CN113991039A - Display substrate, manufacturing method thereof, display panel and display device - Google Patents
Display substrate, manufacturing method thereof, display panel and display device Download PDFInfo
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- CN113991039A CN113991039A CN202111253490.2A CN202111253490A CN113991039A CN 113991039 A CN113991039 A CN 113991039A CN 202111253490 A CN202111253490 A CN 202111253490A CN 113991039 A CN113991039 A CN 113991039A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Abstract
The embodiment of the application discloses a display substrate and a manufacturing method thereof, a display panel and a display device, wherein the display substrate of one embodiment comprises: the display device comprises a display area with a plurality of electroluminescent display units arranged in an array, a non-display area surrounding the display area, and a plurality of functional film layers arranged on a flexible substrate, wherein the functional film layers comprise a plurality of inorganic film layers and a plurality of organic film layers, the non-display area comprises an isolation dam part and a first isolation groove part which are arranged from the display area to the display area from near to far and surround the display area, the isolation dam part comprises a dam body with a first height arranged on the inorganic film layers and the organic film layers, and the dam body is used for isolating the organic film layers, close to the light emergent side, of the display area; the first isolation groove part comprises first isolation columns arranged on the inorganic film layer closest to the flexible substrate, a first isolation groove exposing the inorganic film layer closest to the flexible substrate between every two adjacent first isolation columns, and an FMLOC dielectric layer covering the first isolation columns and the first isolation groove.
Description
Technical Field
The present disclosure relates to the field of display technologies, and in particular, to a display substrate, a manufacturing method thereof, a display panel, and a display device.
Background
An OLED (Organic Light Emitting Diode) display device has a series of advantages such as an all-solid structure, self-luminescence, fast response speed, high brightness, a full viewing angle, and flexible display, and thus becomes a display device with high competitiveness and good development prospect.
However, the OLED device may be corroded and damaged under the action of water vapor, so that the packaging problem of the OLED device becomes more prominent, and the service life of the device is seriously affected by the packaging failure.
Disclosure of Invention
In order to solve at least one of the above problems, a first embodiment of the present application provides a display substrate including a display area having a plurality of electroluminescent display units arranged in an array, and a non-display area surrounding the display area, including a plurality of functional film layers disposed on a flexible substrate, the plurality of functional film layers including a plurality of inorganic film layers and a plurality of organic film layers,
the non-display area comprises an isolation dam part and a first isolation groove part which are arranged from the display area to the display area from the near to the far direction and surround the display area
The isolation dam part comprises a dam body with a first height, which is arranged on the inorganic film layer and the organic film layer and is used for isolating the organic film layer close to the light emergent side of the display area;
the first isolation groove part comprises first isolation columns arranged on the inorganic film layer closest to the flexible substrate, a first isolation groove exposing the inorganic film layer closest to the flexible substrate between every two adjacent first isolation columns, and an FMLOC dielectric layer covering the first isolation columns and the first isolation groove.
In a specific embodiment, the display substrate comprises a driving circuit layer, a device layer, an encapsulation layer and an FMLOC dielectric layer which are sequentially stacked and arranged on a flexible substrate, wherein the driving circuit layer comprises a circuit function layer, an interlayer insulating layer, a first planarization layer and a second planarization layer, the device layer comprises an anode, a pixel defining layer, a light emitting material and a cathode layer, and an inorganic protective layer, and the encapsulation layer comprises a first encapsulation layer, a second encapsulation layer and a third encapsulation layer;
the isolation dam part comprises a first planarization layer, a second planarization layer, an inorganic protective layer, a dam body, a luminescent material, a cathode layer, a first packaging layer, a third packaging layer and an FMLOC dielectric layer which are sequentially arranged on the interlayer insulating layer in a stacking mode, wherein the dam body and the pixel defining layer are arranged on the same layer, and the height, relative to the flexible substrate, of the dam top, far away from the flexible substrate, of the dam body is larger than the height, relative to the flexible substrate, of the second packaging layer;
the first isolation column comprises a second planarization layer, an inorganic protective layer, a luminescent material, a cathode layer, a first packaging layer and a third packaging layer which are sequentially stacked on the interlayer insulating layer, and the first isolation groove is an opening which penetrates through the first isolation column and exposes the interlayer insulating layer.
In a specific embodiment, the first isolation trench further comprises a third planarization layer covering the FMLOC dielectric layer.
In a specific embodiment, the non-display region further includes a second isolation trench portion disposed on a side of the isolation dam portion away from the first isolation trench portion and surrounding the display region, and the second isolation trench portion includes a first planarization layer disposed on the interlayer insulating layer, a second isolation pillar disposed on the first planarization layer, a second isolation trench exposing the first planarization layer between two adjacent second isolation pillars, and a light emitting material and cathode layer, a first encapsulation layer, a second encapsulation layer, a third encapsulation layer, and an FMLOC dielectric layer covering the second isolation pillars and the second isolation trench, where the light emitting material and the cathode layer, the first encapsulation layer, the second encapsulation layer, the third encapsulation layer, and the FMLOC dielectric layer are disposed on the isolation dam portion, and surround the display region
The second isolation pillar includes a second planarization layer and an inorganic protective layer disposed on the first planarization layer.
