CN113956715A - Anti-etching ink for ink-jet printing - Google Patents
Anti-etching ink for ink-jet printing Download PDFInfo
- Publication number
- CN113956715A CN113956715A CN202111501060.8A CN202111501060A CN113956715A CN 113956715 A CN113956715 A CN 113956715A CN 202111501060 A CN202111501060 A CN 202111501060A CN 113956715 A CN113956715 A CN 113956715A
- Authority
- CN
- China
- Prior art keywords
- ink
- etching
- parts
- mass
- jet printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
Abstract
The invention discloses an ink-jet printing etching-resistant ink which is prepared from the following components in parts by weight: photosensitive functional material: 50-70 parts by mass; temperature-sensitive monomers: 5-15 parts by mass; light-curing resin: 1-10 parts by mass; photopolymerization initiator: 1-5 parts by mass; ultra-fine synthesis of barium sulfate: 0.1-1 parts by mass; organic dye: 0.1-0.5 parts by mass; the actual dissolving temperature of the etching-resistant ink consisting of the photosensitive functional material, the temperature-sensitive monomer, the photocuring resin, the photopolymerization initiator, the superfine synthetic barium sulfate and the organic dye is more than 35 ℃. The invention solves the problems of insufficient etching resistance, poor etching quality, insufficient etching depth and the like of the prior etching-resistant ink product, and expands the application range of the etching-resistant ink for ink-jet printing.
Description
Technical Field
The invention belongs to the field of manufacturing printed circuits by ink-jet printing, and relates to an etching-resistant ink used in an ink-jet printing process.
Background
Circuit boards, also known as printed circuit boards, are important electronic components, support bodies for electronic components, and carriers for electrical connection of electronic components. The circuit board is one of indispensable accessories in various modern electronic devices, but all electronic devices, whether large machines or personal computers, communication base stations or mobile phones, household appliances or electronic toys, are all used as printed circuit boards.
The manufacture of printed circuit boards in the electronic industry is of great importance, and conventional PCBs currently use dry film or wet film resists to coat and manufacture etch-resistant coatings, form the required patterns through exposure and development processes after coating, then chemically etch the exposed copper surface, remove the etch-resistant coatings through a film-coating process, and finally form the required circuit patterns. The process has the advantages of long period, high energy consumption and high labor cost. As inkjet printing technology matures, the use of inkjet printing forms to directly form etch resistant coatings of desired patterns has been more discussed in the industry.
The quality requirement for the etch is to be able to completely remove all of the copper layer except under the resist layer. Strictly speaking, the etching quality must include the line width uniformity and the degree of undercutting of the conductive lines. The problem of undercutting is often addressed in etching. The ratio of undercut width to etch depth, referred to as the etch factor; in the printed circuit industry, small undercutting or low etching factors are the most satisfactory. The structure of the etching equipment and the etching solution with different compositions can affect the etching factor or the lateral erosion degree. The etching-resistant ink is used as a barrier layer when a circuit is corroded and plays a protective role when the circuit is etched. With the continuous progress of the technology, the etching-resistant ink capable of being printed by ink jet is appeared, but the etching-resistant ink products used in the market at present have the problems of insufficient etching resistance, poor etching quality, insufficient etching depth and the like.
Disclosure of Invention
Aiming at the problems of the etching-resistant ink products used in the prior art, the invention solves the problems of insufficient etching resistance, poor etching quality, insufficient etching depth and the like of the PCB etching-resistant coating manufactured by the current etching-resistant ink jet printing process through an innovative formula technology.
The invention is realized by the following steps:
an ink-jet printing etching-resistant ink, which is prepared from the following components:
photosensitive functional material: 50-70 parts by mass;
temperature-sensitive monomers: 5-15 parts by mass;
light-curing resin: 1-10 parts by mass;
photopolymerization initiator: 1-5 parts by mass;
ultra-fine synthesis of barium sulfate: 0.1-1 parts by mass;
organic dye: 0.1-0.5 parts by mass;
the actual dissolving temperature of the etching-resistant ink consisting of the photosensitive functional material, the temperature-sensitive monomer, the photocuring resin, the photopolymerization initiator, the superfine synthetic barium sulfate and the organic dye is more than 35 ℃. The etching-resistant ink is suitable for acidic etching liquid with the temperature of more than 35 ℃.
The dynamic viscosity of the etching-resistant ink at 25 ℃ is below 50 cps.
