CN113980753A - Novel leavening agent and preparation method thereof - Google Patents
Novel leavening agent and preparation method thereof Download PDFInfo
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- CN113980753A CN113980753A CN202111248406.8A CN202111248406A CN113980753A CN 113980753 A CN113980753 A CN 113980753A CN 202111248406 A CN202111248406 A CN 202111248406A CN 113980753 A CN113980753 A CN 113980753A
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- leavening agent
- novel
- novel leavening
- board
- deionized water
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- 235000010855 food raising agent Nutrition 0.000 title claims abstract description 72
- 238000002360 preparation method Methods 0.000 title abstract description 12
- 239000008367 deionised water Substances 0.000 claims abstract description 12
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000002585 base Substances 0.000 claims abstract description 11
- 239000003513 alkali Substances 0.000 claims abstract description 8
- 150000007519 polyprotic acids Polymers 0.000 claims abstract description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 30
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 238000003756 stirring Methods 0.000 claims description 11
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 9
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000002791 soaking Methods 0.000 claims description 7
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 claims description 6
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 claims description 6
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 6
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 claims description 6
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 claims description 6
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 claims description 6
- COBPKKZHLDDMTB-UHFFFAOYSA-N 2-[2-(2-butoxyethoxy)ethoxy]ethanol Chemical compound CCCCOCCOCCOCCO COBPKKZHLDDMTB-UHFFFAOYSA-N 0.000 claims description 4
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 4
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 claims description 4
- -1 alcohol ethers Chemical class 0.000 claims description 3
- 150000001298 alcohols Chemical class 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 claims description 2
- RNFAKTRFMQEEQE-UHFFFAOYSA-N Tripropylene glycol butyl ether Chemical compound CCCCOC(CC)OC(C)COC(O)CC RNFAKTRFMQEEQE-UHFFFAOYSA-N 0.000 claims description 2
- 235000019445 benzyl alcohol Nutrition 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims description 2
- 238000007865 diluting Methods 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- 239000002904 solvent Substances 0.000 abstract description 20
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 abstract description 18
- 239000000463 material Substances 0.000 abstract description 17
- 230000003628 erosive effect Effects 0.000 abstract description 6
- 238000005352 clarification Methods 0.000 abstract description 3
- 238000000926 separation method Methods 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 3
- 238000007747 plating Methods 0.000 abstract description 2
- 239000003292 glue Substances 0.000 description 12
- 235000011121 sodium hydroxide Nutrition 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 150000001408 amides Chemical class 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000005265 energy consumption Methods 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- 230000008961 swelling Effects 0.000 description 4
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 3
- 238000005187 foaming Methods 0.000 description 3
- 229910052748 manganese Inorganic materials 0.000 description 3
- 239000011572 manganese Substances 0.000 description 3
- 239000012286 potassium permanganate Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000012855 volatile organic compound Substances 0.000 description 2
- 239000002912 waste gas Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000006184 cosolvent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000006174 pH buffer Substances 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/36—Organic compounds containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/263—Ethers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Inorganic Chemistry (AREA)
- Processing Of Solid Wastes (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
The invention belongs to the technical field of chemical plating pretreatment, and particularly relates to a novel leavening agent and a preparation method thereof. The leavening agent comprises the following components in percentage by mass: 40-50g/L of alcohol ether; 15-20g/L of alcohol; 30-40g/L of alkali; 2-4g/L of inorganic polybasic acid; the balance being deionized water. The novel leavening agent takes alcohol ether as a solvent, can achieve the biting and eroding capacity of the traditional leavening agent at a lower operation temperature in a short time under the condition of low solvent, solves the problems that the novel material has insufficient biting and eroding amount, is easy to cause hole wall separation, and the clarification of tank liquor and the mutual solubility of the alcohol ether leavening agent under the condition of high-concentration alkali, has economic preparation and use cost, is safe and environment-friendly, can be used for treating various base materials, and has wide applicability.
