CN114047652B

CN114047652B - Display substrate, display panel, manufacturing method and display device

Info

Publication number: CN114047652B
Application number: CN202111349563.8A
Authority: CN
Inventors: 张孝斌; 连伟琼; 康建松; 蔡宗翰
Original assignee: Xiamen Tianma Microelectronics Co Ltd
Current assignee: Xiamen Tianma Microelectronics Co Ltd
Priority date: 2021-11-15
Filing date: 2021-11-15
Publication date: 2023-09-15
Anticipated expiration: 2041-11-15
Also published as: CN114047652A

Abstract

The invention discloses a display substrate, a display panel, a manufacturing method and a display device, and relates to the technical field of display, wherein the display substrate comprises sub-substrates which are arranged in an array way, the sub-substrates comprise a first sub-substrate and a second sub-substrate which are oppositely arranged, and in an edge area, the first sub-substrate comprises a first conductive part and a second conductive part, and the second conductive part is positioned at one side of the first conductive part far away from the first substrate; the second conductive part comprises a first end and a second end which are arranged along the first direction, the first end is positioned at one side of the second end close to the binding area, the first end of the second conductive part is electrically connected with the first conductive part through a conductive hole, and the second end is connected with the same short-circuit rod; the first conductive part is disconnected at one side far away from the binding area; in the edge region, the second sub-substrate includes a bump structure on a side of the second substrate facing the first sub-substrate, and the second conductive portion overlaps the bump structure in a direction perpendicular to the first substrate. Thus, the antistatic performance of the display panel and the display device is improved.

Description

Display substrate, display panel, manufacturing method and display device

Technical Field

The invention relates to the technical field of display, in particular to a display substrate, a display panel, a manufacturing method and a display device.

Background

The liquid crystal display panel generally includes an array substrate, a color film substrate, and a liquid crystal layer disposed between the array substrate and the color film substrate. The array substrate is provided with a plurality of scanning lines, a plurality of data lines, a plurality of pixel electrodes, a plurality of array distributed thin film transistors and other various electronic components. In order to ensure that the electrical connection relation of various electronic components on the array substrate is correct, the industry generally sets a shorting bar on the array substrate in the process of manufacturing the array substrate, and the shorting bar is electrically connected with a signal wire in the array substrate, so as to reduce the influence of static electricity on the signal wire and prevent static electricity from being knocked.

When the short-circuit rod is cut off, the lead which is originally connected with the short-circuit rod is exposed at the cutting section, static electricity is very easy to introduce, and small static electricity is likely to remain in the array substrate, so that the phenomenon of bad square lattice or device damage is formed, and the antistatic performance of the product is reduced to a great extent.

Disclosure of Invention

In view of the above, the present application provides a display substrate, a display panel, a manufacturing method thereof, and a display device, which aim to improve antistatic performance of a product.

In a first aspect, the present application provides a display substrate, including a plurality of sub-substrates arranged in an array, where the sub-substrate includes a display area and a peripheral area surrounding the display area, the peripheral area includes a binding area and an edge area located on the same side of the display area, and the binding area is located between the edge area and the display area;

The sub-substrate comprises a first sub-substrate and a second sub-substrate which are oppositely arranged, the first sub-substrate comprises a first substrate, and the second sub-substrate comprises a second substrate;

in the edge region, the first sub-substrate includes a plurality of first conductive portions and a plurality of second conductive portions extending in a first direction and arranged in a second direction, the first conductive portions being electrically connected to signal lines of the display region, the first direction being an arrangement direction of the bonding region and the edge region, the second direction intersecting the first direction; the first conductive part and the second conductive part are positioned at one side of the first substrate facing the second sub-substrate and positioned at different film layers, and the second conductive part is positioned at one side of the first conductive part far away from the first substrate; the second conductive part comprises a first end and a second end which are arranged along the first direction, and the first end is positioned at one side of the second end close to the binding area; the first end of the second conductive part is electrically connected with the first conductive part through a conductive hole, and the second end of the second conductive part is connected with the same short-circuit rod; the first conductive part is disconnected at one side far away from the binding area;

In the edge region, the second sub-substrate includes a bump structure, the bump structure is located on a side of the second substrate facing the first sub-substrate, and the second conductive portion overlaps the bump structure in a direction perpendicular to the first substrate.

In a second aspect, the present application provides a display panel, including the display area, a binding area, and an edge area, where the edge area is located at a side of the binding area away from the display area;

the display panel comprises a first substrate and a second substrate which are oppositely arranged, wherein the first substrate comprises a first substrate, the second substrate comprises a second substrate, and the second substrate is not overlapped with the binding area and the edge area along the direction perpendicular to the first substrate;

the first substrate comprises a plurality of first conductive parts and a plurality of second conductive parts, the first conductive parts extend along a first direction and are arranged along a second direction, the first conductive parts are electrically connected with signal lines of the display area, the first conductive parts are disconnected at one side far away from the binding area, the first direction is the arrangement direction of the binding area and the edge area, and the second direction is intersected with the first direction;

The first conductive part and the second conductive part are positioned on one side of the first substrate facing the second substrate and positioned on different film layers, and the second conductive part is positioned on one side of the first conductive part away from the first substrate;

the same second conductive part comprises at least two second sub-parts, in the same second conductive part, the second sub-parts extend along the first direction and are arranged along the first direction, the two adjacent second sub-parts are disconnected, and the second sub-parts adjacent to the binding area are electrically connected with the first conductive part through conductive holes.

In a third aspect, the present application provides a display device including the display panel provided by the present application.

In a fourth aspect, the present application provides a method for manufacturing a display panel, including:

providing the display substrate, wherein the second sub-substrate comprises a first cutting line and a second cutting line, the first sub-substrate comprises a third cutting line, the first cutting line is positioned between the display area and the binding area, the second cutting line is positioned at one side of the edge area away from the binding area, and the third cutting line is positioned between the disconnection position of the first conductive part and the short-circuit bar;

Cutting the second sub-substrate in the display substrate along the first cutting line and the second cutting line, and cutting the first sub-substrate in the display substrate along the third cutting line;

and splitting the second sub-substrate at the position of the second cutting line, or splitting the first sub-substrate at the position of the third cutting line, so that the protruding structure overlaps the second conductive part and presses and breaks the second conductive part.

Compared with the prior art, the display substrate, the display panel, the manufacturing method and the display device provided by the invention have the advantages that at least the following beneficial effects are realized:

in the display substrate provided by the invention, in the edge area, the first sub-substrate comprises a first conductive part and a second conductive part which are arranged in different layers, and the first conductive part is electrically connected with a signal line of the display area. The first end of the second conductive part is electrically connected with the first conductive part through the conductive hole, and the second end of the second conductive part is connected with the same short-circuit rod, so that the short-circuit rod is electrically connected with the first conductive part, and further the signal wires of the display area can be connected together through the short-circuit rod in a short-circuit way, and when a test signal is input on the short-circuit rod, the quality of a picture displayed by the display area can be detected. The display panel is obtained by cutting and splitting the display substrate, the second sub-substrate comprises a convex structure in the edge area, the second conductive part is overlapped with the convex structure along the direction perpendicular to the first substrate, and in the splitting process, the convex structure can apply pressure to the second conductive part to press the second conductive part to break, so that the connection path between the second conductive part and the outside is cut off; in addition, the first conductive part is disconnected at one side far away from the binding area, and the connection path between the first conductive part and the outside is also blocked. Therefore, after the display panel is formed through the display substrate, external static electricity can not enter the display panel through the first conductive part and the second conductive part, and accordingly the antistatic performance of the display panel and the display device is effectively improved.

Of course, it is not necessary for any one product embodying the invention to achieve all of the technical effects described above at the same time.

Other features of the present invention and its advantages will become apparent from the following detailed description of exemplary embodiments of the invention, which proceeds with reference to the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.

