CN114092342A - Dynamic correction method for chip appearance, electronic device and readable storage medium - Google Patents
Dynamic correction method for chip appearance, electronic device and readable storage medium Download PDFInfo
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Abstract
The invention provides a dynamic correction method of chip appearance, an electronic device and a readable storage medium, wherein the method comprises the following steps: continuously shooting a plurality of gray level images for the same wafer, wherein a plurality of crystal grains are distributed on the wafer; acquiring at least one image from a plurality of continuously shot gray level images, and processing the image to form a check image; uniformly extending outwards from the center of the verification image to obtain a verification area; acquiring a check value corresponding to each check position according to the gray value of each pixel point in the check area; and checking each crystal grain according to the check value and/or checking a preset area of each crystal grain, and confirming whether the currently detected crystal grain is a defective product or not according to the result. The invention is corresponding to each detection crystal grain, and needs to sequentially extract the check image, and after the check area is selected, an independent check value is formed for each wafer case; and the check value is used for carrying out clamping control on the excellence of the crystal grain, so that the clamping control precision of the excellence of the crystal grain is improved.
Description
Technical Field
The invention relates to the field of medical equipment imaging, in particular to a dynamic correction method of chip appearance, electronic equipment and a readable storage medium.
Background
In the wafer packaging process, the thickness of the film coating such as PV or ITO fluctuates due to the effects of scratching, manufacturing process, etc., so that some chips on the wafer are defective.
In order to avoid the defective products from entering the market, the prior art adopts a gray scale card control mode to detect the appearance of the chips, and further distinguishes which part of the chips on the wafer are the defective products to further eliminate.
In the prior art, for the appearance inspection of the chip, the clamping control is usually performed by a boundary method, specifically, all the dies on the wafer are partitioned, and the partition is based on, for example, the types of the components on the dies, such as: an electrode, a light emitting area and a cutting channel; setting a fixed gray scale clamping value for each partition, and judging that the chip is a defective product when the gray scale of any partition is lower than the corresponding gray scale clamping value; the appearance detection method is simple, but the gray scales of all the partitions of the chip can not be at the same level due to the influence of manufacturing or process, so that the gray scale difference among the chips is overlarge, the same gray scale value is adopted to clamp and control different crystal grains on different wafers, and when the parameter is too strict, the crystal grains with low gray scales are killed excessively; when the parameters are too loose, the chromatic aberration cannot be effectively clamped.
Disclosure of Invention
In order to solve the above technical problems, an object of the present invention is to provide a dynamic correction method for chip appearance, an electronic device and a readable storage medium.
In order to achieve one of the above objects, an embodiment of the present invention provides a method for dynamically correcting chip appearance, the method including: continuously shooting a plurality of gray level images for the same wafer, wherein a plurality of crystal grains are distributed on the wafer;
acquiring at least one image from a plurality of continuously shot gray level images, and processing the image to form a check image;
uniformly extending outwards from the center of a verification image to obtain a verification area, wherein the verification area is a partition equal to a preset area, and/or a partition equal to a preset crystal grain number, and/or a partition with a preset pattern with a preset size; the area of the verification area is smaller than that of the verification image and/or the number of crystal grains contained in the verification area is smaller than that of crystal grains contained in the wafer;
acquiring a check value corresponding to each check position according to the gray value of each pixel point in the check area; the checking position is any single crystal grain and/or any position on any single crystal grain; the check value is a card control gray value corresponding to the check position;
and checking each crystal grain according to the check value and/or checking a preset area of each crystal grain, and confirming whether the currently detected crystal grain is a defective product or not according to the result.
As a further refinement of an embodiment of the present invention, the method includes: the number of continuously photographed grayscale images is set according to the size of the wafer.
As a further improvement of an embodiment of the present invention, the "acquiring at least one image from a plurality of gray-scale images continuously captured and processing the acquired image to form a verification image" specifically includes:
and acquiring at least one image from the images at the middle positions of the plurality of continuously shot gray level images, and processing the image to form a check image.
As a further improvement of an embodiment of the present invention, the method further comprises: the number of continuously shot images is odd;
the step of acquiring at least one image from a plurality of gray-scale images shot continuously and processing the image to form a check image specifically comprises the following steps: and acquiring 1 image at the middle position of a plurality of continuously shot gray level images, and directly taking the image as a verification image.
As a further improvement of an embodiment of the present invention, before obtaining the verification area by uniformly extending outward from the center of the verification image, the method further includes:
if the number of images obtained from the plurality of gray-scale images continuously captured is 2 or more, an image formed by averaging the obtained images is used as a verification image.
