CN114062813A - Chip burning state detection circuit and method - Google Patents
Chip burning state detection circuit and method Download PDFInfo
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Abstract
The invention discloses a chip burning state detection circuit and a method, wherein the circuit comprises: the device comprises a burning module, a switch module, a voltage comparison module and a state judgment module; the first end of the burning module is connected with a power supply, the second end of the burning module is connected with the inverting input end of the voltage comparison module, the non-inverting input end of the voltage comparison module is connected with a reference power supply, the signal output end of the voltage comparison module is connected with the state judgment module, and the switch module is connected with the burning module; when the power supply is powered on, the switch module conducts the branch circuit where the burning module is located, and the burning module is burned; the voltage comparison module compares the reference voltage with the detection voltage in the burning process of the burning module and outputs a detection level to the state judgment module according to a comparison result; the state judging module judges the burning state of the burning module according to the detection level, and determines the chip burning result according to the burning state of the burning module, so that the accuracy of chip burning detection is improved.
Description
Technical Field
The invention relates to the technical field of chips, in particular to a chip burning state detection circuit and a chip burning state detection method.
Background
At present, modern smart mobile phones and consumer markets such as intelligent house widely use sensor chip (MEMS ASIC), consequently sensor chip demand increases relatively by a wide margin, along with the promotion of people's consumption ability, performance requirement to intelligent product is also higher, consequently, the sensitivity variation range that needs sensor chip is less relatively in order to promote product performance, current sensor chip is used for the sensitivity of calibration sensor chip through built-in correctable FUSE (FUSE) control module mostly, but current use FUSE calibration's mode, easily receive the influence of factors such as process error and system PCB reflow soldering, thereby lead to the inaccurate calibration of chip burning state detection and arouse and calibrate unusually.
The above is only for the purpose of assisting understanding of the technical aspects of the present invention, and does not represent an admission that the above is prior art.
Disclosure of Invention
The invention mainly aims to provide a circuit and a method for detecting a chip burning state, and aims to solve the technical problem of inaccurate detection of the chip burning state.
In order to achieve the above object, the present invention provides a chip burning state detection circuit, which includes: the device comprises a burning module, a switch module, a voltage comparison module and a state judgment module;
the first end of the burning module is connected with a power supply, the second end of the burning module is connected with the inverting input end of the voltage comparison module, the positive phase input end of the voltage comparison module is connected with a reference power supply, the signal output end of the voltage comparison module is connected with the state judgment module, and the switch module is connected with the burning module;
the switch module is used for conducting a branch circuit where the burning module is located when the power supply is powered on, and burning the burning module;
the voltage comparison module is used for comparing the received reference voltage input by the positive phase input end with the detection voltage input by the negative phase input end in the burning process of the burning module and outputting a detection level to the state judgment module according to the comparison result;
the state judging module is used for judging the burning state of the burning module according to the detection level and determining the chip burning result according to the burning state of the burning module.
Optionally, the chip burning state detection circuit further includes a first load; the first end of the first load is connected with the second end of the burning module, and the second end of the first load is grounded.
Optionally, the chip burning state detection circuit further includes a second load, and the voltage comparison module includes a voltage comparator; the positive phase input end of the voltage comparator is connected with a reference power supply, the negative phase input end of the voltage comparator is connected with the second end of the burning module, the negative phase input end of the voltage comparator is further connected with the first end of the first load, the positive phase input end of the voltage comparator is further connected with the first end of the second load, and the second end of the second load is grounded.
Optionally, the state determination module includes a memory circuit and a determination circuit, an input end of the memory circuit is connected with an output end of the voltage comparator, and an output end of the memory circuit is connected with an input end of the determination circuit;
the memory circuit is used for storing the detection level output by the voltage comparator;
the judging circuit is used for judging the burning state of the burning module according to the detection level stored in the memory circuit and determining the chip burning result according to the burning state of the burning module.
