CN114088259A - Insole flexible sensor and preparation method thereof - Google Patents

Insole flexible sensor and preparation method thereof Download PDF

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Publication number
CN114088259A
CN114088259A CN202111473288.0A CN202111473288A CN114088259A CN 114088259 A CN114088259 A CN 114088259A CN 202111473288 A CN202111473288 A CN 202111473288A CN 114088259 A CN114088259 A CN 114088259A
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China
Prior art keywords
sensor
insole
layer
flexible
conductive
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Pending
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CN202111473288.0A
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Chinese (zh)
Inventor
秦泽昭
张通
鱼婧
陈宗楠
杨小牛
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Huangpu Institute of Materials
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Huangpu Institute of Materials
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Priority to CN202111473288.0A priority Critical patent/CN114088259A/en
Publication of CN114088259A publication Critical patent/CN114088259A/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/205—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using distributed sensing elements
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/103—Detecting, measuring or recording devices for testing the shape, pattern, colour, size or movement of the body or parts thereof, for diagnostic purposes
    • A61B5/1036—Measuring load distribution, e.g. podologic studies
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/103—Detecting, measuring or recording devices for testing the shape, pattern, colour, size or movement of the body or parts thereof, for diagnostic purposes
    • A61B5/1036—Measuring load distribution, e.g. podologic studies
    • A61B5/1038—Measuring plantar pressure during gait
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
    • A61B5/6801—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be attached to or worn on the body surface
    • A61B5/6802—Sensor mounted on worn items
    • A61B5/6804—Garments; Clothes
    • A61B5/6807—Footwear
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
    • A61B5/6801—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be attached to or worn on the body surface
    • A61B5/6813—Specially adapted to be attached to a specific body part
    • A61B5/6829—Foot or ankle
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/12—Manufacturing methods specially adapted for producing sensors for in-vivo measurements
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/16—Details of sensor housings or probes; Details of structural supports for sensors

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  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Molecular Biology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Veterinary Medicine (AREA)
  • Biophysics (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Biomedical Technology (AREA)
  • Public Health (AREA)
  • Medical Informatics (AREA)
  • General Health & Medical Sciences (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Physics & Mathematics (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Dentistry (AREA)
  • Footwear And Its Accessory, Manufacturing Method And Apparatuses (AREA)

Abstract

The invention belongs to the technical field of flexible sensors, and discloses an insole flexible sensor and a preparation method thereof, which are used for solving the technical problems that the flexible sensor in the prior art cannot be bent, is not sealed really, has high cost and the like. The insole flexible sensor comprises a lower packaging layer, an electrode layer, a sensitive layer and an upper packaging layer; the electrode layer is a flexible substrate; the sensitive layer is a microstructure elastomer with a conductive coating or an elastomer composite material mixed with a conductive filler; the lower packaging layer and/or the upper packaging layer are/is a hot melt adhesive film. The insole flexible sensor has the advantages of simple structure, bending resistance, moisture resistance and damp resistance; the structure is compact, the sensor is not easy to damage, the influence of external moisture and gas can be effectively prevented, the sensitive layer in the sensor is protected, and the stability of the sensor is improved; the method is used for detecting the pressure of the sole of the foot. The preparation method has simple process and lower cost, and is beneficial to large-area popularization.

