CN113966145A - High-weather-resistance temperature regulating system and method for combined embedded cabinet - Google Patents

High-weather-resistance temperature regulating system and method for combined embedded cabinet Download PDF

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Publication number
CN113966145A
CN113966145A CN202111191312.1A CN202111191312A CN113966145A CN 113966145 A CN113966145 A CN 113966145A CN 202111191312 A CN202111191312 A CN 202111191312A CN 113966145 A CN113966145 A CN 113966145A
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China
Prior art keywords
heat exchange
cabinet
plate
ventilation
heat
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CN202111191312.1A
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Chinese (zh)
Inventor
李卫兵
李惠华
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Zhengzhou Dema Electric Co Ltd
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Zhengzhou Dema Electric Co Ltd
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Priority to CN202111191312.1A priority Critical patent/CN113966145A/en
Publication of CN113966145A publication Critical patent/CN113966145A/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20145Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00Machines, plants or systems, using electric or magnetic effects
    • F25B21/02Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20172Fan mounting or fan specifications
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20209Thermal management, e.g. fan control
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554Forced ventilation of a gaseous coolant
    • H05K7/20572Forced ventilation of a gaseous coolant within cabinets for removing heat from sub-racks, e.g. plenum
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/207Thermal management, e.g. cabinet temperature control

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to a combined embedded type high-weather-resistance temperature regulating system for a cabinet, which comprises bearing columns, heat exchange bases, a drainage fan, a semiconductor refrigerating mechanism, a drainage pipe and a wiring terminal, wherein the heat exchange bases are mutually connected through the bearing columns, at least one wiring terminal is additionally arranged on the outer side surface of each heat exchange base, the semiconductor refrigerating mechanism is embedded in a refrigerating cavity, the drainage fan is connected with the outer side surface of a heat exchange plate, and in addition, the ventilation fan, the drainage fan and the semiconductor refrigerating mechanism are electrically connected with the wiring terminals. The using method comprises the four steps of system initialization, system adjustment, temperature adjustment operation, system maintenance and the like. On one hand, the invention can meet the requirements of cooling the interior of the cabinet in a ventilation environment and forced refrigeration and greatly improve the flexibility of the temperature adjustment operation of the cabinet; on the other hand, the temperature adjusting efficiency can be flexibly adjusted to meet the requirements of different cabinet structures and operation of temperature adjustment, so that the universality and the operation flexibility of the cabinet temperature adjusting system are greatly improved.

Description

High-weather-resistance temperature regulating system and method for combined embedded cabinet
Technical Field
The invention relates to a high-weather-resistance temperature regulating system and a high-weather-resistance temperature regulating method for a combined embedded cabinet, and belongs to the technical field of temperature regulating equipment.
Background
At present, when cabinet equipment such as a power distribution cabinet, an electric control cabinet, a network cabinet and the like operates, in order to reduce the influence of high-temperature and low-temperature environments on electrical equipment in the cabinet and improve the operation stability of the equipment, currently, a variety of cooling systems for cabinet operation are developed, such as conventional ventilation fan equipment, and dedicated temperature control devices, such as "an efficient industrial intelligent temperature control dehumidifier" with patent application number "202022182591.2", and "a water flow temperature control device for data center" with patent application number "202021047109.8, although the current temperature adjusting devices can meet the use requirements to a certain extent, the ventilation volume and the refrigeration volume of the ventilator are relatively single, the adjusting range is narrow, therefore, the German defect that the temperature regulating capacity of the cabinet is insufficient or the energy consumption of the temperature regulating operation is too high due to insufficient or overlarge heat dissipation capacity is easily caused when the current temperature regulating system operates; meanwhile, the structure of the current temperature regulating equipment system is relatively fixed and can only be fixedly installed at the designated working positions such as the top and the bottom of the cabinet or the outside of the cabinet, and the operation of the current temperature regulating equipment system is usually carried out on the whole ventilation and cooling operation of the internal environment of the cabinet, so that the installation and use flexibility and the accuracy of the temperature regulating refrigeration operation of the current temperature regulating system are poor, and meanwhile, the cabinet is required to be synchronously stopped when the temperature regulating equipment is in fault or maintained, so that the outstanding contradiction exists between the maintenance of the refrigeration and temperature regulating equipment of the cabinet, and the stability and the continuity of the operation of the cabinet are seriously influenced.
Therefore, in order to solve the problem, a brand new temperature adjusting device and method are urgently needed to be developed so as to meet the requirement of practical use.
Disclosure of Invention
In order to solve the defects in the prior art, the invention provides a combined embedded type cabinet high-weather-resistance temperature regulating system and a temperature regulating method.
