CN114019592A - Antireflection structure, manufacturing method thereof and optical device - Google Patents
Antireflection structure, manufacturing method thereof and optical device Download PDFInfo
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- CN114019592A CN114019592A CN202111314471.6A CN202111314471A CN114019592A CN 114019592 A CN114019592 A CN 114019592A CN 202111314471 A CN202111314471 A CN 202111314471A CN 114019592 A CN114019592 A CN 114019592A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
- G02B1/118—Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
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Abstract
The application discloses subtract reflection structure body includes: a substrate; the microstructure array is positioned on the upper surface of the substrate and comprises a plurality of microstructures which are irregularly and rectangularly arranged. The antireflection structure comprises a substrate and a microstructure array arranged on the substrate, wherein a plurality of microstructures in the microstructure array are irregularly arranged, so that scattered light can be uniformly distributed in space through the microstructure array, and the reflection light intensity of all angles is relatively small, so that glare is prevented from being generated on the surface of the antireflection structure. In addition, the application also provides a manufacturing method of the antireflection structure and an optical device with the advantages.
Description
Technical Field
The present disclosure relates to the field of optical technologies, and in particular, to an antireflection structure, a method for manufacturing the antireflection structure, and an optical device.
Background
Fresnel reflections occur when light is incident on the interface between two media, and such reflections can greatly impede the transmission and detection of light energy. In order to enhance the antireflection effect, a cone microstructure array may be disposed on the upper surface of the substrate, where the cone microstructure array includes cone microstructures, the plurality of cone microstructures are regularly arranged in a rectangular shape or in a honeycomb shape, the cone microstructures may be cones, parabolic cones, pyramids, and the like, and the cone microstructure array may be regarded as a layer of film having gradient distribution of gradually-changed refractive index, which may reduce a refractive index difference between the upper surface of the substrate and air, thereby achieving the broadband antireflection effect.
When the wavelength of light is smaller than the size of the cone microstructure, because the cone microstructures are regularly arranged, the light can be scattered on the surface of the cone microstructure array, the scattered light is unevenly distributed in space, and strong reflected light, namely glare, can exist at a specific angle. Glare has a great hazard, for example, when entering human eyes, glare can cause discomfort and even harm to human eyes; when glare enters the optical device, it can cause damage to the optical device.
Therefore, how to solve the above technical problems should be a great concern to those skilled in the art.
Disclosure of Invention
The application aims to provide an antireflection structure, a manufacturing method thereof and an optical device so as to avoid glare.
In order to solve the above technical problem, the present application provides an antireflection structure, including:
a substrate;
the microstructure array is positioned on the upper surface of the substrate and comprises a plurality of microstructures which are irregularly arranged.
Optionally, in the antireflection structure, an upper surface of the microstructure is planar.
Optionally, in the antireflection structure, the substrate and the microstructure are made of the same material.
Optionally, in the antireflection structure, the substrate and the microstructure are made of different materials.
Optionally, in the antireflection structure, the microstructure array is in any one of a spiral arrangement, a circular arrangement, a quasi-rectangular arrangement, and a splicing arrangement.
Optionally, in the antireflection structure, the shape of the microstructure is any one of a cylinder, a truncated pyramid, and a prism.
Optionally, in the antireflection structure, a square of an equivalent refractive index of the microstructure array is equal to a product of a refractive index of the substrate and a refractive index of air.
The present application also provides a method for manufacturing an antireflection structure, including:
obtaining a substrate;
and preparing a microstructure array on the upper surface of the substrate, wherein the microstructure array comprises a plurality of microstructures which are irregularly arranged.
Optionally, in the manufacturing method of the antireflection structure, when the materials of the microstructure and the substrate are the same, the preparing a microstructure array on the upper surface of the substrate includes:
coating photoresist on the upper surface of the substrate, and baking the photoresist;
exposing the photoresist and baking the photoresist again;
developing the photoresist;
and etching the substrate to form the microstructure array, and removing the photoresist.
The present application also provides an optical device including any one of the antireflection structures described above.
