CN113991324A - Transmit-receive separated thermal control integrated phased array framework - Google Patents
Transmit-receive separated thermal control integrated phased array framework Download PDFInfo
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- CN113991324A CN113991324A CN202111447267.1A CN202111447267A CN113991324A CN 113991324 A CN113991324 A CN 113991324A CN 202111447267 A CN202111447267 A CN 202111447267A CN 113991324 A CN113991324 A CN 113991324A
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- thermal control
- control structure
- main body
- transmitting
- receiving
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Abstract
The invention discloses a receiving and transmitting separated thermal control integrated phased array framework, which comprises: the receiving array surface, the receiving thermal control structure main body, the transmitting array surface and the transmitting thermal control structure main body; the receiving thermal control structure main body and the transmitting thermal control structure main body form a thermal control main body, a receiving array surface and a transmitting array surface are respectively arrayed, the receiving array surface is positioned on the receiving thermal control structure main body, the transmitting array surface is positioned on the transmitting thermal control structure main body, and the receiving thermal control structure main body and the transmitting thermal control structure main body can be independently spliced. The invention solves the difficulties of independent thermal control, separable adjustment and measurement and the like of the transmitting and receiving array surface, and has the characteristics of high structural design integration level, small longitudinal size, light weight of the whole machine and the like.
Description
Technical Field
The invention relates to a phased array system, in particular to a receiving and transmitting separated thermal control integrated phased array framework.
Background
The phased array antenna gradually exposes the head angle in the satellite communication field due to the excellent performance and the user experience, but the high-density integration and the high heat flow density of the array surface are also the core difficulties of the design of the phased array system, the high-consistency matching of the design also directly influences the assembly result of the product, and the thermal control scheme directly influences whether the antenna can be normally started or not. However, the above aspects cannot be independently expanded, which is a system level difficulty that the redundant and miscellaneous interweaving affects each other and even contradicts each other, so a reasonable overall system architecture is very important.
Disclosure of Invention
The present invention provides a transceiving separated thermal control integrated phased array architecture to solve the above technical problems.
In order to achieve the purpose, the invention adopts the following technical scheme:
a transmit-receive split thermal control integrated phased array architecture, comprising: the receiving array surface, the receiving thermal control structure main body, the transmitting array surface and the transmitting thermal control structure main body; the receiving thermal control structure main body and the transmitting thermal control structure main body form a thermal control main body, a receiving array surface and a transmitting array surface are respectively arrayed, the receiving array surface is positioned on the receiving thermal control structure main body, the transmitting array surface is positioned on the transmitting thermal control structure main body, and the receiving thermal control structure main body and the transmitting thermal control structure main body can be independently spliced.
Preferably, the receiving thermal control structure main body and the emitting thermal control structure main body are both cooled by vapor chambers, and working media are filled in the inner cavities of the vapor chambers.
Preferably, the receiving thermal control structure main body and the transmitting thermal control structure main body are provided with integrated radiating fins on the side surfaces, and the fan is additionally arranged.
Preferably, the network element is installed on the back of the thermal control main body and comprises a network element A and a network element B, and holes are formed in the thermal control main body to realize vertical interconnection between the thermal control main body and the network element.
Preferably, the receiving array surface and the transmitting array surface penetrate through the antenna through hole through the grounding column and then are welded at the top end, the antenna and the thermal control main body are fixed into a whole, a group of positioning columns are designed on the receiving thermal control structure main body and the transmitting thermal control structure main body, the receiving array surface and the transmitting array surface are firstly positioned and then are fixed one by one from the counter bores on the back surfaces of the receiving thermal control structure main body and the transmitting thermal control structure main body through screws.
Preferably, the receiving thermal control structure body and the transmitting thermal control structure body are designed in a shape complementary nesting mode, the connection is fixedly installed from the receiving thermal control structure body to the transmitting thermal control structure body through a front screw, the back screw is fixedly installed from the transmitting thermal control structure body to the receiving thermal control structure body, and the side screw is fixedly installed from the transmitting thermal control structure body to the receiving thermal control structure body to realize splicing.
Preferably, the air cooling fan is directly installed on the side surface of the radiating fin.
Preferably, the control power supply interfaces, the radio frequency interfaces and the corresponding interfaces on the network element of the receiving array surface and the transmitting array surface penetrate through the thermal control main body avoiding through hole to realize a vertical interconnection stacked framework.
