CN114023862B - Micro-LED substrate and preparation method and application thereof - Google Patents
Micro-LED substrate and preparation method and application thereof Download PDFInfo
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- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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Abstract
The invention provides a Micro-LED substrate and a preparation method and application thereof, wherein the preparation method comprises the following steps: providing a Micro-LED unit, wherein a bonding surface of the Micro-LED unit is provided with a first targeting material layer; providing a control substrate, wherein a targeting material array is arranged on the surface of the control substrate far away from the substrate; and synchronously transferring the Micro-LED units to a control substrate, and enabling the first targeting material layer to be in contact with and bonded with a targeting material array to obtain the Micro-LED substrate. The first targeting material layer comprises a first biological material, and the material of the targeting material array comprises a second biological material which is specifically combined with the first biological material; the Micro-LED unit and the control substrate are accurately aligned and directionally transferred by specific combination of biological materials, the preparation efficiency is high, and the method is simple. The Micro-LED substrate obtained by the preparation method has lower manufacturing cost and high product yield.
Description
Technical Field
The invention belongs to the technical field of display equipment, and particularly relates to a Micro-LED substrate and a preparation method and application thereof.
Background
The LED (Light emitting diode) has the characteristics of high brightness, good Light emitting efficiency and low power consumption, and is widely applied in the fields of photoelectricity, illumination and the like. With the continuous development of LED technology, Micro-LEDs (Micro-LEDs) are recently emerging in the display field and become one of the hot spots of future display technology. The Micro-LED technology is used for designing LED structures in a thin film, Micro-size and array mode, and the size of the LED structures is usually smaller than 100 mu m. The performance advantage of Micro-LEDs comes from the micron-scale pitch, each pixel (pixel) can realize addressing control and single-point driving light emission, and has the characteristics of higher resolution, high luminance, long service life, low power consumption and high chroma, so the application range in the fields of display, illumination and the like is gradually widened.
The Micro-LED has many technical difficulties at present, for example, the Micro-LED dies need to be transferred to a receiving substrate to be connected with a circuit on the receiving substrate for use, but the Micro-LED has a small size, more dies are needed on the same display area, and the transfer mode of the large-size LED dies has extremely low efficiency, high cost and poor heat dissipation. The mass transfer technology is an important technology for transferring a large number of Micro-LED dies with a Micro scale to a large-size transfer plate, and how to ensure low cost and high yield of the mass transfer technology is a technical problem of current main research.
A conventional method of bulk transfer of Micro-LEDs is to transfer the Micro-elements from a transfer substrate to a receiving substrate by substrate Bonding (Wafer Bonding). One of the methods is direct transfer, which is to directly bond the micro device array from the transfer substrate to the receiving substrate, and then remove the transfer substrate. For example, CN109473532A discloses a method for manufacturing a Micro LED display substrate, which includes transferring Micro LEDs distributed on an epitaxial wafer according to a set gap array onto corresponding pads of a driving substrate through a transfer substrate assembly; the transferring step comprises: butting the transfer substrate assembly with the epitaxial wafer to transfer the Micro LED on the epitaxial wafer to the adhesive layer of the transfer substrate assembly; and butting the transfer substrate assembly with the driving substrate, and performing viscous failure treatment on the adhesive layer on the transfer substrate assembly so as to release the Micro LEDs at the corresponding positions in the transfer substrate assembly onto the bonding pads at the corresponding positions of the driving substrate. Another method of implementation is "indirect transfer," which involves two bond-peel steps. In the indirect transfer process, the transpose head can pick up a portion of the array of micro-components on the intermediate carrier substrate, then bond the array of micro-components to the receiving substrate, and then remove the transpose head. For example, CN113035765A discloses a chip transfer method, which includes: transferring a plurality of Light Emitting Diode (LED) chips in a chip wafer onto a transition substrate; the transition substrate includes: a substrate and a plurality of adhesive structures located on one side of the substrate; the LED chip comprises a first electrode and a second electrode which are positioned on the same side, and the first electrode and the second electrode comprise magnetic materials; under the action of magnetic force provided by the magnetic attraction unit, the LED chip is controlled to vertically turn over, so that the first electrode and the second electrode face the direction departing from the transition substrate; and transferring the plurality of LED chips after being turned over on the transition substrate to the corresponding positions of the plurality of LED chips to be arranged in the target substrate.
Generally, the current massive transfer technology comprises the processes of grabbing and aligning and placing Micro-LED crystal grains, the size of the Micro-LED is in the micron level, and the grabbing and placing precision is higher, while the existing machine equipment is difficult to realize precise grabbing and aligning, so that certain errors exist in the position of the Micro-LED on a control substrate, and the display quality of a Micro-LED display device is influenced. Based on the method, the Micro-LED is transferred in a large amount more accurately, and the high-quality Micro-LED substrate is prepared, so that the problem to be solved in the field is urgently solved.
