CN114035704B - Circuit board structure, backlight module, display module and touch display module - Google Patents
Circuit board structure, backlight module, display module and touch display module Download PDFInfo
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- CN114035704B CN114035704B CN202111305158.6A CN202111305158A CN114035704B CN 114035704 B CN114035704 B CN 114035704B CN 202111305158 A CN202111305158 A CN 202111305158A CN 114035704 B CN114035704 B CN 114035704B
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- flexible circuit
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- circuit
- display module
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- 238000005452 bending Methods 0.000 claims abstract description 48
- 239000012790 adhesive layer Substances 0.000 claims description 25
- 239000010410 layer Substances 0.000 claims description 14
- 239000003351 stiffener Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 3
- 230000000007 visual effect Effects 0.000 abstract description 8
- 238000010030 laminating Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 13
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
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- 238000004891 communication Methods 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
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- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000002262 irrigation Effects 0.000 description 1
- 238000003973 irrigation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000011664 nicotinic acid Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
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- 239000000243 solution Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application relates to the technical field of display, and this application embodiment provides a circuit board structure, backlight unit, display module assembly and touch-control display module assembly, and the circuit board structure includes flexible circuit board, first circuit hard board and second circuit hard board, and flexible circuit board includes laminating portion and kink. Because the orthographic projection of the first circuit hard board on the flexible circuit board covers the attaching part and covers at least part of the area of the bending part, the orthographic projection of the second circuit hard board on the flexible circuit board coincides with the attaching part, when the bending part of the flexible circuit board bends towards the second circuit hard board, the bending range of the bending part is increased, and the bending part is at least partially positioned under the first circuit hard board, the visual range of a visual area is ensured, and the space is saved.
Description
Technical Field
The application relates to the technical field of display, in particular to a circuit board structure, a backlight module, a display module and a touch display module.
Background
In the related art, a flexible circuit board is arranged between two circuit hard boards for pressing. But when it is applied to a display module, the visible range of the visible region is reduced because there is a bent portion of the flexible circuit board under the visible region of the display module.
Disclosure of Invention
Based on the above, it is necessary to provide a circuit board structure, a backlight module, a display module and a touch display module to ensure the visual range of the visual area.
According to one aspect of the present application, an embodiment of the present application provides a circuit board structure, including:
the flexible circuit board comprises a bonding part and a bending part connected with the bonding part, and the flexible circuit board is provided with a first surface and a second surface which are oppositely arranged;
the first circuit hard board is arranged on the first surface of the flexible circuit board, and orthographic projection of the first circuit hard board on the flexible circuit board covers the attaching part and at least part of the area of the bending part; and
the second circuit hard board is arranged on the second surface of the flexible circuit board, and orthographic projection of the second circuit hard board on the flexible circuit board coincides with the attaching part.
In one embodiment, the circuit board structure further includes a first adhesive layer disposed between the first circuit stiffener and the flexible circuit board;
orthographic projection of the first adhesive layer on the flexible circuit board falls into the range of the attaching part.
In one embodiment, the orthographic projection of the first adhesive layer on the flexible circuit board coincides with the attaching portion.
In one embodiment, the circuit board structure further includes a second adhesive layer disposed between the second circuit stiffener and the flexible circuit board;
orthographic projection of the second adhesive layer on the flexible circuit board falls into the range of the attaching part.
In one embodiment, the orthographic projection of the second adhesive layer on the flexible circuit board coincides with the attaching portion.
In one embodiment, along the arrangement direction of the attaching part and the bending part, the front projection outline of the first circuit hard board on the flexible circuit board is provided with a first side edge positioned in the range of the bending part; the second circuit hard board is provided with a second side edge close to the bending part, and the second circuit hard board is provided with a front projection outer contour on the flexible circuit board;
the first side edge and the second side edge are provided with a preset distance.
In one embodiment, the predetermined distance is greater than 0.3 millimeters.
In one embodiment, the first circuit stiffener is a Mini-LED backlight substrate.
