CN114079000B - Packaging system of SAW filter - Google Patents

Packaging system of SAW filter Download PDF

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Publication number
CN114079000B
CN114079000B CN202210057195.8A CN202210057195A CN114079000B CN 114079000 B CN114079000 B CN 114079000B CN 202210057195 A CN202210057195 A CN 202210057195A CN 114079000 B CN114079000 B CN 114079000B
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module
bonding
packaging
saw
parameters
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CN114079000A (en
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不公告发明人
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Shenzhen Newsonic Technologies Co Ltd
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Shenzhen Newsonic Technologies Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/10—Geometric CAD
    • G06F30/17—Mechanical parametric or variational design
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G06F30/23—Design optimisation, verification or simulation using finite element methods [FEM] or finite difference methods [FDM]
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/02—Forming enclosures or casings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/03—Assembling devices that include piezoelectric or electrostrictive parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2111/00—Details relating to CAD techniques
    • G06F2111/04—Constraint-based CAD

Abstract

The invention provides a packaging system of a SAW filter. The cap cover plate manufacturing module comprises: the blind hole parameter and the metal layer laying parameter are obtained, and the blind hole and the metal layer are arranged on the cap cover plate to generate a target cap cover plate; a device wafer manufacturing module: for processing the device wafer into SAW wave filter devices; a cavity manufacturing module: the system comprises a target cap plate, an SAW wave filter device, a closed cavity model and a data acquisition module, wherein the target cap plate is used for determining the corresponding relation between the target cap plate and the SAW wave filter device and constructing the closed cavity model; packaging the module: and the bonding module is used for bonding the target cap plate and the SAW wave filter device according to the closed cavity model, arranging a bonding pad on the cap plate and carrying out welding packaging. Compared with the prior art, the invention is more convenient, and the invention comprises design and welding, and can adapt to various packaging methods.

Description

Packaging system of SAW filter
Technical Field
The invention relates to the technical field of filter packaging, in particular to a packaging system of an SAW filter.
Background
The SAW filter is also called a surface acoustic wave filter. The surface acoustic wave filter is an important part of a mobile communication terminal product, and the raw material is made of piezoelectric crystals. With the miniaturization and low cost of the mobile terminal, the requirement for packaging the surface acoustic wave filter is also increased correspondingly. Meanwhile, due to the performance and design function requirements of the surface acoustic wave filter product, the functional area of the filter chip is required to be ensured not to contact any substance, namely, the cavity structure design. Based on the requirements of the surface acoustic wave filter on the cavity structure in the packaging structure and the requirements on the flatness and cleanliness of the surface of the cavity, the traditional surface acoustic wave filter is mostly packaged in a manner of combining ceramic substrate packaging with hot-pressing ultrasonic welding.
In the prior art, many technical solutions are proposed for the packaging method of the SAW filter, but in any technical solution, bonding and packaging of a cap plate and a device chip (also called a wafer) exist.
Although many packaging methods have been proposed in the related art, a specific packaging system is not provided, and systematic and flow packaging can be performed in a targeted manner based on the structural diagram of the SAW filter. Although the packaging method is many, the packaging method is not supported by a packaging system, and the efficiency is very low.
Disclosure of Invention
The invention provides a packaging system of a SAW filter, which is used for solving the problem that although a plurality of packaging methods are proposed, a specific packaging system is not provided temporarily, and systematic and flow packaging can be carried out according to a structural diagram of the SAW filter. Although many packaging methods are available, the packaging method is not supported by a packaging system, and the efficiency is very low.
A packaging system for a SAW filter comprising:
the cap cover plate manufacturing module comprises: the blind hole parameter and the metal layer laying parameter are obtained, and the blind hole and the metal layer are arranged on the cap cover plate to generate a target cap cover plate;
a device wafer manufacturing module: for processing the device wafer into SAW wave filter devices;
a cavity manufacturing module: the system comprises a target cap plate, an SAW wave filter device, a closed cavity model and a data acquisition module, wherein the target cap plate is used for determining the corresponding relation between the target cap plate and the SAW wave filter device and constructing the closed cavity model;
packaging the module: and the bonding module is used for bonding the target cap plate and the SAW wave filter device according to the closed cavity model, arranging a bonding pad on the cap plate and carrying out welding packaging.
As an embodiment of the present invention: the cap plate manufacturing module includes:
acquiring a structure diagram of the SAW filter, and determining a combined component of the SAW filter;
determining bonding parameters according to the combined component;
determining blind hole parameters and metal layer laying parameters according to the bonding parameters;
and according to the blind hole parameters and the metal layer laying parameters, carrying out blind hole punching and metal layer laying on the cap plate, and obtaining the target cap plate after the blind hole punching and the metal layer laying.
