CN114064641A - Bin dividing method and terminal for LED chip - Google Patents
Bin dividing method and terminal for LED chip Download PDFInfo
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Abstract
The invention provides a method and a terminal for dividing an LED chip into bins, which are used for acquiring a preset Bin coding table set, wherein the preset Bin coding table set comprises a default Bin coding table; traversing the film source to be sorted, and when the film source to be sorted is traversed to the target film source to be sorted, respectively pre-sorting the target film source to be sorted according to each Bin coding table in the preset Bin coding table set to obtain the Bin yield of the target film source to be sorted to each Bin coding table; updating the default Bin coding table according to the set Bin yield of each Bin coding table; the invention realizes the replacement of the default Bin coding table according to the set Bin yield in the actual production process, thereby being capable of adapting to the phenomenon that part of film sources deviate in brightness or wavelength in the batch production process, enabling the film sources to be matched with the adaptive Bin coding table and realizing the improvement of the set Bin yield.
Description
Technical Field
The invention relates to the field of LED products, in particular to a Bin dividing method and a terminal for an LED chip.
Background
The customer has more and more delicate requirements on the subdivision of photoelectric parameters of LED products, the sorting equipment of the LED can sort 150Bin grades at most, the prior sorting process of the LED chips only adopts a single Bin coding table to operate and cannot cover the characteristics of all the LED chips, so that the Bin yield of part of LED chip sets with high/low brightness and high/low wavelength (namely the proportion of the number of the LED chips sorted successfully according to the Bin coding table to the total number of the LED chips on one chip source) is lower, the upper Bin rate of the LED chips (namely the proportion of the total number of all the LED chips of the LED chip stations sorted successfully according to the Bin coding table) is influenced during sorting, and the prior two main processing modes are that firstly, the operation is directly carried out according to the Bin coding table in use, a certain yield loss is borne, and the production cost is increased undoubtedly; and the other is that a clamping control value is set for the set Bin yield, and a mode of placing before and then carrying out centralized processing is adopted for film sources with the set Bin yield lower than the clamping control value, but the mode has a limited improvement degree on the set Bin yield.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: a method and a terminal for dividing an LED chip into bins are provided, so that the yield of the bins is improved.
In order to solve the technical problems, the invention adopts a technical scheme that:
a Bin dividing method for LED chips comprises the following steps:
acquiring a preset Bin coding table set, wherein the preset Bin coding table set comprises a default Bin coding table;
traversing the film source to be sorted, and when the film source to be sorted is traversed to the target film source to be sorted, respectively pre-sorting the target film source to be sorted according to each Bin coding table in the preset Bin coding table set to obtain the Bin yield of the target film source to be sorted to each Bin coding table;
and updating the default Bin coding table according to the set Bin yield of each Bin coding table.
In order to solve the technical problem, the invention adopts another technical scheme as follows:
an LED chip Bin terminal comprising a memory, a processor and a computer program stored on the memory and executable on the processor, the processor implementing the following steps when executing the computer program:
acquiring a preset Bin coding table set, wherein the preset Bin coding table set comprises a default Bin coding table;
traversing the film source to be sorted, and when the film source to be sorted is traversed to the target film source to be sorted, respectively pre-sorting the target film source to be sorted according to each Bin coding table in the preset Bin coding table set to obtain the Bin yield of the target film source to be sorted to each Bin coding table;
and updating the default Bin coding table according to the set Bin yield of each Bin coding table.
The invention has the beneficial effects that: a Bin coding table set is set, wherein the Bin coding table set comprises a default Bin coding table, when the Bin coding table set is sorted, the set Bin yield of the to-be-sorted film source under each Bin coding table in the Bin coding table set is calculated, the default Bin coding table is updated according to the calculated set Bin yield, the default Bin coding table is replaced according to the set Bin yield in the actual production process, and therefore the phenomenon that part of the film sources deviate in brightness or wavelength in the batch production process can be met, the film sources can be matched with the adaptive Bin coding table, and the set Bin yield is improved.
Drawings
FIG. 1 is a flowchart illustrating steps of a Bin dividing method for an LED chip according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a sub-Bin terminal of an LED chip according to an embodiment of the present invention;
FIG. 3 is a diagram illustrating a plurality of test slice sources determining a first Bin code table according to an embodiment of the present invention;
description of reference numerals:
1. an LED chip is divided into a Bin terminal; 2. a processor; 3. a memory.
Detailed Description
In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1, a method for splitting an LED chip into bins includes the steps of:
acquiring a preset Bin coding table set, wherein the preset Bin coding table set comprises a default Bin coding table;
traversing the film source to be sorted, and when the film source to be sorted is traversed to the target film source to be sorted, respectively pre-sorting the target film source to be sorted according to each Bin coding table in the preset Bin coding table set to obtain the Bin yield of the target film source to be sorted to each Bin coding table;
and updating the default Bin coding table according to the set Bin yield of each Bin coding table.