Description
Technical Field
The invention belongs to the technical field of chemical plating pretreatment, and particularly relates to a novel leavening agent and a preparation method thereof.
Background
With the progress of technology, the requirement of the new materials (such as high-speed board materials) used in the present PCBs on the roughness of the drilled hole is higher and higher, and especially, the hole wall bonding force becomes a major problem. The drilling holes can generate cracks between the resins and the glass fibers, the cracks can remain the leavening agents, and the leavening agents naturally volatilize to cause the punctiform or flaky hole walls to float off. Therefore, it is desirable to minimize the solvent content in the leavening cylinders while minimizing the time required to reduce solvent carryover.
The need for leavening agents is increasing, as leavening times are reduced and solvents are reduced while ensuring a certain amount of degummed material to prevent the formation of inner layer interconnect defects (ICD). At present, in the process of removing the glue residue by using the traditional leavening agent, because of the appearance of a novel base material, the traditional leavening agent can not remove the molten glue residue and fragments by the glue residue removing process so as to provide a clean resin surface of a hole wall and a reliable inner copper surface, and the traditional leavening agent has weak corrosion resistance and is easy to remain, thus easily causing the problems of hole wall floating and the like. In addition, the traditional leavening agent has short service cycle, and the bath solution is easy to be turbid and layered under the condition of high-concentration alkali. This series of problems necessitates the development of a leavening agent which can be applied to the new materials.
Although Chinese patent CN113088410A provides an amide-based horizontal copper deposition leavening agent and a preparation method thereof, the amide-based horizontal copper deposition leavening agent uses an amide-based substance, and a solvent is easy to volatilize, so that VOC (volatile organic Compounds) emission is easily caused; chinese patent CN106010830A provides a PCB aqueous leavening agent and a using method thereof, but the raw materials used in the method are high in solvent content, so that the solvent easily causes the problems of poor adhesion such as foaming or delamination between a base material and a copper layer in a fine seam between glass fiber and resin scraps.
Disclosure of Invention
The invention aims to provide a novel leavening agent and a preparation method thereof, the novel leavening agent can achieve the biting and eroding capacity of the traditional leavening agent in a short time at a lower operation temperature under the condition of low solvent, the problems that the novel material has insufficient biting and eroding amount and is easy to cause hole wall separation, and the clarification of tank liquor and the mutual dissolution of alcohol ether leavening agents under the condition of high-concentration alkali are solved, and the preparation and use cost of the novel leavening agent is economic, the production is safe and the environment is friendly.
The invention provides a novel leavening agent, which comprises the following components in percentage by mass:
the solvent with low solvent content is used in the technical scheme, so that the problem of poor adhesion force such as foaming or layering between the base material and the copper layer caused by the solvent in a fine seam between the glass fiber and the resin scraps can be solved, the vapor pressure of the alcohol ether leavening agent is lower than that of amides, the problems of heat reliability and solvent volatilization are not easy to occur, and the problem of failure of the anode conductive wire is favorably alleviated.
Further, in the above technical solution, the alcohol ether includes one or more of benzyl alcohol butyl ether, diethylene glycol monobutyl ether, triethylene glycol butyl ether, and tripropylene glycol butyl ether. In the technical scheme, the pure ether is used as a solvent of the leavening agent, so that various base materials can be expanded and softened.
Further, in the above technical solution, the alcohol includes one or more of 1, 4-butanediol, glycerol, and butanol. In the technical scheme, alcohols are used as wetting agents and cosolvents.
Further, in the above technical solution, the inorganic polybasic acid is any one of phosphoric acid or phosphorous acid. The polybasic acid is added in the technical scheme, so that the pH buffering effect of the bath solution can be achieved, and the bath solution is not layered after the alkali is continuously added.
