CN114076475A - Cooling system and method for mold - Google Patents
Cooling system and method for mold Download PDFInfo
- Publication number
- CN114076475A CN114076475A CN202010849245.7A CN202010849245A CN114076475A CN 114076475 A CN114076475 A CN 114076475A CN 202010849245 A CN202010849245 A CN 202010849245A CN 114076475 A CN114076475 A CN 114076475A
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- CN
- China
- Prior art keywords
- pipeline
- cooling
- water
- switch valve
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 91
- 238000000034 method Methods 0.000 title claims abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 95
- 238000001704 evaporation Methods 0.000 claims abstract description 37
- 230000008020 evaporation Effects 0.000 claims abstract description 37
- 238000004891 communication Methods 0.000 claims abstract description 3
- 239000007788 liquid Substances 0.000 claims description 23
- 238000007789 sealing Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 11
- 238000010521 absorption reaction Methods 0.000 abstract description 7
- 230000006837 decompression Effects 0.000 abstract description 5
- 238000009835 boiling Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D31/00—Other cooling or freezing apparatus
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/02—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating liquids, e.g. brine
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D29/00—Arrangement or mounting of control or safety devices
Abstract
The invention provides a cooling system and a method for a mold, wherein the cooling system for the mold comprises: a cooling line located within the mold; the evaporation container is communicated with the cooling pipeline through a first pipeline, and the evaporation container is also communicated with the cooling pipeline through a second pipeline; a water pump is arranged on the second pipeline; a pressure reduction device in communication with the evaporation vessel; the water inlet pipeline is communicated with the evaporation container, and a first switch valve is mounted on the water inlet pipeline; and the controller controls the starting and stopping of the water pump and the pressure reducing equipment and the opening and closing of the first switch valve. The cooling system for the die adopts a decompression mode to ensure that water is introduced into the cooling pipeline after being boiled at normal temperature, and the heat in the cooling pipeline is absorbed by utilizing the heat absorption effect during the boiling of the water.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of rapid cooling and rapid heating of a mold, in particular to a cooling system and a cooling method for the mold.
[ background of the invention ]
The cooling of the existing cooling and rapid heating system is mainly to directly introduce water into a cooling pipeline in a mold so as to cool the mold. The rate of cooling in this way is linked to the flow rate and temperature of the water passing into the cooling circuit, the flow rate of which is limited by the tortuous ducts and the viscosity of the water inside the mould, while the temperature of the water is limited by the ambient humidity, the Dew point (dewpoint).
Therefore, in the prior art, the cooling effect of the cooling mode of directly introducing water into the cooling pipeline in the mold is limited, and in order to further improve the cooling effect, the prior art needs to be improved.
[ summary of the invention ]
The technical problem to be solved by the invention is as follows: in order to solve the problem that the cooling effect of the cooling mode in which water is directly introduced into the cooling pipeline in the die in the prior art is limited. The invention provides a cooling system and a cooling method for a mold to solve the problems.
The technical scheme for solving the technical problem is as follows:
a cooling system for a mold, comprising:
a cooling line located within the mold;
the evaporation container is communicated with the cooling pipeline through a first pipeline, and the evaporation container is also communicated with the cooling pipeline through a second pipeline; a water pump is arranged on the second pipeline;
a pressure reduction device in communication with the evaporation vessel;
the water inlet pipeline is communicated with the evaporation container, and a first switch valve is mounted on the water inlet pipeline;
and the controller controls the starting and stopping of the water pump and the pressure reducing equipment and the opening and closing of the first switch valve.
Preferably, the cooling device further comprises a drain pipeline, the drain pipeline is communicated with the cooling pipeline, and a second switch valve is arranged on the drain pipeline;
a third switch valve is arranged on the first pipeline;
a fourth switch valve is arranged on the second pipeline and is positioned between the water pump and the cooling pipeline;
the controller controls the second switch valve, the third switch valve and the fourth switch valve to be switched on and off.
Preferably, the pressure reducing device is a pressure reducing pump, a suction port of the pressure reducing pump is communicated with the evaporation container, and the controller controls the on-off of the pressure reducing pump.
Preferably, a liquid level sensor is arranged in the evaporation container, and the liquid level sensor is electrically connected with the controller.
The invention also provides a cooling method for the die, which comprises the following steps:
a sealing step, wherein the controller controls the first switch valve to be closed, the second switch valve to be closed, the water pump to be closed, the third switch valve to be opened and the fourth switch valve to be opened;
a pressure reduction step, wherein the controller controls the pressure reduction pump to be started;
and a conveying step, wherein after the water in the evaporation container is boiled, the controller controls the water pump to be started, and after the water is kept for a preset time, the controller controls the water pump to be stopped.