Description

Insole flexible sensor and preparation method thereof
Technical Field
The invention relates to the technical field of flexible sensors, in particular to an insole flexible sensor and a preparation method thereof.
Background
The sole pressure distribution monitoring is beneficial to analyzing information such as gait characteristics, balance postures and the like of a human body, and is one of important biomechanical parameters of the human body. The plantar pressure detection provides an assessment means for foot deformities such as equinus, high-arch foot, flat foot and the like, and has a promoting effect on the research and development of clinical medicine, biomechanics and physical training. In addition, the lower body limb actions can be identified through the detection of the foot pressure, and a new development opportunity is provided for the intelligent game industry. Therefore, the research on the insole sensor capable of detecting the pressure distribution of the sole has important significance.
The flexible pressure sensor has the characteristics of light weight, thinness, flexibility and the like, has unique advantages in the field of interface stress testing, and is often used for preparing intelligent insole sensors, such as Chinese patent documents CN112263046A, CN210095737U, CN211407805U, CN106974361A, CN214283624U and the like. The common principles of flexible pressure sensors are mainly classified into piezoelectric type, pressure-capacitance type and piezoresistive type. The piezoelectric flexible sensor can only detect dynamic signals and cannot meet the use scene of the intelligent insole. The pressure-capacitance type flexible sensor detects pressure by using the change of a capacitance signal when being pressed, and generally has the problems of complex acquisition circuit, easy signal interference and the like. The piezoresistive flexible sensor has the advantages of simple structure, stable signal, low cost and the like, and is most suitable for manufacturing the intelligent insole pressure sensor. However, the existing intelligent insole flexible sensor generally has the following problems: the bending property cannot be ensured, and the performance of the sensor unit can be problematic after the sensor unit is bent for multiple times; the sensor is not sealed really, and the sensor is easy to lose efficacy in a humid environment or a water environment; the cost is high, and the limitation of material preparation and process production makes the intelligent insole sensor generally expensive, and is not beneficial to large-area popularization.
Disclosure of Invention
The invention aims to solve the problems that a flexible sensor in the prior art cannot be bent, is not sealed really, is high in cost and the like, and provides an insole flexible sensor and a preparation method thereof.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
in a first aspect, the invention provides an insole flexible sensor, which comprises a lower packaging layer, an electrode layer, a sensitive layer and an upper packaging layer;
the electrode layer is a flexible substrate; the sensitive layer is a microstructure elastomer with a conductive coating or an elastomer composite material mixed with a conductive filler; the lower packaging layer and/or the upper packaging layer are/is a hot melt adhesive film.
As a preferred embodiment of the insole flexibility sensor of the present invention, the flexible substrate is a conductive fabric or a stretchable elastomer.
As a preferable embodiment of the insole flexible sensor, the hot melt adhesive film is at least one of EVA, TPU and PO.
As a preferred embodiment of the insole flexible sensor of the present invention, the electrode layer is provided with an electrode unit; the sensitive layer is matched with the position of the electrode unit.
As a preferred embodiment of the insole flexible sensor, the conductive coating is composed of conductive fillers and dispersing agents; the conductive filler is carbon conductive filler or metal filler, and the dispersant is at least one of TPU, SEBS, PVP and PVA.
Preferably, the carbon-based conductive filler is at least one of carbon nanotube, graphene and graphite; the metal filler is at least one of nickel, silver, copper and aluminum.
As a preferable embodiment of the insole flexibility sensor of the invention, the microstructure is at least one of a spherical shape, a cylindrical shape, a conical shape and a random shape.
As a preferable embodiment of the insole flexibility sensor, the elastomer is at least one of silicone rubber, TPU and SEBS.
In a second aspect, the invention provides a preparation method of the insole flexible sensor, which comprises the following steps:
(1) processing the electrode layer according to the number and the position of the designed sensor units and the conducting circuits;
(2) pairing the sensitive layer with an electrode unit of an electrode layer and fixing;
(3) and carrying out hot pressing on the lower packaging layer, the electrode layer, the sensitive layer and the upper packaging layer to obtain the packaging structure.
As a preferred embodiment of the method for manufacturing the insole flexible sensor, in the step (1), when the flexible substrate is a conductive fabric, a set conductive circuit is processed by using a laser marking machine; when the flexible substrate is a stretchable elastomer, the set conductive circuit is processed by utilizing an ink-jet printing technology.
Compared with the prior art, the invention has the beneficial effects that:
the insole flexible sensor has the advantages of simple structure, bending resistance (the performance of the sensor unit is still stable after being bent for 50 ten thousand times), moisture resistance and moisture resistance; the structure is compact, the sensor is not easy to damage, the influence of external moisture and gas can be effectively prevented, the sensitive layer in the sensor is protected, and the stability of the sensor is improved; the method is used for detecting the pressure of the sole of the foot. The preparation method has simple process and lower cost, and is beneficial to large-area popularization.
Drawings
FIG. 1 is a schematic structural view of a flexible pressure sensor of an insole in example 1;
in the figure, 1 is a lower packaging layer, 2 is an electrode layer, 3 is a sensitive layer, and 4 is an upper packaging layer.
FIG. 2 is a graph showing the results of the moisture and humidity proofing test in test example 1;
FIG. 3 is a graph showing the results of bending resistance test in test example 1.
FIG. 4 is a graph showing the results of the moisture and humidity resistance test of comparative example 1;
FIG. 5 is a graph showing the results of bending resistance test in comparative example 1.