FIG. 1 is a top view of a display substrate according to the related art;

FIG. 2 is a top view of the display substrate of FIG. 1 after being cut;

FIG. 3 is a top view of a display substrate according to an embodiment of the present invention;

FIG. 4 is a top view of a single submount of the display substrate of FIG. 3;

FIG. 5 is a cross-sectional view of an AA of the sub-substrate of FIG. 4;

FIG. 6 is a schematic diagram showing an arrangement of a first conductive portion and a second conductive portion on a first sub-substrate;

FIG. 7 is a schematic diagram showing a structure of the first conductive portion and the second conductive portion after dicing the sub-substrate;

FIG. 8 is another cross-sectional view of the sub-substrate AA of FIG. 4;

FIG. 9 is another cross-sectional view of the sub-substrate AA of FIG. 4;

FIG. 10 is a diagram showing a structure of a film layer of a display area of a submount according to an embodiment of the present invention;

FIG. 11 is another cross-sectional view of the sub-substrate AA of FIG. 4;

FIG. 12 is a top view of a display panel according to an embodiment of the present invention;

FIG. 13 is a top view of the first conductive portion and the second conductive portion of the edge region of FIG. 12;

FIG. 14 is a BB cross-sectional view of the display panel provided in the embodiment of FIG. 12;

fig. 15 is a schematic structural diagram of a display device according to an embodiment of the present invention;

fig. 16 is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of the invention;

FIG. 17 is a top view of a display substrate according to an embodiment of the present invention;

FIG. 18 is a schematic cross-sectional view showing a first cut line, a second cut line, and a third cut line on a display substrate;

FIG. 19 is a schematic view showing a structure of the second sub-substrate after splitting according to the embodiment of the invention;

FIG. 20 is a schematic view showing a structure after separating the shorting bar from the display substrate;

FIG. 21 is a schematic view of a process for fabricating a first sub-substrate in a display substrate;

FIG. 22 is a schematic diagram of another process for fabricating a first sub-substrate in a display substrate;

FIG. 23 is a schematic view of another process for fabricating a first sub-substrate in a display substrate;

FIG. 24 is a schematic view of another process for fabricating a first sub-substrate in a display substrate;

fig. 25 is a schematic diagram of another process for fabricating a first sub-substrate in a display substrate.

Detailed Description

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless it is specifically stated otherwise.

The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses.

Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but are intended to be part of the specification where appropriate.

In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of exemplary embodiments may have different values.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.

Fig. 1 is a top view of a display substrate 100 'in the related art, and fig. 2 is a top view of the display substrate in fig. 1 after being cut, in the related art, a shorting bar 30' is disposed on an array substrate in the display substrate, the shorting bar 30 'is electrically connected to a signal line L in the array substrate, and the array substrate can be detected by using the shorting bar 30'. After the detection is finished, the short-circuit bar 30' is cut along the cutting line in fig. 1 to form the structure shown in fig. 2, at this time, the lead L originally connected with the short-circuit bar is exposed, static electricity is very easy to be introduced, small static electricity is likely to remain in the array substrate, and the phenomenon of defective square or device impact is formed, so that the antistatic performance of the product is reduced to a great extent.

Therefore, the invention provides a display substrate, a display panel, a manufacturing method of the display substrate and the display panel, and a display device, and aims to improve antistatic performance of a product.

Fig. 3 is a top view of a display substrate provided BY an embodiment of the present invention, fig. 4 is a top view of a single sub-substrate in the display substrate in fig. 3, fig. 5 is a cross-sectional view AA of the sub-substrate in fig. 4, please refer to fig. 3 to 5, and an embodiment of the present invention provides a display substrate 100, which includes a plurality of sub-substrates 10 arranged in an array, wherein the sub-substrates 10 include a display area Q1 and a peripheral area Q2 surrounding the display area Q1, the peripheral area Q2 includes a binding area BD and an edge area BY located on the same side of the display area Q1, and the binding area BD is located between the edge area BY and the display area Q1;

The sub-substrate 10 includes a first sub-substrate 11 and a second sub-substrate 12 disposed opposite to each other, the first sub-substrate 11 including a first substrate 00, the second sub-substrate 12 including a second substrate 02;

in the edge region BY, the first sub-substrate 11 includes a plurality of first conductive parts 21 and a plurality of second conductive parts 22 extending in a first direction and arranged in a second direction, the first conductive parts 21 being electrically connected to the signal lines of the display region Q1, the first direction being an arrangement direction of the bonding region BD and the edge region BY, the second direction intersecting the first direction; optionally, the first direction and the second direction are perpendicular; the first conductive part 21 and the second conductive part 22 are positioned on one side of the first substrate 00 facing the second sub-substrate 12 and positioned on different film layers, and the second conductive part 22 is positioned on one side of the first conductive part 21 away from the first substrate 00; the second conductive part 22 includes a first end D1 and a second end D2 arranged along the first direction, the first end D1 being located at a side of the second end D2 near the binding area BD; the first end D1 of the second conductive part 22 is electrically connected with the first conductive part 21 through the conductive hole K1, and the second end D2 of the second conductive part 22 is connected with the same shorting bar 30; the first conductive part 21 is disconnected at a side away from the bonding area BD;

in the edge region BY, the second sub-substrate 12 includes a bump structure 40, the bump structure 40 is located on a side of the second substrate 02 facing the first sub-substrate 11, and the second conductive part 22 overlaps the bump structure 40 in a direction perpendicular to the first substrate 00.

Specifically, with continued reference to fig. 3 to 5, the display substrate provided BY the present invention includes a plurality of sub-substrates 10 arranged in an array, a display area Q1 of the sub-substrates 10 is used for performing a display function, a peripheral area is used for setting some peripheral circuits, and the peripheral area includes a binding area BD and an edge area BY located on the same side of the display area Q1, and the edge area BY is located on a side of the binding area BD away from the display area Q1. From the viewpoint of the film structure, the sub-substrate 10 includes a first sub-substrate 11 and a second sub-substrate 12 disposed opposite to each other, and optionally, a liquid crystal (not shown in the drawing) is filled between the first sub-substrate 11 and the second sub-substrate 12 in the display area Q1. Optionally, the first sub-substrate 11 is an array substrate, and the second sub-substrate 12 is a color film substrate.

In the edge area BY, the first sub-substrate 11 includes a plurality of first conductive portions 21 and a plurality of second conductive portions 22, referring to fig. 6, fig. 6 is a schematic layout diagram of the first conductive portions 21 and the second conductive portions 22 on the first sub-substrate 11, and referring to fig. 4 and 5, the first conductive portions 21 are electrically connected to the signal lines in the display area Q1, so as to be capable of transmitting signals to the signal lines in the display area Q1. The first conductive part 21 and the second conductive part 22 are positioned on different film layers, the first conductive part 21 is positioned on one side of the second conductive part 22 close to the first substrate 00, the first end D1 of the second conductive part 22 is electrically connected with the first conductive part 21 through the conductive hole K1, the second ends D2 of the second conductive parts 22 are connected together through the short-circuit rod 30, when static electricity acts, the short-circuit rod 30 can disperse the static electricity to the different second conductive parts 22, and phenomena such as device damage caused by static electricity concentration are avoided. In addition, when a test signal is input to the shorting bar 30, the quality of the screen displayed in the display area Q1 can be detected.

