CN114043078B - Device for collecting laser cutting residues - Google Patents
Device for collecting laser cutting residues Download PDFInfo
- Publication number
- CN114043078B CN114043078B CN202111399383.0A CN202111399383A CN114043078B CN 114043078 B CN114043078 B CN 114043078B CN 202111399383 A CN202111399383 A CN 202111399383A CN 114043078 B CN114043078 B CN 114043078B
- Authority
- CN
- China
- Prior art keywords
- laser cutting
- placing platform
- pushing
- collecting
- residue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Abstract
The invention relates to a device for collecting laser cutting residues, which comprises a residue placing platform arranged at the bottom of a laser cutting machine, wherein one end of the residue placing platform, which is close to the laser cutting machine, is provided with a push shovel assembly in a sliding manner; the device is matched with the spring piece through the movable push plate, so that residues attached to the opposite slag platform are cleaned, and the complete cleaning of the opposite slag platform is ensured while the stable movement of the push shovel head is ensured.
Description
[ field of technology ]
The invention relates to laser processing equipment, in particular to a device for collecting laser cutting residues.
[ background Art ]
When current people collect the residue that laser cutting machine produced, what often adopted is that the heat insulating board that can artificially draw is collected, but in collecting the in-process, needs continuous residue to observe on the heat insulating board, avoids surpassing the collection bearing capacity of heat insulating board after, leads to the condition emergence that the heat insulating board can't be taken out easily.
In order to avoid the occurrence of the above-mentioned condition, someone has designed the platform of placing the residue and the push pedal that suits with the platform, and then through the removal of push pedal, realizes the clearance to the residue, has improved the clearance rate, but in the in-service use, because of the residue temperature is higher when dropping, and then the condition that the easy emergence residue attached on the platform takes place, leads to the push pedal to remove and hinders and can't clear up the condition of attached residue to take place.
[ invention ]
The invention aims at overcoming the defects in the prior art, and aims to provide a device for collecting laser cutting residues, which ensures that when a pushing shovel head cleans residues on an opposite slag platform, the residues attached to the slag platform are cleaned through the cooperation of the elasticity of an elastic piece and the movement of the pushing shovel head, and the movement of the pushing shovel head on the slag platform is not blocked.
In order to achieve the above purpose, the present invention provides the following technical solutions: the device for collecting the laser cutting residues comprises a residue placing platform arranged at the bottom of a laser cutting machine, wherein a pushing shovel assembly is slidably arranged at one end, close to the laser cutting machine, of the residue placing platform, a collecting hopper is slidably arranged at one end, distributed along the length, of the residue placing platform, and the opening end of the collecting hopper is flush with a collecting area of the residue placing platform;
the pushing shovel assembly comprises a pushing shovel piece, the pushing shovel piece comprises a pushing shovel head and a movable pushing plate, an elastic piece is fixedly arranged at the contact part of the pushing shovel head and the movable pushing plate, the movable pushing plate is slidably connected at one end of the pushing shovel head far away from the laser cutting machine, the movable pushing plate extending end is located at the outer side of the pushing shovel head pushing direction, and one end of the movable pushing plate is mutually abutted with the bottom end of the slag placing platform.
As a further improvement of the invention, the push shovel assembly further comprises a movable rod, a connecting rod is hinged on the movable rod, and one end of the connecting rod, which is far away from the movable rod, is fixedly connected to the push shovel head.
As a further improvement of the invention, a driving assembly for driving the pushing shovel assembly to move is arranged on the slag placing platform, the driving assembly comprises a motor box and two belt pulley sleeve members, the motor box is fixedly connected to one end of the slag placing platform far away from the collecting hopper, the two belt pulley sleeve members are respectively positioned at two ends of the slag placing platform along the width direction, and two ends of the moving rod along the length direction are fixedly connected to the belt pulley sleeve members.
As a further improvement of the invention, one end of the collecting hopper far away from the laser cutting machine is provided with a rotating plate, and one end of the rotating plate far away from the collecting hopper is fixedly provided with two telescopic rods.
