CN114001580A - Waste heat recovery system connected to waste liquid and waste gas collecting pipe of electroplating device - Google Patents
Waste heat recovery system connected to waste liquid and waste gas collecting pipe of electroplating device Download PDFInfo
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- CN114001580A CN114001580A CN202111356944.9A CN202111356944A CN114001580A CN 114001580 A CN114001580 A CN 114001580A CN 202111356944 A CN202111356944 A CN 202111356944A CN 114001580 A CN114001580 A CN 114001580A
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- waste
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- evaporator
- electroplating
- waste liquid
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- 238000009713 electroplating Methods 0.000 title claims abstract description 91
- 239000007788 liquid Substances 0.000 title claims abstract description 84
- 239000002699 waste material Substances 0.000 title claims abstract description 77
- 239000002912 waste gas Substances 0.000 title claims abstract description 76
- 239000002918 waste heat Substances 0.000 title claims abstract description 41
- 238000011084 recovery Methods 0.000 title claims abstract description 24
- 239000007789 gas Substances 0.000 claims abstract description 66
- 238000001035 drying Methods 0.000 claims abstract description 18
- 238000010438 heat treatment Methods 0.000 claims abstract description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 17
- 239000000446 fuel Substances 0.000 abstract description 8
- 238000005516 engineering process Methods 0.000 abstract description 6
- 238000004064 recycling Methods 0.000 abstract description 6
- 239000002351 wastewater Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000007747 plating Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D21/0001—Recuperative heat exchangers
- F28D21/0012—Recuperative heat exchangers the heat being recuperated from waste water or from condensates
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B30/00—Heat pumps
- F25B30/06—Heat pumps characterised by the source of low potential heat
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28B—STEAM OR VAPOUR CONDENSERS
- F28B9/00—Auxiliary systems, arrangements, or devices
- F28B9/08—Auxiliary systems, arrangements, or devices for collecting and removing condensate
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D21/0001—Recuperative heat exchangers
- F28D21/0014—Recuperative heat exchangers the heat being recuperated from waste air or from vapors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/56—Heat recovery units
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Electroplating Methods And Accessories (AREA)
- Heat Treatment Of Water, Waste Water Or Sewage (AREA)
Abstract
The invention discloses a waste heat recovery system connected to a waste liquid and waste gas collecting pipe of an electroplating device, wherein a circulating working medium circulates in an electroplating liquid condenser, a waste liquid evaporator, a waste gas evaporator, a gas evaporator and a gas condenser in sequence; the invention fully considers the heat demand and waste heat resource condition of the electroplating industry, integrates the waste heat recovery of the electroplating waste liquid and the waste gas into a system by combining the heat pump technology, forms a waste heat recovery system which is connected to a waste liquid and waste gas collecting pipe of an electroplating device by combining the heat pump technology, fully utilizes the waste heat resource of the process, meets the heat demand of drying an electroplated part and heating an electroplating bath, realizes the recycling of waste heat, and compared with the traditional scheme of consuming fuel to produce steam for heating, the scheme can save fuel, save energy and reduce emission.
Description
Technical Field
The invention belongs to the technical field of waste heat recycling equipment, and particularly relates to a waste heat recycling system connected to a waste liquid and waste gas collecting pipe of an electroplating device.
