CN114036721A - Method and device for constructing three-dimensional temperature cloud field of micro-module - Google Patents
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Abstract
The invention is suitable for the technical field of data centers, and provides a method and a device for constructing a three-dimensional temperature cloud field of a micromodule, wherein the method comprises the following steps: acquiring temperature information corresponding to at least three temperature monitoring points on the micro-module; constructing a three-dimensional micromodule model of the micromodule; determining the position coordinates of a plurality of interpolation points in a three-dimensional coordinate system of the model; for any interpolation point: selecting a plurality of known data points as first data points corresponding to the interpolation point based on the position coordinates of the interpolation point and the position coordinates of each known data point; calculating the temperature value of the interpolation point based on the temperature values of the first data points and the distances between each first data point and the interpolation point; and rendering the three-dimensional micromodule model according to the temperature values corresponding to the position coordinates to obtain a three-dimensional temperature cloud field of the micromodule. Through the scheme, the reliability of the three-dimensional temperature cloud field can be improved on the premise of ensuring the accuracy of data.
Description
Technical Field
The invention belongs to the technical field of data centers, and particularly relates to a method and a device for constructing a three-dimensional temperature cloud field of a micromodule.
Background
The micro module is generally used for storing IT equipment such as a server, core devices of 1T equipment such as the server are semiconductor devices, the heat productivity is large, and except a CPU, other processing chips of a computer, such as a bus, a memory, an I/0 and the like, are high heat productivity devices. With the continuous development of the refrigeration mode, the temperature data in the machine room is more and more difficult to master.
The conventional temperature data acquisition method is that a plurality of temperature sensors are arranged outside a cabinet, the temperature data of each point of the cabinet is acquired through the temperature sensors, and then a corresponding temperature cloud picture is drawn according to the temperature data, so that operation and maintenance personnel of a data center can quickly locate hot spots and cold spots according to the temperature cloud picture. The temperature cloud chart can only accurately display temperature data of a monitoring point outside the cabinet, but when the temperature outside the cabinet is higher, the higher heat source exists inside the cabinet, so that a generated temperature cloud field is unreliable.
Disclosure of Invention
In view of this, embodiments of the present invention provide a method and an apparatus for constructing a three-dimensional temperature cloud field of a micro module, so as to solve a problem that a temperature cloud field in the prior art cannot accurately and effectively represent a temperature of a cabinet.
The first aspect of the embodiment of the invention provides a method for constructing a three-dimensional temperature cloud field of a micromodule, which comprises the following steps:
acquiring temperature information corresponding to at least three temperature monitoring points on the micro-module; the temperature information comprises a temperature value and position data; each temperature monitoring point is respectively positioned at different directions of the micromodule;
constructing a three-dimensional micromodule model of the micromodule; converting the position data corresponding to each temperature monitoring point into a three-dimensional coordinate system where the three-dimensional micromodule model is located;
determining position coordinates of a plurality of interpolation points in the three-dimensional coordinate system;
for any interpolation point: selecting a plurality of known data points as first data points corresponding to the interpolation point based on the position coordinates of the interpolation point and the position coordinates of each known data point; calculating the temperature value of the interpolation point based on the temperature value of each first data point corresponding to the interpolation point and the distance between each first data point and the interpolation point; the known data points comprise temperature monitoring points and/or interpolation points of calculated temperature values;
rendering the three-dimensional micromodule model according to the temperature value corresponding to each position coordinate on the three-dimensional micromodule model to obtain the three-dimensional temperature cloud field of the micromodule.