As a further improvement of the invention, a folding plate is fixedly arranged at one end of the collecting hopper far away from the slag placing platform, and two supporting plates are fixedly arranged at one end of the collecting hopper near the slag placing platform, and each supporting plate comprises a rotating part 621 and a fixing part 622.
As a further development of the invention, the folding position of the folding plate is located in one third of the length direction, the folding position being remote from the laser cutter.
As a further improvement of the present invention, a reset plate is fixedly provided between the support plate rotating portion 621 and the fixing portion 622.
As a further improvement of the invention, one end of the slag placing platform far away from the laser cutting machine is abutted against the ground, and the collecting hopper is positioned below the ground.
The invention has the advantages that: 1. through the cooperation between removal push pedal and the spring spare, and then realize the attached residue of opposition sediment platform and clear up, ensure to push away when shovel head steady movement, ensure the complete clearance of opposition sediment platform.
2. Through the movable of collecting the hopper, and then conveniently when the residue in the collecting hopper is cleared up, reduce the waste of manpower, improve the transfer rate of the residue in the collecting hopper.
[ description of the drawings ]
FIG. 1 is a schematic view of the overall structure of a device for collecting laser cutting residues;
FIG. 2 is an enlarged schematic view of the collection hopper and push shovel assembly of FIG. 1;
FIG. 3 is a schematic view of the collection hopper and push shovel assembly of FIG. 2 in another orientation;
FIG. 4 is a schematic view of the structure of FIG. 3 in another direction;
FIG. 5 is a schematic view of the telescopic rod and support plate of FIG. 4;
fig. 6 is an enlarged schematic view of the elastic member of fig. 4.
Reference numerals: 1-driving assembly, 11-motor case, 12-belt pulley external member, 2-slag placing platform, 21-through hole, 3-pushing shovel assembly, 31-movable rod, 311-connecting rod, 32-pushing shovel piece, 322-pushing shovel head, 323-movable push plate, 4-collecting hopper, 5-folding plate, 6-supporting plate, 61-buffer plate, 621-rotating part, 622-fixed part, 7-telescopic rod, 71-rotating plate and 8-elastic piece.
[ detailed description ] of the invention
The following detailed description of the invention provides specific embodiments with reference to the accompanying drawings.
Reference numerals and components referred to in the drawings are as follows:
the device for collecting laser cutting residues is characterized in that the movable push plate and the elastic piece are connected with the push shovel head, so that when residues on the opposite residue platform are cleaned by the push shovel head, residues attached to the residue platform are cleaned by the elastic piece and the push shovel head, and the travel of the push shovel head is not blocked.
As shown in fig. 1-6, a device for collecting laser cutting residues comprises a residue placing platform 2 arranged at the bottom of a laser cutting machine, wherein the residue placing platform 2 is used for collecting residues generated by laser cutting, one end, close to the laser cutting machine, of the residue placing platform 2 is slidably provided with a pushing shovel assembly 3 used for collecting and moving the residues, one end, distributed along the length direction, of the residue placing platform 2 is slidably provided with a collecting hopper 4 used for collecting and storing the residues, and the opening end of the collecting hopper 4 is flush with a collecting area (not marked in the drawing) of the residue placing platform 2;
the pushing shovel assembly 3 comprises a pushing shovel piece 32, the pushing shovel piece 32 comprises a pushing shovel head 322 and a movable pushing plate 323, an elastic piece 8 is fixedly arranged at the contact part of the pushing shovel head 322 and the movable pushing plate 323, the pushing shovel head 322 is not in direct contact with the slag placing platform 2, the movable pushing plate 323 is in sliding connection in a gap between the pushing shovel head 322 and the slag placing platform 2, the extending end of the movable pushing plate 323 is located at the outer side of the pushing direction of the pushing shovel head 322, and one end of the movable pushing plate 323 is mutually abutted to the bottom end of the concave surface of the slag placing platform 2.
