CN114093966A - Photovoltaic module, installation method thereof and photovoltaic building integrated piece - Google Patents

Photovoltaic module, installation method thereof and photovoltaic building integrated piece Download PDF

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CN114093966A
CN114093966A CN202111475125.6A CN202111475125A CN114093966A CN 114093966 A CN114093966 A CN 114093966A CN 202111475125 A CN202111475125 A CN 202111475125A CN 114093966 A CN114093966 A CN 114093966A
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hot
photovoltaic module
melt layer
photovoltaic
layer
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施正荣
汤嘉鸿
王伟力
练成荣
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Shangmai Zhenjiang New Energy Technology Co ltd
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Shangmai Zhenjiang New Energy Technology Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
    • E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
    • E04B1/62—Insulation or other protection; Elements or use of specified material therefor
    • E04B1/66—Sealings
    • E04B1/665—Sheets or foils impervious to water and water vapor
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04D—ROOF COVERINGS; SKY-LIGHTS; GUTTERS; ROOF-WORKING TOOLS
    • E04D13/00—Special arrangements or devices in connection with roof coverings; Protection against birds; Roof drainage; Sky-lights
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04D—ROOF COVERINGS; SKY-LIGHTS; GUTTERS; ROOF-WORKING TOOLS
    • E04D5/00—Roof covering by making use of flexible material, e.g. supplied in roll form
    • E04D5/10—Roof covering by making use of flexible material, e.g. supplied in roll form by making use of compounded or laminated materials, e.g. metal foils or plastic films coated with bitumen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S20/00—Supporting structures for PV modules
    • H02S20/20—Supporting structures directly fixed to an immovable object
    • H02S20/22—Supporting structures directly fixed to an immovable object specially adapted for buildings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B10/00—Integration of renewable energy sources in buildings
    • Y02B10/10—Photovoltaic [PV]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B10/00—Integration of renewable energy sources in buildings
    • Y02B10/20—Solar thermal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Civil Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Photovoltaic Devices (AREA)
  • Roof Covering Using Slabs Or Stiff Sheets (AREA)

Abstract

The invention discloses a photovoltaic assembly, an installation method thereof and a photovoltaic building integrated piece, wherein a component hot melting layer is arranged on the back surface of the photovoltaic assembly, and the component hot melting layer at least covers the long edge and/or the short edge of the back surface of the photovoltaic assembly, or a frame hot melting layer is arranged on the outer surface of at least part of a frame positioned on the back surface of the photovoltaic assembly; the component hot melting layer or the frame hot melting layer is used for being combined with a base surface hot melting layer on an installation base surface into a whole through a hot melting combination process; the component hot melt layer, the frame hot melt layer and/or the base surface hot melt layer are made of thermoplastic polymers; compared with the conventional bonding scheme, the invention has the advantages of obviously more excellent stripping force performance, simple and convenient construction process and low construction cost.

Description

Photovoltaic module, installation method thereof and photovoltaic building integrated piece
Technical Field
The invention relates to the field of photovoltaic installation, in particular to a photovoltaic module and an installation method thereof, and also relates to a photovoltaic building integrated piece applying the installation method, which is particularly suitable for installation of light photovoltaic modules.
Background
The current mainstream photovoltaic module is generally packaged by glass, so that the weight per unit area of the photovoltaic module is large, and when the photovoltaic module is applied and installed on the roof of a building, particularly the roof of a house in an industrial and commercial plant, the problem of insufficient load bearing can be generally existed. In order to solve the technical problem, roots need to be generated on the building roof to damage the roof water resistance in order to realize reliable installation, and therefore the scheme of the light-weight packaging photovoltaic module is generated. The light packaged photovoltaic module can be installed through a mechanical structure, and at present, the light packaged photovoltaic module is installed with a building roof in an integrated manner by adopting an adhesive bonding mode in order to not increase roof load too much and not damage roof waterproofness.
However, the applicant has found that, after application in depth, the adhesive-bonded mounting also has some disadvantages: a. the building roof is made of multiple types of materials, the bonding effect of conventional glue and the building roof is unreliable, and particularly, a silica gel adhesive commonly used for a photovoltaic module is low in peeling strength and poor in compatibility with a waterproof coiled material, so that a plasticizer in the waterproof coiled material is separated out to generate catalysis, and therefore, at present, a technology for researching, developing and optimizing the adhesive is available; b. custom development of adhesives and high labor costs.