Optionally, the memory circuit includes a flip-flop, an input terminal of the flip-flop is connected to the output terminal of the voltage comparator, and an output terminal of the flip-flop is connected to the input terminal of the determination circuit.
In order to achieve the above object, the present invention further provides a chip burning state detection method based on the above chip burning state detection circuit, where the chip burning state detection method includes:
when the power supply is powered on, controlling the switch module to conduct a branch circuit where the burning module is located, and adjusting the output voltage of the power supply in real time to burn the burning module;
in the burning process of the burning module, acquiring the detection level output by the voltage comparison module;
and judging the burning state of the burning module according to the detection level, and determining a chip burning result according to the burning state of the burning module.
Optionally, when the power supply is powered on, the switching module is controlled to turn on the branch circuit where the burning module is located, and the output voltage of the power supply is adjusted in real time to burn the burning module, including:
when the power supply is powered on, controlling the switch module to conduct the branch where the burning module is located;
and adjusting the output voltage of the power supply to increase to a first preset voltage to burn the burning module.
Optionally, the adjusting the output voltage of the power supply to increase to a first preset voltage to burn the burning module includes:
adjusting the output voltage of the power supply to increase to a first preset voltage;
and when the output voltage is increased to a first preset voltage, controlling the power supply to keep the first preset voltage for a preset time length to burn the burning module.
Optionally, the determining the burning state of the burning module according to the detection level and determining the chip burning result according to the burning state of the burning module includes:
judging whether the detection level is a positive level;
when the detection level is positive, judging that the burning state of the burning module is successful;
and when the burning state of the burning module is successful, judging that the burning result of the chip is the completion of burning.
Optionally, after determining whether the detection level is a positive level, the method further includes:
when the detection level is negative, judging that the burning state of the burning module is burning failure;
and when the burning state of the burning module is burning failure, judging that the burning result of the chip is unfinished burning.
The technical scheme of the invention provides a chip burning state detection circuit, which comprises: the device comprises a burning module, a switch module, a voltage comparison module and a state judgment module; the first end of the burning module is connected with a power supply, the second end of the burning module is connected with the inverting input end of the voltage comparison module, the positive phase input end of the voltage comparison module is connected with a reference power supply, the signal output end of the voltage comparison module is connected with the state judgment module, and the switch module is connected with the burning module; the switch module is used for conducting a branch circuit where the burning module is located when the power supply is powered on, and burning the burning module; the voltage comparison module is used for comparing the received reference voltage input by the positive phase input end with the detection voltage input by the negative phase input end in the burning process of the burning module and outputting a detection level to the state judgment module according to the comparison result; the state judging module is used for judging the burning state of the burning module according to the detection level and determining the chip burning result according to the burning state of the burning module.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a functional block diagram of a chip burning state detection circuit according to a first embodiment of the present invention;
FIG. 2 is a schematic circuit diagram of a chip burning state detection circuit according to an embodiment of the present invention;
FIG. 3 is a functional block diagram of a circuit for detecting a burning status of a chip according to an embodiment of the present invention;
FIG. 4 is a flowchart illustrating a method for detecting a burning status of a chip according to a first embodiment of the present invention;
FIG. 5 is a flowchart illustrating a method for detecting a burning status of a chip according to a second embodiment of the present invention;
FIG. 6 is a schematic diagram of adjusting an output voltage of a power supply according to an embodiment of the method for detecting a burning status of a chip.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) | |
| Power | Power supply | | Ground connection | |
| 10 | Burning |
20 | |
|
| 30 | |
40 | State determination moduleBlock | |
| FUSE | Fuse protector | Switch | Switch with a switch body | |
| Load1 | A first load | Load2 | Second load | |
| VP | Normal phase input end | VN | Inverting input terminal | |
| A | Voltage comparator | F | Flip- |
|
| 401 | |
402 | Decision circuit | |
| VA | A first preset voltage | VDD | Rated voltage of power supply |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The invention provides a chip burning state detection circuit.