A second aspect of the embodiments of the present invention provides a device for constructing a three-dimensional temperature cloud field of a micromodule, including:
the temperature information acquisition module is used for acquiring temperature information corresponding to at least three temperature monitoring points on the micromodule; the temperature information comprises a temperature value and position data; each temperature monitoring point is respectively positioned at different directions of the micromodule;
the model building module is used for building a three-dimensional micromodule model of the micromodule; converting the position data corresponding to each temperature monitoring point into a three-dimensional coordinate system where the three-dimensional micromodule model is located;
the interpolation point coordinate determination module is used for determining the position coordinates of a plurality of interpolation points in the three-dimensional coordinate system;
a temperature value calculation module for, for any interpolation point: selecting a plurality of known data points as first data points corresponding to the interpolation point based on the position coordinates of the interpolation point and the position coordinates of each known data point; calculating the temperature value of the interpolation point based on the temperature value of each first data point corresponding to the interpolation point and the distance between each first data point and the interpolation point; the known data points comprise temperature monitoring points and/or interpolation points of calculated temperature values;
and the temperature cloud field construction module is used for rendering the three-dimensional micro-module model according to the temperature values corresponding to the position coordinates on the three-dimensional micro-module model to obtain the three-dimensional temperature cloud field of the micro-module.
A third aspect of the embodiments of the present invention provides a terminal device, which includes a memory, a processor, and a computer program stored in the memory and executable on the processor, where the processor implements the steps of the method for constructing a three-dimensional temperature cloud field of a micro module as described above when executing the computer program.
A fourth aspect of the embodiments of the present invention provides a computer-readable storage medium, which stores a computer program that, when executed by a processor, implements the steps of the method for constructing a three-dimensional temperature cloud field of micromodules as described above.
Compared with the prior art, the embodiment of the invention has the following beneficial effects: the method comprises the steps of firstly obtaining temperature information corresponding to at least three temperature monitoring points on a micro-module; constructing a three-dimensional micromodule model of the micromodule; converting the position data corresponding to each temperature monitoring point into a three-dimensional coordinate system where the three-dimensional micromodule model is located; then determining the position coordinates of a plurality of interpolation points in the three-dimensional coordinate system; for any interpolation point: selecting a plurality of known data points as first data points corresponding to the interpolation point based on the position coordinates of the interpolation point and the position coordinates of each known data point; calculating the temperature value of the interpolation point based on the temperature value of each first data point corresponding to the interpolation point and the distance between each first data point and the interpolation point; and finally, rendering the three-dimensional micromodule model according to the temperature values corresponding to the position coordinates on the three-dimensional micromodule model to obtain the three-dimensional temperature cloud field of the micromodule. Through the scheme, the numerical value of each interpolation point can be accurately obtained based on the temperature data and the distance of a plurality of known data points around the interpolation point, so that the reliability of the three-dimensional temperature cloud field is improved on the premise of ensuring the accuracy of the three-dimensional temperature cloud field data.
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In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a schematic flow chart of a method for constructing a three-dimensional temperature cloud field of a micro module according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of interpolation point selection according to an embodiment of the present invention;
FIG. 3 is a schematic view of a temperature cloud field provided by an embodiment of the present invention;
FIG. 4 is a schematic diagram of an apparatus for constructing a three-dimensional temperature cloud field of micro-modules according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a terminal device according to an embodiment of the present invention.
Detailed Description
In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.
In order to explain the technical means of the present invention, the following description will be given by way of specific examples.
In an embodiment, as shown in fig. 1, fig. 1 shows an implementation flow of a method for constructing a three-dimensional temperature cloud field of a micro module provided in this embodiment, an execution subject of the method is a terminal device, and a process thereof is detailed as follows:
s101: acquiring temperature information corresponding to at least three temperature monitoring points on the micro-module; the temperature information comprises a temperature value and position data; each temperature monitoring point is respectively positioned at different directions of the micromodule.
In this embodiment, a plurality of temperature sensors are uniformly arranged on the micromodule, and the temperature information of each part of the micromodule is acquired through the temperature sensors. The temperature information includes temperature values and location data.
Specifically, the staff can be at the cold passageway that every rack corresponds, hot passageway respectively vertical even N temperature sensor that sets up to top, the lateral part of rack set up at least one temperature sensor. Temperature sensors can be arranged at the parts with the highest temperature and the parts with the lowest temperature of the cabinets respectively. Exemplarily, N-5.