Therefore, the applicant determines to seek a technical scheme to solve the above technical problems based on the research of the installation and application fields of the photovoltaic modules for years, and further strongly promotes the development process of the integrated photovoltaic building.
Disclosure of Invention
In view of the above, the present invention aims to provide a photovoltaic module, a mounting method thereof, and a photovoltaic building integrated member, which have significantly better peel force performance than the conventional bonding scheme, and are simple and convenient in construction process and low in construction cost.
Although in the prior art: for convenience of lamination, the photovoltaic module is often provided with an EVA film layer inside, however, the purpose of their arrangement is to achieve good encapsulation protection of the photovoltaic cell string; in order to realize the electric connection between the photovoltaic cell strings, a welding connection mode is adopted; the prior art generally considers that the photovoltaic module needs to be installed on a base surface through a mechanical structural member after the lamination packaging is completed, for the light photovoltaic module, the installation on the base surface is realized through an adhesion mode, and the technical suggestion of installing the photovoltaic module through a welding mode is not adopted.
The research and development team of the applicant is continuously dedicated to developing innovative installation schemes for achieving higher quality and rapidness aiming at the light photovoltaic module, and after a large number of practical cases are accumulated in the installation application field of the light photovoltaic module, the inventor surprisingly finds that if the photovoltaic module is installed by adopting a welding mode instead of a bonding mode, the stripping force performance of the photovoltaic module on an installation base plane can be greatly improved, and the zero-space effect between the photovoltaic module and the installation base plane can be achieved.
The applicant has further found that in order to facilitate the weather resistance, one generally chooses to provide a weather-resistant fluorine-containing layer, such as PVDF sheets, PVF sheets, etc., on the outer surface of the photovoltaic module backsheet, which is difficult to perform heat welding due to the high melting point of the fluorine-containing material. By combining the current technical situation, the applicant finally provides the application of the invention after a large amount of experimental investigation and test verification.
The technical scheme adopted by the invention is as follows:
a photovoltaic module is provided with a module hot melt layer on the back surface, the module hot melt layer at least covers the long edge and/or the short edge of the back surface of the photovoltaic module where the module hot melt layer is located, and the module hot melt layer is used for being compounded with a base surface hot melt layer on an installation base surface into a whole through a hot melt compounding process; the component hot melt layer and/or the base surface hot melt layer are made of thermoplastic polymers.
A photovoltaic assembly comprises a frame positioned around the photovoltaic assembly, wherein a frame hot melting layer is arranged on the outer surface of at least part of the frame positioned on the back side of the photovoltaic assembly, and the frame hot melting layer is used for being combined with a base surface hot melting layer positioned on an installation base surface into a whole through a hot melting compounding process; the frame hot melt layer and/or the base surface hot melt layer are made of thermoplastic polymers.
Preferably, the melting point of the thermoplastic polymer is in the range of 100-400 ℃.
Preferably, the thermoplastic polymer has a melt index in the range of 0.1 to 60g/10min at 190 ℃/2.16kg under test conditions according to ASTM D1238-2010.
Preferably, the thermoplastic polymer is selected from any one or a mixture of polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyformaldehyde, polycarbonate, polyamide, acrylic plastics, polyolefin plastics, polysulfone and polyphenyl ether.
Preferably, the thermoplastic polymer is added with an ageing-resistant auxiliary agent accounting for not less than 0.2 wt% of the weight of the thermoplastic polymer, and/or a weather-resistant coating is arranged on the surface of the photovoltaic back plate which is not covered by the component hot-melt layer or the frame hot-melt layer, so that the weather-resistant effect of the photovoltaic back plate is improved.
Preferably, the method for installing the photovoltaic module comprises the following operation steps:
s10), placing the photovoltaic module with the back surface provided with the module hot melt layer or the frame hot melt layer above the base surface hot melt layer;
s20), taking the hot melting layers positioned on the long side and/or the short side of the back of the photovoltaic module and the base surface hot melting layers corresponding to the hot melting layers as target welding areas, and heating the target welding areas through a welding tool to melt the hot melting layers positioned in the target welding areas;
s30), pressurizing the target welding area, so that the hot melt layers positioned in the target welding area are hot melt compounded into a whole, and the photovoltaic module is installed.