A combined embedded type cabinet high-weather-resistance temperature adjusting system comprises at least two bearing columns, heat exchange bases, air exchange fans, drainage fans, a semiconductor refrigerating mechanism, drainage tubes and wiring terminals, wherein the two heat exchange bases are connected with each other through the at least two bearing columns, the front end faces of the two adjacent heat exchange bases form an included angle of 0-90 degrees, the outer side faces of the heat exchange bases are additionally provided with at least one wiring terminal, each heat exchange base comprises a bottom plate, a back plate, a heat dissipation fin plate and a heat exchange plate, the heat exchange plates are of an I-shaped groove-shaped structure in cross section, groove bodies on the rear end faces of the heat exchange plates are coated outside the bottom plate and are coaxially distributed with the bottom plate to form a heat dissipation cavity with a rectangular cavity structure in cross section, the heat dissipation fin plates are embedded in the heat dissipation cavities and are connected with the bottoms of the bottom plates and the heat exchange plate bottoms, the heat dissipation holes are distributed in parallel to each other, and the side walls of the heat exchange plates corresponding to the two adjacent heat dissipation fin plates are arranged, the backplate inlays in the cell body of terminal surface before the heat transfer board, with cell wall sliding connection and with the coaxial distribution of cell body, and the backplate divide into refrigeration chamber and air guide chamber with the cell body of terminal surface before the heat transfer board from the extroversion inwards, air guide chamber and external environment intercommunication and its axis and louvre axis vertical distribution, at least one of semiconductor refrigeration mechanism inlays in the refrigeration intracavity, and its heat dissipation end is connected with the tank bottom of cell body, and its refrigeration end is 0-50 millimeters with the interval between the backplate rear end face, establishes at least one air exchange duct on the backplate, and through intercommunication between air exchange duct between refrigeration chamber and air guide chamber, establishes at least one ventilation fan in addition in the air exchange duct, and the drainage fan is connected with the heat transfer board lateral surface to through the drainage tube intercommunication between the louvre with the heat transfer board lateral surface, in addition ventilation fan, drainage fan, semiconductor refrigeration mechanism all with binding post electrical connection.
Furthermore, the heat dissipation fin plate, the bottom plate and the bottom of the heat exchange plate groove form an included angle of 30-90 degrees, and the distance between every two adjacent heat dissipation fin plates is 1-20 mm.
Furthermore, the back plate is connected with the side wall of the tank body in a sliding way through a sliding groove, the back end surface of the back plate is connected with the bottom of the tank body through at least two bearing springs, the back plate comprises at least two clamping plates, a bearing plate, a guide sliding groove and a swing mechanism, the clamping plates are distributed in parallel and distributed in the same plane parallel to the bottom of the heat exchange plate, two ends of each clamping plate are respectively connected with the bearing plate and vertically distributed, a ventilation air duct for installing a ventilation fan is arranged between every two adjacent clamping plates, the guide sliding groove is embedded in the ventilation air duct and connected with the side surface of the clamping plate corresponding to the ventilation air duct, the guide sliding groove is distributed in parallel with the axis of the clamping plate, at least one sliding block is arranged on the guide sliding groove, the back end surface of the sliding block is connected with the guide sliding groove in a sliding way, the front end surface is hinged with the ventilation fan through the swing mechanism, and 1-5 ventilation fans are arranged in each ventilation air duct, the ventilation fans are connected in parallel, an elastic cushion block is additionally arranged on the side surface of the sliding block and exceeds the side surface of the sliding block by at least 5 mm, the ventilation fans are embedded in the ventilation air duct and are in sliding connection with the clamping plate through the guide sliding grooves, the included angle between the axis of each ventilation fan and the bottom of the heat exchange plate groove is 30-120 degrees, and the swing mechanism is electrically connected with the wiring terminal.
Further, the bottom plate include metal heat transfer board, stereoplasm insulation guide rail, stereoplasm insulation cushion, the metal heat transfer board is the grid plate structure that the rectangle is personally submitted for the cross section, metal heat transfer board up end is connected with the radiating fin, and the terminal surface is connected with two at least stereoplasm insulation guide rails down, terminal surface parallel distribution under stereoplasm insulation guide rail and the metal heat transfer board to symmetric distribution is in metal heat transfer board central line both sides, the central equipartition of stereoplasm insulation cushion encircles metal heat transfer board, and each stereoplasm insulation cushion up end respectively with stereoplasm insulation guide rail sliding connection, terminal surface and metal heat transfer board down between the terminal surface interval be 10-50 millimeters, and stereoplasm insulation cushion axis and the vertical distribution of terminal surface under the metal heat transfer board.
Further, when the heat exchange bases are two or more, the two adjacent heat exchange bases are communicated through a drainage tube, the drainage tube comprises a flexible protective sleeve, a bearing keel, a hard flow guide tube, an electrostatic adsorption net, a temperature sensor, an air flow sensor and a telescopic connecting rod, the hard flow guide tube is a hollow tubular structure with a rectangular axial cross section, the upper end surface and the lower end surface of the hard flow guide tube are connected with at least two telescopic connecting rods, the telescopic connecting rods are uniformly distributed around the axis of the hard flow guide tube and form an included angle of 0-60 degrees with the axis of the hard flow guide tube, the two ends of each telescopic connecting rod are respectively hinged with an elastic hinge and are hinged with the hard flow guide tube and the heat exchange base through the elastic hinge, the flexible protective sleeve is a hollow tubular structure coaxially distributed with the hard flow guide tube and covers the upper end surface, the lower end surface and the upper end surface of the hard flow guide tube, The flexible sheath pipe connected with the lower end surface is outside the flexible sheath pipe and is abutted against the outer surface of the heat exchange base, when the number of the heat exchange bases is two or more, the telescopic connecting rods positioned on the upper end surface and the lower end surface of the hard flow guide pipe are respectively connected with the two adjacent heat exchange bases through elastic hinges, the bearing keel is of a frame structure which is coaxially distributed with the hard flow guide pipe, is embedded in the hard flow guide pipe and is in sliding connection with the inner side surface of the hard flow guide pipe through sliding chutes, at least two sliding chutes are distributed in parallel with the axis of the hard flow guide pipe and are uniformly distributed around the axis of the hard flow guide pipe, the drainage fan is embedded in the upper end surface of the bearing keel and is coaxially distributed with the bearing keel, the electrostatic adsorption net is embedded in the lower end surface of the bearing keel and is coaxially distributed with the bearing keel, the temperature sensor and the air flow sensor are connected with the inner side surface of the bearing keel and positioned between the drainage fan and the electrostatic adsorption net, and the electrostatic adsorption net, the temperature sensor and the air flow sensor are electrically connected with the wiring terminal.
