CN114061663A - High-pressure-resistant dual-redundancy temperature and humidity sensor - Google Patents
High-pressure-resistant dual-redundancy temperature and humidity sensor Download PDFInfo
- Publication number
- CN114061663A CN114061663A CN202111363889.6A CN202111363889A CN114061663A CN 114061663 A CN114061663 A CN 114061663A CN 202111363889 A CN202111363889 A CN 202111363889A CN 114061663 A CN114061663 A CN 114061663A
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- CN
- China
- Prior art keywords
- temperature
- circuit board
- humidity
- humidity sensitive
- filler neck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000945 filler Substances 0.000 claims abstract description 17
- 238000005259 measurement Methods 0.000 claims abstract description 16
- 238000005245 sintering Methods 0.000 claims abstract description 16
- 229920000642 polymer Polymers 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 2
- 230000009977 dual effect Effects 0.000 claims 2
- 230000005611 electricity Effects 0.000 claims 1
- 230000008054 signal transmission Effects 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 230000003750 conditioning effect Effects 0.000 description 2
- 101000860173 Myxococcus xanthus C-factor Proteins 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
Abstract
The invention discloses a high-pressure-resistant dual-redundancy temperature and humidity sensor, which is characterized in that two temperature and humidity sensitive elements are embedded into a shell, so that two-way redundant measurement of temperature and humidity signals can be realized, and the whole sensor can bear a high-pressure environment through structural design. Wherein, the two temperature and humidity sensitive elements are embedded in the filler neck and are adhered and fixed by adhesive. The filler neck is additionally provided with an opening, and moisture at the front end is prevented from entering the rear end through a polymer plug, so that the pressure at two sides of the moisture sensitive element is balanced. The rear end is welded with the filler neck through a sintering terminal, the electric signal is transmitted to the rear end circuit through a sintering terminal lead, and the medium pressure is isolated at the front end by the sintering terminal.
Description
Technical Field
The invention belongs to the sensing technology, and particularly relates to a high-pressure-resistant dual-redundancy temperature and humidity sensor.
Background
At present, temperature and humidity sensor generally is used for temperature and humidity measurement under the atmospheric environment to, the temperature and humidity sensor that uses at present only has signal all the way, and this has certain limitation to some occasions that the temperature and humidity control requires highly, and in order to satisfy the occasion that the humidity control requires highly, the traditional approach is that two humidity sensor and two temperature sensor of installation reach redundant effect, in order to realize the measurement of humiture. However, because the two humidity sensors and the temperature sensor are installed at different positions, measurement deviation may occur, and in addition, for the measurement of the humidity in the closed tank body, the traditional temperature and humidity sensor cannot meet the sealing requirement, which also causes large deviation. Therefore, based on the above, it is necessary to provide a new temperature and humidity sensor, which has a structural design, can implement dual-path redundant measurement of temperature and humidity signals, and enables the sensor to bear a high-voltage environment as a whole, and has the characteristics of small measurement error and the like.
Disclosure of Invention
The invention aims to provide a high-pressure-resistant dual-redundancy temperature and humidity sensor which has the characteristics of small measurement error, high pressure resistance, small size and low cost.
The technical solution for realizing the invention is as follows: a high-pressure-resistant dual-redundancy temperature and humidity sensor comprises a filler neck, a polymer plug, a sintering terminal, a first circuit board, a second circuit board, a shell, an electric connector and two temperature and humidity sensitive elements, wherein an end cover is not arranged on the front end face of the shell, the front end face of the shell is fixedly connected with the outer wall of the rear end of the filler neck, and an introduction cavity is formed between the front end face of the shell and the outer wall of the rear end of the filler neck; the water filling pipe comprises a pipe connecting nozzle, a water filling pipe and a water filling pipe, wherein three-step through holes with gradually increased diameters are formed in the central axis of the pipe connecting nozzle from front to back in sequence, namely a first-step hole, a second-step hole and a third-step hole are formed in sequence; two temperature and humidity sensitive elements are communicated with the introduction cavity, the sintering terminal, the first circuit board and the second circuit board are sequentially arranged in the introduction cavity from front to back, one temperature and humidity sensitive element is connected with the first circuit board through the sintering terminal, the other temperature and humidity sensitive element is connected with the second circuit board through the sintering terminal to realize double-circuit redundancy measurement of temperature and humidity signals to be measured, the electric connector is fixed on the outer wall of the bottom surface of the shell and is respectively electrically connected with the first circuit board and the second circuit board, and voltage signals on the circuit boards are transmitted out.