Further, in the above technical scheme, the alkali is any one of sodium hydroxide, potassium hydroxide or lithium hydroxide. The strong base is used in the technical scheme, a required strong alkaline environment is provided for removing the glue residues, and the glue residue removing effect is good.
The invention also provides a preparation method of the novel leavening agent, which comprises the following steps: adding alcohol ethers into a container, adding deionized water, stirring uniformly, adding alcohols, stirring uniformly, adding inorganic polybasic acid, stirring uniformly, cooling to normal temperature, adding strong base, fully stirring uniformly, and diluting to constant volume with deionized water to obtain the novel leavening agent liquid.
The invention also provides a using method of the novel leavening agent, which comprises the following steps: preparing a novel leavening agent according to a ratio, heating to 60-80 ℃, and then putting the PCB double-sided board or the multilayer board into the novel leavening agent for soaking reaction for 6-9 min.
The novel leavening agent obtained in the technical scheme can obtain the required bite erosion amount by only heating to a lower temperature and processing for 1-2 times when in use, reduces the energy consumption, is suitable for various base materials, and has wide applicability.
Further, when the double-sided board or the multilayer board of the PCB in the technical scheme is a high-speed board, the heating temperature is 70-80 ℃.
Further, when the double-sided board or the multilayer board of the PCB in the technical scheme is a common board, the heating temperature is 60-70 ℃.
Furthermore, the required bite amount can be achieved by using the technical scheme for 1-2 times.
Compared with the prior art, the method has the beneficial effects that:
1. the novel swelling agent takes alcohol ether as a solvent, has lower vapor pressure than amides, is not easy to cause the problem of heat reliability, is beneficial to relieving the failure problem of the anode conductive wire, can be used for treating various base materials, and has wide applicability;
2. the invention adopts the solution with low solvent content, can reduce the problem that the solvent causes poor adhesion such as foaming or layering between the base material and the copper layer in the fine joint between the glass fiber and the resin scraps, can achieve the biting capability of the traditional leavening agent in a short time, and simultaneously uses the leavening agent with low solvent content, reduces the emission of waste gas COD, and has low wastewater treatment cost;
3. the invention uses polybasic acid as pH buffer of the bath solution, solves the problems of clarification of the bath solution and mutual solubility with alcohol ether leavening agent under the condition of high-concentration alkali;
4. when the novel leavening agent is used, the required bite erosion amount can be achieved by processing for 1-2 times at a lower operation temperature, so that the energy consumption is reduced;
5. the novel leavening agent solves the problems of insufficient bite quantity of new materials and easy separation of hole walls, and has the advantages of economic cost, safe production and environmental protection.
Detailed Description
The experimental procedures in the following examples are conventional unless otherwise specified. The raw materials in the following examples are all commercially available products and are commercially available, unless otherwise specified.
The above-mentioned technical features of the present invention and those described in detail below (e.g., in the embodiments) can be combined with each other to form a new or preferred embodiment.
To make the present invention, various technical solutions and advantages clearer, the following embodiments of the present invention are described in detail for further clarity and completeness, and it should be noted that the fact that the description is the embodiments of the present invention, and does not represent all solutions, and it is stated that: the embodiments based on the present invention belong to the protection scope of the present invention.
Example 1
A preparation method of a novel leavening agent comprises the following specific steps:
adding 45g of diethylene glycol monobutyl ether into a beaker, adding 500mL of deionized water, stirring until the diethylene glycol monobutyl ether is completely dissolved, then adding 16g of 1, 4-butanediol and 3g of phosphoric acid, adding 35g of caustic soda flakes after the diethylene glycol monobutyl ether is uniformly stirred and completely dissolved, and then using the deionized water to fix the volume to 1L after the diethylene glycol monobutyl ether is uniformly stirred to prepare the novel leavening agent solution.
