CN114063824A - Pressure sensing module, pressure sensing detection method and device and electronic equipment - Google Patents

Pressure sensing module, pressure sensing detection method and device and electronic equipment Download PDF

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Publication number
CN114063824A
CN114063824A CN202111402761.6A CN202111402761A CN114063824A CN 114063824 A CN114063824 A CN 114063824A CN 202111402761 A CN202111402761 A CN 202111402761A CN 114063824 A CN114063824 A CN 114063824A
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China
Prior art keywords
resistor
elastic layer
voltage signal
detection circuit
layer
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CN202111402761.6A
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Chinese (zh)
Inventor
罗家平
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Vivo Mobile Communication Co Ltd
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Vivo Mobile Communication Co Ltd
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Priority to CN202111402761.6A priority Critical patent/CN114063824A/en
Publication of CN114063824A publication Critical patent/CN114063824A/en
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0414Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
    • G06F3/04146Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position using pressure sensitive conductive elements delivering a boolean signal and located between crossing sensing lines, e.g. located between X and Y sensing line layers
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416Control or interface arrangements specially adapted for digitisers
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04105Pressure sensors for measuring the pressure or force exerted on the touch surface without providing the touch position

Abstract

The application discloses a pressure-sensitive module, a pressure-sensitive detection method and device and electronic equipment, and belongs to the technical field of electronic products. The pressure-sensitive module includes: the pressing structure layer is provided with M grooves on one surface close to the piezoresistor layer, wherein the arrangement positions of the grooves correspond to the pressing detection points; the piezoresistor layer is electrically connected with a detection circuit, and the detection circuit outputs a voltage signal.

Description

Pressure sensing module, pressure sensing detection method and device and electronic equipment
Technical Field
The application belongs to the technical field of electronic products, and particularly relates to a pressure sensing module, a pressure sensing detection method and device and electronic equipment.
Background
Most of the pressure sense design manufacturers under the screen realize the detection of the pressure by using the piezoresistive effect at present, the resistance value of the piezoresistor changes under the action of the pressure, the resistance change is converted into an electric signal through the Wheatstone bridge, and the electric signal is converted into a digital signal through the ADC and then is sent into the processor for processing. Referring to fig. 1, there is shown a conventional screen down pressure sensing module unit 100, in which 101 is a mechanism for fixing a strain resistor, 102, 103, 104 and 105 are strain resistors, each of the pressure sensing module units is a detection point, and the pressure sensing module units are arranged in a manner (as shown in fig. 2) such that the pressure conditions at various positions of the screen can be detected under the screen. The deformation that the screen produced can conduct near pressure sense unit when the screen is pressed to the object, and the pressure sense unit can send the treater to the signal of telecommunication after receiving the deformation, and the treater is through what or which pressure sense unit of discernment is pressed the back according to the pressure sense unit position that is pressed and push out the position of pressing.
At present, when the pressure-sensitive module is used under a screen with strong rigidity, the pressure sense fed back by the pressure-sensitive module is insufficient, and the problem of poor sensitivity exists.
Disclosure of Invention
The embodiment of the application aims to provide a pressure-sensitive module, a pressure-sensitive detection method and device and electronic equipment, and the problem that the existing pressure-sensitive module is poor in sensitivity can be solved.
In order to solve the technical problem, the present application is implemented as follows:
in a first aspect, an embodiment of the present application provides a pressure module, including: the pressing structure layer is provided with M grooves on one surface close to the piezoresistor layer, wherein the arrangement positions of the grooves correspond to the pressing detection points;
the piezoresistor layer is electrically connected with a detection circuit, and the detection circuit outputs a voltage signal.
In a second aspect, an embodiment of the present application provides an electronic device, including a display screen and the pressure-sensitive module according to the first aspect; the pressure sensing module is located on the inner side of the display screen and is tiled in the whole sensing area.
In a third aspect, an embodiment of the present application provides a pressure-sensitive detection method, which is applied to the electronic device according to the second aspect, and the method includes:
acquiring a voltage signal output by the pressure sensing module;
and detecting a pressure value received by a display screen of the electronic equipment according to the voltage signal.
In a fourth aspect, an embodiment of the present application provides a pressure-sensitive detection apparatus applied to the electronic device according to the second aspect, the apparatus includes:
the acquisition module is used for acquiring a voltage signal output by the pressure sensing module;
and the detection module is used for detecting the pressure value received by the display screen of the electronic equipment according to the voltage signal.
In a fifth aspect, the present application provides an electronic device, which includes a processor, a memory, and a program or instructions stored on the memory and executable on the processor, and when executed by the processor, the program or instructions implement the steps of the method according to the third aspect.
In a sixth aspect, the present application provides a readable storage medium, on which a program or instructions are stored, which when executed by a processor implement the steps of the method according to the third aspect.