The residue generated by laser cutting is carried through the residue placing platform 2, so that the residue is collected through the movement of the pushing shovel piece 32 arranged on the pushing shovel assembly 3 on the residue placing platform 2, the residue is pushed into the collecting hopper 4 for temporary storage, the collecting efficiency of the laser cutting residue is improved, and meanwhile, the frequency of cleaning the residue is reduced;
and keep away from the terminal surface of laser cutting machine through removing push pedal 323 and putting sediment platform 2 concave surface and contradict, and then make the residue on putting sediment platform 2 gather on pushing shovel head 322 and remove, when meetting the condition that the residue was pasted each other with putting sediment platform 2, through pushing shovel piece 32 to being close to the one end of collecting hopper 4 and remove, and then make remove push pedal 323 and residue contact, keep pushing shovel piece 32's removal unchanged, thereby remove push pedal 323 and pushing shovel head 322 take place to slide, and then make elastic component 8 shrink, thereby in pushing shovel piece 32 continuous removal, increase elastic component 8's elasticity, and then reach the thrust that strengthens removing push pedal 323 with this, the thrust that removes push pedal 323 is equivalent to the force that is produced by pushing shovel piece 32 removal and is added elastic component 8's elasticity, thereby make remove push pedal 323 and remove the ability improvement, thereby realize the residue that is attached, and after the residue is clear, under the effect of elastic component 8, make remove push pedal 323 and resume the initial position, thereby avoided attaching the condition that the residue is blocked shovel head 322 to take place to slide, thereby in order to reach the thrust of strengthening and remove the thrust of pushing shovel piece 32, this thrust that is equivalent to remove the opposite to remove the sediment and realize completely.
As shown in fig. 1-4, further, the push shovel assembly 3 further includes a moving rod 31 for moving the push shovel 32, a connecting rod 311 for supporting the push shovel 32 is hinged on the moving rod 31, and one end of the connecting rod 311 far away from the moving rod 31 is fixedly connected to the push shovel head 322.
The supporting and the moving of the pushing shovel piece are realized through the moving rod 31 and the connecting rod 311, and then when the pushing shovel piece 32 moves, larger friction can not occur between the pushing shovel piece 32 and the slag placing platform 2, normal movement of the pushing shovel piece 32 is ensured, and the connection between the pushing shovel head 322 and the moving rod 31 is realized through the connecting rod 311, so that the movement direction of the pushing shovel head 322 is ensured not to change in the working process, and the stable cleaning state of the pushing shovel head 322 against the slag placing platform 2 is ensured.
As shown in fig. 1, further, a driving assembly 1 for driving the pushing shovel assembly 3 to move is arranged on the slag placing platform 2, the driving assembly 1 comprises a motor box 11 for providing transmission power and two belt pulley sets 12 for driving the pushing shovel assembly 3 to move, the motor box 11 is fixedly connected to one end of the slag placing platform 2 far away from the collecting hopper 4, the two belt pulley sets 12 are respectively positioned at two ends of the slag placing platform 2 along the width direction, and two ends of the moving rod 31 along the length direction are fixedly connected to the belt pulley sets 12.
Through movable rod 31 and belt pulley external member 12 connection, and then make belt pulley external member 12 when removing, can drive movable rod 31 and remove, belt pulley external member 12 passes through drive mechanism with motor (not shown) in the motor case 11 simultaneously and is connected, and then drives belt pulley external member 12 through the motor and remove to drive movable rod 31 and remove, and then realize pushing away the removal of shovel piece 32, thereby realize clearing up the residue on the opposed sediment platform 2.
The movable distance of the movable rod 31 is the same as the length of the slag placement platform 2, and the pushing blade 32 can be partially moved to the upper side of the collection hopper 4 to ensure that the slag is transported into the collection hopper 4.
As shown in fig. 4, further, a rotating plate 71 is disposed at an end of the collecting hopper 4 away from the laser cutting machine, and two telescopic rods 7 are fixedly disposed at an end of the rotating plate 71 away from the collecting hopper 4.
