moving iron sound channel, the loudspeaker sound channel is formed into a channel with one end facing the loudspeaker unit and the other end facing the outside of the shell and extending in a zigzag mode so as to filter high-frequency signals transmitted by the loudspeaker unit, and the moving iron sound channel is formed into a through hole with the position corresponding to the moving iron unit so as to conduct the high-frequency signals transmitted by the moving iron unit outwards. Therefore, the technical scheme of the embodiment of the invention can realize physical frequency division through the arrangement of the sound channel, thereby optimizing the hearing sense.

Description

Earphone module

Technical Field

The embodiment of the invention relates to the field of microphones, in particular to an earphone module.

Background

Most of the traditional earphones are single-unit earphones, and the single moving coil unit in the unit earphones cannot meet the requirements of audiences on the tone quality because the performance of low frequency and medium-high frequency cannot be effectively considered, so that the multi-unit earphones are gradually popularized. In the prior art, the multi-unit earphone mainly comprises a double-moving-coil unit earphone, but the structure is complex, the integration level is poor, the assembly difficulty is high, and the cost is high due to the need of additionally arranging an acoustic design.

Disclosure of Invention

In view of this, the embodiment of the present invention provides an earphone module, which has a better integration level, a compact structure and a simple process.

The earphone module of the embodiment of the invention comprises:

a housing; and

the sound conduction assembly is arranged in the shell and comprises a loudspeaker unit, a moving iron unit and a microphone unit, and the loudspeaker unit, the moving iron unit and the microphone unit are arranged on the same plane and are electrically connected with each other through a flexible circuit board;

wherein the housing comprises a speaker acoustic channel and a moving iron acoustic channel;

the loudspeaker sound channel is formed into a zigzag extending channel with one end facing the loudspeaker unit and the other end facing the outside of the shell so as to filter high-frequency signals propagated by the loudspeaker unit;

the moving iron sound channel is formed into a through hole corresponding to the moving iron unit in position so as to conduct high-frequency signals propagated by the moving iron unit outwards.

Alternatively, the speaker unit is formed as a rectangular block;

the moving iron unit and the microphone unit are arranged on two sides of the loudspeaker unit.

Optionally, the speaker unit and the microphone unit have an angle in a horizontal direction.

Optionally, the flexible circuit board is formed in a bent back shape surrounding the speaker unit.

Optionally, the flexible circuit board has first fixing portions on both sides of the moving iron unit and both sides of the microphone unit.

Optionally, the earphone module includes a bracket having a second fixing portion corresponding to the first fixing portion, and the first and second fixing portions are combined and configured to fix a position of the flexible circuit board.

Optionally, the flexible circuit board includes a bearing portion configured to bear the moving iron unit and the microphone unit.

Optionally, the bracket has a mounting hole to mount the acoustic conduction assembly.

Optionally, the plane on which the sound conduction assembly is disposed is flush with a face of the bracket having the mounting hole.

Optionally, the side of the housing having the speaker acoustic channel and the moving iron acoustic channel is opposite to the side of the bracket having the mounting hole.

The earphone module comprises a shell and a sound conduction assembly arranged in the shell, wherein the sound conduction assembly comprises a loudspeaker unit, a moving iron unit and a microphone unit which are arranged on the same plane, and the loudspeaker unit, the moving iron unit and the microphone unit are electrically connected through a flexible circuit board. The shell comprises a loudspeaker sound channel and a moving iron sound channel, the loudspeaker sound channel is formed into a channel with one end facing the loudspeaker unit and the other end facing the outside of the shell and extending in a zigzag mode so as to filter high-frequency signals transmitted by the loudspeaker unit, and the moving iron sound channel is formed into a through hole with the position corresponding to the moving iron unit so as to conduct the high-frequency signals transmitted by the moving iron unit outwards. Therefore, the technical scheme of the embodiment of the invention can realize physical frequency division through the arrangement of the sound channel, thereby optimizing the hearing, meeting the requirement of a user on the sound quality of the earphone, simplifying the assembly process of the earphone and improving the production efficiency.

