CN113965184A

CN113965184A - Crystal oscillator packaging structure

Info

Publication number: CN113965184A
Application number: CN202111135274.8A
Authority: CN
Inventors: 彭子修; 郑莉慧; 罗韋晨; 林宗德
Original assignee: TXC Corp
Current assignee: TXC Corp
Priority date: 2021-08-24
Filing date: 2021-09-27
Publication date: 2022-01-21
Also published as: TW202310561A; TWI765811B; JP2023031190A; JP7212742B1

Abstract

The invention discloses a crystal oscillator packaging structure which comprises a packaging base, a resonant crystal wafer and a top cover. The top of the packaging base is provided with a groove, and the side wall of the packaging base surrounds the groove. The resonant crystal wafer comprises a frame area, a U-shaped connecting area, a resonant area and a first connecting arm. The U-shaped connecting area is connected between the edge of the resonance area and the frame area, the notch of the U-shaped connecting area and two inner side walls which are perpendicular to each other face the resonance area, the first connecting arm is connected between the U-shaped connecting area and the frame area, and the frame area is arranged on the side wall of the packaging base. The top cover is arranged on the frame area to shield the groove, the U-shaped connecting area, the resonance area and the first connecting arm. The invention forms a U-shaped connecting area between the frame area and the resonance area to prevent external mechanical vibration or instant impact from being transmitted to the resonance crystal wafer and stabilize the resonance frequency.

Description

Crystal oscillator packaging structure

Technical Field

The present invention relates to a package structure, and more particularly, to a crystal oscillator package structure.

Background

The quartz element has stable piezoelectric characteristics, can provide accurate and wide reference frequency, clock pulse control, timing function, noise filtering function and the like, and can be used as a sensor for vibration, pressure and the like and an important optical element; therefore, quartz elements play a significant role in electronic products.

Fig. 1 is a schematic view of a prior art quartz vibrator. Referring to fig. 1, a quartz vibrator 1 is constituted by a quartz vibrator element 10 and a first case 11 and a second case 12 as covering the quartz vibrator element 10. The quartz vibrator element 10 is composed of a quartz substrate. The quartz resonator element 10 has

excitation electrodes

13 and 14 formed on the upper and lower surfaces thereof, and the quartz resonator element 10 has a main vibrating portion and a support portion surrounding the main vibrating portion. The first case 11 and the second case 12 are made of, for example, general glass such as blue plate glass (blue plate glass). The first housing 11 and the second housing 12 have peripherally formed protrusions at their peripheries, respectively. The first case 11 and the second case 12 are bonded to the supporting portion at the protruding portions so as to sandwich the quartz vibrator element 10 therebetween. Since the supporting portion occupies a high area ratio of the quartz vibrator element 10, external mechanical shock or instantaneous impact is transmitted to the main vibrating portion, resulting in unstable vibration frequency of the quartz vibrator 1.

Therefore, the present invention provides a crystal oscillator package structure to solve the above-mentioned problems in the prior art.

Disclosure of Invention

The invention provides a crystal oscillator packaging structure which prevents external mechanical vibration or instant impact from being transmitted to a resonant crystal wafer and stabilizes resonant frequency.

In an embodiment of the invention, a crystal oscillator package structure is provided, which includes a package base, a resonator chip and a top cover. The top of the packaging base is provided with a groove, and the side wall of the packaging base surrounds the groove. The resonant crystal wafer comprises a frame region, at least one U-shaped connecting region, a resonant region and at least one first connecting arm. The U-shaped connecting area is connected between the edge of the resonance area and the frame area, a notch (notch) of the U-shaped connecting area and two inner side walls which are perpendicular to each other face the resonance area, the first connecting arm is connected between the U-shaped connecting area and the frame area, and the frame area is arranged on the side wall of the packaging base. The top cover is arranged on the frame area to shield the groove, the U-shaped connecting area, the resonance area and the first connecting arm.