Further, the heat exchange plate lateral surface that the refrigeration chamber corresponds establish axis and louvre axis parallel distribution's spread groove, at least two and symmetric distribution of spread groove are in heat exchange plate axis both sides, and all establish a connection platform in every spread groove to through connecting platform and a bearer post interconnect, and articulated through ratchet in addition between bearer post and the connection platform, its axis is 0-90 contained angle with the heat exchange plate front end, establish at least one in the air guide chamber front end face and lead the air cleaner of air chamber coaxial distribution.
A use method of a combined embedded type cabinet high-weather-resistance temperature regulating system comprises the following steps:
s1, setting the system, firstly assembling the heat exchange base, the ventilation fan, the drainage fan, the semiconductor refrigeration mechanism, the drainage tube and the wiring terminal to obtain a plurality of assembled standby heat exchange bases, then the volume of the cabinet for the cooling operation to be used and the theoretical maximum heating value of the electrical equipment when the equipment in the cabinet runs are counted, and the installation positions of the heat source devices in the cabinet are preliminarily positioned, and according to the distribution positions of the heat source devices, a spare heat exchange base is arranged on the inner side surface of the machine cabinet corresponding to the rear end surface of the heat source equipment, the air guide cavity of the spare heat exchange base is coaxially distributed with the heat source equipment, and finally, all the spare heat exchange bases which are installed are communicated with each other through a bearing column and a guide pipe, connecting terminals of each standby heat exchange base are electrically connected with a power circuit and a control system in the cabinet, so that system presetting is completed;
s2, adjusting the system, and after the step S1 is completed, firstly setting a temperature adjusting system setting standard, wherein the specific standard is not calculated according to the total ventilation volume by taking the ventilation volume per minute as 1/20-1/10 of the cabinet volume; the refrigerating capacity is 0.6-1.5 times of the theoretical maximum heating capacity in every 10 minutes; then, the ventilation volume and the refrigeration volume of each heat exchange base set and installed in the step S1 are calculated, and when the ventilation volume and the refrigeration volume of each heat exchange base installed in the step S1 do not reach the set standard of a set temperature regulation system, a newly-added heat exchange base is arranged between every two adjacent heat exchange bases set in the step S1, the newly-added heat exchange bases are communicated through a bearing column and a drainage pipe, at least one temperature regulation channel distributed along the axis of the cabinet from bottom to top is formed among the communicated heat exchange bases, and the heat exchange base positioned at the uppermost part of the temperature regulation channel is communicated with a heat dissipation air duct at the top of the cabinet through the drainage pipe, so that the system adjustment is completed;
s3, adjusting the temperature, after the step S2 is completed, firstly, the cabinet is operated, the ventilation fan, the drainage fan, the semiconductor refrigeration mechanism and the drainage tube of the heat exchange base arranged at the heat source position in the step S1 are driven to operate, the drainage fan discharges high-temperature gas in the cabinet from the cabinet through the heat dissipation cavity of the heat exchange base and the drainage tube, and meanwhile, when the airflow passes through the heat dissipation cavity, on one hand, the waste heat generated by the operation of the semiconductor refrigeration mechanism is cooled through the flowing airflow; on the other hand, when the airflow passes through the drainage tube, the electrostatic adsorption net in the drainage tube is used for adsorbing and purifying dust in the airflow, and simultaneously, the temperature sensor and the air flow sensor are used for synchronously monitoring the air exchange amount and the refrigerating capacity; then, the control system of the cabinet counts the ventilation volume and the refrigerating volume during the current temperature regulation operation, and respectively adjusts the operation state of each heat exchange base according to the currently detected ventilation volume and refrigerating volume, thereby achieving the purpose of comprehensive temperature regulation operation;
s4, performing system maintenance, wherein in the operation of the step S3, when partial heat exchange bases need to be stopped for maintenance, the electrical connection between the heat exchange bases needing to be replaced and maintained and the cabinet circuit system is disconnected through the wiring terminals, and then the normal heat exchange bases are replaced by the heat exchange bases disconnected with the electrical connection through the shell on one hand, so that equipment replacement can be completed; on the other hand, after the heat exchange base is detached from the cabinet, the position of the detached heat exchange base is temporarily replaced by the guide pipe, so that the temperature adjusting channel is ensured to be smooth, and the heat exchange base is reset after maintenance of a fault heat exchange base is completed.
On one hand, the heat exchange bases with the number and the distribution positions capable of being adjusted flexibly and the ventilation fans, the drainage fans and the semiconductor refrigerating mechanisms which are positioned in the heat exchange bases are arranged to synchronously meet the requirements of cooling the interior of the cabinet in a ventilation environment and cooling in a forced refrigeration mode, and the forced ventilation cooling agent and the forced refrigeration cooling can run independently, so that the flexibility of the cabinet temperature adjustment operation is greatly improved; on the other hand is in operation, can set up the refrigeration source operating position that adjusts the temperature through a plurality of heat transfer bases that set up in a flexible way, can effectually improve the interior heat dissipation ventilation total amount of rack simultaneously in addition to reach the needs that nimble adjustment temperature regulation efficiency was in order to satisfy different rack structures and the operation that adjusts the temperature, very big improvement and improved rack temperature regulating system's commonality and operation flexibility.
