CN114031747A - Low-viscosity high-performance epoxy resin system easy for dispersing nano materials and preparation method thereof - Google Patents
Low-viscosity high-performance epoxy resin system easy for dispersing nano materials and preparation method thereof Download PDFInfo
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- CN114031747A CN114031747A CN202111476556.4A CN202111476556A CN114031747A CN 114031747 A CN114031747 A CN 114031747A CN 202111476556 A CN202111476556 A CN 202111476556A CN 114031747 A CN114031747 A CN 114031747A
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 90
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 90
- 239000002086 nanomaterial Substances 0.000 title claims abstract description 42
- 238000002360 preparation method Methods 0.000 title abstract description 10
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 47
- 238000002156 mixing Methods 0.000 claims abstract description 22
- 239000003085 diluting agent Substances 0.000 claims abstract description 16
- 239000012745 toughening agent Substances 0.000 claims abstract description 14
- 239000011259 mixed solution Substances 0.000 claims description 35
- 150000001412 amines Chemical class 0.000 claims description 28
- 238000001816 cooling Methods 0.000 claims description 28
- 238000003756 stirring Methods 0.000 claims description 26
- 229920005989 resin Polymers 0.000 claims description 25
- 239000011347 resin Substances 0.000 claims description 25
- 238000010438 heat treatment Methods 0.000 claims description 24
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 claims description 18
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 claims description 14
- 229940018564 m-phenylenediamine Drugs 0.000 claims description 14
- 238000005303 weighing Methods 0.000 claims description 14
- 238000002844 melting Methods 0.000 claims description 13
- 230000008018 melting Effects 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 10
- 239000000243 solution Substances 0.000 claims description 10
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 8
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 6
- ITZGNPZZAICLKA-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) 7-oxabicyclo[4.1.0]heptane-3,4-dicarboxylate Chemical compound C1C2OC2CC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 ITZGNPZZAICLKA-UHFFFAOYSA-N 0.000 claims description 6
- AOFIWCXMXPVSAZ-UHFFFAOYSA-N 4-methyl-2,6-bis(methylsulfanyl)benzene-1,3-diamine Chemical compound CSC1=CC(C)=C(N)C(SC)=C1N AOFIWCXMXPVSAZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 229920002530 polyetherether ketone Polymers 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 claims description 2
- 239000004697 Polyetherimide Substances 0.000 claims description 2
- 239000006185 dispersion Substances 0.000 claims description 2
- 229920001601 polyetherimide Polymers 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 239000002131 composite material Substances 0.000 description 5
- 239000003292 glue Substances 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 239000002048 multi walled nanotube Substances 0.000 description 4
- 238000010125 resin casting Methods 0.000 description 4
- 239000012467 final product Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000000835 fiber Substances 0.000 description 2
- 239000000805 composite resin Substances 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Abstract
The invention discloses a low-viscosity high-performance epoxy resin system easy for dispersing nano materials and a preparation method thereof. The low-viscosity high-performance epoxy resin system easy to disperse the nano material is prepared by mixing multifunctional epoxy resin, an active diluent, a toughening agent and a curing agent according to a certain proportion under a certain condition, has the characteristics of high strength and modulus, high elongation, low viscosity and the like, can effectively solve the problem that the nano material is difficult to disperse in the high-performance epoxy resin system due to high viscosity, and has the advantages of convenience in operation, good repeatability and the like.
Description
Technical Field
The invention relates to the field of composite material preparation, in particular to a low-viscosity high-performance epoxy resin system capable of easily dispersing nano materials and a preparation method thereof.
Background
With the further development of the advanced resin matrix composite preparation technology, the light and high-strength advanced resin matrix composite is gradually used as a main bearing part. Research results show that when the interlaminar shear strength between fibers reaches more than 120MPa, the advanced resin-based composite material can be used as a main bearing part. However, the continuous fiber reinforced resin matrix composite represented by epoxy resin still has the problems of poor toughness, low damage tolerance, poor strength after impact and the like, so that the application of the composite as a main bearing part is further limited. In view of the above problems, researchers using a small amount of nano materials to uniformly add to resin can further improve the toughness of an epoxy resin system and can improve the thermal or electrical properties of the resin, however, the existing high-performance epoxy resin system has a high system viscosity and is not easy to disperse the nano materials, or the nano materials in the epoxy resin system added with the nano materials have poor dispersion stability, and therefore, there is a great need to develop a special epoxy resin system suitable for dispersing the nano materials.
Disclosure of Invention
The invention aims to solve the technical problem of providing a low-viscosity high-performance epoxy resin system easy for dispersing nano materials and a preparation method thereof.
