CN113969383B - Hot-dip plating method for copper wire - Google Patents
Hot-dip plating method for copper wire Download PDFInfo
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- CN113969383B CN113969383B CN202111246026.0A CN202111246026A CN113969383B CN 113969383 B CN113969383 B CN 113969383B CN 202111246026 A CN202111246026 A CN 202111246026A CN 113969383 B CN113969383 B CN 113969383B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
- C23C2/06—Zinc or cadmium or alloys based thereon
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
- C23C2/36—Elongated material
- C23C2/38—Wires; Tubes
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/04—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors
- C23G1/06—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/10—Other heavy metals
- C23G1/103—Other heavy metals copper or alloys of copper
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
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- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
The invention discloses a hot-dip method of a copper wire, which comprises the following steps of: pour into the degreaser in to the deoiling pond, at normal atmospheric temperature, put into the deoiling pond with pending copper line and soak, the rocking that does not stop during the soaking is taken out the after-cleaning after the preset time, and the degreaser includes sodium hydroxide, sodium silicate, sodium dodecyl sulfate, emulsifier, borax and zinc oxide, pickling: pouring a pickling agent into the pickling tank, soaking the deoiled copper wire in the pickling tank for 10-13min at 30-40 ℃, and plating assisting: putting the cleaned copper wire into a plating assistant container, pouring a plating assistant solution into the plating assistant container, and plating a plating assistant layer on the surface of the copper wire at the temperature of 58-68 ℃; hot dipping: and putting the copper wire subjected to plating assistance into a zinc bath for hot plating. The combination of stannous chloride, polyether polyol and epoxy resin can slow down the corrosion degree of the surface of the plating layer.
Description
Technical Field
The invention relates to the technical field of copper wire manufacturing, in particular to a hot-dip method for a copper wire.
Background
The hot dipping is to put the cleaned workpiece into a molten zinc pool, take out after isothermal, coat the surface of the workpiece with thicker zinc, generally more than 0.2mm, and use bolts and nuts, large steel components and the like outdoors, which can be rustless for decades. In Australia and all outdoor steel components, hot galvanizing is required, including iron railings, iron doors and the like, but a copper wire is directly subjected to hot galvanizing, so that the corrosion resistance is poor, and particularly in coastal areas.
Disclosure of Invention
The invention provides a hot-dip method of a copper wire to solve the defects in the prior art.
In order to solve the technical problems, the invention adopts the following technical scheme: a hot-dip plating method of copper wire comprises the following steps,
oil removal: pouring a degreasing agent into the degreasing tank, placing the copper wire to be treated into the degreasing tank for soaking at normal temperature, continuously shaking during the soaking, taking out the copper wire for cleaning after preset time, wherein the degreasing agent comprises 30-45 parts of sodium hydroxide, 12-16 parts of sodium silicate, 8-12 parts of sodium dodecyl sulfate, 10-15 parts of an emulsifier, 7-11 parts of borax and 5-10 parts of zinc oxide;
the alkalinity of the sodium hydroxide is extremely strong, when the alkali content is high, the saponification effect is stronger, the sodium hydroxide has a good removing effect on mineral oil and animal and vegetable oil, but because the alkalinity of the sodium hydroxide is extremely strong, the sodium hydroxide has certain oxidation and corrosion effects on metals, sodium silicate molecules can form a film on the surface of a copper wire to protect the surface of a metal layer from being corroded by the sodium hydroxide, and the sodium carbonate has a strong emulsifying effect on the oil, so that the mineral oil which cannot be subjected to saponification reaction can be removed; zinc is an active metal, so that sodium hydroxide can perform a reduction reaction in preference to zinc oxide, thereby preventing the copper wire from being corroded; the borax is added, so that the alkalinity can be reduced, and the protective effect and the antirust function on metal, particularly steel parts and aluminum alloy are achieved; the sodium dodecyl sulfate is used as a surfactant, an emulsifier is matched, the grease is micronized after the sodium dodecyl sulfate is soaked in a grease layer, and the grease particles are emulsified and dispersed in water by the surfactant, so that the aim of removing the grease is fulfilled.