Drawings

The above and other objects, features and advantages of the embodiments of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

fig. 1 is a schematic perspective view of an earphone module according to an embodiment of the present invention;

fig. 2 is an exploded view of an earphone module according to an embodiment of the present invention;

fig. 3 is a top view and a bottom view of the internal structure of the earphone module according to the embodiment of the present invention;

fig. 4 is a cross-sectional view of an earphone module according to an embodiment of the present invention taken along the plane a-a;

fig. 5 is a cross-sectional view of an earphone module according to an embodiment of the present invention taken along the plane B-B;

fig. 6 is an exploded view of the sound conducting component of the earphone module according to the embodiment of the present invention;

fig. 7 is a schematic diagram of a flexible circuit board of an earphone module according to an embodiment of the invention;

fig. 8 is a schematic view of another perspective of a stand of an earphone module according to an embodiment of the present invention;

description of reference numerals:

1-a shell; 11-loudspeaker acoustic channel; 12-moving iron acoustic channel; 2-a sound conducting component; 21-a loudspeaker unit; 22-a moving iron unit; 23-a microphone unit; 3-a flexible circuit board; 31-a first fixed part; 32-a support part; 33-a cantilever; 4-a scaffold; 41-a second fixed part; 42-mounting holes;

the sound conduction component lies in plane-I.

Detailed Description

The present invention will be described below based on examples, but the present invention is not limited to only these examples. In the following detailed description of the present invention, certain specific details are set forth. It will be apparent to one skilled in the art that the present invention may be practiced without these specific details. Well-known methods, procedures, components and circuits have not been described in detail so as not to obscure the present invention.

Further, those of ordinary skill in the art will appreciate that the drawings provided herein are for illustrative purposes and are not necessarily drawn to scale.

Unless the context clearly requires otherwise, throughout this specification, the words "comprise", "comprising", and the like are to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is, what is meant is "including, but not limited to".

In the description of the present invention, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.

Unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are intended to be inclusive and mean that, for example, they may be fixedly connected or detachably connected or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.

Fig. 1 is a schematic perspective view of an earphone module according to an embodiment of the present invention. Fig. 2 is an exploded view of an earphone module according to an embodiment of the present invention. Fig. 3 is a top view and a bottom view of the internal structure of the earphone module according to the embodiment of the present invention. As shown in fig. 1, 2 and 3, the earphone module includes a housing 1 and a sound conduction assembly 2. The sound conduction assembly 2 is disposed inside the housing 1, and includes a speaker unit 21, a moving iron unit 22, and a microphone unit 23, which are disposed on the same plane I and electrically connected to each other through the flexible circuit board 3. That is, in order to realize the integration of the earphone module, the sound conduction assembly 2 is arranged on the same plane I, so that a simple and compact structure can be realized, and unnecessary supporting structures are reduced.

In the present embodiment, the housing 1 is formed in a circular shape, the speaker unit 21 is formed in a rectangular block shape, and the moving iron unit 22 and the microphone unit 23 are provided on both sides of the speaker unit 21, that is, in a space between the speaker unit 21 and the housing 1. Among them, the speaker unit 21 formed in a rectangular shape can achieve the same performance as a larger-sized circular speaker in the case where an optimized diaphragm such as a composite diaphragm is used. Therefore, in the present embodiment, the rectangular speaker unit 21 has a smaller volume and can ensure a better sound transmission effect, so that the compactness of the internal structure of the earphone module can be improved, and the integration of the sound conduction assembly 2 is realized.

