CN114078983A - Photovoltaic module - Google Patents
Photovoltaic module Download PDFInfo
- Publication number
- CN114078983A CN114078983A CN202010797061.0A CN202010797061A CN114078983A CN 114078983 A CN114078983 A CN 114078983A CN 202010797061 A CN202010797061 A CN 202010797061A CN 114078983 A CN114078983 A CN 114078983A
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- CN
- China
- Prior art keywords
- solder
- photovoltaic module
- adhesive
- grid lines
- strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000853 adhesive Substances 0.000 claims abstract description 92
- 230000001070 adhesive effect Effects 0.000 claims abstract description 92
- 238000003466 welding Methods 0.000 claims abstract description 61
- 229910052709 silver Inorganic materials 0.000 claims abstract description 7
- 229910000679 solder Inorganic materials 0.000 claims description 147
- 229910052718 tin Inorganic materials 0.000 claims description 16
- 239000002245 particle Substances 0.000 claims description 15
- 230000008018 melting Effects 0.000 claims description 13
- 238000002844 melting Methods 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 238000005476 soldering Methods 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 229910052797 bismuth Inorganic materials 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229910052745 lead Inorganic materials 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000012212 insulator Substances 0.000 claims 1
- 230000003287 optical effect Effects 0.000 abstract description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 4
- 239000004332 silver Substances 0.000 abstract description 4
- 239000002313 adhesive film Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
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- 238000004519 manufacturing process Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- -1 gallium arsenide Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
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- 230000007547 defect Effects 0.000 description 1
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- 230000002349 favourable effect Effects 0.000 description 1
- 238000009432 framing Methods 0.000 description 1
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- 239000002932 luster Substances 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The invention discloses a photovoltaic module, which comprises: the battery comprises a plurality of battery pieces, wherein each battery piece is provided with a plurality of auxiliary grid lines arranged at intervals; the solar cell comprises a plurality of welding strips, wherein the welding strips are arranged at intervals along the length direction of the secondary grid lines, each welding strip extends along the arrangement direction of the secondary grid lines, each welding strip is electrically connected with the secondary grid lines, each welding strip is bonded with a cell piece through at least one bonding piece, and the at least one bonding piece is located between the edge of the cell piece and one of the outermost sides of the secondary grid lines. According to the photovoltaic module, the contact force between the battery piece and the welding strip can be increased, and the connection firmness between the welding strip and the secondary grid line is improved. In addition, the light-shielding area of the adhesive member can be reduced. In addition, the main grid line does not need to be arranged on the cell, the use amount of silver paste can be reduced, the cost is reduced, the shielding of the main grid line on the cell can be avoided, and the optical utilization rate of the photovoltaic module is further improved.
Description
Technical Field
The invention relates to the technical field of photovoltaic power generation, in particular to a photovoltaic module.
Background
When manufacturing a photovoltaic module, a plurality of battery pieces are generally welded by using a welding strip to form a battery string, then the plurality of battery strings are laid between glass and a back plate and connected in series by using bus bars, and then lamination and framing are carried out. In the related art, the contact force between the solder strip and the cell is small, so that the reliability of the photovoltaic module is low.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, an object of the present invention is to provide a photovoltaic module, which can improve the contact force between the cell and the solder strip, and improve the reliability of the photovoltaic module.
A photovoltaic module according to an embodiment of the present invention includes: the battery comprises a plurality of battery pieces, a plurality of secondary grid lines and a plurality of battery pieces, wherein each battery piece is provided with a plurality of secondary grid lines arranged at intervals; the welding strip comprises a plurality of welding strips, the welding strips are arranged at intervals along the length direction of the secondary grid lines, each welding strip extends along the arrangement direction of the secondary grid lines, each welding strip is electrically connected with the secondary grid lines, each welding strip is bonded with the battery piece through at least one bonding piece, and the at least one bonding piece is located between the edge of the battery piece and the outermost side of the secondary grid lines.
According to the photovoltaic module provided by the embodiment of the invention, each welding strip is electrically connected with the plurality of secondary grid lines, each welding strip is bonded with the cell piece through at least one bonding piece, and the at least one bonding piece is positioned between the edge of the cell piece and the outermost side of the plurality of secondary grid lines, so that the contact force between the cell piece and the welding strip can be increased, the connection firmness between the welding strip and the secondary grid lines can be improved, and the reliability of the photovoltaic module can be improved. In addition, the shading area of the bonding piece can be reduced, and the high optical utilization rate of the cell piece is guaranteed. In addition, can need not to set up the main grid line on the battery piece, on the one hand, can reduce the use amount of silver thick liquid, reduce cost, on the other hand, can avoid the sheltering from of main grid line to the battery piece, further improve photovoltaic module's optical utilization.