In a specific embodiment, the interlayer insulating layer, the inorganic protective layer, the first encapsulation layer, and the third encapsulation layer are inorganic layers;
the first planarizing layer, the second planarizing layer, the pixel defining layer, the light emitting material and cathode layer, and the second encapsulating layer are organic layers.
A second embodiment of the present application provides a display panel including the display substrate according to the first embodiment of the present application.
A third embodiment of the present application provides a display device including the display panel according to the second embodiment of the present application.
A third embodiment of the present application provides a method for manufacturing a display substrate according to the first embodiment of the present application, the method including:
forming a display area with a plurality of electroluminescent display units arranged in an array and a display substrate surrounding a non-display area of the display area, wherein the display substrate comprises a plurality of functional film layers arranged on a flexible substrate, and the plurality of functional film layers comprise a plurality of inorganic film layers and a plurality of organic film layers;
the non-display area comprises an isolation dam part and a first isolation groove part which are arranged from the display area to the display area from the near to the far direction and surround the display area
The isolation dam part comprises a dam body with a first height, which is arranged on the inorganic film layer and the organic film layer and is used for isolating the organic film layer close to the light emergent side of the display area;
the first isolation groove part comprises first isolation columns arranged on the inorganic film layer closest to the flexible substrate, a first isolation groove exposing the inorganic film layer closest to the flexible substrate between every two adjacent first isolation columns, and an FMLOC dielectric layer covering the first isolation columns and the first isolation groove.
In one particular embodiment, the method comprises:
forming a driving circuit layer on the flexible substrate, wherein the driving circuit layer comprises a circuit function layer, an interlayer insulating layer, a first planarization layer and a second planarization layer;
patterning an inorganic protective layer including a plurality of inorganic protective portions on the second planarization layer of the non-display region, forming a first opening corresponding to a first isolation groove portion to be formed between adjacent inorganic protective portions, exposing the second planarization layer;
forming an anode on the second planarization layer of the display region;
forming a pixel defining layer comprising a pixel defining portion formed on the anode and a dam formed on the inorganic protective layer to form an isolation dam, the dam having a first height relative to the flexible substrate;
etching through the first opening to form a first middle isolation column and an inverted T-shaped first middle isolation groove exposing the interlayer insulating layer to form a first middle display substrate;
evaporating and forming a light-emitting material and a cathode layer on the first intermediate display substrate;
forming a first encapsulation layer on the light emitting material and the cathode layer;
printing on the first packaging layer on one side of the dam body close to the display area to form a second packaging layer, wherein the height of the second packaging layer relative to the flexible substrate is smaller than that of the dam body relative to the flexible substrate;
forming a third encapsulation layer covering the second encapsulation layer and the exposed first encapsulation layer;
etching through the first opening by using an FLMOC (flash metal oxide semiconductor) process to form a first isolation column and a cross-shaped first isolation groove exposing the interlayer insulating layer so as to form a second intermediate display substrate;
and forming an FMLOC dielectric layer on the second intermediate display substrate to form an isolation dam part and a first isolation groove part.
In a specific embodiment, after forming the FMLOC dielectric layer on the second intermediate display substrate to form the isolation dam and the first isolation trench, the manufacturing method further includes:
forming a third planarizing layer covering the first isolation trench portion.
In one embodiment, the display substrate further includes a second isolation trench portion disposed on a side of the isolation dam portion away from the first isolation trench portion and surrounding the display region,
the patterning an inorganic protective layer including a plurality of inorganic protective portions on the second planarization layer of the non-display area further includes: forming a second opening corresponding to a second isolation groove part to be formed, exposing the second planarization layer, between the adjacent inorganic protection parts;
the forming of the first intermediate isolation pillar and the first intermediate isolation trench of the inverted T shape exposing the interlayer insulating layer by the first opening etching to form the first intermediate display substrate further includes: and etching through the second opening to form a second isolation column and an inverted T-shaped second isolation groove exposing the first planarization layer.
The beneficial effect of this application is as follows:
the display substrate, the manufacturing method thereof, the display panel and the display device are made, the scheme of the isolation dam and the first isolation groove is adopted to realize effective packaging of an electroluminescent display device so as to isolate a water vapor invasion channel, specifically, an FMLOC (field programmable gate array) process is adopted to etch organic materials remained on an interlayer insulating layer, so that the problem that a second flattened layer isolated due to evaporation of luminescent materials and a cathode layer in the prior art is communicated again is solved; the application further realizes inorganic packaging by depositing the FMLOC dielectric layer on the exposed interlayer insulating layer after etching, thereby realizing effective moisture-proof packaging protection, prolonging the service life of the OLED device and having wide application prospect.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic diagram of a prior art display substrate designed to exclude moisture;
FIG. 2 is a schematic diagram illustrating the effect of water vapor invading the light-emitting area channel in the prior art;
FIG. 3 illustrates a schematic structural diagram of a display substrate according to an embodiment of the present application;
FIGS. 4a-4l are schematic diagrams illustrating a process for fabricating a display substrate according to an embodiment of the present application;
FIG. 5 shows a schematic structural diagram of a display substrate according to yet another embodiment of the present application;
fig. 6 shows a schematic flow chart of a method of manufacturing a display substrate according to an embodiment of the present application.
