CN114080652A

CN114080652A - Surface-mounted magnetic component module

Info

Publication number: CN114080652A
Application number: CN202080050001.0A
Authority: CN
Inventors: 李·弗朗西斯; 威廉·贾维斯; 丹下贵之
Original assignee: Murata Manufacturing Co Ltd
Current assignee: Murata Manufacturing Co Ltd
Priority date: 2019-07-09
Filing date: 2020-07-09
Publication date: 2022-02-22
Also published as: EP3981018A1; WO2021007403A1; EP3981018A4

Abstract

A magnetic component module, comprising: a substrate; a core on a first surface of a substrate; a spacer on the core; a winding including a wire bond extending over the core and electrically connecting the first portion of the substrate with the second portion of the substrate; and a trace on and/or in the substrate; and an overmolding material that encapsulates the core, the spacer, and the wire bond. The wire bond is routed through a trench included in the spacer.

Description

Surface-mounted magnetic component module

Cross Reference to Related Applications

This application claims the benefit of U.S. patent application No.62/871,845, filed on 7/9/2019. The entire contents of this application are incorporated herein by reference.

Technical Field

The present invention relates to magnetic assemblies and magnetic assembly modules, and more particularly, to transformers and surface mounted transformer modules.

Background

Transformers are used in many applications, for example, to vary the voltage of input electricity. The transformer has one or more primary windings and one or more secondary windings wound around a common core of magnetic material. The primary winding receives electrical energy, for example from a power source, and couples the electrical energy to the secondary winding through a varying magnetic field. This electrical energy is manifested as an electromagnetic force across the secondary winding. The voltage developed in the secondary winding is related to the voltage in the primary winding by the turns ratio between the primary and secondary windings. A typical transformer is implemented using an arrangement of adjacent coils. In toroidal transformers, the windings are wound around a toroidal core.

The demands of many areas, including telecommunications, implantable medical devices, and battery-powered wireless devices, for example, have prompted design efforts to minimize component size with lower cost solutions that exhibit the same or better performance, but operate with reduced power consumption. Reduced power consumption is typically caused by other requirements to reduce the supply voltage of various circuits. Accordingly, there is a continuing need to provide magnetic assemblies that are more efficient, smaller, and less costly.

Disclosure of Invention

To overcome the above problems and meet the above needs, preferred embodiments of the present invention provide magnetic assembly modules, each including a spacer disposed on a core, and a wire bond extending over the spacer and through a trench included in the spacer.

According to a preferred embodiment of the present invention, a magnetic assembly module includes: a substrate; a core on a first surface of the substrate; a spacer on the core; a winding including a wire bond extending over the core and electrically connecting the first portion of the substrate with the second portion of the substrate, and traces on and/or in the substrate; and an overmolding material encapsulating the core, the spacer, and the wire bond. The wire bond is routed through a trench included in the spacer.

The electronic component may be attached to a second surface of the substrate opposite the first surface of the substrate. The spacer may coincide with the top of the core. The edges of the spacer may overhang the core. The spacer may extend over the entire outer surface of the core or substantially over the entire outer surface of the core. The wire bonds may include first and second wire bonds, the trenches included in the spacer may include first and second trenches crossing each other, and each of the first and second wire bonds may be routed through one of the first and second trenches, respectively.

The magnetic component module may further include a gap between the bottom surface of the core and the first surface of the substrate, wherein the overmold material may fill the gap. An adhesive is in the gap between the core and the substrate, and an overmolding material may encapsulate the adhesive.

The magnetic component module may also include input/output pins on a surface of the substrate. The input/output pins may be exposed on the first surface of the substrate.

The magnetic component module may also include an adhesive to mount the core to the substrate. The spacer may include polyethylene terephthalate (PET) resin.

According to a preferred embodiment of the present invention, a method of manufacturing a magnetic component module includes: providing a substrate; depositing a first adhesive on a portion of the first surface of the substrate; adhering the core to a portion of a first surface of a substrate on which the first adhesive is deposited; providing a spacer on the core; connecting a first conductive portion of the substrate with a second conductive portion of the substrate with a wire bond; passing the wire bond through a trench included in the spacer; providing a trace on and/or in a substrate; and overmolding the core, the spacer, and the wire bond with an overmolding material. The wire bonds and traces define windings.