According to another aspect of the present application, an embodiment of the present application provides a backlight module, including a chip and the circuit board structure described above;
the chip is connected with the first circuit hard board.
In one embodiment, the chip is a Mini-LED chip.
According to still another aspect of the present application, an embodiment of the present application provides a display module, including the above-mentioned backlight module.
According to still another aspect of the present application, an embodiment of the present application provides a touch display module, including:
the display module is used for displaying the display module; and
the touch control module is coupled to one side of the display module.
Above-mentioned circuit board structure, backlight unit, display module assembly and touch-control display module assembly, circuit board structure includes flexible circuit board, first circuit hard board and second circuit hard board, and flexible circuit board includes laminating portion and kink. Because the orthographic projection of the first circuit hard board on the flexible circuit board covers the attaching part and covers at least part of the area of the bending part, the orthographic projection of the second circuit hard board on the flexible circuit board coincides with the attaching part, when the bending part of the flexible circuit board bends towards the second circuit hard board, the bending range of the bending part is increased, and the bending part is at least partially positioned under the first circuit hard board, the visual range of a visual area is ensured, and the space is saved.
Drawings
FIG. 1 is a schematic diagram of a circuit board structure according to an embodiment of the related art;
FIG. 2 is a schematic diagram of a circuit board structure according to another embodiment of the related art;
FIG. 3 is a schematic diagram of a circuit board structure according to another embodiment of the related art;
FIG. 4 is a schematic structural diagram of a touch display module according to an embodiment of the related art;
FIG. 5 is a schematic diagram of a touch display module according to another embodiment of the related art;
FIG. 6 is a schematic diagram of a circuit board structure according to an embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of a touch display module according to an embodiment of the disclosure.
Reference numerals simply denote:
10: circuit board structure 100: circuit hard board
101: first circuit stiffener 1011: irrigation hole
102: the second circuit hard board 1021: circuit wiring layer
200: flexible circuit board 210: bonding part
220: bending portion 201: a first surface
202: second surface 300: connector with a plurality of connectors
20: chip 30: driving chip
40: touch module 50: cover plate
60: frame body
a: first glue layer b: second adhesive layer
c: protective layer
x: arrangement direction s1: first side end
s2: second side end d: preset distance
N: non-visible region
Detailed Description
In order to make the above objects, features and advantages of the present application more comprehensible, a detailed description of embodiments accompanied with figures is provided below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of embodiments of the present application. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application. The embodiments of the present application may be implemented in many other ways than those described herein, and similar modifications may be made by those skilled in the art without departing from the spirit of the invention, so that the embodiments of the present application are not limited to the specific embodiments disclosed below.
It will be appreciated that the terms "first," "second," and the like, as used herein, may be used to describe various terms, and are not to be interpreted as indicating or implying a relative importance or an implicit indication of the number of technical features being indicated. However, unless specifically stated otherwise, these terms are not limited by these terms. These terms are only used to distinguish one term from another. For example, the first conformable member and the second conformable member are different conformable members without departing from the scope of the present application. In the description of the embodiments of the present application, the meaning of "a plurality", "a number" or "a plurality" is at least two, such as two, three, etc., unless explicitly defined otherwise.
In the description of the embodiments of the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured" and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to the specific circumstances.
In the description of embodiments of the present application, unless explicitly specified and limited otherwise, a first feature "up" or "down" on a second feature may be that the first and second features are in direct contact, or that the first and second features are in indirect contact via an intermediary. Moreover, a first feature being "above," "over" and "on" a second feature may be that the first feature is directly above or obliquely above the second feature, or simply indicates that the first feature level is higher than the second feature level. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely under the second feature, or simply indicating that the first feature level is less than the second feature level.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
In order to facilitate understanding of the technical solutions of the embodiments of the present application, before describing the specific implementation manner of the embodiments of the present application, some technical terms in the technical field to which the embodiments of the present application belong will be first briefly described.