100 inner isolation trenches 102 outer isolation trenches
10 flexible substrate 20 buffer layer 30 gate insulation 40 interlayer insulation 401 active layer 402 source 403 drain 404 gate
50 first planarizing layer 60 second planarizing layer 700 anode 702 inorganic protective layer 800 pixel definition layer 802 dam 804 light emitting material and cathode layer 900 first encapsulation layer 902 second encapsulation layer 904 third encapsulation layer 906FMLOC dielectric layer 908 third planarizing layer
70 isolation dam 80 first isolation trench 104 second isolation trench
Detailed Description
In order to more clearly illustrate the present application, the present application is further described below in conjunction with the preferred embodiments and the accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not intended to limit the scope of the present application.
It is noted that references herein to "on … …", "formed on … …" and "disposed on … …" can mean that one layer is formed or disposed directly on another layer or that one layer is formed or disposed indirectly on another layer, i.e., there is another layer between the two layers. As used herein, unless otherwise specified, the term "on the same layer" means that two layers, components, members, elements or portions can be formed by the same patterning process, and the two layers, components, members, elements or portions are generally formed of the same material. Herein, unless otherwise specified, the expression "patterning process" generally includes the steps of coating of photoresist, exposure, development, etching, stripping of photoresist, and the like. The expression "one-time patterning process" means a process of forming a patterned layer, member, or the like using one mask plate.
Because the OLED device can be corroded and damaged under the action of water and oxygen, the packaging problem of the OLED device is more prominent, and the service life of the device is seriously influenced by the packaging failure. In the prior art, in order to isolate water and oxygen, research and development personnel design a display substrate as shown in fig. 1, which employs an isolation trench structure of dual planarization layers, i.e., a first planarization layer 50+ a second planarization layer 60, specifically, as shown in fig. 1, an inner isolation trench 100 is located on the basis of the first planarization layer 50, blocks the second planarization layer 60, and is further provided with encapsulation layers, i.e., a first encapsulation layer 900+ a second encapsulation layer 902+ a third encapsulation layer 904, and an outer isolation trench 102 is provided at a position of the inner isolation trench 100 away from a display region, further blocks the structure of the second planarization layer 60 on the basis of an interlayer insulating layer 40, and is provided with an encapsulation layer.
However, in practical use, research and development personnel find that the problem of water vapor intrusion corrosion of the organic material of the OLED still exists, as shown in fig. 2, the outer isolation groove of the display substrate manufactured according to the prior art does not achieve effective organic partition, and a circle 90 in fig. 2 is a water vapor intrusion channel, however, when the outer isolation groove is formed by etching, the second planarization layer is completely partitioned, and how this water vapor intrusion channel is formed.
In view of the above situation, after the applicant repeatedly disassembles and tests the display substrate, the applicant finds that the above prior art has the disadvantage because, although the etching is performed and the etching is performed to the interlayer insulating layer 40 when the outer isolation groove is formed, that is, the second planarization layer 60 is structurally isolated by exposing the interlayer insulating layer 40, the second planarization layer 60 which is already isolated is connected when the light-emitting material and the cathode layer 804 are subsequently evaporated, so that the moisture intrusion channel shown in fig. 2 is formed, and external moisture still intrudes into the light-emitting region along the organic layer. Thus, the prior art solution still suffers from package failure.
In view of the above-mentioned problems and the causes for the problems, as shown in fig. 3, an embodiment of the present application provides a display substrate including a display area having a plurality of electroluminescent display units arranged in an array, and a non-display area surrounding the display area, and including a plurality of functional film layers disposed on a flexible substrate, the plurality of functional film layers including a plurality of inorganic film layers and a plurality of organic film layers,
the non-display region includes an isolation dam 70 and a first isolation groove 80 surrounding the display region from the near to the far direction from the display region, wherein
The isolation dam part 70 includes a dam body with a first height disposed on the inorganic film layer and the organic film layer, and is used for isolating the organic film layer near the light exit side of the display region;
the first isolation groove portion 80 includes a first isolation pillar disposed on the inorganic film layer closest to the flexible substrate, a first isolation groove exposing the inorganic film layer closest to the flexible substrate between two adjacent first isolation pillars, and an FMLOC dielectric layer 906 covering the first isolation pillar and the first isolation groove.
This implementation is easy to be corroded by water oxygen to electroluminescent display substrate, and the encapsulation of realizing the luminescent device to the display area through adopting isolation dam and isolated groove structure includes, and the isolation dam is used for keeping apart the organic rete that is close to the light-emitting side, and the isolated groove is used for keeping apart the organic rete that is close to the flexible substrate side to realize the all-round protection in order to block the steam passageway to the display area through the isolation structure that has isolation dam and isolated groove.
Specifically, in this embodiment, the FMLOC process is used to form the light emitting material and the cathode layer, and then the light emitting material and the cathode layer are etched again to the interlayer insulating layer to isolate the organic light emitting material and the cathode layer, thereby solving the problem that the isolated second planarization layer is reconnected due to evaporation of the light emitting material and the cathode layer in the prior art, and isolating the organic layer; furthermore, inorganic packaging is realized through an FMLOC dielectric layer deposited on the exposed interlayer insulating layer, so that moisture-proof packaging protection is realized, the service life of the OLED device is prolonged, and the OLED device has a wide application prospect.