Disclosure of Invention
In order to develop a preparation method of a Micro-LED substrate with better precision and higher efficiency, one of the purposes of the invention is to provide a preparation method of a Micro-LED substrate, which comprises the following steps:
providing a Micro-LED unit; a first targeting material layer is arranged on the bonding surface of the Micro-LED unit;
providing a control substrate; a targeting material array is arranged on the surface of the control substrate far away from the substrate;
synchronously transferring the Micro-LED units to a control substrate, and enabling the first targeting material layer to be in contact with and bonded with a targeting material array to obtain the Micro-LED substrate;
the first targeting material layer comprises a first biological material, and the material of the targeting material array comprises a second biological material which is specifically combined with the first biological material; the first biological material is an antigen or an antibody.
Another object of the present invention is to provide a Micro-LED substrate, comprising:
a control substrate; the control substrate comprises a plurality of sub-pixel regions;
the Micro-LED unit array comprises a plurality of Micro-LED units, and the Micro-LED units are correspondingly bound with the sub-pixel areas one by one;
the bonding layer is arranged between the control substrate and the Micro-LED unit; an antigen-antibody complex is included in the bonding layer.
The third object of the present invention is to provide a display panel, which comprises the Micro-LED substrate of the second object.
Compared with the prior art, the invention has the following beneficial effects:
according to the preparation method of the Micro-LED substrate, the specific targeting materials are respectively arranged on the bonding surfaces of the Micro-LED unit and the control substrate, the Micro-LED unit and the control substrate are accurately aligned and directionally transferred through specific combination of the biological materials with the targeting effect, the precision of mass transfer of the Micro-LED is remarkably improved, the preparation efficiency is high, the preparation method is simple, complex and precise mechanical equipment is not needed, and the process cost is reduced. The Micro-LED substrate obtained by the preparation method has the advantages of lower production and manufacturing cost, high product yield and excellent display quality.
Drawings
FIG. 1 is a schematic structural view of a Micro-LED unit provided in one embodiment of the present invention;
fig. 2 is a schematic structural diagram of a control substrate according to an embodiment of the present invention;
FIG. 3 is a schematic structural view of a Micro-LED substrate provided in one embodiment of the present invention;
the LED structure comprises a substrate 110, an LED semiconductor structure 110, 121, a first electrode, a second electrode, a first targeting material layer 130, a packaging layer 140, a control substrate 20, a targeting material array 210, a third electrode 221 and a fourth electrode 222.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
One of the purposes of the invention is to provide a preparation method of a Micro-LED substrate, which comprises the following steps:
providing a Micro-LED unit; a first target material layer is arranged on the bonding surface of the Micro-LED unit;
providing a control substrate; a targeting material array is arranged on the surface of the control substrate far away from the substrate;
synchronously transferring the Micro-LED units to a control substrate, and enabling the first targeting material layer to be in contact with and bonded with a targeting material array to obtain the Micro-LED substrate;
the first targeting material layer comprises a first biological material, and the material of the targeting material array comprises a second biological material which is specifically combined with the first biological material; the first biological material is an antigen or an antibody.
In the preparation method provided by the invention, a first targeting material layer is arranged on the bonding surface of the Micro-LED unit, a targeting material array is arranged on the surface, bonded with the Micro-LED unit, of the control substrate, a first biological material in the first targeting material layer is specifically combined with a second biological material in the targeting material array, and the Micro-LED unit is bonded with the control substrate to obtain the Micro-LED substrate. Based on the fact that interaction/recognition between the first biological material and the second biological material has high specificity, the Micro-LED unit cannot be connected with a site, which is not provided with the targeting material array, on the control substrate, so that the Micro-LED unit can be accurately bonded at a corresponding position on the control substrate, position deviation cannot occur, and the precision of mass transfer of the Micro-LEDs is improved. More importantly, the preparation method can finish accurate alignment by target identification of the first biological material and the second biological material without using complex and precise mechanical equipment, thereby greatly simplifying the process steps; moreover, the target recognition and bonding speed between the biological materials is high, the conditions are mild, the recognition and reaction can be completed at normal temperature, and the preparation efficiency is high. The Micro-LED substrate obtained by the preparation method has lower production and manufacturing cost, and the alignment of the Micro-LED unit and the control substrate is accurate, the product yield is high, and the display quality is excellent.
In the present invention, the specific binding between the first biomaterial and the second biomaterial is the specific binding between the antigen and the antibody. When the first biological material is an antigen, the second biological material is an antibody corresponding to the first biological material; when the first biological material is an antibody, the second biological material is an antigen corresponding thereto.
In the invention, the bonding surface of the Micro-LED unit means the surface of the Micro-LED unit contacted and bound with the control substrate.
In the present invention, the arrangement (pattern) of the target material array is the arrangement (pattern) of the sub-pixel region on the control substrate.
In one embodiment, the Micro-LED unit is peeled off from the LED substrate before the first layer of targeting material is provided on the bonding surface.
In one embodiment, the LED substrate comprises a Si substrate or a sapphire substrate.
In one embodiment, a wrapping layer is disposed on a non-bonding surface of the Micro-LED unit, and a first layer of targeting material is disposed on a bonding surface of the Micro-LED unit after the Micro-LED unit is peeled from the LED substrate.