In a seventh aspect, an embodiment of the present application provides a chip, where the chip includes a processor and a communication interface, where the communication interface is coupled to the processor, and the processor is configured to execute a program or instructions to implement the method according to the third aspect.
In this application embodiment, the pressure-sensitive module includes: the pressing structure layer is provided with M grooves on one surface close to the piezoresistor layer, wherein the arrangement positions of the grooves correspond to the pressing detection points; the utility model provides a pressure sensitive resistance layer, including the pressure sensitive resistance layer, detection circuitry, pressure-sensitive resistance layer, detection circuitry output voltage signal, further can be according to voltage signal, can detect the received pressure value of electronic equipment's display screen, in this application embodiment, press the structural layer through increasing, and be close to one side of pressure sensitive resistance layer is equipped with M and presses the recess that the check point corresponds, like this, and when pressure sensitive resistance layer received to press, the groove structure can increase the deformation volume of pressure sensitive resistance to promote the sensitivity of pressure sensitive module.
Drawings
Fig. 1 is a schematic structural diagram of a conventional pressure-sensitive module unit;
FIG. 2 is a schematic diagram of a conventional pressure module unit arrangement;
FIG. 3 is a schematic diagram of a pressure sensing module according to an embodiment of the present invention;
FIG. 4 is a second schematic view of a pressure-sensitive module according to an embodiment of the present invention;
FIG. 5 is a third schematic view of a pressure module according to an embodiment of the present invention;
FIG. 6 is a fourth schematic view of the pressure module according to the embodiment of the present invention;
FIG. 7 is a fifth schematic view of a pressure module according to an embodiment of the present invention;
FIG. 8 shows a sixth schematic view of the pressure module according to the embodiment of the present invention.
FIG. 9 is a seventh schematic view of a pressure module according to an embodiment of the present invention;
fig. 10 shows an eighth schematic structural diagram of a pressure sensing module according to an embodiment of the invention.
FIG. 11 is a diagram illustrating a processing architecture of an electronic device according to an embodiment of the invention;
FIG. 12 is a flow chart of a pressure sensing method according to an embodiment of the present invention;
fig. 13 is a schematic structural view of a pressure-sensitive detection device according to an embodiment of the present invention;
fig. 14 is a block diagram showing the configuration of an electronic apparatus according to an embodiment of the present invention;
fig. 15 is a schematic diagram showing a hardware configuration of an electronic device according to an embodiment of the present invention.
Description of reference numerals:
201-a first elastic layer; 202-a second elastic layer; 200-a varistor layer; 311-a first analog switch; 312 — a first piezo-resistor; 313. 413-a wire; 314-a first fixture; 411-a second analog switch; 412-a second piezo-resistor; 414-a second fixture; 501-a third elastic layer; 502-a fourth elastic layer; 503-a fifth elastic layer; r1 — first resistance; r2 — second resistance; r3 — third resistance; r4-fourth resistor; r5-fifth resistor; r6-sixth resistance; v1 — first power supply; v2 — second power supply; delta u1-a first voltage signal; delta u2-a second voltage signal.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or described herein. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
The following describes the control method provided by the embodiments of the present application in detail through specific embodiments and application scenarios thereof with reference to the accompanying drawings.
The embodiment of the invention provides a pressure sensing module, which comprises: the pressing structure layer is provided with M grooves on one surface close to the piezoresistor layer, wherein the arrangement positions of the grooves correspond to the pressing detection points; the voltage-sensitive resistance layer is electrically connected with a detection circuit, and the detection circuit outputs a voltage signal; the voltage signal is used for detecting the magnitude of the pressing force applied to the piezoresistor.
In this embodiment, through increasing the pressing structure layer to being close to the one side of piezo-resistor layer is equipped with M recess, makes the position that sets up of recess correspond with pressing the detection point, like this, when piezo-resistor layer received to press, the groove structure can increase piezo-resistor's deformation volume, thereby promotes piezo-resistor module's sensitivity.
As shown in fig. 3 and 4, in an embodiment, the pressing structure layer includes: a first elastic layer 201 and a second elastic layer 202; wherein, the varistor layer 200 is sandwiched between the first elastic layer 201 and the second elastic layer 202;
grooves are formed in the first elastic layer 201 and the second elastic layer 202 on the sides close to the piezoresistor layers, and a convex structure is formed between the two grooves for each elastic layer; the grooves on the first elastic layer and the grooves on the second elastic layer are arranged in a staggered manner, and the grooves on the first elastic layer 201 are opposite to the protruding structures on the second elastic layer 202, as shown in fig. 3, which shows a schematic cross-sectional view when not pressed, as shown in fig. 4, which shows a schematic cross-sectional view after being deformed by being pressed.