As a further improvement of an embodiment of the present invention, the method further comprises: and setting the verification area as a circular area with the center of the verification image as the center of a circle and the radius as a preset radius r.
As a further improvement of an embodiment of the present invention, "obtaining a verification value corresponding to each verification position according to a gray value of each pixel point in a verification region, where the verification position is any single crystal grain" includes:
calculating at least one of the gray average value, the median value and the weighted average value of all crystal grains in the verification area to be used as the verification value;
"inspecting each die by the check value and determining whether the currently inspected die is defective or not according to the result" includes:
acquiring any grain to be detected, and judging whether the actual gray value of the grain to be detected is in a check interval or not, wherein the actual gray value is at least one of an average value, a median value and a weighted average value which have the same category as the check value; the check interval is (X1-Y1, X1+ Y1), X1 represents a check value, and Y1 is a constant;
if yes, determining the current crystal grain as a good product;
if not, the current crystal grain is determined to be a defective product.
As a further improvement of an embodiment of the present invention, "obtaining a verification value corresponding to each verification position according to a gray value of each pixel point in a verification region, where the verification position is any position on any single die" includes:
dividing each crystal grain into a plurality of syndrome partitions according to the checking position;
respectively calculating at least one of the gray average value, the median value and the weighted average value of all crystal grains in the checking area and all syndrome partitions with the same position as the checking value of the current position of any crystal grain;
"inspecting a predetermined area of each die by the check value and confirming whether the currently detected die is defective or not according to the result" includes:
acquiring a part to be detected of any grain to be detected, and judging whether the actual gray value of the part to be detected of the grain to be detected is in a corresponding check interval, wherein the actual gray value is at least one of an average value, a median value and a weighted average value which have the same category as the check value; the check interval is (X2-Y2, X2+ Y2), X2 represents a check value corresponding to the part to be checked, and Y2 is a constant;
if so, confirming that the part to be detected of the current crystal grain to be detected is qualified;
if not, confirming that the part to be detected of the current crystal grain to be detected is unqualified;
and confirming whether the grains to be detected are good products or not according to the parts to be detected of the grains to be detected.
As a further improvement of an embodiment of the present invention, "determining whether or not a grain to be inspected is a good product based on a part to be inspected of a crystal grain to be inspected" includes:
if the qualified proportion of all parts to be detected of the current crystal grain is larger than a preset proportion threshold value and/or a preset specific part to be detected is qualified, determining that the current crystal grain is a good product;
and if the qualified proportion of all parts to be detected of the current crystal grain to be detected is not more than a preset proportion threshold value and/or the preset specific parts to be detected are not qualified, determining that the current crystal grain is a defective product.
In order to solve one of the above objects, an embodiment of the present invention provides an electronic device, which includes a memory and a processor, wherein the memory stores a computer program operable on the processor, and the processor executes the computer program to implement the steps in the dynamic correction method for chip appearance.
In order to solve one of the above objects, an embodiment of the present invention provides a computer-readable storage medium, on which a computer program is stored, the computer program, when being executed by a processor, implementing the steps in the dynamic correction method for chip appearance as described above.
Compared with the prior art, the invention has the beneficial effects that: according to the dynamic correction method for the chip appearance, the electronic device and the readable storage medium, the detection crystal grains are extracted sequentially through the check image, and after the check area is selected, an independent check value is formed for each wafer case; and the check value is used for carrying out clamping control on the excellence of the crystal grain, so that the clamping control precision of the excellence of the crystal grain is improved.
Drawings
FIG. 1 is a flow chart illustrating a method for dynamically correcting chip appearance according to an embodiment of the present invention;
fig. 2 and fig. 3 are schematic flow charts of preferred embodiments of implementing the dynamic correction method for the chip appearance of fig. 1.
Detailed Description
The present invention will be described in detail below with reference to specific embodiments shown in the drawings. These embodiments are not intended to limit the present invention, and structural, methodological, or functional changes made by those skilled in the art according to these embodiments are included in the scope of the present invention.
As shown in fig. 1, a first embodiment of the present invention provides a method for dynamically correcting chip appearance, where the method includes:
s1, continuously shooting a plurality of gray level images for the same wafer, wherein a plurality of crystal grains are distributed on the wafer;
s2, acquiring at least one image from the continuously shot gray level images, and processing the image to form a check image;
s3, uniformly extending outwards from the center of a verification image to obtain a verification area, wherein the verification area is a partition equal to a preset area, and/or a partition equal to a preset crystal grain number, and/or a partition with a preset pattern with a preset size, and the area of the verification area is smaller than the area of the verification image, and/or the number of crystal grains contained in the verification area is smaller than the number of crystal grains contained in a wafer;
s4, acquiring a check value corresponding to each check position according to the gray value of each pixel point in the check area; the checking position is any single crystal grain and/or any position on any single crystal grain; the check value is a card control gray value corresponding to the check position;
and S5, checking each crystal grain by the check value and/or checking a preset area of each crystal grain, and confirming whether the currently detected crystal grain is a defective product or not according to the result.