Through two telescopic links 7 that set up for collect the hopper 4 in after collecting the residue, drive through telescopic link 7 and collect hopper 4 and remove to the one end that is close to laser cutting machine, and the both ends that rotor plate 71 distribute along length direction are cylindrical (the figure is not marked), and rotate and connect on collecting the bottom of hopper 4, and rotor plate 71 along the both ends that length distributes with collect hopper 4 hookup location fixed be equipped with be used for collecting the torsional spring that hopper 4 reset, and then after collecting hopper 4 and ground parallel and level, make through rotor plate 71 and collect hopper 4 and take place to rotate, make the residue of collecting in the hopper 4 empty subaerial, thereby the convenience is to collecting the residue clearance in the hopper 4.
It should be noted that, the collecting hopper 4 is connected to the slag placing platform 2 by a sliding rail (not shown in the drawing).
As shown in fig. 4-5, further, a folding plate 5 is fixedly arranged at one end of the collecting hopper 4 far away from the slag placing platform 2, two supporting plates 6 are fixedly arranged at one end of the collecting hopper 4 near the slag placing platform 2, and the supporting plates 6 comprise a rotating part 621 and a fixing part 622.
Through folding board 5 and backup pad 6 that set up to ensure to collect hopper 4 behind removing to ground, rotation direction is controllable, and then through hawser (not shown) pulling folding board 5 lower extreme, and then make folding board 5 fold, and then drive to collect hopper 4 and rotate around rotating plate 71, the torsional spring on the rotating plate 71 tightens up this moment, thereby drives the rotation portion 621 of backup pad 6 and takes place to rotate, makes the rotation direction of collecting hopper 4 invariable, conveniently emptys the collection to collecting the residue in the hopper 4.
The rotation portion 621 of the support plate 6 is a portion connected to the collection hopper 4, and the fixing portion 622 is a portion of the collection hopper 4 near the ground.
As shown in fig. 2, preferably, in order that the support plate 6 can be moved with the collection hopper 4 to the ground, two through holes 21 for the passage of the support plate 6 are provided on the slag placement platform 2.
As shown in fig. 2, further, the folding position of the folding plate 5 is located at one third of the length direction, and the folding position is away from the laser cutter.
Through above-mentioned technical feature for folding board 5 is to collecting hopper 4 when inclination when the slope is great, and folding board 5 folding board's unfolded part supports collecting hopper 4 self weight, and when folding board 5 is folding around folding position, does not take place to conflict with collecting hopper 4's outer wall, thereby makes collecting hopper 4 can overturn fully, makes collecting hopper 4 interior residue can be cleared up completely.
As shown in fig. 4, a buffer plate 61 is further fixed between the rotating portion 621 and the fixing portion 622 on the support plate 6.
Through above-mentioned technical characteristics, and then accomplish and empty the back at collection hopper 4, the bearing that resets of folding board 5 this moment is great, and then resets collection hopper 4 through the torsional spring, and simultaneously assist the torsional spring to reset collection hopper 4 through buffer plate 61, and then with the help of buffer plate 61's elasticity buffering to avoid collecting hopper 4 and bump in the time of resetting opposition sediment platform 2, the rotation portion 621 of pulling backup pad 6 removes, and then improves folding board 5's life.
Further, the slag placing platform 2 is abutted against the ground at one end far away from the laser cutting machine, and the collecting hopper 4 is positioned below the horizontal ground.
Because of put sediment platform 2 is located the one end that laser cutting machine is close to ground, in order to make laser cutting machine when using simultaneously, be convenient for people to laser cutting machine operation, and then make the open end of collecting hopper 4 and level ground parallel and level, and then make the wall body that collects hopper 4 be located the depressed part on level ground, the while is convenient observes the residue condition in the collection hopper 4.
The foregoing is merely a preferred embodiment of the present invention, and it should be noted that modifications and additions may be made to the person skilled in the art without departing from the method of the present invention, which modifications and additions should also be considered as being within the scope of the present invention.
