CN113958161A - Multilayer structure data center adopting evaporative cooling technology - Google Patents
Multilayer structure data center adopting evaporative cooling technology Download PDFInfo
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- CN113958161A CN113958161A CN202111247793.3A CN202111247793A CN113958161A CN 113958161 A CN113958161 A CN 113958161A CN 202111247793 A CN202111247793 A CN 202111247793A CN 113958161 A CN113958161 A CN 113958161A
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- room
- evaporative cooling
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04H—BUILDINGS OR LIKE STRUCTURES FOR PARTICULAR PURPOSES; SWIMMING OR SPLASH BATHS OR POOLS; MASTS; FENCING; TENTS OR CANOPIES, IN GENERAL
- E04H5/00—Buildings or groups of buildings for industrial or agricultural purposes
- E04H5/02—Buildings or groups of buildings for industrial purposes, e.g. for power-plants or factories
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20827—Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04H—BUILDINGS OR LIKE STRUCTURES FOR PARTICULAR PURPOSES; SWIMMING OR SPLASH BATHS OR POOLS; MASTS; FENCING; TENTS OR CANOPIES, IN GENERAL
- E04H5/00—Buildings or groups of buildings for industrial or agricultural purposes
- E04H2005/005—Buildings for data processing centers
Abstract
The invention discloses a multilayer structure data center adopting an evaporative cooling technology, which comprises a room body, wherein the room body comprises an electromechanical auxiliary room, a two-layer main room and a three-layer main room which are sequentially stacked from bottom to top, the horizontal projection area of the electromechanical auxiliary room is larger than that of the two-layer main room, and an evaporative cooling unit is arranged on the roof of at least one room. The invention utilizes the characteristics of the building structure as the mounting platform of the evaporative cooling unit, saves the built steel structure platform, reduces the investment cost, reduces the difficulty of construction and installation, avoids the potential safety hazard in the production and installation process, and increases the plasticity of the overall landscape modeling.
Description
Technical Field
The invention relates to the technical field of data center process layout, in particular to a multilayer structure data center adopting an evaporative cooling technology.
Background
The climate difference between south and north of China is large, the temperature and humidity environments are different, the application of the evaporative cooling unit is closely related to the climate environment, the evaporative cooling unit is gradually applied to domestic and north data center projects in recent years, and the PUE and operation cost of the data center are effectively reduced. At present, the refrigerating capacity of an evaporative cooling unit used in a data center is usually 200-300 kw, and in order to meet the refrigerating requirement of the data center, more than 100 evaporative cooling units with the refrigerating capacity of 200-300 kw are often required to be configured in a data center with a 3000 cabinet size. The number of evaporative cooling units is so large that it puts high demands on the arrangement and installation of the process plane. For the reasons, at present, the layout and installation modes of the evaporative cooling units commonly used in practical engineering mainly include the following:
(1) arranging and installing a steel structure platform: a series of steel structure projects are built on the outer side of the machine room and serve as equipment platforms, and the equipment platforms are supported by steel structure columns from top to bottom. And steel grids are laid on each layer of equipment platform, and the evaporative cooling unit is installed on the platform. The method needs a large amount of steel, so that not only is the construction difficulty increased in the construction process, but also certain potential safety hazards exist, and the construction cost of the steel part is increased;
(2) one floor is arranged and installed: the method has the advantages that the installation is convenient, the data center machine room is generally arranged on two layers, when the evaporation unit is arranged on one layer, the energy transmission route is not the shortest, so that the use amount of power cables, air pipes and water pipes is greatly increased, extra cost pressure is applied to construction investment, and meanwhile, the integral attractiveness of the building is insufficient.
Patent application No. CN201910740336.4 discloses a butterfly data center, which comprises a single-layer building and a multi-layer building, wherein each layer comprises a system support area and four host areas distributed in an array of two rows and two columns, the system support area is positioned at the central position between the four host areas, an auxiliary area is arranged between every two host areas along the row direction, and the four host areas, the system support area and the auxiliary area are matched to form butterfly distribution; each host area comprises two host room supporting areas, wherein the host rooms are positioned on one side of the host room facing the other host area, and the two host room supporting areas are distributed along the row direction; every two host areas are independent from each other, and each host area is communicated with the system support area; the auxiliary area system supports area communication. The butterfly data center disclosed in the application can realize the shortest path for energy transmission, and has the effects of being most convenient and fast to operate and maintain, most reliable in safety protection and most flexible in modular operation. However, the patent is not suitable for a data center adopting an evaporative cooling technology, and the process layout is greatly different.