Preferably, the welding tool adopts a hot air heating mode, and the target welding area is heated through a hot air nozzle of the welding tool; and/or pressurizing the photovoltaic module by the bonding tool.
Preferably, the welding temperature is above the melting point of the thermoplastic polymer; and/or the pressurization range is 0.01-0.6 Mpa; and/or the ratio of the area of the target welding area to the area of the back of the photovoltaic module is 1: 50-1: 3.
preferably, the photovoltaic module is installed on a building base surface by the installation method, and the base surface hot melting layer is a waterproof coiled material fixedly installed on the building base surface.
It should be noted that the installation base surface related to the present application may be any type of building base surface or non-building base surface, and the base surface may be provided with an insulation board or a waterproof roll or other functional layers, and the present application is not particularly limited in implementation.
The photovoltaic module is installed by creatively introducing a hot-melt compounding process, and only a hot-melt layer is required to be arranged on the back surface of the photovoltaic module or the back surface of a photovoltaic module frame during actual installation and implementation, and the hot-melt layer and a base surface hot-melt layer fixedly positioned on an installation base surface are directly subjected to integrated compounding molding through the hot-melt layer through the hot-melt compounding process, so that the photovoltaic module is installed on the base surface; compared with the conventional bonding scheme, the photovoltaic module mounting scheme obtained through the application has the advantages of obviously more excellent peeling force performance, simple and convenient construction process and low construction cost.
Drawings
Fig. 1 is a schematic structural view of a photovoltaic module backsheet in example 1 of the present invention (black marks in the figure represent a soldering region a1 on the back side of the photovoltaic module);
fig. 2 is a schematic structural view of a photovoltaic module backsheet in example 2 of the present invention (black marks in the figure represent a soldering region a2 on the back side of the photovoltaic module);
fig. 3 is a schematic structural view of a photovoltaic module backsheet in example 3 of the present invention (black marks in the figure represent a soldering region a3 on the back side of the photovoltaic module);
fig. 4 is a schematic view of a photovoltaic module in accordance with embodiments 1 to 3 of the present invention in a state of a structure where soldering mounting is performed;
fig. 5 is a schematic structural view of a photovoltaic module in example 4 of the present invention (black marks in the figure represent a welding area b1 on the back of the frame);
fig. 6 is a schematic structural view of a photovoltaic module in example 5 of the present invention (black marks in the figure represent a welding area b2 on the back side of the frame);
fig. 7 is a schematic view of a photovoltaic module in accordance with example 4-5 of the present invention in a state of a soldering installation;
FIG. 8 is a photograph showing the state of the process in which the experimenter performs welding and installation on the base hot melt layer of the photovoltaic module sample by using the hot air creeping welder in embodiment 1 of the present invention;
FIG. 9 is a photograph of a sample of a photovoltaic module obtained in example 1 of the present invention after soldering and mounting;
fig. 10 is a photograph of a sample of the photovoltaic module of fig. 9 after solder mounting has been completed.
Detailed Description
The embodiment of the invention discloses a photovoltaic module, wherein a module hot melting layer is arranged on the back surface of the photovoltaic module, the module hot melting layer at least covers the long edge and/or the short edge of the back surface of the photovoltaic module where the module hot melting layer is arranged, and the module hot melting layer is used for being compounded with a base surface hot melting layer on an installation base surface into a whole through a hot melting compounding process; the component hot melt layer and/or the base surface hot melt layer are made of thermoplastic polymers.
The embodiment of the invention also discloses a photovoltaic assembly, which comprises a frame positioned around the photovoltaic assembly, wherein the outer surface of at least part of the frame positioned on the back side of the photovoltaic assembly is provided with a frame hot melting layer, and the frame hot melting layer is used for being compounded with a base surface hot melting layer positioned on an installation base surface into a whole through a hot melting compounding process; the frame hot melt layer and/or the base surface hot melt layer are made of thermoplastic polymers.