For step S1, the number of the continuously captured grayscale images for the same wafer is not particularly limited, and the number thereof can be specifically specified according to the requirement.
In the preferred embodiment of the present invention, the number of the continuously shot gray images is set according to the size of the wafer; for example: the wafer is circular, the diameter size of the wafer is 4 inches, the number of continuously shot gray level images can be set to be 255, and when the diameter size of the wafer is 2 inches, the number of the continuously shot gray level images can be correspondingly reduced on the basis of 255; in addition, the size of the outer frame of the wafer varies according to the substrate selected, and the substrate is usually rectangular, circular, etc., and will not be further described herein.
For step S2, in an implementation manner of the present invention, the number of the acquired verification images to be formed may be specified by a user, and may be one or more gray scale images captured continuously.
The position where the gray scale image is acquired can be any position in the continuously shot images, such as: according to the shooting sequence, the number of the gray level images at the front, the number of the shot images at the middle and the number of the gray level images at the back are numbered; when the number of the acquired gray images is 2 or more, the plurality of gray images may be acquired sequentially, at intervals, or according to a certain rule.
In a preferred embodiment of the present invention, the parameters of the device for capturing the grayscale images are: the image exposure time, the sensor gain, and the image at the intermediate time position in the shooting order are more likely to reflect the real appearance of the wafer, so that for step S2, at least one image is obtained from the images at the intermediate positions of the plurality of gray scale images continuously shot and processed to form a verification image, thereby improving the calculation accuracy.
Preferably, for step S1, the number of consecutive captured images is odd; for step S2, 1 image at the intermediate position of the plurality of continuously captured grayscale images is acquired and directly used as the verification image.
Accordingly, in step S2, if the number of images acquired from the plurality of gray-scale images continuously captured is 2 or more, the image obtained by averaging the acquired images is used as the verification image.
It can be understood that averaging the acquired images is to average the gray values of the plurality of images, and when a plurality of images with the same size exist, averaging the gray values of the plurality of images to form an image is the prior art, and therefore, specific implementation processes of the step are not described in detail.
Preferably, in an embodiment of the present invention, for step S3, the verification area is set as a circular area with a center of the verification image as a center and a radius of a preset radius r;
in a specific example of the present invention, if the wafer is circular, the preset radius r is smaller than the radius of the wafer displayed in the verification image. Correspondingly, after the verification image is determined, a circular area is defined by taking the center of the verification image as the center of a circle and taking the preset radius r as the radius, and then the circular area is the verification area.
In the first preferred embodiment of the present invention, whether any of the dies to be inspected is good can be indirectly determined through the gray level value of each die in the verification area of the wafer.
Specifically, in this embodiment, as shown in fig. 2, in step S4, the verification location is any single crystal grain, and accordingly, at least one of the gray-scale average, the median, and the weighted average of all crystal grains in the verification area is calculated as the verification value;
further, in step S5, in this specific implementation, any grain to be detected is obtained, and it is determined whether an actual gray scale value of the grain to be detected is within the verification interval, where the actual gray scale value is at least one of an average value, a median value, and a weighted average value having the same category as the verification value; the check interval is (X1-Y1, X1+ Y1), X1 represents a check value, and Y1 is a constant; if yes, determining the current crystal grain as a good product; if not, the current crystal grain is determined to be a defective product.
Preferably, the value of Y1 is set according to the color tolerance of the center and edge of the single crystal grain with excellent performance under normal conditions.
In the first preferred embodiment of the present invention, whether the corresponding portion of any of the dies to be tested is qualified can be determined by the gray value of the selected portion of each die in the verification area of the wafer, and further, whether any of the dies to be tested is good can be indirectly determined by whether the corresponding portion of the particles to be tested is qualified.