From the above description, the beneficial effects of the present invention are: a Bin coding table set is set, wherein the Bin coding table set comprises a default Bin coding table, when the Bin coding table set is sorted, the set Bin yield of the to-be-sorted film source under each Bin coding table in the Bin coding table set is calculated, the default Bin coding table is updated according to the calculated set Bin yield, the default Bin coding table is replaced according to the set Bin yield in the actual production process, and therefore the phenomenon that part of the film sources deviate in brightness or wavelength in the batch production process can be met, the film sources can be matched with the adaptive Bin coding table, and the set Bin yield is improved.
Further, the obtaining of the set Bin yield of the target to-be-sorted slice source for each Bin coding table and the updating of the default Bin coding table according to the set Bin yield of each Bin coding table include:
if the difference value between the set Bin yield of a target Bin coding table except the default Bin coding table and the set Bin yield of the default Bin coding table in the preset Bin coding table set is within a first preset range, storing the set Bin yield of each Bin coding table of the target to-be-sorted slice source into a database;
the updating the default Bin coding table according to the set Bin yield of each Bin coding table comprises:
calculating the average set Bin yield of each Bin coding table in the database at preset time intervals;
and setting the Bin coding table with the highest average set Bin yield as a default Bin coding table.
From the above description, the default Bin coding table is the Bin coding table according to which Bin division is currently performed, when Bin division is performed according to the default Bin coding table, a set of Bin yield rates corresponding to Bin division performed on the target to-be-sorted slice source according to other Bin coding tables in the preset Bin coding table set are calculated, if a difference value of the set Bin yield rates between the other Bin coding tables and the default Bin coding table exceeds a first preset range, it is indicated that a difference occurs in the sorting result of each Bin coding table of the target to-be-sorted slice source, the difference result is stored, all the Bin coding tables with the difference occurring in the sorting result are finally integrated, one with the highest average set of Bin yield rates is selected to be the new default Bin coding table, the Bin coding table is updated according to an actual production condition in the production process, and improvement of the overall set of Bin yield rates is achieved.
Further, the traversing the source of the to-be-sorted slice further comprises:
and when the target film source to be sorted is traversed, actually sorting the target film source to be sorted according to the default Bin coding table.
According to the description, the actual sorting is directly carried out according to the existing default Bin coding table in the production process, the sorting results of all Bin coding tables are calculated in the background and used as the basis for updating the default Bin coding table, the actual production process cannot be influenced in the process of confirming the default Bin coding table, and the yield of the set Bin is improved on the premise of ensuring the current production efficiency.
Further, the obtaining of the preset Bin coding table set comprises:
acquiring a test film source and a Bin coding table set;
sorting the test film source according to each Bin coding table in the Bin coding table set respectively to obtain a set Bin yield corresponding to each Bin coding table;
and selecting the Bin coding table with the highest Bin yield as a default Bin coding table.
According to the above description, the set Bin yield of the test film source under different Bin coding tables is obtained by setting the test film source, sorting the test film source according to the preset coding table set, and selecting the Bin coding table with the highest set Bin yield as the default Bin coding table to ensure the set Bin yield at the beginning of production.
Further, the test film source is multiple;
the selecting the Bin coding table with the highest Bin yield as the default Bin coding table comprises:
traversing the test film source, and when a target test film source is traversed, sorting the Bin code tables according to the set Bin yield corresponding to each Bin code table of the target test film source, wherein the Bin code table with the highest marking set Bin yield is a first Bin code table;
and after traversing, acquiring the Bin coding table marked as the first Bin coding table for the most times as a default Bin coding table.
From the above description, before starting production, a Bin coding table is selected by a plurality of test film sources, so that the influence of accidental factors is eliminated, and the yield of the set Bin in the production process is further ensured.