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1: please refer to fig. 1 and 4 in combination, aThe photovoltaic module 1 comprises a front plate, a photovoltaic cell string and a back plate which are packaged into a whole through lamination; the photovoltaic module 1 proposed in the present embodiment is a lightweight photovoltaic module, and particularly preferably, the weight of the photovoltaic module 1 does not exceed 3.5kg/m2(ii) a Of course, the photovoltaic module with larger weight may be selectively installed according to actual needs, which is not particularly limited in this embodiment; the front plate and the back plate of the photovoltaic module can adopt the photovoltaic module packaging material technology previously proposed by the applicant: CN201610685536.0, CN201610685240.9, and CN201610927464.6, thin and light in weight, are very preferred lightweight photovoltaic module products; of course, light photovoltaic module products with other packaging schemes may also be adopted, and the backsheet 10a in this embodiment may also adopt a conventionally known backsheet (which may be a single-layer structure or a multi-layer composite structure, and this embodiment is not limited to this); any known cell is used as the cell used in the photovoltaic module 1, and this embodiment is not particularly limited thereto.
In the present embodiment, the outer surface of the back plate 10a (i.e. the back surface of the photovoltaic module 1) is provided with the module hot melt layer 11a, preferably, in the present embodiment, the module hot melt layer 11a may be directly a part of the back plate 10a, and is directly prepared and formed at one time through the encapsulation and lamination process of the photovoltaic module 1, so that the integral forming effect is good and the production efficiency is high; in other embodiments, as a less preferred embodiment, the module hot melt layer 11a may be fabricated separately after the photovoltaic module 1 is laminated (specifically, hot melt composite welding may also be adopted).
In the present embodiment, the assembly hot melt layer 11a is used to be integrated with the base hot melt layer 2 on the mounting base by a hot melt compounding process; both the assembly hotmelt layer 11a and the base hotmelt layer 2 are made of thermoplastic polymers.
Preferably, to ensure that the melting point range of the thermoplastic polymer of this embodiment is 100-400 ℃, more preferably: 120 ℃ and 350 ℃; and/or the thermoplastic polymer has a melt index in the range of 0.1 to 60g/10min at 190 ℃/2.16kg according to ASTM D1238-2010; more preferably 0.5-50g/10min, and even more preferably 0.8-40g/10min, has good hot-melt property, and meanwhile, the fluidity during melting is not too violent, so that good compounding is realized conveniently; specifically, the thermoplastic polymer is selected from any one or a mixture of several of polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyoxymethylene, polycarbonate, polyamide, acrylic plastic, polyolefin plastic, polysulfone and polyphenylene oxide, and other thermoplastic polymer materials with good hot-melt compounding characteristics can be adopted to make the hot-melt layer in the embodiment; the present example is not particularly limited solely to the particular thermoplastic polymer actually employed; particularly preferably, in the present embodiment, the assembly hot melt layer 11a is made of polyethylene (melting point is about 130 ℃, and melt index is about 4g/10 min), and the base hot melt layer 2 directly adopts a known TPO waterproof roll (i.e. a thermoplastic polyolefin waterproof roll);
in the present application, the materials of the assembly hot-melt layer 11a and the base hot-melt layer 2 may be the same or different, and they may be in a range that can be variously implemented as long as they have hot-melt plasticity.
Since the weather resistance of the thermoplastic polymer itself generally cannot satisfy the encapsulation requirement of the photovoltaic module, in order to improve the weather resistance of the module hot-melt layer in the present embodiment, it is preferable that at least the thermoplastic polymer used for preparing the module hot-melt layer 11a is added with an aging resistance assistant in an amount of not less than 0.2 wt% in terms of its weight part, more preferably not less than 0.5 wt%, and particularly preferably 1 to 3 wt%; the aging-resistant assistant may be a known antioxidant, an ultraviolet-resistant assistant, an aging-resistant assistant, and the like, and is not particularly limited in this embodiment.
When the method is implemented, the thicknesses of the component hot melt layer 11a and the base surface hot melt layer 2 are respectively selected according to actual requirements; preferably, in the present embodiment, the thickness of the module hot melt layer 11a ranges from 0.05 to 5mm, more preferably from 0.1 to 2mm, still more preferably from 0.2 to 1 mm; the thickness range of the base surface hot melt layer 2 is 0.5-10mm, and more preferably 1-5 mm; in order to further facilitate the effect of the hot-melt composite mounting and the mounting efficiency, the applicant suggests that the thickness of the base hot-melt layer 2 is not less than the thickness of the component hot-melt layer 11 a.
