CN114079719A - Image sensor, imaging device, and electronic apparatus - Google Patents
Image sensor, imaging device, and electronic apparatus Download PDFInfo
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- CN114079719A CN114079719A CN202010854179.2A CN202010854179A CN114079719A CN 114079719 A CN114079719 A CN 114079719A CN 202010854179 A CN202010854179 A CN 202010854179A CN 114079719 A CN114079719 A CN 114079719A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
- H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
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- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The application discloses image sensor, including a plurality of pixel units that are the array and arrange, pixel unit includes first pixel unit, first pixel unit includes the dimming layer, the dimming layer is used for adjusting the transmissivity to the imaging beam, selectively controls first pixel unit generates black level signal or receives the imaging beam generates the image signal. The application also discloses an imaging device and an electronic device. The method and the device have the advantages of high imaging resolution and high pixel utilization rate.
Description
Technical Field
The present application relates to the field of optoelectronics, and in particular, to an image sensor, an imaging device, and an electronic apparatus.
Background
A common imaging device includes an image sensor and a lens. An image sensor generally includes a pixel array, which is formed by arranging a plurality of pixel units in a matrix array, and is capable of receiving an optical signal and generating an electrical signal. An image sensor converts an optical signal into an electrical signal, which needs to pass through an analog-to-digital conversion module, but due to the limitation of the analog-to-digital conversion precision, a small voltage value cannot be converted, dark details in an image cannot be displayed, and in order to retain the dark details in the image, an image sensor manufacturer adds a fixed offset, namely a black level, to the voltage before the analog-to-digital conversion input. In addition, ideally, the electrical signal generated by the pixel unit can accurately represent the received light signal energy, and actually, due to circuit noise interference, the pixel unit generates a dark current even when the light signal is not received. Dark current is related to exposure time and circuit gain, and the magnitude of dark current varies from pixel cell to pixel cell. Therefore, the black level calibration is performed before the image data is processed. Typically, some of the pixel cells at the periphery of the pixel array will be set as black pixels for providing a black level. However, since these black pixels are not used for actual imaging but occupy the position of the pixel array, the pixel unit of the image sensor has a low utilization rate and the imaging resolution is low.
Disclosure of Invention
In view of the above, the present application provides an image sensor, an imaging device and an electronic apparatus, which can overcome or improve the problems of the prior art, and the details thereof are as follows:
one aspect of the present application provides an image sensor, including a plurality of pixel units arranged in an array, where each pixel unit includes a first pixel unit including a dimming layer configured to adjust transmittance of an imaging light beam, so as to selectively control the first pixel unit to generate a black level signal or receive the imaging light beam and generate an electrical image signal.
In some embodiments, when the transmittance of the dimming layer for the imaging light beam is a first transmittance, the first pixel unit is configured to generate a black level signal; when the transmittance of the light modulation layer to the imaging light beam is a second transmittance, the first pixel unit is used for receiving the imaging light beam and converting the imaging light beam into an image electric signal, and the second transmittance is greater than the first transmittance.
In some embodiments, the first pixel cell further comprises:
a lens layer for transmitting and converging the imaging light beam;
the filter layer is positioned below the lens layer and used for transmitting light beams in a target waveband and filtering light beams outside the target waveband, the wavelength of the imaging light beam is within the target waveband, and the filter layer is positioned between the lens layer and the dimming layer or the dimming layer is positioned between the lens layer and the filter layer;
and the photosensitive layer is positioned below the dimming layer and used for receiving the imaging light beams passing through the lens layer, the filter layer and the dimming layer and converting the received imaging light beams into the image electric signals or generating the black level signals.
In certain embodiments, the lens layer comprises microlenses.
In some embodiments, the target wavelength band includes a visible wavelength band, and the imaging beam is visible light.
In some embodiments, the filter layer comprises one or more of a red filter for transmitting red light and filtering out light beams other than red light, a green filter for transmitting green light and filtering out light beams other than green light, and a blue filter for transmitting blue light and filtering out light beams other than blue light, the imaging light beams comprising the red light, the blue light, and the green light.
In some embodiments, the pixel unit further includes a second pixel unit, the first pixel unit is located at the periphery of the second pixel unit, and the second pixel unit is configured to receive the imaging light beam and convert the received imaging light beam into an electrical image signal.