The method may further include depositing a second adhesive on the core and adhering the spacer to the core using the second adhesive. The method may also include attaching an electronic component to a second surface of the substrate opposite the first surface of the substrate. The spacer may coincide with the top of the core. The edges of the spacer may overhang the core. The spacer may extend over the entire outer surface of the core or substantially over the entire outer surface of the core. The wire bonds may include first and second wire bonds, the trenches included in the spacer may include first and second trenches crossing each other, and each of the first and second wire bonds may be routed through one of the first and second trenches, respectively. The first adhesive may define a gap between the core and the substrate, and the overmold material may encapsulate the first adhesive. The method may further include mounting the input/output pins on a surface of the substrate. The input/output pins may be exposed on the first surface of the substrate. The spacer may include a polyethylene terephthalate resin. The method may also include overmolding the electronic assembly.

According to a preferred embodiment of the present invention, a magnetic assembly module includes: a substrate; a core on a first surface of the substrate; a spacer on the core; a winding including a wire bond extending over the core and electrically connecting the first portion of the substrate with the second portion of the substrate, and traces on and/or in the substrate; and an overmolding material encapsulating the core, the spacer, and the wire bond.

The electronic component may be attached to a second surface of the substrate opposite the first surface of the substrate. The spacer may coincide with the top of the core. The edges of the spacer may overhang the core. The spacer may extend over the entire outer surface of the core or substantially over the entire outer surface of the core.

The magnetic component module may further include a gap between the bottom surface of the core and the first surface of the substrate, wherein the overmold material may fill the gap. An adhesive may be in the gap between the core and the substrate, and an overmolding material may encapsulate the adhesive.

According to a preferred embodiment of the present invention, a method of manufacturing a magnetic component module includes: providing a substrate; adhering the core to a portion of a first surface of a substrate on which the first adhesive is deposited; providing a spacer on the core; defining a winding comprising a wire bond extending over the core and electrically connecting a first conductive portion of the substrate with a second conductive portion of the substrate, and providing a trace on and/or in the substrate; and overmolding the core, the spacer, and the wire bond with an overmolding material.

The method of manufacturing a magnetic assembly module may further include depositing a second adhesive on the core and adhering the spacer to the core using the second adhesive.

The method of manufacturing a magnetic component module may further include attaching an electronic component to a second surface of the substrate opposite the first surface of the substrate. The method of manufacturing a magnetic component module may further comprise overmolding the electronic component.

The spacer may coincide with the top of the core. The edges of the spacer may overhang the core. The spacer may extend over the entire outer surface of the core or substantially over the entire outer surface of the core. The spacer may include a polyethylene terephthalate resin.

The adhesive may create a gap between the core and the substrate, and the overmold material may encapsulate the first adhesive.

A method of manufacturing a magnetic component module may include mounting input/output pins on a surface of a substrate. The input/output pins may be exposed on the first surface of the substrate.

The above and other features, elements, characteristics, steps and advantages of the present invention will become more apparent from the following detailed description of preferred embodiments of the present invention with reference to the attached drawings.

Drawings

Fig. 1 shows a magnetic assembly module in which spacers are attached to a core.

Fig. 2 is a top perspective view of the magnetic assembly module of fig. 1.

Fig. 3 is a side view of the magnetic assembly module of fig. 1.

Fig. 4 is a top view of the magnetic assembly module of fig. 1.

Fig. 5 is a side view of the magnetic assembly module of fig. 1 modified to include a trench in the spacer.

Fig. 6 is a top perspective view of the magnetic assembly module of fig. 5.

Fig. 7 is a top view of the magnetic assembly module shown in fig. 5.

Fig. 8 is a cross-sectional view of the magnetic assembly module shown in fig. 5.

Fig. 9 is a top perspective view of the magnetic assembly module of fig. 1 further modified to include intersecting trenches in the spacer.

Fig. 10 is a top view of the magnetic assembly module shown in fig. 9.

Fig. 11 is a cross-sectional view of the magnetic assembly module shown in fig. 9.

Fig. 12-21 illustrate steps of a method of manufacturing the magnetic assembly module of fig. 1.

Fig. 22 shows a magnetic assembly module with spacers surrounding the core.

Fig. 23-30 illustrate steps of a method of manufacturing the magnetic assembly module of fig. 22.

Fig. 31 shows a magnetic assembly module with a core and a support.

Fig. 32-41 illustrate steps of a method of manufacturing the magnetic assembly module of fig. 31.

Fig. 42 shows a magnetic component module with input/output pins.

Fig. 43-55 illustrate steps of a method of manufacturing the magnetic assembly module of fig. 42.

Fig. 56 is a block diagram of an example of an implementation of a magnetic component module.

Fig. 57 is a block diagram of a gate drive circuit application that may include one or more of the magnetic component modules shown in fig. 56.

Fig. 58 is a circuit diagram of a motor control application that may include the gate drive unit of fig. 57.