Background
Electroplating is a process of plating a layer of other metals or alloys on the surface of a metal by utilizing the electrolysis principle to improve the performance of the metal, and in the electroplating process, the material generally needs to be subjected to the steps of chemical cleaning, electrolytic processing, water washing, electroplating, drying and the like. In the electroplating link, with heat demand and waste heat resource coexistence, certain heat is contained in the electroplating waste liquid, still can produce electroplating waste gas among the electroplating process, the stoving process of plated item also is one of the heat-consuming process, use steam to heat and dry the electroplating component indirectly as heating medium usually, the stoving gas that carries vapor is often directly discharged into the atmosphere, with these waste gases, the waste liquid is direct to be discharged into the external world, can destroy natural environment, also can cause thermal waste. The Chinese patent with the application number of 2015205884244 and the name of the invention being an electroplating waste gas waste heat recovery device discloses an electroplating waste gas waste heat recovery device which is suitable for the waste heat recovery of electroplating waste gas; the Chinese patent with the application number of 2016200763125 and the name of the invention of the device for recovering the electroplating wastewater recovers the electroplating wastewater through multi-stage evaporation and multi-stage condensation, is suitable for improving the utilization rate of water and utilizes the waste heat of the wastewater. The above prior patents do not utilize waste water and waste heat by simultaneous recovery.
Disclosure of Invention
The invention aims to overcome the technical problem that only waste water or waste gas waste heat is utilized in the prior art, and provides a waste heat recovery system which can simultaneously utilize waste water and waste gas waste heat generated by an electroplating process and can be used for meeting the internal heat demand of the electroplating process, thereby reducing the heat of the waste water and waste gas discharged into the environment and realizing energy conservation and emission reduction and is connected to a waste liquid and waste gas collecting pipe of an electroplating device.
In order to solve the technical problems, the invention is realized by the following technical scheme:
a waste heat recovery system connected to a waste liquid and waste gas collecting pipe of an electroplating device comprises an electroplating bath, wherein an electroplating solution condenser is arranged in the electroplating bath, a circulating working medium is arranged in the electroplating solution condenser, the waste heat recovery system also comprises a waste liquid evaporator, a waste gas evaporator, a gas evaporator and a gas condenser, and the circulating working medium circulates and circulates in the electroplating solution condenser, the waste liquid evaporator, the waste gas evaporator, the gas evaporator and the gas condenser in sequence; the waste liquid of the electroplating bath is discharged into a waste liquid evaporator, the waste liquid evaporator is also communicated with a waste liquid collecting pipe of the electroplating device, and the waste liquid generated by electroplating enters the waste liquid evaporator, heats the circulating working medium which flows into the waste liquid evaporator and then is discharged through a waste liquid discharge pipe connected to the waste liquid evaporator; the waste gas evaporator is communicated with a waste gas collecting pipe of the electroplating device, waste gas generated by electroplating enters the waste gas evaporator, and is discharged through a waste gas discharge pipe connected to the waste gas evaporator after heating the circulating working medium flowing into the waste gas evaporator;
the gas evaporator is communicated with a drying box exhaust pipe of the electroplating device, steam discharged into the gas evaporator by the drying box heats the circulating working medium which is communicated with the gas evaporator, and then is discharged into the gas condenser, and the circulating working medium which is communicated with the gas condenser is cooled and then is discharged into the drying box; the circulating working medium cooled by the gas condenser enters the electroplating solution condenser, is heated by the electroplating solution in the electroplating bath, and circulates to the waste liquid evaporator again.
Preferably, the gas evaporator is connected with a cold air pipe and a circulating fan, and the circulating working medium which circulates to the gas evaporator is heated and then discharged into the gas condenser through the cold air pipe and the circulating fan.
Preferably, the waste gas evaporator is connected with a waste gas steam trap, the gas evaporator is connected with a gas steam trap, the waste gas steam trap and the gas steam trap are communicated to a condensate pipe, and the condensate pipe is communicated with the waste liquid collecting pipe. The waste gas steam trap and the gas steam trap discharge the condensed water in the steam heating pipeline to the outside of the pipeline.
Preferably, in order to control the discharge amount of the waste liquid in the plating tank, a waste liquid communicating pipe is connected between the plating tank and the waste liquid evaporator, a drain valve is arranged on the pipeline, and the waste liquid in the plating tank is discharged into the waste liquid evaporator through the drain valve.
Preferably, the cycle fluid is nitrogen or air.