In some embodiments, the light modulation layer comprises an electrochromic material, and when the electrochromic layer is powered on, the light modulation layer has the first transmittance; when the electrochromic layer is not electrified, the transmittance of the dimming layer to the imaging light beam is the second transmittance.
In certain embodiments, the first transmittance is less than or equal to 0, 0.5%, 1%, 2%, 3%, 4%, 5%.
In certain embodiments, the second transmittance is greater than or equal to 75%, 80%, 85%, 90%, 95%.
An aspect of the present application provides an imaging apparatus including the image sensor described above and a lens assembly located above the image sensor.
An aspect of the present application provides an electronic device including the above-described image sensor, or the above-described imaging apparatus.
The image sensor comprises the first pixel unit, wherein the first pixel unit comprises a dimming layer which can be used for adjusting the transmittance of the imaging light beam, so that the first pixel unit is selectively controlled to generate a black level signal or receive the imaging light beam and generate an image electric signal. The first pixel unit of the present application may be multiplexed into a black pixel unit and an imaging unit for generating a black level signal and an image electric signal. Therefore, the image sensor, the imaging device and the electronic equipment have more pixel units which can be used for generating image electric signals, and have higher pixel utilization rate and higher imaging resolution.
Drawings
FIG. 1 is a schematic view of one embodiment of an electronic device of the present application;
FIG. 2 is a schematic partial cross-sectional view of the imaging device of FIG. 1 taken along line A-A;
FIG. 3 is a block schematic diagram of a portion of the circuitry of the image sensor of FIG. 2;
FIG. 4 is a schematic diagram of an arrangement of one embodiment of the pixel cell of FIG. 2;
FIG. 5 is a schematic cross-sectional view of a portion of the first pixel cell of FIG. 4;
fig. 6 is a schematic partial cross-sectional view of the light modulation layer of fig. 5.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. The following embodiments and their technical features may be combined with each other without conflict. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, which is a perspective view of an electronic device 1 according to the present application, the electronic device 1 includes an imaging device 10, and the imaging device 10 may be used to generate an image, such as but not limited to an environment image or a person image. Generally, a surface having a display area for a user to browse or touch is referred to as a front surface of the electronic device 1, a surface facing away from the front surface of the electronic device 1 is referred to as a back surface of the electronic device 1, and a side surface of the electronic device 1 is located between the front surface and the back surface. Alternatively, in some embodiments, the imaging device 10 may be located on the front or back or side of the electronic apparatus 1. For example, but not limiting of, the imaging device 10 may be a front-facing camera or a rear-facing camera.
Optionally, the electronic device 1 has a length direction, a width direction and a thickness direction that are perpendicular to each other. For example, but not limiting of, as shown in fig. 1, the electronic device 1 has a length direction parallel to the Y-axis, a width direction parallel to the X-axis, and a thickness direction parallel to the Z-axis. The two ends of the electronic device 1 along the length direction are respectively defined as a top and a bottom, for example, but not limited to, the imaging device 10 illustrated in fig. 1 is located at the middle position of the top of the electronic device 2. Of course, the imaging device 10 may be located at the bottom or the middle area of the electronic apparatus 2, which is not limited in this application. The electronic device 1 may comprise a display (not shown) by means of which the electronic device 1 may display information. The display may be a Liquid Crystal Display (LCD), an Organic Light Emitting Diode (OLED) display, a Mini-LED display, a Micro-LED display, or the like, which is not limited in this application.
The electronic device 1 is, for example, but not limited to, a suitable type of electronic product such as a consumer electronic product, a home electronic product, a vehicle-mounted electronic product, a financial terminal product, and the like. The consumer electronic products include, for example, mobile phones, tablet computers, notebook computers, desktop monitors, all-in-one computers, and the like. Household electronic products are, for example, smart door locks, televisions, refrigerators and the like. The vehicle-mounted electronic product is, for example, a vehicle-mounted navigator, a vehicle-mounted DVD, or the like. The financial terminal products are ATM machines, terminals for self-service business and the like.