Optionally, with continued reference to fig. 6, an end of the first conductive portion 21 away from the display area is electrically connected through the shorting member 33, so that, when static electricity acts during the manufacturing process of the display substrate, the shorting member 33 can disperse the static electricity to the second conductive portion 22, thereby avoiding the damage to the device caused by the concentrated static electricity, and thus being beneficial to improving the antistatic performance during the manufacturing process of the display substrate. The end of the first conductive portion 21 away from the display area is disconnected, and the short-circuit member 33 is located at the end of the disconnected position away from the display area. Alternatively, the process of disconnecting the end of the first conductive portion away from the display area is not directly disconnected during the process of manufacturing the first conductive portion, but is disconnected in a subsequent process by etching holes, so that the shorting member 33 plays a role in conducting and dispersing static electricity before the first conductive portion is disconnected, that is, after the first conductive portion is manufactured and before the etching holes are formed, the shorting member can conduct static electricity in the process, so as to avoid damage to devices caused by static electricity concentration.

It can be understood that the display substrate and the sub-substrate included in the display substrate provided by the embodiments of the present application are intermediate products for forming the display panel, that is, the display panel can be formed by performing operations such as further processing (e.g. cutting and splitting) on the display substrate and the sub-substrate.

In the submount 10 in the display substrate provided BY the embodiment of the present invention, the bump structure 40 is disposed on the second sub-substrate 12 in the edge area BY, and the bump structure 40 overlaps the second conductive portion 22 along the direction perpendicular to the first substrate 00. When the sub-substrate 10 is broken, a pressure is applied to the second sub-substrate 12, and at this time, the bump structure 40 will apply a pressure to the second conductive portion 22 to break the second conductive portion 22, so that the second conductive portion 22 is disconnected, which is equivalent to cutting off the connection path between the second conductive portion 22 and the outside, referring to fig. 7, fig. 7 is a schematic structural diagram of the first conductive portion 21 and the second conductive portion 22 after the sub-substrate 10 is cut and broken. The first conductive portion 21 is disconnected on the side away from the binding area BD, which corresponds to a connection path between the first conductive portion 21 and the outside. Therefore, when the structure of the display substrate provided by the invention is used for manufacturing the display panel, even if the second conductive part 22 which is originally electrically connected with the shorting bar 30 is disconnected after the shorting bar 30 is cut off, and the side of the first conductive part 21 facing the shorting bar 30 is also disconnected, even if external static electricity is applied to the disconnected first conductive part 21 and second conductive part 22, the static electricity cannot be further conducted to the display area Q1, so that the phenomenon of grid defect or device breakdown caused by the static electricity applied to the second display area Q1 is avoided, and the antistatic performance of the product is effectively improved.

Optionally, with continued reference to fig. 7, along the first direction, the open position of the first conductive portion 21 is located between the conductive hole K1 and the cutting line that cuts the shorting bar 30, so as to ensure that after the shorting bar 30 is cut, the end of the first conductive portion 21 away from the binding area BD remains open, thereby cutting off the path of the electrostatic transmission.

Referring to fig. 8, fig. 8 is a cross-sectional view of another AA of the sub-substrate 10 in fig. 4, in an alternative embodiment of the present invention, in the edge region BY, the first sub-substrate 11 further includes a plurality of support blocks 70, along a direction perpendicular to the first substrate 00, the second conductive portion 22 overlaps at least two support blocks 70, the support blocks 70 and the bump structure 40 do not overlap at least partially, and the bump structure 40 is located between two adjacent support blocks 70 along the first direction. It should be noted that fig. 8 illustrates a scheme in which the same second conductive portion 22 overlaps four supporting blocks 70, and in some other embodiments of the present invention, the number of supporting blocks overlapping the same second conductive portion 22 may also be embodied as other, which is not particularly limited in the present invention.

Specifically, in the embodiment of the present invention, a plurality of support blocks 70 are introduced on the first sub-substrate 11, and the same second conductive portion 22 overlaps at least two support blocks 70, and the bump structure 40 is located between two adjacent support blocks 70 along the first direction, and optionally, the support blocks 70 are located on a side of the second conductive portion 22 facing the first substrate 00. When the sub-substrate 10 is subjected to the splitting operation to apply pressure to the second sub-substrate 12, the bump structure 40 applies pressure to the second conductive portion 22, and since at least two supporting blocks 70 are disposed on one side of the second conductive portion 22, the supporting blocks 70 are matched with the bump structure 40, increasing the shear force applied to the second conductive portion 22, so that the second conductive portion 22 is more beneficial to cutting off the transmission path of static electricity to the display area Q1, and thus the antistatic performance of the product is more beneficial to being improved.

In an alternative embodiment of the present invention, with continued reference to fig. 8, the first sub-substrate 11 further includes a first metal layer M1 and a second metal layer M2 disposed on a side of the first substrate 00 facing the second sub-substrate 12, optionally, the first metal layer M1 and the second metal layer M2 are separated by an insulating layer, and the second metal layer M2 is located on a side of the first metal layer M1 away from the first substrate 00; along the direction perpendicular to the first substrate 00, the first metal layer M1 and the second metal layer M2 are located between the film layer where the first conductive portion 21 is located and the film layer where the second conductive portion 22 is located; the support blocks 70 are located at the first metal layer M1 and/or the second metal layer M2.

Specifically, a plurality of signal lines are generally provided on the first sub-substrate 11, and alternatively, the signal lines may be obtained by etching a metal layer on the first sub-substrate 11. Alternatively, fig. 8 shows a solution comprising two metal layers on the first sub-substrate 11. In the edge region BY, the support block 70 may be formed BY etching the first metal layer M1 and/or the second metal layer M2. In some embodiments of the present invention, only the first metal layer M1 may be reused as the supporting block 70, or only the second metal layer M2 may be reused as the supporting block 70, and when the metal layer is reused as the supporting block 70, the metal layer as the supporting block 70 can apply a larger shearing force to the second conductive portion 22 during the splitting process due to the larger hardness of the metal layer, which is more beneficial to cutting the second conductive portion 22.

In the embodiment shown in fig. 8, the first metal layer M1 and the second metal layer M2 are simultaneously multiplexed as the supporting block 70, at this time, in the same supporting block 70, along the direction perpendicular to the first substrate 00, the first metal layer M1 and the second metal layer M2 overlap, which is equivalent to increasing the height of the supporting block 70, and in the splitting process, when the bump structure 40 presses against the second conductive portion 22, the supporting block 70 formed by the first metal layer M1 and the second metal layer M2 applies an upward shearing force to the second conductive portion 22, the bump structure 40 applies a downward shearing force to the second conductive portion 22, and the shearing forces in both directions are simultaneously applied to the second conductive portion 22, so that the second conductive portion 22 can be rapidly cut off, and the electrostatic transmission path between the second conductive portion 22 and the outside is disconnected. And when the height of the supporting block 70 is increased, it is also advantageous to increase the deformation amount of the second conductive part 22 during the breaking process, thus increasing the success rate of the second conductive part 22 being broken.

It should be noted that, in the embodiment of the present invention, the existing metal layer on the first sub-substrate 11 is reused as the supporting block 70, and the supporting block 70 is not required to be additionally introduced, so that the film structure of the first sub-substrate 11 is not increased while the second conductive portion 22 is rapidly cut off.

Optionally, in addition to multiplexing the metal layer as the supporting block 70, the insulating layer may be multiplexed as the supporting block 70 in the present application, for example, the insulating layer and the metal layer are used together as the supporting block 70, so as to increase the overall height of the supporting block 70, increase the shearing force applied to the second conductive portion 22 during the splitting process, and improve the cutting efficiency of the second conductive portion 22.

Fig. 9 is a cross-sectional view of another AA of the sub-substrate 10 in fig. 4, in which the first sub-substrate 11 further includes a third metal layer M3 disposed between the film layer where the second conductive portion 22 is located and the second metal layer M2, and the support block 70 is further located on the third metal layer M3.