Detailed Description

Fig. 1 shows a magnetic component module 100 having a core 110, windings defined by wire bonds 120 and traces 145, spacers 130, and a substrate 140, such as a multilayer Printed Circuit Board (PCB). Note that two examples of spacers are shown, including spacer 130 and spacer 135, where spacer 135 conforms to the top of core 110 and partially covers the sidewalls of core 110, as will be discussed below. The overmold material 190 may cover or encapsulate the core 110, wire bonds 120, and spacers 130. The magnetic component module 100 may be a transformer having a primary winding and a secondary winding extending around a core 110, as shown in fig. 1. Although fig. 1 shows a transformer with two windings, other magnetic components including, for example, an inductor with a single winding or a transformer with three or more windings may be used. Circuit components and/or connectors may be located on the bottom surface of the substrate 140. As shown in fig. 1, the magnetic component module 100 may include Surface Mount (SM) or input/output (I/O) pins 160 located on the bottom surface of the substrate 140. The magnetic component module 100 may include an electronic component 150 mounted on a bottom surface of the substrate 140. Electronic components 150 may include passive components such as capacitors, resistors, and the like, and may include active components such as transistors.

The core 110 may be an uninsulated core and may be secured (i.e., adhered) to the multilayer substrate 140 with an adhesive 170. As shown in fig. 2, the adhesive 170 may include portions that are spaced apart along the bottom of the core 110, or may extend along the entire bottom of the core 110. The spacer 130 may be an insulating spacer and may be fixed (i.e., adhered) to the top of the core 140. The spacer 130 may be made by an injection molding process. The spacer 130 may be made of any suitable material that may be injection molded, including polyethylene terephthalate (PET) resin. The spacer 130 may help ensure that the wire bonds 120 do not contact the core 110, which may cause the magnetic assembly module to short. Although the spacer is shown in the figures as a single monolithic body, the spacer may include two or more bodies arranged around a core.

The windings are disposed around the core 110 and include wire bonds 120 extending over the core 110 and traces 145 on or in the substrate 140 extending under the core 110. The wire bonding part 120 includes two end parts bonded to different parts of the substrate 140. As shown in fig. 4, the wire bonds 120 may be attached to the substrate 140 in a single row outside of the spacers 135 and two rows inside of the spacers 135. Other arrangements are possible, including two or more rows outside of spacers 135, and one or more rows inside of spacers 135. The wire bonds 120 define the upper half of the windings. The wire bonds 120 may comprise copper wires, gold wires, aluminum wires, or any other suitable electrically conductive material. The wire bond 120 may be attached to the substrate 140 by ball bonding, wedge bonding, flex bonding, or any other suitable attachment method. The traces 145 may be located on an inner or outer layer of the substrate 140 and define the lower half of the winding. Traces 145 may be located on an inner or bottom surface of substrate 140 if core 110 is uninsulated. Traces 145 may also be on the top surface of substrate 140 if core 110 is insulating or if spacers 130 completely surround the outer surface of core 110 as shown in fig. 22.

The left side of fig. 1 shows an example of a spacer 130 between the top of the core 110 and the wire bond 120, the spacer 130 preventing the wires from contacting the core 110 and from shorting. As shown, the spacers 130 are wider than the width of the core 110 to create an overhang that maintains a predetermined distance between the wire bonds 120 and the core 110. The right side of fig. 1 shows an alternative configuration of spacer 135, where spacer 135 conforms to the top of core 110 and partially covers the sidewalls of core 110. It will be appreciated that, in general, the spacer will have a single cross-sectional shape throughout the spacer and that the two different cross-sectional shapes shown in figure 1 are examples of possible cross-sectional shapes. Fig. 2-4 illustrate a magnetic assembly module 100 that uses spacers 135 that conform to the top of the core 110 and partially cover the sidewalls of the core 110, while fig. 16-21 illustrate the use of spacers 130 that are wider than the width of the core 110 to create an overhung magnetic assembly module.

Fig. 1 also shows that the core 110, spacer 130, and wire bonds 120 may be overmolded with an overmolding material 190 to stabilize and protect the components of the magnetic component module. In addition to overmolding, potting or encapsulation methods may be used to stabilize and protect the components of the magnetic component module.

Fig. 2-4 illustrate examples of magnetic assembly modules 100 with spacers 135 without overmolding material 190. Fig. 2 is a top perspective view, fig. 3 is a side view, and fig. 4 is a top view. Fig. 2-4 show views of spacer 135 having a single cross-sectional shape and conforming to the top of core 110. Fig. 2-4 show core 110, wire bonds 120, substrate 140, assembly 150, I/O pins 150, and adhesive 170.