Further, the microphone unit 23 is configured to collect an ambient noise signal inside the earphone, and the speaker unit 21 is configured to play an anti-phase signal of the noise signal according to the noise signal, so as to implement a noise reduction function of the earphone module. In the conventional design, the microphone unit 23 and the speaker unit 21 are usually perpendicular to each other, so that the sound output channel of the microphone unit 23 needs to be designed separately, which results in a complicated structure of the earphone module. In this embodiment, the speaker unit 21 and the microphone unit 23 are located on the same plane I and are placed in parallel to each other, so that the structure of the earphone module is simpler while the noise reduction effect is achieved, and the production difficulty can be reduced. Alternatively, the speaker unit 21 and the microphone unit 23 may have other positional relationships, for example, have an angle in the horizontal direction, and the same noise reduction effect may be achieved.

Fig. 4 is a cross-sectional view of an earphone module according to an embodiment of the present invention taken along the plane a-a. Fig. 5 is a cross-sectional view of an earphone module according to an embodiment of the present invention, taken along the plane B-B. As shown in fig. 4 and 5, the casing 1 includes a speaker acoustic channel 11 and a moving-iron acoustic channel 12. The speaker acoustic channel 11 is formed as a passage extending in a meandering manner with one end facing the speaker unit 21 and the other end facing the outside of the housing 1, the moving-iron acoustic channel 12 is formed as a through hole at a position corresponding to the moving-iron unit 22, and both the speaker acoustic channel 11 and the moving-iron acoustic channel 12 can perform a physical frequency-dividing function.

In the present embodiment, the speaker unit 21 is used as a middle and low frequency unit, and the speaker acoustic channel 11 is formed as a channel extending inside the housing 1, and is bent twice in the process of passing from the speaker unit 21 to the outside of the housing 1. The diameter of the acoustic channel 11 of the speaker is small, and the narrow and long zigzag structure can filter out high-frequency components in the sound signal. The function is realized through the Helmholtz resonance principle, which refers to the phenomenon that air resonates in the cavity, namely the resonance wavelength in the cavity is adjusted by setting parameters such as the diameter and the length of the resonant cavity, so that a sound absorption effect is formed, and sound signals with specific wavelength are filtered. Compared with the method of dividing frequency by using circuit elements, the method can reduce phase distortion caused by the problems of element properties and the like in the circuit and further optimize the listening feeling. That is, in the present embodiment, the speaker acoustic channel 11 is formed into a resonant cavity corresponding to the resonant wavelength by setting a specific shape, so as to filter the high-frequency signal in the acoustic signal and realize physical frequency division. Optionally, the resonant cavity formed by the speaker acoustic channel 11 may be adjusted to suit the performance requirements of the earphone module.

In the present embodiment, the moving iron unit 22 is used as a high-frequency unit, the moving iron acoustic channel 12 is formed as a straight through hole corresponding to the moving iron unit 22, and the diameter of the moving iron acoustic channel 12 is large, so that the high-frequency sound signal can be transmitted outward without being damaged as much as possible, thereby protecting the high-frequency signal.

The design of the acoustic channel enables the earphone module to have an effective acoustic structure, so that the earphone module can be directly applied to earphones, the assembly process of the earphones can be simplified, the assembly efficiency and yield of the earphones are improved, a user does not need to make other acoustic designs on the earphone shell in the subsequent production process, and the acoustic signals are prevented from being leaked in the acoustic cavity of the earphone shell. In the present embodiment, the housing 1 is divided into an upper shell and a lower shell, wherein the upper shell has a speaker sound channel 11 and a moving-iron sound channel 12, which are formed as an integrated sound chamber, and the lower shell has a sealing effect. Alternatively, the lower case may be formed in a plate shape having a vent hole, and a sealing mesh cloth is attached to the inside thereof to perform a sealing effect.

