Detailed Description
The following describes embodiments with reference to the drawings.
(embodiment 1)
Fig. 1 is a schematic view of an ultrasonic probe 200 according to embodiment 1. Fig. 1 shows the positional relationship of various components provided in the ultrasonic probe 200, not the sizes of the various components.
The ultrasonic probe 200 includes a sensor 202, a pulser & switch unit 204, an amp (amplifier) adc (analog to Digital converter) unit 206, a Digital signal processing unit 208, a wireless communication unit 210, a battery 220, and a plurality of temperature sensors 230(2301, 2302). The ultrasonic probe 200 outputs ultrasonic waves to a subject (not shown), receives reflected waves (ultrasonic waves) reflected from the subject, and generates ultrasonic image data from the received reflected waves.
Instead of the temperature sensors 2301, 2302, thermistors may be provided. The temperature sensors 2301, 2302 and the thermistor are examples of the temperature detection unit. Hereinafter, the temperature sensors 2301 and 2302 will be collectively referred to as the temperature sensor 230 without being particularly distinguished and described.
The temperature sensor 2301 is disposed in a position close to the sensor 202 and the pulser & switch unit 204, and detects the temperature around the sensor 202 and the pulser & switch unit 204. The temperature sensor 2301 may be disposed in a position in contact with one of the sensor 202 and the pulser & switch portion 204, or may be disposed between the sensor 202 and the pulser & switch portion 204.
The temperature sensor 2302 is disposed at a position close to or in contact with the amplifier in the AMP & ADC unit 206, and detects the temperature around the amplifier. The battery 220 supplies power to the sensor 202, the pulser & switch unit 204, the AMP & ADC unit 206, the digital signal processing unit 208, the wireless communication unit 210, and the like, which are heat generating components. The sensor 202, the pulser & switch unit 204, the AMP & ADC unit 206, the digital signal processing unit 208, and the wireless communication unit 210 will be described with reference to fig. 3. The ultrasonic probe 200 can be operated by an external power supply, and in this case, the battery 220 is not provided. In the case of performing communication with the outside by a wired method, a wired communication unit may be disposed in the ultrasonic probe 200 instead of the wireless communication unit 210.
Fig. 2 is a schematic diagram of an example of the external shape of the ultrasonic probe 200 of fig. 1 and an example of the arrangement position of a heat generating component or the like. The ultrasonic probe 200 has an elongated shape when viewed from the surface side where the operation buttons 250, the led (light Emitting diode)252, and the like are provided. For example, the sensor 202 and the pulser & switch unit 204 are arranged in this order from the distal end side of the ultrasonic probe 200 positioned on the upper side in fig. 2, and the temperature sensor 2301 is provided on the sensor 202 side of the pulser & switch unit 204. The distal end portion of the ultrasonic probe 200, where the sensor 202 is exposed, is a portion that is in contact with the subject.
The AMP & ADC unit 206 and the digital signal processing unit 208 are disposed at substantially the center portion in the longitudinal direction of the ultrasonic probe 200, and the temperature sensor 2302 is disposed on the pulser & switch unit 204 side of the AMP & ADC unit 206. The wireless communication section 210 is disposed on the rear end side of the ultrasonic probe 200 on the lower side in fig. 2.
For example, the sensor 202, the pulser & switch section 204, the AMP & ADC section 206, the digital signal processing section 208, and the wireless communication section 210 are arranged on the surface (front surface) side within the case (case) of the ultrasonic probe 200. The battery 220 is disposed on the rear side in the housing from the center portion to the rear end side of the ultrasonic probe 200.
Fig. 3 is a schematic diagram showing an example of the configuration of the ultrasonic diagnostic system 100 according to embodiment 1. The ultrasonic diagnostic system 100 shown in fig. 3 includes the ultrasonic probe 200 and the terminal device 300 shown in fig. 1. The ultrasonic probe 200 and the terminal device 300 can wirelessly communicate with each other. For example, the terminal device 300 may be a general-purpose terminal such as a tablet (computer) terminal.
The ultrasonic probe 200 includes a control unit 212 and a pulser voltage generating unit 214 in addition to the elements shown in fig. 1. The terminal device 300 includes a wireless communication unit 302, a cpu (central Processing unit)304, a memory 306, and a display unit 308.
The sensor 202 has an unillustrated oscillator array arranged in an array shape at a position relative to a contact portion with the living body P (subject), and outputs ultrasonic waves generated by the oscillator array to the living body P in accordance with a pulse signal generated by the pulser & switch portion 204. The ultrasonic wave entering the living body P may be reflected at the boundary where the acoustic impedances are different. The sensor 202 receives an ultrasonic wave (reflected wave) reflected from the living body P, and outputs the received ultrasonic wave to the pulser & switch unit 204 as a signal.
The pulser & switch unit 204 selects the sensor 202 by the switcher, transmits a pulse signal from the pulser to the sensor 202, and causes the sensor 202 to output an ultrasonic wave. The pulser & switch section 204 receives a signal generated by the sensor 202 based on the reflected wave, and outputs the received signal to the amplifier of the AMP & ADC section 206 selected by the switch.