An antireflection structure provided by the present application includes: a substrate; the microstructure array is positioned on the upper surface of the substrate and comprises a plurality of microstructures which are irregularly and rectangularly arranged.
Therefore, the antireflection structure comprises a substrate and a microstructure array arranged on the substrate, and as a plurality of microstructures in the microstructure array are irregularly arranged, the microstructure array can enable scattered light to be uniformly distributed in space, and the reflection light intensity of all angles is relatively small, so that glare is prevented from being generated on the surface of the antireflection structure.
In addition, the application also provides a manufacturing method of the antireflection structure and an optical device with the advantages.
Drawings
For a clearer explanation of the embodiments or technical solutions of the prior art of the present application, the drawings needed for the description of the embodiments or prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic cross-sectional view of an antireflection structure provided in an embodiment of the present application;
fig. 2 to 5 are schematic views of microstructures with different shapes provided in the embodiments of the present application;
fig. 6 and 7 are schematic arrangements of the microstructure array provided in the present application;
FIG. 8 is a schematic diagram of an arrangement of a conventional microstructure array;
fig. 9 to 11 are schematic arrangement diagrams of other microstructure arrays provided in the present application;
fig. 12 is a schematic cross-sectional view of another antireflection structure provided in an example of the present application;
fig. 13 is a graph showing transmittance of light rays of different wavelengths for the antireflection structure of the present application and the conventional antireflection structure of the related art;
fig. 14 is a flowchart of a method for manufacturing an anti-reflective structure according to the present application.
Detailed Description
In order that those skilled in the art will better understand the disclosure, the following detailed description will be given with reference to the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described and will be readily apparent to those of ordinary skill in the art without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
As described in the background section, in order to enhance the antireflection effect, a cone microstructure array may be disposed on the upper surface of the substrate, and a plurality of cone microstructures in the cone microstructure array are regularly and rectangularly arranged, when the wavelength of the light is smaller than the size of the cone microstructures, the light may be scattered on the surface of the cone microstructure array, the scattered light may be unevenly distributed in space, and there may be strong reflected light at a specific angle, that is, glare, which has a great hazard.
In view of the above, the present application provides an antireflection structure, please refer to fig. 1, where fig. 1 is a schematic structural diagram of an antireflection structure provided in an embodiment of the present application, including:
a substrate 1;
the microstructure array is positioned on the upper surface of the substrate 1 and comprises a plurality of microstructures 2, and the microstructures 2 are irregularly arranged.
It should be noted that the shape of the microstructure 2 is not particularly limited in the present application, and for example, the shape of the microstructure 2 is any one of a cylinder, a truncated pyramid, a truncated cone (as shown in fig. 2), a truncated cone (as shown in fig. 3), a curved truncated cone (as shown in fig. 4), a cone (as shown in fig. 5), a parabolic cone, and a pyramid. A truncated pyramid, i.e. a pyramid, removes a portion of the tip.
It should be noted that, in the present application, the arrangement of the microstructure array is not particularly limited, and may be set by itself. For example, the microstructure array is in any one of a spiral arrangement, a circular arrangement, a quasi-rectangular arrangement, and a splicing arrangement.
When the microstructure arrays are arranged in a quasi-rectangular shape, as shown in fig. 6 and 7, the microstructure arrays shown in fig. 6 and 7 can be seen as applying a certain displacement to the plurality of microstructures 2 arranged in a regular rectangular shape as shown in fig. 8 (an arrangement schematic diagram of the existing microstructure array), and changing the positions of the microstructures.
When the microstructure array is regularly and circularly arranged, the microstructures 2 are arranged in a plurality of concentric circles, and when the arrangement form is irregular and circularly arranged, namely a certain displacement is applied to the plurality of microstructures 2 in the regular and circularly arranged, and the positions of the microstructures are changed.
It should be noted that the microstructure array may also be arranged in a circular-like arrangement.
When the microstructure array is in a regular spiral arrangement, as shown in fig. 9, the spiral arrangement is an archimedean spiral arrangement, but the spiral arrangement is not limited to this, and other forms of spiral arrangements are also included in the scope of the present application; when the arrangement is irregular spiral arrangement, that is, a certain displacement is applied to the plurality of microstructures 2 in the regular spiral arrangement to change the positions of the microstructures, the applied displacement is not limited in this application, and may be set by itself, for example, the displacement may be non-periodic displacement or periodic displacement, as shown in fig. 10.