Further, the earphone module further comprises a support 4. The holder 4 has a mounting hole 42 for mounting the sound conduction assembly 2. The plane I in which the sound-conducting assembly 2 is arranged is flush with the side of the holder 4 having the mounting hole 42. The surface of the casing 1 having the speaker acoustic duct 11 and the moving-iron acoustic duct 12 faces the surface of the bracket 4 having the mounting hole 42. That is, the sound conduction member 2 is disposed in the mounting hole 42 and faces the housing 1 having the speaker acoustic channel 11 and the moving-iron acoustic channel 12. It will be appreciated that the propagation of sound has a direction and therefore the acoustic signal of the acoustic conduction assembly 2 is propagated towards the side opposite thereto. When the sound conduction assembly 2 is exposed from the mounting hole 42 toward the side of the housing 1 having the speaker sound channel 11 and the moving-iron sound channel 12, the speaker sound channel 11 and the moving-iron sound channel 12 can receive the sound signals transmitted by them to the maximum extent, so as to ensure the transmission effect of the sound signals. In addition, the plane I on which the sound conduction assembly 2 is arranged is parallel to the side of the bracket 4 with the mounting hole 42, so that the sound conduction assembly 2 is not shielded by the bracket 4, and sound signals can directly spread outwards from the mounting hole 42 without loss due to collision, so that the earphone module has better sound quality.

In the present embodiment, the housing 1 has an upper case and a lower case, the holder 4 is located between the upper case and the lower case, and a mounting hole 42 is formed on a surface facing the upper case. The bracket 4 and the upper and lower cases of the case 1 may be directly coupled by providing corresponding structures at the edges. The sound conduction member 2 may be fixed in the mounting hole 42 by silicone rubber. That is, the sealing effect between the bracket 4 and the housing 1 is generated by the corresponding structure at the edge, preventing the sound signal from leaking from the edge of the housing 1. The sound conduction assembly 2 generates a sealing effect with the support 4 through the silica gel seal, so that sound is completely transmitted to the upper shell of the shell 1. Alternatively, the connection between the bracket 4 and the housing 1 may be changed, and the bracket 4 may have other structures, such as a support plate formed inside the housing 1 and fixed to the inner wall of the housing 1 by using a material such as silicone rubber to achieve a sealing effect. Alternatively, the sound conduction assembly 2 may be fixed in the mounting hole 42 by other materials capable of achieving a sealing effect, and the application is not limited herein.

Fig. 6 is an exploded view of the sound conducting component of the earphone module according to the embodiment of the present invention. Fig. 7 is a schematic diagram of a flexible circuit board of an earphone module according to an embodiment of the invention. As shown in fig. 6 and 7, the flexible circuit board 3 is formed in a bent-back shape so as to surround the speaker unit 21. The flexible circuit board 3 has first fixing portions 31 on both sides of the moving-iron unit 22 and both sides of the microphone unit 23.

Fig. 8 is a schematic view of another view angle of the support of the earphone module according to the embodiment of the invention. As shown in fig. 8, the holder 4 has a second fixing portion 41 corresponding to the first fixing portion 31, and the first fixing portion 31 and the second fixing portion 41 are combined and configured to fix the position of the flexible circuit board 3.

Further, the flexible circuit board 3 includes a holding portion 32 configured to hold the moving-iron unit 22 and the microphone unit 23. Since the sound is generated by vibration, the speaker unit 21 generates certain vibration when propagating the sound signal, which may cause the moving-iron unit 22 and the microphone unit 23 to vibrate together, thereby affecting the effect of sound signal propagation. The substrate of the flexible circuit board 3 has a good bending degree and can generate a certain elastic deformation, so that the supporting parts 32 for supporting the flexible circuit board 3 and the moving iron unit 22 and the microphone unit 23 are arranged at the positions corresponding to the flexible circuit board 3 and the moving iron unit 22, and the flexible circuit board and the microphone unit 23 can be elastically suspended in the shell 1, so that the moving iron unit 22 and the microphone unit 23 are prevented from being influenced by the vibration of the loudspeaker unit 21, the reliability of the product is effectively improved, and the service life of the element is prolonged.