In an embodiment of the invention, the crystal oscillator package structure further includes a first electrode layer, a second electrode layer, a first sealing ring, a second sealing ring, and a plurality of conductive pads. The first electrode layer is arranged on the first connecting arm, the U-shaped connecting area and the bottom surface of the resonance area, and the first electrode layer is electrically connected with the resonance area. The second electrode layer is arranged on the top surfaces of the first connecting arm, the U-shaped connecting area and the resonance area and is electrically connected with the resonance area. The first sealing ring is arranged between the side wall of the packaging base and the frame area, the second sealing ring is arranged between the frame area and the top cover, and all the conductive connecting pads are arranged on the bottom surface of the packaging base.

In one embodiment of the present invention, the U-shaped connecting section includes a second connecting arm, a third connecting arm and a fourth connecting arm. The second connecting arm has a first end and a second end, and the first end of the second connecting arm is connected with the edge of the resonance area. The third connecting arm is provided with a third end and a fourth end, the third end of the third connecting arm is connected with the second end of the second connecting arm, and the third connecting arm is vertically connected with the second connecting arm. The fourth connecting arm is provided with a fifth end and a sixth end, the fifth end of the fourth connecting arm is connected with the fourth end of the third connecting arm, the sixth end of the fourth connecting arm is connected with the first connecting arm, and the fourth connecting arm is vertically connected with the third connecting arm and the first connecting arm. The notch is located between the second connecting arm and the fourth connecting arm, the third connecting arm and the fourth connecting arm are provided with inner side walls facing the resonance area, the fourth connecting arm is overlapped with the resonance area in an area, the area is located between a first straight line and a second straight line, the first straight line is parallel to the second straight line, the first straight line is overlapped with the edge of the resonance area, and the second straight line is overlapped with the side edge of the first connecting arm far away from the fourth connecting arm.

In an embodiment of the invention, the resonance region is rectangular, the fourth link is parallel to a long side of the rectangle, the first straight line overlaps a short side of the rectangle near the third link, a shortest distance between the first straight line and the second straight line is D1, a length of the long side is L, D1 is L × C1, and 0< C1< 1.

In an embodiment of the invention, the resonance area is rectangular, the fourth link is parallel to a short side of the rectangle, the first straight line overlaps a long side of the rectangle near the third link, a shortest distance between the first straight line and the second straight line is D2, a length of the short side is W, D2 is W × C2, 0< C2< 1.

In an embodiment of the present invention, the resonance region is an ellipse, the fourth link is parallel to a long axis of the ellipse, the first straight line overlaps a position of the ellipse closest to the third link, a shortest distance between the first straight line and the second straight line is D1, a length of the long axis is L, D1 is L × C1, and 0< C1< 1.

In an embodiment of the present invention, the resonant region is an ellipse, the fourth link is parallel to a short axis of the ellipse, the first straight line overlaps a position of the ellipse closest to the third link, a shortest distance between the first straight line and the second straight line is D2, a length of the short axis is W, D2 is W × C2, and 0< C2< 1.

In an embodiment of the invention, the resonance area is a circle, the fourth connecting arm is parallel to the diameter of the circle, the first straight line overlaps the position of the circle closest to the third connecting arm, the shortest distance between the first straight line and the second straight line is D, the length of the diameter is R, D is R × C, and 0< C < 1.

In an embodiment of the invention, the at least one U-shaped connection region includes two U-shaped connection regions, the at least one first connection arm includes two first connection arms, the two first connection arms are respectively connected with the two U-shaped connection regions, and the two U-shaped connection regions are symmetrically arranged with the resonance region as a center.

In an embodiment of the present invention, the frame region, the first connecting arm, the U-shaped connecting region and the resonance region are integrally formed.

Based on the above, the crystal oscillator packaging structure forms the U-shaped connection area between the frame area and the resonance area, and the notch of the U-shaped connection area and the two inner side walls perpendicular to each other face the resonance area, so as to prevent external mechanical vibration or instant impact from being transmitted to the resonance area and stabilize the resonance frequency.

Drawings

Fig. 1 is a schematic view of a prior art quartz vibrator.

Fig. 2 is an exploded view of an embodiment of a crystal oscillator package structure of the present invention.