Referring to fig. 4, fig. 8, fig. 9 and fig. 10 in further combination, in the installation method of the photovoltaic module 1 according to the present embodiment, the operation steps of the hot-melt lamination process include:
s10), placing the photovoltaic module 1 of the embodiment above the base surface hot melt layer 2;
s20), taking the assembly hot melt layers 11a positioned on the periphery of the back of the photovoltaic assembly 1 and the base surface hot melt layer 2 corresponding to the assembly hot melt layers as target welding areas, and heating the target welding areas through a welding tool to melt the hot melt layers 11a and 2 positioned in the target welding areas; in order to improve the soldering efficiency while ensuring the soldering quality, it is particularly preferable that, in the present embodiment, the ratio of the area of the target soldering region to the area of the back surface of the photovoltaic module 1 is 1: 50-1: 3, more preferably 1: 20-1: 3, more preferably 1: 10-1: 5; the welding tool adopts a hot air climbing welding machine 3 (which can be directly purchased from the market and is provided with a movable roller at the bottom), the hot air climbing welding machine 3 (shown in figure 8) welds a target welding area in a hot air heating mode, and specifically, a hot air nozzle 31 of the hot air climbing welding machine can extend into a gap 4 of the target welding area to implement hot air heating; the welding temperature is higher than the melting point of the thermoplastic polymer, specifically in the embodiment, the welding temperature is set at 300-;
s30), pressurizing the target welding area in a mode of displacing the photovoltaic module 1 through the hot air creeping welder 3, so that the hot melt layers 11a and 2 positioned in the target welding area are hot-melt compounded into a whole, and the installation of the photovoltaic module 1 is completed.
In other embodiments, the welding tool may also be a hot air manual welding gun, or may also be a welding tool of other heating methods, which is not limited in this embodiment, wherein a pressurizing tool may be specially provided to implement the heating function, and the applicant suggests that a preferred pressurizing range is 0.01-0.6Mpa, which is beneficial to quickly complete hot-melt compounding in the target welding area.
The embodiment also provides a photovoltaic building integrated piece, the photovoltaic module is mounted on a building base (not shown in the figure, as a mounting base, specifically, a roof or a curtain wall) by using the above mounting method, and the base hot melt layer 2 (i.e., a TPO waterproof roll) is fixedly mounted on the building base by a fastener or other known means.
It should be particularly noted that, when the photovoltaic module 1 is installed, the base hot-melt layer 2 related to this embodiment may be fixed on an installation base in advance, or may be laid on the installation base in advance, to complete the fixed installation of the photovoltaic module 1 and the base hot-melt layer 2, or the photovoltaic module 1 may be installed with the base hot-melt layer 2 according to this embodiment to obtain the base hot-melt layer 2 welded photovoltaic module 1, and then the base hot-melt layer 2 welded photovoltaic module 1 is integrally installed on the installation base, which are implementation modes that can be changed according to actual needs, and do not affect the core technical effect of this application.
In the bonding scheme in the prior art, the height difference exists between the photovoltaic module and the building roof due to the fact that the adhesive is not uniformly coated on the back face of the photovoltaic module, the photovoltaic module in a partial area is overhead, and hidden cracks are easily generated on the photovoltaic module after constructors step on the photovoltaic module in the subsequent operation and maintenance process. In this embodiment 1, the module hot melt layer 11a is directly disposed on the back plate of the photovoltaic module 1, so that the photovoltaic module 1 and the installation base surface (specifically, the base surface hot melt layer 2) can be directly attached to each other, and the problem that the photovoltaic module 1 is likely to crack during subsequent maintenance due to a height difference is avoided.
In order to verify the implementation effect of the embodiment 1, the following comparative example 1 is specifically provided in the present application:
comparative example 1: the other technical solutions of comparative example 1 are the same as those of example 1, except that in comparative example 1, the back surface of the photovoltaic module is not provided with a module hot-melt layer, and the photovoltaic module and the base hot-melt layer (i.e., TPO) waterproof roll layer are compounded into a whole in a structural adhesive bonding mode.