Compared with the prior art, the invention has the following advantages: the invention solves the difficulties of independent thermal control, separable adjustment and measurement and the like of the transmitting and receiving array surface, and has the characteristics of high structural design integration level, small longitudinal size, light weight of the whole machine and the like.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a diagram of a body structure of a thermal control structure;
FIG. 3 is a block diagram of a body of an emissive thermal control structure;
FIG. 4 is a schematic diagram of a receive thermal control structure body and a transmit thermal control structure body;
FIG. 5 is a stacked configuration of the present invention;
FIG. 6 is a schematic view of a vertical interconnect of the present invention;
in the figure: the receiving array surface (1), the receiving thermal control structure main body (2), the transmitting array surface (3), the transmitting thermal control structure main body (4), a network element A (5), a network element B (6), a control power supply interface (7), a radio frequency interface (8), a side screw (9) and a front screw (10).
Detailed Description
The invention is explained in further detail below with reference to the figures and the specific embodiments.
As shown in fig. 1 to 6, a transmit-receive separated thermal control integrated phased array architecture includes: a receiving array surface 1, a receiving thermal control structure main body 2, an emitting array surface 3 and an emitting thermal control structure main body 4; the receiving thermal control structure main body 2 and the transmitting thermal control structure main body 4 form a thermal control main body, the receiving array surface 1 and the transmitting array surface 3 are respectively arrayed, the receiving array surface 1 is positioned on the receiving thermal control structure main body 2, the transmitting array surface 3 is positioned on the transmitting thermal control structure main body 4, and the receiving thermal control structure main body 2 and the transmitting thermal control structure main body 4 can be independently spliced. The receiving thermal control structure body 2 and the transmitting thermal control structure body 4 are designed in a complementary nested mode, connection is achieved through the fact that the receiving thermal control structure body 2 is fixedly installed to the transmitting thermal control structure body 4 through the front screws 10, the back screws are fixedly installed to the receiving thermal control structure body 2 from the transmitting thermal control structure body 4, and the side screws 9 are fixedly installed to the receiving thermal control structure body 2 from the transmitting thermal control structure body 4 to achieve splicing.
The receiving thermal control structure main body 2 and the emitting thermal control structure main body 4 are both cooled by vapor chambers, and working media are filled in the inner cavities of the vapor chambers. Realize high-efficient heat-conduction and thermal expansion, guarantee the array face samming index requirement, simultaneously, the vapor chamber cavity frame installs the main part as the array face, with the high integration of array face structure, satisfies the installation demand of array face subassembly, realizes the integration array face framework.
The receiving thermal control structure body 2 and the transmitting thermal control structure body 4 are provided with integrated radiating fins on the side surfaces and are additionally provided with fans. The air cooling fan is directly arranged on the side surface of the radiating fin. The heat dissipation structure has the advantages that the heat dissipation surface can be fully exposed in the environment without shielding and is optimally combined with the whole structure, meanwhile, the heat dissipation teeth and the whole structure are integrally processed, the risk of low heat conduction efficiency of an assembly part is avoided, the reliability is high, in addition, the air cooling fan is directly installed on the side surface of the heat dissipation fin, and the heat conduction and heat dissipation capacity is furthest exerted.
The network element is installed on the back of the thermal control main body and comprises a network element A5 and a network element B6, and holes are formed in the thermal control main body to realize vertical interconnection between the thermal control main body and the network element. The control power supply interface 7 and the radio frequency interface 8 of the receiving array surface 1 and the transmitting array surface 3 and the corresponding interfaces on the network element pass through the thermal control main body avoiding through hole to realize the vertical interconnection laminated framework
The receiving array surface 1 and the transmitting array surface 3 penetrate through the antenna through hole through the grounding column and then are welded at the top end, the antenna and the thermal control main body are fixed into a whole, a group of positioning columns are designed on the receiving thermal control structure main body 2 and the transmitting thermal control structure main body 4, the receiving array surface 1 and the transmitting array surface 3 are positioned firstly and then are fixed one by one from the counter bores on the back surfaces of the receiving thermal control structure main body 2 and the transmitting thermal control structure main body 4 through screws.
When the split type design is used for the whole machine assembly, the receiving thermal control structure main body and the transmitting thermal control structure main body can be connected and installed firstly to form an installation platform of whole machine parts, and then all the parts are installed in sequence; the components installed in each thermal control system can be installed at first, and then the receiving component and the transmitting component are connected and installed. Meanwhile, the splicing position of the receiving thermal control structure main body and the transmitting thermal control main body is also used as a receiving array surface and a transmitting array surface isolation wall, so that the isolation degree of the receiving array surface and the transmitting array surface is improved.