Preferably, the controller controls the third switching valve to be closed, the fourth switching valve to be closed, and the second switching valve to be opened.
Preferably, the closing step further includes a water filling step, and if the controller detects that the value of the liquid level sensor is lower than a predetermined value, the controller controls the first switch valve to be opened, and until the controller detects that the value of the liquid level sensor is equal to the predetermined value, the controller controls the first switch valve to be closed.
The cooling system for the die has the advantages that the pressure reduction mode is adopted, so that water is introduced into the cooling pipeline after being boiled at normal temperature, the heat in the cooling pipeline is absorbed by utilizing the heat absorption effect during boiling of the water, the cooling effect is good, the water in the cooling pipeline exists in the states of liquid water and water vapor, the liquidity is good, and the flowing heat absorption of the liquid water and the water vapor in the cooling pipeline is facilitated.
[ description of the drawings ]
FIG. 1 is a schematic view of a cooling system for a mold of the present invention.
Fig. 2 is a flow chart of a cooling method for a mold according to the present invention.
[ detailed description ] embodiments
To further illustrate the technical means and effects of the present invention, the following detailed description is given with reference to the embodiments of the present invention and the accompanying drawings.
Referring to fig. 1, fig. 1 is a schematic diagram illustrating a cooling system for a mold according to the present invention. The present invention provides a cooling system 100 for a mold, comprising:
and the cooling pipeline 1, the cooling pipeline 1 is positioned in the mold, and one part of the cooling pipeline 1 penetrates through the mold core.
The evaporation container 2, the evaporation container 2 and the cooling pipeline 1 are communicated through a first pipeline 5, and the evaporation container 2 and the cooling pipeline 1 are also communicated through a second pipeline 6. A water pump 601 is mounted on the second pipeline 6. When the water pump 601 is started, the water pump 601 pumps the water in the evaporation vessel 2 into the cooling line 1.
And a pressure reducing device 3, wherein the pressure reducing device 3 is communicated with the evaporation container 2. The pressure reducing device 3 can draw a negative pressure in the evaporation vessel 2 to boil the water in the evaporation vessel 2 at normal temperature.
The water inlet pipeline 4, the water inlet pipeline 4 and the evaporation container 2 are communicated, and a first switch valve 401 is installed on the water inlet pipeline 4.
And a controller (not shown in the figure), which is electrically connected with the water pump 601, the pressure reducing device 3 and the first switch valve 401, and can control the start and stop of the water pump 601 and the pressure reducing device 3 and the switch of the first switch valve 401.
The operation principle of the cooling system 100 for the mold is as follows: after water is injected into the evaporation container 2 through the water inlet pipeline 4, the controller controls the first switch valve 401 to be closed, and then the controller controls the decompression device 3 to be started, so that negative pressure is absorbed in the evaporation container 2. Since the pressure in the evaporation vessel 2 becomes low, the water in the evaporation vessel 2 can be boiled at normal temperature. The controller then starts the water pump 601 to supply the water in the evaporation vessel 2 to the cooling line 1 through the second line 6, at which time liquid water and water vapor are present in the cooling line 1, and the water vapor absorb heat in the cooling line 1 and return to the evaporation vessel 2 through the first line 5.
The cooling system 100 for the mold adopts a decompression mode to ensure that water is introduced into the cooling pipeline 1 after being boiled at normal temperature, the heat in the cooling pipeline 1 is absorbed by utilizing the heat absorption effect during boiling of the water, the cooling effect is good, the water in the cooling pipeline 1 exists in the states of liquid water and water vapor, the liquidity is good, and the flowing heat absorption of the liquid water and the water vapor in the cooling pipeline 1 is facilitated.
The cooling system 100 for the mold further comprises a water drainage pipeline 7, the water drainage pipeline 7 is communicated with the cooling pipeline 1, and the water drainage pipeline 7 is provided with a second switch valve 701.
A third on/off valve 501 is installed on the first pipe 5. A fourth switching valve 602 is installed on the second pipeline 6, and the fourth switching valve 602 is located between the water pump 601 and the cooling pipeline 1.
The controller is electrically connected with the second switch valve 701, the third switch valve 501 and the fourth switch valve 602, and controls the on/off of the second switch valve 701, the third switch valve 501 and the fourth switch valve 602.