Referring to GB2792-2014, the applicant performed a peeling force comparison test on the photovoltaic modules provided in example 1 and comparative example 1 respectively (the peeling force test described in the present application refers to specifically peeling the back surface of the photovoltaic module from the base hot melt layer), and the test results are: the peel strength of example 1 was 80N/cm, and that of comparative example 1 was 30N/cm.
Example 2: the remaining technical solutions of this embodiment 2 are the same as those of embodiment 1, except that please refer to fig. 2 further, in order to ensure the weather-resistant encapsulation effect of the photovoltaic module and not affect the hot-melt composite effect of the module hot-melt layer 11a of this embodiment, in this embodiment 2, a weather-resistant coating 11b is further disposed on the surface of the photovoltaic back sheet 10b that is not covered by the module hot-melt layer 11a, in this embodiment 2, a fluorine-containing coating may be specifically used to improve the weather-resistant effect of the photovoltaic back sheet 10b, in other embodiments, other weather-resistant coatings may also be used, which is not limited in this application.
Example 3: the remaining technical solutions of this embodiment 3 are the same as those of embodiment 1, except that please refer to fig. 3, in this embodiment 3, the module hot melt layer does not cover the entire back surface of the photovoltaic back panel 10c, and only the periphery (i.e., the long side and the short side) of the back surface of the photovoltaic back panel 10c is covered with the module hot melt layer 11c in a closed shape; similarly, referring to example 1, the module hot melt layer 11c of this embodiment may be manufactured by a single step directly through an encapsulation lamination process of a photovoltaic module, or in other embodiments, after the photovoltaic module is laminated, the module hot melt layer may be manufactured separately.
Referring to GB2792-2014, the applicant performed a peel force comparison test on the photovoltaic module provided in example 3, and the detection result is: the peel strength of example 3 was 72N/cm.
Example 4: in the remaining technical solutions of this embodiment 4, the photovoltaic module includes a front board, a photovoltaic cell string, and a back board, which are packaged into a whole by lamination, and the front board and the back board all adopt known structures, but please refer to fig. 5 and fig. 7 in a further combination manner, in this embodiment 4, a module hot-melt layer is not disposed on an outer surface of the back board, wherein the photovoltaic module 1 'further includes a frame 20 (which may specifically be an aluminum frame or other metal frame or other material frame) located around the photovoltaic module, a frame hot-melt layer 21a (which may specifically be an adhesive or other suitable fixing means) is disposed on an outer surface of the frame 20 located on a back side of the photovoltaic module 1', and the frame hot-melt layer 21a is used for being combined with the hot-melt base layer 2 located on an installation base into a whole by a hot-melt combining process; the material of the frame hot melt layer 21a can be similar to the component hot melt layer 11a in example 1.
In order to verify the implementation effect of the embodiment 4, the following comparative example 2 is specifically provided in the present application:
comparative example 2: the other technical solutions of the comparative example 2 are the same as those of the embodiment 4, except that in the comparative example 2, the frame hot melt layer 21a is not disposed on the outer surface of the frame 20 located on the back surface of the photovoltaic module 1', and the frame hot melt layer and the base hot melt layer 2 (i.e., the TPO waterproof roll layer) are combined into a whole in a structural adhesive bonding manner.
Referring to GB2792-2014, the applicant performed a peel force comparison test on the photovoltaic modules provided in example 4 and comparative example 2, respectively, and the test results were: the peel strength of example 4 was 60N/cm, and that of comparative example 2 was 25N/cm.
Example 5: the remaining technical solutions of this embodiment 5 are the same as those of embodiment 4, except that in this embodiment 5, the material of the frame 20 'is the thermoplastic polymer as described in embodiment 1, and the outer surface of the frame 20' located on the back side of the photovoltaic module is the frame hot melt layer 21 b.
Referring to GB2792-2014, the applicant performed a peel force comparison test on the photovoltaic module provided in example 5, and the detection result is: the peel strength of example 5 was 68N/cm.
Example 6: the remaining technical solutions of this embodiment 6 are the same as any one of embodiments 1 to 5, except that in this embodiment 6, the assembly hot-melt layer or the frame hot-melt layer is made of polyethylene.