As an embodiment of the present invention: the cap plate manufacturing module further includes:
setting control parameters of the perforating machine according to the blind hole parameters;
setting a metal layer filling control parameter according to the metal layer laying parameter;
determining an equipment displacement function according to the control parameters and the metal layer filling control parameters;
setting a punching node and a metal layer laying node according to the equipment displacement function;
and setting the processing flow of the target cap plate according to the punching node and the metal layer laying node.
As an embodiment of the present invention: the device wafer fabrication module includes:
a pretreatment module: the device is used for establishing a geometric model of the SAW wave filter device and carrying out pre-processing on a device wafer; wherein the content of the first and second substances,
the pre-processing comprises: material processing and finite element analysis;
an analysis design module: for setting constraints of the device wafer after the pre-processing, determining a crystal processing criterion; wherein the content of the first and second substances,
the constraint conditions include: load criteria, shape criteria, and parameter criteria;
a post-processing module: and reprocessing the device wafer after the pre-processing according to the crystal processing standard.
As an embodiment of the present invention: the device wafer fabrication module further comprises:
crystal face processing information acquisition module: the surface processing information of the SAW wave filter device is determined according to the geometric model;
a measuring point acquisition module: the system is used for establishing a coordinate increment formula according to the surface processing information and calculating the surface coordinate information of the SAW wave filter device;
fitting a fixed point module: the connecting line is used for determining a connecting line between any coordinate points of the SAW wave filter device through piecewise fitting according to the surface coordinate information;
a surface output module: and forming a surface equation through polynomial fitting, and determining the surface of the SAW wave filter device.
As an embodiment of the invention: the cavity manufacturing module comprises:
a surface parameter acquisition unit: acquiring a first bonding parameter of a bonding surface of the SAW wave filter device and a second bonding parameter of a bonding surface of a target cap plate;
a cavity judgment module: the bonding simulation module is used for performing bonding simulation according to the first bonding parameter and the second bonding parameter to form a cavity model;
a coupling characteristic analysis unit: the device is used for setting test parameters according to the cavity model and determining the coupling characteristics; wherein the content of the first and second substances,
the test parameters include: film thickness parameters and waveguide refractive index;
a device characteristic analysis unit: the optical fiber coupling detection module is used for performing device-based packaging simulation according to the cavity model, performing optical fiber coupling detection and determining device characteristics; wherein the content of the first and second substances,
the fiber coupling detection comprises: single fiber coupling and double fiber coupling;
an anti-vibration characteristic analysis unit: the device is used for carrying out cavity performance test, acquiring cavity performance parameters under different vibration strengths and determining anti-vibration characteristics;
a determination unit: the device is used for respectively judging whether the coupling characteristic, the device characteristic and the anti-vibration characteristic are within preset characteristic thresholds; wherein the content of the first and second substances,
the characteristic threshold includes: a coupling characteristic threshold, a device characteristic threshold and an anti-vibration characteristic threshold;
a sealing unit: and when the coupling characteristic, the device characteristic and the anti-vibration characteristic are within the preset characteristic threshold value, constructing a cavity closed model.
As an embodiment of the present invention: the cavity manufacturing module comprises:
the cavity expecting unit: the device is used for acquiring a three-dimensional expected model of the cavity according to the structure diagram of the SAW filter and determining expected characteristic parameters;
a cavity deviation unit: the device comprises a cap plate, a device wafer, a SAW filter, a characteristic deviation model and a deviation coefficient, wherein the material parameters of the cap plate and the device wafer are obtained, the conventional deviation parameter of the SAW filter is obtained, and the characteristic deviation model is established according to the conventional deviation parameter and the material parameters to determine the deviation coefficient;
characteristic threshold setting means: and determining the characteristic parameter according to the deviation coefficient and the expected characteristic parameter.
As an embodiment of the present invention: the package module includes:
a temporary bonding unit: temporarily bonding the target cap cover plate and the SAW wave filter device according to the closed cavity model;
a cutting and grinding unit: the device is used for obtaining the temporarily bonded SAW wave filter, and cutting and thinning the wafer;
a complex bonding unit: the SAW filter is used for re-bonding after the wafer is cut and thinned;
a wiring unit: for routing on the cap plate and wafer after the rebonding;
a welding unit: the welding pad is welded on the cap plate after wiring;
packaging the unit: and the welding package is carried out according to the welding pads.
As an embodiment of the present invention: the package module further includes:
an electrode setting unit: after the wafer is cut and thinned, arranging an electrode on the wafer;
a ball mounting processing unit: the solder ball mounting device is used for judging whether a bare metal layer exists or not after the soldering packaging, and carrying out ball mounting treatment when a bare metal layer exists;
a dividing unit: the method is used for carrying out segmentation processing on the packaged SAW wave filter after ball mounting processing.