The AMP & ADC unit 206 amplifies a signal indicating a reflected wave of the ultrasonic wave received from the pulser & switch unit 204 by an amplifier, converts the signal into a digital signal by an ADC, and outputs the digital signal to the digital signal processing unit 208. For example, the AMP & ADC unit 206 has 32-channel (channel) amplifiers, and can operate the number of channels instructed from the control unit 212. The larger the number of channels to be operated, the higher the power consumption of the AMP & ADC unit 206, but the larger the data amount, and therefore, the higher the image quality of the ultrasonic image data generated by the digital signal processing unit 208. On the other hand, the smaller the number of channels to be operated, the lower the power consumption of the AMP & ADC unit 206, but the smaller the data amount, so the image quality of the ultrasonic image data generated by the digital signal processing unit 208 is low.
The digital signal processing section 208 performs various kinds of processing on the digital signal received from the AMP & ADC section 206 to generate ultrasonic image data, and outputs the generated ultrasonic image data to the wireless communication section 210. For example, the digital signal processing unit 208 may perform a process of aligning the timings (timing) of the signals representing the reflected waves output from the pulser & switch unit 204, an averaging (phase adjustment addition) process, a gain correction process in consideration of attenuation of the reflected waves in the living body P, an envelope process for acquiring luminance information, and the like. The digital signal processing unit 208 can transmit the ultrasonic image data to the wireless communication unit 210 using, for example, spi (serial Peripheral interface).
The wireless communication unit 210 can perform wireless communication with the wireless communication unit 302 of the terminal device 300 outside the ultrasonic probe 200 by using, for example, Wi-Fi (registered trademark) or the like. The wireless communication between the wireless communication units 210 and 302 is not limited to Wi-Fi, and may be performed using another standard. The wireless communication unit 210 may use, for example, I2The C (I-squared-C) interface outputs an ultrasonic irradiation instruction and the like received from the terminal device 300 to the control unit 212. The wireless communication unit 210 may also transmit the ultrasonic image data received from the digital signal processing unit 208 to the wireless communication unit 210 of the terminal device 300. The ultrasonic image data transmitted from the ultrasonic probe 200 to the terminal device 300 is a digital signal (digital data).
For example, the wireless communication unit 210 may change the frame rate of the ultrasound image data transmitted to the wireless communication unit 302 of the terminal device 300 in accordance with an instruction from the control unit 212. The higher the frame rate is, the more the power consumption of the wireless communication unit 210 is increased, but the image displayed on the display unit 308 of the terminal device 300 changes smoothly. On the other hand, the lower the frame rate, the less the power consumption of the wireless communication unit 210, but the image displayed on the display unit 308 of the terminal device 300 changes unnaturally. It should be noted that, in the case of lowering the frame rate, as the frame rate is lowered, for example, the number of oscillators operated by the sensor 202, the number of pulsers and switches operated by the pulser & switch section 204, and the number of operation channels of the AMP & ADC section 206 are all reduced.
The battery 220 is chargeable via a power supply terminal, not shown, for example, and can supply power to each component of the ultrasonic probe 200. Each of the temperature sensors 2301 and 2302 can output temperature information indicating the measured temperature to the control unit 212. The ultrasonic probe 200 may have 3 or more temperature sensors 230. Each temperature sensor 230 is preferably disposed in contact with or close to a heat generating component having a relatively large amount of heat generation.
The control unit 212 controls the entire ultrasound probe 200. For example, the control unit 212 may be realized by a control program executed by a processor such as a CPU that controls the operation of the ultrasonic probe 200. For example, the control unit 212 may control the pulser & switch unit 204 in response to a measurement start instruction received from the terminal device 300 via the wireless communication unit 210, thereby causing the sensor 202 to output an ultrasonic wave. The control unit 212 causes the digital signal processing unit 208 to generate ultrasonic image data obtained by imaging the reflected wave from the living body P.
Further, the control unit 212 stops the operations of the pulser & switch unit 204, the digital signal processing unit 208, and the like in response to a measurement stop instruction received from the terminal device 300 via the wireless communication unit 210. The measurement start instruction and the measurement stop instruction may be performed by operating an operation button 250 (fig. 2) provided on the housing surface of the ultrasonic probe 200.
Furthermore, the control unit 212 controls the power consumption of at least one of the pulser & switch unit 204 and the AMP & ADC unit 206 based on the temperature measured by each temperature sensor 230. Accordingly, the amount of heat generated by each of the pulser & switch unit 204 and the AMP & ADC unit 206 can be adjusted, and the surface temperature of the case of the ultrasonic probe 200 can be set to a temperature at which the operator holding the ultrasonic probe 200 does not feel hot. Further, the temperature of the front end portion of the sensor 202 may be set to a temperature at which the subject does not feel hot. The control of the power consumption amount performed by the control unit 212 will be described with reference to fig. 4 and 5.
The pulser voltage generating unit 214 generates a driving voltage of the pulser & switch unit 204 according to the control from the control unit 212. The driving voltage of the pulser can be adjusted based on the control from the control section 212.
The wireless communication unit 302 of the terminal device 300 receives ultrasonic image data and the like from the wireless communication unit 210 of the ultrasonic probe 200. The wireless communication unit 302 transmits an ultrasonic irradiation instruction or the like to the wireless communication unit 210 of the ultrasonic probe 200. The CPU304 can control the overall operation of the terminal device 300 by executing a program, for example. The memory 306 stores ultrasonic image data received by the wireless communication unit 302, various programs executed by the CPU304, data used by the various programs, and the like.