Example 7: the remaining technical solutions of this embodiment 7 are the same as any one of embodiments 1 to 5, except that in this embodiment 7, the assembly hot-melt layer or the frame hot-melt layer is made of polyvinyl chloride.
Example 8: the remaining technical solutions of this embodiment 8 are the same as any one of embodiments 1 to 5, except that in this embodiment 8, the assembly hot-melt layer or the frame hot-melt layer is made of polystyrene.
Example 9: the remaining technical solution of this embodiment 9 is the same as any one of embodiments 1 to 5, except that in this embodiment 9, the module hot-melt layer or the frame hot-melt layer is made of TPO (polyolefin plastic).
Example 10: the remaining technical solutions of this embodiment 10 are the same as any one of embodiments 1 to 5, except that in this embodiment 10, the assembly hot-melt layer or the frame hot-melt layer is made of polycarbonate.
Example 11: the remaining technical solutions of this embodiment 11 are the same as any one of embodiments 1 to 5, except that in this embodiment 11, the component hot-melt layer or the frame hot-melt layer is made of polyoxymethylene.
Example 12: the remaining technical means of this example 12 is the same as any one of examples 1 to 5, except that in this example 12, the assembly hot-melt layer or the frame hot-melt layer is made of polyphenylene ether.
Example 13: the remaining technical solutions of this embodiment 13 are the same as any one of embodiments 1 to 5, except that in this embodiment 13, the assembly hot-melt layer or the frame hot-melt layer is made of polysulfone.
Example 14: the remaining technical solution of this example 14 is the same as any one of examples 1 to 5, except that in this example 14, the module hot-melt layer or the frame hot-melt layer is made of polyamide.
Example 15: the remaining technical solutions of this embodiment 15 are the same as any one of embodiments 1 to 5, except that in this embodiment 15, the assembly hot-melt layer or the frame hot-melt layer is made of acrylic plastic.
Example 16: the remaining technical solution of this example 16 is the same as any one of examples 1 to 15, except that in this example 16, an EVA (ethylene vinyl acetate copolymer) waterproof roll layer is used as the base surface hot melt layer.
Example 17: the remaining technical solution of this example 17 is the same as any one of examples 1 to 15, except that in this example 17, a polyvinyl chloride waterproof roll layer is used as the base hot-melt layer.
Example 18: the remaining technical solution of this example 18 is the same as any one of examples 1 to 15, except that in this example 18, a polyethylene waterproof roll layer is used as the base hot-melt layer.
Example 19: the remaining technical solution of this example 19 is the same as any one of examples 1 to 15, except that in this example 19, a polypropylene waterproof roll layer is used as the base surface hot-melt layer.
Example 20: the remaining technical solution of this example 20 is the same as any one of examples 1 to 15, except that in this example 20, the polypropylene layer is used as the base hot-melt layer, and the mounting base is a non-building base.
Example 21: the remaining technical solutions of this embodiment 21 are the same as those of embodiment 3, except that in this embodiment 21, a plurality of module hot-melt layer units are only disposed on the long side or the short side (when the lengths of the long side and the short side are equal, at least two peripheries that are parallel and opposite may be directly selected) of the back surface of the photovoltaic backplane in a covering manner, and the module hot-melt layer may be in a linear shape or in other shapes as long as it is convenient to perform a hot-melt lamination process subsequently.
Referring to GB2792-2014, the applicant performed a peel force comparison test on the photovoltaic modules provided in examples 6-21 above, and found that: the peel strengths of examples 6 to 21 were all 60N/cm or more, and the peel strength was as high as about 100N/cm.
Example 22: the remaining technical solutions of this embodiment 22 are the same as those of embodiment 4, except that in this embodiment 22, a frame hot-melt layer is only disposed on the long side or the short side of the outer surface of the frame (i.e., a part of the outer surface of the frame, and when the lengths of the long side and the short side are equal, at least two peripheries that are parallel and opposite may be directly selected) on the back surface of the photovoltaic module.
Referring to GB2792-2014, the applicant performed a peel force comparison test on the photovoltaic modules provided in examples 6-22 above, and found that: the peel strengths of examples 6 to 22 were all 60N/cm or more, and the peel strength was as high as about 100N/cm.