As an embodiment of the present invention: the system further comprises:
an equipment module: the packaging assembly line is used for building a packaging assembly line and installing packaging equipment on the packaging assembly line; wherein the content of the first and second substances,
the packaging apparatus includes: the method comprises the following steps of (1) welding a mechanical arm, a puncher mechanical arm, bonding equipment and a dividing mechanical arm;
welding the module: the welding mechanical arm is used for performing welding operation on the welding pad;
a punching module: for performing a punching operation on said cap plate by means of a punching robot arm;
a bonding module: the bonding equipment is used for performing extrusion bonding on the SAW filter device and the target cap plate;
a segmentation module: and the wafer position is determined and the wafer is segmented after the welding packaging.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and drawings.
The technical solution of the present invention is further described in detail by the accompanying drawings and embodiments.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a system diagram of a packaging system for a SAW filter in accordance with an embodiment of the present invention;
FIG. 2 is a device control diagram of a packaging system for a SAW filter in accordance with an embodiment of the present invention;
FIG. 3 is a flowchart of the packaging steps in an embodiment of the present invention.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it should be understood that they are presented herein only to illustrate and explain the present invention and not to limit the present invention.
In the prior art, a series of physical and chemical technologies are mainly used for preventing the SAW filter from being adhered and having good air tightness on the packaging layer of the filter, and external water vapor is prevented from entering the interior of the SAW filter in the packaging process. Still other techniques achieve the ability to reduce packaging costs by providing special electrodes on the surface of the SAW filter without affecting the original properties of the SAW filter itself. However, these approaches require improvements to the SAW filter based on the prior art, and the consequence of these approaches is that the more improved the SAW filter, the more its shape becomes. Because the process flow is changed, the SAW filter is added with some physical or chemical structures on the process flow, so that the volume of the SAW filter is increased, which is not preferable for the prior art, the device is smaller and smaller, and the original operation state and the characteristic are not changed, and the aim of device innovation is to change the SAW filter.
In the invention, a simulation modeling mode based on software technology is adopted, and the field of equipment construction is prepared for packaging, so that the steps on a physical and chemical level are reduced, and the steps on a physical level can also be reduced, functional structures are not added on the physical level, a better packaging effect is forcibly achieved from the physical level, but the bonding packaging of the SAW filter is carried out in a combined mode by considering the component devices of the SAW filter from the beginning of packaging.
Example 1:
as shown in fig. 1, a packaging system for a SAW filter includes:
the cap cover plate manufacturing module comprises: the blind hole parameter and the metal layer laying parameter are obtained, and the blind hole and the metal layer are arranged on the cap cover plate to generate a target cap cover plate; the cap cover plate is provided with a blind hole and a metal layer for bonding, and plays a role in packaging. In the invention, the parameters of the riser hole comprise the position, the size and the like of the riser hole. The metal layer laying parameters are parameters of how thick the metal layer is, how the metal layer is laid, what type of metal the metal layer is and the metal characteristics in the metal layer, and the like. In the prior art, when packaging is performed, metal pouring is performed or packaging is performed through colloid, the surface structure of the SAW filter can be determined according to user requirements by the aid of the cap plate, and then SAW filter devices can be designed according to the cap plate to perform bonding packaging.
A device wafer manufacturing module: for processing the device wafer into SAW filter devices;
in the invention, the device wafer is processed into the SAW filter device, namely the other side of the cap plate, and is used as a part of the main SAW wave filter which needs to be packaged.
The two steps are similar to the manner that the base and the upper cover are required by the packaging technology in the prior art, but most of the prior art adopts the adhesive, and the invention can realize sealing by a blind hole manner without using the adhesive. Secondly, the blind hole parameters and the metal layer laying parameters are obtained in advance, and equipment customization can be realized.
A cavity manufacturing module: the system comprises a target cap plate, an SAW wave filter device, a closed cavity model and a data acquisition module, wherein the target cap plate is used for determining the corresponding relation between the target cap plate and the SAW wave filter device and constructing the closed cavity model;
during the sealing process, it is most important to construct a closed cavity to maintain airtightness. In the invention, the cap plate and the SAW wave filter device are respectively manufactured in the first two steps, so that the corresponding relation is the corresponding relation of the blind hole, the corresponding relation of the surface, the installation angle and the like, and the tightness of the closed cavity is ensured by the tight thread seaming on the physical layer surface. The model of the closed cavity is formed, but the model is the closed cavity simulated by software level simulation, so the model is formed. This has solved among the prior art that the encapsulation needs a large amount of experiments to still can not necessarily solve the problem of closed cavity after the experiment.
Packaging the module: and the SAW filter device is used for bonding a target cap plate and the SAW filter device according to the closed cavity model, arranging a bonding pad on the cap plate and carrying out welding packaging.
And at the time of final packaging, the packaging is carried out by a bonding mode, and the bonding mode has the advantages that: the method is a technology that two homogeneous or heterogeneous semiconductor materials with clean surfaces and flat atomic levels are subjected to surface cleaning and activation treatment, are directly combined under certain conditions, and are bonded into a whole through Van der Waals force, molecular force and even atomic force. This technique may further ensure the hermeticity of the inventive chamber, wherein it is also required to ensure that the inventive cap plate is also a semiconductor material. But to ensure that it can function as a SAW filter. A metal layer is laid so that it has conductive properties. This side of the metal layer is not the bonding side.