When the microstructure arrays are arranged in a splicing manner, the microstructure arrays comprise a plurality of sub-arrays, and the arrangement modes of the sub-arrays can be the same or different. When the sub-arrays are arranged in the same manner, the sub-arrays are obtained by rotating the same array by different angles, as shown in fig. 11. When the arrangement modes of the sub-arrays are different, the sub-arrays can be formed by splicing different sub-arrays with the periods and the duty ratios close to each other. The more complex the splicing method is, the more the splicing method helps to reduce the occurrence of glare.
Optionally, as a specific embodiment, the substrate 1 and the microstructure 2 are made of the same material, so that the manufacturing method of the antireflection structure can be simplified. However, this is not limited in the present application, and as another specific embodiment, the material of the substrate 1 is different from that of the microstructure 2.
It should be noted that the materials of the substrate 1 and the microstructure 2 are not particularly limited in this application, and depend on the wavelength of light. In an infrared band, the substrate 1 and the microstructure 2 can be made of silicon, germanium, sapphire, zinc sulfide, zinc selenide and the like; in visible light, terahertz or other wave bands, the material of the substrate 1 and the material of the microstructure 2 can be selected from materials with high transmittance in corresponding wave bands, such as quartz glass and the like.
It should be noted that, in the present application, the height of the microstructure 2, that is, the height of the microstructure array, is not limited, the height of the microstructure 2 is generally 0.3um to 4um, and the specific height value is determined according to the working band and the material of the substrate 1.
Preferably, in order to reduce the reflectivity and increase the transmittance of the microstructure array, the duty cycle of the microstructure array is 0.1 to 0.9.
The circle center pitch P (namely the period P) of the microstructure 2 is selected from 0.35um to 5 um; the diameter D of the microstructure 2 is chosen in the range of 0.2um to 4 um.
Wherein the duty cycle is defined as follows: in the range of 1mm multiplied by the height of the microstructure on the surface of the substrate, the volume of the microstructure accounts for the proportion, and the calculation formula is as follows:
where f is the duty cycle, H is the height of the microstructure, and V is the sum of the volumes of all microstructures within 1mm by 1mm of the substrate surface.
The antireflection structure comprises a substrate and a microstructure array arranged on the substrate, wherein a plurality of microstructures in the microstructure array are irregularly arranged, so that scattered light can be uniformly distributed in space through the microstructure array, and the reflection light intensity of all angles is relatively small, so that glare is prevented from being generated on the surface of the antireflection structure.
Referring to fig. 12, fig. 12 is a schematic structural diagram of another antireflection structure provided in the embodiments of the present application. On the basis of the above embodiment, in an embodiment of the present application, the upper surface of the microstructure is planar.
The shape of the microstructure with the planar upper surface includes, but is not limited to, any one of a cylinder, a frustum, a truncated cone, a curved frustum and a prism.
When the upper surface of the microstructure is planar, the microstructure array can be regarded as a two-dimensional grating in a short wave band, and incident light is strongly scattered to reduce transmission; in the long wave band, the microstructure array can be regarded as a uniform film, incident light is transmitted, and glare is avoided. That is, the antireflection structure has a short-wave cut-off property and a front cut-off property for passing a long wave, and can be applied to the fields of infrared detector windows and the like.
Preferably, the microstructure is in the shape of a cylinder, compared with a microstructure array in the shape of a truncated cone, the height of the cylinder microstructure is smaller than the period, the manufacturing process is simple, the manufacturing cost is reduced, meanwhile, the long-wave transmission capacity of the array formed by the cylinder microstructure is basically unchanged, and the transmission capacity of a short-wave band is further reduced, so that the front stopping capacity is enhanced.