Acid washing: and pouring a pickling agent into the pickling tank, and soaking the copper wire subjected to oil removal in the pickling tank for 10-13min at the temperature of 30-40 ℃.
Cleaning: putting the copper wire subjected to acid washing into ultrasonic waves for washing for 4 times;
plating assisting: putting the cleaned copper wire into a plating assistant container, pouring plating assistant liquid into the plating assistant container, plating a plating assistant layer on the surface of the copper wire at the temperature of 58-68 ℃, wherein the most suitable temperature of the plating assistant liquid is 58-68 ℃, the temperature is lower, and the adhesion of the fluxing agent is uneven and has no effect; when the temperature is higher, the adhesion of the fluxing agent is too thick, and the consumption is increased;
hot dipping: and putting the copper wire subjected to plating assistance into a zinc bath for hot plating.
Preferably, the acid washing agent comprises 40-55 parts of hydrochloric acid, 10-15 parts of citric acid, 10-15 parts of ethylene diamine tetraacetic acid, 12-17 parts of rosin amine polyoxyethylene ether and 7-11 parts of benzotriazole.
Ethylenediaminetetraacetic acid is a heavy metalThe complexing agent can form a stable water-soluble complex with metals, rare earth elements, transition metals and the like, can be used for compatiblizing metal-containing impurities such as rust and the like under acid pickling and accelerating the cleaning speed of a metal solution, the rosin amine polyoxyethylene ether can change the activation energy of a cathode reaction or an anode reaction in a corrosion chemical process, the corrosion of acid to the metals in acid pickling is avoided and the oxidation is slowed down, the rosin amine polyoxyethylene ether is an effective metal corrosion inhibitor, benzotriazole can be used for rust prevention and has a particularly obvious corrosion prevention effect on copper, the gas-phase corrosion inhibitor for copper and copper alloys can form covalent bonds and coordination bonds with copper atoms and can be replaced into chain polymers mutually, a multilayer protective film is formed on the surface of copper, the surface of copper does not perform redox reaction, hydrogen does not occur and plays an anti-corrosion role, the benzotriazole is matched with the rosin amine polyoxyethylene ether, the copper wire can be effectively prevented from being corroded, meanwhile, the protective film is formed on the surface of the copper wire, the corrosion of citric acid to the metals is small, the chloride ion is not added into the stress corrosion of the copper wire, and the citric acid can complex Fe3 + Weakening of Fe3 + The acid cleaning can also remove the residual degreasing agent on the copper wire due to the alkaline degreasing agent.
Preferably, the plating assistant solution comprises 20-30 parts of zinc chloride, 10-15 parts of ammonium chloride, 5-8 parts of stannous chloride, 4-7 parts of polyether polyol and 5-8 parts of epoxy resin.
Stannous chloride can guarantee that when electroplating, the cladding material is difficult for droing, in the platinization process, still can regard as sensitizer, makes the coating film luminance good, and polyether glycol can regard as the treating compound, makes copper line and zinc chloride and ammonium chloride rapid infiltration and reaction for help the formation of cladding material, accelerate copper line surface to form the thin protection film of one deck, increase the laminating degree, epoxy chemical resistance improves the chemical property stability of cladding material, protects metal matrix surface.
Preferably, the emulsifier comprises a fatty acid soap and a polyoxyethylene ether in a mass ratio of 1:1.
The polyoxyethylene ether is a nonionic active agent, has the functions of emulsification, foaming and decontamination, the fatty acid soap is also called as a fatty acid potassium soap which is an anionic surfactant, can be used as a main active substance of a high-efficiency cleaning type, can be freely compounded with anionic, nonionic and high polymer cationic surfactants under the alkaline condition, and can be matched with the polyoxyethylene ether, so that the alkaline oil removal efficiency can be improved.
Preferably, the plating assistant process further comprises the steps of soaking the copper wire in the plating assistant liquid for 30-45s, putting the soaked copper wire into a dryer, drying the surface moisture at the temperature of 150-250 ℃, simultaneously raising the temperature of the copper wire, wherein the drying time is 6-8min, and carrying out hot plating on the dried copper wire.