In one embodiment, the wrapping layer is provided before peeling, and the wrapping layer has functions of protection and heat dissipation and can assist the first targeting material layer to grow in a correct position after the Micro-LED unit is peeled from the LED substrate.
In one embodiment, the coating is an Optical Coating (OC) and the coating material is an optically transparent material, such as polyarylate or the like.
In one embodiment, the first layer of targeting material comprises a combination of a first bridging material and a first biomaterial; the first biological material forms a high-strength stable connection with the bonding surface of the Micro-LED unit through the first bridging material.
In one embodiment, the first bridging material comprises an alkenyl silane coupling agent and a hydrogel material polymerized from an unsaturated monomer; the alkenyl silane coupling agent reacts and bridges with a bonding surface (inorganic material) of the Micro-LED unit through siloxane groups on one hand, and participates in polymerization reaction of unsaturated monomers through alkenyl groups with reactivity on the other hand, so that fixation of the bonding surface of the Micro-LED unit and the first targeting material layer is achieved.
In one embodiment, the alkenyl silane coupling agent is a vinyl silane coupling agent, exemplary including but not limited to: any one or a combination of at least two of a silane coupling agent Si-171, a silane coupling agent Si-151 and a silane coupling agent Si-172.
In one embodiment, the unsaturated monomer comprises acrylamide.
In one embodiment, the method for disposing the first targeting material layer comprises:
providing an alkenyl silane coupling agent layer on the bonding surface of the Micro-LED unit (recorded as step S11);
coating a mixture of acrylamide and a first initiator on the alkenyl silane coupling agent layer, and polymerizing to obtain a first coating (recorded as step S12);
coating a mixture containing acrylamide, a second initiator and a cross-linking agent on the first coating to obtain a second coating (marked as step S13);
and coating a first biological material grafted with unsaturated functional groups on the second coating, and polymerizing to obtain the first targeting material layer (marked as step S14).
In one embodiment, the method of disposing an alkenyl silane coupling agent layer includes: and placing the bonding surface of the Micro-LED unit in an alkenyl silane coupling agent solution for reaction to obtain the alkenyl silane coupling agent layer.
In one embodiment, the solvent of the alkenyl silane coupling agent solution is a mixture of an alcohol solvent and water, and the mass ratio of the alcohol solvent to the water is (1-10): 1, and may be, for example, 1.5:1, 2:1, 3:1, 4:1, 5:1, 6:1, 7:1, 8:1, or 9: 1.
In one embodiment, the reaction time is 10 to 24 hours, and may be, for example, 11 hours, 12 hours, 13 hours, 14 hours, 15 hours, 16 hours, 17 hours, 18 hours, 19 hours, 20 hours, 21 hours, 22 hours, 23 hours, or the like.
In one embodiment, the reaction temperature is 15 to 35 ℃, for example, 16 ℃, 18 ℃, 20 ℃, 22 ℃, 25 ℃, 28 ℃, 30 ℃, 32 ℃ or 34 ℃, preferably room temperature.
In one embodiment, the first initiator, the second initiator are each independently a photoinitiator or a thermal initiator; the first biomaterial grafted with unsaturated functional groups is a N-acryloxysuccinimide (NSA) modified grafted first biomaterial.
In one embodiment, the first initiator is a photoinitiator; in step S12, the mass ratio of the first initiator to acrylamide is 1 (80-200), and may be, for example, 1:90, 1:100, 1:110, 1:120, 1:130, 1:140, 1:150, 1:160, 1:170, 1:180, or 1: 190.
In one embodiment, the polymerization in step S12 is photopolymerization, and the polymerization is performed under light irradiation.
In one embodiment, the illumination conditions are ultraviolet illumination conditions.
In one embodiment, the time of the light irradiation is 0.1 to 1min, and may be, for example, 0.2min, 0.3min, 0.4min, 0.5min, 0.6min, 0.7min, 0.8min, or 0.9 min. Under the above-mentioned light conditions, the first coating layer is an incompletely polymerized acrylamide layer.
In one embodiment, the second initiator is a thermal initiator, and the mass ratio of the second initiator to acrylamide in step S13 is 1 (80-200), and may be, for example, 1:90, 1:100, 1:110, 1:120, 1:130, 1:140, 1:150, 1:160, 1:170, 1:180, or 1: 190.
In one embodiment, the mass ratio of the crosslinking agent to the acrylamide in step S13 is 1 (80-200), and may be, for example, 1:90, 1:100, 1:110, 1:120, 1:130, 1:140, 1:150, 1:160, 1:170, 1:180, or 1: 190.
In one embodiment, the mixture of step S13 further comprises an accelerator; the content of the accelerator is 0.5 to 2. mu.L, for example, 0.6. mu.L, 0.8. mu.L, 1. mu.L, 1.2. mu.L, 1.5. mu.L, 1.7. mu.L or 1.9. mu.L based on 1g of the acrylamide.
In one embodiment, the first biomaterial grafted with unsaturated functional groups is an N-acryloxysuccinimide (NSA) modified grafted first biomaterial according to the following reaction formula:
wherein the content of the first and second substances,
representing a first biological material.