The transmittance of the antireflection structure in the present application and the transmittance of the conventional antireflection structure for light with different wavelengths are shown in fig. 13, where the abscissa is the wavelength and the ordinate is the transmittance. In a short wave band, the transmittance of the antireflection structure is almost zero, light rays are basically not transmitted, and the transmittance in a long wave band is high; the anti-reflection structure in the prior art has high transmittance in a short wave band and poor front cut-off performance.
On the basis of the above embodiments, in one embodiment of the present application, the square of the equivalent refractive index of the microstructure array is equal to the product of the refractive index of the substrate and the refractive index of air, so as to enhance the transmission effect of the microstructure array.
Referring to fig. 14, fig. 14 is a flowchart of a method for fabricating an anti-reflective structure according to the present application, the method including:
step S101: a substrate is obtained.
It is noted that the substrate is a clean substrate. And (3) putting the substrate material into an acetone solution for ultrasonic cleaning for 15min, respectively cleaning the substrate material for 15min by using ethanol and deionized water, and blowing the substrate material by using a nitrogen gun after the substrate is cleaned.
Step S102: and preparing a microstructure array on the upper surface of the substrate, wherein the microstructure array comprises a plurality of microstructures which are irregularly arranged.
Wherein, the shape of the microstructure includes any one of a row but not limited to a cylinder, a frustum, a circular truncated cone, a prism (as shown in fig. 2), a truncated cone, a curved truncated cone, a parabolic cone and a pyramid. The microstructure array can be in any one of spiral arrangement, circular arrangement, quasi-rectangular arrangement and splicing arrangement.
Optionally, an upper surface of the microstructure is planar, so that the antireflection structure has a front stopping capability.
As an embodiment, when the material of the microstructure and the substrate is the same, the preparing the microstructure array on the upper surface of the substrate includes:
and step S11, coating photoresist on the upper surface of the substrate and baking the photoresist.
And spin-coating the photoresist coating on the surface of the substrate by a spin-coating method, wherein the coating thickness is 300 nm-5 um. After the glue is applied, the substrate is baked using an electric hot plate.
And step S12, exposing the photoresist, and baking the photoresist again.
And placing the mask plate on the substrate, and exposing the photoresist on the substrate, so that the pattern on the mask plate is transferred to the photoresist.
And baking is carried out again after exposure, so that the development quality can be improved.
And step S13, developing the photoresist.
The development is carried out with a developer for a development time of 10s to 120s, depending on the various graphic parameters. After development, the photoresist is repeatedly rinsed with deionized water to obtain the required photoresist pattern. And the substrate is baked again using the hot plate.
And step S14, etching the substrate to form the microstructure array, and removing the photoresist.
Etching the substrate by using a reactive ion etching machine, transferring the pattern in the photoresist to the substrate, and forming a microstructure array in a specific arrangement; and cleaning the surface of the substrate by using a photoresist remover, and removing the photoresist.
As another embodiment, when the material of the microstructure is the same as that of the substrate, the preparing the microstructure array on the upper surface of the substrate using another material as a mask includes:
step S21: and growing a hard mask on the upper surface of the substrate.
The growth mode can adopt chemical vapor deposition. The material of the hard mask may be silicon oxide, silicon nitride or other materials.
Step S22: and coating photoresist on the hard mask layer, and baking the photoresist.
And spin-coating a photoresist coating on the surface of the substrate by adopting a spin-coating method, wherein the coating thickness is 300 nm-5 um, and baking the substrate by using an electric hot plate.
Step S23: the photoresist is exposed and baked again.
And exposing the photoresist to transfer the pattern on the mask plate to the photoresist.
Step S24: and developing the photoresist.
The development is carried out with a developer for a development time of 10s to 120s, depending on the various graphic parameters. And then repeatedly rinsing with deionized water to obtain the required photoresist pattern. And the substrate is baked again using the hot plate.
Step S25: and etching the hard mask to form a mask pattern, and removing the photoresist.
And etching the hard mask by using a reactive ion etching machine, and transferring the pattern in the photoresist to the hard mask.
Step S26: and etching the substrate to form a microstructure array, and removing the hard mask.
And etching the substrate material by using a reactive ion etching machine, and transferring the pattern in the hard mask to the substrate to obtain the required microstructure array.