Preferably, the hot-dip coating process comprises the step of soaking the copper wire in a zinc bath for 4-8min at the temperature of 500-600 ℃ of zinc liquid.
Preferably, the method further comprises
And (3) cooling: and (4) putting the hot-dipped copper wire into a cooling pool, and cooling to the normal temperature at the cooling speed of 17 ℃/s.
Preferably, the degreasing soaking time is 9-15min.
Compared with the prior art, the invention has the beneficial effects that: the combination of stannous chloride, polyether polyol and epoxy resin can slow down the corrosion degree of the surface of the plating layer.
Detailed Description
The present invention will be described in detail with reference to examples.
Example 1
The invention provides a hot-dip method of a copper wire, which comprises the following steps,
oil removal: pouring a degreasing agent into the degreasing tank, placing the copper wire to be treated into the degreasing tank for soaking at normal temperature, continuously shaking during soaking, taking out after 9min, and cleaning, wherein the degreasing agent comprises 30 parts of sodium hydroxide, 12 parts of sodium silicate, 8 parts of sodium dodecyl sulfate, 10 parts of an emulsifier, 7 parts of borax and 5 parts of zinc oxide;
acid washing: pouring a pickling agent into the pickling tank, and soaking the copper wire subjected to oil removal in the pickling tank for 10min at the temperature of 30 ℃, wherein the pickling agent comprises 40 parts of hydrochloric acid, 10 parts of citric acid, 10 parts of ethylenediamine tetraacetic acid, 12 parts of rosin amine polyoxyethylene ether and 7 parts of benzotriazole.
Cleaning: putting the copper wire subjected to acid washing into ultrasonic waves for washing for 4 times;
plating assistance: putting the cleaned copper wire into a plating assistant container, pouring a plating assistant solution into the plating assistant container for 30s, plating a plating assistant layer on the surface of the copper wire at the temperature of 58 ℃, putting the soaked copper wire into a dryer, drying the surface water at the temperature of 150 ℃ and simultaneously increasing the temperature of the copper wire, wherein the plating assistant solution comprises 20 parts of zinc chloride, 10 parts of ammonium chloride, 5 parts of stannous chloride, 4 parts of polyether polyol and 5 parts of epoxy resin, and the drying time is 6min;
hot dipping: soaking the assistant plated copper wire in a zinc pool for 4min at the temperature of 500 ℃ of zinc liquid;
and (3) cooling: and (4) putting the hot-dipped copper wire into a cooling pool, and cooling to the normal temperature at the cooling speed of 17 ℃/s.
Example 2
A hot-dip plating method of copper wire comprises the following steps,
oil removal: pouring a degreasing agent into the degreasing tank, placing the copper wire to be treated into the degreasing tank for soaking at normal temperature, continuously shaking during soaking, taking out after 13min, and cleaning, wherein the degreasing agent comprises 40 parts of sodium hydroxide, 14 parts of sodium silicate, 10 parts of sodium dodecyl sulfate, 13 parts of an emulsifier, 10 parts of borax and 8 parts of zinc oxide;
acid washing: pouring a pickling agent into the pickling tank, and soaking the copper wire subjected to oil removal in the pickling tank for 11min at the temperature of 35 ℃, wherein the pickling agent comprises 50 parts of hydrochloric acid, 10-15 parts of citric acid, 12 parts of ethylenediamine tetraacetic acid, 15 parts of rosin amine polyoxyethylene ether and 9 parts of benzotriazole.
Cleaning: cleaning the copper wire subjected to acid cleaning for 4 times in ultrasonic waves;
plating assistance: putting the cleaned copper wire into a plating assistant container, pouring a plating assistant solution into the plating assistant container for 40s, plating a plating assistant layer on the surface of the copper wire at the temperature of 60 ℃, wherein the plating assistant solution comprises 25 parts of zinc chloride, 12 parts of ammonium chloride, 7 parts of stannous chloride, 6 parts of polyether polyol and 6 parts of epoxy resin, putting the soaked copper wire into a dryer, and drying the surface water at the temperature of 200 ℃ while increasing the temperature of the copper wire for 7min;
hot dipping: soaking the assistant-plated copper wire in a zinc pool for 7min at the temperature of 550 ℃ of zinc liquid;
and (3) cooling: and (4) putting the hot-dipped copper wire into a cooling pool, and cooling to the normal temperature at the cooling speed of 17 ℃/s.
