CN114068770A - Chip component transfer printing device - Google Patents

Chip component transfer printing device Download PDF

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Publication number
CN114068770A
CN114068770A CN202110871065.3A CN202110871065A CN114068770A CN 114068770 A CN114068770 A CN 114068770A CN 202110871065 A CN202110871065 A CN 202110871065A CN 114068770 A CN114068770 A CN 114068770A
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CN
China
Prior art keywords
chip component
temporary substrate
flexible member
chip
peeling
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110871065.3A
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Chinese (zh)
Inventor
杉本典幸
粟野彻
敦贺光明
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V Technology Co Ltd
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V Technology Co Ltd
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Filing date
Publication date
Application filed by V Technology Co Ltd filed Critical V Technology Co Ltd
Publication of CN114068770A publication Critical patent/CN114068770A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0093—Wafer bonding; Removal of the growth substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0062—Processes for devices with an active region comprising only III-V compounds
    • H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
    • H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Led Device Packages (AREA)

Abstract

The invention provides a transfer device capable of reliably transferring a chip component to a chip component having a flexible member with adhesive force. The chip component transfer device includes: a first table capable of holding a temporary substrate with chip components, on which the chip components are arranged and formed, on the temporary substrate; a second table capable of holding a flexible member having an annular fixing member attached around the flexible member and having an adhesive force on the surface; and a driving mechanism provided to at least one of the first table and the second table, the driving mechanism relatively moving the first table and the second table to move the first table and the second table closer to or away from each other. The second table is provided with a convex portion which is integrally or separately provided with a surface of the second table supporting the flexible member, protrudes from the surface supporting the flexible member, and is in contact with the flexible member.