Drawings
The invention is described in detail below with reference to the drawings and the detailed description;
FIG. 1 is a schematic diagram of the system of the present invention;
FIG. 2 is a schematic view of a heat exchange base;
FIG. 3 is a schematic view of a back plate structure;
FIG. 4 is a schematic flow chart of the method of the present invention.
Detailed Description
In order to facilitate the implementation of the technical means, creation features, achievement of the purpose and the efficacy of the invention, the invention is further described below with reference to specific embodiments.
As shown in fig. 1-3, a combined embedded type cabinet high weather resistance temperature regulating system comprises bearing columns 1, heat exchange bases 2, ventilating fans 3, drainage fans 4, a semiconductor refrigerating mechanism 5, drainage tubes 6 and connecting terminals 7, wherein the heat exchange bases 2 are at least two, the two heat exchange bases 2 are connected with each other through the at least two bearing columns 1, the front end faces of the two adjacent heat exchange bases 2 form an included angle of 0-90 degrees, and the outer side faces of the heat exchange bases 2 are additionally provided with at least one connecting terminal 7.
In this embodiment, the heat exchange base 21 includes a bottom plate 21, a back plate 22, a heat dissipation fin 23, and a heat exchange plate 24, the heat exchange plate 24 has an i-shaped groove-shaped cross section, the groove body on the rear end surface of the heat dissipation plate is coated outside the bottom plate 21, is coaxially distributed with the bottom plate 21 and forms a heat dissipation cavity 101 with a rectangular cavity structure on the cross section, the heat dissipation fin plate 23 is embedded in the heat dissipation cavity 101, connected with the bottom of the bottom plate 21 and the heat exchange plate 24, all the heat dissipation fin plates 23 are distributed in parallel, and the side wall of the heat exchange plate 24 corresponding to the heat exchange plate corresponding to the adjacent two heat dissipation fins 23 is provided with a heat dissipation hole 25, the back plate 22 is embedded in the groove body of the front end surface of the heat exchange plate 24, the heat exchange plate is connected with the groove wall in a sliding mode and distributed coaxially with the groove body, the groove body on the front end face of the heat exchange plate 24 is divided into a refrigeration cavity 102 and an air guide cavity 103 by the back plate 22 from outside to inside, the air guide cavity 103 is communicated with the external environment, and the axis of the air guide cavity is perpendicular to the axis of the heat dissipation hole 25.
In this embodiment, at least one of the semiconductor refrigeration mechanisms 5 is embedded in the refrigeration cavity 102, and the heat dissipation end thereof is connected with the bottom of the groove body, the distance between the refrigeration end thereof and the rear end face of the back plate 22 is 0-50 mm, at least one ventilation air duct 26 is arranged on the back plate 22, the refrigeration cavity 102 and the air guide cavity 103 are communicated through the ventilation air duct 26, at least one ventilation fan 3 is additionally arranged in the ventilation air duct 26, the drainage fan 4 is connected with the outer side face of the heat exchange plate 24 and communicated with the heat dissipation hole 25 on the outer side face of the heat exchange plate 24 through the drainage tube 6, and in addition, the ventilation fan 3, the drainage fan 4 and the semiconductor refrigeration mechanism 5 are electrically connected with the wiring terminal 7.
In this embodiment, the heat dissipation fins 23 form an included angle of 30 to 90 degrees with the bottom plate 21 and the bottom of the heat exchange plate 24, and the distance between two adjacent heat dissipation fins 23 is 1 to 20 mm.
It is emphasized that the back plate 22 is slidably connected with the sidewall of the tank body through a sliding chute 8, the back end surface of the back plate 22 is connected with the bottom of the tank body through at least two bearing springs 9, the back plate 22 comprises at least two clamping plates 221, a bearing plate 222, a guide sliding chute 223 and a swing mechanism 224, at least two clamping plates 21 are arranged, the clamping plates 221 are distributed in parallel and distributed in the same plane distributed in parallel with the bottom of the heat exchange plate 224, two ends of each clamping plate 221 are respectively connected with the bearing plate 222 and distributed vertically, a ventilation air duct 26 for installing a ventilation fan is arranged between two adjacent clamping plates 221, the guide sliding chute 223 is embedded in the ventilation air duct 26 and is connected with the side surface of the clamping plate 221 corresponding to the ventilation air duct 26, the guide sliding chute 223 is distributed in parallel with the axis of the clamping plates 221, at least one sliding block 225 is arranged on the guide sliding chute 223, the back end surface of the sliding block 225 is slidably connected with the guide sliding chute 223, the front end face is hinged to the ventilating fan 3 through the swing mechanism 224, 1-5 ventilating fans 3 are arranged in each ventilating air duct 26, the ventilating fans 3 are connected in parallel, the elastic cushion block 226 is additionally arranged on the side surface of the sliding block 225, the elastic cushion block 226 exceeds the side surface of the sliding block 225 by at least 5 mm, the ventilating fan 3 is embedded in the ventilating air duct 26 and is connected with the clamping plate 221 in a sliding mode through the guide sliding groove 223, the included angle of 30-120 degrees is formed between the axis of the ventilating fan 3 and the bottom of the heat exchange plate 24 groove, and the swing mechanism 224 is electrically connected with the wiring terminal 7.
