CN114031280A - Method and device for cutting and splitting glass substrate and electronic equipment - Google Patents
Method and device for cutting and splitting glass substrate and electronic equipment Download PDFInfo
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- CN114031280A CN114031280A CN202111403759.0A CN202111403759A CN114031280A CN 114031280 A CN114031280 A CN 114031280A CN 202111403759 A CN202111403759 A CN 202111403759A CN 114031280 A CN114031280 A CN 114031280A
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- 239000011521 glass Substances 0.000 title claims abstract description 110
- 239000000758 substrate Substances 0.000 title claims abstract description 100
- 238000000034 method Methods 0.000 title claims abstract description 49
- 238000005520 cutting process Methods 0.000 title claims abstract description 48
- 230000035699 permeability Effects 0.000 claims abstract description 51
- 238000004364 calculation method Methods 0.000 claims abstract description 5
- 230000035515 penetration Effects 0.000 claims description 21
- 238000012544 monitoring process Methods 0.000 claims description 19
- 238000004891 communication Methods 0.000 claims description 10
- 206010041662 Splinter Diseases 0.000 claims description 8
- 230000007547 defect Effects 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 6
- 230000003068 static effect Effects 0.000 claims description 4
- 235000013547 stew Nutrition 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 9
- 238000007373 indentation Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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Abstract
The embodiment of the application provides a method and a device for cutting and splitting a glass substrate and electronic equipment, wherein when the fact that the mileage of a cutter wheel for cutting the glass substrate by the cutter wheel equipment reaches a preset mileage value is monitored, the crack information of the glass substrate is obtained; calculating the cutter wheel standing permeability based on the crack information; determining a target cutter pressure value according to the cutter wheel standing permeability and the cutter wheel mileage; and controlling the cutter wheel equipment to continuously cut the glass substrate at the target cutter pressure value. This application can determine target sword pressure value according to the break bar permeability and the break bar mileage that stews that the crack information calculation obtained at the cutting process for the break bar equipment continues to cut the glass substrate under the target sword pressure value that the accuracy determined, has improved lobe of a leaf success rate and product yield greatly.
Description
Technical Field
The invention relates to the technical field of cutting and splitting, in particular to a method and a device for cutting and splitting a glass substrate and electronic equipment.
Background
In the past, when it was necessary to cut a double glass display substrate, a display panel, or the like from an unnecessary portion on one side, it was necessary to cut these glass substrates with a cutter wheel under a set knife pressure to leave an indentation in these glass substrates, and then to split these glass substrates including the indentation with the indentation as a boundary with a splitting device to complete the splitting of the glass substrates, and the process of splitting the glass substrates including the indentation along the indentation may be referred to as splitting.
Researches find that the knife pressure greatly influences the success rate of the splitting, the knife pressure applied to the knife wheel at present can only be set according to experience, and when the knife pressure is not accurately set, the splitting failure of the glass substrate can be caused, so that the yield of products is reduced.
Disclosure of Invention
In view of the above, the present invention provides a method and an apparatus for cutting and splitting a glass substrate, and an electronic device, which can accurately determine a knife pressure value, so that a knife wheel device performs splitting cutting on the glass substrate under the knife pressure value, thereby greatly improving the success rate of splitting and the yield rate of products.
In a first aspect, the embodiments of the present invention provide a method for cutting and breaking a glass substrate, wherein the method is applied to a controller, and the controller is in communication connection with a cutter wheel device; the method comprises the following steps: monitoring whether the cutter wheel mileage reaches a preset mileage value when the cutter wheel equipment cuts the glass substrate; if so, acquiring the crack information of the glass substrate; calculating the cutter wheel standing permeability based on the crack information; determining a target cutter pressure value according to the cutter wheel standing permeability and the cutter wheel mileage; and controlling the cutter wheel equipment to continuously cut the glass substrate at the target cutter pressure value.
Before monitoring whether the cutter wheel mileage of the cutter wheel equipment reaches the preset mileage value, the method further comprises the following steps: and controlling the cutter wheel equipment to cut the glass substrate under a preset cutter pressure value.
The step of calculating the cutter wheel standing permeability based on the crack information comprises the following steps: calculating the standing penetration depth of the cutter wheel based on the crack information; and calculating the cutter wheel standing permeability according to the cutter wheel standing penetration depth and the splinter thickness value of the glass substrate.
The crack information comprises transverse crack depth, glass fracture surface depth and median crack depth; calculating the standing penetration depth of the cutter wheel based on the crack information, wherein the step comprises the following steps of: and adding the depth of the transverse crack, the depth of the glass fracture surface and the depth of the intermediate crack to obtain the standing penetration depth of the cutter wheel.
The step of calculating the cutter wheel standing permeability according to the cutter wheel standing penetration depth and the splinter thickness value of the glass substrate comprises the following steps: and dividing the standing penetration depth of the cutter wheel by the thickness value of the splinters of the glass substrate to obtain the standing penetration rate of the cutter wheel.
The step of determining the target cutter pressure value according to the cutter wheel standing permeability and the cutter wheel mileage comprises the following steps: searching a cutter pressure value corresponding to the cutter wheel standing permeability and the cutter wheel mileage from a cutter pressure look-up table; the cutter pressure lookup table stores the cutter wheel standing permeability and the corresponding relation between the cutter wheel mileage and the cutter pressure value; and determining the cutter pressure value as a target cutter pressure value.
The method further comprises the following steps: when the monitoring cutter wheel equipment finishes cutting, a starting signal is sent to the detection system to start the detection system to detect the cut glass substrate, and if the glass substrate is detected to have a preset defect, an alarm instruction is sent to the alarm equipment to trigger the alarm equipment to give an alarm prompt.
In a second aspect, the embodiment of the invention further provides a device for cutting and splitting a glass substrate, wherein the device is applied to a controller, and the controller is in communication connection with the cutter wheel equipment; the device includes: the monitoring module is used for monitoring whether the cutter wheel mileage of the cutter wheel equipment reaches a preset mileage value; the acquisition module is used for acquiring the crack information of the glass substrate if the monitoring module monitors that the crack information is positive; the calculation module is used for calculating the cutter wheel standing permeability based on the crack information; the determining module is used for determining a target cutter pressure value according to the cutter wheel standing permeability and the cutter wheel mileage; and the control module is used for controlling the cutter wheel equipment to cut the glass substrate under the target cutter pressure value.
In a third aspect, an embodiment of the present invention further provides an electronic device, where the electronic device includes a processor and a memory, where the memory stores computer-executable instructions that can be executed by the processor, and the processor executes the computer-executable instructions to implement the foregoing method.
In a fourth aspect, the embodiments of the present invention also provide a computer-readable storage medium, where the computer-readable storage medium stores computer-executable instructions, and when the computer-executable instructions are called and executed by a processor, the computer-executable instructions cause the processor to implement the above-mentioned method.
The embodiment of the invention has the following beneficial effects:
the embodiment of the application provides a method and a device for cutting and splitting a glass substrate and electronic equipment, wherein when the fact that the mileage of a cutter wheel for cutting the glass substrate by the cutter wheel equipment reaches a preset mileage value is monitored, the crack information of the glass substrate is obtained; calculating the cutter wheel standing permeability based on the crack information; determining a target cutter pressure value according to the cutter wheel standing permeability and the cutter wheel mileage; and controlling the cutter wheel equipment to continuously cut the glass substrate at the target cutter pressure value. This application can determine target sword pressure value according to the break bar permeability and the break bar mileage that stews that the crack information calculation obtained at the cutting process for the break bar equipment continues to cut the glass substrate under the target sword pressure value that the accuracy determined, has improved lobe of a leaf success rate and product yield greatly.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and drawings.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a flow chart of a method for cutting and breaking a glass substrate according to an embodiment of the present invention;
FIG. 2 is a flow chart of another method for cutting and breaking a glass substrate according to an embodiment of the present invention;
FIG. 3 is a schematic view of a crack provided by an embodiment of the present invention;
fig. 4 is a schematic diagram of a corresponding relationship provided in the embodiment of the present invention;
fig. 5 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of an apparatus for cutting and breaking a glass substrate according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Icon:
300-a glass substrate; 301-surface cracking; 302-transverse crack; 303-glass fracture surface; 304-median crack; 500-a thin film transistor substrate; 501-color filter substrate; 502-lobe; 503-power up terminal.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Considering that the existing cutter pressure applied to the cutter wheel can only be set according to experience, when the cutter pressure is not accurately set, the splitting failure of the glass substrate can be caused, and the product yield is reduced; based on the method, the device and the electronic equipment for splitting, provided by the embodiment of the invention, the target knife pressure value can be determined according to the knife flywheel standing permeability and the knife flywheel mileage obtained by calculating the crack information, so that the knife flywheel equipment can continuously cut the glass substrate under the accurately determined target knife pressure value, and the splitting success rate and the product yield are greatly improved.
The embodiment provides a method for cutting and splitting a glass substrate, wherein the method is applied to a controller, and the controller is in communication connection with a cutter wheel device; the cutter wheel equipment can be regarded as a veneer cutting machine, and referring to a flow chart of a method for splitting and cutting shown in fig. 1, the method specifically comprises the following steps:
step S102, monitoring whether the cutter wheel mileage reaches a preset mileage value when the cutter wheel equipment cuts the glass substrate;
generally, before monitoring the mileage of the cutter wheel, the cutter wheel device needs to be controlled to perform the primary cutting on the glass substrate at a preset cutter pressure value, which is an empirical value set by experience, and the preset cutter pressure value is generally set to be 8.5N.
When the cutter wheel equipment is used for carrying out primary cutting on the glass base material, the cutter wheel mileage of the cutter wheel equipment needs to be monitored in real time, wherein the cutter wheel mileage can be understood as the length of the cut glass base material; the preset mileage value can be set as required, and is not limited herein.
And (5) executing step S104 when the cutter wheel mileage reaches the preset mileage value, and executing step S102 to continue monitoring if the cutter wheel mileage does not reach the preset mileage value.
Step S104, acquiring crack information of the glass substrate;
the crack information here is information of a crack caused on the glass substrate after the cutter wheel device first cuts the glass substrate, and the crack information can be measured by a microscope in general.
Step S106, calculating the cutter wheel standing permeability based on the crack information;
in the present embodiment, the cutter wheel standing permeability can be understood as the ratio of the depth of a crack caused by primary cutting of a glass substrate to the thickness of the glass substrate.
Step S108, determining a target cutter pressure value according to the cutter wheel standing permeability and the cutter wheel mileage;
and step S110, controlling the cutter wheel equipment to continuously cut the glass substrate under the target cutter pressure value.
When the cutting device is actually used, the preset cutter pressure value of the cutter wheel equipment is adjusted to the target cutter pressure value, the glass base material is continuously cut, and the cutting of the glass base material is completed.
The embodiment of the application provides a method for cutting and splitting a glass substrate, and in the cutting process, the application can determine a target knife pressure value according to the knife flywheel standing permeability and the knife flywheel mileage obtained by calculating crack information, so that knife flywheel equipment continues to cut the glass substrate under the accurately determined target knife pressure value, and the splitting success rate and the product yield are greatly improved.
The embodiment provides another method for cutting and splitting a glass substrate, which is realized on the basis of the embodiment; this example focuses on a specific implementation of calculating the stationary permeability of the cutter wheel. As shown in fig. 2, another method for splitting includes the following steps:
step S202, monitoring whether the cutter wheel mileage reaches a preset mileage value when the cutter wheel equipment cuts the glass substrate;
if yes, step S204 is performed, and if no, step S202 is performed.
Step S204, acquiring crack information of the glass substrate;
step S206, calculating the standing penetration depth of the cutter wheel based on the crack information;
for easy understanding, fig. 3 shows a schematic diagram of a crack, as shown in fig. 3, when the cutting edge of the cutter wheel device is pressed into the surface of the glass substrate 300 for cutting, a transverse surface crack 301 and a longitudinal transverse crack 302 are formed on the glass substrate 300, after the cutter wheel breaks the surface layer of the glass substrate 300, the glass substrate 300 is subjected to a cutting pressure to generate a glass fracture surface 303, and the glass fracture surface 303 preferably has a regular rib pattern, and the main factors influencing the crack are as follows: the angle of the cutter wheel, the pressure, the penetration amount, etc. of the glass substrate 300 along the glass fracture surface 303 without being affected by the force, and the intermediate crack 304 is generated, which may be affected by the angle of the cutter wheel, the pressure, the penetration amount, the stability time before breaking, etc. The penetration effect of the cutter wheel is generated from the surface of the glass substrate 300 to the middle crack.
In the present embodiment, the crack information includes the lateral crack depth of the lateral crack 302, the glass fracture surface depth of the glass fracture surface 303, and the median crack depth of the median crack 304, and therefore, the cutter wheel standing penetration depth is obtained by adding the lateral crack depth, the glass fracture surface depth, and the median crack depth.
S208, calculating the cutter wheel standing permeability according to the cutter wheel standing penetration depth and the splinter thickness value of the glass substrate;
specifically, the cutter wheel standing permeability is determined as a ratio obtained by dividing the cutter wheel standing permeability by the thickness value of the splinters of the glass substrate; wherein, just can guarantee that the lobe of a leaf succeeds when the break bar permeability that stews needs to reach more than presetting the permeability threshold value, this preset permeability threshold value can set up as required, does not restrict here.
Step S210, determining a target cutter pressure value according to the cutter wheel standing permeability and the cutter wheel mileage;
in practical application, except that the cutter wheel static permeability influences cutter pressure, consider that the cutter wheel is along with life-span loss, can guarantee that the cutter wheel static permeability is sufficient according to cutter wheel mileage increase pressure, guarantee the lobe of a leaf success rate, eliminate bad defect.
The above step S210 can be realized by steps a1 to a 2:
step A1, searching a cutter pressure value corresponding to the cutter wheel standing permeability and the cutter wheel mileage from a cutter pressure look-up table; the cutter pressure lookup table stores the cutter wheel standing permeability and the corresponding relation between the cutter wheel mileage and the cutter pressure value;
the cutter wheel standing permeability and the corresponding relationship between the cutter wheel mileage and the cutter pressure value stored in the cutter pressure look-up table are generally obtained through historical data, for convenience of understanding, the cutter pressure look-up table is shown and explained in a schematic form, fig. 4 shows a schematic diagram of the corresponding relationship, and fig. 4 shows the relationship among the cutter wheel standing permeability, the cutter wheel mileage and the cutter pressure value.
Step a2, determining the blade pressure value as a target blade pressure value.
In actual use, after the cutter wheel standing permeability and the cutter wheel mileage are obtained, a cutter pressure value corresponding to the cutter wheel standing permeability and the cutter wheel mileage in a matching manner can be inquired on fig. 4, and the cutter pressure value is a target cutter pressure value.
Step S212, controlling cutter wheel equipment to continuously cut the glass substrate under the target cutter pressure value;
taking a glass substrate as an example for explanation, fig. 5 shows a structural schematic diagram of a display panel cut, as shown in fig. 5, the display panel is formed by assembling two glass substrates, namely a thin film transistor substrate 500 and a color filter substrate 501, and the process from step S202 to step S212 can be used to cut off a split sheet 502 with a specific width on the side of the color filter substrate 501, and expose an energizing terminal 503, so that a liquid crystal alignment voltage driving system applies a voltage to the panel to form a pretilt angle for the liquid crystal.
And S214, when the monitoring cutter wheel device finishes cutting, sending a starting signal to the detection system to start the detection system to detect the cut glass substrate, and if the glass substrate is detected to have a preset defect, sending an alarm instruction to the alarm device to trigger the alarm device to give an alarm prompt.
The default defects include at least one of: liquid crystal leakage, unfilled corners and cutting residues are remained, and when the method is specifically realized, the preset defects can be set according to actual needs and are not limited; the alarm device may be a voice alarm device, a photoelectric alarm device or a text alarm device.
The embodiment of the invention also provides a device for cutting and splitting the glass substrate, wherein the device is applied to a controller, and the controller is in communication connection with the cutter wheel equipment; fig. 6 shows a schematic structural diagram of a splinter cutting device, which comprises:
the monitoring module 602 is configured to monitor whether a cutter wheel mileage of the cutter wheel device reaches a preset mileage value;
an obtaining module 604, configured to obtain crack information of the glass substrate if the monitoring module monitors yes;
the calculating module 606 is used for calculating the cutter wheel standing permeability based on the crack information;
the determining module 608 is configured to determine a target cutter pressure value according to the cutter wheel standing permeability and the cutter wheel mileage;
and the control module 610 is used for controlling the cutter wheel equipment to cut the glass substrate at the target cutter pressure value.
The embodiment of the application provides a device for cutting and splitting a glass substrate, wherein when the fact that the mileage of a cutter wheel for cutting the glass substrate by cutter wheel equipment reaches a preset mileage value is monitored, crack information of the glass substrate is obtained; calculating the cutter wheel standing permeability based on the crack information; determining a target cutter pressure value according to the cutter wheel standing permeability and the cutter wheel mileage; and controlling the cutter wheel equipment to continuously cut the glass substrate at the target cutter pressure value. This application can determine target sword pressure value according to the break bar permeability and the break bar mileage that stews that the crack information calculation obtained at the cutting process for the break bar equipment continues to cut the glass substrate under the target sword pressure value that the accuracy determined, has improved lobe of a leaf success rate and product yield greatly.
The device for cutting and splitting a glass substrate provided by the embodiment of the invention has the same technical characteristics as the method for cutting and splitting a glass substrate provided by the embodiment, so that the same technical problems can be solved, and the same technical effects can be achieved.
An electronic device is further provided in the embodiment of the present application, as shown in fig. 7, which is a schematic structural diagram of the electronic device, wherein the electronic device includes a processor 121 and a memory 120, the memory 120 stores computer-executable instructions capable of being executed by the processor 121, and the processor 121 executes the computer-executable instructions to implement the method for cutting and breaking a glass substrate.
In the embodiment shown in fig. 7, the electronic device further comprises a bus 122 and a communication interface 123, wherein the processor 121, the communication interface 123 and the memory 120 are connected by the bus 122.
The Memory 120 may include a high-speed Random Access Memory (RAM) and may also include a non-volatile Memory (non-volatile Memory), such as at least one disk Memory. The communication connection between the network element of the system and at least one other network element is realized through at least one communication interface 123 (which may be wired or wireless), and the internet, a wide area network, a local network, a metropolitan area network, and the like may be used. The bus 122 may be an ISA (Industry Standard Architecture) bus, a PCI (Peripheral Component Interconnect) bus, an EISA (Extended Industry Standard Architecture) bus, or the like. The bus 122 may be divided into an address bus, a data bus, a control bus, and the like. For ease of illustration, only one double-headed arrow is shown in FIG. 7, but this does not indicate only one bus or one type of bus.
The processor 121 may be an integrated circuit chip having signal processing capabilities. In implementation, the steps of the above method may be performed by integrated logic circuits of hardware or instructions in the form of software in the processor 121. The Processor 121 may be a general-purpose Processor, and includes a Central Processing Unit (CPU), a Network Processor (NP), and the like; the device can also be a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other Programmable logic device, a discrete Gate or transistor logic device, or a discrete hardware component. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like. The steps of the method disclosed in connection with the embodiments of the present application may be directly implemented by a hardware decoding processor, or implemented by a combination of hardware and software modules in the decoding processor. The software module may be located in ram, flash memory, rom, prom, or eprom, registers, etc. storage media as is well known in the art. The storage medium is located in the memory, and the processor 121 reads the information in the memory and completes the steps of the method for cutting and breaking the glass substrate according to the foregoing embodiment in combination with the hardware thereof.
Embodiments of the present application further provide a computer-readable storage medium, where the computer-readable storage medium stores computer-executable instructions, and when the computer-executable instructions are called and executed by a processor, the computer-executable instructions cause the processor to implement the method for cutting and splitting a glass substrate, where specific implementation may refer to the foregoing method embodiments, and details are not repeated herein.
The method and apparatus for cutting and breaking a glass substrate and the computer program product of an electronic device provided in the embodiments of the present application include a computer-readable storage medium storing program codes, where instructions included in the program codes may be used to execute the methods described in the foregoing method embodiments, and specific implementation may refer to the method embodiments, and will not be described herein again.
Unless specifically stated otherwise, the relative steps, numerical expressions, and values of the components and steps set forth in these embodiments do not limit the scope of the present application.
The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a non-volatile computer-readable storage medium executable by a processor. Based on such understanding, the technical solution of the present application or portions thereof that substantially contribute to the prior art may be embodied in the form of a software product stored in a storage medium and including instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Finally, it should be noted that: the above-mentioned embodiments are only specific embodiments of the present application, and are used for illustrating the technical solutions of the present application, but not limiting the same, and the scope of the present application is not limited thereto, and although the present application is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: any person skilled in the art can modify or easily conceive the technical solutions described in the foregoing embodiments or equivalent substitutes for some technical features within the technical scope disclosed in the present application; such modifications, changes or substitutions do not depart from the spirit and scope of the exemplary embodiments of the present application, and are intended to be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. The method for cutting and splitting the glass substrate is applied to a controller, and the controller is in communication connection with a cutter wheel device; the method comprises the following steps:
monitoring whether the cutter wheel mileage reaches a preset mileage value when the cutter wheel equipment cuts the glass substrate;
if so, acquiring the crack information of the glass substrate;
calculating the cutter wheel standing permeability based on the crack information;
determining a target cutter pressure value according to the cutter wheel standing permeability and the cutter wheel mileage;
and controlling the cutter wheel equipment to continuously cut the glass substrate at the target cutter pressure value.
2. The method of claim 1, wherein prior to monitoring whether a cutter wheel mileage of the cutter wheel device reaches a preset mileage value, the method further comprises:
and controlling the cutter wheel equipment to cut the glass substrate under a preset cutter pressure value.
3. The method of claim 1, wherein the step of calculating a cutter wheel rest permeability based on the crack information comprises:
calculating the standing penetration depth of the cutter wheel based on the crack information;
and calculating the cutter wheel standing permeability according to the cutter wheel standing penetration depth and the splinter thickness value of the glass substrate.
4. The method of claim 3, wherein the crack information includes a lateral crack depth, a glass fracture surface depth, and a median crack depth;
calculating the standing penetration depth of the cutter wheel based on the crack information, wherein the step comprises the following steps of:
and adding the transverse crack depth, the glass fracture surface depth and the intermediate crack depth to obtain the cutter wheel standing penetration depth.
5. The method of claim 3, wherein the step of calculating a cutter wheel static penetration from the cutter wheel static penetration depth and the break thickness value of the glass substrate comprises:
and dividing the standing penetration depth of the cutter wheel by the thickness value of the splinters of the glass substrate to obtain the standing penetration rate of the cutter wheel.
6. The method of claim 1, wherein the step of determining a target cutter pressure value based on the cutter wheel standing permeability and the cutter wheel mileage comprises:
searching a cutter pressure value corresponding to the cutter wheel standing permeability and the cutter wheel mileage from a cutter pressure look-up table; the cutter pressure lookup table stores the cutter wheel standing permeability and the corresponding relation between the cutter wheel mileage and the cutter pressure value;
and determining the cutter pressure value as a target cutter pressure value.
7. The method of claim 1, further comprising:
monitoring when the cutting of the cutter wheel equipment is completed, sending a starting signal to a detection system to start the detection system to detect the cut glass substrate, and sending an alarm instruction to alarm equipment to trigger the alarm equipment to give an alarm prompt if the glass substrate is detected to have a preset defect.
8. The device for cutting and splitting the glass substrate is applied to a controller, and the controller is in communication connection with a cutter wheel device; the device comprises:
the monitoring module is used for monitoring whether the cutter wheel mileage of the cutter wheel equipment reaches a preset mileage value;
the acquisition module is used for acquiring the crack information of the glass substrate if the monitoring module monitors that the crack information is positive;
the calculation module is used for calculating the cutter wheel standing permeability based on the crack information;
the determining module is used for determining a target cutter pressure value according to the cutter wheel standing permeability and the cutter wheel mileage;
and the control module is used for controlling the cutter wheel equipment to cut the glass substrate under the target cutter pressure value.
9. An electronic device comprising a processor and a memory, the memory storing computer-executable instructions executable by the processor, the processor executing the computer-executable instructions to implement the method of any one of claims 1 to 7.
10. A computer-readable storage medium having computer-executable instructions stored thereon which, when invoked and executed by a processor, cause the processor to implement the method of any of claims 1 to 7.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111403759.0A CN114031280A (en) | 2021-11-24 | 2021-11-24 | Method and device for cutting and splitting glass substrate and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111403759.0A CN114031280A (en) | 2021-11-24 | 2021-11-24 | Method and device for cutting and splitting glass substrate and electronic equipment |
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| CN114031280A true CN114031280A (en) | 2022-02-11 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103601361A (en) * | 2013-11-06 | 2014-02-26 | 深圳市华星光电技术有限公司 | Cutting device for cutting liquid crystal substrate, and cutter pressure debugging method of cutting device |
| US20150122864A1 (en) * | 2013-11-06 | 2015-05-07 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Cutting device for cutting liquid crystal substrate and method for adjusting knife pressure thereof |
| EP3015236A1 (en) * | 2014-10-30 | 2016-05-04 | Mitsuboshi Diamond Industrial Co., Ltd. | Method of scribing the surface of a thick glass plate, and scribing wheel for scribing the surface of a such a plate |
| CN109422455A (en) * | 2017-08-21 | 2019-03-05 | 塔工程有限公司 | Dicing method and scribing equipment |
| CN209815962U (en) * | 2019-03-15 | 2019-12-20 | 郑州旭飞光电科技有限公司 | Dust-free glass breaking device |
| WO2021183291A1 (en) * | 2020-03-12 | 2021-09-16 | Corning Incorporated | Systems and methods for separating glass substrates |
-
2021
- 2021-11-24 CN CN202111403759.0A patent/CN114031280A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103601361A (en) * | 2013-11-06 | 2014-02-26 | 深圳市华星光电技术有限公司 | Cutting device for cutting liquid crystal substrate, and cutter pressure debugging method of cutting device |
| US20150122864A1 (en) * | 2013-11-06 | 2015-05-07 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Cutting device for cutting liquid crystal substrate and method for adjusting knife pressure thereof |
| EP3015236A1 (en) * | 2014-10-30 | 2016-05-04 | Mitsuboshi Diamond Industrial Co., Ltd. | Method of scribing the surface of a thick glass plate, and scribing wheel for scribing the surface of a such a plate |
| CN109422455A (en) * | 2017-08-21 | 2019-03-05 | 塔工程有限公司 | Dicing method and scribing equipment |
| CN209815962U (en) * | 2019-03-15 | 2019-12-20 | 郑州旭飞光电科技有限公司 | Dust-free glass breaking device |
| WO2021183291A1 (en) * | 2020-03-12 | 2021-09-16 | Corning Incorporated | Systems and methods for separating glass substrates |
Non-Patent Citations (1)
| Title |
|---|
| 陈正树, 武汉理工大学出版社 * |
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