Mini-LEDs/Micro-LEDs, i.e., LED miniaturization and matrixing, refer to the integration of high density, micro-sized LED arrays on a drive substrate, such as addressable, individually driven on for each pixel to achieve a display. Wherein Mini-LEDs, also referred to as sub-millimeter LEDs, refer to LEDs having a die size above about 100 microns, the size of the Mini-LEDs is between conventional LEDs and Micro-LEDs, typically between 100 microns and 300 microns, and the Micro-LEDs typically have a size below 100 microns.
TDM, namely full-lamination touch display integrated module, belongs to i/o equipment of a computer, namely input/output equipment, and is a display tool for displaying certain electronic files on a screen through specific transmission equipment and reflecting the electronic files to human eyes.
An OLED (Organic Light-Emitting Diode), also known as an Organic laser display, organic Light Emitting semiconductor (Organic Electroluminescence Display, OLED). An OLED is a current-type organic light emitting device, which is a phenomenon of emitting light by injection and recombination of carriers, and the intensity of the light emission is proportional to the current injected. Under the action of an electric field, holes generated by the anode and electrons generated by the cathode of the OLED move, are respectively injected into the hole transport layer and the electron transport layer, and migrate to the light emitting layer. When the two meet at the light emitting layer, an energy exciton is generated, thereby exciting the light emitting molecule to finally generate visible light.
The circuit board may be divided into a circuit hard board and a flexible circuit board according to the flexibility of the insulating layer. When the electronic component is soldered to the circuit board, the circuit board has poor flexibility although it can provide better structural strength. When electronic parts are soldered to a flexible circuit board, the flexible circuit board, although having a better flexibility, does not provide sufficient structural strength.
Accordingly, a circuit board structure composed of a flexible circuit board and a circuit hard board is proposed in the related art, which has both the flexibility of the flexible circuit board and the structural strength of the circuit hard board. The circuit board structure in the related art will be described with reference to the accompanying drawings.
FIG. 1 is a schematic diagram of a circuit board structure 10 according to an embodiment of the related art; fig. 2 is a schematic structural diagram of a circuit board structure 10 according to another embodiment of the related art; fig. 3 is a schematic structural view of a circuit board structure 10 according to another embodiment of the related art; for convenience of explanation, only portions relevant to the embodiments of the present application are shown.
Referring to fig. 1, in an embodiment of the related art, a circuit board structure 10 is provided, the circuit board structure 10 includes a circuit hard board 100, a flexible circuit board 200, and a connector 300, the circuit hard board 100 is provided with the connector 300, and the flexible circuit board 200 is connected to the circuit hard board 100 by means of the connector 300. Referring to fig. 2, another embodiment of the related art provides a circuit board structure 10, where the circuit board structure 10 includes a circuit hard board 100 and a flexible circuit board 200, gold finger groups are respectively disposed on the circuit hard board 100 and the flexible circuit board 200, and the circuit hard board 100 and the flexible circuit board 200 are bound together by means of the gold finger group structure. Referring to fig. 3, a circuit board structure 10 is provided in another embodiment of the related art, and the circuit board structure 10 includes a flexible circuit board 200 and two circuit hard boards 100, wherein the flexible circuit board 200 is disposed between the two circuit hard boards 100, and then the three circuit hard boards are pressed together.
FIG. 4 is a schematic structural diagram of a touch display module according to an embodiment of the related art; for convenience of explanation, only portions relevant to the embodiments of the present application are shown.
For ease of understanding, as shown in fig. 4, the upper side of the drawing is defined as the upper side, the lower side of the drawing is defined as the lower side, the left side of the drawing is defined as the left side, and the right side of the drawing is defined as the right side. The upper aspect is the front side toward the user side, and the lower side away from the user side is the rear side. Subsequent illustrations follow the definition of fig. 4. It is to be understood that the above definitions are provided for illustrative purposes only and are not to be construed as limiting the present application.