Fig. 3 is a cross-sectional view of a crystal oscillator package structure according to an embodiment of the present invention.

Fig. 4 to 10 are structural top views of various embodiments of the resonant crystal slab of the present invention.

Description of reference numerals: 1-quartz vibrator; 10-quartz vibrator element; 11-a first housing; 12-a second housing; 13-an excitation electrode; 14-an excitation electrode; 2-crystal oscillator packaging structure; 20-a package base; 200-grooves; 21-resonant crystal piece; 210-a border region; 211-U shaped connection region; 2111-second connecting arm; 2112-third connecting arm; 2113-fourth connecting arm; 212-a resonance region; 213-first connecting arm; 22-a top cover; 23-a first electrode layer; 24-a second electrode layer; 25-a first sealing ring; 26-a second sealing ring; 27-conductive pads.

Detailed Description

Embodiments of the invention will be further illustrated by the following description in conjunction with the related drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts. In the drawings, the shape and thickness may be exaggerated for simplicity and convenience. It is to be understood that elements not specifically shown in the drawings or described in the specification are of a type well known to those of ordinary skill in the art. Many variations and modifications may be made by one of ordinary skill in the art in light of the teachings of the present invention.

When an element is referred to as being "on …," it can be broadly interpreted as referring to the fact that the element is directly on the other element or that the other element is present in both. In contrast, when an element is referred to as being "directly on" another element, it is not intended that the other element be present between the two elements. As used herein, the word "and/or" includes any combination of one or more of the associated listed items.

Reference will now be made in detail to "one embodiment" or "an embodiment" of the present invention, which refers to a particular element, structure, or characteristic described in connection with at least one embodiment. Thus, the appearances of the phrase "one embodiment" or "an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

The present invention is described with respect to the following examples, which are intended to be illustrative only, since various modifications and changes may be made therein by those skilled in the art without departing from the spirit and scope of the present invention, the scope of which is defined by the appended claims. Throughout the specification and claims, unless the context clearly dictates otherwise, the words "a" and "an" include the word "a" and "the" including such elements or components. In addition, as used herein, the singular articles "a", "an" and "the" include plural referents unless the context clearly dictates otherwise. Also, as used in this description and throughout the claims, the meaning of "in" may include "in" and "on" unless the content clearly dictates otherwise. The term (terms) used throughout the specification and claims has the ordinary meaning as commonly understood in the art, in the context of this invention, and in the specific context, unless otherwise indicated. Certain terms used to describe the invention are discussed below or elsewhere in this specification to provide additional guidance to the practitioner (practioner) in describing the invention. The use of examples anywhere throughout the specification, including any examples of words discussed herein, is intended merely to be illustrative, and certainly does not limit the scope or meaning of the invention or any exemplary words. As such, the present invention is not limited to the various embodiments set forth in this specification.

In addition, the terms "electrically coupled" or "electrically connected" when used herein include any direct and indirect electrical connection. For example, if a first device is electrically coupled to a second device, that connection may be through a direct connection, or through an indirect connection via other devices and connections. In addition, if transmission and provision of electrical signals are described, persons skilled in the art should understand that attenuation or other non-ideal changes may be accompanied in the transmission process of electrical signals, but the source of electrical signal transmission or provision and the receiving end should be regarded as substantially the same signal unless otherwise stated. For example, if an electrical signal S is transmitted (or provided) from a terminal a of the electronic circuit to a terminal B of the electronic circuit, wherein a voltage drop may occur across a source/drain of a transistor switch and/or a possible stray capacitance, but the purpose of this design is not to deliberately use attenuation or other non-ideal changes that occur during transmission (or provision) to achieve certain specific technical effects, the electrical signal S should be considered to be substantially the same signal at the terminals a and B of the electronic circuit.

It is understood that as used herein, the terms "comprising", "including", "having", "containing", "including", and the like are open-ended, i.e., meant to include, but not limited to. Moreover, not all objects or advantages or features disclosed herein are necessarily achieved by any one embodiment or claim of the invention. In addition, the abstract and the title of the invention are provided to assist the searching of patent documents and are not intended to limit the scope of the invention.