Therefore, in view of the layout and installation method of the evaporative cooling unit and the related patent documents of the data center retrieved at present, there is an urgent need to design a data center which is reasonable in layout, convenient to construct, material-saving, low in construction cost, attractive in process layout and building structure and suitable for adopting the evaporative cooling technology.
Disclosure of Invention
The invention aims to provide a multi-layer structure data center adopting an evaporative cooling technology, which realizes the shortest conveying route distance, is convenient for equipment installation, can greatly reduce the investment cost, is flexible in recruitment and investment introduction, has an attractive appearance, and has applicability to the data center adopting the evaporative cooling technology in the industry.
In order to solve the technical problems, the invention provides a multi-layer structure data center adopting an evaporative cooling technology, which comprises a room body, wherein the room body comprises an electromechanical auxiliary room, a two-layer main room and a three-layer main room which are sequentially stacked from bottom to top, the horizontal projection area of the electromechanical auxiliary room is larger than that of the two-layer main room, and an evaporative cooling unit is arranged on the roof of at least one room.
Further, for the multi-layer structure data center adopting the evaporative cooling technology, the two-layer main room is arranged right above the electromechanical auxiliary room.
Further, for the data center with the multilayer structure adopting the evaporative cooling technology, the horizontal projection area of the two layers of main rooms is smaller than or equal to that of the three layers of main rooms.
Further, for the data center with the multilayer structure adopting the evaporative cooling technology, the three layers of main rooms are arranged right above the two layers of main rooms.
Further, for the data center with the multi-layer structure adopting the evaporative cooling technology, evaporative cooling units are installed on the roofs of the electromechanical auxiliary rooms and the roofs of the three layers of main rooms.
Furthermore, for the multilayer structure data center adopting the evaporative cooling technology, the electromechanical auxiliary room, the two-layer mainframe room and the three-layer mainframe room are all cubes.
Further, for the multi-layer data center adopting the evaporative cooling technology, the interior of the room body is vertically divided into a plurality of module groups according to spatial distribution.
Further, for the multi-layer structure data center adopting the evaporative cooling technology, the number of the module groups is between 2 and 5.
Furthermore, for the multilayer structure data center adopting the evaporative cooling technology, the number of the server cabinets installed in each module is more than or equal to 1000.
Compared with the prior art, the invention at least has the following beneficial effects:
the invention utilizes the building structure as the mounting platform of the evaporative cooling unit, perfectly omits a built steel structure platform, greatly reduces the investment cost, reduces the difficulty of construction and installation, avoids potential safety hazards in the production and installation processes, greatly improves the attractiveness of the data center because the whole building structure is optimized, increases the plasticity of the whole landscape modeling, and has applicability to the data center adopting the evaporative cooling technology in the industry.
Drawings
FIG. 1 is a schematic diagram of an overall structure of a multi-tiered data center using evaporative cooling technology according to an embodiment of the present invention;
FIG. 2 is a diagram illustrating an embodiment of the present invention in which three independent module groups are vertically divided.
Detailed Description
While the multi-tiered structured data center employing evaporative cooling of the present invention will now be described in greater detail with reference to the schematic drawings, in which preferred embodiments of the present invention are shown, it is to be understood that one skilled in the art can modify the invention described herein while still achieving the advantageous effects of the invention. Accordingly, the following description should be construed as broadly as possible to those skilled in the art and not as limiting the invention.
The invention is described in more detail in the following paragraphs by way of example with reference to the accompanying drawings. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
As shown in fig. 1, an embodiment of the present invention provides a multilayer data center using an evaporative cooling technology, including a room body 1, where the room body 1 includes a mechanical and electrical auxiliary room 2, a two-layer main room 3, and a three-layer main room 4, which are sequentially stacked from bottom to top, a horizontal projection area of the mechanical and electrical auxiliary room 2 is greater than a horizontal projection area of the two-layer main room 3, and an evaporative cooling unit is disposed on a roof of at least one room.
In the embodiment of the present invention, the auxiliary machinery room 2, the two-layer main machine room 3, and the three-layer main machine room 4 are all disposed in a cube, preferably, for example, a rectangular parallelepiped.
The horizontal projection area of the second-layer main computer room 3 is larger than or equal to that of the third-layer main computer room 4.
In the embodiment of the invention, the two-layer main room 3 is arranged right above the electromechanical auxiliary room 2. Further, the three-layer main computer room 4 is arranged right above the two-layer main computer room 3.
In one embodiment, the roof of the electromechanical auxiliary room 2 and the roof of the three-storey main room 4 are each provided with a number of evaporative cooling units 5.