The photosensitive functional material is one or a combination of N, N-diethyl acetoacetamide DEAA, N-diethyl acetoacetamide (DEAA) polymer and o-nitrobenzyl acrylate (NBAE).
The temperature-sensitive monomer is one or a combination of N-isopropylacrylamide (NIPAM), dimethylaminoethyl methacrylate (DMAEMA), oligo (ethylene glycol) methyl ether methacrylate (OEGMA), N-Vinyl Caprolactam (VCL), methyltetrahydrofuran methacrylamide (THFMA) and methyltetrahydrofuran acrylamide (THFAA).
The invention uses the photosensitive functional material and the temperature sensitive monomer as the main components of the ink, the reaction of the photosensitive functional material and the temperature sensitive monomer raises the actual dissolution temperature of the ink to more than 35 ℃, the prepared ink can generate phase separation at more than 35 ℃, is insoluble in acidic etching solution or water with the temperature of more than 35 ℃, but can be dissolved in acidic etching solution or water with the temperature of less than 35 ℃. The main solvent of the acidic etching solution is water. The temperature of the etching solution in the actual etching process is higher than 35 ℃, so the technical scheme of the invention pioneers the problem that the anti-etching coating has poor acid-resistant etching performance and the like, and the manufacture of the PCB anti-etching coating by the ink-jet printing process is possible. The actual dissolving temperature of the ink is optimized by adjusting different proportions of the ink components.
The light-cured resin is a light-cured resin containing acryloyl, carboxyl or epoxy in the molecule.
Further, the light-cured resin is one or a combination of more of light-cured resin 2-acryloyl-methyl propane sulfonic acid epoxy resin, polyurethane acrylic resin, methacrylate and special acrylate oligomer, wherein the molecule of the light-cured resin contains acryloyl; the light-cured resin containing carboxyl in the molecule is maleic anhydride copolymer resin; the light-cured resin containing epoxy groups in molecules is one or a combination of bisphenol A epoxy acrylate, acrylate epoxy resin, phenol novolac epoxy resin, o-cresol novolac epoxy resin and bisphenol F type epoxy resin.
The light-cured resin in the present invention is used for improving light-curing efficiency and adjusting viscosity.
The photopolymerization initiator is selected from one or more of thioxanthone and derivatives thereof, hydroxyketone derivatives, amidoketone derivatives, acyl phosphorus oxide, cation initiator and titanocene.
Wherein, the commercial products mainly comprise 2, 4-diethyl thioxanthone DETX, isopropyl thioxanthone ITX and the like; the hydroxy ketone derivative photopolymerization initiator is mainly available in the market products of: 2-hydroxy-2-methyl-1-phenylacetone (1173), 1-hydroxycyclohexylbenzone (184), 2-hydroxy-2-methyl-1-p-hydroxyethyl ether phenylacetone (2959), and the like; the amidoketone derivative photopolymerization initiator is mainly prepared from the following commercial products: 2-methyl-1- (4-methylthiophenyl) -2-morpholinyl-1-propanone (907), 2-phenylbenzyl-2-dimethylamine-1- (4-morpholinylbenzyl phenyl) butanone (369), 2-dimethylamino-2- (4-methyl) benzyl-1- [4- (4-morpholinyl) phenyl ] -1-butanone (379), and the like; the acyl phosphorus oxide photopolymerization initiator is mainly prepared from the following commercial products: ethyl 2,4, 6-trimethylbenzoylphosphonate (TPO-L),2,4, 6-trimethylbenzoyl-diphenylphosphine oxide (TPO), phenylbis (2,4, 6-trimethylbenzoyl) phosphine oxide (819), and the like; cationic initiators, mainly the commercial products: aryldiazonium salts, diaryliodonium salts, triarylsulfonium salts, and the like; the titanocene photopolymerization initiator is mainly bis-2, 6-difluoro-3-pyrrolylphenyltitanocene (784) and the like which are commercially available, and one or more of the titanocene photopolymerization initiators can be selected for use.
The superfine synthetic barium sulfate is barium sulfate with the D50 grain size less than or equal to 100 nm. The superfine synthetic barium sulfate is mainly used as a filler to reduce the shrinkage stress of the photocuring resin and improve the adhesive force of a coating. The content of barium sulfate is not easy to exceed 1 part by mass, and the barium sulfate has higher density and is easy to settle and block a spray head.