Fig. 2 is an exploded view of an embodiment of a crystal oscillator package structure of the present invention. Fig. 3 is a cross-sectional view of a crystal oscillator package structure according to an embodiment of the present invention. Referring to fig. 2 and 3, a crystal oscillator package 2 according to the present invention is described. The crystal oscillator package 2 includes a package base 20, a resonator chip 21 and a top cover 22. The top of the package base 20 has a recess 200, and the sidewall of the package base 20 surrounds the recess 200. The resonant crystal piece 21 can be a quartz crystal piece, which includes a frame region 210, at least one U-shaped connection region 211, a resonant region 212 and at least one first connection arm 213, the U-shaped connection region 211 has the function of absorbing vibration, and the shape of the resonant region 212 is not limited. The U-shaped connection region 211 connects the edge of the resonance region 212 and the frame region 210, the notch (notch) of the U-shaped connection region 211 and two inner sidewalls perpendicular to each other face the resonance region 212, the first connection arm 213 connects the U-shaped connection region 211 and the frame region 210, and the frame region 210 is disposed on the sidewall of the package base 20. In this embodiment, the number of the U-shaped connection region 211 and the first connection arm 213 is two, but the invention is not limited thereto. The frame region 210, the U-shaped connection region 211, the resonance region 212, and the first connection arm 213 may be integrally formed. The top cover 22 is disposed on the frame region 210 to shield the recess 200, the U-shaped connection region 211, the resonance region 212 and the first connection arm 213. Since the U-shaped connection region 211 is formed between the frame region 210 and the resonance region 212, and the notch of the U-shaped connection region 211 and the two inner sidewalls perpendicular to each other face the resonance region 212, external mechanical shock or instant impact can be prevented from being transmitted to the resonance region 212, and the resonance frequency can be stabilized.

In some embodiments of the present invention, the crystal oscillator package structure 2 may further include a first electrode layer 23, a second electrode layer 24, a first sealing ring 25, a second sealing ring 26 and a plurality of conductive pads 27. The first electrode layer 23 is disposed on the first connecting arm 213, the U-shaped connecting region 211 and the bottom surface of the resonant region 212, and the first electrode layer 23 is electrically connected to the resonant region 212. The second electrode layer 24 is disposed on the top surfaces of the first connecting arm 213, the U-shaped connecting region 211 and the resonant region 212, and the second electrode layer 24 is electrically connected to the resonant region 212. The first sealing ring 25 is disposed between the sidewall of the package base 20 and the frame region 210, the second sealing ring 26 is disposed between the frame region 210 and the top cover 22, and all the conductive pads 27 are disposed on the bottom surface of the package base 20.

Fig. 4 to 10 are structural top views of various embodiments of the resonant crystal slab of the present invention. Various embodiments of the resonant crystal slab 21 are described below.

Please refer to fig. 4 and 5. As shown in fig. 4, the number of U-shaped connection regions 211 is two, and the number of first connection arms 213 is two, wherein the two first connection arms 213 are respectively connected to the two U-shaped connection regions 211, and the two U-shaped connection regions 211 are symmetrically disposed with respect to the resonance region 212. As shown in fig. 5, the number of the U-shaped connection region 211 is one. Each U-shaped link 211 includes a second link arm 2111, a third link arm 2112, and a fourth link arm 2113. Second link arm 2111 has a first end and a second end, with the first end of second link arm 2111 connecting the edge of resonant region 212. The third connecting arm 2112 has a third end and a fourth end, the third end of the third connecting arm 2112 is connected to the second end of the second connecting arm 2111, and the third connecting arm 2112 is perpendicularly connected to the second connecting arm 2111. The fourth connection arm 2113 has a fifth end and a sixth end, the fifth end of the fourth connection arm 2113 is connected to the fourth end of the third connection arm 2112, the sixth end of the fourth connection arm 2113 is connected to the first connection arm 213, and the fourth connection arm 2113 is perpendicularly connected to the third connection arm 2112 and the first connection arm 213. The notch of U-shaped connecting region 211 is located between second connecting arm 2111 and fourth connecting arm 2113, and third connecting arm 2112 and fourth connecting arm 2113 have inner side walls facing resonant region 212. The fourth connecting arm 2113 and the resonance region 212 together overlap a region, which is located between a first straight line L1 and a second straight line L2, the first straight line L1 is parallel to the second straight line L2, the first straight line L1 overlaps the edge of the resonance region 212, and the second straight line L2 overlaps the side of the first connecting arm 213 away from the fourth connecting arm 2113. For example, resonating region 212 may be rectangular, with fourth link arm 2113 parallel to the long side of the rectangle, and first line L1 overlapping the short side of the rectangle and being close to third link arm 2112, with the shortest distance between first line L1 and second line L2 being D1, and the long side of the rectangle having a length L. In order to absorb most of the shock by the U-shaped connection region 211 and to prevent external shock from affecting the resonance region 212, D1 is L × C1, 0< C1< 1.