In the embodiment of the present invention, the horizontal area of the electromechanical auxiliary room 2 is larger than the horizontal projection area of the three-layer main room 4 and the two-layer main room 3, so that the evaporative cooling unit 5 may be installed on the roof of the electromechanical auxiliary room 2 to cool the inside of the two-layer main room 3, and the evaporative cooling unit 5 installed on the roof of the three-layer main room 4 cools the inside of the three-layer main room 4. The arrangement mode of the evaporative cooling unit 5 can greatly optimize the airflow organization of the evaporative cooling unit 5 and the room body 1, and meanwhile, a steel structure platform which is commonly used and is built for arranging the evaporative cooling unit 5 is omitted, the material usage amount increased by the floor mounting of one layer is reduced, and the investment cost is greatly reduced.
Referring to fig. 2, in the embodiment of the present invention, the house body 1 is of a modular design, and the inside of the house body 1 is vertically divided into a plurality of module groups according to spatial distribution, for example, 2 to 5 or more.
In a preferred scheme, the system is divided into three module groups, and as shown in fig. 2, a first-layer machine room auxiliary room area a, a second-layer main machine room a and a third-layer main machine room a are a module group; the auxiliary room area B of the first-layer machine room, the second-layer main machine room B and the third-layer main machine room B form a module group; the auxiliary room area C of the first floor of machine room, the second floor of main machine room C and the third floor of main machine room C form a module group. Three independent units are formed inside the house body 1, the whole house body 1 can be divided in a combined mode, and flexibility in actual use is greatly improved.
The number of the server cabinets installed in each module is more than or equal to 1000. In this embodiment, the number of the server cabinets installed in the three modules is equal to or greater than 1000, so that the use requirements are met.
In the multilayer structure data center adopting the evaporative cooling technology, the room body 1 is formed by stacking three layers of electromechanical auxiliary rooms 2, two layers of main rooms 3 and three layers of main rooms 4 in structural design. The two-layer main machine room 3, the three-layer main machine room 4 and the electromechanical auxiliary room 2 are vertically arranged. Through setting up the shaft, can realize the intercommunication of two layers of host computer rooms 3, three-layer host computer room 4 and electromechanical auxiliary room 2 power cable, avoid the low-pressure area to walk the line transversely, power transmission route distance is shortest, and energy transmission loss is minimum.
When the structure is designed, if the sizes of the electromechanical auxiliary room 2, the two-layer main room 3 and the three-layer main room 4 are designed to be similar, the three layers are not well matched, and the cost is increased if the number of layers is increased. Therefore, the electromechanical auxiliary room 2 is designed to be larger than the two-layer main room 3 and the three-layer main room 4, so that the whole room body 1 is in a shape of being narrow at the top and wide at the bottom. This makes electromechanical auxiliary room 2 roof can reserve the arrangement space of evaporative cooling unit 5, has saved the steel construction platform that the commonly-used was set up for arranging evaporative cooling unit to and the one deck falls to the ground and installs the material use amount that increases, reduces investment cost by a wide margin.
It is understood that the present invention may have other number of layers according to actual requirements, for example, 4 layers or more may be provided when the length and width of each layer cannot be infinitely increased, and the actual number of stations is large.
In summary, compared with the prior art, the invention has the following advantages:
the multi-layer structure data center adopting the evaporative cooling technology provided by the invention utilizes the characteristics of the building structure as the mounting platform of the evaporative cooling unit, the built steel structure platform is perfectly omitted, the investment cost is greatly reduced, the difficulty of construction and mounting is reduced, the potential safety hazard in the production and mounting process is avoided, in addition, the integral building structure is optimized, the attractiveness of the data center is greatly improved, the plasticity of the integral landscape shape is increased, and the multi-layer structure data center adopting the evaporative cooling technology has applicability to the data center adopting the evaporative cooling technology in the industry.
In the space planning of the data center provided by the invention, the house body adopts a modular design, the internal space is vertically divided into three independent module groups, and the three module groups are respectively as follows: the left module group is composed of an electromechanical auxiliary room left area, a two-layer main room left area and a three-layer main room left area, a module group is composed of an electromechanical auxiliary room middle area, a two-layer main room middle area and a three-layer main room middle area, and a module group is composed of an electromechanical auxiliary room right area, a two-layer main room right area and a three-layer main room right area, three module groups form three independent use units, the whole machine room space can be combined and separated, and the flexibility in actual use is greatly improved.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (9)
1. The utility model provides an adopt multilayer structure data center of evaporative cooling technique, its characterized in that, includes the room body, the room body includes that electromechanical auxiliary that from the bottom up piles up the setting uses room, two layers of host computer rooms and three-layer host computer room in proper order, electromechanical auxiliary is greater than two layers of host computer room horizontal projection area with room horizontal projection area, is provided with the evaporative cooling unit on the roof of a room at least.