The display unit 308 displays an ultrasonic image or the like received from the ultrasonic probe 200. Here, the ultrasonic image displayed on the display unit 308 includes a video (video) obtained during the scanning of the living body P by the ultrasonic probe 200 and a still image obtained when the scanning of the living body P by the ultrasonic probe 200 is stopped. In the case where the terminal device 300 is a general-purpose terminal such as a tablet terminal, the display unit 308 may include a touch screen.
Fig. 4 is a schematic diagram of an operation example of the ultrasonic probe 200 of fig. 3. For example, the operation flow shown in fig. 4 can be realized by a control program executed by the control unit 212(CPU) in fig. 3. That is, fig. 4 is a schematic diagram of an example of a control method and a control program of the ultrasonic probe 200. The operational flow shown in fig. 4 may be repeatedly executed at a predetermined cycle (for example, every second or every 100 msec).
First, in step S10, the control section 212 compares the temperature detected by the temperature sensor 2301 arranged in the vicinity of the sensor 202 and the pulser & switch section 204 with the temperature threshold VT 1. Then, the control unit 212 determines whether or not the temperature detected by the temperature sensor 2301 exceeds a temperature threshold VT 1. The controller 212 executes step S14 when the temperature detected by the temperature sensor 2301 exceeds the temperature threshold VT1, and executes step S12 when the temperature detected by the temperature sensor 2301 is equal to or less than the temperature threshold VT 1.
In step S12, the control section 212 compares the temperature detected by the temperature sensor 2302 arranged near the AMP & ADC section 206 with the temperature threshold VT 2. After that, the control unit 212 determines whether or not the temperature detected by the temperature sensor 2302 exceeds the temperature threshold VT 2. The control unit 212 executes step S14 when the temperature detected by the temperature sensor 2302 exceeds the temperature threshold VT2, and executes step S16 when the temperature detected by the temperature sensor 2302 is equal to or less than the temperature threshold VT 2. The temperature thresholds VT1 and VT2 exemplify the 1 st temperature threshold. For example, the temperature thresholds VT1, VT2 may be set to the same value.
In step S14, since one of the temperatures measured by the 2 temperature sensors 230 exceeds the temperature threshold set for each temperature sensor 230, the control unit 212 switches the operation mode of the ultrasonic probe 200 to one of a plurality of low power consumption (low power consumption) operation modes. On the other hand, in step S16, the control unit 212 maintains the operation mode of the ultrasonic probe 200 in the normal operation mode or switches to the normal operation mode.
It should be noted that the temperature threshold VT1 can be set to be lower than the temperature threshold VT 2. Accordingly, as shown in fig. 5, the temperature of the distal end portion of the sensor 202 that is in direct contact with the skin of the subject can be made lower than the maximum temperature of the case of the ultrasonic probe 200 that is held by the operator of the ultrasonic probe 200. Therefore, the subject can be prevented from feeling uncomfortable.
Here, the subject is a patient or the like who is imaged with an ultrasound image by the ultrasound probe 200. Although not particularly limited, the temperature of the tip portion of the sensor 202 and the surface temperature of the case of the ultrasonic probe 200 are preferably not higher than a temperature at which low-temperature burn does not occur (for example, 40 ℃).
In the ultrasonic probe 200, the pulser & switch unit 204 and the AMP & ADC unit 206 have the highest heat generation amount and the highest temperature housing, and are located at positions facing the pulser & switch unit 204 and the AMP & ADC unit 206. Further, various components are closely installed within the housing of the ultrasonic probe 200, and there is little gap between the inner surface of the housing and the various components. For this reason, the surface temperature of the case is substantially the same as the temperature detected by each temperature sensor 230.
Fig. 5 is a diagram of a specific example of the action shown in fig. 4. The judgment (determination) of step S20 is the same as the judgment of step S10 of fig. 4, and the judgments of steps S22 and S24 are the same as the judgment of step S12 of fig. 4.
In step S20, the control unit 212 executes step S22 when the temperature measured by the temperature sensor 2301 exceeds the temperature threshold VT1, and executes step S24 when the temperature measured by the temperature sensor 2301 is equal to or less than the temperature threshold VT 1.
In step S22, the control unit 212 executes step S26 when the temperature measured by the temperature sensor 2302 exceeds the temperature threshold VT 2. In step S22, the control unit 212 executes step S28 when the temperature measured by the temperature sensor 2302 is equal to or lower than the temperature threshold VT 2.
In step S24, the control unit 212 executes step S30 when the temperature measured by the temperature sensor 2302 exceeds the temperature threshold VT 2. In step S24, the control unit 212 executes step S32 when the temperature measured by the temperature sensor 2302 is equal to or lower than the temperature threshold VT 2.
In steps S26 and S30, the controller 212 reduces the number of operation channels of the amplifier. For example, the control portion 212 may reduce the number of operation channels in the low power consumption operation mode from 32 in the normal operation mode to 24, 16, and so on. When the temperature measured by the temperature sensor 2302 exceeds the temperature threshold VT2, the control unit 212 decreases the number of operation channels of the amplifier regardless of the temperature measured by the temperature sensor 2301.
The control section 212 also reduces the number of pulsers and the number of switches that operate in the pulser & switch section 204, corresponding to the reduction in the number of operating channels of the amplifier. Accordingly, not only the heat generation amount of the amplifier can be reduced, but also the heat generation amount of the pulser & switch unit 204 can be reduced. For this reason, by repeatedly executing the processing of fig. 5, the temperature around the AMP & ADC unit 206 can be suppressed to the temperature threshold VT2 or less, and the temperature around the pulser & switch unit 204 can be suppressed to the temperature threshold VT1 or less. For example, the temperature of the front end portion of the sensor 202 may also be suppressed below the temperature threshold VT 1. Therefore, both the subject and the operator who holds and operates the ultrasonic probe 200 can be prevented from feeling uncomfortable.