In one possible embodiment, the actual power at the selected location of each temperature monitoring point is greater than a preset power threshold.
Specifically, the temperature monitoring points may be disposed at locations on the micromodule where power is high, or at least one temperature monitoring point may be disposed in an area where work is intensive. The actual power of each part of the micromodule can be obtained by a monitoring system.
S102: constructing a three-dimensional micromodule model of the micromodule; and converting the position data corresponding to each temperature monitoring point into a three-dimensional coordinate system where the three-dimensional micromodule model is located.
Specifically, a browser in the terminal device needs to support a Threejs environment, a corresponding 3D rendering environment is created in the Threejs environment, and a mouse operation controller OrbitControls is injected. The method comprises the steps that the number and types of cabinets input into a micro-module by a user are loaded on the basis of Threejs, basic three-dimensional models of single-row cabinets of corresponding types are loaded, the corresponding position of each cabinet model is calculated, and finally the basic three-dimensional models of the cabinets of corresponding numbers are spliced into an integral three-dimensional micro-module model.
The process of modeling the cabinet is specifically as follows:
firstly, modeling a basic module of a single-row cabinet, after model loading is completed, returning cabinet data configured by a current user by a terminal equipment analysis background, dividing a micro-module cabinet into a front row and a rear row, wherein the terminal equipment only needs to calculate the specific position of any one row (such as the rear row), and the position of the other row can be determined; because the current cabinet model is two columns of unified models, the cabinet number data subscript starts from 0, the cabinets with subscript numbers of even numbers are in the back row, and the cabinets with subscript numbers of odd numbers are in the front row. Then, a new object model group is created, background data is traversed circularly, user configuration data (such as cabinet names, cabinet types and the like) returned by a background are stored in a corresponding single-column cabinet basic cube model, the types of cabinets (a common cabinet width full cabinet 64 and an air conditioner cabinet width half cabinet 34) are distinguished and judged according to the fixed width of the cube model, the width of the cube model is multiplied by the subscript number traversed currently and used as the X-axis position (Y-axis and Z-axis default is 0) of the cabinet model in a scene, the X-axis position and the subscript number are added to the created object model group so as to be used as a data change basis when data change occurs, and finally the object model group is added to the scene to complete rendering of the basic model of the 3D micro module.
S103: and determining the position coordinates of a plurality of interpolation points in the three-dimensional coordinate system.
In one embodiment, the specific implementation flow of S103 includes:
and determining the position coordinates of a plurality of interpolation points in the three-dimensional coordinate system according to a preset unit step length and the coordinate range of the three-dimensional micromodule model in the three-dimensional coordinate system.
As a selection mode of an interpolation point, after the three-dimensional micromodule model is established, the terminal device can acquire a unit step length determined by a user according to a coordinate range of the three-dimensional micromodule model in a coordinate system, and store the preset unit step length, wherein the preset unit step length is a unit in the three-dimensional coordinate system; and then dividing a plurality of data points on the three-dimensional micromodule model according to a preset unit step length. For example, data points of the three-dimensional micromodule model can be determined in x, y and z axes by using 1 as a unit step, and the position coordinates of each interpolation point can be determined by using the data point corresponding to the temperature monitoring point as a known data point and using other points as interpolation points.
In one embodiment, as an alternative to S103 described above, S103 may also be implemented by:
s201: acquiring size information of the micromodule;
s202: acquiring the actual distance between a first interpolation point and a mark point of the micromodule; the first interpolation point is any interpolation point;
s203: and determining the position coordinate of the first interpolation point based on the position coordinate of the mark point of the micromodule, the actual distance between the first interpolation point and the mark point of the micromodule and the proportional relation between the micromodule and the three-dimensional micromodule model.
As another implementation manner of interpolation point selection, the present embodiment may automatically calculate the position coordinates of each interpolation point according to the size information of the actual micromodule. Specifically, when a user establishes a three-dimensional micromodule model, the user can firstly determine the actual position of each interpolation point, and the terminal device determines the actual distance and the relative angle between each interpolation point and the mark point according to the actual position of each interpolation point and the actual position of the mark point of the micromodule.