Simultaneously, bottom plate 21 include metal heat transfer board 211, stereoplasm insulation guide rail 212, stereoplasm insulating cushion 213, metal heat transfer board 211 is the grid plate structure that the rectangle is personally submitted for the cross section, metal heat transfer board 211 up end is connected with radiating fin 23, and the terminal surface is connected with two at least stereoplasm insulation guide rails 212 down, terminal surface parallel distribution under stereoplasm insulation guide rail 212 and the metal heat transfer board 211 to the symmetric distribution is in metal heat transfer board 211 central line both sides, stereoplasm insulating cushion 213 is four at least, encircles metal heat transfer board 211 center equipartition, and each stereoplasm insulating cushion 213 up end respectively with stereoplasm insulation guide rail 212 sliding connection, terminal surface interval is 10-50 millimeters under terminal surface and the metal heat transfer board 211, and stereoplasm insulating cushion 212 axis and the terminal surface vertical distribution under metal heat transfer board 211.
It should be noted that, when two or more heat exchange bases 2 are provided, two or more adjacent heat exchange bases 2 are communicated with each other through a drainage tube 6, the drainage tube 6 includes a flexible sheath tube 61, a bearing keel 62, a hard flow guide tube 63, an electrostatic adsorption net 64, a temperature sensor 65, an air flow sensor 66 and a telescopic connecting rod 67, the hard flow guide tube 63 is a hollow tubular structure with a rectangular axial cross section, the upper end surface and the lower end surface of the hard flow guide tube 63 are connected with at least two telescopic connecting rods 67, the telescopic connecting rods 67 are uniformly distributed around the axis of the hard flow guide tube 63 and form an included angle of 0-60 degrees with the axis of the hard flow guide tube 63, two ends of each telescopic connecting rod 67 are hinged with an elastic hinge 68 and hinged with the hard flow guide tube 63 and the heat exchange bases 2 through the elastic hinges 68, the flexible sheath tube 61 is a hollow tubular structure coaxially distributed with the hard flow guide tube 63, the flexible sheath pipes 61 are covered outside the upper end surface and the lower end surface of the hard guide pipe 63 and connected with the upper end surface and the lower end surface of the hard guide pipe 63 and are abutted against the outer surface of the heat exchange base 2, when two or more heat exchange bases 2 are provided, the telescopic connecting rods 67 positioned on the upper end surface and the lower end surface of the hard guide pipe 63 are respectively connected with two adjacent heat exchange bases 2 through elastic hinges 68, the bearing keels 62 are frame structures coaxially distributed with the hard guide pipe 63 and are embedded in the hard guide pipe 63 and are in sliding connection with the inner side surface of the hard guide pipe 63 through sliding chutes 8, at least two sliding chutes 8 are distributed in parallel with the axis of the hard guide pipe 63 and are uniformly distributed around the axis of the hard guide pipe 63, the drainage fans 4 are embedded in the upper end surface of the bearing keels 62 and are coaxially distributed with the bearing keels 62, and the electrostatic adsorption nets 64 are embedded in the lower end surface of the bearing keels 62 and are coaxially distributed with the bearing keels 62, the temperature sensor 65 and the air flow sensor 66 are connected with the inner side surface of the bearing keel 62 and positioned between the drainage fan 4 and the electrostatic adsorption net 64, the temperature sensor 65 and the air flow sensor 66 are all electrically connected with the wiring terminal 7.
Further preferably, the outer side surface of the heat exchange plate 24 corresponding to the refrigeration cavity 102 is provided with connecting grooves 27 with axes parallel to the axes of the heat dissipation holes 25, at least two of the connecting grooves 27 are symmetrically distributed on two sides of the axes of the heat exchange plate 24, each connecting groove 27 is internally provided with a connecting table 28 and is connected with one bearing column 1 through the connecting table 28, the bearing column 1 is hinged with the connecting table 28 through a ratchet mechanism, the axes of the bearing columns are at an included angle of 0-90 degrees with the front end surface of the heat exchange plate 24, and the front end surface of the air guide cavity 103 is internally provided with at least one air filter 29 coaxially distributed with the air guide cavity 103.