In a specific embodiment, as shown in fig. 3, the display substrate includes a driving circuit layer, a device layer, an encapsulation layer and an FMLOC dielectric layer, which are sequentially stacked on a flexible substrate, wherein the driving circuit layer includes a circuit function layer and an interlayer insulating layer 40, a first planarization layer 50 and a second planarization layer 60, the device layer includes an anode 700, a pixel defining layer 800, a light emitting material and cathode layer 804, and an inorganic protection layer 702, and the encapsulation layer includes a first encapsulation layer 900, a second encapsulation layer 902 and a third encapsulation layer 904.
In this embodiment, the isolation dam includes a dam 802 having a first height disposed on the inorganic film and the organic film, and is configured to isolate the organic film near the light exit side of the display area, specifically:
the isolation dam part 70 comprises a first planarization layer 50, a second planarization layer 60, an inorganic protective layer 702, a dam body 802, a luminescent material and cathode layers 804, a first packaging layer 900, a third packaging layer 904 and an FMLOC dielectric layer 906 which are sequentially stacked and arranged on the interlayer insulating layer 40, wherein the dam body 802 and the pixel defining layer 800 are arranged on the same layer, and the height of the dam top of the dam body 802 far away from the flexible substrate 10 relative to the flexible substrate 10 is greater than the height of the second packaging layer 902 relative to the flexible substrate 10;
the second encapsulation layer 902 is an organic layer closest to the light-emitting side, in other words, the organic film layer of the display area close to the light-emitting side, which is used for isolation, of the isolation dam is the second encapsulation layer, and further, by setting the height of the dam crest of the dam body, which is far away from the flexible substrate, relative to the flexible substrate to be greater than the height of the second encapsulation layer relative to the flexible substrate, the second encapsulation layer 902 is effectively prevented from overflowing the dam body 802, so that the encapsulation protection of the moisture proof is realized.
In this embodiment, the first isolation groove portion 80 includes a first isolation pillar disposed on the inorganic film layer closest to the flexible substrate, a first isolation groove exposing the inorganic film layer closest to the flexible substrate between two adjacent first isolation pillars, and an FMLOC dielectric layer 906 covering the first isolation pillar and the first isolation groove.
Specifically, the first isolation column includes a second planarization layer 60, an inorganic protective layer 702, a light emitting material and cathode layer 804, a first encapsulation layer 900, and a third encapsulation layer 904, which are sequentially stacked on the interlayer insulating layer 40, and the first isolation groove is an opening penetrating through the interlayer insulating layer 40.
It should be noted that the interlayer insulating layer 40 is an inorganic film layer closest to the flexible substrate, and all organic film layers can be isolated by an isolation trench penetrating through the interlayer insulating layer, wherein the organic second planarization layer 60 is isolated by a first intermediate isolation trench formed after etching the first planarization layer and exposing the interlayer insulating layer 40, and further, after the light emitting material and cathode layer 804, the first encapsulation layer 900, and the third encapsulation layer 904 are completed, the first isolation trench exposing the interlayer insulating layer 40 is formed by etching after coating the photoresist layer PR.
In this example, the organic light emitting material and the cathode layer 804 are isolated by etching to the interlayer insulating layer 40 through the FMLOC process, so that the problem that the isolated second planarization layer 60 is reconnected due to evaporation of the light emitting material and the cathode layer in the prior art is solved, the organic layer is isolated, and inorganic packaging is realized through the FMLOC dielectric layer deposited on the exposed interlayer insulating layer 40, so that the packaging protection of waterproof oxygen is realized.
The following explains the method for manufacturing the display substrate, as shown in fig. 4a to 4l, including:
s10, forming a driving circuit layer on the flexible substrate, wherein the driving circuit layer comprises a circuit function layer, an interlayer insulating layer, a first planarization layer and a second planarization layer;
specifically, as shown in fig. 4a, a buffer layer 20 is formed on a flexible substrate 10, an active layer 401 is formed on the buffer layer 20, a gate insulating layer 30 is formed on the active layer 401, a gate electrode 404 is formed on the gate insulating layer 30, an interlayer insulating layer 40 is formed on the gate electrode 404, a source electrode 402 and a drain electrode 403 are formed on the interlayer insulating layer 40, and a first planarizing layer 50 and a second planarizing layer 60 are formed on the source electrode 402 and the drain electrode 403; the interlayer insulating layer 40 is an inorganic layer and is used for preventing water vapor; the first and second planarizing layers 50 and 60 are organic layers for reducing stress.
S11, forming an inorganic protective layer comprising a plurality of inorganic protective parts on the second planarization layer of the non-display area in a patterning mode, and forming first openings which expose the second planarization layer and correspond to first isolation groove parts to be formed between the adjacent inorganic protective parts;
specifically, as shown in fig. 4b, the first planarizing layer 50 extends to an isolation dam of a non-display region, a second planarizing layer 60 is formed on the first planarizing layer 50 and the exposed interlayer insulating layer 40, an inorganic protective material layer is formed on the second planarizing layer 60, and a patterned inorganic protective material layer forms an inorganic protective layer 702, where the inorganic protective layer includes a plurality of inorganic protective portions arranged at intervals, a first opening K1 exists between two adjacent inorganic protective portions, and the first opening K1 is used to form a first isolation groove. The inorganic protective layer 702 is an inorganic layer for preventing moisture.