Referring to fig. 1, in the embodiment of the present invention, the chip burning state detection circuit includes: the device comprises a burning module 10, a switch module 20, a voltage comparison module 30 and a state judgment module 40.
The first end of the burning module 10 is connected with a power supply, the second end of the burning module 20 is connected with the inverting input end of the voltage comparison module 30, the non-inverting input end of the voltage comparison module 30 is connected with a reference power supply, the signal output end of the voltage comparison module 30 is connected with the state judgment module 40, and the switch module 20 is connected with the burning module 10;
the switch module 20 is configured to conduct the branch circuit where the burning module 20 is located when the power supply is powered on, and burn the burning module 20.
It can be understood that, when the recording module 20 does not need to be recorded, the switch module 20 keeps an open circuit state, so that the branch in which the recording module 20 is located is in an open circuit state; the burning module 20 may be a FUSE (FUSE) for burning, and the FUSE has an extremely low equivalent impedance, so that the FUSE is easily burned when the FUSE is powered on.
It should be understood that, because the fuse has the characteristics of low equivalent impedance and easy burning when being powered on, when the burning module 10 is burned, the branch circuit where the burning module is located can be conducted through the switch module 20, and after the branch circuit is conducted, the burning module is powered on for burning.
In a specific implementation, the first end of the switch module 20 is connected to the second end of the burning module 10, the second end of the switch module 20 is grounded, when the FUSE is not burned, the switch module is kept open, the branch circuit where the FUSE is located is in an open circuit state, and no current passes through the FUSE; when the FUSE is burned, the switch module 20 is closed, the branch circuit where the FUSE is located is turned on, and the FUSE is burned through the current flowing through the FUSE.
The voltage comparing module 30 is configured to compare the received reference voltage input by the positive phase input terminal with the detection voltage input by the negative phase input terminal during the burning process of the burning module 10, and output a detection level to the state determining module 40 according to the comparison result.
It should be understood that the reference power supply is a power supply for providing a reference voltage for the voltage comparison module 30, and the reference voltage output by the reference power supply can be set according to a specific detection scenario; the positive phase input terminal of the voltage comparison module 30 is connected to a reference power supply, and inputs a reference voltage, which is generally lower than the rated voltage of the power supply.
It can be understood that the inverting input terminal of the voltage comparing module 30 is connected to the second terminal of the burning module, the inverting input terminal inputs the detection voltage, and the detection voltage may be a level value of the second terminal of the burning module 10 in the burning process of the burning module 10.
It should be understood that, since the first end of the burning module 10 is connected to the power supply, when the burning module 10 is not burning, since the equivalent impedance value of the burning module is very low, the inverting input terminal of the voltage comparing module 30 is connected to the power supply through the burning module, the detection level input by the inverting input terminal approaches to the level of the power supply, at this time, the detection voltage input by the inverting input terminal of the voltage comparing module 30 is greater than the reference voltage input by the non-inverting input terminal, and the detection level output by the voltage comparing module is a negative level.
It can be understood that, when the recording module 10 is recorded, the switch module 20 turns on the branch circuit where the recording module is located, if the recording module 10 completes recording, the switch module 20 is switched from the closed state to the open state, the branch circuit where the recording module 20 is located is in the open state, the detection voltage input by the inverting input terminal of the voltage comparison module 30 approaches to 0, at this time, the reference voltage input by the non-inverting input terminal of the voltage comparison module 20 is greater than the detection voltage input by the inverting input terminal, and the detection level output by the voltage comparison module is a positive level.
The state determination module 40 is configured to determine a burning state of the burning module according to the detection level, and determine a chip burning result according to the burning state of the burning module.
It should be understood that when the detection level is positive, the state determination module 40 determines that the burning state of the burning module is burning, and the burning result of the chip is that burning is completed; when the detection level is negative, the state determination module 40 determines that the burning state of the burning module is not burning, and the burning result of the chip is not burning.