Fig. 5 shows a cross-sectional view of a magnetic assembly module 100A having a core 110 secured (i.e., adhered) to a multi-layer substrate 140 by an adhesive 170. The top of core 110 is covered by modified

spacers

130A, 135A. Spacers having other shapes are also possible, including, for example, a circumferential spacer 230 as shown in FIG. 22. Similar to fig. 1, the wire bonds 120 define the upper half of the windings, while the traces on the inner layer of the substrate define the lower half of the windings. Fig. 6-8 illustrate an example of a magnetic assembly module 100A with a spacer 135A without an overmold material 190. Fig. 6 is a top perspective view of the magnetic component module 100A of fig. 5. Fig. 7 is a top view of spacer 135A and wire bond 120, with the outline of core 110 shown in phantom, and fig. 8 is a cross-sectional view showing wire bond 120 located within trench 136 of spacer 135A. Similar to fig. 1, circuit components and/or connectors may be located on the bottom surface of the substrate. As shown in fig. 5-7, the magnetic component module 100A may include Surface Mount (SM) or input/output (I/O) pins 160 on the bottom surface of the substrate 140. The magnetic component module 100A may also include an electronic component 150 mounted on the bottom surface of the substrate 140. Fig. 5 also shows that core 110, spacers 130A, spacers 135A, and wire bonds 120 may be covered or encapsulated by an overmolding material 190. The wire bonds 120 may terminate in a single row or in multiple rows.

As shown in fig. 6 and 7, the wire bonds 120 may terminate in a single row at the substrate 140 outside of the core 110 and may terminate in two rows at the substrate 140 inside of the core 110. Other arrangements are also possible. For example, the wire bonds 120 may terminate at the substrate 140 in two or more rows outside of the core 110, and/or may terminate at the substrate 140 in one or more rows inside of the core 110.

During the overmolding process, the wire bonds 120 may collapse due to pressure within the resin mold, causing the wire bonds 120 to collapse and short to the core or adjacent wire bonds 120. To avoid this problem,

trenches

131, 136 are included in

spacers

130A, 135A such that wire bond 120 is located in

trenches

131, 136. The cross-section of the shape of spacers 130A,

trenches

131, 136 in spacers 135A may be U-shaped, V-shaped, rectangular, semi-circular, or any other suitable shape. Fig. 5-8 show each wire bond 120 located in a

corresponding trench

131, 136 defined in

spacers

130A, 135A.

Fig. 9 is a top perspective view of a magnetic assembly module 100B with a further modified spacer 135B, the spacer 135B including intersecting

grooves

137A, 137B. Fig. 10 is a top view of the magnetic assembly module 100B, wherein the outline of the core 110 is indicated by a dashed line. Fig. 11 is a sectional view of the magnetic component module 100B. Similar to fig. 5-8, the spacers 135B shown in fig. 9-11 include

trenches

137A, 137B. The

grooves

137A, 137B may be defined as an X pattern or a V pattern in plan view to route two adjacent wire bonds 120. Fig. 9 and 10 show that the pair of wire bonding portions 120 are provided in the

grooves

137A, 137B and define an X shape. More specifically, as shown in fig. 11, one of the pair of wire bonding portions 120 is buried in the deep trench 137A, and the other of the pair of wire bonding portions 130 is disposed in the shallow trench 137B. Therefore, the adjacent wirings of the pair of wiring junctions 120 are disposed at different depths of the deep trench 137A and the shallow trench 137B, and can cross each other without contacting and short-circuiting the windings of the magnetic assembly module 100A.

Fig. 12-21 illustrate steps of a method of manufacturing a magnetic assembly module 100 having spacers 130. Fig. 12 shows that a substrate 140, such as a PCB, may be provided with traces 145 according to conventional techniques. Fig. 13 illustrates that an adhesive 170 may be deposited on a portion of the surface of the substrate 140 on which the core 110 is to be mounted. Fig. 14 shows that the core 110 may be adhered to a substrate 140 on which an adhesive 170 is deposited. Fig. 15 shows that an adhesive 132 may be deposited on the top surface of the core 110. Fig. 16 shows that the spacer 130 may be adhered to the top surface of the core 110. Fig. 17 shows that the wire bonding part 120 may be formed such that: the wire bonds 120 are attached to the substrate 140, extend over the core 110 and the spacers 130, and do not contact the core 110. Fig. 18 illustrates that the overmold material 190 may be overmolded to cover or encapsulate the core 110, wire bonds 120, and spacers 130. Fig. 19 shows that solder 180 may be deposited on the surface of the substrate 140 opposite the overmolding material 190. Fig. 20 shows that solder 180 can be used to mount the assembly 150 and I/O pins 160 on the substrate 140. Fig. 21 shows the completed magnetic assembly module 100 shown in the left side of fig. 1.