Specifically, the signal lines on the first sub-substrate 11 may be distributed in three different metal layers, where the first sub-substrate 11 includes a third metal layer M3 in addition to the first metal layer M1 and the second metal layer M2, for example, please refer to fig. 9, where the third metal layer M3 of the edge area BY may also be multiplexed as the supporting block 70, that is, the same supporting block 70 is located in the first metal layer M1, the second metal layer M2 and the third metal layer M3, respectively, and the first metal layer M1, the second metal layer M2 and the third metal layer M3 in the same supporting block 70 overlap along the direction perpendicular to the first substrate 00. When the first metal layer M1, the second metal layer M2 and the third metal layer M3 are multiplexed at the same time as the supporting block 70, the height of the supporting block 70 is increased, so that the deformation amount of the second conductive part 22 formed by being pressed during the breaking process is advantageously increased, and in addition, the shearing force applied to the second conductive part 22 during the breaking process is greater due to the greater hardness of the metal layers, so that the success rate of the second conductive part 22 being broken is further increased without increasing the film layer of the first sub-substrate 11.

Referring to fig. 9 and fig. 10 in combination, fig. 10 is a film structure diagram of a display area Q1 in a submount 10 according to an embodiment of the present invention, in an alternative embodiment of the present invention, a first sub-substrate 11 includes a first transparent conductive layer 91 and a semiconductor layer P0, and a material of a second conductive portion 22 and the first transparent conductive layer 91 are the same and are disposed in the same layer; the material of the first conductive portion 21 is the same as that of the semiconductor layer P0, and is provided in the same layer.

Referring to fig. 10, in the display region, the submount 10 includes an array layer including a thin film transistor T including a semiconductor layer P0 and an electrode layer 60 including a first transparent conductive layer 91. In the embodiment of the invention, the first conductive part 21 multiplexes the semiconductor layer P0, and the second conductive part 22 multiplexes the first transparent conductive layer 91, that is, multiplexes the existing film structure in the sub-substrate 10, so that it is not necessary to add a new film structure in addition to the realization of the image detection, thereby being beneficial to simplifying the manufacturing process of the display substrate and improving the production efficiency of the display substrate. Alternatively, the material of the first transparent conductive layer 91 is, for example, indium tin oxide, which has a smaller hardness and is easily broken during the breaking process to block the electrostatic transmission channel between the second conductive portion and the outside.

With continued reference to fig. 5, 6 and 8, in an alternative embodiment of the present invention, the first sub-substrate 11 includes at least one insulating layer J between the first conductive portion 21 and the second conductive portion 22, the first sub-substrate 11 includes an etching hole K2, and the etching hole K2 penetrates the first conductive portion 21 and the insulating layer J between the first conductive portion 21 and the second conductive portion 22 in a direction perpendicular to the first substrate 00, and breaks the first conductive portion 21.

The embodiment shown in fig. 5, 6 and 8 shows a scheme in which one end of the first conductive part 21 away from the bonding area BD is disconnected, specifically, the first sub-substrate 11 is provided with an etching hole K2, and the etching hole K2 penetrates the first conductive part 21 and the insulating layer between the first conductive part 21 and the second conductive part 22, so as to disconnect the first conductive part 21. Considering that the first end of the second conductive part 22 is electrically connected with the first conductive part 21 through the conductive hole K1, in the process of etching to form the conductive hole K1, a part of etching hole K2 can be formed at the position of etching hole K2 at the same time, and then the first conductive part 21 corresponding to the position of etching hole K2 is etched away, so that the first conductive part 21 is disconnected, and the process of multiplexing the existing process is beneficial to simplifying the production process of the sub-substrate 10, and simultaneously, the electrostatic transmission path between the first conductive part 21 and the outside can be cut off, so that the antistatic performance of the product is beneficial to being improved.

Referring to fig. 6, in an alternative embodiment of the present invention, the etched hole K2 and the second conductive portion 22 do not overlap in a direction perpendicular to the first substrate 00. Since the etching hole K2 is located in the first conductive portion 21, when the etching hole K2 and the second conductive portion 22 do not overlap, it is advantageous to avoid that the second conductive portion 22 contacts the first conductive portion 21 through the etching hole K2 and forms an electrical connection at an end far from the bonding area BD during the formation of the second conductive portion 22.

Alternatively, with continued reference to fig. 6, the first conductive portions 21 and the second conductive portions 22 are alternately arranged in the second direction, and the first conductive portions 21 and the second conductive portions 22 do not overlap in the direction perpendicular to the first substrate 00. Since the first end D1 of the second conductive part 22 needs to be electrically connected to the second conductive part 22, a corner connection part integrally formed with the second conductive part 22 may be introduced at the first end D1 of the second conductive part 22, and the second conductive part 22 is electrically connected to the first conductive part 21 through the corner connection part and the conductive hole K1.

Fig. 11 is a cross-sectional view of another AA of the sub-substrate 10 of fig. 4, in which a first conductive layer 71 is deposited on the inner wall of the conductive hole K1, and the material of the first conductive layer 71 is different from that of the first conductive portion 21.

Specifically, when the insulating layer between the first conductive portion 21 and the second conductive portion 22 is etched to form a through hole to achieve electrical connection between the first end of the second conductive portion 22 and the first conductive portion 21, a through hole is also formed at a position where the first conductive portion 21 is disconnected, exposing a position where the first conductive portion 21 needs to be disconnected. Then, the first conductive part 21 is etched at the position where the first conductive part 21 needs to be disconnected, and the first conductive part 21 corresponding to the position of the through hole is etched. The first conductive layer 71 is deposited on the inner wall of the conductive hole K1 connecting the first conductive part 21 and the second conductive part 22, and the material of the first conductive layer 71 is different from that of the first conductive part 21, so that the first conductive part 21 at the bottom of the conductive hole K1 is prevented from being etched in the process of etching the first conductive part 21 at the corresponding position of the etched hole K2, and the reliability of electric connection between the first conductive part 21 and the second conductive part 22 is ensured.

In an alternative embodiment of the present invention, referring to fig. 10 and 11, the first sub-substrate 11 includes the second transparent conductive layer 92, and the material of the first conductive layer 71 and the second transparent conductive layer 92 are the same and formed in the same process step.

For the liquid crystal display panel, referring to fig. 10, the array substrate generally includes a first electrode layer 61 and a second electrode layer 62 disposed opposite to each other, and the electrodes on the first electrode layer 61 and the second electrode layer 62 may be, for example, a common electrode and a pixel electrode, where the common electrode receives a common voltage signal, the pixel electrode receives a pixel voltage signal, and a voltage difference formed between the common electrode and the pixel electrode is used as a driving voltage to drive the liquid crystal to deflect, so as to further realize a display function. The second transparent conductive layer 92 provided in the embodiment of the present invention may be embodied as a layer closer to the first substrate 00 of the first electrode layer 61 and the second electrode layer 62, the first transparent conductive layer 91 may be embodied as a layer farther from the first substrate 00 of the first electrode layer 61 and the second electrode layer 62, for example, when the first electrode layer 61 is located between the second electrode layer 62 and the first substrate 00, the second conductive portion 22 in the present invention may reuse the second electrode layer 62, and the first conductive layer 71 deposited on the inner wall of the conductive hole K1 may reuse the first electrode layer 61, i.e., the second transparent conductive layer 92. In this way, the first conductive layer 71 is formed in the conductive hole K1 during the process of forming the first electrode layer 61, and no new process flow is required to be introduced, so that the first conductive portion 21 at the corresponding position of the conductive hole K1 is not etched during the etching process of the first conductive portion 21, the manufacturing flow of the display substrate is not increased, and the production efficiency of the display substrate after the first conductive layer 71 is introduced is improved.

Alternatively, the first transparent conductive layer 91 and the second transparent conductive layer 92 provided in the embodiment of the present application may each be embodied as a transparent material such as indium tin oxide.