In this embodiment, through the structural cooperation of recess and protruding, can further increase the sensitivity of pressure sensitive module. As shown in fig. 5 to 7, the detection circuit includes: a first detection circuit and a second detection circuit; the varistor layer 200 includes: a first resistance layer and a second resistance layer which are arranged in a stacked manner;
referring to fig. 6, the first resistance layer includes N first piezoresistors 312 arranged in parallel along a first direction, and first ends of the N first piezoresistors 312 are connected to a first analog switch 311, and the first analog switch 311 is connected to second ends of the N first piezoresistors 312 through a first detection circuit;
referring to fig. 7, the second resistance layer includes N second piezoresistors 412 arranged in parallel along the second direction, and first ends of the N second piezoresistors 412 are connected to a second analog switch 411, and the second analog switch 411 is connected to second ends of the N second piezoresistors 412 through a second detection circuit;
referring to fig. 5, the pressing detection point is a position where the first piezoresistor and the second piezoresistor intersect; the first direction and the second direction are perpendicular to each other; and the voltage signal includes: the first detection circuit and the second detection circuit output a first voltage signal and a second voltage signal, respectively.
Specifically, the first piezo-resistor 312 and the second piezo-resistor 412 are in the form of strips or filaments having a first length; wherein the first length is set according to the size of the pressure-sensitive detection area.
It should be noted that the numbers of the first piezoresistors 312 and the second piezoresistors 412 shown in fig. 5 to 7 are only examples, and the specific value of N may be set according to the needs of the detection area and the number of detection points.
Note that the first resistive layer and the second resistive layer are separate and insulated from each other.
In this embodiment, the first analog switch 311 includes N analog switches, and the N analog switches are sequentially switched off at a certain frequency, and are respectively used for correspondingly controlling the N first voltage dependent resistors 312 to be sequentially connected to the first detection circuit; the second analog switches 411 each include N analog switches, and the N analog switches are sequentially switched off at a certain frequency and are respectively used for correspondingly controlling the N second piezoresistors 412 to be connected to the second detection circuit; when a certain piezoresistor is pressed, the magnitude of the pressure value can be detected through a first voltage signal output by the first detection circuit and a second voltage signal output by the second detection circuit; since the N first piezoresistors 312 and the N second piezoresistors 412, which are vertically arranged with respect to each other, can respectively feed back the coordinates in the X-axis direction and the Y-axis direction, by obtaining the switch states of the N switches in the corresponding first analog switch 311 and the second analog switch 411 when the pressure value is detected, the specific pressing position can be determined.
Further, as shown in fig. 8 to 10, in an embodiment, the pressure sensing module includes: a third elastic layer 501, a fourth elastic layer 502, and a fifth elastic layer 503; the fourth elastic layer 502, the first resistive layer, the third elastic layer 501, the second resistive layer, and the fifth elastic layer 503 are sequentially stacked;
the third elastic layer 501 is provided with M first grooves arranged in parallel along the second direction on one surface close to the first resistance layer; the fourth elastic layer 502 is provided with M second grooves arranged in parallel along the second direction on one surface close to the first resistance layer; the first groove and the second groove are arranged in a staggered manner;
the third elastic layer 501 is provided with M third grooves arranged in parallel along the first direction on one surface close to the second resistance layer; the fifth elastic layer 503 is provided with M fourth grooves arranged in parallel along the first direction on one surface close to the second resistance layer; the third groove and the fourth groove are arranged in a staggered mode.
As shown in fig. 8, it is an explosion diagram of the fourth elastic layer 502, the first resistive layer, the third elastic layer 501, the second resistive layer and the fifth elastic layer 503 sequentially stacked;
illustratively, as shown in the cross-sectional views of fig. 9 and 10, when the pressure-sensitive module receives a pressing force in the direction indicated by the arrow, the first resistive layer and the second resistive layer change from the state of fig. 9 before being stressed to the state of fig. 10 when being stressed, and as shown in fig. 10, a larger deformation amount occurs in both the first resistive layer and the second resistive layer, thereby increasing the sensitivity of the pressure-sensitive module.
In this embodiment, after the screen receives to press, the deformation of screen can be transmitted to on the pressure die set, and middle both sides grooved third elastic layer 510, the grooved fourth elastic layer 502 in the top and the grooved fifth elastic layer 503 in the top can produce certain deformation when the atress owing to all having certain elasticity, can the reconversion when not the atress. This mechanism can push down after the pressurized and make middle piezo-resistor take place deformation, and this structure compares with ordinary structure, can increase the deformation volume of pressing regional piezo-resistor, and the pressure of exerting on the screen also corresponding reduction under the condition that reaches the same deformation moreover, consequently, can promote the sensitivity of pressure-sensitive module.
Further, as shown in fig. 6, in an embodiment, the pressure sensing module further includes: a first fixing member 314; two ends of the N first piezoresistors 312 are fixedly connected to the fourth elastic layer 502 or the third elastic layer 501 through the first fixing element 314.
A second fixing member 414; two ends of the N second piezoresistors 412 are fixedly connected to the fifth elastic layer 503 or the third elastic layer 501 through the second fixing element 414.