In one embodiment, the reaction temperature of the modified grafting is 25 to 40 ℃, such as 26 ℃, 28 ℃, 30 ℃, 32 ℃, 34 ℃, 36 ℃ or 38 ℃ and the like; the reaction time of the modification grafting is 0.5-2 h, such as 0.75h, 1h, 1.25h, 1.5h or 1.75 h; the reaction for the modified grafting was carried out in PBS buffer (phosphate buffered saline).
In one embodiment, the polymerization temperature in step S14 is 45 to 60 ℃, and may be 46 ℃, 48 ℃, 50 ℃, 51 ℃, 53 ℃, 55 ℃, 57 ℃, or 59 ℃ for example; the polymerization time is 2-5 h, for example, 2.5h, 3h, 3.5h, 4h, 4.5h, etc.
In one embodiment, the polymerization of step S14 is performed in the presence of water, thereby forming a first layer of targeting material having hydrogel properties; the first biomaterial is grafted with an unsaturated functional group (C ═ C) which participates in hydrogel-forming polymerization reaction, and thus is stably fixed on the bonding surface of the Micro-LED unit by the action of chemical bonds.
In one embodiment, the material of the array of targeting materials comprises a combination of a second bridging material and a second biomaterial; the second biomaterial forms a high-strength stable connection with the surface of the control substrate (i.e. the surface bound to the Micro-LED unit) via the second bridging material.
In one embodiment, the second bridging material comprises an alkenyl silane coupling agent and a hydrogel material polymerized from an unsaturated monomer; the alkenyl silane coupling agent is reacted and bridged with the surface of the control substrate through siloxane groups on one hand, and takes part in the polymerization reaction of unsaturated monomers through alkenyl groups with reactivity on the other hand, so that the control substrate and the second targeting material layer are fixed.
In one embodiment, the alkenyl silane coupling agent is a vinyl silane coupling agent, exemplary including but not limited to: any one or a combination of at least two of a silane coupling agent Si-171, a silane coupling agent Si-151 and a silane coupling agent Si-172.
In one embodiment, the unsaturated monomer comprises acrylamide.
In one embodiment, the method of disposing the array of targeting materials comprises:
providing an alkenyl silane coupling agent layer on the surface of the control substrate away from the substrate according to a preset pattern (marked as step S21);
coating a mixture of acrylamide and a third initiator on the alkenyl silane coupling agent layer, and polymerizing to obtain a third coating (recorded as step S22);
coating a mixture containing acrylamide, a fourth initiator and a crosslinking agent on the third coating to obtain a fourth coating (marked as step S23);
and coating a second biological material grafted with unsaturated functional groups on the fourth coating, and polymerizing to obtain the targeting material array (marked as step S24).
In the invention, the preset pattern is a distribution pattern of the sub-pixel area on the control substrate.
In one embodiment, the method of disposing the alkenyl silane coupling agent layer of step S21 includes: and placing the surface of the control substrate far away from the substrate in an alkenyl silane coupling agent solution for reaction to obtain the alkenyl silane coupling agent layer.
In one embodiment, the solvent of the alkenyl silane coupling agent solution is a mixture of an alcohol solvent and water, and the mass ratio of the alcohol solvent to the water is (1-10): 1, and may be, for example, 1.5:1, 2:1, 3:1, 4:1, 5:1, 6:1, 7:1, 8:1, or 9: 1.
In one embodiment, the reaction time is 10 to 24 hours, and may be, for example, 11 hours, 12 hours, 13 hours, 14 hours, 15 hours, 16 hours, 17 hours, 18 hours, 19 hours, 20 hours, 21 hours, 22 hours, 23 hours, or the like.
In one embodiment, the reaction temperature is 15 to 35 ℃, for example, 16 ℃, 18 ℃, 20 ℃, 22 ℃, 25 ℃, 28 ℃, 30 ℃, 32 ℃ or 34 ℃, preferably room temperature.
In one embodiment, the third initiator, the fourth initiator are each independently a photoinitiator or a thermal initiator; the second biomaterial grafted with the unsaturated functional group is a N-acryloxysuccinimide (NSA) modified grafted second biomaterial.
In one embodiment, the third initiator is a photoinitiator; in the step S22, the mass ratio of the third initiator to the acrylamide is 1 (80-200), and may be, for example, 1:90, 1:100, 1:110, 1:120, 1:130, 1:140, 1:150, 1:160, 1:170, 1:180, or 1: 190.
In one embodiment, the polymerization in step S22 is photopolymerization, and the polymerization is performed under light irradiation.
In one embodiment, the time of the light irradiation is 0.1 to 1min, and may be, for example, 0.2min, 0.3min, 0.4min, 0.5min, 0.6min, 0.7min, 0.8min, or 0.9 min. Under the above-mentioned light conditions, the second coating layer is an incompletely polymerized acrylamide layer.
In one embodiment, the fourth initiator is a thermal initiator, and the mass ratio of the fourth initiator to acrylamide in step S23 is 1 (80-200), and may be, for example, 1:90, 1:100, 1:110, 1:120, 1:130, 1:140, 1:150, 1:160, 1:170, 1:180, or 1: 190.