In an alternative embodiment of the present application, referring to fig. 3 and 4, in the submount provided in the embodiment of the present application, in the display area Q1, the second sub-substrate 12 includes spacer pillars (not shown), and the material of the bump structure 40 and the spacer pillars are the same material and are formed in the same process step.

Optionally, in the display area Q1, a liquid crystal is filled between the first sub-substrate 11 and the second sub-substrate 12, and a spacer is disposed on a side of the second sub-substrate 12 facing the first sub-substrate 11, for supporting a space between the first sub-substrate 11 and the second sub-substrate 12 to avoid deformation due to compression. In the present application, the bump structure 40 provided at the edge region BY of the second sub-substrate 12 may be made of the same material as the spacer in the display region Q1 and in the same process step. In this way, it is unnecessary to introduce a new material and a new process flow for the bump structure 40 of the edge region BY, thereby facilitating the simplification of the manufacturing process of the display substrate.

Based on the same inventive concept, the present application further provides a display panel, fig. 12 is a top view of the display panel provided BY the embodiment of the present application, fig. 13 is a top view of the first conductive portion 21 and the second conductive portion 22 in the edge area BY of fig. 12, fig. 14 is a BB cross-sectional view of the display panel provided BY the embodiment of fig. 12, where the display panel includes a display area Q1, a binding area BD, and an edge area BY, and the edge area BY is located on a side of the binding area BD away from the display area Q1;

The display panel 200 includes a first substrate 201 and a second substrate 202 disposed opposite to each other, the first substrate 201 including a first substrate 00, the second substrate 202 including a second substrate 02, the second substrate 202 not overlapping the bonding area BD and the edge area BY in a direction perpendicular to the first substrate 00;

in the edge region BY, the first substrate 201 includes a plurality of first conductive parts 21 and a plurality of second conductive parts 22 extending in a first direction and arranged in a second direction, the first conductive parts 21 being electrically connected to the signal lines of the display region Q1 and the first conductive parts 21 being disconnected at a side away from the bonding region BD, wherein the first direction is an arrangement direction of the bonding region BD and the edge region BY, and the second direction intersects the first direction;

the first conductive part 21 and the second conductive part 22 are positioned on one side of the first substrate 00 facing the second substrate 202 and positioned on different film layers, and the second conductive part 22 is positioned on one side of the first conductive part 21 away from the first substrate 00;

the same second conductive part 22 includes at least two second sub-parts 221, and in the same second conductive part 22, the second sub-parts 221 extend along the first direction and are arranged along the first direction, two adjacent second sub-parts 221 are disconnected, and the second sub-part 221 adjacent to the bonding area BD is electrically connected to the first conductive part 21 through the conductive hole K1.

It should be noted that the embodiments shown in fig. 12 to 14 only illustrate a part of the first conductive portion 21 and a part of the second conductive portion 22 on the display panel, and do not represent the actual number, size and shape of the first conductive portion 21 and the second conductive portion 22.

The display panel provided in this embodiment includes a first substrate 201 and a second substrate 202 that are disposed opposite to each other, optionally, the first substrate 201 is an array substrate, the second substrate 202 is a color film substrate, liquid crystal is filled between the first substrate 201 and the second substrate 202, the size of the second substrate 202 is smaller than that of the first substrate 201, and a binding area BD and an edge area BY are disposed in a region of the first substrate 201 that does not overlap with the second substrate 202.

In the edge region BY of the display panel, a first conductive portion 21 and a second conductive portion 22 are provided, wherein the first conductive portion 21 is electrically connected to the signal line of the display region Q1, and the first conductive portion 21 is disconnected on a side away from the bonding region BD, thus, equivalently cutting off the transmission path of the first conductive portion 21 and the external static electricity. The same second conductive part 22 includes at least two second sub-parts 221 extending in the first direction and arranged in the first direction, wherein the second sub-parts 221 adjacent to the bonding region BD are electrically connected to the first conductive part 21 through the conductive holes K1; in the same second conductive portion 22, two adjacent second sub-portions 221 are disconnected, i.e. no electrical connection occurs between two adjacent sub-portions; when external static electricity is applied to the second sub-portion 221 closest to the edge of the display panel, the second sub-portion 221 is insulated from the second sub-portion 221 adjacent to the second sub-portion 221, and the static electricity cannot be further transmitted to the inside of the display panel, so that the static electricity cannot influence the display of the display panel and devices in the display panel, and the antistatic performance of the display panel is effectively improved.

In an alternative embodiment of the present invention, the first substrate 201 further includes a plurality of support blocks 70 at the edge region BY, and the disconnection point of the adjacent two second sub-portions 221 is located between the adjacent two support blocks 70 in the direction perpendicular to the first substrate 00.

Specifically, the edge region BY of the first substrate 201 includes a plurality of support blocks 70, and the positions of the disconnection points of the adjacent two second sub-portions 221 are located between the adjacent two support blocks 70. The display panel of the present invention is obtained by cutting and splitting a display substrate, in which, referring to fig. 5 and 8, the dimensions of the first sub-substrate 11 and the second sub-substrate 12 are the same, and the projections thereof are coincident. In the process of breaking, the part of the second sub-substrate 12 near the edge area BY is removed from the display substrate, and before removing the part of the second sub-substrate 12, a bump structure 40 is disposed on the side of the edge area BY, facing the first sub-substrate 11, of the second sub-substrate 12, and in the process of breaking, the bump structure 40 and the supporting block 70 apply a shearing force to the second conductive portion 22 to break the second conductive portion 22, so as to form at least two second sub-portions 221. At this time, the disconnection point of the adjacent two second sub-portions 221 is located between the adjacent two support blocks 70. In this way, the success rate of the second conductive portion 22 being cut off is advantageously increased, and thus the antistatic performance of the display panel is advantageously improved.

Optionally, with continued reference to fig. 14, the first substrate 201 includes a first metal layer M1 and a second metal layer M2 disposed on a side of the first substrate 00 facing the second substrate 202, the first metal layer M1 and the second metal layer M2 being separated by an insulating layer, the second metal layer M2 being located on a side of the first metal layer M1 facing away from the first substrate 00; along the direction perpendicular to the first substrate 00, the first metal layer M1 and the second metal layer M2 are located between the film layer where the first conductive portion 21 is located and the film layer where the second conductive portion 22 is located; the support blocks 70 are located at the first metal layer M1 and/or the second metal layer M2. The first substrate 201 is typically provided with a plurality of signal lines, alternatively, the signal lines may be obtained by etching a metal layer on the first substrate 201. In the edge region BY, the support block 70 may be formed BY etching the first metal layer M1 and/or the second metal layer M2. In some embodiments of the present invention, only the first metal layer M1 may be reused as the supporting block 70, or only the second metal layer M2 may be reused as the supporting block 70, and when the metal layer is reused as the supporting block 70, the metal layer as the supporting block 70 can apply a larger shearing force to the second conductive portion 22 during the splitting process due to the larger hardness of the metal layer, which is more beneficial to cutting the second conductive portion 22.

In some other embodiments of the present invention, the first substrate 201 further includes a third metal layer M3, the third metal layer M3 is located between the film layer where the second conductive portion 22 is located and the second metal layer M2, and the support block 70 is further located on the third metal layer M3. The signal lines on one sub-substrate 10 may be distributed in three different metal layers, where the first sub-substrate 11 includes a third metal layer M3 in addition to the first metal layer M1 and the second metal layer M2, for example, refer to fig. 9, where the third metal layer M3 of the edge area BY may also be multiplexed as the supporting block 70, that is, the same supporting block 70 is located in the first metal layer M1, the second metal layer M2 and the third metal layer M3, respectively, and the first metal layer M1, the second metal layer M2 and the third metal layer M3 in the same supporting block 70 overlap along the direction perpendicular to the first substrate 00. When the first metal layer M1, the second metal layer M2 and the third metal layer M3 are multiplexed at the same time as the supporting block 70, the height of the supporting block 70 is increased, so that the deformation amount of the second conductive part 22 formed by being pressed during the breaking process is advantageously increased, and in addition, the shearing force applied to the second conductive part 22 during the breaking process is greater due to the greater hardness of the metal layers, so that the success rate of the second conductive part 22 being broken is further increased without increasing the film layer of the first sub-substrate 11.