As shown in fig. 4, a method for using a high weather resistance temperature regulating system of a combined embedded cabinet includes the following steps:
s1, setting the system, firstly assembling the heat exchange base, the ventilation fan, the drainage fan, the semiconductor refrigeration mechanism, the drainage tube and the wiring terminal to obtain a plurality of assembled standby heat exchange bases, then the volume of the cabinet for the cooling operation to be used and the theoretical maximum heating value of the electrical equipment when the equipment in the cabinet runs are counted, and the installation positions of the heat source devices in the cabinet are preliminarily positioned, and according to the distribution positions of the heat source devices, a spare heat exchange base is arranged on the inner side surface of the machine cabinet corresponding to the rear end surface of the heat source equipment, the air guide cavity of the spare heat exchange base is coaxially distributed with the heat source equipment, and finally, all the spare heat exchange bases which are installed are communicated with each other through a bearing column and a guide pipe, connecting terminals of each standby heat exchange base are electrically connected with a power circuit and a control system in the cabinet, so that system presetting is completed;
s2, adjusting the system, and after the step S1 is completed, firstly setting a temperature adjusting system setting standard, wherein the specific standard is not calculated according to the total ventilation volume by taking the ventilation volume per minute as 1/20-1/10 of the cabinet volume; the refrigerating capacity is 0.6-1.5 times of the theoretical maximum heating capacity in every 10 minutes; then, the ventilation volume and the refrigeration volume of each heat exchange base set and installed in the step S1 are calculated, and when the ventilation volume and the refrigeration volume of each heat exchange base installed in the step S1 do not reach the set standard of a set temperature regulation system, a newly-added heat exchange base is arranged between every two adjacent heat exchange bases set in the step S1, the newly-added heat exchange bases are communicated through a bearing column and a drainage pipe, at least one temperature regulation channel distributed along the axis of the cabinet from bottom to top is formed among the communicated heat exchange bases, and the heat exchange base positioned at the uppermost part of the temperature regulation channel is communicated with a heat dissipation air duct at the top of the cabinet through the drainage pipe, so that the system adjustment is completed;
s3, adjusting the temperature, after the step S2 is completed, firstly, the cabinet is operated, the ventilation fan, the drainage fan, the semiconductor refrigeration mechanism and the drainage tube of the heat exchange base arranged at the heat source position in the step S1 are driven to operate, the drainage fan discharges high-temperature gas in the cabinet from the cabinet through the heat dissipation cavity of the heat exchange base and the drainage tube, and meanwhile, when the airflow passes through the heat dissipation cavity, on one hand, the waste heat generated by the operation of the semiconductor refrigeration mechanism is cooled through the flowing airflow; on the other hand, when the airflow passes through the drainage tube, the electrostatic adsorption net in the drainage tube is used for adsorbing and purifying dust in the airflow, and simultaneously, the temperature sensor and the air flow sensor are used for synchronously monitoring the air exchange amount and the refrigerating capacity; then, the control system of the cabinet counts the ventilation volume and the refrigerating volume during the current temperature regulation operation, and respectively adjusts the operation state of each heat exchange base according to the currently detected ventilation volume and refrigerating volume, thereby achieving the purpose of comprehensive temperature regulation operation;
s4, performing system maintenance, wherein in the operation of the step S3, when partial heat exchange bases need to be stopped for maintenance, the electrical connection between the heat exchange bases needing to be replaced and maintained and the cabinet circuit system is disconnected through the wiring terminals, and then the normal heat exchange bases are replaced by the heat exchange bases disconnected with the electrical connection through the shell on one hand, so that equipment replacement can be completed; on the other hand, after the heat exchange base is detached from the cabinet, the position of the detached heat exchange base is temporarily replaced by the guide pipe, so that the temperature adjusting channel is ensured to be smooth, and the heat exchange base is reset after maintenance of a fault heat exchange base is completed.
On one hand, the heat exchange bases with the number and the distribution positions capable of being adjusted flexibly and the ventilation fans, the drainage fans and the semiconductor refrigerating mechanisms which are positioned in the heat exchange bases are arranged to synchronously meet the requirements of cooling the interior of the cabinet in a ventilation environment and cooling in a forced refrigeration mode, and the forced ventilation cooling agent and the forced refrigeration cooling can run independently, so that the flexibility of the cabinet temperature adjustment operation is greatly improved; on the other hand is in operation, can set up the refrigeration source operating position that adjusts the temperature through a plurality of heat transfer bases that set up in a flexible way, can effectually improve the interior heat dissipation ventilation total amount of rack simultaneously in addition to reach the needs that nimble adjustment temperature regulation efficiency was in order to satisfy different rack structures and the operation that adjusts the temperature, very big improvement and improved rack temperature regulating system's commonality and operation flexibility.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (7)

1. The utility model provides a high weatherability temperature regulating system of embedded rack of combination which characterized in that: the combined embedded type cabinet high-weather-resistance temperature regulating system comprises at least two bearing columns, heat exchange bases, ventilating fans, drainage fans, a semiconductor refrigerating mechanism, drainage tubes and wiring terminals, wherein the two heat exchange bases are connected with each other through the at least two bearing columns, an included angle of 0-90 degrees is formed between the front end faces of the two adjacent heat exchange bases, the outer side faces of the heat exchange bases are additionally provided with at least one wiring terminal, each heat exchange base comprises a bottom plate, a back plate, heat dissipation fins and a heat exchange plate, the heat exchange plates are of an I-shaped structure in cross section, groove-shaped grooves on the rear end faces of the heat exchange plates are coated outside the bottom plate, the heat dissipation fins are coaxially distributed with the bottom plate and form a heat dissipation cavity with a rectangular cavity structure in cross section, the heat dissipation fins are embedded in the heat dissipation cavity and connected with the bottoms of the bottom plates and the heat dissipation holes, the heat dissipation fins are distributed in parallel with each other, and the side walls of the heat exchange plates corresponding to the two adjacent heat dissipation fins are provided with heat exchange plates, the back plate is embedded in the groove body on the front end surface of the heat exchange plate, is connected with the groove wall in a sliding way and is distributed coaxially with the groove body, the groove body on the front end surface of the heat exchange plate is divided into a refrigeration cavity and an air guide cavity by the back plate from outside to inside, wherein the air guide cavity is communicated with the external environment, the axis of the air guide cavity is vertically distributed with the axis of the heat dissipation hole, at least one semiconductor refrigeration mechanism is embedded in the refrigeration cavity, and the heat dissipation end of the semiconductor refrigeration mechanism is connected with the bottom of the groove body, the distance between the refrigerating end and the back end face of the back plate is 0-50 mm, the back plate is provided with at least one ventilation air duct, the refrigeration cavity and the air guide cavity are communicated through an air exchange air channel, at least one air exchange fan is additionally arranged in the air exchange air channel, the drainage fan is connected with the outer side surface of the heat exchange plate, and is communicated with the heat dissipation holes on the outer side surface of the heat exchange plate through a drainage tube, and in addition, the ventilation fan, the drainage fan and the semiconductor refrigeration mechanism are all electrically connected with the wiring terminal.