Further, referring to fig. 2, in order to improve the accuracy of detecting the burning status of the chip, the chip burning status detecting circuit further includes a first Load 1; the first end of the first Load is connected to the second end of the burning module 10, and the second end of the first Load is grounded.
It can be understood that the first end of the first Load1 is connected to the second end of the recording module 10, the second end of the Load1 of the first Load is grounded, the first end of the switch module 20 is connected to the second end of the FUSE, and the second end of the switch module is grounded.
It should be appreciated that the ratio of the rated voltage of the power supply to the first Load1 is approximately 0; when the FUSE is not burned, the switch module 20 remains open, the branch circuit where the FUSE is located is approximately in an open circuit state, and the current flowing through the FUSE is not enough to blow the FUSE; when the FUSE is burned, the switch module 20 is closed, the first end of the FUSE is connected to the power supply, the second end is grounded, the FUSE is in an open circuit state, and the current flowing through the FUSE blows the FUSE.
Further, with reference to fig. 2, in order to improve the accuracy of the chip programming state detection, the chip programming state detection circuit further includes a second Load2, and the voltage comparison module 30 includes a voltage comparator a; the positive phase input end of the voltage comparator 1 is connected with a reference power supply, the inverting input end of the voltage comparator a is connected with the second end of the burning module 10, the inverting input end of the voltage comparator a is further connected with the first end of the first Load1, the positive phase input end of the voltage comparator a is further connected with the first end of the second Load2, and the second end of the second Load2 is grounded.
It can be understood that, the non-inverting input terminal of the voltage comparator a inputs the reference voltage, and the inverting input terminal of the voltage comparator inputs the detection voltage; the magnitude of the reference voltage may be changed by changing the equivalent impedance of the second Load 2.
Further, referring to fig. 3, in order to improve the accuracy of detecting the burning status of the chip, the status determining module 40 includes a memory circuit 401 and a determining circuit 402, an input terminal of the memory circuit 401 is connected to the output terminal of the voltage comparator a, and an output terminal of the memory circuit 401 is connected to an input terminal of the determining circuit 402;
the memory circuit 401 is used for storing the detection level output by the voltage comparator a.
It should be understood that the memory circuit has a memory function capable of storing the positive detection level or the negative detection level of the output of the voltage comparator.
The determining circuit 402 is configured to determine a burning status of the burning module 10 according to the detection level stored in the memory circuit 401, and determine a chip burning result according to the burning status of the burning module 10.
It can be understood that when the detection level stored in the memory circuit is positive, the judgment circuit judges that the burning state of the burning module is burnt, so that the burning result of the chip is determined to be the completion of burning; when the level stored in the memory circuit is negative, the judging circuit judges that the burning state of the burning module is not burnt, so that the burning result of the chip is determined to be unfinished.
Further, with reference to fig. 2, in order to improve the accuracy of detecting the burning state of the chip, the memory circuit includes a flip-flop F, an input terminal of the flip-flop F is connected to the output terminal of the voltage comparator, and an output terminal of the flip-flop F is connected to the input terminal of the determining circuit.
This embodiment provides a chip burning state detection circuit, which includes: the device comprises a burning module, a switch module, a voltage comparison module and a state judgment module; the first end of the burning module is connected with a power supply, the second end of the burning module is connected with the inverting input end of the voltage comparison module, the positive phase input end of the voltage comparison module is connected with a reference power supply, the signal output end of the voltage comparison module is connected with the state judgment module, and the switch module is connected with the burning module; the switch module is used for conducting a branch circuit where the burning module is located when the power supply is powered on, and burning the burning module; the voltage comparison module is used for comparing the received reference voltage input by the positive phase input end with the detection voltage input by the negative phase input end in the burning process of the burning module and outputting a detection level to the state judgment module according to the comparison result; the state judging module is used for judging the burning state of the burning module according to the detection level and determining the chip burning result according to the burning state of the burning module.
Referring to fig. 4, fig. 4 is a flowchart illustrating a method for detecting a burning status of a chip according to a first embodiment of the invention.