In particular, the landmark points may be any corner point of the micromodule.
In practical applications, the terminal device may determine the position coordinates of the interpolation point by using any of the above methods. The position coordinates of the interpolation points can be determined by adopting a mixed mode of two methods, for example, the position coordinates of common interpolation points are determined by adopting a preset unit step length so as to ensure the comprehensiveness of a three-dimensional temperature cloud field; the method of S201-S203 is adopted to determine the position coordinates of some important specific points on the micromodule, which are inconvenient for installing the temperature sensor, so as to ensure that the specific points are accurate and can be checked.
S104: for any interpolation point: selecting a plurality of known data points as first data points corresponding to the interpolation point based on the position coordinates of the interpolation point and the position coordinates of each known data point; calculating the temperature value of the interpolation point based on the temperature value of each first data point corresponding to the interpolation point and the distance between each first data point and the interpolation point; the known data points include temperature monitoring points and/or interpolation points at which temperature values have been calculated.
In one embodiment, the acquiring process of the first data point in S104 specifically includes:
sequencing all known data points according to the sequence from near to far away from the interpolation point to obtain a distance sequence corresponding to the interpolation point;
and selecting the first N known data points in the distance sequence as the first data points corresponding to the interpolation point.
In one embodiment, another implementation manner of the first data point acquiring process in S104 includes:
the method comprises the following steps: calculating the distance between the interpolation point and each known data point based on the position coordinates of the interpolation point and the position coordinates of each known data point; taking a known data point with the distance from the interpolation point greater than a preset distance threshold value as a second data point corresponding to the interpolation point;
step two: taking a second data point closest to the interpolation point as a first data point corresponding to the interpolation point;
step three: outputting a current first data point corresponding to the interpolation point;
step four: calculating a target included angle A between the current first data point and the second data point corresponding to the interpolation pointoXAkWherein X represents an interpolation point; a. theoA current first data point representing an interpolated point X; a. thekRepresenting a second data point except the current first data point corresponding to the interpolation point X;
step five: taking the current first data point as a starting point, selecting a first second data point which meets the preset included angle condition and corresponds to the interpolation point according to a preset rotation direction to replace the current first data point, and repeating the third step to the fifth step until M first data points of the interpolation point are obtained; the preset included angle condition is that the target included angle is larger than a preset angle threshold value.
Specifically, the preset rotation angle includes a clockwise rotation angle and a counterclockwise rotation angle.
In the present embodiment, as shown in fig. 3, the interpolation points are white points X and the black points are known data points in fig. 2, and first, the second data points of the interpolation points X are a1 to a5 according to the distance from each known data point to the interpolation point. Then, through the above selection rule, when a4 is used as the current first data point and the next first data point is selected by clockwise rotation, the angle between a5 and a4 is slightly different, so that the point a5 is abandoned, and the first data points of the interpolation point X are a1 to a 4.
In this embodiment, if the first data point obtained by one rotation (from the second data point closest to the interpolation point X to the return thereof) is smaller than M, the temperature value of the interpolation point X is calculated using the temperature value of the first data point obtained by one rotation.
In this embodiment, the selected first data points can be uniformly dispersed in different directions of the interpolation point by the above method, so as to improve the calculation accuracy of the interpolation point.
In an embodiment, the temperature value calculating process of S104 specifically includes:
based on the formula
Obtaining a temperature value of the interpolation point j;
wherein, tiTemperature value, d, representing a known data point iijRepresents the distance, T, between the known data point i and the interpolated point jjRepresenting the temperature value at the interpolation point j.
S105: rendering the three-dimensional micromodule model according to the temperature value corresponding to each position coordinate on the three-dimensional micromodule model to obtain the three-dimensional temperature cloud field of the micromodule.
In this embodiment, after the temperature value of each data point is obtained, the three-dimensional micro-module model is rendered according to the temperature value of each position coordinate and the corresponding color, so as to obtain a three-dimensional temperature cloud field, as shown in fig. 3.