In this embodiment, the first fixing element 314 is used to straighten and fix the N first piezoresistors 312 at two ends of the fourth elastic layer 502 or the third elastic layer 501, and the second fixing element 413 is used to straighten and fix the N first piezoresistors 412 at two ends of the fifth elastic layer 502 or the third elastic layer 501, so as to fix the positions of the first resistance layer and the second resistance layer, and avoid that the first resistance layer and the second resistance layer cannot deform greatly due to the position movement.
As shown in fig. 3, in one embodiment, the first detection circuit includes: the resistor comprises a first resistor R1, a second resistor R2 and a third resistor R3 which are sequentially connected in series; one end of the first resistor R1 far away from the second resistor R2 is connected with one end of a first power supply V1; one end of the second resistor R2 far away from the first resistor R1 is connected with the other end of the first power supply V1;
outputting the first voltage signal Deltau between a first connection point and a second connection point1(ii) a Wherein the first connection point is a connection point between the first resistor R1 and the second resistor R2, the second connection point is a connection point between the third resistor R3 and the first varistor 312;
the end of the first resistor R1 away from the second resistor R2 is also connected to the first analog switch 311, and the end of the third resistor R3 away from the second resistor R2 is connected to the second ends of the N first piezoresistors 312.
As shown in fig. 3, in an embodiment, the second detection circuit includes: a fourth resistor R4, a fifth resistor R5 and a sixth resistor R6 which are connected in series in sequence; one end of the fourth resistor R4 far away from the fifth resistor R5 is connected with one end of the second power supply V2; one end of the fifth resistor R5 far away from the fourth resistor 54 is connected with the other end of the second power supply V2;
the second voltage signal Deltau is output between the third connection point and the fourth connection point2(ii) a Wherein the third connection point is a connection point between the fourth resistor R4 and the fifth resistor R5, and the fourth connection point is a connection point between the sixth resistor R6 and the second varistor 412;
one end of the fourth resistor R4 far from the fifth resistor R5 is connected to the second analog switch 411, and one end of the sixth resistor R6 far from the fifth resistor R5 is connected to the second ends of the N second piezoresistors 412.
Wherein 313 and 413 are both wires, and only an example is labeled in the figure.
Note that, in order to reduce the amount of calculation, the first resistor, the second resistor, the third resistor, the fourth resistor, the fifth resistor, and the sixth resistor have the same resistance; the first power source V1 and the second power source V2 are input wheatstone bridge power sources and may be equally arranged.
The first detection circuit and the second detection circuit are wheatstone bridges, and the resistance value change of the first piezoresistor 312 connected to the first detection circuit can be detected by detecting the voltage (first voltage signal) at two ends of the second resistor R2 and the third resistor R3 which are connected in series, so that whether the first piezoresistor 312 is pressed or not is judged; similarly, by detecting the voltages (second voltage signals) at the two ends of the second fourth resistor R4 and the fifth resistor R5 connected in series, the resistance change of the second varistor 412 connected to the second detection circuit can be detected, and thus, whether the second varistor 412 is pressed or not can be determined.
In the scheme, the pressing structure with the groove is arranged, so that the deformation of the piezoresistor is increased, and the sensitivity of the piezomodule is improved; the piezoresistors are arranged in a mutually vertical mode, and the positions of the pressing points can be accurately positioned by scanning the states of the piezoresistors.
The invention also provides electronic equipment which comprises a display screen and the pressure-sensitive module; the pressure sensing module is located on the inner side of the display screen and is tiled in the whole sensing area.
Wherein, electronic equipment still includes: the processor is used for acquiring a voltage signal output by the pressure sensing module and detecting a pressure value received by the display screen according to the voltage signal; specifically, the processor is a central processing unit MCU, after the voltage signal is amplified by the operational amplifier OPA and processed by the analog-to-digital conversion module ADC, the voltage signal is input into the MCU, and the MCU calculates the pressure value received by the display screen according to the processed voltage signal.
In this embodiment, the size of the varistor layer and the pressing structure layer, the number of the grooves, the number of the first piezoresistors 312 and the second piezoresistors 412 in the pressure sensing module, the spacing distance between the two first piezoresistors 312, and the spacing distance between the two second piezoresistors 412 can be selected and adjusted according to the requirements of the detection area and the detection performance, and finally the pressure sensing module is laid in the whole under-screen sensing area. Through this embodiment, when the display screen received and pressed, the structure of pressing of taking the recess in the voltage-sensitive module can increase piezo-resistor's deformation volume to promote voltage-sensitive module's sensitivity.