Example 3
A hot-dip plating method of copper wire comprises the following steps,
oil removal: pouring a degreasing agent into the degreasing tank, placing the copper wire to be treated into the degreasing tank for soaking at normal temperature, continuously shaking during soaking, taking out after 15min, and cleaning, wherein the degreasing agent comprises 45 parts of sodium hydroxide, 16 parts of sodium silicate, 12 parts of sodium dodecyl sulfate, 15 parts of an emulsifier, 11 parts of borax and 10 parts of zinc oxide;
acid washing: and pouring a pickling agent into the pickling tank, and soaking the copper wire subjected to oil removal in the pickling tank for 13min at the temperature of 40 ℃, wherein the pickling agent comprises 55 parts of hydrochloric acid, 15 parts of citric acid, 15 parts of ethylene diamine tetraacetic acid, 17 parts of rosin amine polyoxyethylene ether and 11 parts of benzotriazole.
Cleaning: putting the copper wire subjected to acid washing into ultrasonic waves for washing for 4 times;
plating assistance: putting the cleaned copper wire into a plating assistant container, pouring a plating assistant solution into the plating assistant container for 45s, plating a plating assistant layer on the surface of the copper wire at the temperature of 68 ℃, putting the soaked copper wire into a dryer, drying the surface water at the temperature of 250 ℃ while increasing the temperature of the copper wire, wherein the plating assistant solution comprises 30 parts of zinc chloride, 15 parts of ammonium chloride, 8 parts of stannous chloride, 7 parts of polyether polyol and 8 parts of epoxy resin, and the drying time is 8min;
hot dipping: soaking the assistant-plated copper wire in a zinc pool for 8min at the temperature of 600 ℃ of zinc liquid;
and (3) cooling: and (4) putting the copper wire subjected to hot dipping into a cooling tank, and cooling to normal temperature at a cooling speed of 17 ℃/s.
Comparative example 1
This comparative example is substantially the same as example 3 except that:
the degreasing agent comprises 35 parts of sodium hydroxide, 15 parts of potassium hydroxide and 15 parts of sodium chloride.
Example 4
This embodiment is substantially the same as embodiment 3 except that:
sodium silicate and borax are not added in the oil removing agent.
Example 5
This example is substantially the same as example 3, except that:
in the oil removing agent, sodium dodecyl sulfate and zinc oxide are not added.
Example 6
This embodiment is substantially the same as embodiment 3 except that:
in the oil removing agent, no emulsifier is added.
Example 7
This embodiment is substantially the same as embodiment 3 except that:
fatty acid soap was not added to the emulsifier.
The surfaces of the copper wires after being degreased in the above examples and comparative examples are observed to show that:
the surfaces of the copper wires after being degreased in the examples 1, 2 and 3 have no obvious oil stain, the gloss of the surfaces of the copper wires is neat, and no obvious defect exists, but the gloss of the copper wires in the examples 1 and 2 is lower than that in the example 3;
example 4 the surface of the copper wire after being degreased has no obvious oil stain, the surface gloss is lower than that of examples 1, 2 and 3, the surface part of the copper wire has corrosion traces, and the comparison of example 3 and example 4 shows that the sodium silicate combined with borax can effectively inhibit the corrosion degree of alkalinity to the copper wire;
example 5 the surface of the copper wire after degreasing has slight oil stain, the surface glossiness is higher than that of example 4 and lower than that of examples 1 and 2, the surface of the copper wire has slight corrosion trace, the corrosion trace is lower than that of example 4, and the comparison of example 3 and example 5 shows that the sodium dodecyl sulfate can improve the degreasing effect, and the zinc oxide can reduce the corrosion of alkalinity to the copper wire;
in example 6, the surface of the deoiled copper wire has obvious oil stains, the surface glossiness of the copper wire is higher than that of example 4 and lower than that of example 5, the surface of the copper wire has no obvious defects, and the comparison between example 3 and example 6 shows that the deoiling effect can be improved by the emulsifier;
the copper wire after being degreased in the example 7 has slight oil stain, but the oil stain degree is lower than that in the example 6 and higher than that in the example 5, the surface of the copper wire has no obvious defect, and the comparison between the example 3 and the example 7 shows that the fatty acid soap can increase the degreasing effect;
the surface of the copper wire after deoiling in comparative example 1 has obvious oil stain traces, the gloss of the copper wire is lower than that in the above examples, the surface of the copper wire has obvious corrosion traces, sodium silicate, borax and zinc oxide are not added in comparative example 1 to inhibit the corrosion of alkalinity to the copper wire, and sodium dodecyl sulfate and an emulsifier are not added to enhance the deoiling effect.