Fig. 2 is a partial cross-sectional view of the imaging device 10 of fig. 1 taken along line a-a. The imaging device 10 includes an image sensor 11 and a lens assembly 12 located above the image sensor 11. The lens assembly 12 may include a convex lens and/or a concave lens, and after the lens assembly 12 optically modulates the imaging light beam 101, the imaging light beam 101 may be received by the image sensor 11 after passing through the lens assembly 12. The image sensor 11 can convert the received imaging light beam 101 into an electrical image signal.
Fig. 3 is a block diagram of a portion of the circuit of the image sensor 11 shown in fig. 2. The image sensor 11 may include a pixel array 12, a row control circuit 13, and a readout circuit 14. The pixel array 12 may include a plurality of pixel units 15 arranged in an array. For example, but not limited to, the plurality of pixel units 15 may have a rectangular array arrangement, a mosaic array arrangement, a triangular array arrangement, a hexagonal array arrangement, and the like, which is not limited in the present application. The row control circuit 13 is configured to provide row control signals to the pixel units 15 of the pixel array 12, and the readout circuit 14 is configured to read the image electrical signals generated by the pixel units 15 of the pixel array 12 and perform signal processing on the image electrical signals.
Fig. 4 is a schematic layout diagram of one embodiment of the pixel unit 15 of the pixel array 12. The pixel unit 15 includes a first pixel unit 16 and a second pixel unit 17. The second pixel units 17 are arranged in a rectangular array, and the first pixel units 16 are located at two opposite sides of the periphery of the second pixel units 17. It should be noted that the number and the positions of the first pixel units 16 and the second pixel units 17 shown in fig. 4 are only examples and are not limited, and the number of the first pixel units 16 and/or the second pixel units 17 may be one or more, and the arrangement and the positions thereof may also be changed, which is not limited in the present application. Further, in some embodiments, the pixel unit 15 may also include only the first pixel unit 16.
Fig. 5 is a partial cross-sectional view of the first pixel unit 16. The first pixel unit 16 includes a photosensitive layer 164, a dimming layer 163, a filter layer 162, and a lens layer 161 sequentially arranged from bottom to top. The photosensitive layer 164 may include a photoelectric conversion device, for example, but not limited to, the photosensitive layer 164 may include a photodiode (Photo Diode). The photosensitive layer 164 receives the imaging light beam 101 and converts photons into electrons, thereby generating an electrical image signal.
The lens layer 161 is used to transmit and focus the imaging light beam 101. Optionally, the Lens layer 161 includes Micro lenses (Micro Lens).
The filter layer 162 is located below the lens layer 161, and is configured to transmit a light beam in a target wavelength band and filter a light beam outside the target wavelength band, where a wavelength of the imaging light beam 101 is within the target wavelength band. The filter layer 162 illustrated in fig. 5 is located between the lens layer 161 and the light modulation layer 163. Alternatively, in other or modified embodiments, the filter layer 162 is located between the lens layer 161 and the light modulation layer 163, or the light modulation layer 163 is located between the lens layer 161 and the filter layer 162.
Optionally, in some embodiments, the imaging light beam 101 includes visible light, and the target wavelength band is a visible wavelength band.
Optionally, in some embodiments, the filter layer 162 includes one or more of a red filter (e.g., labeled R in fig. 4) for transmitting red light and filtering out light beams other than red light, a green filter (e.g., labeled G in fig. 4) for transmitting green light and filtering out light beams other than green light, and a blue green filter (e.g., labeled B in fig. 4) for transmitting blue light and filtering out light beams other than blue light, and the imaging light beam 101 may include the red light, the blue light, and the green light.
The light modulation layer 163 is used to adjust the transmittance for the imaging light beam 101 to selectively control the first pixel unit 16 to generate a black level signal or receive the imaging light beam and generate an image electric signal. Optionally, in some embodiments, when the transmittance of the dimming layer 163 for the imaging light beam 101 is a first transmittance, the first pixel unit 16 is configured to generate a black level signal; when the transmittance of the light modulation layer 163 for the imaging light beam 101 is a second transmittance, the first pixel unit 16 is configured to receive the imaging light beam 101 and convert the imaging light beam into an electrical image signal, where the second transmittance is greater than the first transmittance. For example, but not limited to, the first transmittance may be less than or equal to 0, 0.5%, 1%, 2%, 3%, 4%, 5%, and the second transmittance may be greater than or equal to 75%, 80%, 85%, 90%, 95%. It is to be understood that the first transmittance should be as small as possible, for example, close to or equal to 0. The second transmittance should be as large as possible, for example greater than or equal to 95%. As such, when the dimming layer 163 has a first transmittance, the first pixel unit 16 may function as a black pixel unit for generating a black level signal; when the dimming layer 163 has the second transmittance, the first pixel unit 16 may serve as an imaging pixel for receiving the imaging light beam 101 and generating an image electric signal.