According to some embodiments of the invention, a plurality of the adhesive members are arranged between each of the solder strips and the battery piece, a part of the plurality of the adhesive members is located between the edge of the battery piece and one side of all the secondary grid lines, and another part of the plurality of the adhesive members is located between the edge of the battery piece and the other side of all the secondary grid lines.
According to some embodiments of the invention, a plurality of the bonding members are arranged between each solder strip and the battery piece, and the plurality of bonding members include at least one first bonding member and at least one second bonding member, the first bonding member is arranged between the edge of the battery piece and the outermost one of the plurality of the secondary grid lines, and the second bonding member is arranged between two adjacent secondary grid lines.
According to some embodiments of the invention, a distance between two adjacent adhesive members adjacent to the edge of the battery piece in the length direction of the solder strip is smaller than a distance between two adjacent adhesive members located in the middle of the battery piece.
According to some embodiments of the invention, the second adhesive member is a plurality of second adhesive members, and at least one secondary grid line is arranged between two adjacent second adhesive members along the length direction of the solder strip.
According to some embodiments of the invention, a width of the adhesive member in a length direction of the finger line is equal to or less than a width of the solder strip.
According to some embodiments of the invention, the height of the adhesive member is equal to or less than the height of the secondary grid line.
According to some embodiments of the invention, a plurality of the adhesive members are arranged in an array on the cell sheet.
According to some embodiments of the present invention, the number of the adhesive members in the length direction of the solder strip is X, and the number of the adhesive members in the length direction of the finger line is Y, wherein X, Y respectively satisfy: x is more than or equal to 2 and less than or equal to 130, and Y is more than or equal to 5 and less than or equal to 30.
According to some embodiments of the invention, the adhesive member is an insulating member, and the adhesive member is spaced apart from the adjacent finger lines.
According to some embodiments of the invention, the adhesive member contacts the adjacent finger line.
According to some embodiments of the invention, the adhesive is printed on the battery sheet; or the bonding piece is coated on the welding strip.
According to some embodiments of the invention, the adhesive is a resin adhesive.
According to some embodiments of the invention, the adhesive member includes one of conductive particles and non-conductive particles, and a resin.
According to some embodiments of the present invention, when the adhesive member includes conductive particles and a resin, the conductive particles are at least one of Au, Ag, Cu, and Sn.
According to some embodiments of the invention, the solder strip comprises: a conductive base; the soldering tin layer is coated outside the conductive base body and consists of Sn and Bi; or the soldering tin layer consists of Sn, Bi and Pb; wherein, the content of Bi is 7.5 to 70 percent, the content of Sn is 35 to 65 percent, and the content of Pb is 10 to 40 percent.
According to some embodiments of the invention, the Bi content is 8% to 40%, the Sn content is 40% to 65%, and the Pb content is 25% to 40%.
According to some embodiments of the invention, the solder layer has a melting point temperature T, wherein T satisfies: t is more than or equal to 110 ℃ and less than or equal to 145 ℃.
According to some embodiments of the invention, the solder strip is a circular solder strip, a triangular solder strip, a rectangular solder strip, or a combination of a triangular solder strip and a rectangular solder strip.
According to some embodiments of the invention, when the solder ribbon is a circular solder ribbon, the solder ribbon has a diameter d and the solder layer has a thickness t, wherein d and t respectively satisfy: d is more than or equal to 0.15mm and less than or equal to 0.35mm, and t is more than or equal to 10 mu m and less than or equal to 20 mu m.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural view of a battery cell according to an embodiment of the present invention;
FIG. 2a is a schematic diagram of a cell according to one embodiment of the present invention;
fig. 2b is a schematic structural diagram of a battery cell according to another embodiment of the invention;
fig. 2c is a schematic structural view of a battery cell according to still another embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a photovoltaic module according to an embodiment of the present invention;
FIG. 4 is a partial cross-sectional view taken along line A-A of FIG. 3;
FIG. 5 is a cross-sectional schematic view of a solder strip in accordance with one embodiment of the present invention;
FIG. 6 is a schematic cross-sectional view of a solder strip in accordance with another embodiment of the present invention;
FIG. 7 is a schematic cross-sectional view of a solder strip in accordance with yet another embodiment of the present invention;
FIG. 8 is a schematic cross-sectional view of a solder strip in accordance with yet another embodiment of the present invention.