Compared with the prior art, the invention has the remarkable advantages that: the two temperature and humidity sensitive elements are embedded into the shell, so that double-path redundant measurement of temperature and humidity signals can be realized, mutual interference is avoided, the product failure rate is reduced, and the whole sensor can bear a high-pressure environment through structural design. And has the characteristics of small measurement error, high pressure resistance, small volume and low cost.
Drawings
Fig. 1 is a cross-sectional view of the whole structure of the high-pressure-resistant dual-redundancy temperature and humidity sensor of the present invention.
FIG. 2 is a side view of the filler neck of the present invention.
Detailed Description
The present invention is described in further detail below with reference to the attached drawing figures.
With reference to fig. 1 and 2, the high-pressure-resistant dual-redundancy temperature and humidity sensor comprises a filler neck 1, a polymer plug 5, a sintering terminal 7, a first circuit board 8, a second circuit board 9, a support 10, a shell 11, an electric connector 12 and two temperature and humidity sensitive elements 4, wherein an end cover is not arranged on the front end face of the shell 11, the front end face of the shell 11 is fixedly connected with the outer wall of the rear end of the filler neck 1, and a lead-in cavity is formed between the two. The filler neck 1 is a revolving body, a third-order through hole with gradually increased diameter is formed from front to back along the central axis of the filler neck, and is sequentially a first-order hole, a second-order hole and a third-order hole, a molecular plug mounting hole, a first mounting groove 2 and a second mounting groove 3 are arranged at the bottom of the third-order hole in the direction of the second-order hole, the first mounting groove 2 and the second mounting groove 3 are symmetrical about the molecular plug mounting hole, a temperature and humidity sensitive element 4 is respectively arranged in the first mounting groove 2 and the second mounting groove 3, the two temperature and humidity sensitive elements 4 which are symmetrically arranged are used for reducing measurement errors, and a high polymer plug 5 is arranged in the molecular plug mounting hole. The two temperature and humidity sensitive elements 4 are communicated with the introducing cavity, the sintering terminal 7, the first circuit board 8 and the second circuit board 9 are sequentially arranged in the introducing cavity from front to back, and the first circuit board 8 and the second circuit board 9 are fixed with the inner wall of the shell 11 through the support 10. One temperature and humidity sensitive element 4 is connected with the first circuit board 8 through the sintering terminal 7, and the other temperature and humidity sensitive element 4 is connected with the second circuit board 9 through the sintering terminal 7, so that double-path redundant measurement of temperature and humidity signals to be measured is realized, the measurement accuracy is improved, and when one path of the temperature and humidity signals fails, the temperature and humidity of the environment to be measured can be continuously measured on the other path of the temperature and humidity sensitive element, and normal measurement is not influenced. The electric connector 12 is fixed on the outer wall of the bottom surface of the shell 11 and is electrically connected with the first circuit board 8 and the second circuit board 9 respectively to transmit the voltage signals on the circuit boards.
The temperature and humidity sensitive element 4 is used for collecting humidity and temperature signals and converting and outputting I2The C signal is transmitted to the sintered terminal 7 through a wire.
Sintered terminal 7 for receiving temperature and humidity sensitive element I2And C, transmitting the signal to a rear-end circuit board. Furthermore, the sintered terminal 7 is welded with the filler neck 1 to isolate the external pressure, so that the temperature and humidity sensitive element 4 has the characteristic of high pressure resistance.
The polymer plug 5 is made of polymer materials, can prevent water and ventilate, plays a role in moisture insulation, and enables the pressure of the two paths of temperature and humidity sensitive elements to be balanced.
The temperature and humidity sensitive element 4 is fixed on the filler pipe nozzle 1 through the adhesive 6, so that the operation is convenient and the cost is low.
A first circuit board 8 for connecting the first temperature and humidity sensitive element I2And C, conditioning the signal, converting the signal into a voltage signal and outputting the voltage signal.
A second circuit board 9 for connecting the first temperature-humidity sensitive element2And C, conditioning the signal, converting the signal into a voltage signal and outputting the voltage signal.
The housing 11 serves to protect the temperature and humidity sensitive elements and the circuit board.