Further, the pressing structure layer comprises: a third elastic layer, a fourth elastic layer, and a fifth elastic layer; when the fourth elastic layer, the first resistive layer, the third elastic layer, the second resistive layer and the fifth elastic layer are sequentially stacked, when the display screen receives a press, the pressing force is transmitted to one or more of the first piezoresistor 312 and the second piezoresistor 412, so that the first piezoresistor 312 and the second piezoresistor 412 deform, and the magnitude of the pressure value can be detected through a first voltage signal output by the first detection circuit and a second voltage signal output by the second detection circuit; moreover, since the N first piezoresistors 312 and the N second piezoresistors 412, which are arranged perpendicular to each other, can feed back the coordinates in the X-axis and Y-axis directions, respectively, by obtaining the switch states of the N switches in the corresponding first analog switch 311 and second analog switch 411 when the pressure value is detected, a specific pressing position can be determined.
The electronic equipment acquires a first voltage signal and a second voltage signal through the processor; and detecting the pressure value received by the display screen according to the first voltage signal and the second voltage signal.
Illustratively, as shown in fig. 11, the processor is a central processing unit MCU, and the first voltage signal Δ u1And a second voltage signal Deltau2After the amplification processing of the operational amplifier OPA, the processing of the analog-to-digital conversion module ADC and the input of the processed voltage signals to the MCU, the MCU calculates the pressure value received by the display screen according to the processed first voltage signal and the processed second voltage signal.
Further, in an embodiment, as shown in fig. 11, the processor is communicatively connected to the first analog switch and the second analog switch through a data bus, respectively; the processor controls the N-way analog switch in the first analog switch 311 to be sequentially turned off and controls the N-way analog switch in the second analog switch 411 to be sequentially turned off by outputting an electric signal; n analog switches in the first analog switch 311 are respectively used to control the N first voltage dependent resistors 312 to access the first detection circuit, and N analog switches in the second analog switch 411 are respectively used to control the N second voltage dependent resistors 412 to access the second detection circuit;
and the processor determines the pressing position corresponding to the pressure value according to the switch state when the pressure value is correspondingly received according to the N-way analog switch in the first analog switch 311 and the second analog switch 411.
In this embodiment, the processor MCU communicates with the first analog switch 311 and the second analog switch 411 through a data bus, and can control the N first piezoresistors 312 and the N second piezoresistors 412 to be sequentially connected to the bridge (the first detection circuit and the second detection circuit), and can also determine the coordinates of the pressing position according to the first piezoresistors 312 and the second piezoresistors 412 which are currently connected to the circuit.
It should be noted that the structure of the pressure sensitive module can be used not only for detecting the pressure sense under the screen, but also for detecting the keys of the mobile device.
As shown in fig. 12, the present invention further provides a pressure-sensitive detection method applied to the electronic device, where the method includes:
step 101, acquiring a voltage signal output by a pressure sensing module;
and 102, detecting a pressure value received by a display screen of the electronic equipment according to the voltage signal.
Specifically, the voltage signal includes: the first detection circuit and the second detection circuit output a first voltage signal and a second voltage signal, respectively. In an embodiment, the method further includes:
determining switch states corresponding to N analog switches in the first analog switch and the second analog switch when the pressure value is detected according to electric signals output to the first analog switch and the second analog switch by the electronic equipment;
and determining a pressing position corresponding to the pressure value according to the switch state.
In this embodiment, the first analog switch 311 includes N analog switches, and the N analog switches are sequentially switched off at a certain frequency, and are respectively used for correspondingly controlling the N first voltage dependent resistors 312 to be sequentially connected to the first detection circuit; the second analog switches 411 each include N analog switches, and the N analog switches are sequentially switched off at a certain frequency and are respectively used for correspondingly controlling the N second piezoresistors 412 to be connected to the second detection circuit; when a certain piezoresistor is pressed, the magnitude of a pressure value can be detected by acquiring a first voltage signal output by a first detection circuit and a second voltage signal output by a second detection circuit; since the N first piezoresistors 312 and the N second piezoresistors 412, which are vertically arranged with respect to each other, can respectively feed back the coordinates in the X-axis direction and the Y-axis direction, when the pressure value is detected according to the first voltage signal and the second voltage signal, the specific pressing position can be determined by obtaining the switch states of the N switches in the corresponding first analog switch 311 and the second analog switch 411 when the pressure value is detected.
In the pressure-sensing detection method provided by the embodiment of the present application, the execution main body may be a pressure-sensing detection device, or a control module for executing the pressure-sensing detection method in the pressure-sensing detection device. In the embodiment of the present application, a method for performing pressure detection by a pressure detection device is taken as an example, and the pressure detection device provided in the embodiment of the present application is described.
As shown in fig. 13, the present invention further provides a pressure-sensitive detecting apparatus, applied to the electronic device, where the apparatus 1300 includes:
an obtaining module 1301, configured to obtain a voltage signal output by the pressure sensing module;
the detecting module 1302 is configured to detect a pressure value received by a display screen of the electronic device according to the voltage signal.