That is, the flexible circuit board 3 is fixed to the bracket 4 at the first fixing portions 31 by the second fixing portions 41, and the supporting portion 32 located between the two first fixing portions 31 is in an approximately free state, and supports the moving iron unit 22 and the microphone unit 23 to cancel out the vibration caused by the speaker unit 21. Alternatively, the suspension structure may be implemented by other structures, for example, the moving iron unit 22 and the microphone unit 23 are fixed to the bracket 4 by soft glue with certain elasticity, which may also have the effect of counteracting the vibration, and the application is not limited herein.

Further, the flexible circuit board 3 further includes a cantilever 33, and the cantilever 33 is located between the first fixing portion 31 and the support portion 32, so that the support portion 32 forms a suspension effect. In the present embodiment, the four cantilevers 33 are all formed in a shape similar to a meandering wave, so that when the moving-iron unit 22 and the microphone unit 23 vibrate, a stretching deformation can be generated between the first fixing portion 31 and the supporting portion 32, thereby achieving a shock-absorbing effect and enhancing the reliability of the system. Alternatively, the shape of the cantilever 33 may be changed, for example, formed as a diamond-shaped connection structure, and may be deformed telescopically when vibrated. The four cantilevers 33 may be formed in different shapes from each other, and for example, the cantilevers 33 on both sides of the moving iron unit 22 and the cantilevers 33 on both sides of the microphone unit 23 may be formed asymmetrically, and an effect of damping vibration may be achieved.

In summary, the earphone module can be used as a product alone, can also be used inside an earphone product, as an element of an earphone, and electrically connected to other elements, and can also be used in other electronic devices.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. An earphone module, comprising:

a housing (1); and

the sound conduction assembly (2) is arranged inside the shell (1), the sound conduction assembly (2) comprises a loudspeaker unit (21), a moving iron unit (22) and a microphone unit (23), and the loudspeaker unit (21), the moving iron unit (22) and the microphone unit (23) are arranged on the same plane and are electrically connected with each other through a flexible circuit board (3);

wherein the housing (1) comprises a loudspeaker acoustic channel (11) and a moving iron acoustic channel (12);

the loudspeaker acoustic channel (11) is formed as a zigzag extending channel with one end facing the loudspeaker unit (21) and the other end facing the outside of the housing (1) to filter high frequency signals propagating from the loudspeaker unit (21);

the moving iron sound channel (12) is formed into a through hole corresponding to the moving iron unit (22) in position so as to conduct high-frequency signals propagated by the moving iron unit (22) outwards.

2. A headset module according to claim 1, characterized in that the speaker unit (21) is formed as a rectangular block;

a moving iron unit (22) and a microphone unit (23) are provided on both sides of the speaker unit (21).

3. The earphone module of claim 1 wherein the speaker unit (21) and the microphone unit (23) are angled horizontally.

4. Earphone module according to claim 2, characterized in that the flexible circuit board (3) is formed in a bent-back shape surrounding the speaker unit (21).

5. The earphone module according to claim 4, wherein the flexible circuit board (3) has first fixing portions (31) on both sides of the moving-iron unit (22) and both sides of the microphone unit (23).

6. The earphone module according to claim 5, characterized in that it comprises a holder (4), the holder (4) having a second fixing portion (41) corresponding to the first fixing portion (31), the first fixing portion (31) and the second fixing portion (41) in combination being configured to fix the position of the flexible circuit board (3).

7. The earphone module according to claim 6, characterized in that the flexible circuit board (3) comprises a bearing (32), the bearing (32) being configured to bear the moving-iron unit (22) and the microphone unit (23).

8. The earphone module according to claim 6, wherein the holder (4) has a mounting hole (42) for mounting the sound-conducting component (2).

9. Earphone module according to claim 8, characterized in that the plane in which the sound-conducting component (2) is arranged is flush with the side of the holder (4) having the mounting hole (42).

10. The earphone module according to claim 8, wherein the side of the housing (1) having the speaker acoustic channel (11) and the moving iron acoustic channel (12) is opposite to the side of the holder (4) having the mounting hole (42).