Referring to fig. 3, in this embodiment, for step S4, the verification location is any location on any single die, and accordingly, each die is divided into a plurality of syndrome partitions according to the verification location;
respectively calculating at least one of the gray average value, the median value and the weighted average value of all crystal grains in the checking area and all syndrome partitions with the same position as the checking value of the current position of any crystal grain;
further, in step S5, in this specific implementation, a to-be-detected portion of any to-be-detected crystal grain is obtained, and whether an actual gray value of the to-be-detected portion of the to-be-detected crystal grain is within a corresponding check interval is determined, where the actual gray value is at least one of an average value, a median value, and a weighted average value that have the same category as the check value; the check interval is (X2-Y2, X2+ Y2), X2 represents a check value corresponding to the part to be checked, and Y2 is a constant; if so, confirming that the part to be detected of the current crystal grain to be detected is qualified; if not, confirming that the part to be detected of the current crystal grain to be detected is unqualified;
further, the step S5 further includes: and confirming whether the grains to be detected are good products or not according to the parts to be detected of the grains to be detected.
Preferably, in the second preferred embodiment, the value of Y2 is also set according to the color tolerance of the middle portion and the edge portion of the single crystal grain with excellent performance under normal conditions.
Any site on any single die forming the verification location may be generally specified according to the type of site, for example: electrodes, light emitting areas, cutting streets, etc.; in this particular example, each class on each die forms a syndrome partition, and the grayscale values of the syndrome partitions for all dies in the verification area on the wafer having the same class are used to calculate the verification value for verifying the corresponding class.
For example: 100 crystal grains are distributed in a check area of the wafer, one of the check sub-areas on the crystal grains is a cutting track, then the number of the check sub-areas is also 100, and a dynamic check value corresponding to the cutting track can be calculated through the gray value of the check sub-area with the 100 types as the cutting track; furthermore, when the scribe line of a certain die on the whole wafer needs to be subjected to appearance inspection, whether the scribe line is qualified or not can be accurately checked through the dynamic check value.
In the implementation mode of the invention, the step of determining whether the grains to be detected are good products according to the parts to be detected of the grains to be detected comprises the following steps:
if the qualified proportion of all parts to be detected of the current crystal grain is larger than a preset proportion threshold value and/or a preset specific part to be detected is qualified, determining that the current crystal grain is a good product;
and if the qualified proportion of all parts to be detected of the current crystal grain to be detected is not more than a preset proportion threshold value and/or the preset specific parts to be detected are not qualified, determining that the current crystal grain is a defective product.
The preset proportion threshold is a set percentage constant value, and the size of the preset proportion threshold can be specifically set according to needs.
In a specific example of the present invention, when the qualified rate is adopted to determine whether the die is good, for example: the number of the parts to be detected of a single crystal grain is set to be 4, and the preset proportion threshold value is set to be 50%; corresponding to the grains to be detected, if 3 parts to be detected are judged to be qualified, the qualified proportion is 75 percent and is greater than the preset proportion threshold value by 50 percent, and at the moment, the current grains can be judged to be good products; if only 2 parts to be detected are judged to be qualified, the qualified proportion is 50 percent and is equal to the preset proportion threshold value 50 percent, and at the moment, the current crystal grains can be judged to be defective products.
In another specific example of the present invention, for example: if one of the electrodes on one of the portions of the die is determined to be defective, the determined die is determined to be defective, or if one of the electrodes on one of the portions of the die is determined to be defective, the determined die is determined to be defective, which is not further described herein.
Further, after step S5, the method further includes: outputting parameters on a wafer, the parameters comprising: the serial number and/or position of a good product crystal grain, the serial number and/or position of a bad product crystal grain, and a certain part on the crystal grain is qualified and/or unqualified; the parameters may be stored and output in a list form for subsequent invocation, which is not further described herein.
Further, an embodiment of the present invention provides an electronic device, including a memory and a processor, where the memory stores a computer program executable on the processor, and the processor executes the computer program to implement the steps in the dynamic correction method for chip appearance as described above.
Further, an embodiment of the present invention provides a computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, implements the steps in the dynamic correction method for chip appearance as described above.
In summary, when the gray scale difference between different wafers is large due to the influence of the manufacturing process and materials, the dynamic correction method for the chip appearance, the electronic device and the readable storage medium of the invention need to sequentially extract the verification image corresponding to each detection crystal grain, and form an independent verification value for each wafer case after the verification area is selected; and the check value is used for controlling the excellence of the crystal grain, so that the problem of over-killing of the crystal grain caused by the same check parameter adopted by different wafers can be solved, the chromatic aberration of the single wafer can be effectively controlled, and the excellent control precision of the crystal grain can be improved.
It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.
The above-listed detailed description is only a specific description of a possible embodiment of the present invention, and they are not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention should be included in the scope of the present invention.