Reference numerals:
1: a battery piece; 11: a secondary gate line; 2: welding a strip;
21: a conductive base; 22: a solder layer; 23: a triangular solder ribbon section;
24: a rectangular solder ribbon section; 3: and (4) bonding the parts.
Detailed Description
Embodiments of the present invention will be described in detail below, the embodiments described with reference to the drawings being illustrative, and the embodiments of the present invention will be described in detail below.
A photovoltaic module according to an embodiment of the present invention is described below with reference to fig. 1 to 8. The photovoltaic module may be a heterojunction (a special PN junction formed by sequentially depositing two or more different semiconductor material films on the same substrate, the materials having different energy band gaps, and they may be a compound such as gallium arsenide, or a semiconductor alloy such as silicon-germanium) module.
As shown in fig. 3 and 4, a photovoltaic module according to an embodiment of the present invention includes a plurality of cells 1 and a plurality of solder ribbons 2. In the description of the present invention, "a plurality" means two or more.
Each cell 1 is provided with a plurality of secondary grid lines 11 arranged at intervals. For example, in the example of fig. 1 to 3, the battery piece 1 may be a single crystal battery piece, the battery piece 1 is substantially rectangular, and four corners of the battery piece 1 are arc-shaped. The plurality of finger lines 11 may extend in the left-right direction and be arranged at regular intervals in the up-down direction. The plurality of secondary grid lines 11 may be parallel to each other and all parallel to two opposite edges of the battery sheet 1. Therefore, by arranging the plurality of sub-grid lines 11, the plurality of sub-grid lines 11 can guide the current generated by the photovoltaic effect of the cell 1. Moreover, the main grid line can be omitted from the cell piece 1, so that on one hand, the usage amount of silver paste can be reduced, the cost is reduced, on the other hand, the shielding of the main grid line on the cell piece 1 can be avoided, and the optical utilization rate of the photovoltaic module is improved.
The plurality of solder strips 2 are arranged at intervals along the length direction of the sub-grid lines 11, and each solder strip 2 extends along the arrangement direction of the plurality of sub-grid lines 11. For example, in the example of fig. 3, seven solder strips 2 are shown, the seven solder strips 2 extend in the up-down direction and are arranged at intervals in the left-right direction, the seven solder strips 2 are parallel to each other and are parallel to the other two opposite sides of the battery piece 1, and the solder strips 2 are perpendicular to the busbar lines 11. Each solder ribbon 2 is electrically connected to a plurality of finger lines 11. Thus, the plurality of solder strips 2 thus arranged can carry out the current guided by the plurality of finger lines 11.
With reference to fig. 2a, each solder strip 2 is bonded to the battery sheet 1 by at least one bonding member 3, and the at least one bonding member 3 is located between the edge of the battery sheet 1 and the outermost one of the plurality of finger lines 11. When there is one adhesive member 3, the adhesive member 3 is located between the edge of the battery piece 1 and the outermost one of the plurality of sub-grid lines 11; when the adhesive member 3 is plural, at least one of the plural adhesive members 3 is located between the edge of the battery sheet 1 and the outermost one of the plural finger lines 11.
For example, in the example of fig. 2a, two edges of the battery sheet 1 parallel to the minor grid lines 11 may be a first edge and a second edge, respectively, and two outermost ones of the plurality of minor grid lines 11 may be a first minor grid line and a second minor grid line, respectively, the first minor grid line being disposed adjacent to the first edge, and the second minor grid line being disposed adjacent to the second edge. Each solder strip 2 may be bonded to the cell sheet 1 by two bonding members 3. One of the two adhesives 3 may be located between the first edge and the first finger line, and the other of the two adhesives 3 may be located between the second edge and the second finger line. So set up, on the one hand, a plurality of bonding pieces 3 can play the effect of connecting battery piece 1 and solder strip 2, compare with current photovoltaic module, can increase the contact force between battery piece 1 and the solder strip 2, and make the connection between solder strip 2 and the vice grid line 11 more firm to can improve photovoltaic module's reliability, on the other hand, bonding piece 3 is less to battery piece 1's the area that shelters from, thereby can guarantee that photovoltaic module has higher optical utilization.
It should be noted that seven solder strips 2 are shown in fig. 3 for illustrative purposes, but it is obvious to those skilled in the art after reading the technical solution of the present application that the solution can be applied to other numbers of solder strips 2, which also falls within the protection scope of the present invention.