Note that, when the temperature around the AMP & ADC unit 206 cannot be equal to or lower than the temperature threshold VT2 even if the flow of fig. 5 is executed a plurality of times, the number of operation channels of the amplifier may be gradually reduced to 24, 16, or 8, for example. At the same time, the number of pulsers and the number of switches operating in the pulser & switch unit 204 are also reduced.
In step S28, control unit 212 controls pulser voltage generation unit 214 to decrease the drive voltage of the pulser of pulser & switch unit 204. For example, the control unit 212 may decrease the driving voltage of the pulser in the low power consumption operation mode from 50V in the normal operation mode to 40V, 30V, 20V, or the like. By lowering the drive voltage of the pulser, the intensity of the reflected wave can be lowered, and therefore, the luminance of the ultrasonic image (data) generated by the digital signal processing unit 208 can be lowered. However, since the number of operation channels of the amplifiers is not reduced in step S28, the quality of the ultrasonic image can be prevented from deteriorating.
In step S28, since the drive voltage of the pulser is reduced, the power consumption of the low pulser & switch unit 204 can be reduced, and the amount of heat generated by the pulser & switch unit 204 can be reduced. This can reduce the temperature of the pulser & switch unit 204. Further, since the driving voltage of the sensor 202 is also reduced, the temperature of the sensor 202 can also be reduced.
Therefore, by repeatedly executing the processing of fig. 5, the temperature around the pulser & switch unit 204 and the sensor 202 can be controlled to be equal to or lower than the temperature threshold VT1, and the subject can be prevented from feeling uncomfortable. Note that, when the temperature around the pulser & switch unit 204 cannot be equal to or lower than the temperature threshold VT1 even if the flow of fig. 5 is executed a plurality of times, the drive voltage of the pulser can be gradually reduced to, for example, 40V, 30V, or 20V.
In step S32, the control unit 212 operates in the normal operation mode and controls the operation of each circuit in the ultrasonic probe 200. For example, in the normal operation mode, the number of operation channels of the amplifier is 32, the driving voltage of the pulser is 50V, and the frame rate of the ultrasonic image data generated by the digital signal processing unit 208 is 20fps (frame per second).
As shown in fig. 5, the low power consumption operation mode has two kinds of the low power consumption operation mode based on the change of the number of operation channels of the amplifier and the low power consumption operation mode based on the change of the driving voltage of the pulser. As described above, in each low power consumption operation mode, the number of operation channels of the amplifier can be sequentially reduced, and the drive voltage of the pulser can be sequentially reduced. That is, the power consumption amount can be finely adjusted in each power consumption amount mode.
The above embodiment 1 can reduce the power consumption of the components located near the temperature sensor 230 that detects a temperature exceeding the temperature threshold VT1 (or VT2), thereby suppressing the amount of heat generation. For example, the heat generation amount of the AMP & ADC unit 206 can be suppressed by reducing the number of operation channels of the amplifier, and the heat generation amount of the pulser & switch unit 204 can be suppressed by reducing the driving voltage of the pulser.
Accordingly, the surface temperature of each part of the housing of the ultrasonic probe 200, which is different depending on the arrangement position of the heat generating component, can be set to the temperature threshold VT1 (or VT2) or less. That is, the surface temperature of the case of the ultrasonic probe 200 can be set to a desired temperature regardless of the position of the heat generating component. Therefore, both the subject and the operator of the ultrasonic probe 200 can be prevented from feeling uncomfortable.
Further, by setting the temperature threshold VT1 to be lower than the temperature threshold VT2, the temperature of the distal end portion of the sensor 202 can be made lower than the surface temperature of the case of the ultrasonic probe 200, thereby also preventing the subject from feeling uncomfortable.
(embodiment 2)
Fig. 6 is a schematic diagram of the ultrasonic probe 200A according to embodiment 2. Here, the same elements as those in fig. 1 are given the same reference numerals, and detailed description thereof is omitted. The ultrasonic probe 200A of this embodiment further includes a temperature sensor 2303 disposed in a position close to or in contact with the wireless communication unit 210, and a temperature sensor 2304 disposed in a position close to or in contact with the battery 220. That is, the ultrasonic probe 200A has 4 temperature sensors 230(2301, 2302, 2303, 2304). The other configurations of the ultrasonic probe 200A are the same as those of the ultrasonic probe 200 shown in fig. 1.
The circuit configuration of the ultrasonic probe 200A is the same as that of the ultrasonic probe 200 shown in fig. 3, after the temperature sensors 2303 and 2304 are added. The control unit 212 (fig. 3) of the present embodiment controls the power consumption of at least one of the pulser & switch unit 204, the AMP & ADC unit 206, the wireless communication unit 210, and the battery 220, based on the temperature measured by each temperature sensor 230. Other functions of the ultrasonic probe 200A are the same as those described with reference to fig. 3. Further, the ultrasonic diagnostic system 100 is constructed by the ultrasonic probe 200A and the terminal device (300).