Claims (11)
1. A method for dynamic correction of chip appearance, the method comprising:
continuously shooting a plurality of gray level images for the same wafer, wherein a plurality of crystal grains are distributed on the wafer;
acquiring at least one image from a plurality of continuously shot gray level images, and processing the image to form a check image;
uniformly extending outwards from the center of a verification image to obtain a verification area, wherein the verification area is a partition equal to a preset area, and/or a partition equal to a preset crystal grain number, and/or a partition with a preset pattern with a preset size; the area of the verification area is smaller than that of the verification image and/or the number of crystal grains contained in the verification area is smaller than that of crystal grains contained in the wafer;
acquiring a check value corresponding to each check position according to the gray value of each pixel point in the check area; the checking position is any single crystal grain and/or any position on any single crystal grain; the check value is a card control gray value corresponding to the check position;
and checking each crystal grain according to the check value and/or checking a preset area of each crystal grain, and confirming whether the currently detected crystal grain is a defective product or not according to the result.
2. The method of claim 1, wherein the method comprises: the number of continuously photographed grayscale images is set according to the size of the wafer.
3. The method for dynamically correcting chip appearance according to claim 1, wherein the step of obtaining at least one image from a plurality of gray-scale images captured continuously and processing the image to form a verification image comprises:
and acquiring at least one image from the images at the middle positions of the plurality of continuously shot gray level images, and processing the image to form a check image.
4. The method of claim 3, further comprising: the number of continuously shot images is odd;
the step of acquiring at least one image from a plurality of gray-scale images shot continuously and processing the image to form a check image specifically comprises the following steps: and acquiring 1 image at the middle position of a plurality of continuously shot gray level images, and directly taking the image as a verification image.
5. The dynamic correction method for chip appearance according to claim 1, wherein before the obtaining of the verification area is extended uniformly outward from the center of the verification image, the method further comprises:
if the number of images obtained from the plurality of gray-scale images continuously captured is 2 or more, an image formed by averaging the obtained images is used as a verification image.
6. The method of claim 1, further comprising: and setting the verification area as a circular area with the center of the verification image as the center of a circle and the radius as a preset radius r.
7. The method of claim 1, wherein obtaining the verification value corresponding to each verification location according to the gray-level value of each pixel in the verification area, the verification location being any single grain, comprises:
calculating at least one of the gray average value, the median value and the weighted average value of all crystal grains in the verification area to be used as the verification value;
"inspecting each die by the check value and determining whether the currently inspected die is defective or not according to the result" includes:
acquiring any grain to be detected, and judging whether the actual gray value of the grain to be detected is in a check interval or not, wherein the actual gray value is at least one of an average value, a median value and a weighted average value which have the same category as the check value; the check interval is (X1-Y1, X1+ Y1), X1 represents a check value, and Y1 is a constant;
if yes, determining the current crystal grain as a good product;
if not, the current crystal grain is determined to be a defective product.
8. The method of claim 1, wherein obtaining the verification value corresponding to each verification location according to the gray-level value of each pixel in the verification area, the verification location being any location on any single die, comprises:
dividing each crystal grain into a plurality of syndrome partitions according to the checking position;
respectively calculating at least one of the gray average value, the median value and the weighted average value of all crystal grains in the checking area and all syndrome partitions with the same position as the checking value of the current position of any crystal grain;
"inspecting a predetermined area of each die by the check value and confirming whether the currently detected die is defective or not according to the result" includes:
acquiring a part to be detected of any grain to be detected, and judging whether the actual gray value of the part to be detected of the grain to be detected is in a corresponding check interval, wherein the actual gray value is at least one of an average value, a median value and a weighted average value which have the same category as the check value; the check interval is (X2-Y2, X2+ Y2), X2 represents a check value corresponding to the part to be checked, and Y2 is a constant;
if so, confirming that the part to be detected of the current crystal grain to be detected is qualified;
if not, confirming that the part to be detected of the current crystal grain to be detected is unqualified;
and confirming whether the grains to be detected are good products or not according to the parts to be detected of the grains to be detected.
9. The method for dynamically correcting the appearance of a chip as claimed in claim 8, wherein the step of determining whether the grain to be inspected is good or not based on the portion to be inspected of the grain to be inspected comprises the steps of:
if the qualified proportion of all parts to be detected of the current crystal grain is larger than a preset proportion threshold value and/or a preset specific part to be detected is qualified, determining that the current crystal grain is a good product;
and if the qualified proportion of all parts to be detected of the current crystal grain to be detected is not more than a preset proportion threshold value and/or the preset specific parts to be detected are not qualified, determining that the current crystal grain is a defective product.
10. An electronic device comprising a memory and a processor, said memory storing a computer program operable on said processor, wherein said processor implements the steps of the method for dynamically correcting the appearance of a chip according to any one of claims 1 to 9 when executing said program.
11. A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the steps of the method for dynamic correction of chip appearance according to any one of claims 1 to 9.
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