Fig. 22 shows a magnetic assembly module 200 having a core 210 secured (i.e., adhered) to a substrate 240. The magnetic component module 200 includes a core 210, windings defined by wire bonds 220 and traces 245, spacers 230, and a substrate 240. All sides of the core 210 are covered by spacers 230. As shown in fig. 1, the wire bonds 220 define the upper half of the windings. Traces 245 on the top surface of substrate 240 define the lower half of the windings. Because the spacers 230 cover the entire outer surface of the core 210, it is not necessary to use a more expensive multi-layer substrate, and a less expensive substrate 240 without an inner layer may be used. A multilayer substrate in which the traces 245 defining the lower half of the windings are located on a top surface or an inner layer of the multilayer substrate may also be used. Circuit components and/or connectors may be located on the bottom surface of the substrate 240. Fig. 22 also shows that the core 210, spacers 230, and wire bonds 220 may be overmolded with an overmolding material 290. Instead of the spacer 230 extending over the entire outer surface of the core 210, the spacer 230 may only extend over substantially the entire outer surface of the core 210. For example, the spacer 230 may extend over substantially the entire outer surface of the core 210 by having a C-shape such that the top and bottom and the medial or lateral sides of the core 210 are covered while the lateral or medial sides of the core 210 are exposed. Alternatively, the spacer 230 may extend over the entire outer surface of the core 210 by using two spacers, one extending over the top of the core 210 and one extending over the bottom of the core 210.

As shown in fig. 22, the magnetic component module 200 may include Surface Mount (SM) or input/output (I/O) pins 260 on the bottom surface of the substrate 240. The magnetic component module 200 may include an electronic component 250 mounted on a bottom surface of the substrate 240. Electronic components 250 may include passive components such as capacitors, resistors, and the like, and may include active components such as transistors.

Fig. 23-30 illustrate steps of a method of manufacturing the magnetic assembly module 200 shown in fig. 22. Fig. 23 shows that a substrate 240, such as a PCB, may be provided with traces 245 on two opposing outer surfaces according to conventional techniques. Fig. 24 shows that an adhesive 270 may be deposited on the portion of the surface of the substrate 240 on which the core 210 is to be mounted. Fig. 25 shows that the core 210 covered on all sides by the spacers 230 can be adhered to a substrate 240 in which an adhesive 270 is deposited. Fig. 26 shows that the wire bonding portion 220 may be formed such that: wire bonds 220 are attached to substrate 240, extend over core 210 covered by spacers 230, and do not contact core 210. Fig. 27 shows that the overmolding material 290 may be overmolded to cover or encapsulate the core 210, wire bonds 220, and spacers 230. Fig. 28 shows that solder 280 may be deposited on the surface of substrate 240 opposite overmold material 290. Fig. 29 shows that the assembly 250 and I/O pins 260 can be mounted on the substrate 240 using solder 280. Fig. 30 illustrates the completed magnetic assembly module 200 shown in fig. 22.

As described above with respect to fig. 1, 5, and 22, the core may be secured to the top surface of the substrate. Fig. 31 shows an alternative arrangement of the magnetic component module 300, where the adhesive or glue layer 370 is thick enough to create a gap between the core 310 and the substrate 340 to allow the overmold material 390 to extend under the core 310 after bonding of the wire bonds 320. The magnetic assembly module 300 includes a core 310, windings defined by wire bonds 320 and traces 345, spacers 330, and a substrate 340. Fig. 31 shows a truncated conical shaped adhesive layer 370 disposed below the core 310, which creates a gap between the core 310 and the substrate 340. The overmold material 390 may extend into the gap between the core 310 and the substrate 340, providing an additional insulating layer to strengthen the isolation barrier between the core 310 and the traces 345 on the top surface of the substrate 340. Because the overmold material 390 fills the gap between the core 310 and the substrate 340, a more expensive multi-layer substrate need not be used, and a less expensive substrate 340 without an inner layer can be used. A multilayer substrate in which the traces 345 defining the lower half of the winding are located on a top surface or an inner layer of the multilayer substrate may also be used.

The left side of fig. 31 shows an example of a spacer 330 between the top of the core 310 and the wire bond 320, the spacer 130 preventing the wires from contacting the core 310 and from shorting. As shown, spacer 330 is wider than the width of core 310 to create an overhang that maintains a predetermined distance between wire bond 320 and core 310. The right side of fig. 31 shows an alternative configuration of spacers 335, where the spacers 335 are coincident with the top of the core 310 and partially cover the sidewalls of the core 310. It will be appreciated that, in general, the spacer will have a single cross-sectional shape throughout the spacer and that the two different cross-sectional shapes shown in figure 31 are examples of possible cross-sectional shapes. Fig. 36-41 illustrate the use of spacers 130 that are wider than the width of the core 110 to create an overhung magnetic assembly module.