Fig. 7 and 8 are schematic diagrams of an operation example of the ultrasonic probe 200A of fig. 6. Here, the operation similar to that of fig. 4 is omitted from the detailed description. For example, the operation flows shown in fig. 7 and 8 can be realized by a control program executed by the control section 212(CPU) of fig. 3. That is, fig. 7 and 8 are schematic diagrams of an example of a control method and a control program of the ultrasonic probe 200A. The operation flow shown in fig. 7 and 8 may be repeatedly executed at a predetermined cycle (for example, every second or every 100 msec) except for the case where the power supply of the ultrasonic probe 200A is cut off.
First, in step S40, the control section 212 (fig. 3) determines whether or not the temperature detected by the temperature sensor 2301 arranged in the vicinity of the sensor 202 exceeds the temperature threshold VT 5. Step S48 is executed when the temperature detected by the temperature sensor 2301 exceeds the temperature threshold VT5, and step S42 is executed when the temperature detected by the temperature sensor 2301 is equal to or less than the temperature threshold VT 5.
In step S42, the control section 212 determines whether or not the temperature detected by the temperature sensor 2302 arranged near the AMP & ADC section 206 exceeds the temperature threshold VT 6. Step S48 is executed when the temperature detected by the temperature sensor 2302 exceeds the temperature threshold VT6, and step S44 is executed when the temperature detected by the temperature sensor 2302 is equal to or less than the temperature threshold VT 6.
In step S44, the control unit 212 determines whether or not the temperature detected by the temperature sensor 2303 disposed in the vicinity of the wireless communication unit 210 exceeds the temperature threshold VT 7. The process proceeds to step S48 when the temperature detected by the temperature sensor 2303 exceeds the temperature threshold VT7, and proceeds to step S46 when the temperature detected by the temperature sensor 2303 is equal to or less than the temperature threshold VT 7.
In step S46, the control section 212 determines whether the temperature detected by the temperature sensor 2304 disposed near the battery 220 exceeds a temperature threshold VT 8. Step S48 is executed when the temperature detected by the temperature sensor 2304 exceeds the temperature threshold VT8, and step S50 of fig. 8 is executed when the temperature detected by the temperature sensor 2304 is equal to or less than the temperature threshold VT 8.
The temperature thresholds VT5-VT8 may be set higher than the temperature thresholds VT1-VT4 illustrated in connection with FIG. 8. The temperature threshold VT5-VT8 is a maximum temperature for each of the components mounted on the ultrasonic probe 200A to perform stable operation. The temperature thresholds VT5 to VT8 may be set to the same values as each other, or may be set to values based on the heat generation amount of each component. The temperature threshold VT5-VT8 is an example of the 2 nd temperature threshold.
In step S48, the control unit 212 may shut off the power supply to the ultrasonic probe 200A by, for example, stopping the output of electric power from the battery 220. Accordingly, the operation of the ultrasonic probe 200A can be stopped. In the case where one of the temperatures measured by the plurality of temperature sensors 230 exceeds one of the corresponding temperature thresholds VT5-VT8, the power supply is cut off, thereby preventing malfunction due to heat generation of the respective components.
The operations in steps S50 and S52 in fig. 8 are the same as those in steps S10 and S12 in fig. 4. In step S50, the control unit 212 executes step S58 when the temperature detected by the temperature sensor 2301 exceeds the temperature threshold VT1, and executes step S52 when the temperature detected by the temperature sensor 2301 is equal to or less than the temperature threshold VT 1. In step S52, the control unit 212 executes step S58 when the temperature detected by the temperature sensor 2302 exceeds the temperature threshold VT2, and executes step S54 when the temperature detected by the temperature sensor 2302 is equal to or less than the temperature threshold VT 2.
In step S54, the control section 212 determines whether or not the temperature detected by the temperature sensor 2303 arranged in the vicinity of the wireless communication section 210 exceeds the temperature threshold VT 3. The controller 212 executes step S58 when the temperature detected by the temperature sensor 2303 exceeds the temperature threshold VT3, and executes step S56 when the temperature detected by the temperature sensor 2303 is equal to or less than the temperature threshold VT 3.
In step S56, control unit 212 determines whether or not the temperature detected by temperature sensor 2304 disposed in the vicinity of battery 220 exceeds temperature threshold VT 4. The controller 212 executes step S58 when the temperature detected by the temperature sensor 2304 exceeds the temperature threshold VT4, and executes step S60 when the temperature detected by the temperature sensor 2304 is equal to or less than the temperature threshold VT 4.
The temperature thresholds VT1-VT4 may be set to the same value as each other, or may be set to different values, respectively. For example, the temperature threshold VT1 may be set lower than the other temperature thresholds VT2, VT3, VT4 as in embodiment 1.
In step S58, since one of the temperatures measured by the 4 temperature sensors 230 exceeds the temperature threshold set for each temperature sensor 230, the control unit 212 switches the operation mode of the ultrasonic probe 200A to one of the plurality of low power consumption operation modes. On the other hand, in step S60, the control unit 212 maintains the ultrasonic probe 200A in the normal operation mode or switches to the normal operation mode.
Fig. 9 and 10 are schematic diagrams of specific examples of the actions shown in fig. 8. The judgment of step S70 is the same as the judgment of step S56 of fig. 8, and the judgment of step S72 is the same as the judgment of step S50 of fig. 8. The determination of step S74 is the same as the determination of step S52 in fig. 8, and the determinations of steps S76 and S78 are the same as the determination of step S54 in fig. 8.