In this embodiment, the method for detecting the burning state of the chip includes the following steps:
step S10: and when the power supply is powered on, the switch module is controlled to conduct the branch circuit where the burning module is located, and the output voltage of the power supply is adjusted in real time to burn the burning module.
It should be noted that the execution main body of the embodiment may be a computing service device with data processing, network communication, and program running functions, such as a tablet computer, a personal computer, and the like, or an electronic device, a chip burning state detection device, and the like capable of implementing the above functions. The following describes the present embodiment and the following embodiments by taking a chip burning state detection device as an example.
It is understood that the power supply may be a power supply whose output voltage is adjustable in real time; when the power supply is powered on, the output voltage can be 0, the control switch module conducts the branch circuit where the burning module is located, and the output voltage of the power supply is increased to burn the burning module.
In a specific implementation, when the chip burning state detection device is powered on the power supply, the control switch module is used for conducting the branch circuit where the burning module is located, and regulating and increasing the output voltage of the power supply to burn the burning module.
Step S20: and acquiring the detection level output by the voltage comparison module in the burning process of the burning module.
It should be understood that, in the process of programming the programming module, the detection level output by the voltage comparison module is determined by the programming state of the programming module; when the burning state of the burning module is burnt, the detection level output by the voltage comparison module is a positive level; when the recording state of the recording module is not recording, the detection level output by the voltage comparison module is a negative level.
It is understood that the burning module may be a FUSE (FUSE), or other devices having the same or similar performance as the FUSE, and the embodiment takes the case that the burning module is not FUSE as an example for description.
In a specific implementation, if the burning state of the burning module is burnt, the detection level acquired by the chip burning state detection device is a positive level; and if the burning state of the burning module is not recorded, the detection level acquired by the chip burning state detection equipment is a negative level.
Step S30: and judging the burning state of the burning module according to the detection level, and determining a chip burning result according to the burning state of the burning module.
It can be understood that the determination of the burning status of the burning module according to the detection level is as follows: when the detection level is positive, judging that the burning state of the burning module is burnt; and when the detection level is negative, judging that the burning state of the burning module is not burnt.
In a specific implementation, when a power supply is powered on, the output voltage of the power supply approaches to 0V, a chip burning state detection device controls a switch module to conduct a circuit branch where a burning module is located, adjusts and increases the output voltage of the power supply to burn the burning module, obtains a detection level output by a voltage comparison module in the burning process of the burning module, and judges that the burning state of the burning module is burning when the detection level is positive, and the burning result of a chip is that burning is finished; when the detection level is negative, the burning state of the burning module is judged to be not burning, and the burning result of the chip is not burning.
Further, in order to improve the accuracy of detecting the burning status of the chip, the step S30 includes: judging whether the detection level is a positive level; when the detection level is positive, judging that the burning state of the burning module is successful; and when the burning state of the burning module is successful, judging that the burning result of the chip is the completion of burning.
In a specific implementation, the chip burning state detection device judges whether the detection level is a positive level, and when the detection level is the positive level, the burning state of the burning module is judged to be successful, and the burning result of the chip is the completion of the burning.
Further, in order to improve the accuracy of detecting the burning state of the chip, after determining whether the detection level is a positive level, the method further includes: when the detection level is negative, judging that the burning state of the burning module is burning failure; and when the burning state of the burning module is burning failure, judging that the burning result of the chip is unfinished burning.
In a specific implementation, when the detection level is negative, the chip burning state detection device determines that the burning state of the burning module is burning failure, and the chip burning result is that burning is not completed.
Referring to fig. 5, fig. 5 is a flowchart illustrating a method for detecting a burning status of a chip according to a second embodiment of the invention.
Based on the first embodiment of the method for detecting the burning status of the chip, the step S10 includes:
step S101: and when the power supply is electrified, the switch module is controlled to conduct the branch where the burning module is located.
In a specific implementation, when the chip burning state detection device is powered on, the control switch module is used for conducting a circuit branch where the burning module is located.