According to the photovoltaic module provided by the embodiment of the invention, each solder strip 2 is electrically connected with the plurality of secondary grid lines 11, each solder strip 2 is bonded with the battery piece 1 through at least one bonding piece 3, and at least one bonding piece 3 is positioned between the edge of the battery piece 1 and the outermost one of the plurality of secondary grid lines 11, so that the contact force between the battery piece 1 and the solder strip 2 can be increased, the connection firmness between the solder strip 2 and the secondary grid lines 11 can be improved, and the reliability of the photovoltaic module can be improved. In addition, the shading area of the bonding piece 3 can be reduced, and the photovoltaic module is guaranteed to have high optical utilization rate. In addition, can need not to set up the main grid line on the battery piece 1, on the one hand, can reduce the use amount of silver thick liquid, reduce cost, on the other hand, can avoid the main grid line to the sheltering from of battery piece 1, further improve photovoltaic module's optical utilization.
In some embodiments of the present invention, referring to fig. 2a, a plurality of adhesive members 3 are disposed between each solder strip 2 and the battery sheet 1, a part of the plurality of adhesive members 3 is located between the edge of the battery sheet 1 and one side of all the minor grid lines 11, and another part of the plurality of adhesive members 3 is located between the edge of the battery sheet 1 and the other side of all the minor grid lines 11.
For example, in the example of fig. 2a, each solder strip 2 may be bonded to the cell sheet 1 by two bonding members 3. One of the two adhesive members 3 may be located between the first edge and the first finger line, and the other of the two adhesive members 3 may be located between the second edge and the second finger line. Therefore, through the arrangement, the bonding pieces 3 can be arranged close to the edges of the battery piece 1, and the shading area of the bonding pieces 3 can be further reduced while the welding strips 2 are firmly connected with the battery piece 1.
Of course, the invention is not limited thereto, and in other embodiments of the invention, referring to fig. 2c, a plurality of adhesive members 3 are disposed between each solder strip 2 and the battery sheet 1, and the plurality of adhesive members 3 include at least one first adhesive member and at least one second adhesive member, the first adhesive member is located between the edge of the battery sheet 1 and the outermost one of the plurality of minor grid lines 11, and the second adhesive member is located between two adjacent minor grid lines 11. So set up, a plurality of bonding members 3 can be connected and weld the middle part of taking 2 and battery piece 1 and weld the edge of taking 2 and battery piece 1 to can make and weld the connection between taking 2 and the battery piece 1 more firm.
Further, referring to fig. 2c, the distance between two adjacent adhesive members 3 adjacent to the edge of the battery piece 1 in the length direction of the solder strip 2 is smaller than the distance between two adjacent adhesive members 3 located in the middle of the battery piece 1. Here, it should be noted that "the middle of the cell sheet 1" is to be broadly understood to mean a portion near the middle of the cell sheet 1 with respect to the edge of the cell sheet 1, and is not limited to mean only the center of the cell sheet 1. From this, through above-mentioned setting, the binder 3 of the edge of neighbouring battery piece 1 distributes more densely, and the distribution of the binder 3 that is located the middle part of battery piece 1 is comparatively sparse, when guaranteeing to weld firm being connected of taking 2 and battery piece 1, can effectively promote the welding pulling force between welding strip 2 and the vice grid line 11 to make photovoltaic module have excellent electrical property.
In some embodiments of the present invention, referring to fig. 2b and 2c, the second adhesive member is a plurality of second adhesive members, and at least one finger 11 is disposed between two adjacent second adhesive members along the length direction of the solder ribbon 2. Therefore, when one secondary grid line 11 is arranged between every two adjacent secondary grid lines 11 along the length direction of the welding strip 2, the number of the second bonding pieces is one less than that of the secondary grid lines 11, and the firm connection between the welding strip 2 and the battery piece 1 can be effectively ensured; when being equipped with a plurality of vice grid lines 11 along the length direction of solder strip 2, between two adjacent second bonding pieces, the quantity of second bonding piece is less relatively to can reduce sheltering from to battery piece 1, guarantee photovoltaic module's optical utilization.
Alternatively, the width of the adhesive member 3 in the length direction of the finger 11 may be equal to or less than the width of the solder ribbon 2. Thus, the light shielding area of the adhesive member 3 can be effectively reduced while the firm connection between the solder strip 2 and the battery piece 1 is ensured.
In some alternative embodiments of the present invention, the height of the adhesive member 3 may be less than or equal to the height of the finger 11. Due to the arrangement, the welding between the welding strip 2 and the secondary grid line 11 can be prevented from being influenced by the overlarge height of the bonding piece 3, and therefore the welding firmness can be ensured.