Compared with the prior art, the invention has the beneficial effects that:
the invention fully considers the heat demand and waste heat resource condition of the electroplating industry, integrates the waste heat recovery of the electroplating waste liquid and the waste gas into a system by combining the heat pump technology, forms a waste heat recovery system which is connected to the waste liquid and the waste gas collecting pipe of the electroplating device by combining the heat pump technology, and finally cools the waste gas and the waste water discharged to the environment by the system, thus being environment-friendly; the system fully utilizes the self waste heat resource of the process, meets the heat requirements of drying of the electroplated part and heating of the electroplating bath, realizes the recycling of waste heat, obtains the energy efficiency COP value of the system at 3-5 through experimental research and calculation, and compares with the traditional scheme of consuming fuel to produce steam for heating, so that the scheme can save fuel, and is more energy-saving and emission-reducing.
Drawings
FIG. 1 is a schematic flow diagram of a waste heat recovery system of the present invention.
In fig. 1: a waste liquid evaporator 1; an exhaust gas evaporator 2; a gas evaporator 3; a compressor 4; a gas condenser 5; an electroplating solution condenser 6; an expansion valve 7; an electroplating bath 8; a drain valve 9; a waste liquid discharge pipe 10; an exhaust gas collecting pipe 11; an exhaust gas fan 12; an exhaust gas discharge pipe 13; a hot air duct 14; a plated item drying box 15; a cold air pipe 16; a circulating fan 17; an exhaust gas trap 18; a gas trap 19; a condensate pipe 20; and a waste liquid collecting pipe 21.
Detailed Description
In order to make the technical solutions of the present invention better understood by those skilled in the art, the present invention will be further described in detail by the following embodiments with reference to the accompanying drawings.
Referring to fig. 1, a waste heat recovery system connected to a waste liquid and waste gas collecting pipe of an electroplating device comprises a waste liquid evaporator 1, a waste gas evaporator 2, a gas evaporator 3, a compressor 4, a gas condenser 5, an electroplating solution condenser 6, an expansion valve 7, an electroplating bath 8, a liquid discharge valve 9, a waste liquid discharge pipe 10, a waste gas collecting pipe 11, a waste gas fan 12, a waste gas discharge pipe 13, a hot air pipe 14, an electroplated part drying box 15, a cold air pipe 16, a circulating fan 17, a waste gas steam trap 18, a gas steam trap 19, a condensate pipe 20 and a waste liquid collecting pipe 21;
the waste liquid evaporator 1, the waste gas evaporator 2, the gas evaporator 3, the compressor 4, the gas condenser 5, the electroplating liquid condenser 6 and the expansion valve 7 are sequentially connected by pipelines to form a heat pump closed-loop system; the electroplating solution condenser 6 is arranged inside the electroplating bath 8; a liquid discharge pipeline provided with a liquid discharge valve 9 is also connected between the electroplating bath 8 and the waste liquid evaporator 1, and a waste liquid collecting pipe 21 is connected on the liquid discharge pipeline; the waste liquid evaporator 1 is communicated with a waste liquid discharge pipe 10; the waste gas collecting pipe 11, the waste gas fan 12, the waste gas evaporator 2 and the waste gas discharge pipe 13 are connected in sequence; the plated item drying box 15, the gas evaporator 3, the circulating fan 17 and the gas condenser 5 are sequentially connected by pipelines to form a plated item drying closed-loop system; the gas condenser 5 is connected with a plated item drying box 15 through a hot air pipe 14; the gas evaporator 3 is communicated with the circulating fan 17 through a cold air pipe 16; the waste gas evaporator 2 is connected with a waste gas steam trap 18, the gas evaporator 3 is connected with a gas steam trap 19, and two pipelines respectively connected with the waste gas steam trap 18 and the gas steam trap 19 are crossed to form a condensate pipe 20.
In this embodiment, the circulating medium is air.