As can be seen from the above embodiments, in this embodiment, first, temperature information corresponding to at least three temperature monitoring points on the micro module is obtained; constructing a three-dimensional micromodule model of the micromodule; converting the position data corresponding to each temperature monitoring point into a three-dimensional coordinate system where the three-dimensional micromodule model is located; then determining the position coordinates of a plurality of interpolation points in the three-dimensional coordinate system; for any interpolation point: selecting a plurality of known data points as first data points corresponding to the interpolation point based on the position coordinates of the interpolation point and the position coordinates of each known data point; calculating the temperature value of the interpolation point based on the temperature value of each first data point corresponding to the interpolation point and the distance between each first data point and the interpolation point; and finally, rendering the three-dimensional micromodule model according to the temperature values corresponding to the position coordinates on the three-dimensional micromodule model to obtain the three-dimensional temperature cloud field of the micromodule. Through the scheme, the temperature data and the distance of a plurality of known data points around the interpolation point can be accurately based on the numerical values of the interpolation points, so that the temperature data of all parts on the micromodule can be obtained, the comprehensive accuracy of the three-dimensional temperature cloud field is improved, the temperature condition inside the micromodule can be reliably and effectively reflected by the three-dimensional temperature cloud field, meanwhile, the temperature value of the interpolation point can be accurately obtained by the embodiment, the comprehensive and accurate establishment of the three-dimensional temperature cloud field can be realized by arranging fewer temperature sensors, and the effect of reducing the construction cost of the temperature cloud field is realized.
It should be understood that, the sequence numbers of the steps in the foregoing embodiments do not imply an execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.
In an embodiment, as shown in fig. 4, fig. 4 shows a structure of a building apparatus 100 of a three-dimensional temperature cloud field of micromodules provided by the embodiment, which includes:
the temperature information acquisition module 110 is used for acquiring temperature information corresponding to at least three temperature monitoring points on the micromodule; the temperature information comprises a temperature value and position data; each temperature monitoring point is respectively positioned at different directions of the micromodule;
a model construction module 120 for constructing a three-dimensional micromodule model of the micromodule; converting the position data corresponding to each temperature monitoring point into a three-dimensional coordinate system where the three-dimensional micromodule model is located;
an interpolation point coordinate determination module 130, configured to determine position coordinates of a plurality of interpolation points in the three-dimensional coordinate system;
a temperature value calculation module 140, configured to, for any interpolation point: selecting a plurality of known data points as first data points corresponding to the interpolation point based on the position coordinates of the interpolation point and the position coordinates of each known data point; calculating the temperature value of the interpolation point based on the temperature value of each first data point corresponding to the interpolation point and the distance between each first data point and the interpolation point; the known data points comprise temperature monitoring points and/or interpolation points of calculated temperature values;
and the temperature cloud field construction module 150 is configured to render the three-dimensional micro-module model according to the temperature values corresponding to the position coordinates on the three-dimensional micro-module model, so as to obtain the three-dimensional temperature cloud field of the micro-module.
In one embodiment, the temperature value calculation module 140 includes:
based on the formula
Obtaining a temperature value of the interpolation point j;
wherein, tiTemperature value, d, representing a known data point iijRepresents the distance, T, between the known data point i and the interpolated point jjRepresenting the temperature value at the interpolation point j.
In one embodiment, the temperature value calculation module 140 includes:
the distance sequence acquisition unit is used for sequencing all the known data points according to the sequence from the near to the far away from the interpolation point to obtain a distance sequence corresponding to the interpolation point;
and the first data point selecting unit is used for selecting the first N known data points in the distance sequence as the first data points corresponding to the interpolation point.