Example 8
This embodiment is substantially the same as embodiment 1 except that:
the pickling agent does not contain ethylenediamine tetraacetic acid.
Example 9
This embodiment is substantially the same as embodiment 1 except that:
rosin amine polyoxyethylene ether and benzotriazole are not added in the acid cleaning agent.
Comparative example 2
This comparative example is substantially the same as example 1 except that:
the acid washing agent is 50 parts of sulfuric acid.
The acid pickling process and the acid-pickled copper wire surface of the examples and comparative example 2 were observed to show that:
the surfaces of the example 1, the example 2 and the example 3 have no obvious residues and rust, and the surfaces are tidy and have no obvious corrosion traces, but the acid washing time of the example 2 and the example 3 is longer than that of the example 1;
in the embodiment 8, when pickling is carried out for 10min, the surface of the copper wire still has obvious rust, and when pickling is carried out for 17min, the surface of the copper wire has no obvious rust trace, and the comparison between the embodiment 1 and the embodiment 8 shows that the EDTA can accelerate the pickling process, accelerate the pickling time and improve the efficiency;
in the example 9, when the copper wire is washed by acid for 10min, no obvious rust trace exists on the surface of the copper wire, but the copper wire after being washed by acid is observed to have obvious corrosion trace on the surface of the copper wire, and the comparison between the example 1 and the example 9 shows that the rosin amine polyoxyethylene ether and the benzotriazole can reduce the corrosion of the acid solution to the copper wire in the acid washing process;
in the comparative example 2, when pickling is carried out for 10min, the copper wire still has obvious rust traces, and after pickling is carried out for 22min, the copper wire has no obvious rust traces, and the surface of the copper wire after pickling in the comparative example 2 is observed to have serious corrosion traces, so that the comparative example 2 directly adopts sulfuric acid pickling, does not add ethylenediamine tetraacetic acid to improve the pickling efficiency, and does not add rosin amine polyoxyethylene ether and benzotriazole to prevent corrosion.
Example 10
This embodiment is substantially the same as embodiment 1 except that:
stannous chloride is not added in the plating assistant liquid.
Example 11
This embodiment is substantially the same as embodiment 1 except that:
the assistant plating solution is not added with polyether polyol and epoxy resin.
Comparative example 3
This comparative example is substantially the same as example 1 except that:
no plating assistant process is adopted.
Comparative example 4
This comparative example is substantially the same as example 1 except that:
stannous chloride, polyether polyol and epoxy resin are not added into the plating assistant liquid.
Comparative example 5
This comparative example is substantially identical to example 1, except that:
no cooling process was added.
The neutral salt spray test was performed on the copper wires after hot-dipping in examples 1, 2, 3, 10, 11, 3 and 4, and the corrosion of the surface plating layer of the copper wires was observed, and the results are shown in table 1; the neutral salt spray test is carried out according to a method with the national standard GB/T10125-2012, the temperature of a spray chamber is 35 ℃, the NaCl concentration is 50g/L, and the pH value of the brine is 7.0.