Description

Chip component transfer printing device
Technical Field
The present invention relates to a transfer device for a chip component.
Background
Since sapphire and gallium nitride have a small lattice mismatch, a method of manufacturing a chip component by laminating a gallium nitride-based semiconductor material on a temporary substrate made of sapphire is generally used.
On the other hand, sapphire is not necessarily preferable for a chip component after production because of its poor thermal and electrical conductivity. Therefore, the chip component is peeled off from the temporary substrate and mounted on a predetermined circuit substrate.
As a method for peeling the chip components from the temporary substrate, laser lift-off (LLO) has been known in the related art.
The laser lift-off is a method of peeling off a chip component from a temporary substrate by irradiating laser light from the back surface side of the temporary substrate to the vicinity of the interface between the temporary substrate and the chip component (for example, see patent document 1).
Patent document 1 describes the following: a gallium nitride re-fusion bonding layer having bonding strength smaller than that of an adhesive layer for bonding a chip component to a circuit board is formed at an interface between a temporary substrate and the chip component, and the chip component of the temporary substrate is directly transferred to the circuit board, thereby reducing man-hours and equipment load in a step of peeling the chip component from the temporary substrate.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2019-220666
Disclosure of Invention
Technical problem to be solved by the invention
As a method for transferring a chip component from a temporary substrate with a chip component to a circuit board, the following methods are also known: the chip components are temporarily transferred to a release tape using a UV release tape (a flexible member having an adhesive force on the surface), and then the chip components transferred to the UV release tape are transferred to a circuit board. In such a case, it is necessary to attach the temporary substrate with the chip component to a UV peeling tape, then peel the temporary substrate from the chip component, and transfer the chip component to the UV peeling tape. In this case, when the size of the temporary substrate becomes large, a peeling force against the adhesive force or the atmospheric pressure becomes necessary, and therefore, there is a problem that the temporary substrate and the UV peeling tape are not peeled properly and are detached from the stage that holds them by suction.
The present invention has been made in view of the above problems, and an object thereof is to provide a transfer device for a chip component capable of reliably transferring the chip component to a flexible component having adhesive force.
Means for solving the problems
The above object of the present invention is achieved by the following structure.
(1) A transfer device for a chip component includes:
a first stage capable of holding a temporary substrate for arranging chip components;
a second table capable of holding a flexible member having an annular fixing member attached around the flexible member and having an adhesive force on a surface thereof; and
a driving mechanism provided to at least one of the first table and the second table and relatively moving the first table and the second table so that the first table and the second table approach or separate from each other;
a chip component transfer device for transferring the chip components from the temporary substrate on which the chip components are arrayed to the flexible component,
the second table is provided with a convex portion which is provided integrally with or separately from a surface supporting the flexible member, protrudes from the surface supporting the flexible member, and is in contact with the flexible member.
(2) The chip component transfer apparatus according to (1), wherein the first stage and the second stage hold the temporary substrate and the flexible component, respectively, by suction.
(3) The chip component transfer apparatus according to (1) or (2), wherein the convex portion is formed of a thin plate sandwiched between the surface of the second stage and the flexible member.
(4) The chip component transfer apparatus according to (3), wherein another projection is provided in a central portion of the thin plate, and the other projection projects from a surface of the thin plate and comes into contact with the flexible component.
(5) The chip component transfer apparatus according to (3) or (4), wherein the second stage has: a first gas passage for adsorbing a back surface of the flexible member on which the annular fixed member is mounted; and a second gas passage for adsorbing the thin plate on the inner side of the first gas passage.
Effects of the invention
According to the chip component transfer apparatus of the present invention, since the force with which the temporary substrate is peeled off from the chip component by the convex portion is locally applied to a large extent when the first stage and the second stage are separated, the temporary substrate can be peeled off from the chip component without any problem, and the chip component can be reliably transferred to the flexible component having adhesive force.
Drawings
Fig. 1(a) is a plan view showing a chip component formed on a temporary substrate, and (b) is a side view showing the temporary substrate with the chip component.
Fig. 2(a) is a cross-sectional view showing a state in which the temporary substrate with the chip component is attached to the UV peeling tape, and fig. 2(b) is a cross-sectional view showing a state in which the chip component is peeled from the temporary substrate by the laser peeling process.
Fig. 3(a) to (c) are cross-sectional views showing a step of transferring the chip component to the UV peeling tape together with the peeling device.
Fig. 4 is a plan view of a thin sheet for peeling.
Fig. 5 is a view showing a state in which a small-sized temporary substrate with a chip component is used to transfer the chip component to a UV peeling tape in a peeling apparatus using the thin plate.
Fig. 6 is a view showing a state in which the chip components are transferred to the UV peeling tape in the peeling apparatus using the sheet having no other convex portion.
Fig. 7 is a view showing a state where the chip components are transferred to the UV peeling tape in the peeling apparatus in the case where the convex portion is provided by the second stage.
Description of the symbols
10 chip component
11 temporary substrate
Temporary substrate for 12 chip component
20 UV stripping belt (Flexible part)
21 fixing member
30 transfer device
31 first working table
32 second working table
33 driving mechanism
34 gas channel
35 first gas channel
36 second gas passage
40 peeling sheet
41 other convex part
P convex part
Detailed Description
Hereinafter, a chip component transfer apparatus according to an embodiment of the present invention will be described in detail with reference to the drawings.
The transfer device of the present embodiment is used in a process of manufacturing an image display device in which a chip component is mounted on a circuit board. In the method of manufacturing the image display device according to the present embodiment, first, the temporary substrate with the chip component is manufactured, then, the temporary substrate with the chip component is attached to the UV peeling tape (the flexible member having the adhesive force on the surface), and further, the chip component is peeled from the temporary substrate with the chip component, and the chip component is transferred to the UV peeling tape. After that, the UV release tape to which the chip component is transferred is attached to another carrier component, and the UV release tape is peeled off to transfer the chip component to another carrier component. Further, the other carrier member to which the chip member is transferred is attached to the circuit board, and the other carrier member is peeled off, whereby the chip member is mounted on the circuit board.
The transfer device of the present embodiment is used for transferring the chip components to the UV-peeling tape in the above-described step.
First, a temporary substrate with a chip component according to the present embodiment will be described with reference to fig. 1. As shown in fig. 1, the temporary substrate 12 with chip components has chip components 10 arranged in a matrix on the main surface of a temporary substrate 11 made of sapphire. As for the method of forming the chip components 10 on the temporary substrate 11, a generally known method can be used.
The chip component is a micro LED chip constituting a pixel of the image display device, and for example, a gallium nitride-based Light Emitting Diode (LED) is exemplified. For example, in the case of a chip component 10 made of a gallium nitride-based semiconductor material such as a Light Emitting Diode (LED), it is preferable to use a temporary substrate 11 of sapphire having a small lattice mismatch with gallium nitride.
The chip component 10 is formed on the temporary substrate 11 by crystal growth, and the chip component 10 is formed by crystal growth of a gallium nitride semiconductor material as substantial elongation of the crystal lattice of sapphire in the temporary substrate 11. The chip component 10 has a size of about 20 μm to about 80 μm and a thickness of about several μm to about 10 μm.
The gallium nitride-based semiconductor material may be not only pure gallium nitride but also a semiconductor material containing a small amount of aluminum or indium, which is the same group III element as gallium.