Please refer to fig. 6 and 7. The number of the U-shaped attachment areas 211 is two as shown in FIG. 6, and the number of the U-shaped attachment areas 211 is one as shown in FIG. 7. The difference between fig. 4 and 5 is that the fourth arm 2113 of fig. 6 and 7 is parallel to the short side of the rectangle of the resonance region 212, the first straight line L1 overlaps the long side of the rectangle and is close to the third arm 2112, the shortest distance between the first straight line L1 and the second straight line L2 is D2, and the length of the short side of the rectangle is W. In order to absorb most of the shock by the U-shaped connection region 211 and to prevent external shock from affecting the resonance region 212, D2 is W × C2, 0< C2< 1.

Please refer to fig. 8. As shown in fig. 8, the number of the U-shaped connection region 211 is one. The difference from FIG. 7 is that the resonance region 212 of FIG. 8 can be an ellipse, the fourth connecting arm 2113 is parallel to the long axis of the ellipse, the first straight line L1 overlaps the position of the ellipse closest to the third connecting arm 2112, the shortest distance between the first straight line L1 and the second straight line L2 is D1, and the length of the long axis of the ellipse is L. In order to absorb most of the shock by the U-shaped connection region 211 and to prevent external shock from affecting the resonance region 212, D1 is L × C1, 0< C1< 1.

Please refer to fig. 9. As shown in fig. 9, the U-shaped connection region 211 is one in number, and the resonance region 212 may be elliptical. The difference from fig. 8 is that the fourth link arm 2113 of fig. 9 is parallel to the minor axis of the ellipse, the first straight line L1 overlaps the position of the ellipse closest to the third link arm 2112, the shortest distance between the first straight line L1 and the second straight line L2 is D2, and the length of the minor axis of the ellipse is W. In order to absorb most of the shock by the U-shaped connection region 211 and to prevent external shock from affecting the resonance region 212, D2 is W × C2, 0< C2< 1.

Please refer to fig. 10. As shown in fig. 10, the number of the U-shaped connection region 211 is one. The difference from fig. 9 is that the resonance region 212 of fig. 10 may be circular, the fourth connecting arm 2113 is parallel to the diameter of the circle, the first straight line L1 overlaps the position of the circle closest to the third connecting arm 2112, the shortest distance between the first straight line L1 and the second straight line L2 is D, and the diameter of the circle is R. In order to absorb most of the shock by the U-shaped connection region 211 and to prevent the external shock from affecting the resonance region 212, D — R × C, 0< C < 1.

According to the above embodiment, the crystal oscillator package structure forms the U-shaped connection area between the frame area and the resonance area, and the notch of the U-shaped connection area and the two inner side walls perpendicular to each other face the resonance area, so as to prevent external mechanical vibration or instant impact from being transmitted to the resonance area and stabilize the resonance frequency.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, so that equivalent variations and modifications in the shape, structure, characteristics and spirit of the present invention are included in the scope of the present invention.