Optionally, the voltage signal includes: the first detection circuit and the second detection circuit respectively output a first voltage signal and a second voltage signal; the apparatus 1300 further comprises:
a first determining module, configured to determine, according to the electrical signals output to the first analog switch 311 and the second analog switch 411 by the electronic device, a switch state corresponding to N analog switches in the first analog switch 311 and the second analog switch 411 when the pressure value is detected;
and the second determining module is used for determining the pressing position corresponding to the pressure value according to the switch state.
In the device 1300, the first analog switch 311 includes N analog switches, and the N analog switches are sequentially switched off at a certain frequency, and are respectively used for correspondingly controlling the N first voltage dependent resistors 312 to be sequentially connected to the first detection circuit; the second analog switches 411 each include N analog switches, and the N analog switches are sequentially switched off at a certain frequency and are respectively used for correspondingly controlling the N second piezoresistors 412 to be connected to the second detection circuit; when a certain piezoresistor is pressed, the magnitude of a pressure value can be detected by acquiring a first voltage signal output by a first detection circuit and a second voltage signal output by a second detection circuit; since the N first piezoresistors 312 and the N second piezoresistors 412, which are vertically arranged with respect to each other, can respectively feed back the coordinates in the X-axis direction and the Y-axis direction, by obtaining the switch states of the N switches in the corresponding first analog switch 311 and the second analog switch 411 when the pressure value is detected, the specific pressing position can be determined.
The pressure-sensitive detection device in the embodiment of the present application may be a device, or may be a component, an integrated circuit, or a chip in a terminal. The device can be mobile electronic equipment or non-mobile electronic equipment. By way of example, the mobile electronic device may be a mobile phone, a tablet computer, a notebook computer, a palm top computer, a vehicle-mounted electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook or a Personal Digital Assistant (PDA), and the like, and the non-mobile electronic device may be a server, a Network Attached Storage (NAS), a Personal Computer (PC), a Television (TV), a teller machine or a self-service machine, and the like, and the embodiments of the present application are not particularly limited.
The pressure-sensitive detection device in the embodiment of the present application may be a device having an operating system. The operating system may be an Android (Android) operating system, an ios operating system, or other possible operating systems, and embodiments of the present application are not limited specifically.
The pressure detection device provided in the embodiment of the present application can implement each process implemented in the method embodiment of fig. 12, and is not described here again to avoid repetition.
Optionally, as shown in fig. 14, an electronic device 1400 is further provided in this embodiment of the present application, and includes a processor 1401, a memory 1402, and a program or an instruction stored in the memory 1402 and executable on the processor 1401, where the program or the instruction is executed by the processor 1401 to implement each process of the foregoing pressure-sensing detection method embodiment, and can achieve the same technical effect, and in order to avoid repetition, details are not repeated here.
It should be noted that the electronic device in the embodiment of the present application includes the mobile electronic device and the non-mobile electronic device described above.
Fig. 15 is a schematic hardware structure diagram of an electronic device implementing an embodiment of the present application.
The electronic device 1500 includes, but is not limited to: a radio frequency unit 1501, a network module 1502, an audio output unit 1503, an input unit 1504, a sensor 1505, a display unit 106, a user input unit 1507, an interface unit 1508, a memory 1509, and a processor 1510.
Those skilled in the art will appreciate that the electronic device 1500 may also include a power supply (e.g., a battery) for powering the various components, which may be logically coupled to the processor 1510 via a power management system to perform functions such as managing charging, discharging, and power consumption via the power management system. The electronic device structure shown in fig. 15 does not constitute a limitation of the electronic device, and the electronic device may include more or less components than those shown, or combine some components, or arrange different components, and thus, the description is omitted here.
The processor 1510 is configured to obtain a voltage signal output by the pressure sensing module;
and detecting a pressure value received by a display screen of the electronic equipment according to the voltage signal.
Optionally, the voltage signal includes: a first voltage signal and a second voltage signal; a processor 1510 further configured to: determining the switch states corresponding to the N-way analog switches in the first analog switch 311 and the second analog switch 411 when the pressure value is detected according to the electric signals output to the first analog switch 311 and the second analog switch 411 by the electronic device; and determining a pressing position corresponding to the pressure value according to the switch state.
In the electronic device, the first analog switch 311 includes N analog switches, and the N analog switches are sequentially switched off at a certain frequency and are respectively used for correspondingly controlling the N first voltage dependent resistors 312 to be sequentially connected to the first detection circuit; the second analog switches 411 each include N analog switches, and the N analog switches are sequentially switched off at a certain frequency and are respectively used for correspondingly controlling the N second piezoresistors 412 to be connected to the second detection circuit; when a certain piezoresistor is pressed, the magnitude of a pressure value can be detected by acquiring a first voltage signal output by a first detection circuit and a second voltage signal output by a second detection circuit; since the N first piezoresistors 312 and the N second piezoresistors 412, which are vertically arranged with respect to each other, can respectively feed back the coordinates in the X-axis direction and the Y-axis direction, by obtaining the switch states of the N switches in the corresponding first analog switch 311 and the second analog switch 411 when the pressure value is detected, the specific pressing position can be determined.