In step S70, when the temperature around the battery 220 measured by the temperature sensor 2304 exceeds the temperature threshold VT4, the control unit 212 executes step S80 regardless of the temperatures measured by the other temperature sensors 2301 and 2303. When the temperature measured by the temperature sensor 2304 is equal to or lower than the temperature threshold VT4, the control unit 212 executes step S72 w.
In step S72, control unit 212 executes step S88 of fig. 10 when the temperature around sensor 202 and pulser & switch unit 204 measured by temperature sensor 2301 exceeds temperature threshold VT 1. The control unit 212 executes step S74 when the temperatures around the sensor 202 and the pulser & switch unit 204 measured by the temperature sensor 2301 are both equal to or lower than the temperature threshold VT 1.
In step S74, the control unit 212 executes step S76 when the temperature around the AMP & ADC unit 206 measured by the temperature sensor 2302 exceeds the temperature threshold VT2, and executes step S74 when the temperature measured by the temperature sensor 2301 is equal to or less than the temperature threshold VT 2.
In step S76, the control unit 212 executes step S80 when the temperature around the wireless communication unit 210 measured by the temperature sensor 2303 exceeds the temperature threshold VT3, and executes step S82 when the temperature measured by the temperature sensor 2303 is equal to or less than the temperature threshold VT 3.
In step S78, the control unit 212 executes step S84 when the temperature measured by the temperature sensor 2303 exceeds the temperature threshold VT3, and executes step S86 when the temperature measured by the temperature sensor 2303 is equal to or less than the temperature threshold VT 3.
In step S80, the control unit 212 reduces the number of operation channels of the amplifier of the AMP & ADC unit 206 and lowers the frame rate of the ultrasound image data transmitted from the wireless communication unit 210 to the wireless communication unit 302 of the terminal device 300 (low power consumption operation mode 4). Accordingly, the power consumption of the AMP & ADC unit 206 and the wireless communication unit 210 can be reduced, and the temperature around the AMP & ADC unit 206 and the wireless communication unit 210 can be reduced.
When the frame rate is lowered, the frequency of transmission of ultrasonic waves by the sensor 202 is also lowered. In this case, the frequency of generation of pulses and the frequency of operation of the switch by the pulser & switch unit 204, the frequency of operation of the amplifier and the ADC by the AMP & ADC unit 206, and the frequency of generation of ultrasonic image data by the digital signal processing unit 208 are also reduced.
Therefore, the power consumption of the wireless communication unit 210 and the power consumption of the pulser & switch unit 204, AMP & ADC unit 206, and digital signal processing unit 208 can be reduced. In this case, the power consumption of the AMP & ADC unit 206 can be reduced by both the reduction of the number of operation channels and the reduction of the operation frequency. Therefore, the temperature around the pulser & switch unit 204, AMP & ADC unit 206, digital signal processing unit 208, and wireless communication unit 210 can be reduced.
In step S82, the control unit 212 reduces the number of operation channels of the amplifier of the AMP & ADC unit 206 (low power consumption operation mode 3).
In step S84, the control unit 212 lowers the frame rate of the ultrasound image data transmitted from the wireless communication unit 210 to the wireless communication unit 302 (low power consumption operation mode 2). As described above, by lowering the frame rate, not only the power consumption of the wireless communication section 210 but also the power consumption of the pulser & switch section 204, AMP & ADC section 206, and digital signal processing section 208 can be reduced. Therefore, in step S84, the temperature around the pulser & switch unit 204, AMP & ADC unit 206, digital signal processing unit 208, and wireless communication unit 210 can be lowered.
In step S86, the control unit 212 operates in the normal operation mode, and controls the operation of the circuits in the respective members of the ultrasonic probe 200, as in step S32 of fig. 5.
In step S88 of fig. 10, the control unit 212 executes step S90 when the temperature around the AMP & ADC unit 206 measured by the temperature sensor 2302 exceeds the temperature threshold VT 2. The control unit 212 executes step S92 when the temperature measured by the temperature sensor 2301 is equal to or less than the temperature threshold VT 2.
In step S90, the control unit 212 executes step S94 when the temperature around the wireless communication unit 210 measured by the temperature sensor 2303 exceeds the temperature threshold VT3, and executes step S96 when the temperature measured by the temperature sensor 2303 is equal to or less than the temperature threshold VT 3.
In step S92, the control unit 212 executes step S98 when the temperature measured by the temperature sensor 2303 exceeds the temperature threshold VT3, and executes step S100 when the temperature measured by the temperature sensor 2303 is equal to or less than the temperature threshold VT 3.
The operation of step S94 is the same as the operation of step S80 in fig. 9 (low power consumption operation mode 4). The operation of step S96 is the same as the operation of step S82 in fig. 9 (low power consumption operation mode 3). The operation of step S98 is the same as the operation of step S84 in fig. 9 (low power consumption operation mode 2).
In step S100, the control unit 212 controls the pulser voltage generation unit 214 to lower the pulser driving voltage of the pulser & switch unit 204 (low power consumption operation mode 1), similarly to step S28 of fig. 5. Accordingly, not only the power consumption of the pulser & switch unit 204 can be reduced, but also the heat generation of the sensor 202 can be suppressed, and the temperature around the pulser & switch unit 204 and the temperature around the sensor 202 can be reduced.