Step S102: and adjusting the output voltage of the power supply to increase to a first preset voltage to burn the burning module.
It should be understood that the first preset voltage may be a voltage less than the rated voltage of the power supply; the first preset voltage is generally set to be greater than or equal to 0.8V and less than or equal to 1V; when the output voltage of the power supply is the first preset voltage, the circuit does not reach the optimal working efficiency, but can already start working, and the reference voltage value is relatively low.
Further, because a process error or a system PBC may cause a meltback phenomenon after FUSE burning and fusing due to a reflow soldering high temperature, a random equivalent impedance may be generated after FUSE meltback, so that a detection voltage output after FUSE burning is unstable, at this time, if the output voltage of the power supply is directly controlled to be powered up to a rated voltage, the influence of the equivalent impedance generated by FUSE meltback is received, if the detection voltage is close to a reference voltage, the voltage comparison module may output a positive level, thereby determining that the burning state of the FUSE is burned, and determining that a chip burning result is that burning is completed, and in order to screen out the meltback-burned FUSE, adjusting the output voltage of the power supply to increase to a first preset voltage to burn the burning module, the method includes: adjusting the output voltage of the power supply to increase to a first preset voltage; and when the output voltage is increased to a first preset voltage, controlling the power supply to keep the first preset voltage for a preset time length to burn the burning module.
It can be understood that the first predetermined voltage is generally greater than or equal to 0.8V and less than or equal to 1V, and when the output voltage of the power supply is the first predetermined voltage, although the working performance of the circuit is not optimal, the circuit can start to work, and the reference voltage of the sub-stage voltage comparison module is relatively low.
It should be understood that, referring to fig. 6, when the output voltage of the power supply increases to the first preset voltage, the chip burning state detection device controls the output voltage of the power supply to keep the first preset voltage for a preset time period to burn the FUSE, where the preset time period may be set according to a specific detection scenario.
It can be understood that the output voltage of the power supply keeps the first preset voltage for the preset duration to burn the FUSE, if the FUSE burning is successful, no current flows when the FUSE is disconnected, the detection voltage approaches to 0, the reference voltage is greater than the detection voltage, the detection level output by the voltage comparison module is a positive level, and the FUSE burning success can be accurately judged.
It should be understood that the output voltage of the power supply keeps the FUSE burning for the preset duration at the first preset voltage, if the FUSE burning fails, the detection voltage approaches the first preset voltage and is greater than the reference voltage, and the voltage comparison module outputs a negative level at this time; if the FUSE burn-in phenomenon occurs, the equivalent impedance is generated after the FUSE burn-in, current flows through the FUSE, the detection voltage is not 0, the output voltage of the power supply is 0.8V to 1V, the reference voltage is relatively lower and smaller than the detection voltage, the voltage comparison module outputs a negative level, and therefore when the FUSE burn-in fails or the FUSE burn-in phenomenon occurs, the voltage comparison module outputs the negative level, and the FUSE burn-in failure can be judged.
In this embodiment, when the power supply is powered on, the switch module is controlled to connect the branch where the burning module is located; the output voltage of the power supply is adjusted to be increased to the first preset voltage to burn the burning module, and the voltage comparison module has relatively low reference voltage because the output voltage of the power supply is increased to the first preset voltage to burn the burning module, so that a product which is burned back is screened out, and the accuracy of chip burning detection is improved.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A chip burning state detection circuit is characterized by comprising: the device comprises a burning module, a switch module, a voltage comparison module and a state judgment module;
the first end of the burning module is connected with a power supply, the second end of the burning module is connected with the inverting input end of the voltage comparison module, the positive phase input end of the voltage comparison module is connected with a reference power supply, the signal output end of the voltage comparison module is connected with the state judgment module, and the switch module is connected with the burning module;
the switch module is used for conducting a branch circuit where the burning module is located when the power supply is powered on, and burning the burning module;
the voltage comparison module is used for comparing the received reference voltage input by the positive phase input end with the detection voltage input by the negative phase input end in the burning process of the burning module and outputting a detection level to the state judgment module according to the comparison result;
the state judging module is used for judging the burning state of the burning module according to the detection level and determining the chip burning result according to the burning state of the burning module.