FIG. 6 is a graph showing the results of the moisture and humidity proofing test of comparative example 2;
FIG. 7 is a graph showing the results of bending resistance test in comparative example 2.
Detailed Description
To better illustrate the objects, aspects and advantages of the present invention, the present invention will be further described with reference to specific examples. It will be understood by those skilled in the art that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The test methods used in the examples are all conventional methods unless otherwise specified; the materials used, unless otherwise specified, are commercially available.
Example 1:
(1) an insole flexible pressure sensor, as shown in fig. 1, comprises a lower packaging layer 1, an electrode layer 2, a sensitive layer 3 and an upper packaging layer 4;
the electrode layer 2 is a flexible substrate such as conductive fabric, stretchable elastomer and the like. The electrode layer 2 is provided with an electrode unit.
The sensitive layer 3 is a micro-structure elastomer with a conductive coating. The contact area of the microstructure and the lower surface is changed under the condition of pressure, so that the contact resistance is changed, and the pressure is sensed. The position of the sensitive layer 3 is matched with that of the electrode unit.
The conductive coating is composed of conductive filler and dispersing agent, the conductive filler can be carbon-based conductive fillers such as carbon nano tubes, graphene and graphite, and the dispersing agent is composed of TPU, SEBS, PVP, PVA and the like. The microstructure may be spherical, cylindrical, conical, irregular, etc. The elastomer can be silicon rubber, TPU, SEBS and other materials.
The lower packaging layer 1 and the upper packaging layer 4 are hot melt adhesive films such as EVA, TPU, PO and the like.
(2) The preparation method of the insole flexible pressure sensor comprises the following steps:
1) the electrode layer 2 is processed according to the number, position and conductive paths of the sensor units designed in advance. If the substrate is a conductive fabric, a laser marking machine is used for processing a specific conductive circuit. If the substrate is a stretchable elastomer, the specific conductive circuit is processed by using an ink-jet printing technology.
2) And pairing the sensitive layer 3 and the electrode unit of the electrode layer 2 by using a dispensing chip mounter, and preliminarily fixing.
3) And (3) carrying out hot pressing on the lower packaging layer 1, the electrode layer 2, the sensitive layer 3 and the upper packaging layer 4 by using a hot press to realize the integral packaging of the sensor.
Example 2:
the flexible pressure sensor for the insole is different from the embodiment 1 in that:
the sensitive layer 3 is an elastomer composite material mixed with conductive filler, and the conductive filler can be carbon-based conductive filler such as carbon nanotubes, graphene, graphite and the like, and can also be metal filler such as nickel, silver, copper, aluminum and the like. The elastomer material is rubber, TPU, SEBS and other materials.
Test example:
the insole flexible pressure sensor of example 1 was prepared.
The electrode layer 2 is a conductive fabric, and circuit etching is carried out by an infrared fiber laser marking machine with the frequency of 30 khz.
The sensitive layer 3 is composed of PDMS elastomer with random microstructure, and the conductive coating is composed of carbon nano tube conductive particles and TPU dispersing agent.
The upper packaging layer 1 and the lower packaging layer 4 are made of TPU hot melt adhesive.
And (3) matching the sensitive layer 3 with the electrode layer 2, and packaging the whole sensor by utilizing hot pressing to obtain the sensor.
The method for detecting the performance of the insole flexible pressure sensor comprises the following steps:
(1) bending resistance
According to GB/T38806-.
(2) Moisture-proof and damp-proof
The sensor was completely immersed in water and kept at room temperature (25 ℃) for 2 weeks. The performance differences of the sensors before and after soaking were then compared. The sensor protection grade is referred to as GBT4208-2017 shell protection grade and is IP 68S.
The resulting sensor performance of the test is shown in figures 2 and 3:
as shown in figure 2, the performance of the insole flexible pressure sensor has not changed much after soaking in water for two weeks.
As shown in fig. 3, after the sensor is bent 50 ten thousand times (bending radius 10mm), the performance of the sensor has not changed much.
Comparative example 1:
the insole flexible pressure sensor of example 1 was prepared.
The electrode layer 2 is a conductive fabric, and circuit etching is carried out by an infrared fiber laser marking machine with the frequency of 30 khz.
The sensitive layer 3 is composed of PDMS elastomer with random microstructure, and the conductive coating is composed of carbon nanotube conductive particles and SDS dispersant.
The upper packaging layer 1 and the lower packaging layer 4 are made of TPU hot melt adhesive.
And (3) matching the sensitive layer 3 with the electrode layer 2, and packaging the whole sensor by utilizing hot pressing to obtain the sensor.
The performance of the insole flexible pressure sensor manufactured by adopting the test of the test example is shown in figures 4 and 5:
as shown in figure 4, the performance of the insole flexible pressure sensor has not changed much after soaking in water for two weeks.
As shown in fig. 5, the sensor performance was greatly changed after bending the sensor 50 ten thousand times (bending radius 10 mm).
Comparative example 2:
the insole flexible pressure sensor of example 1 was prepared.
The electrode layer 2 is a conductive fabric, and circuit etching is carried out by an infrared fiber laser marking machine with the frequency of 30 khz.
The sensitive layer 3 is composed of PDMS elastomer with random microstructure, and the conductive coating is composed of carbon nano tube conductive particles and TPU dispersing agent.
The upper packaging layer 1 and the lower packaging layer 4 are made of TPU hot melt adhesive.
And (3) matching the sensitive layer 3 with the electrode layer 2, and packaging the whole sensor by using a double-sided adhesive tape.
The performance of the insole flexible pressure sensor manufactured by the test of the test example is shown in fig. 6 and 7:
as shown in FIG. 6, after two weeks of soaking in water, the performance of the insole flexible pressure sensor changed greatly.
As shown in fig. 7, after the sensor is bent 50 ten thousand times (bending radius 10mm), the performance of the sensor is not changed too much.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting the protection scope of the present invention, and although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.