Fig. 11 is a schematic diagram of an example of an ultrasonic image IMG displayed on the display portion 308 of the terminal device 300 of fig. 3. For example, in fig. 11, the terminal device 300 is a tablet terminal. The ultrasonic image IMG of the subject generated by the digital signal processing unit 208 of the ultrasonic probe 200A is displayed in the image window 320 of the display unit 308. For example, the display portion 308 may be a liquid crystal display, an organic el (electro luminescence) display, or the like.
For example, a character string of "normal operation mode" which is the current operation mode can be displayed on the display window 322 of the operation mode in the display unit 308. For example, when the ultrasonic probe 200A enters the low power consumption operation mode, a character string of one of the "low power consumption operation mode 1", the "low power consumption operation mode 2", the "low power consumption operation mode 3", and the "low power consumption operation mode 4" can be displayed on the display window 322 in accordance with the mode. In addition, numbers, symbols, images, and the like indicating the type of the low power consumption operation mode may be displayed on the display window 322.
An indication window 324 in the display portion 308 can display the remaining amount (remaining capacity) of the battery 220. In the example of fig. 11, it is shown that the remaining amount of battery 220 is about 80%.
The above embodiment 2 can also obtain the same effects as those of the embodiment 1. For example, the power consumption of the components located near the temperature sensor 230 that detects a temperature exceeding the temperature threshold VT1-VT4 can be reduced, and the amount of heat generation can be suppressed. Accordingly, the surface temperatures of the respective portions of the case of the ultrasonic probe 200, which are different depending on the arrangement position of the heat generating components, can be set to be equal to or lower than the temperature threshold VT1-VT4, thereby preventing both the subject and the operator of the ultrasonic probe 200 from feeling uncomfortable.
In embodiment 2, when one of the temperatures measured by the plurality of temperature sensors 230 exceeds one of the corresponding temperature thresholds VT5 to VT8, the power supply is cut off, thereby preventing a failure due to heat generation of various components.
Further, the power consumption of the components located in the vicinity of the temperature sensor 230 that detects a temperature exceeding the temperature thresholds VT3 and VT4 can be reduced, and the amount of heat generation can be suppressed. At this time, when the measured temperatures of the plurality of temperature sensors 230 exceed the temperature threshold (one or more of VT1-VT 4), the power consumption amount can be finely adjusted by reducing the power consumption amounts of the plurality of components. Therefore, for example, the surface temperature of each part of the housing of the ultrasonic probe 200A can be set to a desired temperature while minimizing the deterioration of the image quality of the ultrasonic image.
Further, when the measured temperature of the temperature sensor 2304 disposed in the vicinity of the battery that supplies power to all the circuits exceeds the temperature threshold VT4, the power consumption of the plurality of components as a whole is reduced, so that the amount of heat generated by each component can be uniformly reduced, and the amount of heat generated by the battery 220 can be suppressed.
(embodiment 3)
Fig. 12 is a schematic view of the ultrasonic probe 200B according to embodiment 3. Here, the same elements as those in fig. 1 are given the same reference numerals, and detailed description thereof is omitted. The ultrasonic probe 200B of this embodiment has a temperature sensor 2302 arranged at a position close to or in contact with the amplifier in the AMP & ADC section 206 and a temperature sensor 2303 arranged at a position close to or in contact with the wireless communication section 210. The temperature sensor 2301 is not disposed at a position close to the pulser & switch unit 204. The other configurations of the ultrasonic probe 200B are the same as those of the ultrasonic probe 200 shown in fig. 1.
For example, the arrangement of the temperature sensors 2302, 2303 shown in fig. 12 is an example of the ultrasonic probe 200B in which the temperature of the distal end portion of the sensor 202 is known not to rise to such an extent that the subject feels uncomfortable. When the capacity of the battery 220 is large and the amount of heat generated by the battery 220 is large, the temperature sensor 2304 shown in fig. 6 may be disposed at a position close to or in contact with the battery 220.
The circuit configuration of the ultrasonic probe 200B is the same as that in fig. 3 in which the temperature sensor 2303 is disposed instead of the temperature sensor 2301. Further, the ultrasonic diagnostic system 100 is constructed by the ultrasonic probe 200B and the terminal device (300). In the temperature control (i.e., power consumption control) of each part of the ultrasonic probe 200B by the controller 212 (fig. 3) according to the present embodiment, steps S74, S76, S78, S80, S82, S84, and S86 in fig. 9 are executed. The temperature control of each part of the ultrasonic probe 200B can be realized by the control section 212(CPU) executing a control program.
The same effects as those of embodiment 1 can be obtained in embodiment 3 above. For example, by providing the temperature sensor 230 near a member that generates a larger amount of heat than other members, the surface temperature of each part of the housing of the ultrasonic probe 200B can be set to a desired temperature.
(embodiment 4)
Fig. 13 is a schematic view of the ultrasonic probe 200C according to embodiment 4. Here, the same elements as those in fig. 1 are given the same reference numerals, and detailed description thereof is omitted. The ultrasonic probe 200C of this embodiment includes 2 pulser & switch units 204(204a, 204b) and 2 temperature sensors 2301(2301a, 2301b) corresponding to the pulser & switch units 204. The ultrasonic probe 200C has the same configuration as the ultrasonic probe 200 shown in fig. 1 except for the pulser & switch unit 204 and the temperature sensor 2301. Each temperature sensor 2301 detects the temperature around the pulser & switch unit 204 corresponding thereto, and detects the temperature around the sensor 202.