The method for dividing the LED chip into bins and the terminal are applicable to the process of dividing the LED chip into bins, and are explained by the following specific implementation modes:
referring to fig. 1, a first embodiment of the present invention is:
a Bin dividing method for LED chips comprises the following steps:
s0, confirming the default Bin coding table, including:
s01, acquiring a test film source and a Bin coding table set, wherein one test film source is a wafer, and a plurality of LED chips are arranged on the wafer;
in an optional implementation mode, for each product, 6 sets of Bin coding tables are set according to high and low wave bands, high and low brightness and high and low voltage to serve as a Bin coding table set;
in an alternative embodiment, the test supply is multiple;
in an alternative embodiment, 100 test film sources are used;
s02, sorting the test film source according to each Bin coding table in the Bin coding table set respectively to obtain a set of Bin yield corresponding to each Bin coding table;
s03, selecting the Bin coding table with the highest yield of the Bin as a default Bin coding table, wherein the method comprises the following steps: traversing the test film source, and when a target test film source is traversed, sorting the Bin code tables according to the set Bin yield corresponding to each Bin code table of the target test film source, wherein the Bin code table with the highest marking set Bin yield is a first Bin code table; after traversing, acquiring the Bin coding table marked as the first Bin coding table with the most times as a default Bin coding table;
referring to fig. 3, a Bin yield of a set of Bin coding tables for sorting different film sources is shown, wherein different film sources are respectively marked by different film numbers, different Bin coding tables are also respectively marked by different numbers, and a Bin coding table marked as a first Bin coding table with the most times can be visually obtained, that is, a Bin coding table with the highest set of Bin yield with the most times is obtained;
s1, acquiring a preset Bin coding table set, wherein the preset Bin coding table set comprises a default Bin coding table;
s2, traversing the film sources to be sorted, actually sorting the target film sources to be sorted according to a default Bin coding table when the target film sources to be sorted are traversed, and pre-sorting the target film sources to be sorted according to each Bin coding table in the preset Bin coding table set respectively to obtain the Bin yield of the target film sources to be sorted to each Bin coding table;
s3, updating the default Bin code table according to the set Bin yield of each Bin code table;
if the Bin grade which can be sorted by the sorting equipment is 150 grades, matching is carried out grade by grade from Bin1 according to the grade sequence of a Bin coding table, core particles (LED chips) which accord with the Bin1 grade fall from Bin to Bin1, if the core particles do not accord with the Bin1 grade, the core particles are matched by the Bin2 grade, if the core particles accord with the Bin1 grade, the core particles fall to Bin2, if the core particles do not accord with the Bin 3526, the core particles do not accord with the Bin3, if the last grade of the Bin coding table is not matched, the core particles are judged to be subjected to Bin division failure, and the core particles fall to Bin151 (because the largest supportable grade of the current sorting machine is 150Bin, the grade which exceeds 150 cannot be captured); the yield of the wafer Bin is (the total number of the core particles on the wafer-the number of the core particles failing in Bin)/the total number of the core particles on the wafer;
in an alternative embodiment, a complete Bin coding table includes the Bin coding table name, Bin level code (or logo), Bin coding table version, and maximum and minimum values of the various optoelectronic parameters that require Bin division (e.g., LOP (light output power) \ WLD (main wavelength) \ VF (forward voltage) \ VZ (steady voltage) \ IR (reverse current) \ HW (half wave width) \ VFD, etc.).
The second embodiment of the invention is as follows:
the difference between the method for dividing the LED chip into Bin chips and the first embodiment is as follows:
between S2 and S3 also include:
if the difference value between the set Bin yield of a target Bin coding table except the default Bin coding table and the set Bin yield of the default Bin coding table in the preset Bin coding table set is within a first preset range, storing the set Bin yield of each Bin coding table of the target to-be-sorted slice source into a database;
in an alternative embodiment, the first predetermined range is from-1% to 1%;
s3 includes:
calculating the average set of Bin yield of each Bin coding table in the database at intervals of a preset time period, and setting the Bin coding table with the highest average set of Bin yield as a default Bin coding table;
in an optional embodiment, the average set Bin yield of each Bin coding table in the database is calculated every preset time period, for example, once every day, and is used for updating the default Bin coding table; and after the default Bin coding table is updated, emptying the database.
Referring to fig. 2, a third embodiment of the present invention is:
an LED chip Bin terminal 1 comprises a processor 2, a memory 3 and a computer program stored on the memory 3 and capable of running on the processor 2, wherein the processor 2 implements the steps of the first embodiment when executing the computer program.
In summary, the present invention provides a method and a terminal for splitting a LED chip into bins, wherein a preset Bin coding table set is obtained, which includes a pre-selected default Bin coding table, during a production process, a to-be-sorted slice source is traversed, a to-be-sorted slice source is actually sorted according to the default Bin coding table, a set Bin yield when each Bin coding table in the preset Bin coding table sorts a target to-be-sorted slice source is calculated, if a difference between the set Bin yield of one Bin coding table and the set Bin yield of the default Bin coding table exceeds a preset value, the set Bin yield is added into a database for storage, finally, an average set Bin yield of each Bin coding table in the database is obtained at intervals of a preset time period, the Bin coding table with the highest set Bin yield replaces the default Bin coding table, so as to realize real-time update of the default Bin coding table according to an actual production sorting result, thereby improving the overall set Bin yield, the production cost is reduced.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.
Claims (10)
1. A Bin dividing method for LED chips is characterized by comprising the following steps:
acquiring a preset Bin coding table set, wherein the preset Bin coding table set comprises a default Bin coding table;
traversing the film source to be sorted, and when the film source to be sorted is traversed to the target film source to be sorted, respectively pre-sorting the target film source to be sorted according to each Bin coding table in the preset Bin coding table set to obtain the Bin yield of the target film source to be sorted to each Bin coding table;
and updating the default Bin coding table according to the set Bin yield of each Bin coding table.