In some embodiments of the present invention, the adhesive member 3 is an insulating member, and the adhesive member 3 is spaced apart from the adjacent finger lines 11, as shown in fig. 4. For example, when the bonding member 3 is a first bonding member, the bonding member 3 is spaced apart from the adjacent finger 11, and when the bonding member 3 is a second bonding member, the bonding member 3 is spaced apart from both of the adjacent finger 22. Therefore, the insulating bonding piece 3 and the adjacent auxiliary grid lines 11 are spaced from each other, the bonding piece 3 can be prevented from covering the auxiliary grid lines 11 to influence the electric connection between the auxiliary grid lines 11 and the corresponding welding strips 2, the normal output of current can be ensured, and the photovoltaic module has high output power.
Of course, the present invention is not limited thereto, and in other embodiments of the present invention, the adhesive member 3 is in contact with the adjacent finger line 11. For example, when the adhesive member 3 may be conductive, if the adhesive member 3 is the first adhesive member, the adhesive member 3 may contact the finger 11; if the adhesive member 3 is the second adhesive member, the adhesive member 3 contacts at least one of the adjacent two finger lines 11. The adhesive member 3 is electrically connected to both the busbar 11 and the solder strip 2 which are in contact. The current can be transferred from the finger 11 in contact with the bonding member 3 to the bonding member 3 and finally to the solder ribbon 2 to achieve the output of the current. So set up, when guaranteeing to weld the firm connection between area 2 and the battery piece 1, can reduce the resistance between vice grid line 11 and the welding area 2, be favorable to the normal output of electric current, and simple structure, processing is convenient, can reduce the machining precision of bonding piece 3.
Alternatively, the adhesive member 3 may be printed on the battery sheet 1. For example, during manufacturing, the adhesive member 3 may be printed on the surface of the battery sheet 1 facing the plurality of solder strips 2, and then the solder strips 2 are connected to the sub-grid lines 11 by welding and adhered to the battery sheet 1. Therefore, through the arrangement, the firm connection between the welding strip 2 and the battery piece 1 is realized, meanwhile, the adhesive piece 3 can be accurately printed between two adjacent secondary grid lines 11, and the operation is convenient.
Of course, the invention is not limited thereto, but the adhesive 3 may also be applied to the solder strip 2. So set up, can realize the firm connection between welding area 2 and the battery piece 1 equally, and can avoid the printing area of bonding member 3 too big to can reduce material cost.
Alternatively, the adhesive member 3 may be a resin adhesive. For example, the adhesive member 3 may be a polyvinyl acetal member, a polycarbonate member, a nylon member, a polysulfone member, or the like. But is not limited thereto. So set up, bonding member 3 has better heat resistance, can further guarantee to weld the firm nature of being connected between area 2 and the battery piece 1.
Or alternatively, the adhesive member 3 may include one of conductive particles and non-conductive particles, and a resin. That is, the adhesive member 3 may include conductive particles and resin, or non-conductive particles and resin. For example, when the adhesive member 3 includes conductive particles and a resin, the conductive particles may be at least one of Au, Ag, Cu, and Sn. But is not limited thereto. Therefore, when the bonding member 3 comprises conductive particles and resin, the bonding member 3 has good conductivity, so that the photovoltaic module is convenient to manufacture while the firm connection between the solder strip 2 and the cell 1 is ensured.
In some embodiments of the present invention, as shown in fig. 2b and 3, a plurality of adhesive members 3 are arranged in an array on the cell sheet 1. For example, in the example of fig. 2b and 3, six rows and seven columns of bonding members 3 are arranged between the battery piece 1 and the welding strips 2, the seven columns of bonding members 3 respectively correspond to the seven welding strips 2, and each column comprises six bonding members 3. From this, the bonding member 3 that so sets up simple structure, processing is convenient, and distributes more evenly to it is comparatively even to make the contact force between a plurality of solder strips 2 and the battery piece 1.