The three circuit board structures 10 are applied to the touch display module to realize signal transmission in the touch display module. Today, touch display modules are being developed in an integrated manner, and the touch layer is integrated into the cover 50 or the display layer. Referring to fig. 4, the touch display module shown in fig. 4 is a TDM, and the touch display module includes a circuit hard board 100, a flexible circuit board 200, a driving chip 30 disposed below the circuit hard board 100 and electrically connected to the circuit hard board 100, a chip 20 disposed above the circuit hard board 100, a touch module 40 disposed above the chip 20, a cover plate 50 disposed above the touch module 40, and a frame 60, wherein the circuit hard board 100, the flexible circuit board 200, the driving chip 30, the chip 20, the touch module 40, and the cover plate 50 are all disposed in the frame 60. The circuit board structure 10 in the touch display module adopts a structure that the flexible circuit board 200 shown in fig. 2 is bound to the circuit hard board 100.
The inventor of the present application has studied and found that, in the design process, the touch display module has limitations of width and area, so that the flexible circuit board 200 cannot be bound to the circuit hard board 100. And the circuit board structure 10 shown in fig. 1 cannot be used, i.e. the connector 300 is not placed on the circuit hard board 100, and the connection between the flexible circuit board 200 and the circuit hard board 100 cannot be achieved by means of the connector 300. For Mini TDM, the overall width and area will be smaller, and the flexible circuit board 200 will not be able to be bonded to the circuit stiffener 100. If binding is forced, the pressure head performing the binding operation may touch the driving chip 30 to cause damage to the driving chip 30.
FIG. 5 is a schematic diagram of a touch display module according to another embodiment of the related art; for convenience of explanation, only portions relevant to the embodiments of the present application are shown.
Referring to fig. 5, another embodiment of the related art provides a touch display module, which includes a circuit hard board 100, a flexible circuit board 200, a driving chip 30 disposed below the circuit hard board 100 and electrically connected to the circuit hard board 100, a chip 20 disposed above the circuit hard board 100, a touch module 40 disposed above the chip 20, a cover 50 disposed above the touch module 40, and a frame 60. The circuit hard board 100, the flexible circuit board 200, the driving chip 30, the chip 20, the touch module 40, and the cover 50 are all disposed in the frame 60. The circuit hard board 100 is provided with a filling hole 1011, and the chip 20 can be welded at the position corresponding to the filling hole 1011 in a welding mode, and meanwhile, the circuit hard board 100 is provided with a protection layer c for protecting the chip 20. The circuit board structure 10 in the touch display module adopts a structure that the flexible circuit board 200 shown in fig. 3 is bound to the circuit hard board 100. That is, the circuit hard board 100 includes a first circuit hard board 101 and a second circuit hard board 102, and the flexible circuit board 200 is disposed between the first circuit board and the second circuit board.
Further research by the inventor of the present application has found that, although the circuit board structure 10 can save space, shorten signal transmission distance, and simplify assembly requirements, the bending portion 220 of the flexible circuit board 200 can make the touch display module spare the non-visible area N, resulting in a reduced visible area.
FIG. 6 is a schematic diagram of a circuit board structure 10 according to an embodiment of the present application; for convenience of explanation, only portions relevant to the embodiments of the present application are shown.
Referring to fig. 6, an embodiment of the present application provides a circuit board structure 10, where the circuit board structure 10 includes a flexible circuit board 200, a first circuit hard board 101 and a second circuit hard board 102.
The flexible circuit board 200 includes a bonding portion 210 and a bending portion 220 connected to the bonding portion 210, and the flexible circuit board 200 has a first surface 201 and a second surface 202 disposed opposite to each other. The first circuit hard board 101 is disposed on the first surface 201 of the flexible circuit board 200, and an orthographic projection of the first circuit hard board 101 on the flexible circuit board 200 covers the attaching portion 210 and at least a partial area of the bending portion 220. The second circuit hard board 102 is disposed on the second surface 202 of the flexible circuit board 200, and the orthographic projection of the second circuit hard board 102 on the flexible circuit board 200 coincides with the attaching portion 210.