S12, as shown in fig. 4c, an anode 700 is formed on the second planarization layer 60 of the display area.
S13, as shown in fig. 4d, forming a pixel defining layer including a pixel defining part 800 formed on the anode 700 and a dam 803 formed on the inorganic protective layer to be formed as an isolation dam, the dam having a first height h1 with respect to the flexible substrate;
specifically, the pixel defining layer 800 surrounds the anode 700, and the dam 802 of the isolation dam is disposed on the same layer as the pixel defining layer 800. The pixel defining layer 800 is an organic layer for reducing stress; the dam body 802 of the isolation dam is used for isolating the organic film layer close to the light-emitting side, namely the second encapsulation layer formed subsequently, and isolating water vapor through the first encapsulation layer and the third encapsulation layer formed subsequently thereon.
S14, as shown in fig. 4e, forming a first middle isolation pillar and a first middle isolation trench of an inverted T shape exposing the interlayer insulating layer 40 through the first opening etching to form a first middle display substrate;
note that all the organic film layers close to the flexible substrate can be isolated by an isolation groove penetrating to the interlayer insulating layer 40, wherein the organic second planarizing layer 60 can be isolated by a first intermediate isolation groove formed after etching the second planarizing layer to expose the interlayer insulating layer 40.
S15, as shown in fig. 4f, evaporating and forming a light emitting material and a cathode layer 804 on the first intermediate display substrate;
specifically, the light emitting material and the cathode layer 804 covering the first intermediate display substrate are formed by an evaporation process. Wherein the light emitting material and the cathode layer are organic layers for reducing stress.
S16, as shown in fig. 4g, forming a first encapsulation layer 900 on the light emitting material and the cathode layer 804;
specifically, a first encapsulation layer 900 is formed on the cathode layer, and the encapsulation layer of this example includes a first encapsulation layer 900, a second encapsulation layer 902, and a third encapsulation layer 904.
The first encapsulation layer 900 is an inorganic layer for preventing moisture.
S17, as shown in fig. 4h, printing on the first encapsulation layer 900 on a side of the dam 802 close to the display area to form a second encapsulation layer 902, where a height h2 of the second encapsulation layer 902 relative to the flexible substrate is smaller than a height h1 of the dam 802 relative to the flexible substrate;
in a specific example, the second encapsulation layer 60 is an organic layer for preventing stress, the second encapsulation layer 60 is an organic layer closest to the light-emitting side, the organic film layer isolated by the isolation dam is the second encapsulation layer, and the height of the second encapsulation layer is set to be smaller than the height of the dam body, so that the encapsulation protection of waterproof oxygen is realized.
S18, as shown in fig. 4i, forming a third encapsulation layer 904 covering the second encapsulation layer 902 and the exposed first encapsulation layer;
specifically, a third encapsulation layer 904 is formed on the second encapsulation layer 902 and the exposed first encapsulation layer 900, wherein the third encapsulation layer is an inorganic layer for preventing moisture from entering.
S19, as shown in fig. 4j, forming a first isolation pillar and a cross-shaped first isolation trench exposing the interlayer insulating layer 40 by etching through the first opening using an FLMOC process to form a second intermediate display substrate;
it should be noted that, the isolation trench width W1 — the opening width W2 is greater than or equal to 1um, where the isolation trench width W1 is the widest position of the trench bottom, and the opening width W2 is the width of the first opening, that is, the width of the lateral etching on both sides of the isolation trench is greater than 0.5um each compared with the first opening, so as to ensure complete blocking of the organic layer.
S20, as shown in fig. 4k, forming an FMLOC dielectric layer 906 on the second intermediate display substrate to form an isolation dam and a first isolation trench.
Specifically, after the light emitting material and cathode layer 804, the first encapsulation layer 900, and the third encapsulation layer are completed 904, a first isolation groove exposing the interlayer insulating layer 40 is formed by coating a photoresist layer PR and then etching.
The organic light-emitting material and the cathode layer 804 are isolated by etching to the interlayer insulating layer 40 through an FMLOC process, so that the problem that in the prior art, due to evaporation of the light-emitting material and the cathode layer, isolated second planarization layers are communicated again, organic layers are isolated, inorganic packaging is achieved through an FMLOC dielectric layer 906 deposited on the exposed interlayer insulating layer 40, and therefore packaging protection of waterproof oxygen is achieved.
In one embodiment, as shown in fig. 4l, since the encapsulation layers of the first isolation groove portion are two inorganic layers, i.e., the first encapsulation layer 900 and the third encapsulation layer 904, cracks are likely to occur when the stress is too large, which affects the encapsulation. To this end, the first isolation trench portion further includes a third planarization layer 908 covering the FMLOC dielectric layer 906. The third planarization layer 908 of this embodiment is an OC glue layer, which can form a planarization layer structure covering the first isolation trench portion while enabling the stress of the package layer.
In a specific manufacturing method, after forming an FMLOC dielectric layer on the second intermediate display substrate to form an isolation dam and a first isolation trench, the manufacturing method further includes:
forming a third planarizing layer covering the first isolation trench portion.