After the electroplating is finished, the drain valve 9 is opened, the waste liquid in the electroplating bath 8 and other waste liquid in the electroplating process flowing into the waste liquid collecting pipe 21 enter the waste liquid evaporator 1 together to provide heat for a circulating working medium of a heat pump closed-loop system in the waste liquid evaporator 1, and finally the waste liquid is discharged by the waste liquid discharge pipe 10 and enters a subsequent waste liquid treatment process; the circulating working medium of the heat pump closed-loop system then enters the waste gas evaporator 2 and the gas evaporator 3 to continuously absorb heat until the working medium is completely changed into a steam state; the heat source of the waste gas evaporator 2 is electroplating process waste gas flowing in from the waste gas collecting pipe 11, and the waste gas after heat exchange is discharged through a waste gas discharge pipe 13 and enters a subsequent waste gas treatment process; the circulation working medium in the steam state is pressurized by the compressor 4, and then completes the closed-loop circulation of the heat pump after passing through the gas condenser 5, the electroplating liquid condenser 6 and the expansion valve 7 in sequence, wherein the expansion valve is used for reducing the pressure and the temperature; the circulating working medium of the heat pump closed-loop system releases heat in the electroplating solution condenser 6, the electroplating bath 8 obtains heat, and the temperature is monitored by arranging a temperature sensor in the electroplating bath, so that the temperature requirement of the electroplating process is met; the pressurized circulating working medium enters the gas condenser 5, the steam discharged into the gas condenser 5 through the gas evaporator 3 cools the circulating working medium, the circulating working medium releases heat, the steam in the gas condenser 5 is heated and is brought into the electroplated part drying box 15 through the hot air pipe 14, the electroplated part is dried and passivated stably, and the circulating working medium is cooled and dehydrated in the gas evaporator 3.
And the heat source gas outlets of the waste gas evaporator 2 and the gas evaporator 3 are respectively provided with a waste gas steam trap 18 and a gas steam trap 19 which are used for discharging condensed water, and the condensed water is finally converged through a condensed water pipe 20 and is discharged out of the system.
The invention utilizes the system to carry out a plurality of groups of experiments under different working conditions by changing the temperature of electroplating liquid, the temperature of electroplating waste gas and the steam temperature of the drying box in the electroplating bath. And (3) counting data in the experimental process, and finally calculating to obtain an energy efficiency value of the system, wherein the result is shown in the following table 1.
TABLE 1 System energy efficiency values corresponding to different working conditions
The system energy efficiency COP in the table above is the ratio of the energy obtained by the system to the electrical energy consumed by the system operating. It can be seen from the above table that, the system makes full use of the waste heat resource of the process, meets the heat requirements of drying of the electroplated part and heating of the electroplating bath, realizes the recycling of waste heat, has an energy efficiency COP value of 3-5, and is compared with the traditional scheme of consuming fuel to produce steam for heating, so that the scheme can save fuel, and is more energy-saving and emission-reducing.
The invention fully considers the heat demand and waste heat resource condition of the electroplating industry, integrates the waste heat recovery of the electroplating waste liquid and the waste gas into a system by combining the heat pump technology, forms a waste heat recovery system which is connected to a waste liquid and waste gas collecting pipe of an electroplating device by combining the heat pump technology, fully utilizes the waste heat resource of the process to meet the heat demand of the drying of an electroplated part and the heating of an electroplating bath, realizes the recycling of waste heat, and compared with the traditional scheme of consuming fuel to produce steam for heating, the scheme can save fuel, save energy and reduce emission.
The non-illustrated parts referred to in the present invention are the same as or implemented by the prior art.
The description of the embodiments of the present invention is only for the purpose of assisting understanding of the core idea of the present invention, and is not intended to limit the embodiments of the present invention. It should be understood that any modification, equivalent replacement, and improvement made by those skilled in the art without departing from the principle of the present invention shall be included in the protection scope of the claims of the present invention.