As shown in fig. 31, the magnetic component module 300 may include Surface Mount (SM) or input/output (I/O) pins 360 on the bottom surface of the substrate 340. The magnetic component module 300 may include an electronic component 350 mounted on a bottom surface of the substrate 340. Electronic components 350 may include passive components such as capacitors, resistors, and the like, and may include active components such as transistors.

Fig. 32-41 illustrate steps of a method of manufacturing the magnetic assembly module 300 shown in fig. 31. Fig. 32 shows that a substrate 340, such as a PCB, may be provided with traces 345 on two opposing outer surfaces according to conventional techniques. Fig. 33 shows that an adhesive 370 may be deposited on the portion of the surface of the substrate 340 on which the core 310 is to be mounted. Fig. 34 shows that the core 310 may be adhered to a substrate 340 having an adhesive 370 deposited thereon. Fig. 35 shows that adhesive 332 may be deposited on the top surface of core 310. Fig. 36 shows that spacers 330 may be adhered to the top surface of core 310. Fig. 37 shows that the wire bonding portion 320 may be formed such that: wire bonds 220 are attached to substrate 340, extend over core 310 and spacers 330, and do not contact core 310. Fig. 38 shows that the overmold material 390 may be overmolded to cover or encapsulate the core 310, wire bonds 320, spacers 330, and adhesive 370. Fig. 39 shows that solder 380 may be deposited on the surface of the substrate 340 opposite the overmold material 390. Fig. 40 shows that solder 380 can be used to mount the assembly 350 and I/O pins 360 on the substrate 340. Fig. 41 illustrates the completed magnetic assembly module 300 shown in fig. 31.

Fig. 42 shows a magnetic component module 400 similar to that shown in fig. 1, except that input/output (I/O) pins 460 of the magnetic component module 400 may be located on the same side of the substrate 440 as the core 410, wire bonds 420, and spacers 430. The magnetic component module 400 includes a core 410, windings defined by wire bonds 420 and traces 445, spacers 430, and a substrate 440.

The I/O pins 460 may be made of metal posts or metal cylinders that are connected to landing pads on the substrate 440 via a surface mount process. After the magnetic component module 400 including the I/O pins 460 and the circuit components 450 is overmolded, the top surface of the magnetic component module 400 may be ground to remove the overmolding material 490 and expose the I/O pins 460. Exposing the I/O pins 460 on the same side of the substrate 440 as the core 410 allows for a smaller and more integrated arrangement of components because overmolding allows for a smaller gap between the primary and secondary circuit components.

As shown in fig. 42, the magnetic component module 400 may include an electronic component 450 mounted on a bottom surface of a substrate 440. The electronic components 450 may include passive components such as capacitors, resistors, and the like, and may include active components such as transistors.

Fig. 43-55 illustrate steps of a method of manufacturing the magnetic assembly module 400 shown in fig. 42. Fig. 43 shows that a substrate 440, such as a PCB, may be provided with traces 445 according to conventional techniques. Fig. 44 shows that adhesive 470 may be deposited on the portion of the surface of the substrate 440 on which the core 410 is to be mounted. Fig. 45 shows that the core 410 may be adhered to a substrate 440 on which an adhesive 470 is deposited. Fig. 46 shows that adhesive 432 may be deposited on the top surface of core 410. Fig. 47 shows that spacers 430 may be adhered to the top surface of the core 410. Fig. 48 shows that the wiring joint 420 may be formed such that: the wire bonds are attached to the substrate 440, extend over the core 410 and spacers 430, and do not contact the core 410. Fig. 49 shows that solder 485 may be deposited on the same surface of the substrate 440 as the core 410. Fig. 50 shows that I/O pins 460 may be mounted on a substrate 440 with solder 485 deposited therein. Fig. 51 shows that the overmold material 490 may be overmolded to cover or encapsulate the core 410, wire bonds 420, spacers 430, and I/O pins 460. Fig. 52 shows that a portion of the overmold material 490 may be removed to expose I/O pins 460. Fig. 53 illustrates that solder 480 may be deposited on the surface of the substrate 440 opposite the core 410 and the overmolding material 490. Fig. 54 shows that solder 480 can be used to mount the assembly 450 on the substrate 440. Fig. 55 illustrates that the overmold material 495 can be overmolded to cover or encapsulate the assembly 450 to complete the magnetic assembly module 400 shown in fig. 55.

Alternatively, the overmolding material may be overmolded in the same step to cover or encapsulate the core 410, wire bonds 420, spacers 430, I/O pins 460, and electronic components 450.