Claims (10)

1. The insole flexible sensor is characterized by comprising a lower packaging layer, an electrode layer, a sensitive layer and an upper packaging layer;
the electrode layer is a flexible substrate; the sensitive layer is a microstructure elastomer with a conductive coating or an elastomer composite material mixed with a conductive filler; the lower packaging layer and/or the upper packaging layer are/is a hot melt adhesive film.
2. The insole flexibility sensor of claim 1, wherein the flexible substrate is a conductive fabric or stretchable elastomer.
3. The insole flexible sensor of claim 1, wherein the hot melt adhesive film is at least one of EVA, TPU, PO.
4. The insole flexible sensor of claim 1, wherein said electrode layer has electrode cells disposed thereon; the sensitive layer is matched with the position of the electrode unit.
5. The insole flexibility sensor of claim 1, wherein said conductive coating is comprised of conductive fillers and dispersants; the conductive filler is carbon conductive filler or metal filler, and the dispersant is at least one of TPU, SEBS, PVP and PVA.
6. The insole flexible sensor of claim 5, wherein the carbon-based conductive filler is at least one of carbon nanotubes, graphene, graphite; the metal filler is at least one of nickel, silver, copper and aluminum.
7. The insole flexibility sensor of claim 1, wherein the microstructures are at least one of spherical, cylindrical, conical, irregular.
8. The insole flexibility sensor of claim 1, wherein said elastomer is at least one of silicone rubber, TPU, SEBS.
9. A method for preparing the insole flexible sensor according to any one of claims 1 to 8, comprising the following steps:
(1) processing the electrode layer according to the number and the position of the designed sensor units and the conducting circuits;
(2) pairing the sensitive layer with an electrode unit of an electrode layer and fixing;
(3) and carrying out hot pressing on the lower packaging layer, the electrode layer, the sensitive layer and the upper packaging layer to obtain the packaging structure.
10. The method for preparing the insole flexible sensor according to claim 9, wherein in the step (1), when the flexible substrate is a conductive fabric, a set conductive circuit is processed by a laser marking machine; when the flexible substrate is a stretchable elastomer, the set conductive circuit is processed by utilizing an ink-jet printing technology.
CN202111473288.0A 2021-12-03 2021-12-03 Insole flexible sensor and preparation method thereof Pending CN114088259A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115931187A (en) * 2022-12-19 2023-04-07 东莞市情创电子科技有限公司 High-sensitivity flexible pressure sensor and preparation method thereof

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Publication number Priority date Publication date Assignee Title
WO2016156669A1 (en) * 2015-04-02 2016-10-06 Tacto Tek Oy Multilayer structure for capacitive pressure sensing
WO2018144772A1 (en) * 2017-02-03 2018-08-09 The Regents Of The University Of California Enhanced pressure sensing performance for pressure sensors
CN108871629A (en) * 2018-07-20 2018-11-23 浙江大学 A kind of flexible resistive array of pressure sensors and preparation method thereof
CN113237418A (en) * 2021-04-30 2021-08-10 哈尔滨工业大学 Preparation method and sensitivity regulation and control method of flexible sensor with multiple sensitivities
CN113340483A (en) * 2021-05-31 2021-09-03 重庆大学 Flexible mechanical sensor of bionic microstructure and preparation method thereof
CN216925864U (en) * 2021-12-03 2022-07-08 广东粤港澳大湾区黄埔材料研究院 Insole flexible sensor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016156669A1 (en) * 2015-04-02 2016-10-06 Tacto Tek Oy Multilayer structure for capacitive pressure sensing
WO2018144772A1 (en) * 2017-02-03 2018-08-09 The Regents Of The University Of California Enhanced pressure sensing performance for pressure sensors
CN108871629A (en) * 2018-07-20 2018-11-23 浙江大学 A kind of flexible resistive array of pressure sensors and preparation method thereof
CN113237418A (en) * 2021-04-30 2021-08-10 哈尔滨工业大学 Preparation method and sensitivity regulation and control method of flexible sensor with multiple sensitivities
CN113340483A (en) * 2021-05-31 2021-09-03 重庆大学 Flexible mechanical sensor of bionic microstructure and preparation method thereof
CN216925864U (en) * 2021-12-03 2022-07-08 广东粤港澳大湾区黄埔材料研究院 Insole flexible sensor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115931187A (en) * 2022-12-19 2023-04-07 东莞市情创电子科技有限公司 High-sensitivity flexible pressure sensor and preparation method thereof
CN115931187B (en) * 2022-12-19 2024-04-09 东莞市情创电子科技有限公司 High-sensitivity flexible pressure sensor and preparation method thereof

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