In order to solve the technical problems, the technical scheme of the invention is as follows: the epoxy resin system is prepared by mixing tetrafunctional epoxy resin, trifunctional epoxy resin, toughening agent, reactive diluent and mixed amine curing agent according to a certain proportion, has low viscosity, is easy to disperse nano materials, and can be applied to various forming processes such as winding, hot pressing and the like, thereby achieving the purpose of the invention.
The invention relates to a low-viscosity high-performance epoxy resin system easy for dispersing nano materials, which comprises the following main materials in percentage by weight:
50-80 parts by mass of a polyfunctional epoxy resin;
10-50 parts by mass of an active diluent;
3-10 parts of a toughening agent;
20-35 parts by mass of a mixed amine curing agent;
the mixed amine curing agent comprises 4, 4-diaminodiphenylmethane and m-phenylenediamine, and the mass ratio of the 4, 4-diaminodiphenylmethane to the m-phenylenediamine is 0.25-4.
The invention relates to a low-viscosity high-performance epoxy resin system easy for dispersing nano materials, which is characterized in that: the multifunctional epoxy resin is a trifunctional epoxy resin or a mixture of the trifunctional epoxy resin and a tetrafunctional epoxy resin in a mass ratio of 19-3.
The invention relates to a low-viscosity high-performance epoxy resin system easy for dispersing nano materials, which is characterized in that: the tetrafunctional epoxy resin is AG80, AG-80H, AG-8701 or AG80-MH, and the trifunctional epoxy resin is TDE-85, AFG-90H, YH-300 or YH-325.
The invention relates to a low-viscosity high-performance epoxy resin system easy for dispersing nano materials, which is characterized in that: the reactive diluent comprises one or a mixture of 690, 622, CMP410, C203, 207; the toughening agent comprises polyether sulfone (PES) with an active end group, polyether ether ketone (PEEK) and benzene ring-terminated polyetherimide.
The invention relates to a low-viscosity high-performance epoxy resin system easy for dispersing nano materials, which is characterized in that: the toughening agent powder particle size should not be higher than 160 μm.
The invention relates to a low-viscosity high-performance epoxy resin system easy for dispersing nano materials, which is characterized in that: the mixed amine curing agent also comprises one of 3, 3-diaminodiphenyl sulfone, 4-diaminodiphenyl methane, 3' -dichloro-4, 4-diaminodiphenyl methane or dimethylthio toluene diamine; wherein the mass content of the 4, 4-diaminodiphenylmethane and the m-phenylenediamine in the mixed amine curing agent is not less than 60 percent.
The invention relates to a preparation method of a low-viscosity high-performance epoxy resin system easy for dispersing nano materials, which comprises the following steps:
1) weighing 50-80 parts by mass of polyfunctional epoxy resin;
2) weighing 3-10 parts by mass of a toughening agent, mixing with the multifunctional epoxy resin, and uniformly stirring; heating to 150-170 ℃, and continuously stirring until the solution presents a uniform color; then cooling the resin mixed solution to 120 ℃;
3) weighing 10-50 parts by mass of reactive diluent, adding the reactive diluent into the resin mixed solution obtained in the step 2), heating while stirring, and cooling to room temperature after uniform stirring;
4) preparing an amine mixed curing agent, wherein the amine mixed curing agent comprises 4, 4-diaminodiphenylmethane and m-phenylenediamine in a mass ratio of 0.25-4, the amine mixed curing agent is uniformly mixed and heated to a temperature not lower than the melting point of the 4, 4-diaminodiphenylmethane, and the mixture is stirred until the amine mixed curing agent is uniformly mixed; cooling the curing agent mixed solution to be not higher than 40 ℃, and then heating to be not lower than the highest melting point temperature of each component; repeating the heating and cooling operation for at least 3 times; cooling to room temperature to prepare a mixed amine curing agent;
5) weighing 20-35 parts by mass of the mixed amine curing agent prepared in the step 4), heating to a temperature not less than 10 ℃ above the melting point temperature of the mixed amine curing agent, and uniformly mixing with the epoxy resin mixed solution prepared in the step 3) to obtain a low-viscosity high-performance epoxy resin system easy for dispersing the nano material.
The invention relates to a preparation method of a low-viscosity high-performance epoxy resin system easy for dispersing nano materials, which is characterized by comprising the following steps: the multifunctional epoxy resin is a trifunctional epoxy resin or a mixture of the trifunctional epoxy resin and a tetrafunctional epoxy resin in a mass ratio of 19-3.