Example 2
A preparation method of a novel leavening agent comprises the following specific steps:
adding 40g of triethylene glycol monobutyl ether into a beaker, adding 500mL of deionized water, stirring until the triethylene glycol monobutyl ether is completely dissolved, then adding 15g of glycerol and 2g of phosphorous acid, adding 30g of caustic soda flakes after the glycerol and the phosphorous acid are uniformly stirred and completely dissolved, and then using the deionized water to fix the volume to 1L after the mixture is uniformly stirred to prepare the novel leavening agent solution.
Example 3
A preparation method of a novel leavening agent comprises the following specific steps:
adding 50g of diethylene glycol-butyl ether into a beaker, adding 500mL of deionized water, stirring until the diethylene glycol-butyl ether is completely dissolved, then adding 20g of butanol and 4g of phosphoric acid, adding 40g of potassium hydroxide after the diethylene glycol-butyl ether is uniformly stirred and completely dissolved, and then using the deionized water to fix the volume to 1L after the diethylene glycol-butyl ether is uniformly stirred to prepare the novel leavening agent solution.
Test example 1
The novel leavening agent solution prepared in example 1 was used for the treatment of medium and high TG panels (EM825, IT158, S1000, IT180A) by: the novel leavening agent solution in the embodiment 1 is heated to 75 ℃, and put into a high TG sheet material in a PCB for soaking reaction for 6 min. The specific parameters are as follows:
(1) parameters of the bulking cylinder:
novel leavening agent: 120 mL/L;
sodium hydroxide: 35 g/L;
temperature: 75 ℃;
time: 6 min;
clear and colorless, and has no turbidity after being continuously heated for 3 hours.
(2) Parameters of the glue removing cylinder:
temperature: 75 ℃;
time: 18 min;
potassium permanganate: 60 g/L;
sodium hydroxide: 45 g/L;
hexavalent manganese: 26 g/L.
And (3) testing results: as shown in table 1.
TABLE 1
| Material | EM825 | IT158 | S1000 | IT180A |
| Bite size (mg/cm)2) | 0.356 | 0.338 | 0.292 | 0.246 |
From the test results in table 1, it can be seen that the bite requirement can be met only once for medium to high TG new panels by treating them with the new leavening agent of the present invention.
Test example 2
The novel leavening agent solution prepared in example 1 was used for treating ordinary slabs by the following method: the novel leavening agent solution in the embodiment 1 is heated to 70 ℃, and three pieces of common PCB plates are put into the novel leavening agent solution for soaking and reacting for 6min and 8min respectively. The specific parameters are as follows:
(1) parameters of the bulking cylinder:
novel leavening agent: 120 mL/L;
sodium hydroxide: 35 g/L;
temperature: 70 ℃;
time: 6min/8min/10 min;
clear and colorless, and has no turbidity after being continuously heated for 3 hours.
(2) Parameters of the glue removing cylinder:
temperature: 75 ℃;
time: 18 min;
potassium permanganate: 60 g/L;
sodium hydroxide: 45 g/L;
hexavalent manganese: 26 g/L.
And (3) testing results: as shown in table 2.
TABLE 2
| Soaking time/min | 6 | 8 | 10 |
| Amount of degumming (mg/cm)2) | 0.743 | 0.78 | 0.779 |
From the test results in table 2, it can be seen that the glue removing amount can meet the requirement when the novel swelling agent of the present invention is used for soaking a PCB panel, but the glue removing amount is hardly affected when the novel swelling agent is treated for 6min or more, so that the excellent effect can be achieved only by selecting the treatment for 6min, the energy consumption can be reduced, and the cost can be reduced.
Test example 3
The novel leavening agent solution prepared in example 1 was used for treating ordinary slabs by the following method: the novel leavening agent solution of the embodiment 1 is heated to 65 ℃, 70 ℃, 75 ℃ and 80 ℃ respectively, and is put into the common PCB respectively for soaking reaction for 6 min. The specific parameters are as follows:
(1) parameters of the bulking cylinder:
novel leavening agent: 120 mL/L;
sodium hydroxide: 35 g/L;
temperature: 65 ℃/70 ℃/75 ℃/80 ℃;
time: 6 min;
clear and colorless, and has no turbidity after being continuously heated for 3 hours.