In one embodiment, the temperature value calculation module 140 is specifically configured to:
the method comprises the following steps: calculating the distance between the interpolation point and each known data point based on the position coordinates of the interpolation point and the position coordinates of each known data point; taking a known data point with the distance from the interpolation point greater than a preset distance threshold value as a second data point corresponding to the interpolation point;
step two: taking a second data point closest to the interpolation point as a first data point corresponding to the interpolation point;
step three: outputting a current first data point corresponding to the interpolation point;
step four: calculating a target included angle A between the current first data point and the second data point corresponding to the interpolation pointoXAkWherein X represents an interpolation point; a. theoA current first data point representing an interpolated point X; a. thekRepresenting a second data point except the current first data point corresponding to the interpolation point X;
step five: taking the current first data point as a starting point, selecting a first second data point which meets the preset included angle condition and corresponds to the interpolation point according to a preset rotation direction to replace the current first data point, and repeating the third step to the fifth step until M first data points of the interpolation point are obtained; the preset included angle condition is that the target included angle is larger than a preset angle threshold value.
In one embodiment, the interpolation point coordinate determination module 130 includes:
and determining the position coordinates of a plurality of interpolation points in the three-dimensional coordinate system according to a preset unit step length and the coordinate range of the three-dimensional micromodule model in the three-dimensional coordinate system.
In one embodiment, the interpolation point coordinate determination module 130 includes:
acquiring size information of the micromodule;
acquiring the actual distance between a first interpolation point and a mark point of the micromodule; the first interpolation point is any interpolation point;
and determining the position coordinate of the first interpolation point based on the position coordinate of the mark point of the micromodule, the actual distance between the first interpolation point and the mark point of the micromodule and the proportional relation between the micromodule and the three-dimensional micromodule model.
In one embodiment, the actual power at the selected location of each temperature monitoring point is greater than a preset power threshold.
It can be known from the above embodiments that, in the present embodiment, the numerical value of each interpolation point can be accurately obtained based on the temperature data and the distance of a plurality of known data points around the interpolation point, so that the temperature data of all the positions on the micromodule are obtained, and the overall accuracy of the three-dimensional temperature cloud field is improved.
Fig. 5 is a schematic diagram of a terminal device according to an embodiment of the present invention. As shown in fig. 5, the terminal device 5 of this embodiment includes: a processor 50, a memory 51 and a computer program 52 stored in said memory 51 and executable on said processor 50. The processor 50, when executing the computer program 52, implements the steps in the above-described method embodiment of constructing a three-dimensional temperature cloud field of each micromodule, such as the steps 101 to 105 shown in fig. 1. Alternatively, the processor 50, when executing the computer program 52, implements the functions of the modules/units in the above-mentioned device embodiments, such as the functions of the modules 110 to 150 shown in fig. 4.
The computer program 52 may be divided into one or more modules/units, which are stored in the memory 51 and executed by the processor 50 to accomplish the present invention. The one or more modules/units may be a series of computer program instruction segments capable of performing specific functions, which are used to describe the execution process of the computer program 52 in the terminal device 5.
The terminal device 5 may be a desktop computer, a notebook, a palm computer, a cloud server, or other computing devices. The terminal device may include, but is not limited to, a processor 50, a memory 51. Those skilled in the art will appreciate that fig. 5 is merely an example of a terminal device 5 and does not constitute a limitation of terminal device 5 and may include more or fewer components than shown, or some components may be combined, or different components, e.g., the terminal device may also include input-output devices, network access devices, buses, etc.
The Processor 50 may be a Central Processing Unit (CPU), other general purpose Processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other Programmable logic device, discrete Gate or transistor logic, discrete hardware components, etc. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.
The memory 51 may be an internal storage unit of the terminal device 5, such as a hard disk or a memory of the terminal device 5. The memory 51 may also be an external storage device of the terminal device 5, such as a plug-in hard disk, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash memory Card (Flash Card), and the like, which are provided on the terminal device 5. Further, the memory 51 may also include both an internal storage unit and an external storage device of the terminal device 5. The memory 51 is used for storing the computer program and other programs and data required by the terminal device. The memory 51 may also be used to temporarily store data that has been output or is to be output.