Fig. 56 is a block diagram of an example of an implementation of the magnetic component module TXM. In fig. 56, the magnetic component module TXM is implemented as an isolation converter, wherein the isolation boundaries are shown by dashed lines of the transformer TX. The primary side on the left side of fig. 56 and connected to the primary winding PR is isolated from the secondary side on the right side of fig. 56 and connected to the secondary winding SEC. For example, fig. 56 shows that the electronic module TXM may comprise a switching stage SS, a control stage CS, a transformer TX, a rectification stage RS and an output filter LC. The transformer TX may include a core and windings defined by the aforementioned wire bonds and traces. The circuitry and components other than the transformer TX may include other electronic components attached to a substrate or PCB on which the transformer TX is mounted, as previously described.

As shown in fig. 56, the switching stage SS receives an input voltage Vin and outputs a voltage SSout to at least one primary winding PRI of the transformer TX. The switching stage may comprise switches or transistors controlling the power flow. The control stage CS comprises an input control signal CSin. The control stage CS may control the switching of the switches in the switching stage SS and may monitor the transformer TX via the auxiliary winding AUX. The vertical dashed lines through the transformer TX represent the galvanic isolation between the primary winding PRI and the auxiliary winding AUX and the secondary winding SEC. The secondary winding of the transformer TX may be connected to a rectifier stage RS, which is in turn connected to an output filter LC, which outputs a DC voltage between + Vout and-Vout. The rectifier stage may include a diode and/or a synchronous rectifier that rectifies the voltage at the secondary winding SEC. The output filter LC may comprise an arrangement of inductors and capacitors to filter unwanted frequencies.

Fig. 57 is a block diagram of a gate drive circuit application that may include one or more of the magnetic component modules TXM shown in fig. 56. The vertical and horizontal dashed lines represent galvanic isolation. FIG. 57 shows magnetismThe component module TXM may comprise an input of e.g. +12Vdc and outputs of-5 Vdc and +18Vdc, which may be used for driving e.g. Metal Oxide Semiconductor Field Effect Transistors (MOSFET) or Insulated Gate Bipolar Transistors (IGBT). The output of the magnetic assembly module TXM may be connected to a gate driver IXDD614 YI. The controller CONT may send and receive control signals represented by those shown in the dashed boxes including, for example, power supply disable, pulse width modulation PWM enable, low and high side PWM, overcurrent detection, etc. Control signals may be sent and received between the controller CONT and the isolation circuit ISO and between the controller CONT and the magnetic component module TXM. The isolation circuit ISO can receive and transmit a feedback signal V_DSAnd (6) measuring. The isolation circuitry may include transformers, capacitors, optocouplers, digital isolators, and the like. The output of the gate drive circuit may be connected to the gates of switches located in the inverter unit circuit as part of an inverter for a motor control application as shown in fig. 58.

Fig. 58 shows a circuit for a motor control application that may include a power source PS, such as an inverter INV, operating at a fixed frequency of 50Hz or 60Hz, and a motor MTR operating at its desired frequency. As shown, the inverter INV may include a power converter PC, a smoothing circuit S, and an inverter unit circuit IU controlled by PWM control. Fig. 58 illustrates that the controller CONT may be included to control the gate driving unit GDU of fig. 57. The gate drive unit GDU may control the gates of the switches within the inverter unit circuit IU. Feedback FB may be provided from the motor MTR to the controller CONT to stabilize the control of the gate driving unit GDU.

The package including the magnetic assembly module may be of any size. For example, the package may be about 12.7mm by about 10.4mm by about 4.36 mm. Packages having these dimensions may provide higher isolation. Magnetic component modules can be used in many different applications, including, for example, industrial, medical, and automotive applications. For example, as explained above, the magnetic component module may be included in a gate driver. For example, the magnetic component module may provide 1W to 2W of power, with an efficiency exceeding 80%, and may provide a 3kV or 5kV breakdown voltage rating depending on the footprint of the magnetic component module. For example, the magnetic component module may include UL required enhanced isolation and may operate at a temperature between about-40 ℃ and about 105 ℃ or between about-40 ℃ and about 125 ℃. For example, depending on the application, the magnetic assembly module may have a moisture sensitivity rating (MSL) of 1 or 2. The magnetic assembly module may be used for battery management systems or programmable logic controllers and RS484/232 compliant data acquisition and communication.