It should be noted that, taking fig. 6 as an example, the "first surface 201" refers to an upper surface of the flexible circuit board 200, and the "second surface 202" refers to a lower surface of the flexible circuit board 200. It will be appreciated that "first surface 201" includes the upper surface of conformable portion 210 and the upper surface of kink 220, and "second surface 202" includes the lower surface of conformable portion 210 and the lower surface of kink 220. "front projection of the first circuit hard board 101 on the flexible circuit board 200" refers to the projection of the first circuit hard board 101 on the flexible circuit board 200 in the vertical direction from top to bottom. "the front projection of the first circuit hard board 101 on the flexible circuit board 200 covers the attaching portion 210 and covers at least a part of the area of the bending portion 220" means that the first circuit hard board 101 extends above the bending portion 220 of the flexible circuit board 200, and the length of the portion of the first circuit hard board 101 located above the bending portion 220 of the flexible circuit board 200 may be set according to the use requirement so as to meet the use of different application scenarios. "orthographic projection of the second circuit hard board 102 on the flexible circuit board 200" refers to a projection of the first circuit hard board 101 on the flexible circuit board 200 in a vertical direction from bottom to top.
The front projection of the first circuit hard board 101 on the flexible circuit board 200 covers the attaching portion 210 and at least part of the area of the bending portion 220, and the front projection of the second circuit hard board 102 on the flexible circuit board 200 coincides with the attaching portion 210, that is, the length of the first circuit hard board 101 in the left-right direction is longer than the length of the second circuit hard board 102 in the left-right direction. When the bending portion 220 of the flexible circuit board 200 is bent towards the second circuit hard board 102, the portion of the first circuit hard board 101 above the bending portion 220 of the flexible circuit board 200 increases the bending range of the bending portion 220, so that the bending portion 220 is at least partially located below the first circuit hard board 101, thereby not only ensuring the visual range of the visual area, but also saving space.
In some embodiments, please continue to refer to fig. 6, the circuit board structure 10 further includes a first adhesive layer a disposed between the first circuit hard board 101 and the flexible circuit board 200, and an orthographic projection of the first adhesive layer a on the flexible circuit board 200 falls within a range of the attaching portion 210. Further research by the inventors of the present application has found that, since the circuit board structure 10, in which the flexible circuit board 200 is disposed between the first circuit board 101 and the second circuit board 102, is manufactured in a flat surface, the bending portion 220 of the flexible circuit board 200 is required to be bent after the manufacturing, and therefore, the adhesive surface needs to be avoided in advance. The orthographic projection of the first adhesive layer a on the flexible circuit board 200 falls within the range of the attaching portion 210, that is, the first adhesive layer a is adhered to the upper surface of the attaching portion 210 of the flexible circuit board 200, but not adhered to the upper surface of the bending portion 220 of the flexible circuit board 200. In particular, in some embodiments, the orthographic projection of the first adhesive layer a on the flexible circuit board 200 coincides with the attaching portion 210, so that the first circuit hard board 101 may be better attached to the first surface 201 of the flexible circuit board 200.
It should be noted that, taking fig. 6 as an example, the "orthographic projection of the first adhesive layer a on the flexible circuit board 200" refers to the projection of the first adhesive layer a on the flexible circuit board 200 in the vertical direction from top to bottom. "outer surface of the bent portion 220 of the flexible circuit board 200" means
In some embodiments, please continue to refer to fig. 6, the circuit board structure 10 further includes a second adhesive layer b disposed between the second circuit hard board 102 and the flexible circuit board 200, and an orthographic projection of the second adhesive layer b on the flexible circuit board 200 falls within a range of the attaching portion 210. Similarly, the inventors of the present application have further studied and found that, since the circuit board structure 10 in which the flexible circuit board 200 is disposed between the first circuit board 101 and the second circuit board 102 is manufactured in a flat surface, the bending of the bending portion 220 of the flexible circuit board 200 is performed after the manufacturing, and therefore, it is necessary to avoid the adhesive surface in advance. The orthographic projection of the second adhesive layer b on the flexible circuit board 200 falls within the range of the attaching portion 210, that is, the second adhesive layer b is adhered to the lower surface of the attaching portion 210 of the flexible circuit board 200, but not adhered to the lower surface of the bending portion 220 of the flexible circuit board 200. In particular, in some embodiments, the orthographic projection of the first adhesive layer a on the flexible circuit board 200 coincides with the attaching portion 210, so that the first circuit hard board 101 may be better attached to the first surface 201 of the flexible circuit board 200.