In an alternative embodiment of the present invention, please refer to fig. 14 and 10, fig. 10 may also be considered as a cross-sectional view of the first substrate 201 in the display area, where the first substrate 201 includes a first transparent conductive layer 91 and a semiconductor layer P0, and the material of the second conductive portion 22 is the same as that of the first transparent conductive layer 91 and is disposed in the same layer; the material of the first conductive portion 21 is the same as that of the semiconductor layer P0, and is provided in the same layer.

Referring to fig. 10, in the display region Q1, the first substrate 201 includes a thin film transistor T including a semiconductor layer P0, and the electrode layer 60 includes a first transparent conductive layer 91. In the embodiment of the invention, the first conductive part 21 multiplexes the semiconductor layer P0, and the second conductive part 22 multiplexes the first transparent conductive layer 91, that is, multiplexes the existing film structure in the sub-substrate 10, so that it is not necessary to add a new film structure in addition to the realization of the image detection, thereby being beneficial to simplifying the manufacturing process of the display substrate and improving the production efficiency of the display substrate. Optionally, the material of the first transparent conductive layer is, for example, indium tin oxide, etc., and the hardness of the indium tin oxide is smaller, so that the indium tin oxide is easy to break during the splitting process to block the electrostatic transmission channel between the second conductive portion 22 and the outside, thereby being beneficial to forming a display panel with better antistatic performance.

In an alternative embodiment of the present invention, with continued reference to fig. 14, the first substrate 201 includes at least one insulating layer J between the first conductive portion 21 and the second conductive portion 22, the first substrate 201 includes an etched hole K2, and the etched hole K2 penetrates the first conductive portion 21 and the insulating layer J between the first conductive portion 21 and the second conductive portion 22 in a direction perpendicular to the first substrate 00, and breaks the first conductive portion 21.

In the embodiment of the invention, the film structure of the first substrate 201 in the display panel is the same as the film structure of the first sub-substrate 11 in the display panel, except that the second conductive portion 22 in the first substrate 201 is disconnected, and the second substrate 202 does not overlap with the bonding area BD and the edge area BY. The etched hole K2 penetrates the first conductive portion 21 and the insulating layer J between the first conductive portion 21 and the second conductive portion 22, thereby disconnecting the first conductive portion 21. Considering that the first end of the second conductive part 22 is electrically connected with the first conductive part 21 through the conductive hole K1, in the process of etching to form the conductive hole K1, a part of etching hole K2 can be formed at the position of etching hole K2 at the same time, and then the first conductive part 21 corresponding to the position of etching hole K2 is etched away, so that the first conductive part 21 is disconnected, and the process of multiplexing the existing process is beneficial to simplifying the production process of the sub-substrate 10, and simultaneously, the electrostatic transmission path between the first conductive part 21 and the outside can be cut off, so that the antistatic performance of the product is beneficial to being improved.

Alternatively, referring to fig. 13 and 14, the etched hole K2 does not overlap the second conductive portion 22 in a direction perpendicular to the first substrate 00. Since the etching hole K2 is located in the first conductive portion 21, when the etching hole K2 and the second conductive portion 22 do not overlap, it is advantageous to avoid that the second conductive portion 22 contacts the first conductive portion 21 through the etching hole K2 and forms an electrical connection at an end far from the bonding area BD during the formation of the second conductive portion 22. The first conductive portions 21 and the second conductive portions 22 are alternately arranged in the second direction, and the first conductive portions 21 and the second conductive portions 22 do not overlap in the direction perpendicular to the first substrate 00. Since the first end of the second conductive part 22 needs to be electrically connected to the second conductive part 22, a corner connection part integrally formed with the second conductive part 22 may be introduced at the first end of the second conductive part 22, and the second conductive part 22 is electrically connected to the first conductive part 21 through the corner connection part and the conductive hole K1.

In an alternative embodiment of the present invention, with continued reference to fig. 14, the inner wall of the conductive hole K1 is deposited with a first conductive layer 71, the material of the first conductive layer 71 being different from the material of the first conductive portion 21.

Referring to fig. 11, when the insulating layer between the first conductive portion 21 and the second conductive portion 22 is etched to form a through hole to electrically connect the first end of the second conductive portion 22 and the first conductive portion 21, a through hole is also formed at the position where the first conductive portion 21 is disconnected, so that the position where the first conductive portion 21 needs to be disconnected is exposed. Then, the first conductive part 21 is etched at the position where the first conductive part 21 needs to be disconnected, and the first conductive part 21 corresponding to the position of the through hole is etched. The first conductive layer 71 is deposited on the inner wall of the conductive hole K1 connecting the first conductive part 21 and the second conductive part 22, and the material of the first conductive layer 71 is different from that of the first conductive part 21, so that the first conductive part 21 at the bottom of the conductive hole K1 is prevented from being etched in the process of etching the first conductive part 21 at the corresponding position of the etched hole K2, and the reliability of electric connection between the first conductive part 21 and the second conductive part 22 is ensured.

Optionally, with continued reference to fig. 10 and 14, the first substrate 201 further includes a second transparent conductive layer 92, and the material of the first conductive layer 71 and the second transparent conductive layer are the same material and formed in the same process step.

In the case of a liquid crystal display panel, a first electrode layer 61 and a second electrode layer 62 are generally disposed on an array substrate, and electrodes on the first electrode layer 61 and the second electrode layer 62 may be, for example, a common electrode and a pixel electrode, where the common electrode receives a common voltage signal, the pixel electrode receives a pixel voltage signal, and a voltage difference formed between the common electrode and the pixel electrode is used as a driving voltage to drive liquid crystal to deflect, so as to implement a display function. The second transparent conductive layer 92 provided in the embodiment of the present invention may be embodied as a layer closer to the first substrate 00 of the first electrode layer 61 and the second electrode layer 62, the first transparent conductive layer 91 may be embodied as a layer farther from the first substrate 00 of the first electrode layer 61 and the second electrode layer 62, for example, when the first electrode layer 61 is located between the second electrode layer 62 and the first substrate 00, the second conductive portion 22 in the present invention may reuse the second electrode layer 62, and the first conductive layer 71 deposited on the inner wall of the conductive hole K1 may reuse the first electrode layer 61, i.e., the second transparent conductive layer 92. In this way, the first conductive layer 71 is formed in the conductive hole K1 during the process of forming the first electrode layer 61, and no new process flow is required to be introduced, so that the first conductive portion 21 at the corresponding position of the conductive hole K1 is not etched during the etching process of the first conductive portion 21, the manufacturing flow of the display panel is not increased, and the production efficiency of the display panel after the first conductive layer 71 is introduced is improved.

Based on the same inventive concept, the present application further provides a display device 300, and fig. 15 is a schematic structural diagram of the display device 300 according to the embodiment of the present application, where the display device 300 includes the display panel 200 according to any of the foregoing embodiments of the present application. Referring to fig. 12 to 14, since the first conductive portion 21 is disconnected at the edge region BY of the display panel, the second conductive portion 22 also includes a plurality of disconnected second sub-portions 221, which corresponds to a transmission path of the static electricity being interrupted. When external static electricity is applied to the edge area BY of the display panel, the static electricity cannot be further conducted to the inside of the display panel, so that the overall antistatic performance of the display device 300 is improved.

It should be noted that, the display device 300 provided in the embodiment of the present application may be embodied as any product or component with a real function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, etc.