When the controller controls the third on-off valve 501 to be closed, the fourth on-off valve 602 to be closed and the second on-off valve 701 to be opened, the liquid water and the water vapor in the cooling line 1 are discharged from the water discharge line 7.
Wherein, the pressure reducing device 3 is a pressure reducing pump, the air suction port of the pressure reducing pump is communicated with the evaporation container 2, and the controller controls the start and stop of the pressure reducing pump.
Wherein, a liquid level sensor (not shown in the figure) is arranged in the evaporation container 2, and the liquid level sensor is electrically connected with the controller. The liquid level sensor is capable of detecting liquid level data within the vaporization container 2.
Referring to fig. 1 and 2, fig. 1 is a schematic diagram illustrating a cooling system for a mold according to the present invention, and fig. 2 is a flowchart illustrating a cooling method for a mold according to the present invention. Based on the cooling system 100 for a mold, the present invention further provides a cooling method for a mold, including:
s1, if the controller detects that the value of the liquid level sensor is lower than the predetermined value, the controller controls the first switch valve 401 to open, and until the controller detects that the value of the liquid level sensor is equal to the predetermined value, the controller controls the first switch valve 401 to close.
And S2 closing step, wherein the controller controls the first switch valve 401 to close, the second switch valve 701 to close, the water pump 601 to close, the third switch valve 501 to open and the fourth switch valve 602 to open.
And S3, a pressure reducing step, wherein the controller controls the pressure reducing pump to be started. In this step, the decompression pump is activated to pump the negative pressure in the evaporation vessel 2.
S4, the controller controls the water pump 601 to be turned on after the water in the evaporation container 2 is boiled, and controls the water pump 601 to be turned off after the water is kept for a predetermined time. In this step, water is boiled in the evaporation vessel 2 at normal temperature, supplied to the cooling line 1 through the second line 6 by the water pump 601, and liquid water and water vapor absorb heat in the cooling line 1 and then return to the evaporator through the first line 5.
S5 water discharging step, the controller controls the third on/off valve 501 to close, the fourth on/off valve 602 to close, and the second on/off valve 701 to open. In this step, liquid water and water vapor in the cooling line 1 are discharged from the drain line 7.
The cooling method for the mold adopts a decompression mode to ensure that water is introduced into the cooling pipeline 1 after being boiled at normal temperature, the heat in the cooling pipeline 1 is absorbed by utilizing the heat absorption effect during boiling of the water, the cooling effect is good, the water in the cooling pipeline 1 exists in the states of liquid water and water vapor, the liquidity is good, and the flowing heat absorption of the liquid water and the water vapor in the cooling pipeline 1 is facilitated.
It should be noted that the present invention is not limited to the above embodiments, and any simple modification, equivalent change and modification made to the above embodiments by those skilled in the art based on the technical solution of the present invention fall within the protection scope of the present invention.
Claims (7)
1. A cooling system for a mold, comprising:
a cooling line located within the mold;
the evaporation container is communicated with the cooling pipeline through a first pipeline, and the evaporation container is also communicated with the cooling pipeline through a second pipeline; a water pump is arranged on the second pipeline;
a pressure reduction device in communication with the evaporation vessel;
the water inlet pipeline is communicated with the evaporation container, and a first switch valve is mounted on the water inlet pipeline;
and the controller controls the starting and stopping of the water pump and the pressure reducing equipment and the opening and closing of the first switch valve.
2. A cooling system for a mold as defined in claim 1, wherein:
the cooling device also comprises a water drainage pipeline, wherein the water drainage pipeline is communicated with the cooling pipeline and is provided with a second switch valve;
a third switch valve is arranged on the first pipeline;
a fourth switch valve is arranged on the second pipeline and is positioned between the water pump and the cooling pipeline;
the controller controls the second switch valve, the third switch valve and the fourth switch valve to be switched on and off.
3. A cooling system for a mold as defined in claim 1, wherein:
the pressure reducing device is a pressure reducing pump, an air suction port of the pressure reducing pump is communicated with the evaporation container, and the controller controls starting and stopping of the pressure reducing pump.
4. A cooling system for a mold as defined in claim 1, wherein:
and a liquid level sensor is arranged in the evaporation container and electrically connected with the controller.
5. A method of cooling a mold, comprising:
a sealing step, wherein the controller controls the first switch valve to be closed, the second switch valve to be closed, the water pump to be closed, the third switch valve to be opened and the fourth switch valve to be opened;
a pressure reduction step, wherein the controller controls the pressure reduction pump to be started;
and a conveying step, wherein after the water in the evaporation container is boiled, the controller controls the water pump to be started, and after the water is kept for a preset time, the controller controls the water pump to be stopped.