It should be noted that, taking fig. 6 as an example, the "orthographic projection of the first adhesive layer a on the flexible circuit board 200" refers to the projection of the first adhesive layer a on the flexible circuit board 200 in the vertical direction from top to bottom.
In some embodiments, please continue to refer to fig. 6, along the arrangement direction x of the attaching portion 210 and the bending portion 220, the front projection outer contour of the first circuit stiffener 101 on the flexible circuit board 200 has a first side edge located within the range of the bending portion 220; the second circuit hard board 102 has an outer contour of orthographic projection on the flexible circuit board 200, and has a second side edge near the bending portion 220; the first side and the second side are provided with a preset distance d. That is, the length of the first circuit stiffener 101 in the arrangement direction x along the bonding portion 210 and the bending portion 220 is longer than the length of the second circuit stiffener 102 in the arrangement direction x along the bonding portion 210 and the bending portion 220. The first circuit stiffener 101 provides a bending range of the bending portion 220 of the flexible circuit board 200, such that the bending portion 220 is at least partially located under the first circuit stiffener 101. In particular, in some embodiments, the predetermined distance d is greater than 0.3 mm, so that the display range in Mini TDM can be maintained without increasing the width of the frame.
It should be noted that, taking fig. 6 as an example, the "arrangement direction x along the attaching portion 210 and the bending portion 220" refers to a horizontal direction from left to right, "the" first side "refers to an orthographic projection of the first side s1 (i.e., the rightmost end shown in fig. 6) of the first circuit hard board 101 on the flexible circuit board 200, and the" second side "refers to an orthographic projection of the second side s2 (i.e., the rightmost end shown in fig. 6) of the second circuit hard board 102 on the flexible circuit board 200.
In some embodiments, the first circuit stiffener 101 is a Mini-LED backlight substrate. Because the circuit board structure 10 can save space and does not reduce the range of the visible area, the scene of using Mini-LEDs can be satisfied.
Based on the same inventive concept, the embodiment of the present application further provides a backlight module, which includes a chip 20 and the circuit board structure 10 in the above embodiment, where the chip 20 is connected to the first circuit hard board 101. In some embodiments, please continue to refer to fig. 6, taking fig. 6 as an example, the chip 20 is disposed on the upper surface of the first circuit hard board 101, the first circuit hard board 101 is provided with a hole 1011, and the chip 20 can be soldered on the first circuit hard board 101 by means of the hole 1011. In other embodiments, referring to fig. 6, a protective layer c is further disposed on the upper surface of the first circuit board 101 around the chip 20 to protect the chip 20, a driving chip 30 is disposed on the lower surface of the second circuit board 102, and the driving chip 30 is in signal connection with the second circuit board 102 by means of the circuit trace layer 1021 of the second circuit board 102. In particular to some embodiments, the chip 20 is a Mini-LED chip 20.
Based on the same inventive concept, the embodiment of the application also provides a display module, which comprises the backlight module in the embodiment. Thus, due to the design of the circuit board structure 10, the area of the shielding visible area can be reduced.
FIG. 7 is a schematic structural diagram of a touch display module according to an embodiment of the disclosure; for convenience of explanation, only portions relevant to the embodiments of the present application are shown.