If the magnetic component module comprises a transformer, for example, the primary winding may comprise at least 20 turns and the secondary winding may comprise 12 turns. For example, the coupling coefficient of the transformer may be 0.99. For example, the primary winding may have a Direct Current Resistance (DCR) of about 17.8 Ω/turn, while the secondary winding may have a DCR of about 16.9 Ω/turn. The maximum current may be 600mA (over-current protection), typically 300mA, for example to ensure that the magnetic component module is not damaged in such over-current situations. For example, the core may have an inner diameter of about 5.4mm, an outer diameter of about 8.8mm, and a height of about 1.97 mm. For example, the spacer may have an inner diameter of about 5.1mm, an outer diameter of about 8.8mm, and a height of about 0.2 mm. For example, the transformer may have a size of about 12.7mm by about 10.4mm by about 2.5 mm. The core may be made of any suitable material, including, for example, Mn-Zn, Ni-Zn, FeNi, and the like. The spacer may be made of any suitable material including, for example, an epoxy adhesive. The wire bonds may be made of any suitable material including, for example, aluminum or copper. The pins may be made of any suitable material, including, for example, Cu with a Ni-Sn coating. The overmold material may be made of any suitable material, including, for example, epoxy.

It should be understood that the above description is only illustrative of the present invention. Various alternatives and modifications can be devised by those skilled in the art without departing from the invention. Accordingly, the present invention is intended to embrace all such alternatives, modifications and variances which fall within the scope of the appended claims.

Claims

1. A magnetic component module, comprising:

a substrate;

a core on a first surface of the substrate;

a spacer on the core;

a winding, comprising:

a wire bond extending over the core and electrically connecting a first portion of the substrate with a second portion of the substrate; and

traces on and/or in the substrate; and

an overmolding material encapsulating the core, the spacer and the wire bonds, wherein

The wire bond is routed through a trench included in the spacer.

2. The magnetic component module of claim 1, wherein an electronic component is attached to a second surface of the substrate opposite the first surface of the substrate.

3. The magnetic component module of claim 1 or 2, wherein the spacer conforms to a top of the core.

4. The magnetic component module of claim 1 or 2, wherein an edge of the spacer overhangs the core.

5. The magnetic component module according to claim 1 or 2, wherein the spacer extends over or substantially over the entire outer surface of the core.

6. The magnetic component module of any one of claims 1 to 5, wherein

The wire bond includes a first wire bond and a second wire bond,

the trenches included in the spacers include a first trench and a second trench crossing each other, an

Each of the first and second wire bonds is routed through one of the first and second trenches, respectively.

7. The magnetic component module of any one of claims 1 to 6, further comprising a gap between a bottom surface of the core and the first surface of the substrate, wherein

The overmold material fills the gap.

8. The magnetic component module of claim 7, wherein

An adhesive is in the gap between the core and the substrate, and

the overmolding encapsulates the adhesive.

9. The magnetic component module of any one of claims 1 to 8, further comprising input/output pins on a surface of the substrate.

10. The magnetic component module of claim 9, wherein the input/output pins are exposed on the first surface of the substrate.

11. The magnetic component module of any one of claims 1 to 10, further comprising an adhesive mounting the core to the substrate.

12. The magnetic component module of any one of claims 1 to 11, wherein the spacer comprises a polyethylene terephthalate resin.

13. A method of manufacturing a magnetic component module, the method comprising:

providing a substrate;

depositing a first adhesive on a portion of the first surface of the substrate;

adhering a core to the portion of the first surface of the substrate on which the first adhesive is deposited;

providing a spacer on the core;

connecting a first conductive portion of the substrate with a second conductive portion of the substrate with a wire bond;

passing the wire bond through a trench included in the spacer;

providing a trace on and/or in the substrate; and

overmolding the core, the spacer, and the wire bond with an overmolding material; wherein

The wire bonds and the traces define windings.

14. The method of claim 13, further comprising:

depositing a second binder on the core; and

adhering the spacer to the core using the second adhesive.

15. The method of claim 13 or 14, further comprising attaching an electronic component to a second surface of the substrate opposite the first surface of the substrate.

16. The method of any one of claims 13-15, wherein the spacer is coincident with a top of the core.

17. The method of any one of claims 13 to 15, wherein the edges of the spacer overhang the core.

18. The method of any one of claims 13 to 15, wherein the spacer extends over or substantially over the entire outer surface of the core.

19. The method of any one of claims 13 to 18, wherein

The wire bond includes a first wire bond and a second wire bond,

20. The method of any one of claims 13 to 19, wherein

The first adhesive defining a gap between the core and the substrate, an

The overmold material encapsulates the first adhesive.

21. The method of any one of claims 13 to 20, further comprising mounting input/output pins on a surface of the substrate.

22. The method of claim 21, wherein the input/output pins are exposed on a first surface of the substrate.

23. The method of any of claims 13-22, wherein the spacer comprises a polyethylene terephthalate resin.

24. The method of claim 15, further comprising overmolding the electronic component.