The detailed structure of the other chip components 10 is not affected by the implementation of the present invention, and therefore, is omitted.
Next, as shown in fig. 2(a), the temporary substrate 12 with the chip component is attached to the UV peeling tape 20. The UV release tape 20 has an adhesive layer whose adhesive force is reduced by ultraviolet rays, and has a thickness of 50 to 200 μm. For cutting, a ring-shaped fixing member 21 is attached to the outer periphery of the UV peeling tape 20 in advance.
In addition, as the flexible member having adhesive force on the surface, a thermal release tape or the like may be used in addition to the UV release tape 20, and in this case, the annular fixing member 21 is attached to the outer periphery.
Then, as shown in fig. 2(b), the chip component 10 is irradiated with laser light through the temporary substrate 11 in the laser peeling step, and the chip component 10 is peeled from the temporary substrate 11. Specifically, the laser beam having a wavelength absorbed by the material of the chip component 10 enters the following state: the bonding force of the temporary substrate 11 and the chip component 10 is weakened by the gas generated by the decomposition of the raw material with the temperature rise.
Then, as shown in fig. 3(a), the chip components 10 peeled off from the temporary substrate 11 are transferred to the UV peeling tape 20 using the transfer device 30 of the present embodiment. The transfer device 30 includes: a first table 31 capable of holding the temporary substrate 12 with chip components by suction; and a second table 32 capable of holding the UV peeling tape 20 having the adhesive force on the surface by suction.
The second table 32 is provided with a drive mechanism 33 for moving the second table 32 relative to the first table 31 so as to bring the first table 31 and the second table 32 closer to or away from each other. The driving mechanism 33 may be provided on at least one of the first table 31 and the second table 32.
The first table 31 has a porous material on the front surface thereof and has a gas passage 34 for adsorbing the back surface of the temporary substrate 11. The second stage also has a porous material on the surface thereof, and includes: a first gas passage 35 for adsorbing the back surface of the position of the UV peeling tape 20 where the annular fixing member 21 is attached; and a second gas duct 36 for adsorbing a peeling sheet 40 described later at a position inside the first gas duct 35. In the present embodiment, the second table 32 has an annular groove 37 formed between a surface for sucking the back surface of the flexible member 20 at the position where the annular fixing member 21 is attached and a surface for sucking the thin plate 40.
In the present embodiment, the annular fixing member 21 is configured to be circular, but is not limited thereto, and may be quadrilateral, for example. The groove 37 may be formed in a shape corresponding to the shape of the fixing member 21, and may be a rectangular groove.
Further, a disk-shaped peeling sheet 40 is stuck to the surface of the second table 32, and the sheet 40 has an outer diameter smaller than the outer diameter of the UV peeling tape 20. The thin sheet 40 for peeling is a thin sheet having a peripheral wall thickness of about 100 to 400 μm and made of metal or resin. The outer diameter of the thin plate 40 for peeling is preferably smaller than the inner diameter of the annular fixing member 21, and more preferably smaller than the outer diameter of the temporary substrate 11.
Therefore, by sucking the peeling sheet 40 onto the surface of the second table 32, the second table 32 is provided with the convex portion P which protrudes from the surface supporting the position of the UV peeling tape 20 where the annular fixing member 21 is attached and which abuts against the UV peeling tape 20.
In addition, another convex portion 41 that protrudes further from the surface of the peripheral portion and comes into contact with the UV peeling tape 20 is provided in the central portion of the peeling sheet 40. The other convex portions 41 have a thickness of about 50 to 200 μm. The outer diameter of the other convex portion 41 is preferably smaller than the outer diameter of the temporary substrate 12 with a small chip component described later.
Therefore, in fig. 3(a), in a state where the first table 31 and the second table 32 are separated and the thin plate 40 for peeling is adsorbed to the second table 32, the UV peeling tape 20 of the temporary substrate 12 with the chip component attached thereto is transferred onto the second table 32 by the robot. Specifically, the UV peeling tape 20 of the temporary substrate 12 with the chip component attached thereto is transported onto the second table 32 while the robot H is sucking the upper surface of the annular fixing member 21.
Then, as shown in fig. 3 (b), the second table 32 is raised, the back surface of the temporary substrate 11 is brought into contact with the front surface of the first table 31, and the temporary substrate 11 is attracted to the first table 31. At this time, only the chip component 10 is usually attached to the surface of the UV peeling tape 20 having the adhesive force, but in some cases, the surface of the temporary substrate 11 may come into contact with the surface of the UV peeling tape 20 having the adhesive force, and the temporary substrate 11 may be attached to the UV peeling tape 20.
Thereafter, as shown in fig. 3 (c), by lowering the second table 32, when the first table 31 and the second table 32 are separated from each other, the force for peeling the temporary substrate 11 from the chip component 10 can be applied to the chip component 10 close to the deformed portion of the UV peeling tape 20 via the UV peeling tape 20 deformed by the peeling sheet 40 to a large extent. In addition, even when the temporary substrate 11 is stuck to the UV peeling tape 20, the force for peeling the temporary substrate 11 from the UV peeling tape 20 can be applied to the edge of the UV peeling tape 20 to a large extent by the UV peeling tape 20 deformed by the peeling sheet 40. That is, since a peeling trigger for peeling the temporary substrate 11 from the chip component 10 or the UV peeling tape 20 by hand can be provided by the peeling sheet 40, the temporary substrate 11 can be peeled from the chip component 10 and the UV peeling tape 20 without any problem, and the chip component 10 can be reliably transferred to the UV peeling tape 20. This prevents the conventional problem that the temporary substrate 11 is detached from the first stage 31 or the UV peeling tape 20 is detached from the second stage 32 due to the adhesive force between the temporary substrate 11 and the chip component 10 or the adhesive force between the temporary substrate 11 and the UV peeling tape 20.
In the present embodiment, since the other convex portion 41 is provided at the center portion of the peeling sheet 40, even when the chip component 10 is peeled from the small-sized temporary substrate with chip component 12 and transferred to the UV peeling tape 20, as shown in fig. 5, the chip component 10 can be reliably transferred to the UV peeling tape 20. That is, by lowering the second table 32, when the first table 31 and the second table 32 are separated, the force with which the temporary substrate 11 is peeled off from the chip component 10 can be made to act largely on the chip component 10 close to the portion of the UV peeling tape 20 deformed by the other convex portion 41 (in the case where the temporary substrate 11 is attached to the UV peeling tape 20, the portion of the UV peeling tape 20 attached to the temporary substrate 11 close to the portion deformed by the other convex portion 41), and the temporary substrate 11 is peeled off from the UV peeling tape 20 and the chip component 10 without any problem.
When the chip component 10 is peeled off from the large-sized temporary substrate 12 with a chip component, the other convex portions 41 can absorb the chip component 10 by the elasticity of the UV peeling tape 20, and therefore, no particular adverse effect is caused.
The present invention is not limited to the above-described embodiment, and modifications, improvements, and the like can be appropriately made.
For example, when the transfer device 30 of the present invention is exclusively used for the large-sized temporary substrate 12 with a chip component, the peeling sheet 40 may be configured without other convex portions as shown in fig. 6.
In the present embodiment, the peeling sheet 40 is provided as the convex portion P separately from the surface of the second table 32 supporting the UV peeling tape 20, and the peeling sheet 40 is sandwiched between the surface of the second table 32 and the UV peeling tape 20, but the present invention is not limited to this, and as shown in fig. 7, a convex portion or another convex portion may be integrally provided on the surface of the second table 32. In this case, the convex portion and the surface of the other convex portion may be made of a porous material, and the central portion of the UV peeling tape 20 may be adsorbed.
The shape of the UV peeling tape is determined according to the shape of a transfer device such as a peeling sheet or an annular fixing member, but the shape of the temporary substrate 11 may be designed arbitrarily at a position inside the inner diameter of the annular fixing member. In either case, the convex portion and the other convex portions are preferably formed such that at least a part of the outer edge portions thereof is located inward of the temporary substrate 11.