Based on the same inventive concept, the embodiment of the present application further provides a touch display module, which includes the touch module 40 and the display module in the above embodiment, and the touch module 40 is coupled to one side of the display module. In some embodiments, please continue to refer to fig. 7 in conjunction with fig. 6, taking fig. 7 as an example, the touch module 40 is disposed above the chip 20, the touch module 40 is further provided with a cover 50, the touch display module further includes a frame 60, and the circuit board structure 10, the chip 20, the driving chip 30, the touch module 40 and the cover 50 are disposed in the frame 60. Therefore, due to the design of the circuit board structure 10, not only can the space be saved, but also the area for shielding the visible area can be reduced, and the circuit board structure can be applied to miniature TDM.
In some embodiments, referring to fig. 7, the chip 20 may be configured as a photosensor, and correspondingly, the cover plate 50 may be configured as an OLED display panel. In this way, a light beam for recognizing fingerprint can be emitted through the self-luminous characteristics of the OLED display panel. In addition, in the related art, a metal middle frame is generally used for fixing the under-screen fingerprint, and the hardware cost is high. By adopting the fingerprint identification mode, the chip 20 is fixed in the hole 1011 of the first circuit hard board 101, and the hole 1011 can provide the function of supporting the chip 20, so that the hardware cost can be reduced.
In other embodiments, the circuit trace layer 1021 of the second circuit hard board 102 may be configured as a fingerprint sensing circuit, and correspondingly, the chip 20 may be a light source, which may be a visible light source or a non-visible light source (such as infrared light).
It should be understood that the touch display module provided in the above embodiment may be applied to fields such as mobile phone terminals, bionic electronics, electronic skins, wearable devices, vehicle-mounted devices, internet of things devices, artificial intelligence devices, and the like. For example, the touch display module can be applied to a mobile phone terminal, a tablet, a palm computer, an ipod, a smart watch, a laptop computer, a television, a monitor and the like.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples merely represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the invention. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.
Claims (10)
1. A circuit board structure, comprising:
the flexible circuit board comprises a bonding part and a bending part connected with the bonding part, and the flexible circuit board is provided with a first surface and a second surface which are oppositely arranged;
the first circuit hard board is arranged on the first surface of the flexible circuit board, and orthographic projection of the first circuit hard board on the flexible circuit board covers the attaching part and at least part of the area of the bending part; and
the second circuit hard board is arranged on the second surface of the flexible circuit board, and orthographic projection of the second circuit hard board on the flexible circuit board is overlapped with the attaching part;
the first circuit hard board is provided with a first side edge positioned in the range of the bending part along the arrangement direction of the attaching part and the bending part, wherein the front projection outline of the first circuit hard board on the flexible circuit board is provided with a first side edge positioned in the range of the bending part; the second circuit hard board is provided with a second side edge close to the bending part, and the second circuit hard board is provided with a front projection outer contour on the flexible circuit board;
the first side edge and the second side edge are provided with a preset distance, and the preset distance is larger than 0.3 millimeter.
2. The circuit board structure of claim 1, further comprising a first glue layer disposed between the first circuit stiffener and the flexible circuit board;
orthographic projection of the first adhesive layer on the flexible circuit board falls into the range of the attaching part.
3. The circuit board structure of claim 2, wherein an orthographic projection of the first adhesive layer on the flexible circuit board coincides with the attachment portion.
4. The circuit board structure of claim 1, further comprising a second glue layer disposed between the second circuit stiffener and the flexible circuit board;
orthographic projection of the second adhesive layer on the flexible circuit board falls into the range of the attaching part.
5. The circuit board structure of claim 4, wherein an orthographic projection of the second adhesive layer on the flexible circuit board coincides with the conforming portion.
6. The circuit board structure of any one of claims 1 to 5, wherein the first circuit stiffener is a Mini-LED backlight substrate.
7. A backlight module comprising a chip and a circuit board structure as claimed in any one of claims 1 to 6;
the chip is connected with the first circuit hard board.