The foregoing is a preferred embodiment of the present invention, and it will be apparent to those skilled in the art that variations, modifications, substitutions and alterations can be made in the embodiment without departing from the principles and spirit of the invention.
Claims (8)
1. A transceiving separated thermal control integrated phased array architecture, comprising: the receiving array surface (1), the receiving thermal control structure main body (2), the transmitting array surface (3) and the transmitting thermal control structure main body (4); the receiving thermal control structure main body (2) and the transmitting thermal control structure main body (4) form a thermal control main body, a receiving array surface (1) and a transmitting array surface (3) are respectively arrayed, the receiving array surface (1) is positioned on the receiving thermal control structure main body (2), the transmitting array surface (3) is positioned on the transmitting thermal control structure main body (4), and the receiving thermal control structure main body (2) and the transmitting thermal control structure main body (4) can be independently spliced.
2. The transceiving integrated phased array architecture according to claim 1, wherein the receiving thermal control structure body (2) and the transmitting thermal control structure body (4) are both heat-dissipated by vapor chambers, and working media are filled in inner cavities of the vapor chambers.
3. The transceiving split thermal control integrated phased array architecture according to claim 1, wherein the receiving thermal control structure body (2) and the transmitting thermal control structure body (4) are provided with integrated heat dissipation fins on the sides, and are additionally provided with fans.
4. The transceiving split thermal control integrated phased array architecture according to claim 1, wherein the network element is mounted on the back of the thermal control main body, the network element comprises a network element a (5) and a network element B (6), and a hole is formed in the thermal control main body to vertically interconnect the thermal control main body and the network element.
5. The transceiving integrated phased array architecture as claimed in claim 1, wherein the receiving array plane (1) and the transmitting array plane (3) penetrate through an antenna through hole through a grounding post and then are welded at the top end, the antenna and the thermal control main body are fixed into a whole, a set of positioning posts are designed on the receiving thermal control structure main body (2) and the transmitting thermal control structure main body (4), and the receiving array plane (1) and the transmitting array plane (3) are positioned first and then are fixed one by one from counter bores on the back sides of the receiving thermal control structure main body (2) and the transmitting thermal control structure main body (4) through screws.
6. The transceiving split thermal control integrated phased array architecture according to claim 1, wherein the receiving thermal control structure body (2) and the transmitting thermal control structure body (4) are configured to be complementary to each other in shape, and the connection is achieved by installing and fixing the receiving thermal control structure body (2) to the transmitting thermal control structure body (4) through a front screw (10), installing and fixing a back screw from the transmitting thermal control structure body (4) to the receiving thermal control structure body (2), and installing and fixing a side screw (9) from the transmitting thermal control structure body (4) to the receiving thermal control structure body (2).
7. The architecture of claim 1, wherein the air-cooled fans are directly mounted on the sides of the fins.
8. The transceiving split thermal control integrated phased array architecture according to claim 1, wherein the control power supply interface (7) and the radio frequency interface (8) of the receiving array plane (1) and the transmitting array plane (3) and the corresponding interfaces on the network element pass through thermal control main body avoidance through holes to realize a vertical interconnection stacked architecture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111447267.1A CN113991324A (en) | 2021-12-01 | 2021-12-01 | Transmit-receive separated thermal control integrated phased array framework |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111447267.1A CN113991324A (en) | 2021-12-01 | 2021-12-01 | Transmit-receive separated thermal control integrated phased array framework |
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| Publication Number | Publication Date |
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| CN113991324A true CN113991324A (en) | 2022-01-28 |
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| CN202111447267.1A Pending CN113991324A (en) | 2021-12-01 | 2021-12-01 | Transmit-receive separated thermal control integrated phased array framework |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115084822A (en) * | 2022-08-03 | 2022-09-20 | 西安航天天绘数据技术有限公司 | Phased array antenna assembly |
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2021
- 2021-12-01 CN CN202111447267.1A patent/CN113991324A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115084822A (en) * | 2022-08-03 | 2022-09-20 | 西安航天天绘数据技术有限公司 | Phased array antenna assembly |
| CN115084822B (en) * | 2022-08-03 | 2023-10-20 | 西安航天天绘数据技术有限公司 | Phased array antenna assembly |
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