2. The circuit for detecting the burning status of a chip as claimed in claim 1, wherein the circuit for detecting the burning status of a chip further comprises a first load; the first end of the first load is connected with the second end of the burning module, and the second end of the first load is grounded.
3. The circuit for detecting the burning status of a chip as claimed in claim 2, wherein the circuit for detecting the burning status of a chip further comprises a second load, the voltage comparing module comprises a voltage comparator; the positive phase input end of the voltage comparator is connected with a reference power supply, the negative phase input end of the voltage comparator is connected with the second end of the burning module, the negative phase input end of the voltage comparator is further connected with the first end of the first load, the positive phase input end of the voltage comparator is further connected with the first end of the second load, and the second end of the second load is grounded.
4. The circuit for detecting the burning status of a chip as claimed in claim 3, wherein the status determining module comprises a memory circuit and a determining circuit, the input terminal of the memory circuit is connected to the output terminal of the voltage comparator, and the output terminal of the memory circuit is connected to the input terminal of the determining circuit;
the memory circuit is used for storing the detection level output by the voltage comparator;
the judging circuit is used for judging the burning state of the burning module according to the detection level stored in the memory circuit and determining the chip burning result according to the burning state of the burning module.
5. The circuit for detecting the burning status of a chip as claimed in claim 4, wherein the memory circuit comprises a flip-flop, an input terminal of the flip-flop is connected to the output terminal of the voltage comparator, and an output terminal of the flip-flop is connected to the input terminal of the determining circuit.
6. A chip burning state detection method based on the chip burning state detection circuit of any one of claims 1 to 5, wherein the chip burning state detection method comprises:
when the power supply is powered on, controlling the switch module to conduct a branch circuit where the burning module is located, and adjusting the output voltage of the power supply in real time to burn the burning module;
in the burning process of the burning module, acquiring the detection level output by the voltage comparison module;
and judging the burning state of the burning module according to the detection level, and determining a chip burning result according to the burning state of the burning module.
7. The method for detecting the burning status of a chip as claimed in claim 6, wherein the controlling the switch module to turn on the branch circuit where the burning module is located when the power supply is powered on and adjusting the output voltage of the power supply in real time to burn the burning module comprises:
when the power supply is powered on, controlling the switch module to conduct the branch where the burning module is located;
and adjusting the output voltage of the power supply to increase to a first preset voltage to burn the burning module.
8. The method for detecting the burning status of a chip as claimed in claim 7, wherein the adjusting the output voltage of the power supply to increase to a first predetermined voltage to burn the burning module comprises:
adjusting the output voltage of the power supply to increase to a first preset voltage;
and when the output voltage is increased to a first preset voltage, controlling the power supply to keep the first preset voltage for a preset time length to burn the burning module.
9. The method for detecting the burning status of a chip as claimed in claim 8, wherein the determining the burning status of the burning module according to the detection level and determining the burning result of the chip according to the burning status of the burning module comprises:
judging whether the detection level is a positive level;
when the detection level is positive, judging that the burning state of the burning module is successful;
and when the burning state of the burning module is successful, judging that the burning result of the chip is the completion of burning.
10. The method for detecting the burning status of a chip as claimed in claim 9, wherein after determining whether the detection level is a positive level, the method further comprises:
when the detection level is negative, judging that the burning state of the burning module is burning failure;
and when the burning state of the burning module is burning failure, judging that the burning result of the chip is unfinished burning.
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| CN202111351542.XA CN114062813A (en) | 2021-11-15 | 2021-11-15 | Chip burning state detection circuit and method |
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| CN202111351542.XA CN114062813A (en) | 2021-11-15 | 2021-11-15 | Chip burning state detection circuit and method |
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