In view of further enhancing the isolation effect of the electroluminescent device in the display region, in an alternative embodiment, as shown in fig. 5, the non-display region further includes a second isolation trench 104 disposed on the side of the isolation dam 70 away from the first isolation trench 80 and surrounding the display region, and includes a first planarization layer 50 disposed on the interlayer insulating layer 40, a second isolation pillar disposed on the first planarization layer 50, a second isolation trench between two adjacent second isolation pillars exposing the first planarization layer 60, and a light emitting material and cathode layer 804, a first encapsulation layer 900, a second encapsulation layer 902, a third encapsulation layer 904, and a FMLOC dielectric layer 906 covering the second isolation pillar and the second isolation trench, wherein the first isolation pillar and the second isolation trench are formed in the same layer, and the light emitting material and cathode layer 804, the first encapsulation layer 900, the second encapsulation layer 902, the third encapsulation layer 904, and the FMLOC dielectric layer 906 are formed in the non-display region
The second isolation pillar includes a second planarization layer 60 disposed on the first planarization layer 50 and an inorganic protective layer 702.
In this embodiment, the second isolation groove portion is mainly used for isolating the organic second planarization layer 60, that is, the second isolation groove etched to the first planarization layer 50 is used for isolation, and effective encapsulation is achieved through the first encapsulation layer 900, the second encapsulation layer 902 and the third encapsulation layer 904 which are formed subsequently. This embodiment is on the basis that uses first isolation tank to carry out organic material and keep apart, further keeps apart organic material through using the second isolation tank portion, and through using first isolation tank and second isolation tank to cut off organic material so that form the dual isolation to steam promptly, further strengthens display substrates's waterproof vapour ability.
As shown in fig. 5, the method for forming the second isolation trench will be described below:
the display substrate further comprises a second isolation trench portion 104 arranged at a side of said isolation dam 70 remote from said first isolation trench portion 80 and surrounding said display area,
the patterning an inorganic protective layer including a plurality of inorganic protective portions on the second planarization layer of the non-display area further includes: second openings K2 corresponding to second isolation groove portions to be formed exposing the second planarization layer are formed between adjacent inorganic protective portions 702;
the forming of the first intermediate isolation pillar and the first intermediate isolation trench of the inverted T shape exposing the interlayer insulating layer 40 by the first opening etching to form the first intermediate display substrate further includes: and etching through the second opening K2 to form a second isolation pillar and an inverted T-shaped second isolation groove exposing the first planarization layer 50.
Thus, the display substrate is completed, and the display substrate shown in fig. 5 is formed.
Corresponding to the display substrate provided in the foregoing embodiment, as shown in fig. 6, an embodiment of the present application further provides a manufacturing method using the display substrate, where the method includes:
forming a display area with a plurality of electroluminescent display units arranged in an array and a display substrate surrounding a non-display area of the display area, wherein the display substrate comprises a plurality of functional film layers arranged on a flexible substrate, and the plurality of functional film layers comprise a plurality of inorganic film layers and a plurality of organic film layers;
the non-display area comprises an isolation dam part and a first isolation groove part which are arranged from the display area to the display area from the near to the far direction and surround the display area
The isolation dam part comprises a dam body with a first height, which is arranged on the inorganic film layer and the organic film layer and is used for isolating the organic film layer close to the light emergent side of the display area;
the first isolation groove part comprises first isolation columns arranged on the inorganic film layer closest to the flexible substrate, a first isolation groove exposing the inorganic film layer closest to the flexible substrate between every two adjacent first isolation columns, and an FMLOC dielectric layer covering the first isolation columns and the first isolation groove.
Electroluminescent display substrate easily receives water oxygen erosion, and in this embodiment, adopt isolation dam and isolated groove structure to realize including to the encapsulation of the light emitting device in display area, the isolation dam is used for keeping apart the organic rete that is close to the light-emitting side, and the isolated groove is used for keeping apart the organic rete that is close to the flexible substrate side to realize the all-round protection to the display area through the isolation structure that has isolation dam and isolated groove.
In the embodiment, the organic light-emitting material and the cathode layer are isolated by etching to the interlayer insulating layer through the FMLOC process, so that the problem that the isolated second planarization layer is communicated again due to evaporation of the light-emitting material and the cathode layer in the prior art is solved, and the organic layer is isolated; furthermore, inorganic packaging is realized through an FMLOC dielectric layer deposited on the exposed interlayer insulating layer, so that moisture-proof packaging protection is realized, the service life of the OLED device is prolonged, and the OLED device has a wide application prospect.