The invention relates to a preparation method of a low-viscosity high-performance epoxy resin system easy for dispersing nano materials, which is characterized by comprising the following steps: the mixed amine curing agent also comprises one of 3, 3-diaminodiphenyl sulfone, 4-diaminodiphenyl methane, 3' -dichloro-4, 4-diaminodiphenyl methane or dimethylthio toluene diamine; wherein the mass content of the 4, 4-diaminodiphenylmethane and the m-phenylenediamine in the mixed amine curing agent is not less than 60 percent.
The invention relates to a low-viscosity high-performance epoxy resin system easy to disperse nano materials, which is prepared by mixing multifunctional epoxy resin, reactive diluent, toughening agent and mixed amine curing agent according to a certain proportion under a certain condition.
Detailed Description
The present invention will be further described with reference to the following examples, but the technical solution of the present invention is not limited to the specific embodiments listed below. The invention is not limited to the embodiments described above, but rather, various modifications and changes may be made by those skilled in the art without departing from the scope of the invention.
Example one
1000g of trifunctional epoxy resin TDE-85 were weighed out and heated to 80 ℃. 250g of tetrafunctional epoxy resin AG-80 were weighed out and heated to 80 ℃. Mixing the two epoxy resins, stirring until the appearance color is uniform, and cooling to room temperature.
75g of a toughening agent 5003P with the particle size of 160 mu m is weighed and poured into the resin mixed solution for mixing, the mixed solution is heated to 150 ℃ while stirring, the mixed solution is continuously stirred at the temperature until the solution presents a uniform color, and then the resin mixed solution is cooled to 120 ℃.
Keeping the temperature of the resin mixed solution at 120 ℃, weighing 250g of reactive diluent 690, adding the reactive diluent into the resin mixed solution in two batches while stirring until the color is uniform, and cooling to room temperature; and (5) standby.
Weighing 150g of 4, 4-diaminodiphenylmethane and m-phenylenediamine respectively, mixing, heating to the temperature of 5 ℃ higher than the melting point of the 4, 4-diaminodiphenylmethane while stirring, and continuing stirring until the mixed solution is uniform; cooling to 40 ℃, adding 200g of liquid dimethylthiotoluenediamine, and stirring and mixing; cooling the curing agent mixed solution to 35 ℃, and then heating to 60 ℃; and cooling and heating for 3 times, and cooling to room temperature to obtain the final product. The curing agent was measured using DSC and found to have a melting point of 49.6 ℃.
And heating the curing agent to 60 ℃, and uniformly mixing the curing agent with the epoxy resin mixed solution to obtain the low-viscosity high-performance epoxy resin system easy for dispersing the nano material.
The low-viscosity high-performance epoxy resin system easy to disperse the nano material prepared by the embodiment has the room-temperature viscosity of 1960mpa.s and the gel time of not less than 8 hours. The prepared resin casting has the tensile strength of 92MPa, the modulus of 4.2GPa and the elongation of 4.7 percent, and the resin system is mixed with the multi-wall carbon nano tube to obtain the mixed glue solution which is stable and has good dispersibility.
Example two
The difference from the first embodiment is that:
900g of trifunctional epoxy resin TDE-85 were weighed out and heated to 80 ℃. 300g of tetrafunctional epoxy resin AG-80 were weighed and heated to 80 ℃. Mixing the two epoxy resins, stirring until the appearance color is uniform, and cooling to room temperature.
Diaminodiphenylmethane in an amount of 75g and m-phenylenediamine in an amount of 225g were weighed and mixed to prepare a curing agent having a melting point of 45.6 ℃.
And heating the curing agent to 55.6 ℃, and uniformly mixing the curing agent with the epoxy resin mixed solution to obtain the low-viscosity high-performance epoxy resin system easy for dispersing the nano material.
The low-viscosity high-performance epoxy resin system easy to disperse the nano material prepared by the embodiment has the room-temperature viscosity of 1960mpa.s and the gel time of not less than 8 hours. The prepared resin casting has the tensile strength of 92MPa, the modulus of 4.2GPa and the elongation of 4.7 percent, and the resin system is mixed with the multi-wall carbon nano tube to obtain the mixed glue solution which is stable and has good dispersibility.
EXAMPLE III
800g of trifunctional epoxy resin TDE-85 were weighed out and heated to 80 ℃. 40g of epoxy resin AG-80H were weighed out and heated to 80 ℃. Mixing the two epoxy resins, stirring until the appearance color is uniform, and cooling to room temperature.