Based on the same inventive concept, the present application also provides a method for manufacturing a display panel, and fig. 16 is a flowchart of a method for manufacturing a display panel provided by an embodiment of the present application, where the method includes:

s101, providing any display substrate of the above embodiments of the present application, please refer to fig. 17 and 18, and refer to fig. 4 to 6, wherein the second sub-substrate 12 includes a first cutting line X1 and a second cutting line X2, the first sub-substrate 11 includes a third cutting line X3, the first cutting line X1 is located between the display area Q1 and the bonding area BD, the second cutting line X2 is located at a side of the edge area away from the bonding area, and the third cutting line X3 is located between the open position of the first conductive portion and the shorting bar; fig. 17 is a top view of a display substrate according to an embodiment of the present application, and fig. 18 is a schematic cross-sectional view showing a first scribe line, a second scribe line, and a third scribe line on the display substrate; it should be noted that fig. 17 is only an example in which one display substrate includes 2×2 sub-substrates 10, and in fact, the number of sub-substrates 10 included in the display substrate may be more, and the form shown in fig. 17 is only for the sake of more clear description of the present application.

S102, cutting the second sub-substrate 12 in the display substrate along the first cutting line X1 and the second cutting line X2, and cutting the first sub-substrate 11 in the display substrate along the third cutting line X3. In the actual production process, the first cutting line and the second cutting line are used for cutting the second sub-substrate firstly, and then the third cutting line is used for cutting the first sub-substrate; of course, in other embodiments of the present invention, the first sub-substrate may be cut first and then the second sub-substrate may be cut, which is not limited in detail.

S103, splitting the second sub-substrate 12 at the position of the second cutting line X2, or splitting the first sub-substrate 11 at the position of the third cutting line X3 to overlap the bump structure 40 and the second conductive portion 22 and press-break the second conductive portion 22, for example, please refer to FIG. 18, FIG. 18 is a schematic diagram illustrating a splitting operation of the second sub-substrate 12 in the embodiment of the present invention; it should be noted that, in order to make the bump structure 40 break the second conductive portion 22, fig. 18 only shows a scheme of breaking the second sub-substrate at the position of the second cutting line X2 by using the breaking device, in other embodiments of the present invention, the first sub-substrate may also be broken at the position of the third cutting line by using the breaking device, which can also make the bump structure 40 break the second conductive portion 22.

Specifically, the display substrate provided by the embodiment of the application can be regarded as a display mother board, and comprises a plurality of sub-substrates 10, and a plurality of display panels can be obtained by cutting and splitting the display substrate, wherein each sub-substrate 10 corresponds to one display panel. The above embodiment shows an embodiment of cutting and splitting the first sub-substrate 11 and the second sub-substrate 12, and in practice, when cutting the display substrate, the periphery of each sub-substrate 10 on the display substrate is cut and split in addition to the positions corresponding to the first cutting line, the second cutting line and the third cutting line, and the cutting order of each sub-substrate 10 is not limited in the present application.

In the submount 10 provided in the embodiment of the present application, the bump structure 40 is provided on the second sub-substrate 12 in the edge region BY, and the bump structure 40 overlaps the second conductive portion 22 in the direction perpendicular to the first substrate 00. When the first sub-substrate 11 or the second sub-substrate 12 is cracked, the bump structure 40 applies pressure to the second conductive portion 22 to reduce the pressure of the second conductive portion 22, so that the second conductive portion 22 is disconnected, which is equivalent to cutting off the connection path between the second conductive portion 22 and the outside. The first conductive portion 21 is disconnected on the side away from the binding area BD, which corresponds to a connection path between the first conductive portion 21 and the outside. Therefore, when the manufacturing method provided by the application is used for manufacturing the display panel, even if the short-circuit bar 30 is cut off, the second conductive part 22 which is originally electrically connected with the short-circuit bar 30 is disconnected, and the first conductive part 21 is disconnected towards one side of the short-circuit bar 30, even if external static electricity is applied to the disconnected first conductive part 21 and second conductive part 22, the external static electricity cannot be further conducted to the display area Q1, so that the phenomenon of grid defect or device breakdown caused by the static electricity applied to the display area Q1 is avoided, and the antistatic performance of the product is effectively improved.

In addition, the second cutting line and the third cutting line are close to the edge area, so that pressure is applied to the protruding structure, and the success rate of the protruding structure for fracturing the second conductive part is improved.

It can be understood that in the splitting process, the first sub-substrate can be split first and then the second sub-substrate can be split, or the second sub-substrate can be split first and then the first sub-substrate can be split, and the second conductive part can be pressed and broken by the protruding structure at the same time of splitting, so that a new process flow is not required to be introduced, and the existing splitting flow is multiplexed, thereby being beneficial to simplifying the manufacturing process of the display panel.

Optionally, along the first direction, the disconnection position of the first conductive part 21 is located between the conductive hole K1 and the third cutting line X3 that cuts the shorting bar 30, so as to ensure that after the shorting bar 30 is cut, the end of the first conductive part 21 away from the binding area BD remains disconnected, thereby cutting off the path of the electrostatic transmission.

In the first alternative embodiment of the present invention, referring to fig. 19, after the second sub-substrate 12 is broken at the position of the second cutting line X2, the portion of the second sub-substrate 12 located between the first cutting line X1 and the second cutting line X2 is separated from the display substrate, and referring to fig. 19, fig. 19 is a schematic structural diagram after the breaking of the second sub-substrate in the embodiment of the present invention is completed.

After the first sub-substrate 11 is broken at the position of the third cutting line X3, the portions of the first sub-substrate 11 located at both sides of the third cutting line X3 are separated to form a structure as shown in fig. 20, and fig. 20 is a schematic diagram showing a structure after the shorting bar 30 is separated from the display substrate.

Specifically, referring to fig. 19 and 20, the embodiment shows a scheme of splitting and removing the portion of the second sub-substrate 12 located in the binding region and the edge region, splitting and removing the shorting bar 30 on the first sub-substrate 11, and removing the shorting bar 30. In the process of breaking the first sub-board, the shorting bar 30 and the shorting member 33 are removed together. After the shorting bar 30 is cut, since the side of the first conductive portion 21 near the shorting bar 30 is disconnected, and the second conductive portion 22 is already pressed to be disconnected during the breaking process of the second sub-substrate 12, that is, the second conductive portion 22 is also in a disconnected state, even if static electricity is conducted to the first conductive portion 21 and the second conductive portion 22 on the cut surface, since both the first conductive portion 21 and the second conductive portion 22 are disconnected, the conduction path of static electricity to the inside of the display panel is blocked, which is advantageous for improving the antistatic performance of the display panel.

A specific manufacturing process of the display substrate will be described below.

Referring to fig. 21, a semiconductor layer P0, a gate insulating layer G1 and a first metal layer M1 are fabricated on a first substrate 00, and in an edge region, the gate insulating layer G1 and the first metal layer M1 are embodied as a plurality of block structures, and it should be noted that, in this embodiment, only the film structure in the edge region is described, and for the film structure in other regions of the display substrate, reference is made to the prior art, and details will not be repeated here, and in the edge region, the semiconductor layer P0 is reused as the first conductive portion 21, wherein fig. 21 is a schematic diagram of a process for fabricating the first sub-substrate in the display substrate.

Referring to fig. 22, a first insulating layer J1 is formed on a side of the first metal layer M1 away from the first substrate 00, and two through holes penetrating through the first insulating layer J1 are formed on the first insulating layer J1, wherein the two through holes are respectively located at two sides of a block structure formed by the gate insulating layer G1 and the first metal layer M1, wherein the through holes near the bonding region are subsequently used as conductive holes, and the through holes far from the bonding region BD are used as etching holes, wherein fig. 22 is a schematic diagram of another process for manufacturing the first sub-substrate in the display substrate.