The principle of the technical scheme is as follows: the system of the invention strictly observes the arrangement of the capping plate and the arrangement of the device wafer when packaging the SAW filter, and then realizes the manufacture of the SAW filter by a bonding mode after the two modes are set. Finally, the invention is provided with the bonding pad which has two functions, one is that the air tightness is better by a packaging mode, and the bonding pad is used as a pin.
The beneficial effects of the above technical scheme are that: compared with the prior art, the invention is more convenient, and the invention comprises design and welding, and can adapt to various packaging methods. And finally, carrying out final packaging through welding pads. The invention can reach the standard of preventing gas from entering, and combines the design process and the packaging process to form the whole SAW filter.
Example 2:
as an embodiment of the present invention: the cap plate manufacturing module comprises:
acquiring a structure diagram of the SAW filter, and determining a combined component of the SAW filter;
since the SAW filter is certainly composed of more than one component, in order to achieve a perfect bonding degree between the SAW filter device and the capping plate, the bonding parameters are determined by the combined components of the SAW filter; this bonding parameter is a parameter that is determined before neither the cap plate nor the SAW filter device is machined.
Determining bonding parameters according to the combined component;
the bonding parameters include bonding of each combined component of the SAW filter, bonding incapability and bonding angle, and after the parameters are determined, the parameters of the cap plate are determined in a corresponding manner. Because the main purpose of packaging the SAW filter is to ensure the air tightness, the invention ensures the air tightness through bonding design from the design point of view, thereby reducing the processes required by later packaging.
Determining blind hole parameters and metal layer laying parameters according to the bonding parameters;
and according to the blind hole parameters and the metal layer laying parameters, carrying out blind hole punching and metal layer laying on the cap plate, and obtaining the target cap plate after the blind hole punching and the metal layer laying.
Since the parameters of the target cap plate have been determined, so to speak, at the stage of the bonding parameter determination, the laying of the metal layer can be realized in this way, finally the target cap plate is finalized.
The principle of the technical scheme is as follows: according to the invention, when the cap plate is manufactured, the bonding parameters are determined according to the combined component; and then, punching and metal laying are carried out on the cap plate according to the bonding requirement, so that the method is more suitable for industrial processes.
The beneficial effects of the above technical scheme are that: compared with the prior art, the invention is more convenient and more suitable for industrial processes, reduces the cost of a plurality of industrial packages, simplifies the operation steps in the packaging stage, but needs more elaboration in the design stage of the cap cover plate, and has differences in the processing modes. Therefore, the invention is a comprehensive packaging process combining design and packaging, and reduces the packaging difficulty through the convenience in design.
Example 3:
as an embodiment of the present invention: the cap plate manufacturing module further includes:
setting control parameters of the perforating machine according to the blind hole parameters;
because the packaging of the invention is a complete process, the parameters of the punching machine are set after the parameters of the blind holes are determined, namely after the size of the holes to be punched is determined, and the parameters of the punching machine can be used for punching according to the required parameters of the blind holes.
Setting a metal layer filling control parameter according to the metal layer laying parameter;
and similarly, when the metal layer is laid, the control parameters of the metal layer are set to ensure that the bonding with the SAW filter device can be finally carried out.
Determining an equipment displacement function according to the control parameters and the metal layer filling control parameters;
the equipment displacement function can be said to be a displacement function for setting equipment processing when processing is carried out, and the displacement function comprises a position control function of a mechanical arm when the perforating machine punches and a laying distance displacement function when metal laying is carried out on a metal laying layer. The specific setting mode of the two functions requires the comprehensive design of the control parameters of the machine of the processing equipment, the standard processing parameters and the processing scene which need to be processed.
Setting a punching node and a metal layer laying node according to the equipment displacement function;
the node is laid to node and metal level that punches, is exactly that drilling equipment carries out the node that punches to every blind hole when carrying out the blind hole and punch, also is when punching, carries out drilling equipment's displacement, carries out the node of displacement. And the metal layer is laid on the nodes from the node to the node. This is the routing node of the metal layer.
And setting the processing flow of the target cap plate according to the punching node and the metal layer laying node. After the nodes are determined, the machining equipment only needs to be matched according to the nodes, and the overall machining process flow can be determined.
The principle of the technical scheme is as follows: when the cap plate is manufactured, the unique parameters of the punching mechanical arm and the equipment parameters of the metal laying equipment are adjusted according to the parameters of punching and the parameters of metal laying required, so that accurate punching and more complete metal laying and filling are achieved.
The beneficial effects of the above technical scheme are that: realize more accurate punching and more complete metal laying, adapt to automatic processing more simultaneously, solve the operation flaw in the manual work encapsulation among the prior art.