2. The data center with a multi-tiered structure using evaporative cooling as recited in claim 1 wherein said two-tiered main room is disposed directly above said mechatronic auxiliary room.
3. The data center with a multi-tiered structure based on evaporative cooling as recited in claim 2 wherein said two-tiered main room floor plan view area is equal to or less than said three-tiered main room floor plan view area.
4. The data center with a multi-story structure using evaporative cooling technology as claimed in claim 3, wherein the three-story main room is disposed right above the two-story main room.
5. The data center with a multi-story structure using evaporative cooling technology as set forth in any one of claims 1 to 4, wherein evaporative cooling units are installed on the roofs of the mechatronic auxiliary rooms and the roofs of the three main floors.
6. The data center with a multi-layer structure adopting an evaporative cooling technology as claimed in claim 1, wherein the mechatronic auxiliary room, the two-layer main room and the three-layer main room are cubic.
7. The data center with a multi-tiered structure using evaporative cooling as recited in claim 1 wherein said interior of said housing is vertically divided into a plurality of module groups in a spatial distribution.
8. The data center with a multi-tiered structure based on evaporative cooling as recited in claim 7 wherein said set of modules is between 2 and 5 in number.
9. The data center with a multi-layer structure and adopting an evaporative cooling technology as claimed in claim 7, wherein the number of the server cabinets installed in each module is greater than or equal to 1000.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111247793.3A CN113958161A (en) | 2021-10-26 | 2021-10-26 | Multilayer structure data center adopting evaporative cooling technology |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111247793.3A CN113958161A (en) | 2021-10-26 | 2021-10-26 | Multilayer structure data center adopting evaporative cooling technology |
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| CN113958161A true CN113958161A (en) | 2022-01-21 |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2764213A1 (en) * | 2011-04-06 | 2012-10-06 | Fmr Llc | Modular data center |
| CN202810267U (en) * | 2012-09-20 | 2013-03-20 | 曙光信息产业(北京)有限公司 | Machine room |
| CN103471185A (en) * | 2013-09-17 | 2013-12-25 | 北京雅驿欣科技有限公司 | Modularized data center machine room air conditioning system |
| CN105451504A (en) * | 2014-08-19 | 2016-03-30 | 阿里巴巴集团控股有限公司 | Machine room, data center, and data center system |
| CN205584689U (en) * | 2016-02-23 | 2016-09-14 | 武汉科技大学 | High -efficient cooling system of data computer lab |
| CN205918176U (en) * | 2016-08-01 | 2017-02-01 | 香江科技股份有限公司 | Modularization overhead cooling unit system communication computer lab |
| CN110414028A (en) * | 2018-04-30 | 2019-11-05 | 百度（美国）有限责任公司 | It is designed using the connection of data center's building of indirect evaporating-cooling unit |
| CN212746760U (en) * | 2020-05-29 | 2021-03-19 | 河北秦淮数据有限公司 | Data center cooling system and data center machine room |
-
2021
- 2021-10-26 CN CN202111247793.3A patent/CN113958161A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2764213A1 (en) * | 2011-04-06 | 2012-10-06 | Fmr Llc | Modular data center |
| CN202810267U (en) * | 2012-09-20 | 2013-03-20 | 曙光信息产业(北京)有限公司 | Machine room |
| CN103471185A (en) * | 2013-09-17 | 2013-12-25 | 北京雅驿欣科技有限公司 | Modularized data center machine room air conditioning system |
| CN105451504A (en) * | 2014-08-19 | 2016-03-30 | 阿里巴巴集团控股有限公司 | Machine room, data center, and data center system |
| CN205584689U (en) * | 2016-02-23 | 2016-09-14 | 武汉科技大学 | High -efficient cooling system of data computer lab |
| CN205918176U (en) * | 2016-08-01 | 2017-02-01 | 香江科技股份有限公司 | Modularization overhead cooling unit system communication computer lab |
| CN110414028A (en) * | 2018-04-30 | 2019-11-05 | 百度（美国）有限责任公司 | It is designed using the connection of data center's building of indirect evaporating-cooling unit |
| CN212746760U (en) * | 2020-05-29 | 2021-03-19 | 河北秦淮数据有限公司 | Data center cooling system and data center machine room |
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