And the stripping force of the conventional photovoltaic module bonded by using structural adhesive or adhesive tape is between 10 and 40N/cm.
The embodiment creatively introduces the hot-melt compounding process to realize the installation of the photovoltaic assembly, and during the actual installation and implementation, only the hot-melt layer needs to be arranged on the back of the photovoltaic assembly or the back of the photovoltaic assembly frame, and the integral compound molding is realized directly through the hot-melt layer and the base surface hot-melt layer fixedly positioned on the installation base surface through the hot-melt compounding process, so that the installation of the photovoltaic assembly on the base surface is completed; the photovoltaic module installation scheme obtained through this embodiment has obvious more excellent peel force performance for conventional bonding scheme, and the work progress is simple convenient moreover, and construction cost is low.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (10)

1. A photovoltaic module is characterized in that a module hot melt layer is arranged on the back of the photovoltaic module and at least covers the long edge and/or the short edge of the back of the photovoltaic module where the module hot melt layer is located, and the module hot melt layer is used for being compounded with a base surface hot melt layer located on an installation base surface into a whole through a hot melt compounding process; the component hot melt layer and/or the base surface hot melt layer are made of thermoplastic polymers.
2. A photovoltaic assembly comprises a frame positioned around the photovoltaic assembly, and is characterized in that the outer surface of at least part of the frame positioned on the back side of the photovoltaic assembly is provided with a frame hot melting layer, and the frame hot melting layer is used for being compounded with a base hot melting layer positioned on an installation base into a whole through a hot melting compounding process; the frame hot melt layer and/or the base surface hot melt layer are made of thermoplastic polymers.
3. The photovoltaic module of claim 1 or 2, wherein the thermoplastic polymer has a melting point in the range of 100-400 ℃.
4. The photovoltaic module of claim 1 or 2, wherein the thermoplastic polymer has a melt index in the range of 0.1 to 60g/10min at 190 ℃/2.16kg test conditions according to ASTM D1238-2010.
5. A photovoltaic module according to claim 1 or 2, wherein the thermoplastic polymer is selected from any one or a mixture of polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyoxymethylene, polycarbonate, polyamide, acrylic plastic, polyolefin plastic, polysulfone and polyphenylene oxide.
6. The photovoltaic module according to claim 1 or 2, wherein the thermoplastic polymer is added with an aging-resistant auxiliary agent in an amount of not less than 0.2 wt% based on the weight of the thermoplastic polymer, and/or a weather-resistant coating is provided on the surface of the photovoltaic back sheet not covered by the module hot-melt layer or the frame hot-melt layer for improving the weather-resistant effect of the photovoltaic back sheet.
7. A method of mounting a photovoltaic module according to any of claims 1 to 6, wherein the steps of the hot melt lamination process include:
s10), placing the photovoltaic module with the back surface provided with the module hot melt layer or the frame hot melt layer above the base surface hot melt layer;
s20), taking the hot melting layers positioned on the long side and/or the short side of the back of the photovoltaic module and the base surface hot melting layers corresponding to the hot melting layers as target welding areas, and heating the target welding areas through a welding tool to melt the hot melting layers positioned in the target welding areas;
s30), pressurizing the target welding area, so that the hot melt layers positioned in the target welding area are hot melt compounded into a whole, and the photovoltaic module is installed.
8. The mounting method according to claim 7, wherein the welding tool is heated by hot air, and the target welding area is heated by a hot air nozzle of the welding tool; and/or pressurizing the photovoltaic module by the bonding tool.
9. The mounting method of claim 7, wherein the welding temperature is above the melting point of the thermoplastic polymer; and/or the pressurization range is 0.01-0.6 Mpa; and/or the ratio of the area of the target welding area to the area of the back of the photovoltaic module is 1: 50-1: 3.
10. a photovoltaic building monolith characterized in that a photovoltaic module is mounted on a building base by the mounting method as claimed in claim 8 or 9, said base hot melt layer being a waterproof roll fixedly mounted on said building base.
CN202111475125.6A 2021-12-03 2021-12-03 Photovoltaic module, installation method thereof and photovoltaic building integrated piece Pending CN114093966A (en)

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