Example 4:
as an embodiment of the present invention: the device wafer fabrication module includes:
a pretreatment module: the device is used for establishing a geometric model of the SAW wave filter device and carrying out pre-processing on a device wafer; wherein the content of the first and second substances,
the pre-processing comprises: material processing and finite element analysis;
material processing, i.e., material selection processing, requires selection of corresponding materials that are easily bonded for both the cap plate and the device wafer, so that the material processing is achieved by the pre-processing. Finite element analysis is to analyze the mixing performance of bonding different materials. The specific performance of the packaged SAW filter is analyzed from the macro scale and the periscopic scale respectively.
An analysis design module: a constraint condition for setting the device wafer after the pre-processing, and determining a crystal processing standard; wherein the content of the first and second substances,
the constraint conditions include: load criteria, shape criteria, and parameter criteria;
and setting constraint conditions, namely setting various standard conditions in the processing. The load standard is the load parameter of the load device in the working environment of the encapsulated filter. The shape standard is the shape standard of the SAW filter obtained after the package is processed. And the parameter standard comprises the performance parameters of the manufactured filter and the parameters corresponding to the working environment.
A post-processing module: and reprocessing the device wafer after the pre-processing according to the crystal processing standard. Rework, i.e., the processing criteria parameters implemented after material processing and finite element analysis, for SAW filter performance considerations, after material processing and finite element analysis, we may have multiple materials available, and after performance analysis, we may leave only one of the most suitable materials. And then processed to reach the desired target.
The principle of the technical scheme is as follows: when the device chip (wafer) is processed, the invention gives material and finite element analysis, and the finite element analysis is used for analyzing the processing process, thereby realizing more accurate processing.
The beneficial effects of the above technical scheme are that: the invention can realize more increased and more accurate crystal processing of equipment and devices.
Example 5:
as an embodiment of the present invention: the device wafer fabrication module further comprises:
crystal face processing information acquisition module: the surface processing information of the SAW wave filter device is determined according to the geometric model;
the surface processing information, that is, the processing parameters of the surface of the SAW filter, such as smoothness, cleanliness, and shape of the surface.
A measuring point obtaining module: the system is used for establishing a coordinate increment formula according to the surface processing information and calculating the surface coordinate information of the SAW wave filter device; the coordinate increment formula is to establish a coordinate system according to the machined surface, and the coordinate system has the function of increment, and different surfaces of the SAW wave filter are determined by continuously changing the positions of coordinates on a coordinate axis and continuously through the difference values of the coordinates at different positions.
Fitting a fixed point module: the connecting line is used for determining a connecting line between any coordinate points of the SAW wave filter device through piecewise fitting according to the surface coordinate information;
and fitting by a piecewise fitting mode, namely fitting the edge of one surface and the edge of the other surface, wherein the vertex angle of the surface is the node of the fitting when the surface is fitted, so that the SAW filter is expanded from a three-dimensional shape to a planar shape.
A surface output module: and forming a surface equation through polynomial fitting, and determining the surface of the SAW wave filter device. The polynomial fitting method mainly converts a plane into a three-dimensional shape of a solid, and in the process, polynomial fitting is needed to form an integral surface equation, and a scheme of measuring a volume through piecewise polynomial fitting is adopted.
The principle of the technical scheme is as follows: the invention can establish a coordinate system of coordinates, the coordinate system of the surface coordinates carries out random connection line fitting through the coordinate system, and finally the surface fitting is realized based on a polynomial.
The beneficial effects of the above technical scheme are that: the method can ensure that the surfaces of the device crystal can be fitted, so that more accurate bonding is realized, and the function of each surface is determined from a piecewise fitting mode; and then carrying out multiple fitting through the function of the surface to form the fitting of the integral surface.
Example 6:
as an embodiment of the present invention: the cavity manufacturing module comprises:
a surface parameter acquisition unit: acquiring a first bonding parameter of a bonding surface of the SAW wave filter device and a second bonding parameter of a bonding surface of a target cap plate;
the first bonding parameter is a parameter of a face to which the SAW wave filter device is bonded, and the second bonding parameter is a parameter of a face to which the capping plate is bonded.
A cavity judgment module: the bonding simulation module is used for performing bonding simulation according to the first bonding parameter and the second bonding parameter to form a cavity model;
the bonding mode is a parameter fitting mode and realizes the simulation of the cavity model, and in the process, the invention aims to adapt the cap plate and the SAW filter device, so the integral air tightness can be ensured by the bonding simulation mode.
A coupling characteristic analysis unit: the device is used for setting test parameters according to the cavity model and determining the coupling characteristics; wherein the content of the first and second substances,
the test parameters include: film thickness parameters and waveguide refractive index;
the most important characteristic required for the SAW filter is the coupling characteristic, which is an important parameter of the filter characteristic. The most important parameters for the cavity are the thickness of the film layer and the refractive index of the waveguide, and the parameters needing to be tested are tested under the simulation condition, so that the most accurate parameters of the SAW filter can be determined.