It should be noted that, when the microstructure array is different from the substrate material, after the substrate is obtained, the microstructure material layer is first fabricated on the substrate, and then the microstructure material layer is etched to obtain the microstructure array. For the specific process, reference may be made to the above embodiments, which are not described in detail herein.
The antireflection structure comprises a substrate and a microstructure array arranged on the substrate, wherein a plurality of microstructures in the microstructure array are irregularly arranged, so that scattered light can be uniformly distributed in space through the microstructure array, and the reflection light intensity of all angles is relatively small, so that glare is prevented from being generated on the surface of the antireflection structure.
The present application also provides an optical device including any one of the antireflection structures described above.
The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The antireflection structure, the manufacturing method thereof, and the optical device provided by the present application are described in detail above. The principles and embodiments of the present application are explained herein using specific examples, which are provided only to help understand the method and the core idea of the present application. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.
Claims (10)
1. An antireflection structure, comprising:
a substrate;
the microstructure array is positioned on the upper surface of the substrate and comprises a plurality of microstructures which are irregularly arranged.
2. The antireflection structure of claim 1 wherein the upper surface of the microstructure is planar.
3. The antireflection structure of claim 1 wherein the substrate and the microstructure are the same material.
4. The antireflection structure of claim 1 wherein the substrate and the microstructure are different materials.
5. The antireflection structure of claim 1, wherein the microstructure array is in any one of a spiral arrangement, a circular arrangement, a quasi-rectangular arrangement, and a tiled arrangement.
6. The antireflection structure of claim 2, wherein the microstructure has a shape of any one of a cylinder, a truncated pyramid, and a prism.
7. The antireflection structure of any of claims 1 to 6 wherein the square of the equivalent refractive index of the microstructure array is equal to the product of the refractive index of the substrate and the refractive index of air.
8. A method for manufacturing an antireflection structure, comprising:
obtaining a substrate;
and preparing a microstructure array on the upper surface of the substrate, wherein the microstructure array comprises a plurality of microstructures which are irregularly arranged.
9. The method of claim 8, wherein when the microstructures and the substrate are the same material, the preparing an array of microstructures on the top surface of the substrate comprises:
coating photoresist on the upper surface of the substrate, and baking the photoresist;
exposing the photoresist and baking the photoresist again;
developing the photoresist;
and etching the substrate to form the microstructure array, and removing the photoresist.
10. An optical device, characterized in that it comprises an antireflection structure as claimed in any of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202111314471.6A CN114019592A (en) | 2021-11-08 | 2021-11-08 | Antireflection structure, manufacturing method thereof and optical device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111314471.6A CN114019592A (en) | 2021-11-08 | 2021-11-08 | Antireflection structure, manufacturing method thereof and optical device |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008158293A (en) * | 2006-12-25 | 2008-07-10 | Nissan Motor Co Ltd | Hydrophilic antireflection structure |
| CN104185800A (en) * | 2012-03-28 | 2014-12-03 | 索尼公司 | Optical element and method for manufacturing same, optical system, imaging device, optical device, and master plate |
| CN104516032A (en) * | 2013-09-26 | 2015-04-15 | 索尼公司 | Laminated body, imaging element package, imaging apparatus, and electronic apparatus |
| CN110073247A (en) * | 2016-12-16 | 2019-07-30 | 索尼公司 | Optical element, imaging element package, imaging device and electronic equipment |
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2021
- 2021-11-08 CN CN202111314471.6A patent/CN114019592A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008158293A (en) * | 2006-12-25 | 2008-07-10 | Nissan Motor Co Ltd | Hydrophilic antireflection structure |
| CN104185800A (en) * | 2012-03-28 | 2014-12-03 | 索尼公司 | Optical element and method for manufacturing same, optical system, imaging device, optical device, and master plate |
| CN104516032A (en) * | 2013-09-26 | 2015-04-15 | 索尼公司 | Laminated body, imaging element package, imaging apparatus, and electronic apparatus |
| CN110073247A (en) * | 2016-12-16 | 2019-07-30 | 索尼公司 | Optical element, imaging element package, imaging device and electronic equipment |
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