It will be apparent to those skilled in the art that, for convenience and brevity of description, only the above-mentioned division of the functional units and modules is illustrated, and in practical applications, the above-mentioned function distribution may be performed by different functional units and modules according to needs, that is, the internal structure of the apparatus is divided into different functional units or modules to perform all or part of the above-mentioned functions. Each functional unit and module in the embodiments may be integrated in one processing unit, or each unit may exist alone physically, or two or more units are integrated in one unit, and the integrated unit may be implemented in a form of hardware, or in a form of software functional unit. In addition, specific names of the functional units and modules are only for convenience of distinguishing from each other, and are not used for limiting the protection scope of the present application. The specific working processes of the units and modules in the system may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and reference may be made to the related descriptions of other embodiments for parts that are not described or illustrated in a certain embodiment.
Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.
In the embodiments provided in the present invention, it should be understood that the disclosed apparatus/terminal device and method may be implemented in other ways. For example, the above-described embodiments of the apparatus/terminal device are merely illustrative, and for example, the division of the modules or units is only one logical division, and there may be other divisions when actually implemented, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.
The integrated modules/units, if implemented in the form of software functional units and sold or used as separate products, may be stored in a computer readable storage medium. Based on such understanding, all or part of the flow of the method according to the embodiments of the present invention may also be implemented by a computer program, which may be stored in a computer-readable storage medium, and when the computer program is executed by a processor, the steps of the method embodiments may be implemented. Wherein the computer program comprises computer program code, which may be in the form of source code, object code, an executable file or some intermediate form, etc. The computer-readable medium may include: any entity or device capable of carrying the computer program code, recording medium, usb disk, removable hard disk, magnetic disk, optical disk, computer Memory, Read-Only Memory (ROM), Random Access Memory (RAM), electrical carrier wave signals, telecommunications signals, software distribution medium, and the like. It should be noted that the computer readable medium may contain content that is subject to appropriate increase or decrease as required by legislation and patent practice in jurisdictions, for example, in some jurisdictions, computer readable media does not include electrical carrier signals and telecommunications signals as is required by legislation and patent practice.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.
Claims (10)
1. A method for constructing a three-dimensional temperature cloud field of a micromodule is characterized by comprising the following steps:
acquiring temperature information corresponding to at least three temperature monitoring points on the micro-module; the temperature information comprises a temperature value and position data; each temperature monitoring point is respectively positioned at different directions of the micromodule;
constructing a three-dimensional micromodule model of the micromodule; converting the position data corresponding to each temperature monitoring point into a three-dimensional coordinate system where the three-dimensional micromodule model is located;
determining position coordinates of a plurality of interpolation points in the three-dimensional coordinate system;
for any interpolation point: selecting a plurality of known data points as first data points corresponding to the interpolation point based on the position coordinates of the interpolation point and the position coordinates of each known data point; calculating the temperature value of the interpolation point based on the temperature value of each first data point corresponding to the interpolation point and the distance between each first data point and the interpolation point; the known data points comprise temperature monitoring points and/or interpolation points of calculated temperature values;
rendering the three-dimensional micromodule model according to the temperature value corresponding to each position coordinate on the three-dimensional micromodule model to obtain the three-dimensional temperature cloud field of the micromodule.
2. The method of claim 1, wherein the calculating the temperature value of the interpolation point based on the temperature value of each first data point corresponding to the interpolation point and the distance between each first data point and the interpolation point comprises:
based on the formula
Obtaining a temperature value of the interpolation point j;
wherein, tiTemperature value, d, representing a known data point iijRepresents the distance, T, between the known data point i and the interpolated point jjRepresenting the temperature value at the interpolation point j.
3. The method of claim 1, wherein selecting a plurality of known data points as the first data point corresponding to the interpolation point based on the distance between each known data point and the interpolation point comprises:
sequencing all known data points according to the sequence from near to far away from the interpolation point to obtain a distance sequence corresponding to the interpolation point;
and selecting the first N known data points in the distance sequence as the first data points corresponding to the interpolation point.