105g of a toughening agent 5003P with the particle size of 160 mu m is weighed and poured into the resin mixed solution for mixing, the mixture is heated to 150 ℃ while stirring, the mixed solution is continuously stirred at the temperature until the solution shows a uniform color, and then the resin mixed solution is cooled to 120 ℃.
Maintaining the temperature of the resin mixed solution at 120 ℃, weighing 525g of reactive diluent 622, adding into the resin mixed solution in three batches while stirring until the color is uniform, and cooling to room temperature; and (5) standby.
Weighing 294g of 4, 4-diaminodiphenylmethane and 73.5g of m-phenylenediamine, heating to the melting point temperature of 294g of 4, 4-diaminodiphenylmethane while stirring, and continuously stirring until the mixture is uniformly mixed; firstly, cooling to 38 ℃, and then heating to 80 ℃; and cooling and heating for 10 times, and cooling to room temperature to obtain the final product. The curing agent was measured using DSC and found to have a melting point of 37 ℃.
And heating the curing agent to 42 ℃, and uniformly mixing the curing agent with the epoxy resin mixed solution to obtain the low-viscosity high-performance epoxy resin system easy for dispersing the nano material.
The low-viscosity high-performance epoxy resin system easy for dispersing the nano material, prepared by the embodiment, has the room temperature viscosity of 1080mpa.s, the tensile strength of the prepared resin casting body of 107MPa, the modulus of 4.1GPa and the elongation of 5.3%, the resin system and the multi-walled carbon nanotube are mixed by using a three-roll grinder, and the obtained mixed glue solution is stable and has good dispersibility.
Example four
1000g of trifunctional epoxy resin TDE-85 were weighed out and heated to 80 ℃. 250g of tetrafunctional epoxy resin AG-80 were weighed out and heated to 80 ℃. Mixing the two epoxy resins, stirring until the appearance color is uniform, and cooling to room temperature.
75g of a toughening agent 5003P with the particle size of 160 mu m is weighed and poured into the resin mixed solution for mixing, the mixed solution is heated to 150 ℃ while stirring, the mixed solution is continuously stirred at the temperature until the solution presents a uniform color, and then the resin mixed solution is cooled to 120 ℃.
Keeping the temperature of the resin mixed solution at 120 ℃, weighing 250g of reactive diluent 690, adding the reactive diluent into the resin mixed solution in two batches while stirring until the color is uniform, and cooling to room temperature; and (5) standby.
Weighing 150g of 4, 4-diaminodiphenylmethane and m-phenylenediamine respectively, mixing, heating to the temperature of 5 ℃ higher than the melting point of the 4, 4-diaminodiphenylmethane while stirring, and continuing stirring until the mixed solution is uniform; cooling to 40 deg.C, adding 200g solid 4, 4-diamino diphenyl sulfone, stirring and mixing; heating the curing agent mixed solution to 175 ℃ and then heating the curing agent mixed solution to completely dissolve 4, 4-diaminodiphenyl sulfone, and then cooling the curing agent mixed solution to 45 ℃; and cooling and heating for 3 times, and cooling to room temperature to obtain the final product. The curing agent was measured using DSC and found to have a melting point of 115.6 ℃.
And heating the curing agent to 130 ℃, and uniformly mixing the curing agent with the epoxy resin mixed solution to obtain the low-viscosity high-performance epoxy resin system easy for dispersing the nano material.
The low-viscosity high-performance epoxy resin system easy to disperse the nano material prepared by the embodiment has the room-temperature viscosity of 3280mpa.s and the gel time of not less than 8 hours. The prepared resin casting has the tensile strength of 92MPa, the modulus of 4.2GPa and the elongation of 4.7 percent, and the resin system is mixed with the multi-wall carbon nano tube to obtain the mixed glue solution which is stable and has good dispersibility.
Claims (9)
1. A low-viscosity high-performance epoxy resin system easy for dispersing nano materials comprises the following main materials in percentage by weight:
50-80 parts by mass of a polyfunctional epoxy resin;
10-50 parts by mass of an active diluent;
3-10 parts of a toughening agent;
20-35 parts by mass of a mixed amine curing agent;
the mixed amine curing agent comprises 4, 4-diaminodiphenylmethane and m-phenylenediamine, and the mass ratio of the 4, 4-diaminodiphenylmethane to the m-phenylenediamine is 0.25-4.
2. A low viscosity high performance epoxy resin system for dispersing nano-materials easily as claimed in claim 1, wherein: the multifunctional epoxy resin is a trifunctional epoxy resin or a mixture of the trifunctional epoxy resin and a tetrafunctional epoxy resin in a mass ratio of 19-3.