Device characteristic analysis unit: the optical fiber coupling detection module is used for performing device-based packaging simulation according to the cavity model, performing optical fiber coupling detection and determining device characteristics; wherein the content of the first and second substances,
the fiber coupling detection comprises: single fiber coupling and double fiber coupling;
for the integral device, the coupling characteristic can only be realized through single optical fiber coupling and double optical fiber coupling, two different device characteristics can be obtained through the two modes, and the device characteristic can be analyzed through the two modes, so that the integral device is ensured to have high-efficiency performance.
Anti-vibration characteristic analysis unit: the device is used for carrying out cavity performance test, acquiring cavity performance parameters under different vibration strengths and determining anti-vibration characteristics;
in the analysis of the vibration characteristics, the equipment is designed under different vibration environments through different vibration intensities, so that the SAW filter can be ensured to keep a stable output under different scenes.
A determination unit: the device is used for respectively judging whether the coupling characteristic, the device characteristic and the anti-vibration characteristic are within preset characteristic thresholds; wherein, the first and the second end of the pipe are connected with each other,
the characteristic threshold includes: a coupling characteristic threshold, a device characteristic threshold and an anti-vibration characteristic threshold;
a sealing unit: and when the coupling characteristic, the device characteristic and the anti-vibration characteristic are within the preset characteristic threshold value, constructing a cavity closed model.
The principle of the technical scheme is as follows: during bonding, the device can perform coupling monitoring on the characteristics of the equipment, and a cavity-based closed model is established after the monitoring is successful through the coupling monitoring.
The beneficial effects of the above technical scheme are that: the invention can keep better tightness when bonding is carried out, and comprehensively analyzes the SAW filter in various modes besides air tightness, thereby ensuring that the SAW filter always keeps a higher state relative to other equipment in the prior art. Compared with the packaging method in the prior art, a series of tests must be carried out after the packaging is finished, and a series of detection and tests can be carried out during the packaging.
Example 7:
as an embodiment of the present invention: the cavity manufacturing module comprises:
the cavity expecting unit: the device is used for acquiring a three-dimensional expected model of the cavity according to the structure diagram of the SAW filter and determining expected characteristic parameters;
the three-dimensional expected model is a parameter of the SAW filter which can reach expected characteristics under an expected state, and the expected characteristics have the function of comparing obtained data when the simulation is carried out, so that deviation adjustment can be carried out, and the SAW filter has better performance while being packaged.
A cavity deviation unit: the device comprises a cap plate, a device wafer, a SAW filter, a characteristic deviation model and a deviation coefficient, wherein the material parameters of the cap plate and the device wafer are obtained, the conventional deviation parameter of the SAW filter is obtained, and the characteristic deviation model is established according to the conventional deviation parameter and the material parameters to determine the deviation coefficient;
the invention mainly relates to a characteristic deviation model established by material parameters and obtained conventional deviation parameters on the deviation coefficient, which is a comprehensive deviation parameter model. The finally formed cavity can be ensured to be in a complete state.
Characteristic threshold setting means: and determining the characteristic parameter according to the deviation coefficient and the expected characteristic parameter.
The principle of the technical scheme is as follows: the invention can carry out deviation calculation on the characteristic parameters of the cavity, thereby obtaining the characteristic parameters of the SAW filter.
The beneficial effects of the above technical scheme are that: the method has the advantages that more accurate characteristic parameters of the SAW filter can be obtained, so that the performance of the SAW filter is guaranteed in the packaging process, and compared with the packaging method in the prior art, the method can only consider physical characteristics but cannot consider the performance characteristics during packaging, and the effect is more efficient.
Example 8:
as an embodiment of the present invention: the package module includes:
a temporary bonding unit: temporarily bonding the target cap cover plate and the SAW wave filter device according to the closed cavity model;
the temporary bonding is initial bonding, and the purpose of the bonding is to ensure that whether bonding between the wafer and the wafer has certain problems or not is judged in a test stage when bonding is carried out, and adjustment is needed, so that secondary adjustment can be carried out through wafer slitting and thinning, and compared with the irreversibility of packaging in the prior art, the mode in the prior art achieves a better bonding purpose.
A cutting and grinding unit: the device is used for obtaining the temporarily bonded SAW wave filter, and cutting and thinning the wafer;
a complex bonding unit: the SAW filter is used for re-bonding after the wafer is cut and thinned;
the composite bonding is bonding again after the wafer is cut and thinned, which is a bonding mode after adjustment, and in this mode, the superior air tightness of the cavity is achieved.
A wiring unit: for routing on the cap plate and wafer after the rebonding;
a welding unit: the welding pad is welded on the cap plate after wiring;
packaging the unit: and the welding package is carried out according to the welding pads.
The wiring and the bonding pad are operations after packaging, but the bonding pad in the prior art is directly arranged on the substrate, and for a SAW filter, the bonding pad only has the function of a pin.