Claims (3)
1. The utility model provides a high pressure resistant dual-redundancy temperature and humidity sensor which characterized in that: the temperature and humidity sensor comprises a filler neck (1), a polymer plug (5), a sintering terminal (7), a first circuit board (8), a second circuit board (9), a shell (11), an electric connector (12) and two temperature and humidity sensitive elements (4), wherein the front end surface of the shell (11) is not provided with an end cover, the front end surface of the shell (11) is fixedly connected with the outer wall of the rear end of the filler neck (1), and a lead-in cavity is formed between the front end surface of the shell (11) and the outer wall of the rear end of the filler neck (1); the water pipe comprises a pipe connecting nozzle (1), and is characterized in that a third-order through hole with gradually increased diameter is formed from front to back along the central axis of the pipe connecting nozzle (1), and is sequentially a first-order hole, a second-order hole and a third-order hole, a molecular plug mounting hole, a first mounting groove (2) and a second mounting groove (3) are formed in the bottom of the third-order hole in the direction of the second-order hole, the first mounting groove (2) and the second mounting groove (3) are symmetrical about the molecular plug mounting hole, a temperature and humidity sensitive element (4) is respectively arranged in the first mounting groove (2) and the second mounting groove (3), and a polymer plug (5) is arranged in the molecular plug mounting hole; two temperature and humidity sensitive elements (4) all communicate with the introduction chamber, sintering terminal (7), first circuit board (8), second circuit board (9) set gradually in introducing the intracavity from preceding backward, a temperature and humidity sensitive element (4) with link to each other with first circuit board (8) through sintering terminal (7), another temperature and humidity sensitive element (4) link to each other with second circuit board (9) through sintering terminal (7), in order to realize the redundant measurement of double-circuit to the humiture signal that awaits measuring, electric connector (12) are fixed at casing (11) bottom surface outer wall, and be connected with first circuit board (8) and second circuit board (9) electricity respectively, the voltage signal transmission on with the circuit board goes out.
2. The high pressure resistant dual redundancy temperature and humidity sensor of claim 1, characterized in that: the sintering terminal (7) is fixedly connected with the filler neck (1) and has the function of isolating external pressure, so that the temperature and humidity sensitive element (4) has the characteristic of high pressure resistance.
3. The high pressure resistant dual redundancy temperature and humidity sensor of claim 1, characterized in that: the polymer plug (5) can be waterproof and breathable, plays a role in moisture insulation, and enables the pressure of the two paths of temperature and humidity sensitive elements to be balanced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111363889.6A CN114061663A (en) | 2021-11-17 | 2021-11-17 | High-pressure-resistant dual-redundancy temperature and humidity sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111363889.6A CN114061663A (en) | 2021-11-17 | 2021-11-17 | High-pressure-resistant dual-redundancy temperature and humidity sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114061663A true CN114061663A (en) | 2022-02-18 |
Family
ID=80277821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111363889.6A Pending CN114061663A (en) | 2021-11-17 | 2021-11-17 | High-pressure-resistant dual-redundancy temperature and humidity sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114061663A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1088682A (en) * | 1993-01-22 | 1994-06-29 | 上海科技专科学校 | The warm and humid photosensitive elements of a kind of novel polymeric membrane |
| CN203758949U (en) * | 2014-03-25 | 2014-08-06 | 南京霍普斯科技有限公司 | Dual-sensor humidity alarm |
| WO2015004933A1 (en) * | 2013-07-10 | 2015-01-15 | 日立オートモティブシステムズ株式会社 | Temperature/humidity measurement device |
| CN109059981A (en) * | 2018-10-24 | 2018-12-21 | 北京机械设备研究所 | A kind of temperature, pressure and humidity detection sensor |
| CN111198048A (en) * | 2020-02-18 | 2020-05-26 | 珠海任驰光电科技有限公司 | Humidity FBG probe, temperature and humidity FBG probe and measurement system |
| CN111537568A (en) * | 2020-05-09 | 2020-08-14 | 南京高华科技股份有限公司 | High-pressure-resistant double-path humidity sensor based on sintering packaging technology |
-
2021
- 2021-11-17 CN CN202111363889.6A patent/CN114061663A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1088682A (en) * | 1993-01-22 | 1994-06-29 | 上海科技专科学校 | The warm and humid photosensitive elements of a kind of novel polymeric membrane |
| WO2015004933A1 (en) * | 2013-07-10 | 2015-01-15 | 日立オートモティブシステムズ株式会社 | Temperature/humidity measurement device |
| CN203758949U (en) * | 2014-03-25 | 2014-08-06 | 南京霍普斯科技有限公司 | Dual-sensor humidity alarm |
| CN109059981A (en) * | 2018-10-24 | 2018-12-21 | 北京机械设备研究所 | A kind of temperature, pressure and humidity detection sensor |
| CN111198048A (en) * | 2020-02-18 | 2020-05-26 | 珠海任驰光电科技有限公司 | Humidity FBG probe, temperature and humidity FBG probe and measurement system |
| CN111537568A (en) * | 2020-05-09 | 2020-08-14 | 南京高华科技股份有限公司 | High-pressure-resistant double-path humidity sensor based on sintering packaging technology |
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