2. The method of claim 1, wherein the obtaining the Bin yield of the target to-be-sorted slice source for each Bin coding table and the updating the default Bin coding table according to the Bin yield of each Bin coding table comprises:
if the difference value between the set Bin yield of a target Bin coding table except the default Bin coding table and the set Bin yield of the default Bin coding table in the preset Bin coding table set is within a first preset range, storing the set Bin yield of each Bin coding table of the target to-be-sorted slice source into a database;
the updating the default Bin coding table according to the set Bin yield of each Bin coding table comprises:
calculating the average set Bin yield of each Bin coding table in the database at preset time intervals;
and setting the Bin coding table with the highest average set Bin yield as a default Bin coding table.
3. The LED chip Bin splitting method according to claim 1, wherein traversing the source of the to-be-sorted chip further comprises:
and when the target film source to be sorted is traversed, actually sorting the target film source to be sorted according to the default Bin coding table.
4. The method of claim 1, wherein the obtaining the preset Bin coding table set comprises:
acquiring a test film source and a Bin coding table set;
sorting the test film source according to each Bin coding table in the Bin coding table set respectively to obtain a set Bin yield corresponding to each Bin coding table;
and selecting the Bin coding table with the highest Bin yield as a default Bin coding table.
5. The LED chip Bin method according to claim 4, wherein the number of the test chip sources is plural;
the selecting the Bin coding table with the highest Bin yield as the default Bin coding table comprises:
traversing the test film source, and when a target test film source is traversed, sorting the Bin code tables according to the set Bin yield corresponding to each Bin code table of the target test film source, wherein the Bin code table with the highest marking set Bin yield is a first Bin code table;
and after traversing, acquiring the Bin coding table marked as the first Bin coding table for the most times as a default Bin coding table.
6. An LED chip Bin terminal, comprising a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the processor implements the following steps when executing the computer program:
acquiring a preset Bin coding table set, wherein the preset Bin coding table set comprises a default Bin coding table;
traversing the film source to be sorted, and when the film source to be sorted is traversed to the target film source to be sorted, respectively pre-sorting the target film source to be sorted according to each Bin coding table in the preset Bin coding table set to obtain the Bin yield of the target film source to be sorted to each Bin coding table;
and updating the default Bin coding table according to the set Bin yield of each Bin coding table.
7. The LED chip Bin terminal of claim 6, wherein the obtaining of the set Bin yield of the target to-be-sorted slice source for each Bin coding table and the updating of the default Bin coding table according to the set Bin yield of each Bin coding table comprises:
if the difference value between the set Bin yield of a target Bin coding table except the default Bin coding table and the set Bin yield of the default Bin coding table in the preset Bin coding table set is within a first preset range, storing the set Bin yield of each Bin coding table of the target to-be-sorted slice source into a database;
the updating the default Bin coding table according to the set Bin yield of each Bin coding table comprises:
calculating the average set Bin yield of each Bin coding table in the database at preset time intervals;
and setting the Bin coding table with the highest average set Bin yield as a default Bin coding table.
8. The LED chip Bin terminal of claim 6, wherein traversing the source of the to-be-sorted chip further comprises:
and when the target film source to be sorted is traversed, actually sorting the target film source to be sorted according to the default Bin coding table.
9. The LED chip Bin terminal of claim 6, wherein said obtaining the preset Bin coding table set comprises:
acquiring a test film source and a Bin coding table set;
sorting the test film source according to each Bin coding table in the Bin coding table set respectively to obtain a set Bin yield corresponding to each Bin coding table;
and selecting the Bin coding table with the highest Bin yield as a default Bin coding table.
10. The LED chip Bin terminal of claim 9, wherein said plurality of test chip sources;
the selecting the Bin coding table with the highest Bin yield as the default Bin coding table comprises:
traversing the test film source, and when a target test film source is traversed, sorting the Bin code tables according to the set Bin yield corresponding to each Bin code table of the target test film source, wherein the Bin code table with the highest marking set Bin yield is a first Bin code table;
and after traversing, acquiring the Bin coding table marked as the first Bin coding table for the most times as a default Bin coding table.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117952284A (en) * | 2024-03-27 | 2024-04-30 | 深圳市柠檬光子科技有限公司 | Method, device, equipment and storage medium for optimizing chip picking path |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117952284A (en) * | 2024-03-27 | 2024-04-30 | 深圳市柠檬光子科技有限公司 | Method, device, equipment and storage medium for optimizing chip picking path |
| CN117952284B (en) * | 2024-03-27 | 2024-05-31 | 深圳市柠檬光子科技有限公司 | Method, device, equipment and storage medium for optimizing chip picking path |
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