The principle of the technical scheme is as follows: the invention executes the steps of temporary bonding, thinning, secondary bonding, wiring, welding, packaging and the like when the device crystal is processed, which aims to ensure the tightness of the SAW wave filter cavity.
The beneficial effects of the above technical scheme are that: the sealing performance of the SAW filter can be well detected and reinforced, and in the process of packaging, the bonding pad is arranged at last, so that the bonding pad has certain characteristics, the bonding pad has certain protection effect on the air tightness of a cavity, the effect of the bonding pad is not a single pin any more, and the effect of integration and double effects are achieved.
Example 9:
as an embodiment of the present invention: the package module further includes:
an electrode setting unit: after the wafer is cut and thinned, arranging an electrode on the wafer; the electrode is arranged in the most conventional mode in the prior art, and all wafers are provided with the electrodes, but the electrodes in the prior art are assembled, and the electrode is assembled later in the invention, so that the assembly performance is better.
A ball mounting processing unit: the solder ball mounting device is used for judging whether a bare metal layer exists or not after the soldering packaging, and carrying out ball mounting treatment when a bare metal layer exists;
the ball-planting process is a conventional method in the prior art, so that the exposed metal layer has no influence on the equipment.
A dividing unit: the method is used for carrying out segmentation processing on the packaged SAW wave filter after ball mounting processing.
The principle of the technical scheme is as follows: in the invention, electrodes are required to be added on the device crystal during packaging, and ball planting treatment is carried out on the exposed metal part to finally realize segmentation.
The beneficial effects of the above technical scheme are that: after the system is bonded, the SAW wave filter is still a semi-finished product, and the final SAW wave filter is obtained through electrode adding, ball mounting processing and dividing.
Example 10:
as an embodiment of the present invention: as shown in the attached figure 2 of the drawings,
an equipment module: the packaging assembly line is used for building a packaging assembly line and installing packaging equipment on the packaging assembly line; wherein the content of the first and second substances,
the packaging apparatus includes: the method comprises the following steps of (1) welding a mechanical arm, a puncher mechanical arm, bonding equipment and a dividing mechanical arm;
welding the module: the welding mechanical arm is used for performing welding operation on the welding pad;
a punching module: for performing a punching operation on said cap plate by means of a punching robot arm;
a bonding module: the bonding equipment is used for performing extrusion bonding on the SAW filter device and the target cap plate;
a segmentation module: and the wafer position is determined and the wafer is segmented after the welding packaging.
The principle of the technical scheme is as follows: in the invention, when the SAW filter is manufactured, equipment on a production line is required to be controlled, so that a plurality of modules are arranged, each manufacturing step is singly controlled, and the technical scheme combines the operations of design, processing, packaging, welding and the like together, thereby ensuring the improvement of the invention compared with the traditional process.
The beneficial effects of the above technical scheme are that: and each step of the packaging process is subjected to single control, so that the accuracy of each step is ensured.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims (9)

1. A packaging system for a SAW filter, comprising:
a cap cover plate manufacturing module: the blind hole parameter and the metal layer laying parameter are obtained, and the blind hole and the metal layer are arranged on the cap cover plate to generate a target cap cover plate;
a device wafer manufacturing module: for processing the device wafer into SAW wave filter devices;
a cavity manufacturing module: the system comprises a target cap plate, an SAW wave filter device, a closed cavity model and a data acquisition module, wherein the target cap plate is used for determining the corresponding relation between the target cap plate and the SAW wave filter device and constructing the closed cavity model;
packaging the module: the target cap plate and the SAW wave filter device are bonded according to the closed cavity model, a bonding pad is arranged on the cap plate, and welding packaging is carried out;
the cavity manufacturing module comprises:
a surface parameter acquisition unit: acquiring a first bonding parameter of a bonding surface of the SAW wave filter device and a second bonding parameter of a bonding surface of a target cap plate;
a cavity judgment module: the bonding simulation module is used for performing bonding simulation according to the first bonding parameter and the second bonding parameter to form a cavity model;
a coupling characteristic analysis unit: the device is used for setting test parameters according to the cavity model and determining the coupling characteristics; wherein the content of the first and second substances,
the test parameters include: film thickness parameters and waveguide refractive index;
a device characteristic analysis unit: the optical fiber coupling detection module is used for performing device-based packaging simulation according to the cavity model, performing optical fiber coupling detection and determining device characteristics; wherein the content of the first and second substances,
the fiber coupling detection comprises: single fiber coupling and double fiber coupling;
an anti-vibration characteristic analysis unit: the device is used for carrying out cavity performance test, acquiring cavity performance parameters under different vibration strengths and determining anti-vibration characteristics;
a determination unit: the device is used for respectively judging whether the coupling characteristic, the device characteristic and the anti-vibration characteristic are within preset characteristic thresholds; wherein the content of the first and second substances,
the characteristic threshold includes: a coupling characteristic threshold, a device characteristic threshold and an anti-vibration characteristic threshold;
a sealing unit: and when the coupling characteristic, the device characteristic and the anti-vibration characteristic are within the preset characteristic threshold value, constructing a cavity closed model.