8. A backlight module according to claim 7, wherein the chip is a Mini-LED chip.
9. A display module comprising a backlight module according to claim 7 or 8.
10. The utility model provides a touch-control display module assembly which characterized in that includes:
the display module of claim 9; and
the touch control module is coupled to one side of the display module.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111305158.6A CN114035704B (en) | 2021-11-05 | 2021-11-05 | Circuit board structure, backlight module, display module and touch display module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111305158.6A CN114035704B (en) | 2021-11-05 | 2021-11-05 | Circuit board structure, backlight module, display module and touch display module |
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| CN114035704A CN114035704A (en) | 2022-02-11 |
| CN114035704B true CN114035704B (en) | 2023-07-18 |
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| CN108646463A (en) * | 2018-03-26 | 2018-10-12 | 厦门天马微电子有限公司 | Backlight module and detection backlight module whether the method and display device of heavy industry |
| WO2019218491A1 (en) * | 2018-05-15 | 2019-11-21 | 武汉华星光电半导体显示技术有限公司 | Flexible circuit board and display screen |
| WO2020216300A1 (en) * | 2019-04-25 | 2020-10-29 | Oppo广东移动通信有限公司 | Input/output component and electronic device |
| CN112585760A (en) * | 2019-07-30 | 2021-03-30 | 京东方科技集团股份有限公司 | Display device and display module |
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| JPS57193094A (en) * | 1981-05-18 | 1982-11-27 | Matsushita Electric Ind Co Ltd | Electronic circuit part and method of mounting same |
| CN206533614U (en) * | 2017-01-03 | 2017-09-29 | 深南电路股份有限公司 | A kind of PCB construction |
| CN107484336A (en) * | 2017-09-16 | 2017-12-15 | 深圳市华琥技术有限公司 | A kind of wiring board |
| CN209390451U (en) * | 2018-11-22 | 2019-09-13 | 歌尔科技有限公司 | A kind of flexible circuit board and electronic equipment |
| CN214476074U (en) * | 2020-12-15 | 2021-10-22 | 昆山国显光电有限公司 | Flexible display module |
| CN113473695B (en) * | 2021-06-29 | 2022-09-30 | 昆山国显光电有限公司 | Flexible circuit module and display panel |
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| CN108646463A (en) * | 2018-03-26 | 2018-10-12 | 厦门天马微电子有限公司 | Backlight module and detection backlight module whether the method and display device of heavy industry |
| WO2019218491A1 (en) * | 2018-05-15 | 2019-11-21 | 武汉华星光电半导体显示技术有限公司 | Flexible circuit board and display screen |
| WO2020216300A1 (en) * | 2019-04-25 | 2020-10-29 | Oppo广东移动通信有限公司 | Input/output component and electronic device |
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| CN114035704A (en) | 2022-02-11 |
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Effective date of registration: 20240108 Address after: 518109, Building E4, 101, Foxconn Industrial Park, No. 2 East Ring 2nd Road, Fukang Community, Longhua Street, Longhua District, Shenzhen City, Guangdong Province (formerly Building 1, 1st Floor, G2 District), H3, H1, and H7 factories in K2 District, North Shenchao Optoelectronic Technology Park, Minqing Road, Guangdong Province Patentee after: INTERFACE OPTOELECTRONICS (SHENZHEN) Co.,Ltd. Patentee after: Interface Technology (Chengdu) Co., Ltd. Patentee after: GENERAL INTERFACE SOLUTION Ltd. Address before: No.689 Hezuo Road, West District, high tech Zone, Chengdu City, Sichuan Province Patentee before: Interface Technology (Chengdu) Co., Ltd. Patentee before: INTERFACE OPTOELECTRONICS (SHENZHEN) Co.,Ltd. Patentee before: Yicheng Photoelectric (Wuxi) Co.,Ltd. Patentee before: GENERAL INTERFACE SOLUTION Ltd. |