3. A low viscosity high performance epoxy resin system with easy dispersion of nano materials as claimed in claim 2, characterized by: the tetrafunctional epoxy resin is AG80, AG-80H, AG-8701 or AG80-MH, and the trifunctional epoxy resin is TDE-85, AFG-90H, YH-300 or YH-325.
4. A low viscosity high performance epoxy resin system for dispersing nano-materials easily as claimed in claim 1, wherein: the reactive diluent comprises one or a mixture of 690, 622, CMP410, C203, 207; the toughening agent comprises polyether sulfone (PES) with an active end group, polyether ether ketone (PEEK) and benzene ring-terminated polyetherimide.
5. A low viscosity high performance epoxy resin system for dispersing nano materials easily as claimed in claim 4, wherein: the toughening agent powder particle size should not be higher than 160 μm.
6. A low viscosity high performance epoxy resin system for dispersing nano-materials easily as claimed in claim 1, wherein: the mixed amine curing agent also comprises one of 3, 3-diaminodiphenyl sulfone, 4-diaminodiphenyl methane, 3' -dichloro-4, 4-diaminodiphenyl methane or dimethylthio toluene diamine; wherein the mass content of the 4, 4-diaminodiphenylmethane and the m-phenylenediamine in the mixed amine curing agent is not less than 60 percent.
7. A method for preparing the low viscosity high performance epoxy resin system for dispersing nano-materials easily as claimed in claim 1, which comprises the following steps:
1) weighing 50-80 parts by mass of polyfunctional epoxy resin;
2) weighing 3-10 parts by mass of a toughening agent, mixing with the multifunctional epoxy resin, and uniformly stirring; heating to 150-170 ℃, and continuously stirring until the solution presents a uniform color; then cooling the resin mixed solution to 120 ℃;
3) weighing 10-50 parts by mass of reactive diluent, adding the reactive diluent into the resin mixed solution obtained in the step 2), heating while stirring, and cooling to room temperature after uniform stirring;
4) preparing an amine mixed curing agent, wherein the amine mixed curing agent comprises 4, 4-diaminodiphenylmethane and m-phenylenediamine in a mass ratio of 0.25-4, the amine mixed curing agent is uniformly mixed and heated to a temperature not lower than the melting point of the 4, 4-diaminodiphenylmethane, and the mixture is stirred until the amine mixed curing agent is uniformly mixed; cooling the curing agent mixed solution to be not higher than 40 ℃, and then heating to be not lower than the highest melting point temperature of each component; repeating the heating and cooling operation for at least 3 times; cooling to room temperature to prepare a mixed amine curing agent;
5) weighing 20-35 parts by mass of the mixed amine curing agent prepared in the step 4), heating to a temperature not less than 10 ℃ above the melting point temperature of the mixed amine curing agent, and uniformly mixing with the epoxy resin mixed solution prepared in the step 3) to obtain a low-viscosity high-performance epoxy resin system easy for dispersing the nano material.
8. The method for preparing a low viscosity high performance epoxy resin system for dispersing nano materials easily as claimed in claim 7, wherein: the multifunctional epoxy resin is a trifunctional epoxy resin or a mixture of the trifunctional epoxy resin and a tetrafunctional epoxy resin in a mass ratio of 19-3.
9. The method for preparing a low viscosity high performance epoxy resin system for dispersing nano materials easily as claimed in claim 7, wherein: the mixed amine curing agent also comprises one of 3, 3-diaminodiphenyl sulfone, 4-diaminodiphenyl methane, 3' -dichloro-4, 4-diaminodiphenyl methane or dimethylthio toluene diamine; wherein the mass content of the 4, 4-diaminodiphenylmethane and the m-phenylenediamine in the mixed amine curing agent is not less than 60 percent.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104119640A (en) * | 2013-04-24 | 2014-10-29 | 中国科学院化学研究所 | High strength and high toughness epoxy resin composition applicable for hot melt method preparation of carbon fiber reinforced composite prepreg |
| CN111484706A (en) * | 2020-05-27 | 2020-08-04 | 北京化工大学 | High-performance resin matrix for IV-type composite gas cylinder and preparation method thereof |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104119640A (en) * | 2013-04-24 | 2014-10-29 | 中国科学院化学研究所 | High strength and high toughness epoxy resin composition applicable for hot melt method preparation of carbon fiber reinforced composite prepreg |
| CN111484706A (en) * | 2020-05-27 | 2020-08-04 | 北京化工大学 | High-performance resin matrix for IV-type composite gas cylinder and preparation method thereof |
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