In one embodiment, the mass ratio of the crosslinking agent to the acrylamide in step S23 is 1 (80-200), and may be, for example, 1:90, 1:100, 1:110, 1:120, 1:130, 1:140, 1:150, 1:160, 1:170, 1:180, or 1: 190.
In one embodiment, the mixture of step S23 further comprises an accelerator; the content of the accelerator is 0.5 to 2. mu.L, for example, 0.6. mu.L, 0.8. mu.L, 1. mu.L, 1.2. mu.L, 1.5. mu.L, 1.7. mu.L or 1.9. mu.L based on 1g of the acrylamide.
In one embodiment, the photoinitiators each independently include, but are not limited to: benzoin and derivatives thereof (for example, benzoin dimethyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin butyl ether), an alkyl phenone initiator (α -diethoxyacetophenone, α -hydroxyalkyl phenone, α -aminoalkylphenone), a benzil initiator (diphenylethanone, α -dimethoxy- α -phenylacetophenone), a benzophenone initiator (benzophenone, 2, 4-dihydroxybenzophenone, michelson) or a combination of at least two of them.
In one embodiment, each of the thermal initiators independently includes any one of a peroxide-based initiator, an azo-based initiator, a persulfate-based initiator (potassium persulfate, ammonium persulfate), or a combination of at least two thereof.
In one embodiment, the crosslinking agent comprises methylene bisacrylamide.
In one embodiment, the accelerator comprises tetramethylethylenediamine.
In one embodiment, the second biomaterial grafted with unsaturated functional groups is an N-acryloxysuccinimide (NSA) modified grafted second biomaterial according to the following reaction formula:
wherein, the first and the second end of the pipe are connected with each other,
representing a second biological material.
In one embodiment, the method and process parameters for modifying the graft are the same as those for modifying the grafted first biological material, and are not described herein again.
In one embodiment, the polymerization temperature in step S24 is 45 to 60 ℃, for example, 46 ℃, 48 ℃, 50 ℃, 51 ℃, 53 ℃, 55 ℃, 57 ℃ or 59 ℃ or the like; the polymerization time is 2-5 h, for example, 2.5h, 3h, 3.5h, 4h, 4.5h, etc.
In one embodiment, the polymerization of step S24 is performed in the presence of water, thereby forming a second layer of targeting material having hydrogel properties; the second biomaterial is grafted with an unsaturated functional group (C ═ C) which participates in the hydrogel-forming polymerization reaction, and is thus fixed to the surface of the control substrate remote from the substrate with high strength and stability by the action of chemical bonds.
In one embodiment, the method of contacting and bonding the first layer of targeting material to the array of targeting materials comprises:
placing a plurality of the Micro-LED units and the control substrate in an electrolyte solution, and enabling the first targeting material layer to be in contact with the targeting material array through the flowing of the electrolyte solution, so that the bonding is realized based on the specific binding of the first biological material and the second biological material.
In one embodiment, the solute concentration in the electrolyte solution may be 0.1 to 5%, for example, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, 1%, 1.5%, 2%, 2.5%, 3%, 3.5%, 4%, or 4.5%.
In one embodiment, the pH of the electrolyte solution is 5 to 8, and may be, for example, 5.2, 5.5, 5.8, 6, 6.2, 6.5, 6.8, 7, 7.2, 7.5, 7.8, or the like; the pH value provides a suitable environment for the specific combination of the first biological material and the second biological material, and the combination and the activity of the antigen and the antibody are influenced by the pH value which is too high or too low.
In one embodiment, the electrolyte solution comprises an aqueous solution of NaCl.
In one embodiment, the electrolyte solution is a physiological saline solution with a concentration of 0.8-0.9%.
In one embodiment, the bonding temperature is 15-45 ℃, for example, 16 ℃, 18 ℃, 20 ℃, 22 ℃, 25 ℃, 28 ℃, 30 ℃, 32 ℃, 35 ℃, 36 ℃, 37 ℃, 39 ℃, 40 ℃, 42 ℃ or 44 ℃ and the like; since the bonding process is mainly performed in an electrolyte solution, the electrolyte solution has the same temperature range as the bonding. The temperature provides an appropriate environmental temperature for the specific binding between the first biomaterial and the second biomaterial, and is preferably close to the body temperature of the human body (about 37 ℃), so that if the temperature is too high, the first biomaterial and the second biomaterial are denatured, and if the temperature is too low, the dissociation, the slow reaction, and the like are likely to occur.
In one embodiment, the Micro-LED unit provided with the first targeting material layer and the control substrate provided with the targeting material array are in sufficient contact with the first targeting material layer and the targeting material array in an electrolyte solution under the flow of the electrolyte solution, and the bonding is realized through the specific binding (the spontaneous recognition and specific binding of antigen/antibody) of the first biomaterial and the second biomaterial; after the antigen is combined with the antibody, an antigen-antibody complex is formed, which has the property of hydrophobic colloid, and the interaction in the complex comprises a large number of non-covalent bonds, specifically: electrostatic interactions, van der waals forces, hydrogen bonding, hydrophobic forces, and the like.
In one embodiment, the bonding is completed by a post-treatment step, which includes washing and drying.