It should be understood that in the embodiment of the present application, the input Unit 1504 may include a Graphics Processing Unit (GPU) 15041 and a microphone 15042, and the Graphics processor 15041 processes image data of still pictures or videos obtained by an image capturing device (such as a camera) in a video capturing mode or an image capturing mode. The display unit 1506 may include a display panel 15061, and the display panel 15061 may be configured in the form of a liquid crystal display, an organic light emitting diode, or the like. The user input unit 1507 includes a touch panel 15071 and other input devices 15072. A touch panel 15071, also referred to as a touch screen. The touch panel 15071 may include two parts of a touch detection device and a touch controller. Other input devices 15072 may include, but are not limited to, a physical keyboard, function keys (e.g., volume control keys, switch keys, etc.), a trackball, a mouse, and a joystick, which are not described in detail herein. The memory 1509 may be used to store software programs as well as various data including, but not limited to, application programs and an operating system. The processor 1510 may integrate an application processor, which primarily handles operating systems, user interfaces, applications, etc., and a modem processor, which primarily handles wireless communications. It will be appreciated that the modem processor described above may not be integrated into the processor 1510.
The embodiment of the present application further provides a readable storage medium, where a program or an instruction is stored on the readable storage medium, and when the program or the instruction is executed by a processor, the program or the instruction implements the processes of the embodiment of the pressure sensing detection method, and can achieve the same technical effect, and in order to avoid repetition, details are not repeated here.
The processor is the processor in the electronic device described in the above embodiment. The readable storage medium includes a computer readable storage medium, such as a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and so on.
The embodiment of the present application further provides a chip, where the chip includes a processor and a communication interface, the communication interface is coupled to the processor, and the processor is configured to execute a program or an instruction to implement each process of the embodiment of the pressure sensing detection method, and can achieve the same technical effect, and the details are not repeated here to avoid repetition.
It should be understood that the chips mentioned in the embodiments of the present application may also be referred to as system-on-chip, system-on-chip or system-on-chip, etc.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Further, it should be noted that the scope of the methods and apparatus of the embodiments of the present application is not limited to performing the functions in the order illustrated or discussed, but may include performing the functions in a substantially simultaneous manner or in a reverse order based on the functions involved, e.g., the methods described may be performed in an order different than that described, and various steps may be added, omitted, or combined. In addition, features described with reference to certain examples may be combined in other examples.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present application may be embodied in the form of a computer software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal (such as a mobile phone, a computer, a server, or a network device) to execute the method according to the embodiments of the present application.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (15)

1. A pressure sensing module, comprising: the pressing structure layer is provided with M grooves on one surface close to the piezoresistor layer, wherein the arrangement positions of the grooves correspond to the pressing detection points;
the piezoresistor layer is electrically connected with a detection circuit, and the detection circuit outputs a voltage signal.
2. The pressure sensing module of claim 1, wherein the pressing structure layer comprises: a first elastic layer and a second elastic layer; the piezoresistor layer is sandwiched between the first elastic layer and the second elastic layer;
wherein a convex structure is formed between the two grooves; the grooves on the first elastic layer and the grooves on the second elastic layer are arranged in a staggered mode, and the grooves on the first elastic layer are opposite to the protruding structures on the second elastic layer.
3. The pressure sensing module of claim 1, wherein the piezoresistive layer comprises: a first resistance layer and a second resistance layer which are arranged in a stacked manner; the detection circuit includes: a first detection circuit and a second detection circuit; wherein the content of the first and second substances,
the first resistance layer comprises N first piezoresistors which are arranged in parallel along a first direction, first ends of the N first piezoresistors are connected with a first analog switch, and the first analog switch is connected with second ends of the N first piezoresistors through the first detection circuit;
the second resistance layer comprises N second piezoresistors which are arranged in parallel along a second direction, first ends of the N second piezoresistors are connected with a second analog switch, and the second analog switch is connected with second ends of the N second piezoresistors through the second detection circuit; the pressing detection point is the position where the first piezoresistor and the second piezoresistor are intersected;
the first direction and the second direction are perpendicular to each other; and the voltage signal comprises: the first detection circuit and the second detection circuit output a first voltage signal and a second voltage signal, respectively.
4. The pressure sensing module of claim 3, wherein the pressing structure layer comprises: a third elastic layer, a fourth elastic layer, and a fifth elastic layer; the fourth elastic layer, the first resistance layer, the third elastic layer, the second resistance layer and the fifth elastic layer are sequentially stacked;
one surface of the third elastic layer close to the first resistance layer is provided with M first grooves which are arranged in parallel along the second direction; one surface of the fourth elastic layer close to the first resistance layer is provided with M second grooves which are arranged in parallel along the second direction; the first groove and the second groove are arranged in a staggered manner;
one surface of the third elastic layer close to the second resistance layer is provided with M third grooves which are arranged in parallel along the first direction; one surface of the fifth elastic layer, which is close to the second resistance layer, is provided with M fourth grooves which are arranged in parallel along the first direction; the third groove and the fourth groove are arranged in a staggered mode.