Claims (5)
1. A waste liquid and waste gas collecting pipe waste heat recovery system connected to an electroplating device comprises an electroplating bath (8) and is characterized in that an electroplating solution condenser (6) is arranged in the electroplating bath, a circulating working medium is arranged in the electroplating solution condenser, the waste heat recovery system also comprises a waste liquid evaporator (1), a waste gas evaporator (2), a gas evaporator (3) and a gas condenser (5), and the circulating working medium circulates in the electroplating solution condenser, the waste liquid evaporator (1), the waste gas evaporator (2), the gas evaporator (3) and the gas condenser (5) in sequence; the waste liquid of the electroplating bath is discharged into a waste liquid evaporator, the waste liquid evaporator is also communicated with a waste liquid collecting pipe (21) of the electroplating device, the waste liquid generated by electroplating enters the waste liquid evaporator, and after the circulating working medium which flows into the waste liquid evaporator is heated, the waste liquid is discharged through a waste liquid discharge pipe (10) connected to the waste liquid evaporator; the waste gas evaporator is communicated with a waste gas collecting pipe (11) of the electroplating device, waste gas generated by electroplating enters the waste gas evaporator, and is discharged through a waste gas discharge pipe (13) connected to the waste gas evaporator after heating the circulating working medium flowing into the waste gas evaporator;
the gas evaporator is communicated with an exhaust pipe of a drying box (15) of the electroplating device, steam discharged into the gas evaporator by the drying box is discharged into the gas condenser after heating the circulating working medium which is convectively communicated into the gas evaporator, and the circulating working medium which is convectively communicated into the gas condenser is cooled and then is discharged into the drying box; the circulating working medium cooled by the gas condenser enters the electroplating solution condenser, is heated by the electroplating solution in the electroplating bath, and circulates to the waste liquid evaporator again.
2. The waste heat recovery system connected to a waste liquid and waste gas collecting pipe of an electroplating device according to claim 1, wherein a cold air pipe (16) and a circulating fan (17) are connected to the gas evaporator (3), and the circulating working medium flowing into the gas evaporator is heated and then discharged into a gas condenser through the cold air pipe (16) and the circulating fan (17).
3. The waste heat recovery system connected to the waste liquid and waste gas collecting pipe of the electroplating device according to claim 1, wherein the waste gas evaporator (2) is connected with a waste gas steam trap (18), the gas evaporator (3) is connected with a gas steam trap (19), the waste gas steam trap (18) and the gas steam trap (19) are both communicated to a condensate pipe (20), and the condensate pipe is communicated with the waste liquid collecting pipe (21).
4. The waste heat recovery system connected to the waste liquid and waste gas collecting pipe of the electroplating device according to claim 1, wherein a waste liquid communicating pipe is connected between the electroplating tank and the waste liquid evaporator, a drain valve (9) is arranged on the pipe, and the waste liquid of the electroplating tank is discharged into the waste liquid evaporator through the drain valve.
5. The waste heat recovery system connected to the waste liquid and waste gas collecting pipe of the electroplating device according to claim 1, wherein the circulating working medium is nitrogen or air.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111356944.9A CN114001580B (en) | 2021-11-16 | 2021-11-16 | Waste heat recovery system on waste liquid and waste gas collecting pipe connected to electroplating device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111356944.9A CN114001580B (en) | 2021-11-16 | 2021-11-16 | Waste heat recovery system on waste liquid and waste gas collecting pipe connected to electroplating device |
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| CN114001580A true CN114001580A (en) | 2022-02-01 |
| CN114001580B CN114001580B (en) | 2024-05-28 |
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|---|---|---|---|---|
| JP2003211149A (en) * | 2002-01-28 | 2003-07-29 | Daiwa Kagaku Kogyo Kk | Device for treating plating washing waste liquid and treatment method thereof |
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| KR20160093873A (en) * | 2015-01-30 | 2016-08-09 | 김선철 | Waste heat recycling system based on constant temperature tank and heat pump |
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-
2021
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| CN114001580B (en) | 2024-05-28 |
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