In a specific embodiment, after the bonding is completed, the Micro-LED substrate is taken out, the residual Micro-LED units on the surface are washed with clear water (the Micro-LED units not participating in the reaction can be recycled), and the Micro-LED substrate is obtained after drying.
In one embodiment, in order to improve the problem that the first and second biomaterials have low adhesion to each other, which may result in weak fixation of the Micro-LED unit on the substrate, the first targeting material layer and other polymerizable functional groups (e.g., residual C ═ C double bonds in acrylamide) contained in the targeting material array undergo polymerization, thereby enhancing adhesion. The polyacrylamide is connected together, the strength of the polyacrylamide can reach more than 1MPa, and the Micro-LED unit can be firmly and stably fixed on the control substrate.
In one embodiment, the first and second biological materials are not otherwise modified, i.e., are antigens and antibodies, respectively.
In another embodiment, the first biomaterial, the second biomaterial are each independently modified; the modified material comprises any one of polysaccharide (such as chitosan), polyrotaxane, enzyme, liposome, ungrafted or polyethylene glycol grafted nanoparticles or a combination of at least two of the nanoparticles.
In one embodiment, the thickness of the first layer of targeting material, the thickness of the array of targeting materials are each independently 0.5nm to 5 μm, for example 0.8nm, 1nm, 5nm, 10nm, 30nm, 50nm, 80nm, 100nm, 200nm, 300nm, 400nm, 500nm, 600nm, 700nm, 800nm, 900nm, 1 μm, 1.5 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm or 4.5 μm, and the like.
In one embodiment, the Micro-LED unit includes an LED semiconductor structure, and first and second electrodes disposed on the LED semiconductor structure; at least one of the first and second electrodes is on the same side of the LED semiconductor structure as the first layer of targeting material.
In one embodiment, the Micro-LED unit is schematically illustrated in fig. 1, and includes an LED semiconductor structure 110, a first electrode 121, a second electrode 122, a first targeting material layer 130, a wrapping layer 140; the first electrode 121, the second electrode 122 and the first targeting material layer 130 are located on the same side of the LED semiconductor structure 110.
In another embodiment, the first electrode, the second electrode and the first targeting material layer are located on the same side of the LED semiconductor structure, and a projection of the first electrode on a predetermined plane surrounds a projection of the second electrode on the predetermined plane; and the preset plane is parallel to the bonding surface. Preferably, the projection of the first electrode on a preset plane is a circle a, the projection of the second electrode on the preset plane is a circle B, and the circle a and the circle B form a concentric circle; therefore, the accuracy and yield of the electrode in the alignment connection can be ensured, and the influence caused by the rotation angle is avoided.
In one embodiment, the electrode on the same side of the LED semiconductor structure as the first layer of targeting material, on a side thereof remote from the LED semiconductor structure, is optionally provided with or without a layer of first targeting material.
In one embodiment, a schematic structural diagram of the control substrate is shown in fig. 2, and a surface of the control substrate 20 away from the substrate is provided with the targeting material array 210, the third electrode 221, and the fourth electrode 222.
In one embodiment, the third electrode 221 and the fourth electrode 222 are located in the area where the array of targeting materials 210 is located, and the side of the array that is connected to the Micro-LED units is optionally provided with or without targeting materials. Since the thickness of the array of targeting material, the first layer of targeting material, is very low, and has no significant effect on the contact of the electrodes, the surfaces of all electrodes are optionally provided with or without targeting material.
In one embodiment, the Micro-LED substrate obtained by the preparation method has a structure as shown in FIG. 3.
In one embodiment, the method for preparing the Micro-LED substrate comprises the following steps:
providing a Micro-LED unit; the bonding surface of the Micro-LED unit is provided with a first targeting material layer, and the specific method comprises the following steps: arranging an alkenyl silane coupling agent layer on the bonding surface of the Micro-LED unit; coating a mixture of acrylamide and a first initiator on the alkenyl silane coupling agent layer, and polymerizing to obtain a first coating; coating a mixture containing acrylamide, a second initiator and a cross-linking agent on the first coating to obtain a second coating; coating a first biological material grafted with unsaturated functional groups on the second coating, and polymerizing to obtain the first targeting material layer;
providing a control substrate; the surface of the control substrate far away from the substrate is provided with a targeting material array, and the specific method comprises the following steps: arranging an alkenyl silane coupling agent layer on the surface, far away from the substrate, of the control substrate according to a preset pattern; coating a mixture of acrylamide and a third initiator on the alkenyl silane coupling agent layer, and polymerizing to obtain a third coating; coating a mixture comprising acrylamide, a fourth initiator and a crosslinking agent on the third coating to obtain a fourth coating; coating a second biological material grafted with unsaturated functional groups on the fourth coating, and polymerizing to obtain the targeting material array;
and synchronously transferring the plurality of Micro-LED units to a control substrate and placing the control substrate in an electrolyte solution, enabling the first targeting material layer to be in contact with the targeting material array through the flowing of the electrolyte solution, and realizing bonding based on the specific binding of the first biological material and the second biological material to obtain the Micro-LED substrate.