TABLE 1
As can be seen from table 1, example 1 is the most preferred embodiment, stannous chloride is not added in example 10, corrosion of the surface plating layer of the copper wire starts to occur on day 10, polyether polyol and epoxy resin are not added in example 11, corrosion of the surface plating layer of the copper wire starts to occur on day 9, and the corrosion speed is high, and the corrosion area is about 17% on day 10, so that stannous chloride, polyether polyol and epoxy resin can reduce the corrosion degree of the surface of the plating layer, no plating assistant process is adopted in comparative example 3, no cooling process is added in comparative example 5, and the corrosion speed of the copper wire is higher than that of examples 1, 2 and 3.
The above additional technical features can be freely combined and used in superposition by those skilled in the art without conflict.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the patent and protection scope of the present invention should be subject to the appended claims.
Claims (4)
1. A hot-dip plating method of a copper wire is characterized by comprising the following steps,
oil removal: pouring a degreasing agent into an oil removing tank, placing a copper wire to be treated into the oil removing tank for soaking at normal temperature, continuously shaking during soaking, taking out for cleaning after preset time, wherein the degreasing agent comprises 30-45 parts of sodium hydroxide, 12-16 parts of sodium silicate, 8-12 parts of sodium dodecyl sulfate, 10-15 parts of an emulsifier, 7-11 parts of borax and 5-10 parts of zinc oxide, and the emulsifier comprises fatty acid soap and polyoxyethylene ether in a mass ratio of 1:1;
acid washing: pouring a pickling agent into the pickling tank, and soaking the copper wire subjected to oil removal in the pickling tank for 10-13min at the temperature of 30-40 ℃, wherein the pickling agent comprises 40-55 parts of hydrochloric acid, 10-15 parts of citric acid, 10-15 parts of ethylene diamine tetraacetic acid, 12-17 parts of rosin amine polyoxyethylene ether and 7-11 parts of benzotriazole;
cleaning: putting the copper wire subjected to acid washing into ultrasonic waves for washing for 4 times;
plating assistance: putting the cleaned copper wire into a plating assistant container, pouring a plating assistant solution into the plating assistant container, and plating an assistant coating on the surface of the copper wire at the temperature of 58-68 ℃, wherein the plating assistant solution comprises 20-30 parts of zinc chloride, 10-15 parts of ammonium chloride, 5-8 parts of stannous chloride, 4-7 parts of polyether polyol and 5-8 parts of epoxy resin;
hot dipping: putting the assistant plated copper wire into a zinc pool for hot plating;
the method further comprises cooling: and (4) putting the hot-dipped copper wire into a cooling pool, and cooling to the normal temperature at the cooling speed of 17 ℃/s.
2. The hot-dip method of copper wire according to claim 1, wherein the plating-assistant process further comprises immersing the copper wire in the plating-assistant solution for 30-45s, placing the immersed copper wire in a dryer, drying the surface moisture at 150-250 ℃ while increasing the temperature of the copper wire, wherein the drying time is 6-8min, and performing the hot-dip process on the dried copper wire.
3. The method for hot-dipping copper wire according to claim 1, wherein the hot-dipping process comprises immersing the copper wire in a zinc bath at 500-600 ℃ for 4-8min.
4. The method for hot-dipping copper wire according to claim 1, wherein the degreasing soaking time is 9 to 15min.
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| CN110257747A (en) * | 2019-06-22 | 2019-09-20 | 浙江东南新材科技有限公司 | A kind of superthin coated hot plating zinc steel plate and its manufacture craft |
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| CN111945091A (en) * | 2019-05-15 | 2020-11-17 | 扬州澳洋顺昌金属材料有限公司 | Galvanizing production process |
| CN113122752A (en) * | 2021-04-10 | 2021-07-16 | 江西中晟金属有限公司 | Production method of corrosion-resistant copper wire |
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| CA2628470C (en) * | 2005-12-20 | 2011-10-18 | Teck Cominco Metals Ltd. | Flux and process for hot dip galvanization |
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| CN111945091A (en) * | 2019-05-15 | 2020-11-17 | 扬州澳洋顺昌金属材料有限公司 | Galvanizing production process |
| CN110257747A (en) * | 2019-06-22 | 2019-09-20 | 浙江东南新材科技有限公司 | A kind of superthin coated hot plating zinc steel plate and its manufacture craft |
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