2. The high-weather-resistance temperature regulating system for the combined embedded cabinet as claimed in claim 1, wherein: the heat dissipation fin plate, the bottom plate and the bottom of the heat exchange plate groove form an included angle of 30-90 degrees, and the distance between every two adjacent heat dissipation fin plates is 1-20 mm.
3. The high-weather-resistance temperature regulating system for the combined embedded cabinet as claimed in claim 1, wherein: the back plate is connected with the side wall of the groove body in a sliding mode through a sliding groove, the back plate rear end face is connected with the groove bottom of the groove body through at least two bearing springs, the back plate comprises at least two clamping plates, a bearing plate, a guide sliding groove and a swing mechanism, the clamping plates are distributed in parallel and distributed in the same plane parallel to the groove bottom of the heat exchange plate, two ends of each clamping plate are connected with the bearing plate respectively and distributed vertically, a ventilation air duct used for installing a ventilation fan is arranged between every two adjacent clamping plates, the guide sliding groove is embedded in the ventilation air duct and connected with the side surface of each clamping plate corresponding to the ventilation air duct, the guide sliding groove is distributed in parallel with the axis of each clamping plate, at least one sliding block is arranged on the guide sliding groove, the rear end face of each sliding block is connected with the guide sliding groove in a sliding mode, the front end face is hinged with the ventilation fan through the swing mechanism, and 1-5 ventilation fans are arranged in each ventilation air duct, the ventilation fans are connected in parallel, an elastic cushion block is additionally arranged on the side surface of the sliding block and exceeds the side surface of the sliding block by at least 5 mm, the ventilation fans are embedded in the ventilation air duct and are in sliding connection with the clamping plate through the guide sliding grooves, the included angle between the axis of each ventilation fan and the bottom of the heat exchange plate groove is 30-120 degrees, and the swing mechanism is electrically connected with the wiring terminal.
4. The high-weather-resistance temperature regulating system for the combined embedded cabinet as claimed in claim 1, wherein: the bottom plate include metal heat transfer board, stereoplasm insulation guide rail, stereoplasm insulation cushion, the grid plate structure of rectangle is personally submitted for the cross section to the metal heat transfer board, the metal heat transfer board up end is connected with the heat dissipation fin, and the terminal surface is connected with two at least stereoplasm insulation guide rails down, terminal surface parallel distribution under stereoplasm insulation guide rail and the metal heat transfer board to symmetric distribution is in metal heat transfer board central line both sides, the stereoplasm insulation cushion is four at least, encircles metal heat transfer board center equipartition, and each stereoplasm insulation cushion up end respectively with stereoplasm insulation guide rail sliding connection, terminal surface and metal heat transfer board under the interval be 10-50 millimeters between the terminal surface, and the terminal surface vertical distribution under stereoplasm insulation cushion axis and the metal heat transfer board.
5. The high-weather-resistance temperature regulating system for the combined embedded cabinet as claimed in claim 1, wherein: when heat transfer base be two and more than two, through the drainage tube intercommunication between two adjacent heat transfer bases, the drainage tube includes flexible protecting pipe, bears fossil fragments, stereoplasm honeycomb duct, electrostatic absorption net, temperature sensor, air flow sensor, telescopic link, the stereoplasm honeycomb duct is the hollow tubular structure of rectangle for axial cross-section, stereoplasm honeycomb duct up end and terminal surface all with at least two telescopic link interconnect down, telescopic link encircles stereoplasm honeycomb duct axis equipartition and is 0-60 contained angle with stereoplasm honeycomb duct axis, telescopic link both ends are articulated with an elastic hinge respectively to articulate through elastic hinge with stereoplasm honeycomb duct and heat transfer base, flexible protecting pipe is the hollow tubular structure with stereoplasm honeycomb duct coaxial distribution, the cladding is at stereoplasm honeycomb duct up end, terminal surface down and stereoplasm honeycomb duct up end, the cladding, The flexible sheath pipe connected with the lower end surface is outside the flexible sheath pipe and is abutted against the outer surface of the heat exchange base, when the number of the heat exchange bases is two or more, the telescopic connecting rods positioned on the upper end surface and the lower end surface of the hard flow guide pipe are respectively connected with the two adjacent heat exchange bases through elastic hinges, the bearing keel is of a frame structure which is coaxially distributed with the hard flow guide pipe, is embedded in the hard flow guide pipe and is in sliding connection with the inner side surface of the hard flow guide pipe through sliding chutes, at least two sliding chutes are distributed in parallel with the axis of the hard flow guide pipe and are uniformly distributed around the axis of the hard flow guide pipe, the drainage fan is embedded in the upper end surface of the bearing keel and is coaxially distributed with the bearing keel, the electrostatic adsorption net is embedded in the lower end surface of the bearing keel and is coaxially distributed with the bearing keel, the temperature sensor and the air flow sensor are connected with the inner side surface of the bearing keel and positioned between the drainage fan and the electrostatic adsorption net, and the electrostatic adsorption net, the temperature sensor and the air flow sensor are electrically connected with the wiring terminal.