Another object of the present invention is to provide a Micro-LED substrate, comprising:
a control substrate; the control substrate comprises a plurality of sub-pixel regions;
the Micro-LED unit array comprises a plurality of Micro-LED units, and the Micro-LED units are correspondingly bound with the sub-pixel areas one by one;
the bonding layer is arranged between the control substrate and the Micro-LED unit; an antigen-antibody complex is included in the bonding layer.
In one embodiment, the Micro-LED substrate is prepared by a method of preparation according to one of the objects.
In one embodiment, the bonding layer is formed by contacting and reacting a first layer of targeting material with an array of materials of a targeting material, including an antigen-antibody complex formed by specific binding of a first biomaterial to a second biomaterial.
In one embodiment, the bonding layer further comprises an acrylamide-based polymer; the acrylamide-based polymer is used as a bridging material to bridge the antigen-antibody compound with the control substrate and the Micro-LED unit. The third object of the present invention is to provide a display panel, which comprises the Micro-LED substrate of the second object.
Example 1
In one embodiment, a method for preparing a Micro-LED substrate is provided, which specifically includes the following steps:
(1) providing a Micro-LED unit, wherein a first targeting material layer is arranged on a bonding surface of the Micro-LED unit, and the specific method comprises the following steps:
firstly, arranging an Optical Coating (OC) layer as a wrapping layer on a non-bonding surface of a Micro-LED unit; then peeling the Micro-LED unit from the LED substrate; placing the stripped bonding surface of the Micro-LED unit in a vinyl silane coupling agent solution, and reacting for 12 hours at room temperature to obtain a vinyl silane coupling agent layer on the bonding surface of the Micro-LED unit;
coating a mixture of acrylamide and a photoinitiator (the mass ratio of the acrylamide to the photoinitiator is 100:1) on the vinyl silane coupling agent layer, and polymerizing for 40s under ultraviolet irradiation to obtain a first coating;
coating a mixture containing acrylamide, a thermal initiator, a cross-linking agent and an accelerator on the first coating, wherein the mass ratio of the acrylamide to the thermal initiator to the cross-linking agent is 100:1:1, and adding 1 mu L of the accelerator into each gram of the acrylamide to obtain a second coating;
and coating a layer of N-acryloyloxy succinimide (NSA) modified and grafted first biological material (goat anti-rabbit IgG) on the second coating, and polymerizing for 4 hours at 55 ℃ in the presence of water to obtain a first targeting material layer, namely an antibody hydrogel layer, with the thickness of 120 nm.
(2) Providing a control substrate; the surface of the control substrate far away from the substrate is provided with a targeting material array, and the specific method comprises the following steps:
placing the surface, far away from the substrate, of the control substrate in a vinyl silane coupling agent solution according to a preset pattern, and reacting for 12 hours at room temperature to obtain a vinyl silane coupling agent layer on the surface, far away from the substrate, of the control substrate;
coating a mixture of acrylamide and a photoinitiator (the mass ratio of the acrylamide to the photoinitiator is 100:1) on the vinyl silane coupling agent layer, and polymerizing for 40s under ultraviolet irradiation to obtain a third coating;
coating a mixture containing acrylamide, a thermal initiator, a cross-linking agent and an accelerator on the third coating, wherein the mass ratio of the acrylamide to the thermal initiator to the cross-linking agent is 100:1:1, and 1 mu L of the accelerator is added into each gram of the acrylamide to obtain a fourth coating;
coating a layer of N-acryloyloxy succinimide (NSA) modified and grafted second biological material (rabbit IgG) on the fourth coating, and polymerizing for 5 hours at 50 ℃ in the presence of water to obtain the targeting material array, wherein the material is antigen hydrogel and the thickness of the targeting material array is 150 nm;
(3) synchronously transferring the Micro-LED units obtained in the step (1) to a control substrate, placing the control substrate in an electrolyte solution (0.9% physiological saline), controlling the temperature of a system to be about 37 ℃, enabling a first targeting material layer to be in contact with a targeting material array through the flowing of the electrolyte solution, and realizing bonding based on the specific binding of an antibody and an antigen; and obtaining the Micro-LED substrate.
The applicant states that the present invention is illustrated by the above examples to a Micro-LED substrate and a method for preparing the same and applications thereof, but the present invention is not limited to the above process steps, i.e. it does not mean that the present invention must rely on the above process steps to be implemented. It will be apparent to those skilled in the art that any modification of the present invention, equivalent substitutions of selected materials and additions of auxiliary components, selection of specific modes and the like, which are within the scope and disclosure of the present invention, are contemplated by the present invention.