The organic dye is one of oil-soluble green dye, oil-soluble blue dye and oil-soluble yellow dye. The organic dye is used for providing color for the coating, the content of the organic dye is preferably 0.1-0.5 part by mass, and the color of the etching-resistant ink can be changed at will.
The ink for ink-jet printing etching resistance is used for manufacturing a circuit pattern on the surface of a substrate in an ink-jet printing mode. The substrate is preferably copper-clad or stainless steel.
Compared with the prior art, the invention has the beneficial effects that: through long-term research on the preparation of the PCB anti-etching coating by using an ink-jet printing process, the actual dissolution temperature of the ink is above 35 ℃ by using the ink which takes a photosensitive functional material and a temperature-sensitive monomer as main components.
Detailed Description
In order to make the objects, technical solutions and effects of the present invention more clear, the present invention is further described in detail by the following examples. It should be noted that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Hereinafter, the inkjet printing etching resist ink of the present invention will be described with reference to examples, but the present invention is not limited to these examples.
Example 1
An ink-jet printing etching-resistant ink, which is prepared from the following components:
photosensitive functional material: 70 parts by mass of N, N-Diethylacetoacetamide (DEAA);
temperature-sensitive monomers: 15 parts by mass of N-isopropylacrylamide (NIPAM);
light-curing resin: 1 part by mass of a special acrylate oligomer;
photopolymerization initiator: 5 parts by mass of 2,4, 6-trimethylbenzoyl-diphenylphosphine oxide (TPO);
d50 superfine synthetic barium sulfate with the particle size less than or equal to 100 nm: 0.1 part by mass;
organic dye: 0.2 part by mass of oil-soluble blue;
the actual dissolving temperature of the etching-resistant ink consisting of the photosensitive functional material, the temperature-sensitive monomer, the photocuring resin, the photopolymerization initiator, the superfine synthetic barium sulfate and the organic dye is more than 35 ℃, and the dynamic viscosity at 25 ℃ is 7 cp. The components are mixed according to a proportion, ball-milled by a high-speed ball mill, and filtered by a 1um filter to obtain the ink-jet printing etching-resistant ink.
The actual dissolving temperature of the ink is over 35 ℃ by using the ink which takes the photosensitive functional material and the temperature sensitive monomer as main components and adjusting different proportions, and the prepared ink is subjected to phase separation at over 35 ℃.
The prepared etching-resistant ink is used for manufacturing a circuit pattern on the surface of the copper-clad foil in an ink-jet printing mode. Printing was performed on the copper clad foil surface by an ink jet printer, followed by UV curing. Inkjet printing conditions film thickness: 0.8 um; the device comprises the following steps: using a piezoelectric ink-jet printer, wherein the temperature of a printing head is 25 ℃; and (3) photocuring conditions: ultraviolet exposure energy: 600mj/cm2。
And soaking the circuit pattern in an etching solution at 35 ℃ for etching, soaking in water at 20 ℃ after etching is finished, and stripping the anti-etching ink coating to obtain the copper circuit. The obtained etching-resistant ink coating can be soaked in an acid etching solution at 35 ℃ for 60min without falling off.
Example 2
An ink-jet printing etching-resistant ink, which is prepared from the following components:
photosensitive functional material: 60 parts by mass of N, N-diethylacetoacetamide DEAA, and 5 parts by mass of N, N-Diethylacetoacetamide (DEAA) polymer;
temperature-sensitive monomers: 3 parts by mass of dimethylaminoethyl methacrylate (DMAEMA) and 2 parts by mass of methyltetrahydrofuran methacrylamide (THFMA);
light-curing resin: 3 parts by mass of a maleic anhydride copolymer resin;
photopolymerization initiator: 5 parts by mass of phenylbis (2,4, 6-trimethylbenzoyl) phosphine oxide (819);
d50 superfine synthetic barium sulfate with the particle size less than or equal to 100 nm: 0.5 part by mass;
organic dye: 0.25 parts of oil-soluble blue and oil-soluble yellow respectively;
the actual dissolving temperature of the etching-resistant ink consisting of the photosensitive functional material, the temperature-sensitive monomer, the photocuring resin, the photopolymerization initiator, the superfine synthetic barium sulfate and the organic dye is more than 35 ℃, and the dynamic viscosity at 25 ℃ is 15 cp. The components are mixed according to a proportion, ball-milled by a high-speed ball mill, and filtered by a 1um filter to obtain the ink-jet printing etching-resistant ink.