(2) Parameters of the glue removing cylinder:
temperature: 75 ℃;
time: 18 min;
potassium permanganate: 60 g/L;
sodium hydroxide: 45 g/L;
hexavalent manganese: 26 g/L.
And (3) testing results: as shown in table 3.
TABLE 3
| Temperature (. degree.C.) | 65 | 70 | 75 | 80 |
| Amount of degumming (mg/cm)2) | 0.719 | 0.769 | 0.832 | 1.211 |
From the test results in table 3, it can be seen that when the novel swelling agent of the present invention is used to soak common PCB panels, the difference in temperature will affect the amount of glue removal, but the amount of glue removal will also increase with increasing temperature. Therefore, for treating common PCB boards, the treatment temperature is preferably 65-70 ℃.
In conclusion, the novel leavening agent can achieve the biting capability of the traditional leavening agent at a low temperature in a short time under the condition of low solvent, can reduce the energy consumption, and simultaneously reduces the emission of waste gas COD by using the leavening agent with low solvent content.
Finally, it should be emphasized that the above-described preferred embodiments of the present invention are merely examples of implementations, rather than limitations, and that many variations and modifications of the invention are possible to those skilled in the art, without departing from the spirit and scope of the invention.
Claims (10)
1. The novel leavening agent is characterized by comprising the following components in percentage by mass:
the balance being deionized water.
2. The novel leavening agent of claim 1, wherein the alcohol ethers comprise one or more of benzyl alcohol butyl ether, diethylene glycol monobutyl ether, triethylene glycol butyl ether, and tripropylene glycol butyl ether.
3. The novel leavening agent of claim 1, wherein the alcohol comprises one or more of 1, 4-butanediol, glycerol, butanol.
4. The novel leavening agent as claimed in claim 1, wherein the inorganic polybasic acid is any one of phosphoric acid or phosphorous acid.
5. The novel leavening agent as claimed in claim 1, wherein the alkali is any one of sodium hydroxide, potassium hydroxide or lithium hydroxide.
6. The process for preparing a novel leavening agent as claimed in any one of claims 1 to 5, wherein the process comprises the steps of: adding alcohol ethers into a container, adding deionized water, stirring uniformly, adding alcohols, stirring uniformly, adding inorganic polybasic acid, stirring uniformly, cooling to normal temperature, adding strong base, fully stirring uniformly, and diluting to constant volume with deionized water to obtain the novel leavening agent liquid.
7. Use of the novel leavening agent according to any one of claims 1 to 5 or the novel leavening agent prepared according to claim 6, wherein the use is: preparing a novel leavening agent according to a ratio, heating to 60-80 ℃, and then putting the PCB double-sided board or the multilayer board into the novel leavening agent for soaking reaction for 6-9 min.
8. The use method of the novel leavening agent according to claim 7, wherein the heating temperature is 70-80 ℃ when the PCB double-sided board or multi-layer board is a high-speed board.
9. The use method of the novel leavening agent according to claim 7, wherein the heating temperature is 60-70 ℃ when the PCB double-sided board or multi-layer board is a common board.
10. The use of the novel leavening agent as claimed in any one of claims 7 to 9 wherein the desired amount of bite is achieved in 1 to 2 applications.
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Cited By (1)
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|---|---|---|---|---|
| CN114133994A (en) * | 2021-11-19 | 2022-03-04 | 广东世运电路科技股份有限公司 | Swelling agent for manufacturing printed circuit board |
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| TW200712105A (en) * | 2005-09-30 | 2007-04-01 | Taiwan Uyemura Co Ltd | The leavening agent |
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| TW200712105A (en) * | 2005-09-30 | 2007-04-01 | Taiwan Uyemura Co Ltd | The leavening agent |
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