Claims

1. A crystal oscillator package structure, comprising:

the top of the packaging base is provided with a groove, and the side wall of the packaging base surrounds the groove;

a resonant crystal wafer, comprising a frame region, at least one U-shaped connecting region, a resonant region and at least one first connecting arm, wherein the at least one U-shaped connecting region is connected between the edge of the resonant region and the frame region, the notch of the at least one U-shaped connecting region and two inner side walls which are perpendicular to each other face the resonant region, the at least one first connecting arm is connected between the at least one U-shaped connecting region and the frame region, and the frame region is arranged on the side walls of the package base; and

a top cover disposed on the frame region to shield the recess, the at least one U-shaped connection region, the resonance region, and the at least one first connection arm.

2. The crystal oscillator package structure of claim 1, further comprising:

the first electrode layer is arranged on the bottom surfaces of the at least one first connecting arm, the at least one U-shaped connecting area and the resonance area, and is electrically connected with the resonance area;

the second electrode layer is arranged on the top surfaces of the at least one first connecting arm, the at least one U-shaped connecting area and the resonance area, and is electrically connected with the resonance area;

the first sealing ring is arranged between the side wall of the packaging base and the frame area;

the second sealing ring is arranged between the frame area and the top cover; and

and the conductive pads are arranged on the bottom surface of the packaging base.

3. The crystal oscillator package structure of claim 1, wherein the at least one U-shaped connection region includes:

a second link arm having a first end and a second end, said first end connecting said edge of said resonance region;

the third connecting arm is provided with a third end and a fourth end, the third end is connected with the second end, and the third connecting arm is vertically connected with the second connecting arm; and

a fourth linking arm, has fifth end and sixth end, the fifth end is connected the fourth end, the sixth end is connected first linking arm, fourth linking arm is connected perpendicularly third linking arm with first linking arm, the notch is located the second linking arm with between the fourth linking arm, the third linking arm with the fourth linking arm has the orientation the inside wall of resonance region, the fourth linking arm with resonance region overlaps an area, the area is located between a first straight line and the second straight line, first straight line is parallel the second straight line, first straight line overlaps the resonance region the edge, the second straight line overlaps first linking arm is kept away from the side of fourth linking arm.

4. The crystal oscillator package structure of claim 3, wherein the resonance area is a rectangle, the fourth connecting arm is parallel to a long side of the rectangle, the first straight line overlaps a short side of the rectangle near the third connecting arm, a shortest distance between the first straight line and the second straight line is D1, and a length of the long side is L, D1 is L × C1, and 0< C1< 1.

5. The crystal oscillator package structure of claim 3, wherein the resonance area is a rectangle, the fourth connecting arm is parallel to a short side of the rectangle, the first straight line overlaps a long side of the rectangle near the third connecting arm, a shortest distance between the first straight line and the second straight line is D2, and a length of the short side is W, D2 is W x C2, and 0< C2< 1.

6. The crystal oscillator package structure of claim 3, wherein the resonance region is an ellipse, the fourth link is parallel to a long axis of the ellipse, the first line overlaps a position of the ellipse closest to the third link, a shortest distance between the first line and the second line is D1, a length of the long axis is L, D1 ═ LxC 1, 0< C1< 1.

7. The crystal oscillator package structure of claim 3, wherein the resonance region is an ellipse, the fourth link is parallel to a minor axis of the ellipse, the first line overlaps a position of the ellipse closest to the third link, a shortest distance between the first line and the second line is D2, and the minor axis has a length W, D2 ═ WxC 2, 0< C2< 1.

8. The crystal oscillator package structure of claim 3, wherein the resonance area is a circle, the fourth connecting arm is parallel to a diameter of the circle, the first line overlaps a position of the circle closest to the third connecting arm, a shortest distance between the first line and the second line is D, and a length of the diameter is R, where D is RxC, and 0< C < 1.

9. The crystal oscillator package structure of claim 1, wherein the at least one U-shaped connection area includes two U-shaped connection areas, the at least one first connection arm includes two first connection arms, the two first connection arms are respectively connected to the two U-shaped connection areas, and the two U-shaped connection areas are symmetrically disposed with respect to the resonance area as a center.

10. The crystal oscillator package structure of claim 1, wherein the frame region, the at least one first connection arm, the at least one U-shaped connection region and the resonance region are integrally formed.