Claims (5)

1. A transfer device for a chip component includes:
a first stage capable of holding a temporary substrate for arranging chip components;
a second table capable of holding a flexible member having an annular fixing member attached around the flexible member and having an adhesive force on a surface thereof; and
a driving mechanism provided to at least one of the first table and the second table and relatively moving the first table and the second table so that the first table and the second table approach or separate from each other;
the chip component transfer device transfers the chip components from the temporary substrate on which the chip components are arrayed to the flexible component, the chip component transfer device being characterized in that,
the second table is provided with a convex portion which is provided integrally with or separately from a surface of the second table supporting the flexible member, protrudes from the surface of the second table supporting the flexible member, and is in contact with the flexible member.
2. The chip component transfer apparatus according to claim 1,
the first table and the second table hold the temporary substrate and the flexible member by suction, respectively.
3. Chip component transfer device according to claim 1 or 2,
the convex portion is formed of a thin plate sandwiched between the surface of the second table and the flexible member.
4. The chip component transfer apparatus according to claim 3,
the thin plate has another projection portion provided at a central portion thereof, the other projection portion projecting from a surface of the thin plate and abutting against the flexible member.
5. Chip component transfer device according to claim 3 or 4,
the second stage has: a first gas passage for adsorbing a back surface of the flexible member on which the annular fixed member is mounted; and a second gas passage for adsorbing the thin plate on the inner side of the first gas passage.
CN202110871065.3A 2020-07-31 2021-07-30 Chip component transfer printing device Pending CN114068770A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020130527A JP2022026864A (en) 2020-07-31 2020-07-31 Transfer device of chip component
JP2020-130527 2020-07-31

Publications (1)

Publication Number Publication Date
CN114068770A true CN114068770A (en) 2022-02-18

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CN202110871065.3A Pending CN114068770A (en) 2020-07-31 2021-07-30 Chip component transfer printing device

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TWI827095B (en) * 2022-06-13 2023-12-21 斯託克精密科技股份有限公司 Apparatus configured to transfer electronic device, method for welding electronic device, and method for manufacturing light-emitting diode display

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CN216719972U (en) 2022-06-10
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