6. A cooling method for a mold according to claim 5, characterized in that:
the controller controls the third switching valve to be closed, the fourth switching valve to be closed and the second switching valve to be opened.
7. A cooling method for a mold according to claim 5, characterized in that:
the method comprises a closing step, a water filling step and a water filling step, wherein if the controller detects that the numerical value of a liquid level sensor is lower than a preset numerical value, the controller controls the first switch valve to be opened, and until the controller detects that the numerical value of the liquid level sensor is equal to the preset numerical value, the controller controls the first switch valve to be closed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010849245.7A CN114076475A (en) | 2020-08-21 | 2020-08-21 | Cooling system and method for mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010849245.7A CN114076475A (en) | 2020-08-21 | 2020-08-21 | Cooling system and method for mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114076475A true CN114076475A (en) | 2022-02-22 |
Family
ID=80282310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010849245.7A Pending CN114076475A (en) | 2020-08-21 | 2020-08-21 | Cooling system and method for mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114076475A (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11137227A (en) * | 1997-11-10 | 1999-05-25 | Miura Co Ltd | Operation control device of vacuum cooling device |
| CN1616907A (en) * | 2003-11-12 | 2005-05-18 | 刘寄声 | Water-less circulation cooling system and its using method |
| JP2007170698A (en) * | 2005-12-19 | 2007-07-05 | Karunoo:Kk | Control method of cooling device |
| CN101004317A (en) * | 2006-01-19 | 2007-07-25 | 孙西灿 | Method and equipment for carrying out heat exchange by using negative pressure mode |
| CN101608846A (en) * | 2008-06-20 | 2009-12-23 | 沈阳瑞格电器制冷设备有限公司 | Water flow refrigerating method and water flow freezer thereof |
| CN102380926A (en) * | 2011-11-03 | 2012-03-21 | 杭州方圆塑料机械有限公司 | Foamed plastic plate machine water-cycle cooling vacuum system |
| JP2013007526A (en) * | 2011-06-24 | 2013-01-10 | Miura Co Ltd | Vacuum cooling device |
| CN106766666A (en) * | 2016-11-28 | 2017-05-31 | 上海理工大学 | A kind of vacuum precooling machine |
| CN108603710A (en) * | 2016-03-08 | 2018-09-28 | 三浦工业株式会社 | Vacuum cooling unit |
| CN109028645A (en) * | 2018-08-16 | 2018-12-18 | 佛山市和利环保科技有限公司 | Industrial circulating cooling water device |
| CN209877473U (en) * | 2018-12-13 | 2019-12-31 | 韩锋 | Decompression refrigerating device and equipment thereof |
-
2020
- 2020-08-21 CN CN202010849245.7A patent/CN114076475A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11137227A (en) * | 1997-11-10 | 1999-05-25 | Miura Co Ltd | Operation control device of vacuum cooling device |
| CN1616907A (en) * | 2003-11-12 | 2005-05-18 | 刘寄声 | Water-less circulation cooling system and its using method |
| JP2007170698A (en) * | 2005-12-19 | 2007-07-05 | Karunoo:Kk | Control method of cooling device |
| CN101004317A (en) * | 2006-01-19 | 2007-07-25 | 孙西灿 | Method and equipment for carrying out heat exchange by using negative pressure mode |
| CN101608846A (en) * | 2008-06-20 | 2009-12-23 | 沈阳瑞格电器制冷设备有限公司 | Water flow refrigerating method and water flow freezer thereof |
| JP2013007526A (en) * | 2011-06-24 | 2013-01-10 | Miura Co Ltd | Vacuum cooling device |
| CN102380926A (en) * | 2011-11-03 | 2012-03-21 | 杭州方圆塑料机械有限公司 | Foamed plastic plate machine water-cycle cooling vacuum system |
| CN108603710A (en) * | 2016-03-08 | 2018-09-28 | 三浦工业株式会社 | Vacuum cooling unit |
| CN106766666A (en) * | 2016-11-28 | 2017-05-31 | 上海理工大学 | A kind of vacuum precooling machine |
| CN109028645A (en) * | 2018-08-16 | 2018-12-18 | 佛山市和利环保科技有限公司 | Industrial circulating cooling water device |
| CN209877473U (en) * | 2018-12-13 | 2019-12-31 | 韩锋 | Decompression refrigerating device and equipment thereof |
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