Claims (10)
1. A preparation method of a Micro-LED substrate is characterized by comprising the following steps:
providing a Micro-LED unit; a first targeting material layer is arranged on the bonding surface of the Micro-LED unit;
providing a control substrate; a targeting material array is arranged on the surface of the control substrate far away from the substrate;
synchronously transferring the Micro-LED units to a control substrate, and enabling the first targeting material layer to be in contact with and bonded with a targeting material array to obtain the Micro-LED substrate;
the first targeting material layer comprises a first biological material, and the material of the targeting material array comprises a second biological material which is specifically combined with the first biological material; the first biological material is an antigen or an antibody;
the method for arranging the first targeting material layer comprises the following steps:
an alkenyl silane coupling agent layer is arranged on the bonding surface of the Micro-LED unit;
coating a mixture of acrylamide and a first initiator on the alkenyl silane coupling agent layer, and polymerizing to obtain a first coating;
coating a mixture containing acrylamide, a second initiator and a cross-linking agent on the first coating to obtain a second coating;
and coating a first biological material grafted with unsaturated functional groups on the second coating layer, and polymerizing to obtain the first targeting material layer.
2. The method of manufacturing according to claim 1, wherein a wrapping layer is disposed on a non-bonding side of the Micro-LED unit, and after the Micro-LED unit is peeled off from the LED substrate, a first layer of targeting material is disposed on a bonding side of the Micro-LED unit.
3. The method of claim 1, wherein the first initiator and the second initiator are each independently a photoinitiator or a thermal initiator; the first biological material grafted with the unsaturated functional group is N-acryloxysuccinimide modified grafted first biological material.
4. The method of claim 1, wherein the step of disposing the array of targeting materials comprises:
arranging an alkenyl silane coupling agent layer on the surface, far away from the substrate, of the control substrate according to a preset pattern;
coating a mixture of acrylamide and a third initiator on the alkenyl silane coupling agent layer, and polymerizing to obtain a third coating;
coating a mixture comprising acrylamide, a fourth initiator and a crosslinking agent on the third coating to obtain a fourth coating;
and coating a second biological material grafted with unsaturated functional groups on the fourth coating, and polymerizing to obtain the targeting material array.
5. The method according to claim 4, wherein the third initiator and the fourth initiator are each independently a photoinitiator or a thermal initiator; the second biological material grafted with the unsaturated functional group is N-acryloyloxy succinimide modified grafted second biological material.
6. The method of claim 1, wherein the step of contacting and bonding the first layer of targeting material to the array of targeting materials comprises:
placing a plurality of the Micro-LED units and the control substrate in an electrolyte solution, and enabling the first targeting material layer to be in contact with the targeting material array through the flowing of the electrolyte solution, so that the bonding is realized based on the specific binding of the first biological material and the second biological material.
7. The method according to claim 1, wherein the first biomaterial and the second biomaterial are each independently modified; the modified material comprises any one or the combination of at least two of polysaccharide, polyrotaxane, enzyme, liposome and nanoparticle which is not grafted or grafted by polyethylene glycol.
8. The method of manufacturing according to claim 1, wherein the Micro-LED unit comprises an LED semiconductor structure, and a first electrode and a second electrode disposed on the LED semiconductor structure; at least one of the first and second electrodes is located on the same side of the LED semiconductor structure as the first layer of targeting material.
9. A Micro-LED substrate, comprising:
a control substrate; the control substrate comprises a plurality of sub-pixel regions;
the Micro-LED unit array comprises a plurality of Micro-LED units, and the Micro-LED units are correspondingly bound with the sub-pixel areas one by one;
the bonding layer is arranged between the control substrate and the Micro-LED unit; an antigen-antibody complex is included in the bonding layer;
the Micro-LED substrate is prepared by the preparation method of any one of claims 1 to 8.
10. A display panel comprising the Micro-LED substrate of claim 9.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109494292A (en) * | 2018-10-30 | 2019-03-19 | 青岛海信电器股份有限公司 | A kind of micro-led lamp plate, its production method and display device |
| CN109994413A (en) * | 2017-12-29 | 2019-07-09 | 南昌欧菲显示科技有限公司 | Micro element flood tide transfer method |
| WO2019146862A1 (en) * | 2018-01-25 | 2019-08-01 | 우영관 | Method for transferring micro-led |
| CN111769054A (en) * | 2020-06-12 | 2020-10-13 | 福州大学 | Mass transfer method of color mu LED |
| CN113451456A (en) * | 2021-05-12 | 2021-09-28 | 乙力国际股份有限公司 | Laser eutectic welding device and method for micro LED chip and control substrate |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7977130B2 (en) * | 2006-08-03 | 2011-07-12 | The Invention Science Fund I, Llc | Method of assembling displays on substrates |
| US11894350B2 (en) * | 2014-10-31 | 2024-02-06 | e Lux, Inc. | Fluidic assembly enabled mass transfer for microLED displays |
-
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109994413A (en) * | 2017-12-29 | 2019-07-09 | 南昌欧菲显示科技有限公司 | Micro element flood tide transfer method |
| WO2019146862A1 (en) * | 2018-01-25 | 2019-08-01 | 우영관 | Method for transferring micro-led |
| CN109494292A (en) * | 2018-10-30 | 2019-03-19 | 青岛海信电器股份有限公司 | A kind of micro-led lamp plate, its production method and display device |
| CN111769054A (en) * | 2020-06-12 | 2020-10-13 | 福州大学 | Mass transfer method of color mu LED |
| CN113451456A (en) * | 2021-05-12 | 2021-09-28 | 乙力国际股份有限公司 | Laser eutectic welding device and method for micro LED chip and control substrate |
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