6. The high-weather-resistance temperature regulating system for the combined embedded cabinet as claimed in claim 1, wherein: the heat exchange plate lateral surface that the refrigeration chamber corresponds establish axis and louvre axis parallel distribution's spread groove, two at least and symmetric distributions of spread groove are in heat exchange plate axis both sides, and all establish a connection platform in every spread groove to through connecting platform and a bearing post interconnect, and bearing post and connection platform are articulated through ratchet in addition, and its axis is 0-90 contained angle with the heat exchange plate front end, establish at least one in the preceding terminal surface of air guide chamber and air guide chamber coaxial distribution's air cleaner.
7. The use method of the combined embedded type cabinet high-weather-resistance temperature regulating system is characterized by comprising the following steps of:
s1, setting the system, firstly assembling the heat exchange base, the ventilation fan, the drainage fan, the semiconductor refrigeration mechanism, the drainage tube and the wiring terminal to obtain a plurality of assembled standby heat exchange bases, then the volume of the cabinet for the cooling operation to be used and the theoretical maximum heating value of the electrical equipment when the equipment in the cabinet runs are counted, and the installation positions of the heat source devices in the cabinet are preliminarily positioned, and according to the distribution positions of the heat source devices, a spare heat exchange base is arranged on the inner side surface of the machine cabinet corresponding to the rear end surface of the heat source equipment, the air guide cavity of the spare heat exchange base is coaxially distributed with the heat source equipment, and finally, all the spare heat exchange bases which are installed are communicated with each other through a bearing column and a guide pipe, connecting terminals of each standby heat exchange base are electrically connected with a power circuit and a control system in the cabinet, so that system presetting is completed;
s2, adjusting the system, and after the step S1 is completed, firstly setting a temperature adjusting system setting standard, wherein the specific standard is not calculated according to the total ventilation volume by taking the ventilation volume per minute as 1/20-1/10 of the cabinet volume; the refrigerating capacity is 0.6-1.5 times of the theoretical maximum heating capacity in every 10 minutes; then, the ventilation volume and the refrigeration volume of each heat exchange base set and installed in the step S1 are calculated, and when the ventilation volume and the refrigeration volume of each heat exchange base installed in the step S1 do not reach the set standard of a set temperature regulation system, a newly-added heat exchange base is arranged between every two adjacent heat exchange bases set in the step S1, the newly-added heat exchange bases are communicated through a bearing column and a drainage pipe, at least one temperature regulation channel distributed along the axis of the cabinet from bottom to top is formed among the communicated heat exchange bases, and the heat exchange base positioned at the uppermost part of the temperature regulation channel is communicated with a heat dissipation air duct at the top of the cabinet through the drainage pipe, so that the system adjustment is completed;
s3, adjusting the temperature, after the step S2 is completed, firstly, the cabinet is operated, the ventilation fan, the drainage fan, the semiconductor refrigeration mechanism and the drainage tube of the heat exchange base arranged at the heat source position in the step S1 are driven to operate, the drainage fan discharges high-temperature gas in the cabinet from the cabinet through the heat dissipation cavity of the heat exchange base and the drainage tube, and meanwhile, when the airflow passes through the heat dissipation cavity, on one hand, the waste heat generated by the operation of the semiconductor refrigeration mechanism is cooled through the flowing airflow; on the other hand, when the airflow passes through the drainage tube, the electrostatic adsorption net in the drainage tube is used for adsorbing and purifying dust in the airflow, and simultaneously, the temperature sensor and the air flow sensor are used for synchronously monitoring the air exchange amount and the refrigerating capacity; then, the control system of the cabinet counts the ventilation volume and the refrigerating volume during the current temperature regulation operation, and respectively adjusts the operation state of each heat exchange base according to the currently detected ventilation volume and refrigerating volume, thereby achieving the purpose of comprehensive temperature regulation operation;
s4, performing system maintenance, wherein in the operation of the step S3, when partial heat exchange bases need to be stopped for maintenance, the electrical connection between the heat exchange bases needing to be replaced and maintained and the cabinet circuit system is disconnected through the wiring terminals, and then the normal heat exchange bases are replaced by the heat exchange bases disconnected with the electrical connection through the shell on one hand, so that equipment replacement can be completed; on the other hand, after the heat exchange base is detached from the cabinet, the position of the detached heat exchange base is temporarily replaced by the guide pipe, so that the temperature adjusting channel is ensured to be smooth, and the heat exchange base is reset after maintenance of a fault heat exchange base is completed.
CN202111191312.1A 2021-10-13 2021-10-13 High-weather-resistance temperature regulating system and method for combined embedded cabinet Pending CN113966145A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111191312.1A CN113966145A (en) 2021-10-13 2021-10-13 High-weather-resistance temperature regulating system and method for combined embedded cabinet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111191312.1A CN113966145A (en) 2021-10-13 2021-10-13 High-weather-resistance temperature regulating system and method for combined embedded cabinet

Publications (1)

Publication Number Publication Date
CN113966145A true CN113966145A (en) 2022-01-21

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Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
CN (1) CN113966145A (en)

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