Claims (5)
1. The device for collecting laser cutting residues is characterized by comprising a residue placing platform (2) arranged at the bottom of a laser cutting machine, wherein a pushing shovel assembly (3) is slidably arranged at one end, close to the laser cutting machine, of the residue placing platform (2), a collecting hopper (4) is slidably arranged at one end, distributed along the length direction, of the residue placing platform (2), and the opening end of the collecting hopper (4) is flush with a collecting area of the residue placing platform (2);
the pushing shovel assembly (3) comprises a pushing shovel piece (32), the pushing shovel piece (32) comprises a pushing shovel head (322) and a movable pushing plate (323), an elastic piece (8) is fixedly arranged at the contact part of the pushing shovel head (322) and the movable pushing plate (323), the pushing shovel head (322) is not in direct contact with the slag placing platform (2), the movable pushing plate (323) is in sliding connection in a gap between the pushing shovel head (322) and the slag placing platform (2), the extending end of the movable pushing plate (323) is located at the outer side of the pushing direction of the pushing shovel head (322), and one end of the movable pushing plate (323) is in mutual interference with the bottom end of the concave surface of the slag placing platform (2);
one end of the collecting hopper (4) far away from the laser cutting machine is provided with a rotating plate (71), and one end of the rotating plate (71) far away from the collecting hopper (4) is fixedly provided with two telescopic rods (7);
one end of the collecting hopper (4) far away from the slag placing platform (2) is fixedly provided with a folding plate (5), one end of the collecting hopper (4) close to the slag placing platform (2) is fixedly provided with two supporting plates (6), and the supporting plates (6) comprise a rotating part (621) and a fixing part (622);
the folding position of the folding plate (5) is positioned at one third of the position distributed along the length direction, and the folding position is far away from the laser cutting machine.
2. Device for collecting laser cutting residues according to claim 1, wherein the pushing shovel assembly (3) further comprises a moving rod (31), a connecting rod (311) is hinged on the moving rod (31), and one end, far away from the moving rod (31), of the connecting rod (311) is fixedly connected to the pushing shovel head (322).
3. The device for collecting laser cutting residues according to claim 2, wherein the residue placing platform (2) is provided with a driving assembly (1) for driving the push shovel assembly (3) to move, the driving assembly (1) comprises a motor box (11) and two belt pulley assemblies (12), the motor box (11) is fixedly connected with one end of the residue placing platform (2) away from the collecting hopper (4), the two belt pulley assemblies (12) are respectively positioned at two ends of the residue placing platform (2) along the width direction, and two ends of the moving rod (31) along the length direction are fixedly connected with the belt pulley assemblies (12).
4. Device for collecting laser cutting residues according to claim 1, characterised in that a buffer plate (61) is fixedly arranged between the rotating part (621) and the fixing part (622) on the support plate (6).
5. Device for collecting laser cutting residues according to claim 1, characterized in that the end of the residue placement platform (2) remote from the laser cutting machine is in contact with the ground, and the collection hopper (4) is located below the horizontal ground.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111399383.0A CN114043078B (en) | 2021-11-19 | 2021-11-19 | Device for collecting laser cutting residues |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111399383.0A CN114043078B (en) | 2021-11-19 | 2021-11-19 | Device for collecting laser cutting residues |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114043078A CN114043078A (en) | 2022-02-15 |
| CN114043078B true CN114043078B (en) | 2023-08-25 |
Family
ID=80210806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111399383.0A Active CN114043078B (en) | 2021-11-19 | 2021-11-19 | Device for collecting laser cutting residues |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114043078B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202643732U (en) * | 2012-04-27 | 2013-01-02 | 宝钢工程技术集团有限公司 | Antilock slag scraper for oxygen lance |