Optionally, with reference to fig. 3, the number of the adhesive pieces 3 in the length direction of the solder strip 2 is X, and the number of the adhesive pieces 3 in the length direction of the finger line 11 is Y, where X, Y respectively satisfy: x is more than or equal to 2 and less than or equal to 130, and Y is more than or equal to 5 and less than or equal to 30. For example, in the example of fig. 3, a plurality of solder strips 2 are arranged along the length direction of the finger line 11, and the arrangement direction of the solder strips 2 is perpendicular to the length direction of the solder strips 2. The number Y of the adhesive members 3 in the length direction of the sub-grid line 11 is the number of the solder strips 2. Specifically, when X is less than 2, the number of the bonding members 3 between each solder strip 2 and the battery piece 1 is too small, and the solder strips 2 may not be firmly connected to the battery piece 1; when X is greater than 130, the number of the bonding members 3 between each solder strip 2 and the battery piece 1 is too large, the light shielding area is too large, the structure is complex, the cost is high, and the operation is inconvenient. When Y is less than 5, the number of the bonding pieces 3 in the length direction of the sub-grid line 11 is too small, that is, the number of the solder strips 2 is too small, and the current collected at the sub-grid line 11 may not be well conveyed; when Y is greater than 30, the number of the adhesive pieces 3 in the length direction of the sub-grid line 11 is too large, that is, the number of the solder strips 2 is too large, which may cause an excessively large shielding area for the cell 1, and reduce the optical utilization rate of the photovoltaic module. Thus, X, Y satisfy: x is more than or equal to 2 and less than or equal to 130, Y is more than or equal to 5 and less than or equal to 30, the shielding area of the bonding piece 3 on the battery piece 1 can be reduced while the firm connection between the welding strip 2 and the battery piece 1 is ensured, the yield of the photovoltaic module can be improved, and the processing is convenient.
In some embodiments of the present invention, the solder ribbon 2 includes a conductive substrate 21 and a solder layer 22, the solder layer 22 being coated on the conductive substrate 21. The conductive substrate 21 may be a copper substrate, a copper-aluminum alloy substrate, a copper-silver-aluminum alloy substrate, or the like. But is not limited thereto.
Specifically, the solder layer 22 may be composed of Sn (tin, a metal element having a silvery-white luster) and Bi (bismuth, an element of group VA 83 of the sixth period of the periodic table). Among them, Sn has a low melting point, is soft and ductile, and plays an important role in the soldering between the solder ribbon 2 and the finger 11. The Bi element can reduce the melting point temperature of the soldering tin layer 22, so that the welding temperature of the solder strip 2 can be reduced, the yield of the photovoltaic module is improved, and the generation of cold solder joint is avoided. And has no pollution and is environment-friendly.
Alternatively, the solder layer 22 may also be composed of Sn, Bi, and Pb. Thus, by adding Pb to the solder layer 22, the surface tension and viscosity of the solder layer 22 can be reduced, so that the solder layer 22 has good wettability and can absorb thermal stress generated by temperature change well.
Wherein, the content of Bi is 7.5 to 70 percent, the content of Sn is 35 to 65 percent, and the content of Pb is 10 to 40 percent. Specifically, for example, when the solder layer 22 is composed of Sn, Bi, and Pb, the content of Sn may be fixed, the content of Bi may be different, and the melting point temperature of the solder layer 22 may be different. For every 1% increase in Bi content, the Pb content is correspondingly reduced by 1%, and the melting point temperature can be reduced by about 2 ℃. However, the content of Bi cannot be too high, and when the content of Bi is too high, the greater the reliability risk, the more brittle the solder strip 2 is, and the more easily oxidized. Thus, by setting the Bi content to 7.5% to 70%, the melting point of the solder layer 22 can be reduced, and the low-temperature brittleness and oxidation can be prevented.
Furthermore, the content of Bi is 8-40%, the content of Sn is 40-65%, and the content of Pb is 25-40%. For example, when the Bi content is less than 8%, the melting point temperature of the solder layer 22 may be high; when the Bi content is more than 40%, there is a possibility that the reliability risk increases, the brittleness of the solder ribbon 2 increases, and oxidation occurs. Thus, the melting point of the solder layer 22 can be further reduced, the low-temperature brittleness can be reduced, and oxidation can be prevented.
Optionally, the solder layer 22 has a melting point temperature T, where T satisfies: t is more than or equal to 110 ℃ and less than or equal to 145 ℃. Specifically, for example, when T < 110 ℃, the melting point temperature of the solder layer 22 is too low and brittleness is large, so that reliability of the solder ribbon 2 is low; when T > 145 ℃, the melting point temperature of the solder layer 22 is too high, which causes the soldering temperature of the solder ribbon 2 to be high, which may result in a high defect rate of the photovoltaic module and may cause a cold joint. Thus, by making T satisfy: t is more than or equal to 110 ℃ and less than or equal to 145 ℃, the melting point temperature of the soldering tin layer 22 is reasonable, and the soldering strip 2 is a low-temperature soldering strip, so that the yield of the photovoltaic module can be improved, the generation of cold solder joint can be avoided, the low-temperature brittleness can be reduced, and the reliability of the soldering strip 2 can be improved.
Alternatively, as shown in fig. 5-7, the solder strip 2 may be a circular solder strip, a triangular solder strip, a rectangular solder strip, or the like. Therefore, when the welding strip 2 is a circular welding strip, continuous welding with the battery piece 1 can be realized, the series resistance can be reduced, and the risk of hidden cracking of the battery piece 1 is reduced; when the welding strip 2 is a triangular welding strip, the welding strip 2 has good welding performance and good reflection effect, and can improve the conversion efficiency; when the welding strip 2 is a rectangular welding strip, the welding strip 2 is flat and has small thickness, so that the contact area between the welding strip 2 and the battery piece 1 can be increased, and the firm connection between the welding strip 2 and the battery piece 1 is realized.
Of course, the invention is not limited thereto, and with reference to fig. 8, the solder strip 2 may also be a combination of a triangular solder strip and a rectangular solder strip. For example, in the example of fig. 8, the solder ribbon 2 includes a triangular solder ribbon section 23 and a rectangular solder ribbon section 24, and the triangular solder ribbon section 23 and the rectangular solder ribbon section 24 are connected to each other in the length direction of the solder ribbon 2. For example, the rectangular solder strip section 24 can be connected to the back of the battery piece 1, the welding area of the rectangular solder strip section 24 and the battery piece 1 is large, and the welding tension can be improved, so that the reliability of the photovoltaic module can be ensured, and the rectangular solder strip section 24 does not occupy the front area of the battery piece 1. The triangular solder strip section 23 can be connected to the front of the adjacent cell piece 1, and light irradiated on the triangular solder strip section 23 can be finally reflected to the cell piece 1, so that the optical utilization rate of the front of the photovoltaic module can be effectively improved, and the power of the photovoltaic module is improved. So set up, when guaranteeing that solder strip 2 has better welding performance, can realize with 1 continuous welding of battery piece, and can effectively improve photovoltaic module's optical utilization.
In some embodiments of the present invention, when the solder ribbon 2 is a circular solder ribbon, the solder ribbon 2 has a diameter d and the solder layer 22 has a thickness t, wherein d and t respectively satisfy: d is more than or equal to 0.15mm and less than or equal to 0.35mm, and t is more than or equal to 10 mu m and less than or equal to 20 mu m.
Specifically, for example, when d < 0.15mm, the diameter of the solder ribbon 2 is excessively small, and a problem of poor soldering such as cold solder may occur; when d is larger than 0.35mm, the diameter of the solder strip 2 is too large, so that the shielding area of the cell 1 may be increased, and the conversion efficiency of the photovoltaic module is affected. When t is1When t is less than 10 μm, the thickness of the solder layer 22 is too small, and it is possible to reduce the quality of the solder joint between the solder ribbon 2 and the finger 111Above 20 μm, this leads to an excessive cost of the entire solder strip 2. Thus, by making d, t1Respectively satisfy: d is more than or equal to 0.15mm and less than or equal to 0.35mm, and t is more than or equal to 10 mu m1Less than or equal to 20 mu m, can reduce the shielding of the battery piece 1 while ensuring the welding quality between the welding strip 2 and the battery piece 1, and has lower cost.
Optionally, the photovoltaic module may include an upper glass layer, a front adhesive film layer, a solar cell module, a back adhesive film layer, and a lower cover plate. Wherein, the front adhesive film layer and the back adhesive film layer can be POE (ethylene-octylene copolymer, novel polyolefin thermoplastic elastomer with narrow relative molecular mass distribution and narrow comonomer distribution and controllable structure developed by taking metallocene as a catalyst) layer or EVA (ethylene-vinyl acetate copolymer is a general high molecular polymer) layer and the like. The lower cover plate may be glass or a back plate. The solar cell module can be connected by a plurality of cell sheets 1 through solder strips 2, for example, low-temperature solder strips, to achieve current output.
Other constructions and operations of photovoltaic modules according to embodiments of the present invention are known to those of ordinary skill in the art and will not be described in detail herein.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", and the like, indicate orientations and positional relationships based on the orientations and positional relationships shown in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
In the description of the present invention, the first feature being "on" or "under" the second feature may include the first and second features being in direct contact, and may also include the first and second features being in contact with each other not directly but through another feature therebetween.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (20)
1. A photovoltaic module, comprising:
the battery comprises a plurality of battery pieces, a plurality of secondary grid lines and a plurality of battery pieces, wherein each battery piece is provided with a plurality of secondary grid lines arranged at intervals;
the welding strip comprises a plurality of welding strips, the welding strips are arranged at intervals along the length direction of the secondary grid lines, each welding strip extends along the arrangement direction of the secondary grid lines, each welding strip is electrically connected with the secondary grid lines, each welding strip is bonded with the battery piece through at least one bonding piece, and the at least one bonding piece is located between the edge of the battery piece and the outermost side of the secondary grid lines.
2. The assembly according to claim 1, wherein a plurality of the adhesive members are disposed between each solder strip and the cell, one part of the adhesive members is disposed between the edge of the cell and one side of all the minor grid lines, and the other part of the adhesive members is disposed between the edge of the cell and the other side of all the minor grid lines.
3. The assembly according to claim 1, wherein a plurality of the bonding members are disposed between each of the solder strips and the cell sheet, the plurality of bonding members including at least one first bonding member and at least one second bonding member, the first bonding member being disposed between an edge of the cell sheet and an outermost one of the plurality of the minor grid lines, and the second bonding member being disposed between two adjacent minor grid lines.
4. The photovoltaic module of claim 3, wherein a distance between two adjacent bonding members adjacent to the edge of the cell sheet in the length direction of the solder ribbon is smaller than a distance between two adjacent bonding members located in the middle of the cell sheet.
5. The photovoltaic module of claim 3, wherein the second adhesive member is a plurality of second adhesive members, and at least one of the secondary grid lines is arranged between two adjacent second adhesive members along the length direction of the solder strip.
6. The photovoltaic module of any one of claims 1-5, wherein the width of the adhesive member in the length direction of the minor grid line is less than or equal to the width of the solder strip.
7. The photovoltaic module of any of claims 1-5, wherein the height of the adhesive is less than or equal to the height of the secondary grid lines.
8. The photovoltaic module of any of claims 1-5 wherein a plurality of the adhesive members are arranged in an array on the cell sheet.
9. The photovoltaic module of any of claims 1-5, wherein the number of the adhesive members is X along the length of the solder strip and Y along the length of the busbar, and wherein X, Y respectively satisfy: x is more than or equal to 2 and less than or equal to 130, and Y is more than or equal to 5 and less than or equal to 30.
10. The photovoltaic module of any one of claims 1-5 wherein the adhesive is an insulator and the adhesive is spaced from adjacent ones of the subgrids.
11. The photovoltaic module of any one of claims 1-5 wherein the adhesive member is in contact with the adjacent subgrid.
12. The photovoltaic module of any of claims 1-5 wherein the adhesive is printed on the cell sheet; or
The adhesive member is coated on the solder strip.
13. A photovoltaic module according to any of claims 1 to 5, wherein the adhesive is a resin adhesive.
14. The photovoltaic module of any of claims 1-5 wherein the adhesive comprises a resin and one of conductive particles and non-conductive particles.
15. The photovoltaic module of claim 14, wherein when the adhesive member includes conductive particles and a resin, the conductive particles are at least one of Au, Ag, Cu, and Sn.
16. The photovoltaic module of any of claims 1-5, wherein the solder ribbon comprises:
a conductive base;
a solder layer coated outside the conductive substrate,
the soldering tin layer consists of Sn and Bi; or
The soldering tin layer consists of Sn, Bi and Pb;
wherein, the content of Bi is 7.5 to 70 percent, the content of Sn is 35 to 65 percent, and the content of Pb is 10 to 40 percent.
17. The photovoltaic module of claim 16, wherein the Bi content is 8% to 40%, the Sn content is 40% to 65%, and the Pb content is 25% to 40%.
18. The photovoltaic module of claim 16, wherein the solder layer has a melting point temperature T, wherein T satisfies: t is more than or equal to 110 ℃ and less than or equal to 145 ℃.
19. The photovoltaic module of claim 16, wherein the solder strip is a circular solder strip, a triangular solder strip, a rectangular solder strip, or a combination of triangular and rectangular solder strips.
20. The photovoltaic module of claim 19, wherein when the solder ribbon is a circular solder ribbon, the solder ribbon has a diameter d and the solder layer has a thickness t, wherein d and t respectively satisfy: d is more than or equal to 0.15mm and less than or equal to 0.35mm, and t is more than or equal to 10 mu m and less than or equal to 20 mu m.
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