When the ultrasonic probe 200C includes 2 pulser & switch units 204a and 204b, the amount of heat generated in each unit of the ultrasonic probe 200C can be controlled in more detail by providing the temperature sensors 2301a and 2301b corresponding to the respective pulser & switch units 204. This prevents the operator who holds and operates the ultrasonic probe 200C from feeling uncomfortable with the surface temperature of the case of the ultrasonic probe 200C.
The circuit configuration of the ultrasonic probe 200C is the same as that of the ultrasonic probe 200 shown in fig. 3 except that the pulser & switch unit 204 shown in fig. 3 is composed of 2 components and the temperature sensor 2301 is 2. Further, the ultrasonic diagnostic system 100 is constructed by the ultrasonic probe 200C and the terminal device (300).
The temperature control (i.e., power consumption control) of each part of the ultrasonic probe 200C by the control unit 212 (fig. 3) according to the present embodiment is the same as that of fig. 5. However, in step S20 of fig. 5, for example, when it is detected that the temperature of one of the pulser & switch units 204 exceeds the temperature threshold VT1, step S22 is executed. When it is detected that the temperatures of the pulser & switch units 204 are all equal to or lower than the temperature threshold VT1, step S24 is executed. The temperature control of each part of the ultrasonic probe 200C can be realized by the control section 212(CPU) executing a control program.
Note that, when the capacity of the battery 220 is large and the amount of heat generation of the battery 220 is large, the temperature sensor 2304 shown in fig. 6 may be disposed at a position close to or in contact with the battery 220. Further, when the amount of heat generation of the wireless communication section 210 is large, a temperature sensor 2303 shown in fig. 6 may be provided at a position close to or in contact with the wireless communication section 210. In this case, the same actions as those shown in fig. 9 and 10 are performed. In addition, in the case where other components such as the AMP & ADC unit 206 are configured by a plurality of components, a temperature sensor may be provided for each component.
The above embodiment 4 can also obtain the same effects as those of the embodiment 1. In embodiment 4, when the ultrasonic probe 200C includes a plurality of pulser & switch units 204, the amount of heat generated in each unit of the ultrasonic probe 200C can be controlled in more detail by disposing the temperature sensor 2301 for each pulser & switch unit 204.
(embodiment 5)
Fig. 14 is a schematic view of the ultrasonic probe 200D according to embodiment 5. Here, the same elements as those in fig. 1 and 13 are given the same reference numerals, and detailed description thereof is omitted. The ultrasonic probe 200D of this embodiment includes 4 pulser & switch units 204(204a, 204b, 204c, 204D) and 4 temperature sensors 2301(2301a, 2301b, 2301c, 2301D) corresponding to the pulser & switch units 204.
The pulser & switch units 204a and 204b and the temperature sensors 2301a and 2301b are disposed on the front surface side of the ultrasonic probe 200C. Pulser & switch sections 204C, 204d and temperature sensors 2301C, 2301d are disposed on the back side of the ultrasonic probe 200C. The ultrasonic probe 200D has the same configuration as the ultrasonic probe 200 shown in fig. 1 except for the pulser & switch unit 204 and the temperature sensor 2301. Each temperature sensor 2301 detects the temperature around the pulser & switch unit 204 corresponding thereto, and detects the temperature around the sensor 202.
In the same manner as in fig. 13, when the ultrasonic probe 200D includes a plurality of pulser & switch units 204, the amount of heat generated in each unit of the ultrasonic probe 200D can be controlled in more detail by arranging the temperature sensor 2301 in correspondence with each pulser & switch unit 204. This prevents the operator who holds and operates the ultrasonic probe 200D from feeling uncomfortable with the surface temperature of the case of the ultrasonic probe 200D.
The circuit configuration of the ultrasonic probe 200D is the same as that of the ultrasonic probe 200 shown in fig. 3 except that the pulser & switch unit 204 shown in fig. 3 is composed of a plurality of members and the temperature sensor 2301 is provided in plurality. Further, the ultrasonic diagnostic system 100 is constructed by the ultrasonic probe 200D and the terminal device (300).
The temperature control (i.e., power consumption control) of each part of the ultrasonic probe 200D by the control unit 212 (fig. 3) according to the present embodiment is the same as that of fig. 5. In step S20 in fig. 5, step S22 is executed when it is detected that the temperature of one of the pulser & switch units 204 exceeds the temperature threshold VT1, for example, as in the description given with reference to fig. 13. When it is detected that the temperatures of the pulser & switch units 204 are all equal to or lower than the temperature threshold VT1, step S24 is executed. The temperature control of each part of the ultrasonic probe 200D can be realized by the control section 212(CPU) executing a control program.
The above embodiment 5 can also obtain the same effects as those of the embodiments 1 and 4.
The present invention has been specifically described above with reference to the embodiments, but the present invention is not limited to the embodiments, and various modifications and changes can be made without departing from the scope of the present invention.
[ description of reference numerals ]
100 ultrasonic diagnostic system
200. 200A, 200B, 200C, 200D ultrasonic probe
202 sensor
204. 204a, 204b, 204c, 204d pulser & switch section
206 AMP & ADC section
208 digital signal processing part
210 wireless communication unit
212 control unit
214 pulser voltage generation section
220 cell
2301. 2301a, 2301b, 2301c and 2301d temperature sensors
2302. 2303 and 2304 temperature sensors
250 operating button
252 LED
300 terminal device
302 radio communication unit
304 CPU
306 memory
308 display part
320 image window
322 display window
324 indicating window
IMG ultrasonic image
P living body (subject).