| CN203045164U (en) * | 2012-12-27 | 2013-07-10 | 苏州领创激光科技有限公司 | Workbench for deslagging and recycling of small parts |
| CN206895156U (en) * | 2017-07-14 | 2018-01-19 | 新昌县七星街道金源机床配件经营部 | Screeding device for agricultural machinery |
| CN108453440A (en) * | 2018-03-19 | 2018-08-28 | 徐永香 | A kind of Mobile welding platform for removing function with electronic welding slag |
| CN109465545A (en) * | 2019-01-03 | 2019-03-15 | 阎振文 | A kind of laser cutting machine workbench slag remover |
| CN112547612A (en) * | 2020-11-30 | 2021-03-26 | 温州冰锡环保科技有限公司 | PCB board tin dross clearance is with machine of brushing version |
| CN212918114U (en) * | 2020-08-20 | 2021-04-09 | 沧州航诚工控设备有限公司 | Automatic slag-discharging laser cutting machine |
| CN113500306A (en) * | 2021-07-14 | 2021-10-15 | 张梦龙 | Laser cutting device convenient for removing cutting residues |
-
2021
- 2021-11-19 CN CN202111399383.0A patent/CN114043078B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202643732U (en) * | 2012-04-27 | 2013-01-02 | 宝钢工程技术集团有限公司 | Antilock slag scraper for oxygen lance |
| CN203045164U (en) * | 2012-12-27 | 2013-07-10 | 苏州领创激光科技有限公司 | Workbench for deslagging and recycling of small parts |
| CN206895156U (en) * | 2017-07-14 | 2018-01-19 | 新昌县七星街道金源机床配件经营部 | Screeding device for agricultural machinery |
| CN108453440A (en) * | 2018-03-19 | 2018-08-28 | 徐永香 | A kind of Mobile welding platform for removing function with electronic welding slag |
| CN109465545A (en) * | 2019-01-03 | 2019-03-15 | 阎振文 | A kind of laser cutting machine workbench slag remover |
| CN212918114U (en) * | 2020-08-20 | 2021-04-09 | 沧州航诚工控设备有限公司 | Automatic slag-discharging laser cutting machine |
| CN112547612A (en) * | 2020-11-30 | 2021-03-26 | 温州冰锡环保科技有限公司 | PCB board tin dross clearance is with machine of brushing version |
| CN113500306A (en) * | 2021-07-14 | 2021-10-15 | 张梦龙 | Laser cutting device convenient for removing cutting residues |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114043078A (en) | 2022-02-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN211336425U (en) | Unmanned aerial vehicle for cable snow removal | |
| CN210474868U (en) | Deashing trolley for steelmaking dust removal pipeline | |
| CN114043078B (en) | Device for collecting laser cutting residues | |
| CN215476272U (en) | Material bag collecting mechanism for unpacking device | |
| CN215482624U (en) | Garbage sweeper sweeping arm mechanism with prolonged service life | |
| CN217013902U (en) | Base station of cleaning system and cleaning system | |
| CN208589664U (en) | A kind of novel electric power power distribution cabinet | |
| CN210737448U (en) | Rail debris collection device | |
| CN210262765U (en) | Cleaning device is used in bridge maintenance | |
| CN113460421A (en) | Material locking mechanism for material bale breaker | |
| CN214325399U (en) | Unmanned aerial vehicle launcher cleaning device | |
| CN112548196A (en) | Ceiling supporting plate cutting machine in motor car compartment | |
| CN219985352U (en) | Telecommunication equipment maintenance platform convenient to clean | |
| CN218452804U (en) | Armor formula lathe protection casing with prevention of seepage passes through function | |
| CN217832314U (en) | Laser cutting machine convenient to it is clean | |
| CN218584539U (en) | Mobile hydraulic module system comprehensive guarantee device for airplane ground | |
| CN220093947U (en) | Metal cutting device with clear up piece function | |
| CN218852639U (en) | Self-cleaning dustpan | |
| CN219970983U (en) | Full-light concrete conveying mechanism | |
| CN109056613A (en) | A kind of fabrication facility floor dust handling equipment | |
| CN220329376U (en) | Elevator door slot cleaning shovel | |
| CN113271723B (en) | PCB surface cleaning machine for LED production | |
| CN216917219U (en) | Portable medical waste collection device | |
| CN215247935U (en) | Blank conveyer and blank production line | |
| CN214656675U (en) | Road cleaning equipment for urban environmental protection |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 325000 No. 4258, 3rd road, Binhai Park, Wenzhou Economic and Technological Development Zone, Wenzhou City, Zhejiang Province Applicant after: Pentium laser (Zhejiang) Co.,Ltd. Address before: 325000 No. 4258, 3rd road, Binhai Park, Wenzhou Economic and Technological Development Zone, Wenzhou City, Zhejiang Province Applicant before: PENTA LASER (WENZHOU) Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |