CN114025478A - Packaging structure for Sub-6G-LTCC Internet of things radio frequency antenna integrated module - Google Patents
Packaging structure for Sub-6G-LTCC Internet of things radio frequency antenna integrated module Download PDFInfo
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- CN114025478A CN114025478A CN202111274493.4A CN202111274493A CN114025478A CN 114025478 A CN114025478 A CN 114025478A CN 202111274493 A CN202111274493 A CN 202111274493A CN 114025478 A CN114025478 A CN 114025478A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2216—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in interrogator/reader equipment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention discloses a packaging structure for a Sub-6G-LTCC Internet of things radio frequency antenna integrated module, which comprises a first PCB, a second PCB, a first radio frequency chip set and a second radio frequency chip set, wherein the first radio frequency chip set and the second radio frequency chip set are arranged on the first PCB; the clamping structure comprises a connecting groove and a clamping groove which are respectively arranged on the metal frame and the first PCB and connecting columns which are fixed on two sides of the bottom of the metal frame, the center of the connecting groove is rotatably connected with a take-up pulley through a central shaft, and two sides inside the connecting groove are both connected with limiting plates in a sliding manner.
Description
Technical Field
The invention relates to the technical field of radio frequency antenna integration of the Internet of things, in particular to a packaging structure for a Sub-6G-LTCC radio frequency antenna integration module of the Internet of things.
Background
The radio frequency card module is also called as an RFID module and is a middleware for reading and writing the radio frequency card RFID, and due to the complexity of the operation time sequence of the radio frequency card RFID, in order to avoid the high research and development cost and time investment of a company using the radio frequency card RFID system, a plurality of companies directly purchase the radio frequency card RFID module for use, so that the products can be rapidly released, and a large amount of research and development cost is saved.
Chinese patent discloses a packaging structure for integrating a tunable antenna array and a radio frequency module, and the disclosure thereof is as follows: (CN207909873U), the integrated antenna array and radio frequency module packaging structure not only realizes the integration of the two, but also can realize the tuning of the antenna array, has the characteristics of high integration level, good electromagnetic shielding effect, high antenna gain and radiation efficiency, small radiation power and low loss, and can meet the requirements of different application occasions.
However, the metal frame used in the patent cannot be disassembled, so that the radio frequency chip set on the first PCB is inconvenient to maintain and recycle, and meanwhile, the designed electromagnetic shielding layer is also inconvenient to disassemble and low in recycling rate, so that the packaging structure for the Sub-6G-LTCC Internet of things radio frequency antenna integrated module is provided.
Disclosure of Invention
The invention aims to provide a packaging structure for a Sub-6G-LTCC Internet of things radio frequency antenna integrated module, so as to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
a packaging structure for a Sub-6G-LTCC Internet of things radio frequency antenna integrated module comprises a first PCB, a second PCB, a first radio frequency chip set and a second radio frequency chip set, wherein the first radio frequency chip set and the second radio frequency chip set are arranged on the first PCB;
the clamping structure comprises a connecting groove and a clamping groove which are respectively arranged on the metal frame and the first PCB and connecting columns which are fixed on two sides of the bottom of the metal frame, the center of the connecting groove is rotatably connected with a take-up pulley through a central shaft, two sides inside the connecting groove are both connected with limiting plates in a sliding mode, the bottom ends of the limiting plates are provided with lugs, one opposite sides of the two limiting plates are both connected with pull ropes, two groups of pull ropes are respectively connected to the upper side and the lower side of the take-up pulley, the center of the take-up pulley extends to the outer side of the metal frame and is connected with a rocker, and a plurality of groups of elastic structures are arranged between the two limiting plates and the connecting columns;
the elastic structure comprises guide posts fixed on the limiting plate and guide grooves formed in the connecting posts, the guide posts are connected with the guide grooves in a sliding mode, and first springs are connected between the guide posts and the inner walls of the guide grooves.
As a further scheme of the invention: the metal frame is connected with the second PCB board through a conductive adhesive layer
As a further scheme of the invention: the bottom of second PCB board is equipped with the U-shaped frame, and the inside swing joint of U-shaped frame has the electromagnetic shield layer, all be equipped with stop gear between the both sides of electromagnetic shield layer and U-shaped frame.
As a further scheme of the invention: stop gear is including offering the rectangular channel on the electromagnetic shield layer and offering the spacing hole on the U-shaped frame, there is the sliding block inside of rectangular channel through the second spring coupling, the spacing post of one side fixedly connected with of sliding block, the one end of spacing post is passed electromagnetic shield layer and joint in the inside in spacing hole, the positive fixedly connected with push rod of sliding block.
As a further scheme of the invention: the electromagnetic shielding layer bottom both sides have all been seted up the spout, the equal fixedly connected with in both sides of U-shaped frame diapire and the sand grip of spout looks adaptation.
Compared with the prior art, the metal frame can be conveniently installed on the first PCB through the clamping structure, and the packaging structure is convenient to operate, so that the packaging structure is convenient to open, the internal electric appliance elements are maintained, and the internal devices and the metal frame are convenient to recycle.
Drawings
Fig. 1 is a schematic structural diagram of a packaging structure for a Sub-6G-LTCC internet of things radio frequency antenna integrated module.
Fig. 2 is a schematic structural diagram of a clamping structure in a packaging structure of a Sub-6G-LTCC internet of things radio frequency antenna integrated module.
Fig. 3 is a partial enlarged view of a portion a in fig. 1 of a package structure of a Sub-6G-LTCC internet of things radio frequency antenna integrated module.
Fig. 4 is a partial enlarged view of a package structure B of a Sub-6G-LTCC internet of things radio frequency antenna integrated module in fig. 2.
In the figure: 1. a first PCB board; 2. a second PCB board; 3. a first radio frequency chipset; 4. a second radio frequency chipset; 5. a metal frame; 6. connecting grooves; 7. a card slot; 8. connecting columns; 9. a take-up pulley; 10. a limiting plate; 11. a bump; 12. pulling a rope; 13. a rocker; 14. a guide post; 15. a guide groove; 16. a first spring; 17. a conductive adhesive layer; 18. a U-shaped frame; 19. an electromagnetic shielding layer; 20. a rectangular groove; 21. a limiting hole; 22. a second spring; 23. a slider; 24. a limiting column; 25. a chute; 26. a convex strip; 27. a push rod.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
The invention provides a packaging structure for a Sub-6G-LTCC Internet of things radio frequency antenna integrated module, and with reference to fig. 1-4, the packaging structure for the Sub-6G-LTCC Internet of things radio frequency antenna integrated module comprises a first PCB (printed circuit board) 1, a second PCB 2, a first radio frequency chip set 3 and a second radio frequency chip set 4, wherein the first radio frequency chip set 3 and the second radio frequency chip set 4 are arranged on the first PCB 1, the first PCB 1 and the second PCB 2 are enclosed by a metal frame 5, and clamping structures are arranged on two sides of the metal frame 5, which are connected with the first PCB 1; the clamping structure comprises a connecting groove 6 and a clamping groove 7 which are respectively arranged on the metal frame 5 and the first PCB 1, and connecting columns 8 which are fixed on two sides of the bottom of the metal frame 5, wherein the center of the connecting groove 6 is rotatably connected with a take-up pulley 9 through a central shaft, two sides inside the connecting groove 6 are both connected with limiting plates 10 in a sliding manner, the bottom ends of the limiting plates 10 are provided with lugs 11, one opposite sides of the two limiting plates 10 are both connected with pull ropes 12, two groups of pull ropes 12 are respectively connected to the upper side and the lower side of the take-up pulley 9, the center of the take-up pulley 9 extends to the outer side of the metal frame 5 and is connected with a rocker 13, and a plurality of groups of elastic structures are respectively arranged between the two limiting plates 10 and the connecting columns 8; the elastic structure comprises a guide post 14 fixed on the limiting plate 10 and a guide groove 15 formed in the connecting post 8, the guide post 14 is in sliding connection with the guide groove 15, and a first spring 16 is connected between the inner walls of the guide post 14 and the guide groove 15.
The packaging structure for the Sub-6G-LTCC internet-of-things radio frequency antenna integrated module disclosed in this embodiment can conveniently detach and separate the metal frame 5 and the first PCB 1, so as to conveniently open the packaging structure, maintain the internal devices therein, and conveniently recycle the metal frame 5 and the internal devices, specifically, when the metal frame 5 and the first PCB 1 are installed, the rocker 13 is rotated clockwise, the take-up pulley 9 can be driven to rotate, the pull ropes 12 at both sides can be driven to wind, the two limit plates 10 can be driven to move in opposite directions, the distance between the two limit plates 10 can be reduced, the limit plates 10 and the connecting column 8 can be clamped into the clamping groove 7, then the rocker 13 is loosened, the two limit plates 10 are flicked under the action of the first spring 16, both sides of the bottom wall of the clamping groove 7 of the bump 11 are limited, and the installation of the metal frame 5 can be completed, when dismantling metal frame 5, clockwise rotation rocker 13 makes two limiting plate 10 remove in opposite directions, alright upwards take out the metal sheet.
The metal frame 5 is connected with the second PCB 2 through a conductive adhesive layer 17. The conductive adhesive layer 17 can realize stable connection of the metal frame 5 and the second PCB 2.
The bottom of second PCB board 2 is equipped with U-shaped frame 18, and the inside swing joint of U-shaped frame 18 has electromagnetic shield layer 19, all is equipped with stop gear between the both sides of electromagnetic shield layer 19 and U-shaped frame 18. The electromagnetic shielding layer 19 can realize good electromagnetic shielding effect between the antenna array and the radio frequency chip.
Limiting mechanism is including offering rectangular channel 20 on electromagnetic shield 19 and offering the spacing hole 21 on U-shaped frame 18, and the inside of rectangular channel 20 is connected with sliding block 23 through second spring 22, and one side fixedly connected with spacing post 24 of sliding block 23, the inside at spacing hole 21 of electromagnetic shield 19 and joint is passed to the one end of spacing post 24, and the positive fixedly connected with push rod 27 of sliding block 23. Cooperation second spring 22, sliding block 23, spacing post 24 and spacing hole 21 can realize the installation and the dismantlement to electromagnetic shield layer 19, conveniently carry out recycle to electromagnetic shield layer 19, can drive sliding block 23 through promoting the push rod and slide.
The bottom of the first PCB board 1 is also provided with a row of solder balls to realize the connection with other modules.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.
Claims (5)
1. The packaging structure for the Sub-6G-LTCC Internet of things radio frequency antenna integrated module is characterized by comprising a first PCB (1), a second PCB (2), a first radio frequency chip set (3) and a second radio frequency chip set (4) which are arranged on the first PCB (1), wherein the first PCB (1) and the second PCB (2) are enclosed by a metal frame (5), and clamping structures are arranged on two sides of the metal frame (5) connected with the first PCB (1);
the clamping structure comprises connecting grooves (6) and clamping grooves (7) which are respectively arranged on a metal frame (5) and a first PCB (1) and connecting columns (8) which are fixed on two sides of the bottom of the metal frame (5), the center of each connecting groove (6) is rotatably connected with a take-up pulley (9) through a central shaft, two sides inside each connecting groove (6) are respectively connected with a limiting plate (10) in a sliding mode, a convex block (11) is arranged at the bottom end of each limiting plate (10), pull ropes (12) are respectively connected to one opposite sides of the two limiting plates (10), two groups of pull ropes (12) are respectively connected to the upper side and the lower side of each take-up pulley (9), the center of each take-up pulley (9) extends to the outer side of the metal frame (5) and is connected with a rocker (13), and a plurality of groups of elastic structures are arranged between the two limiting plates (10) and the connecting columns (8);
elastic structure is including fixing guide post (14) on limiting plate (10) and offering guide way (15) on spliced pole (8), guide post (14) and guide way (15) sliding connection, and be connected with first spring (16) between the inner wall of guide post (14) and guide way (15).
2. The packaging structure for the Sub-6G-LTCC IOT radio frequency antenna integrated module according to claim 1, wherein the metal frame (5) is connected with the second PCB (2) through a conductive adhesive layer (17).
3. The packaging structure for the Sub-6G-LTCC IOT radio frequency antenna integrated module according to claim 1, wherein a U-shaped frame (18) is arranged at the bottom of the second PCB (2), an electromagnetic shielding layer (19) is movably connected inside the U-shaped frame (18), and a limiting mechanism is arranged between the electromagnetic shielding layer (19) and two sides of the U-shaped frame (18).
4. The packaging structure for the Sub-6G-LTCC IOT radio frequency antenna integrated module is characterized in that the limiting mechanism comprises a rectangular groove (20) formed in an electromagnetic shielding layer (19) and a limiting hole (21) formed in a U-shaped frame (18), a sliding block (23) is connected to the inside of the rectangular groove (20) through a second spring (22), a limiting column (24) is fixedly connected to one side of the sliding block (23), one end of the limiting column (24) penetrates through the electromagnetic shielding layer (19) and is clamped in the limiting hole (21), and a push rod (27) is fixedly connected to the front face of the sliding block (23).
5. The packaging structure for the Sub-6G-LTCC IOT radio frequency antenna integrated module according to claim 4, wherein sliding grooves (25) are formed in two sides of the bottom of the electromagnetic shielding layer (19), and protruding strips (26) matched with the sliding grooves (25) are fixedly connected to two sides of the bottom wall of the U-shaped frame (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111274493.4A CN114025478A (en) | 2021-10-29 | 2021-10-29 | Packaging structure for Sub-6G-LTCC Internet of things radio frequency antenna integrated module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111274493.4A CN114025478A (en) | 2021-10-29 | 2021-10-29 | Packaging structure for Sub-6G-LTCC Internet of things radio frequency antenna integrated module |
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| Publication Number | Publication Date |
|---|---|
| CN114025478A true CN114025478A (en) | 2022-02-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111274493.4A Pending CN114025478A (en) | 2021-10-29 | 2021-10-29 | Packaging structure for Sub-6G-LTCC Internet of things radio frequency antenna integrated module |
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| Country | Link |
|---|---|
| CN (1) | CN114025478A (en) |
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| CN107978593A (en) * | 2017-12-26 | 2018-05-01 | 深圳铨力半导体有限公司 | A kind of encapsulating structure and method for packing of integrated tunable antenna array and radio-frequency module |
| CN207909873U (en) * | 2017-12-26 | 2018-09-25 | 华进半导体封装先导技术研发中心有限公司 | A kind of encapsulating structure of integrated tunable antenna array and radio-frequency module |
| CN208258223U (en) * | 2018-05-03 | 2018-12-18 | 成都职业技术学院 | A kind of portable rechargeable projector remote controller |
| CN210475942U (en) * | 2019-08-30 | 2020-05-08 | 武平飞天电子科技有限公司 | High-stability frequency conversion power circuit board welding device |
| CN111446175A (en) * | 2020-04-07 | 2020-07-24 | 华进半导体封装先导技术研发中心有限公司 | Radio frequency chip integrated packaging structure and preparation method thereof |
| CN211942640U (en) * | 2020-03-24 | 2020-11-17 | 上海锦廷机电科技有限公司 | Module clamping structure for printer |
| CN213403659U (en) * | 2020-10-23 | 2021-06-08 | 江苏微邦电子有限公司 | Integrated circuit board with damping mechanism |
| CN113301749A (en) * | 2021-05-28 | 2021-08-24 | 陶保伟 | Thing networking signal transmission conversion module |
-
2021
- 2021-10-29 CN CN202111274493.4A patent/CN114025478A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206962274U (en) * | 2017-07-26 | 2018-02-02 | 陈铁 | A kind of power distribution cabinet easy for removal and installation |
| CN107978593A (en) * | 2017-12-26 | 2018-05-01 | 深圳铨力半导体有限公司 | A kind of encapsulating structure and method for packing of integrated tunable antenna array and radio-frequency module |
| CN207909873U (en) * | 2017-12-26 | 2018-09-25 | 华进半导体封装先导技术研发中心有限公司 | A kind of encapsulating structure of integrated tunable antenna array and radio-frequency module |
| CN208258223U (en) * | 2018-05-03 | 2018-12-18 | 成都职业技术学院 | A kind of portable rechargeable projector remote controller |
| CN210475942U (en) * | 2019-08-30 | 2020-05-08 | 武平飞天电子科技有限公司 | High-stability frequency conversion power circuit board welding device |
| CN211942640U (en) * | 2020-03-24 | 2020-11-17 | 上海锦廷机电科技有限公司 | Module clamping structure for printer |
| CN111446175A (en) * | 2020-04-07 | 2020-07-24 | 华进半导体封装先导技术研发中心有限公司 | Radio frequency chip integrated packaging structure and preparation method thereof |
| CN213403659U (en) * | 2020-10-23 | 2021-06-08 | 江苏微邦电子有限公司 | Integrated circuit board with damping mechanism |
| CN113301749A (en) * | 2021-05-28 | 2021-08-24 | 陶保伟 | Thing networking signal transmission conversion module |
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