In one embodiment, the specific manufacturing method comprises:
forming a driving circuit layer on the flexible substrate, wherein the driving circuit layer comprises a circuit function layer, an interlayer insulating layer, a first planarization layer and a second planarization layer;
patterning an inorganic protective layer including a plurality of inorganic protective portions on the second planarization layer of the non-display region, forming a first opening corresponding to a first isolation groove portion to be formed between adjacent inorganic protective portions, exposing the second planarization layer;
forming an anode on the second planarization layer of the display region;
forming a pixel defining layer comprising a pixel defining portion formed on the anode and a dam formed on the inorganic protective layer to form an isolation dam, the dam having a first height relative to the flexible substrate;
etching through the first opening to form a first middle isolation column and an inverted T-shaped first middle isolation groove exposing the interlayer insulating layer to form a first middle display substrate;
evaporating and forming a light-emitting material and a cathode layer on the first intermediate display substrate;
forming a first encapsulation layer on the light emitting material and the cathode layer;
printing on the first packaging layer on one side of the dam body close to the display area to form a second packaging layer, wherein the height of the second packaging layer relative to the flexible substrate is smaller than that of the dam body relative to the flexible substrate;
forming a third encapsulation layer covering the second encapsulation layer and the exposed first encapsulation layer;
etching through the first opening by using an FLMOC (flash metal oxide semiconductor) process to form a first isolation column and a cross-shaped first isolation groove exposing the interlayer insulating layer so as to form a second intermediate display substrate;
it should be noted that, the width of the isolation trench, i.e. the width of the lateral etching on both sides of the isolation trench, is greater than or equal to 1um, the width of the isolation trench is the widest position of the trench bottom, and the width of the opening is the width of the first opening, i.e. the width of the lateral etching on both sides of the isolation trench is greater than 0.5um in comparison with the opening, thereby ensuring that the organic layer is completely isolated.
And forming an FMLOC dielectric layer on the second intermediate display substrate to form an isolation dam part and a first isolation groove part.
In a specific embodiment, after forming the FMLOC dielectric layer on the second intermediate display substrate to form the isolation dam and the first isolation trench, the manufacturing method further includes:
forming a third planarizing layer covering the first isolation trench portion.
In view of further enhancing the isolation effect of the electroluminescent device to the display area, in an alternative embodiment:
the display substrate further comprises a second isolation groove part which is arranged on one side of the isolation dam part far away from the first isolation groove part and surrounds the display area,
the patterning an inorganic protective layer including a plurality of inorganic protective portions on the second planarization layer of the non-display area further includes: a second opening exposing the second isolation groove part to be formed of the second planarization layer is formed between the adjacent inorganic protection parts;
the forming of the first intermediate isolation pillar and the first intermediate isolation trench of the inverted T shape exposing the interlayer insulating layer by the first opening etching to form the first intermediate display substrate further includes: and etching through the second opening to form a second isolation column and an inverted T-shaped second isolation groove exposing the first planarization layer.
Since the manufacturing method provided in the embodiments of the present application corresponds to the display substrate provided in the above-mentioned several embodiments, the previous embodiments are also applicable to the manufacturing method provided in the embodiments, and detailed description is not provided in the embodiments.
It should be noted that the display substrate provided in the embodiments of the present application is not limited to the specific structure formed by the manufacturing method of the embodiments of the present application, and those skilled in the art may also use other processing processes to form the specific structure of the display substrate.
Based on the display substrate, another embodiment of the present application further provides a display panel, which includes the display substrate described in the foregoing embodiment.
A further embodiment of the present application proposes a display device including the display panel described in the foregoing embodiment.
It should be noted that the display device described in this embodiment is an electroluminescent diode display device. The display device can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame or a navigator.
It should be understood that the above-mentioned examples are given for the purpose of illustrating the present application clearly and not for the purpose of limiting the same, and that various other modifications and variations of the present invention may be made by those skilled in the art in light of the above teachings, and it is not intended to be exhaustive or to limit the invention to the precise form disclosed.
Claims (11)
1. A display substrate comprises a display area with a plurality of electroluminescent display units arranged in an array and a non-display area surrounding the display area, and is characterized by comprising a plurality of functional film layers arranged on a flexible substrate, wherein the functional film layers comprise a plurality of inorganic film layers and a plurality of organic film layers,
the non-display area comprises an isolation dam part and a first isolation groove part which are arranged from the display area to the display area from the near to the far direction and surround the display area
The isolation dam part comprises a dam body with a first height, which is arranged on the inorganic film layer and the organic film layer and is used for isolating the organic film layer close to the light emergent side of the display area;
the first isolation groove part comprises first isolation columns arranged on the inorganic film layer closest to the flexible substrate, a first isolation groove exposing the inorganic film layer closest to the flexible substrate between every two adjacent first isolation columns, and an FMLOC dielectric layer covering the first isolation columns and the first isolation groove.
2. The display substrate according to claim 1, wherein the display substrate comprises a driving circuit layer, a device layer, an encapsulation layer and an FMLOC dielectric layer, which are sequentially stacked and disposed on a flexible substrate, wherein the driving circuit layer comprises a circuit function layer and an interlayer insulating layer, a first planarization layer and a second planarization layer, the device layer comprises an anode, a pixel defining layer, a light emitting material and a cathode layer, and an inorganic protective layer, and the encapsulation layer comprises a first encapsulation layer, a second encapsulation layer and a third encapsulation layer;
the isolation dam part comprises a first planarization layer, a second planarization layer, an inorganic protective layer, a dam body, a luminescent material, a cathode layer, a first packaging layer, a third packaging layer and an FMLOC dielectric layer which are sequentially arranged on the interlayer insulating layer in a stacking mode, wherein the dam body and the pixel defining layer are arranged on the same layer, and the height, relative to the flexible substrate, of the dam top, far away from the flexible substrate, of the dam body is larger than the height, relative to the flexible substrate, of the second packaging layer;
the first isolation column comprises a second planarization layer, an inorganic protective layer, a luminescent material, a cathode layer, a first packaging layer and a third packaging layer which are sequentially stacked on the interlayer insulating layer, and the first isolation groove is an opening which penetrates through the first isolation column and exposes the interlayer insulating layer.