2. A packaging system for a SAW filter as claimed in claim 1, wherein said cap plate making module comprises:
acquiring a structure diagram of the SAW filter, and determining a combined component of the SAW filter;
determining bonding parameters according to the combined component;
determining blind hole parameters and metal layer laying parameters according to the bonding parameters;
and according to the blind hole parameters and the metal layer laying parameters, carrying out blind hole punching and metal layer laying on the cap plate, and obtaining the target cap plate after the blind hole punching and the metal layer laying.
3. A packaging system for a SAW filter as claimed in claim 1, wherein said cap plate making module further comprises:
setting control parameters of the perforating machine according to the blind hole parameters;
setting a metal layer filling control parameter according to the metal layer laying parameter;
determining an equipment displacement function according to the control parameters and the metal layer filling control parameters;
setting a punching node and a metal layer laying node according to the equipment displacement function;
and setting the processing flow of the target cap plate according to the punching node and the metal layer laying node.
4. A packaging system for a SAW filter as defined in claim 1, wherein the device wafer fabrication module comprises:
a pretreatment module: the geometric model is used for establishing the SAW wave filter device, and the device wafer is processed in advance; wherein the content of the first and second substances,
the pre-processing comprises: material processing and finite element analysis;
an analysis design module: a constraint condition for setting the device wafer after the pre-processing, and determining a crystal processing standard; wherein the content of the first and second substances,
the constraint conditions include: load criteria, shape criteria, and parameter criteria;
a post-processing module: and reprocessing the device wafer after the pre-processing according to the crystal processing standard.
5. A packaging system for a SAW filter as recited in claim 4 wherein said device wafer fabrication module further comprises:
crystal face processing information acquisition module: the surface processing information of the SAW wave filter device is determined according to the geometric model;
a measuring point obtaining module: the system is used for establishing a coordinate increment formula according to the surface processing information and calculating the surface coordinate information of the SAW wave filter device;
fitting a fixed point module: the connecting line is used for determining a connecting line between any coordinate points of the SAW wave filter device through piecewise fitting according to the surface coordinate information;
a surface output module: and forming a surface equation through polynomial fitting, and determining the surface of the SAW wave filter device.
6. A packaging system for a SAW filter as claimed in claim 1, wherein the cavity fabricating module comprises:
the cavity expecting unit: the device is used for acquiring a three-dimensional expected model of the cavity according to the structure diagram of the SAW filter and determining expected characteristic parameters;
a cavity deviation unit: the device comprises a cap plate, a device wafer, a SAW filter, a characteristic deviation model and a deviation coefficient, wherein the material parameters of the cap plate and the device wafer are obtained, the conventional deviation parameter of the SAW filter is obtained, and the characteristic deviation model is established according to the conventional deviation parameter and the material parameters to determine the deviation coefficient;
characteristic threshold setting means: and determining the characteristic parameter according to the deviation coefficient and the expected characteristic parameter.
7. A packaging system for a SAW filter, as claimed in claim 1, wherein said packaging module comprises:
a temporary bonding unit: temporarily bonding the target cap cover plate and the SAW wave filter device according to the closed cavity model;
a cutting and grinding unit: the device is used for obtaining the temporarily bonded SAW wave filter, and cutting and thinning the wafer;
a complex bonding unit: the SAW filter is bonded again after the wafer is cut and thinned;
a wiring unit: for routing on the cap plate and wafer after the rebonding;
a welding unit: the welding pad is welded on the cap plate after wiring;
packaging the unit: and performing welding package according to the welding pad.
8. A packaging system for a SAW filter as defined in claim 7, wherein the package module further comprises:
an electrode setting unit: after the wafer is cut and thinned, arranging an electrode on the wafer;
a ball mounting processing unit: the solder ball mounting device is used for judging whether a bare metal layer exists or not after the soldering packaging, and carrying out ball mounting treatment when a bare metal layer exists;
a dividing unit: the method is used for carrying out segmentation processing on the packaged SAW wave filter after ball mounting processing.
9. A packaging system for a SAW filter, as defined in claim 1, wherein said system further comprises:
an equipment module: the packaging assembly line is used for building a packaging assembly line and installing packaging equipment on the packaging assembly line; wherein the content of the first and second substances,
the packaging apparatus includes: the method comprises the following steps of (1) welding a mechanical arm, a puncher mechanical arm, bonding equipment and a dividing mechanical arm;
welding the module: the welding mechanical arm is used for performing welding operation on the welding pad;
a punching module: for performing a punching operation on said cap plate by means of a punching robot arm;
a bonding module: the bonding equipment is used for performing extrusion bonding on the SAW filter device and the target cap plate;
a segmentation module: and the wafer position is determined and the wafer is segmented after the welding packaging.
CN202210057195.8A 2022-01-19 2022-01-19 Packaging system of SAW filter Active CN114079000B (en)

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