Referring to fig. 23, a second metal layer M2 is formed on a side of the first insulating layer away from the first substrate 00, and along a direction perpendicular to the first substrate 00, the second metal layer M2 of the first edge region coincides with the first metal layer M1; then, a first conductive layer 71 is deposited on the inner wall of the via hole near the bonding region BD such that the first conductive layer 71 covers the inner wall of the via hole. Alternatively, the first conductive layer 71 herein may multiplex the first electrode layer 61, the second metal layer M2 and the first metal layer M1 together in the display panel as the supporting block 70. Fig. 23 is a schematic diagram illustrating another process of manufacturing a first sub-substrate in the display substrate.

Referring to fig. 24, a second insulating layer J2, such as a PV layer, is formed on a side of the second metal layer M2 away from the first substrate 00, holes are respectively formed in the second insulating layer J2 at the positions of the conductive holes K1 and the etching holes K2, and the semiconductor layer P0 (i.e., the first conductive portion 21) in the etching holes K2 is simultaneously etched away during etching of the second insulating layer J2, so that the side of the first conductive portion 21 away from the bonding area BD is disconnected, and the etching holes K2 formed at this time are shown in fig. 24, which is another schematic process for manufacturing the first sub-substrate in the display substrate.

Referring to fig. 25, a second electrode layer 62 is formed on a side of the second insulating layer away from the first substrate 00, and the second electrode layer 62 is reused as the second conductive portion 22 in the edge region BY, and the second conductive portion 22 is electrically connected to the first conductive portion 21 through the conductive hole K1. It should be noted that, the front projections of the first conductive portion 21 and the second conductive portion 22 on the first substrate 00 are arranged at parallel intervals, so that when the second conductive portion 22 is formed, the second conductive portion 22 does not enter the etching hole K2, and thus the first sub-substrate is manufactured, wherein fig. 25 is a schematic diagram of another process for manufacturing the first sub-substrate in the display substrate.

It should be noted that, referring to fig. 4, in the process of manufacturing the second sub-substrate 12, a bump structure 40 is disposed in an edge region of the second sub-substrate 12, and the bump structure 40 and the spacer on the second sub-substrate 12 can be manufactured in the same manufacturing process. After the first sub-substrate 11 and the second sub-substrate 12 are boxed, the convex structure 40 of the edge region BY in the second sub-substrate 12 overlaps the second conductive part 22 in the direction perpendicular to the first substrate 00 and is located between the adjacent two support blocks 70. In this way, in the process of splitting the second sub-substrate 12, the protruding structure 40 and the supporting block 70 can apply a certain shearing force to the second conductive portion 22, so that the success rate of pressing the second conductive portion 22 is improved, and the antistatic performance of the product is improved.

In summary, the display substrate, the display panel, the manufacturing method and the display device provided by the invention have the following beneficial effects:

While certain specific embodiments of the invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. The display substrate is characterized by comprising a plurality of sub-substrates which are arranged in an array, wherein each sub-substrate comprises a display area and a peripheral area surrounding the display area, the peripheral area comprises a binding area and an edge area which are positioned on the same side of the display area, and the binding area is positioned between the edge area and the display area;

In the edge region, the second sub-substrate includes a bump structure, the bump structure is located on a side of the second substrate facing the first sub-substrate, the second conductive portion overlaps the bump structure along a direction perpendicular to the first substrate, and the bump structure is used for pressing the second conductive portion to be broken during breaking.

2. The display substrate according to claim 1, wherein the first sub-substrate further comprises a plurality of support blocks at the edge region, the second conductive portion overlaps at least two of the support blocks in a direction perpendicular to the first substrate, the support blocks do not overlap at least partially with the bump structure, and the bump structure is located between two of the support blocks adjacent in the first direction.

3. The display substrate of claim 2, wherein the first sub-substrate further comprises a first metal layer and a second metal layer disposed on a side of the first substrate facing the second sub-substrate, the second metal layer being on a side of the first metal layer facing away from the first substrate; the first metal layer and the second metal layer are positioned between the film layer where the first conductive part is positioned and the film layer where the second conductive part is positioned along the direction perpendicular to the first substrate; the support blocks are located on the first metal layer and/or the second metal layer.

4. The display substrate according to claim 3, wherein the first sub-substrate further comprises a third metal layer disposed between the film layer where the second conductive portion is disposed and the second metal layer, and the supporting block is further disposed on the third metal layer.

5. The display substrate according to claim 1, wherein the first sub-substrate includes a first transparent conductive layer and a semiconductor layer, and the material of the second conductive portion is the same material as the first transparent conductive layer and is provided in the same layer; the material of the first conductive part and the semiconductor layer are the same material and are arranged on the same layer.

6. The display substrate according to claim 1, wherein the first sub-substrate includes at least one insulating layer between the first conductive portion and the second conductive portion, the first sub-substrate includes an etching hole penetrating the first conductive portion and the insulating layer between the first conductive portion and the second conductive portion in a direction perpendicular to the first substrate, and disconnecting the first conductive portion.

7. The display substrate according to claim 6, wherein the etched hole and the second conductive portion do not overlap in a direction perpendicular to the first substrate.

8. The display substrate according to claim 1, wherein a first conductive layer is deposited on an inner wall of the conductive hole, and a material of the first conductive layer is different from a material of the first conductive portion.

9. The display substrate of claim 8, wherein the first submount comprises a second transparent conductive layer, the material of the first conductive layer and the second transparent conductive layer being the same material and formed in the same process step.

10. The display substrate of claim 1, wherein in the display region, the second submount comprises spacer pillars, the material of the bump structure and the spacer pillars are the same material and are formed in the same process step.

11. A display panel, comprising a display area, a binding area and an edge area, wherein the edge area is positioned at one side of the binding area away from the display area;

12. The display panel of claim 11, wherein the first substrate further comprises a plurality of support blocks at the edge region, and wherein a disconnection point of two adjacent second sub-portions is located between two adjacent support blocks in a direction perpendicular to the first substrate.

13. The display panel according to claim 11, wherein the first substrate includes a first transparent conductive layer and a semiconductor layer, and wherein a material of the second conductive portion is the same material as the first transparent conductive layer and is provided in the same layer; the material of the first conductive part and the semiconductor layer are the same material and are arranged on the same layer.

14. The display panel of claim 11, wherein the first substrate includes at least one insulating layer between the first and second conductive portions, the first substrate including an etched hole penetrating the first conductive portion and the insulating layer between the first and second conductive portions in a direction perpendicular to the first substrate and disconnecting the first conductive portion.

15. The display panel according to claim 11, wherein a first conductive layer is deposited on an inner wall of the conductive hole, and a material of the first conductive layer is different from a material of the first conductive portion.

16. A display device comprising the display panel of any one of claims 11 to 15.

17. A method for manufacturing a display panel, comprising:

Providing the display substrate according to any one of claims 1 to 10, wherein the second sub-substrate comprises a first cutting line and a second cutting line, the first sub-substrate comprises a third cutting line, the first cutting line is positioned between the display area and the binding area, the second cutting line is positioned at one side of the edge area away from the binding area, and the third cutting line is positioned between the open position of the first conductive part and the shorting bar;

splitting the second sub-substrate at the position of the second cutting line to enable the protruding structure to overlap with the second conductive part and press the second conductive part to be broken; or, breaking the first sub-substrate at the position of the third cutting line, so that the protruding structure overlaps with the second conductive part and presses the second conductive part.

18. The method according to claim 17, wherein after the second sub-substrate is broken at the position where the second dicing line is located, a portion of the second sub-substrate located between the first dicing line and the second dicing line is separated from the display substrate;

And after the first sub-substrate is cracked at the position of the third cutting line, separating the parts of the first sub-substrate positioned at the two sides of the third cutting line.