3. The display substrate of claim 2, wherein the first isolation trench further comprises a third planarization layer overlying the FMLOC dielectric layer.
4. The display substrate according to claim 2, wherein the non-display region further comprises a second isolation trench portion surrounding the display region and disposed on a side of the isolation dam portion away from the first isolation trench portion, and the second isolation trench portion comprises a first planarization layer disposed on the interlayer insulating layer, a second isolation pillar disposed on the first planarization layer, a second isolation trench between two adjacent second isolation pillars and exposing the first planarization layer, and a light emitting material and cathode layer, a first encapsulation layer, a second encapsulation layer, a third encapsulation layer and an FMLOC dielectric layer covering the second isolation pillars and the second isolation trench, wherein the non-display region further comprises a first planarization layer disposed on the interlayer insulating layer, a second isolation pillar disposed on the first planarization layer, and a light emitting material and cathode layer, a first encapsulation layer, a second encapsulation layer, a third encapsulation layer and an FMLOC dielectric layer covering the second isolation pillar and the second isolation trench
The second isolation pillar includes a second planarization layer and an inorganic protective layer disposed on the first planarization layer.
5. The display substrate according to any one of claims 2 to 4,
the interlayer insulating layer, the inorganic protective layer, the first packaging layer and the third packaging layer are inorganic layers;
the first planarizing layer, the second planarizing layer, the pixel defining layer, the light emitting material and cathode layer, and the second encapsulating layer are organic layers.
6. A display panel comprising the display substrate according to any one of claims 1 to 5.
7. A display device comprising the display substrate according to any one of claims 1 to 5 or the display panel according to claim 6.
8. A method of fabricating a display substrate according to any one of claims 1 to 5, comprising:
forming a display area with a plurality of electroluminescent display units arranged in an array and a display substrate surrounding a non-display area of the display area, wherein the display substrate comprises a plurality of functional film layers arranged on a flexible substrate, and the plurality of functional film layers comprise a plurality of inorganic film layers and a plurality of organic film layers;
the non-display area comprises an isolation dam part and a first isolation groove part which are arranged from the display area to the display area from the near to the far direction and surround the display area
The isolation dam part comprises a dam body with a first height, which is arranged on the inorganic film layer and the organic film layer and is used for isolating the organic film layer close to the light emergent side of the display area;
the first isolation groove part comprises first isolation columns arranged on the inorganic film layer closest to the flexible substrate, a first isolation groove exposing the inorganic film layer closest to the flexible substrate between every two adjacent first isolation columns, and an FMLOC dielectric layer covering the first isolation columns and the first isolation groove.
9. The method of manufacturing according to claim 8, comprising:
forming a driving circuit layer on the flexible substrate, wherein the driving circuit layer comprises a circuit function layer, an interlayer insulating layer, a first planarization layer and a second planarization layer;
patterning an inorganic protective layer including a plurality of inorganic protective portions on the second planarization layer of the non-display region, forming a first opening corresponding to a first isolation groove portion to be formed between adjacent inorganic protective portions, exposing the second planarization layer;
forming an anode on the second planarization layer of the display region;
forming a pixel defining layer comprising a pixel defining portion formed on the anode and a dam formed on the inorganic protective layer to form an isolation dam, the dam having a first height relative to the flexible substrate;
etching through the first opening to form a first middle isolation column and an inverted T-shaped first middle isolation groove exposing the interlayer insulating layer to form a first middle display substrate;
evaporating and forming a light-emitting material and a cathode layer on the first intermediate display substrate;
forming a first encapsulation layer on the light emitting material and the cathode layer;
printing on the first packaging layer on one side of the dam body close to the display area to form a second packaging layer, wherein the height of the second packaging layer relative to the flexible substrate is smaller than that of the dam body relative to the flexible substrate;
forming a third encapsulation layer covering the second encapsulation layer and the exposed first encapsulation layer;
etching through the first opening by using an FLMOC (flash metal oxide semiconductor) process to form a first isolation column and a cross-shaped first isolation groove exposing the interlayer insulating layer so as to form a second intermediate display substrate;
and forming an FMLOC dielectric layer on the second intermediate display substrate to form an isolation dam part and a first isolation groove part.
10. The method of manufacturing according to claim 9, wherein after forming an FMLOC dielectric layer on the second intermediate display substrate to form an isolation dam and a first isolation trench, the method further comprises:
forming a third planarizing layer covering the first isolation trench portion.
11. The method of claim 9, wherein the display substrate further comprises a second isolation trench portion surrounding the display region and disposed on a side of the isolation dam portion away from the first isolation trench portion,
the patterning an inorganic protective layer including a plurality of inorganic protective portions on the second planarization layer of the non-display area further includes: forming a second opening corresponding to a second isolation groove part to be formed, exposing the second planarization layer, between the adjacent inorganic protection parts;
the forming of the first intermediate isolation pillar and the first intermediate isolation trench of the inverted T shape exposing the interlayer insulating layer by the first opening etching to form the first intermediate display substrate further includes: and etching through the second opening to form a second isolation column and an inverted T-shaped second isolation groove exposing the first planarization layer.
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