Fig. 6 is a partial cross-sectional view of the light modulation layer 163 shown in fig. 5. The dimming layer 163 may include a second substrate 1635, a second conductive layer 1634, an electrochromic layer 1633, a first conductive layer 1632, and a first substrate 1631 stacked in sequence from bottom to top. The first substrate 1631 and the second substrate 1635 may be made of glass, a transparent polymer material, or any other suitable transparent material. The first conductive layer 1632 and the second conductive layer 1634 may be Indium Tin Oxide (ITO) semiconductor transparent conductive films. When the first conductive layer 1632 and the second conductive layer 1634 are energized (i.e., under the action of an applied electric field), the electrochromic layer 1633 is electrically colored, and at this time, the transmittance of the electrochromic layer 1633 to the imaging light beam 101 is small. When the first conductive layer 1632 and the second conductive layer 1634 are powered off (i.e., no electric field is applied), the electrochromic layer 1633 is electrically discolored, and at this time, the transmittance of the electrochromic layer 1633 to the imaging light beam 101 is relatively high. Optionally, in some embodiments, when the electrochromic layer 1633 is powered on, the transmittance of the light modulation layer 163 for the imaging light beam 101 is the first transmittance; when the electrochromic layer 1633 is not energized, the transmittance of the light modulation layer 163 for the imaging light beam 101 is the second transmittance.
It is understood that, since the first substrate 1631, the first conductive layer 1632, the second conductive layer 1634 and the second substrate 1635 are made of transparent materials, the first substrate 1631, the first conductive layer 1632, the second conductive layer 1634 and the second substrate 1635 can be considered to have high transmittance (e.g., greater than or equal to 95%) for the imaging light beam 101. Thus, the transmittance of the electrochromic layer 1633 with respect to the imaging light beam 101 determines the transmittance of the dimming layer 163 with respect to the imaging light beam 101.
The electrochromic layer 1633 includes an electrochromic material whose absorption wavelength can produce a reversible change in color under the action of an applied electric field. The electrochromic material may be structurally classified into an inorganic electrochromic material and an organic electrochromic material. The inorganic color-changing material may be, for example, but not limited to: transition metal oxides, such as tungsten oxide, molybdenum oxide, nickel oxide, cobalt oxide, cause the valence state change of metal ions under different voltages due to ion and electron injection, thereby realizing the appearance of a specific color (e.g., black) under the action of an electric field and the restoration of transparency under the action of no electric field. Organic electrochromic materials can be classified into small molecule color-changing materials and high molecule color-changing materials, such as but not limited to conducting polymers, such as polyaniline, polythiophene, polypyrrole, PEDOT, and the like, which can take on red, blue, purple, and the like colors when an electric field is applied. Of course, the embodiment of the present application is not limited to the specific structure and material of the electrochromic layer 1633, and any optical film layer with different transmittance to the imaging light beam 101 when an electric field is applied and not applied is within the scope of the present application.
In summary, the image sensor 11 includes the pixel array 12, the pixel array 12 includes the first pixel unit 16, and the first pixel unit 16 includes a light modulation layer 163, which can be used to adjust the transmittance of the imaging light beam 101, so as to selectively control the first pixel unit to generate a black level signal or receive the imaging light beam and generate an image electrical signal. Accordingly, the first pixel unit 16 of the image sensor 11 of the present application can be multiplexed into a black pixel unit and an imaging unit for generating a black level signal and an image electric signal. Compared with the prior art, the image sensor 11, the imaging device 10 and the electronic device 1 have more pixel units which can be used for generating image electric signals, so that the image sensor has higher pixel utilization rate and higher imaging resolution.