5. The pressure sensing module of claim 4, further comprising: a first fixing member; and the two ends of the N first piezoresistors are fixedly connected with the fourth elastic layer or the third elastic layer through the first fixing piece.
6. The pressure sensing module of claim 4, further comprising: a second fixing member; and two ends of the N second piezoresistors are fixedly connected with the fifth elastic layer or the third elastic layer through the second fixing piece.
7. The pressure sensing module of claim 3, wherein the first detection circuit comprises: the first resistor, the second resistor and the third resistor are sequentially connected in series; one end of the first resistor, which is far away from the second resistor, is connected with one end of a first power supply; one end of the second resistor, which is far away from the first resistor, is connected with the other end of the first power supply;
the first voltage signal is output between the first connection point and the second connection point; wherein the first connection point is a connection point between the first resistor and the second resistor, and the second connection point is a connection point between the third resistor and the first piezoresistor;
one end of the first resistor, which is far away from the second resistor, is also connected with the first analog switch, and one end of the third resistor, which is far away from the second resistor, is connected with the second ends of the N first piezoresistors.
8. The pressure sensing module of claim 3, wherein the second detection circuit comprises: the fourth resistor, the fifth resistor and the sixth resistor are sequentially connected in series; one end of the fourth resistor, which is far away from the fifth resistor, is connected with one end of the second power supply; one end of the fifth resistor, which is far away from the fourth resistor, is connected with the other end of the second power supply;
the second voltage signal is output between the third connecting point and the fourth connecting point; wherein the third connection point is a connection point between the fourth resistor and the fifth resistor, and the fourth connection point is a connection point between the sixth resistor and the second piezoresistor;
one end, far away from the fifth resistor, of the fourth resistor is connected with the second analog switch, and one end, far away from the fifth resistor, of the sixth resistor is connected with the second ends of the N second piezoresistors.
9. The pressure sensing module of claim 3, wherein the first and second piezoresistors are strip-shaped or filament-shaped having a first length;
wherein the first length is set according to the size of the pressure-sensitive detection area.
10. An electronic device, comprising a display screen and the pressure sensing module of any one of claims 1 to 9; the pressure sensing module is located on the inner side of the display screen and is tiled in the whole sensing area.
11. A pressure-sensitive detection method applied to the electronic device according to claim 10, the method comprising:
acquiring a voltage signal output by the pressure sensing module;
and detecting a pressure value received by a display screen of the electronic equipment according to the voltage signal.
12. The pressure sensing method of claim 11, wherein the voltage signal comprises: the first detection circuit and the second detection circuit respectively output a first voltage signal and a second voltage signal;
the method further comprises the following steps:
determining switch states corresponding to N analog switches in the first analog switch and the second analog switch when the pressure value is detected according to electric signals output to the first analog switch and the second analog switch by the electronic equipment;
and determining a pressing position corresponding to the pressure value according to the switch state.
13. A pressure-sensitive detection device applied to the electronic apparatus according to claim 10, the device comprising:
the acquisition module is used for acquiring a voltage signal output by the pressure sensing module;
and the detection module is used for detecting the pressure value received by the display screen of the electronic equipment according to the voltage signal.
14. The pressure sensing device of claim 13, wherein the voltage signal comprises: the first detection circuit and the second detection circuit respectively output a first voltage signal and a second voltage signal;
the device further comprises:
the first determining module is used for determining the switch states corresponding to N paths of analog switches in the first analog switch and the second analog switch when the pressure value is detected according to the electric signals output to the first analog switch and the second analog switch by the electronic equipment;
and the second determining module is used for determining the pressing position corresponding to the pressure value according to the switch state.
15. An electronic device comprising a processor, a memory, and a program or instructions stored on the memory and executable on the processor, the program or instructions when executed by the processor implementing the steps of the pressure sensing method of claim 11 or 12.
CN202111402761.6A 2021-11-24 2021-11-24 Pressure sensing module, pressure sensing detection method and device and electronic equipment Pending CN114063824A (en)

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CN202111402761.6A CN114063824A (en) 2021-11-24 2021-11-24 Pressure sensing module, pressure sensing detection method and device and electronic equipment

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CN202111402761.6A CN114063824A (en) 2021-11-24 2021-11-24 Pressure sensing module, pressure sensing detection method and device and electronic equipment

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023236017A1 (en) * 2022-06-06 2023-12-14 北京小米移动软件有限公司 Display assembly and terminal device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023236017A1 (en) * 2022-06-06 2023-12-14 北京小米移动软件有限公司 Display assembly and terminal device

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