4. The method for constructing a three-dimensional temperature cloud field of a micro-module according to claim 1, wherein the selecting a plurality of known data points as the first data point corresponding to the interpolation point based on the position coordinates of the interpolation point and the position coordinates of each known data point comprises:
the method comprises the following steps: calculating the distance between the interpolation point and each known data point based on the position coordinates of the interpolation point and the position coordinates of each known data point; taking a known data point with the distance from the interpolation point greater than a preset distance threshold value as a second data point corresponding to the interpolation point;
step two: taking a second data point closest to the interpolation point as a first data point corresponding to the interpolation point;
step three: outputting a current first data point corresponding to the interpolation point;
step four: calculating a target included angle A between the current first data point and the second data point corresponding to the interpolation pointoXAkWherein X represents an interpolation point; a. theoA current first data point representing an interpolated point X; a. thekRepresenting a second data point except the current first data point corresponding to the interpolation point X;
step five: taking the current first data point as a starting point, selecting a first second data point which meets the preset included angle condition and corresponds to the interpolation point according to a preset rotation direction to replace the current first data point, and repeating the third step to the fifth step until M first data points of the interpolation point are obtained; the preset included angle condition is that the target included angle is larger than a preset angle threshold value.
5. The method of claim 1, wherein determining the coordinates of the locations of the plurality of interpolation points in the three-dimensional coordinate system comprises:
and determining the position coordinates of a plurality of interpolation points in the three-dimensional coordinate system according to a preset unit step length and the coordinate range of the three-dimensional micromodule model in the three-dimensional coordinate system.
6. The method of claim 1, wherein determining the coordinates of the locations of the plurality of interpolation points in the three-dimensional coordinate system comprises:
acquiring size information of the micromodule;
acquiring the actual distance between a first interpolation point and a mark point of the micromodule; the first interpolation point is any interpolation point;
and determining the position coordinate of the first interpolation point based on the position coordinate of the mark point of the micromodule, the actual distance between the first interpolation point and the mark point of the micromodule and the proportional relation between the micromodule and the three-dimensional micromodule model.
7. The method for constructing a three-dimensional temperature cloud field of micromodules according to claim 1, wherein the actual power of the selected position of each temperature monitoring point is greater than a preset power threshold.
8. A device for constructing a three-dimensional temperature cloud field of micromodules, comprising:
the temperature information acquisition module is used for acquiring temperature information corresponding to at least three temperature monitoring points on the micromodule; the temperature information comprises a temperature value and position data; each temperature monitoring point is respectively positioned at different directions of the micromodule;
the model building module is used for building a three-dimensional micromodule model of the micromodule; converting the position data corresponding to each temperature monitoring point into a three-dimensional coordinate system where the three-dimensional micromodule model is located;
the interpolation point coordinate determination module is used for determining the position coordinates of a plurality of interpolation points in the three-dimensional coordinate system;
a temperature value calculation module for, for any interpolation point: selecting a plurality of known data points as first data points corresponding to the interpolation point based on the position coordinates of the interpolation point and the position coordinates of each known data point; calculating the temperature value of the interpolation point based on the temperature value of each first data point corresponding to the interpolation point and the distance between each first data point and the interpolation point; the known data points comprise temperature monitoring points and/or interpolation points of calculated temperature values;
and the temperature cloud field construction module is used for rendering the three-dimensional micro-module model according to the temperature values corresponding to the position coordinates on the three-dimensional micro-module model to obtain the three-dimensional temperature cloud field of the micro-module.
9. A terminal device comprising a memory, a processor and a computer program stored in the memory and executable on the processor, characterized in that the processor implements the steps of the method according to any of claims 1 to 7 when executing the computer program.
10. A computer-readable storage medium, in which a computer program is stored which, when being executed by a processor, carries out the steps of the method according to any one of claims 1 to 7.
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| CN116933460A (en) * | 2023-09-15 | 2023-10-24 | 北京适创科技有限公司 | Simulation method and device and electronic equipment |
| CN116933460B (en) * | 2023-09-15 | 2023-12-15 | 北京适创科技有限公司 | Simulation method and device and electronic equipment |
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