Although the invention has been shown and described with respect to one or more implementations, equivalent alterations and modifications will occur to others skilled in the art based upon a reading and understanding of this specification and the annexed drawings. The present invention includes all such modifications and variations, and is limited only by the scope of the following claims. In particular regard to the various functions performed by the above described components, the terms used to describe such components are intended to correspond, unless otherwise indicated, to any component which performs the specified function of the described component (e.g., that is functionally equivalent), even though not structurally equivalent to the disclosed structure which performs the function in the herein illustrated exemplary implementations of the specification. In addition, while a particular feature of the specification may have been disclosed with respect to only one of several implementations, such feature may be combined with one or more other features of the other implementations as may be desired and advantageous for a given or particular application. Furthermore, to the extent that the terms "includes," has, "" contains, "or variants thereof are used in either the detailed description or the claims, such terms are intended to be inclusive in a manner similar to the term" comprising. Further, it is understood that reference to "a plurality" herein means two or more. For the steps mentioned in the text, the numerical suffixes are only used for clearly expressing the embodiments and are convenient for understanding, the execution sequence of the steps is not completely represented, and the logical relationship should be set as the consideration
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent structures or equivalent flow transformations made by using the contents of the specification and the drawings, such as the mutual combination of technical features between various embodiments, or the direct or indirect application to other related technical fields, are included in the scope of the present invention.
Claims (12)
1. An image sensor, comprising a plurality of pixel units arranged in an array, the pixel units comprising:
the first pixel unit comprises a dimming layer, and the dimming layer is used for adjusting the transmittance of an imaging light beam, selectively controlling the first pixel unit to generate a black level signal or receiving the imaging light beam and generating an image electric signal.
2. The image sensor of claim 1, wherein the first pixel unit is configured to generate a black level signal when the transmittance of the light modulation layer for the imaging light beam is a first transmittance; when the transmittance of the light modulation layer to the imaging light beam is a second transmittance, the first pixel unit is used for receiving the imaging light beam and converting the imaging light beam into an image electric signal, and the second transmittance is greater than the first transmittance.
3. The image sensor of claim 1, wherein the first pixel cell further comprises:
a lens layer for transmitting and converging the imaging light beam;
the filter layer is positioned below the lens layer and used for transmitting light beams in a target waveband and filtering light beams outside the target waveband, the wavelength of the imaging light beam is within the target waveband, and the filter layer is positioned between the lens layer and the dimming layer or the dimming layer is positioned between the lens layer and the filter layer;
and the photosensitive layer is positioned below the dimming layer and used for receiving the imaging light beams passing through the lens layer, the filter layer and the dimming layer and converting the received imaging light beams into the image electric signals or generating the black level signals.
4. The image sensor of claim 3, wherein the lens layer comprises microlenses.
5. The image sensor of claim 3, wherein the target wavelength band comprises a visible wavelength band and the imaging beam is visible light.
6. The image sensor of claim 5, wherein the filter layer comprises one or more of a red filter for transmitting red light and filtering out light beams other than red light, a green filter for transmitting green light and filtering out light beams other than green light, and a blue filter for transmitting blue light and filtering out light beams other than blue light, wherein the imaging light beams comprise the red light, the blue light, and the green light.
7. The image sensor of claim 1, wherein the pixel unit further comprises a second pixel unit, the first pixel unit is located at a periphery of the second pixel unit, and the second pixel unit is configured to receive an imaging beam and convert the received imaging beam into an electrical image signal.
8. The image sensor of claim 2, wherein the light modulation layer comprises an electrochromic layer, and when the electrochromic layer is powered on, the light modulation layer has the first transmittance for the imaging light beam; when the electrochromic layer is not electrified, the transmittance of the dimming layer to the imaging light beam is the second transmittance.
9. The image sensor of claim 2, wherein the first transmittance is less than or equal to 0, 0.5%, 1%, 2%, 3%, 4%, 5%.
10. The image sensor of claim 2, wherein the second transmittance is greater than or equal to 75%, 80%, 85%, 90%, 95%.
11. An imaging apparatus comprising the image sensor of any one of claims 1 to 10, and a lens assembly located above the image sensor.
12. An electronic device, characterized in that it comprises an image sensor according to any one of claims 1 to 10, or an imaging apparatus according to claim 11.
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