The actual dissolving temperature of the ink is above 35 ℃ by using the ink which takes the photosensitive functional material and the temperature sensitive monomer as main components, and the prepared ink is subjected to phase separation at above 35 ℃.
The prepared etching-resistant ink is used for manufacturing a circuit pattern on the surface of the copper-clad foil in an ink-jet printing mode. Printing was performed on the copper clad foil surface by an ink jet printer, followed by UV curing. Inkjet printing conditions film thickness: 1 um; the device comprises the following steps: using a piezoelectric ink-jet printer, wherein the temperature of a printing head is 30 ℃; and (3) photocuring conditions: ultraviolet exposure energy: 500mj/cm2。
And soaking the circuit pattern in an etching solution at 45 ℃ for etching, soaking in water at 10 ℃ after etching is finished, and stripping the anti-etching ink coating to obtain the copper circuit. The obtained etching-resistant ink coating can be soaked in an acid etching solution at 35 ℃ for 80min without falling off.
Example 3
An ink-jet printing etching-resistant ink, which is prepared from the following components:
photosensitive functional material: 50 parts by mass of N, N-diethyl acetoacetamide DEAA and 10 parts by mass of o-nitrobenzyl acrylate (NBAE);
temperature-sensitive monomers: 5 parts by mass of N-Vinyl Caprolactam (VCL) and 2 parts by mass of methyl tetrahydrofuran acrylamide (THFAA);
light-curing resin: 8 parts of o-cresol formaldehyde epoxy resin;
photopolymerization initiator: 3 parts by mass of 2,4, 6-trimethylbenzoyl-diphenylphosphine oxide (TPO) and 2 parts by mass of 1-hydroxycyclohexyl benzophenone (184);
d50 superfine synthetic barium sulfate with the particle size less than or equal to 100 nm: 0.6 part by mass;
organic dye oil-soluble blue: 0.3 part by mass;
the actual dissolving temperature of the etching-resistant ink consisting of the photosensitive functional material, the temperature-sensitive monomer, the photocuring resin, the photopolymerization initiator, the superfine synthetic barium sulfate and the organic dye is more than 35 ℃, and the dynamic viscosity at 25 ℃ is 35 cp. The components are mixed according to a proportion, ball-milled by a high-speed ball mill, and filtered by a 1um filter to obtain the ink-jet printing etching-resistant ink.
The actual dissolving temperature of the ink is above 35 ℃ by using the ink which takes the photosensitive functional material and the temperature sensitive monomer as main components, and the prepared ink is subjected to phase separation at above 35 ℃.
The prepared etching-resistant ink is used for manufacturing a circuit pattern on the surface of the stainless steel in an ink-jet printing mode. Printing was performed on the stainless steel surface by an inkjet printer and then UV cured. Inkjet printing conditions film thickness: 1.2 um; the device comprises the following steps: using a piezoelectric ink-jet printer, wherein the temperature of a printing head is 45 ℃; and (3) photocuring conditions: ultraviolet exposure energy: 700mj/cm2。
And soaking the circuit pattern in an etching solution at 50 ℃ for etching, soaking in water at 5 ℃ after etching is finished, and stripping the anti-etching ink coating to obtain the stainless steel circuit. The obtained etching-resistant ink coating can be soaked in an acid etching solution at 35 ℃ for 70min without falling off.
Comparative example 1
The technical scheme in the embodiment 1 is changed into that: removing a temperature-sensitive monomer N-isopropylacrylamide (NIPAM), and soaking the obtained anti-etching ink in an acid etching solution at 35 ℃ for 3min to remove the ink. Because N, N-diethyl acetoacetamide DEAA can not be polymerized with a temperature-sensitive monomer N-isopropyl acrylamide (NIPAM), the actual dissolving temperature of the ink can not be increased to more than 35 ℃.
Comparative example 2
The N, N-diethylacetoacetamide DEAA in example 1 was replaced by N, N-Dimethylacrylamide (DMAA), and the obtained etching resist ink was immersed in an acidic etching solution at 35 ℃ for 3min and then peeled off. Because N, N-Dimethylacrylamide (DMAA) can not be polymerized with temperature-sensitive monomer N-isopropylacrylamide (NIPAM), the actual dissolving temperature of the ink can not be increased to more than 35 ℃.
From the results of the table above, it can be seen that: the invention solves the problems of insufficient etching resistance, poor etching quality, insufficient etching depth and the like of the existing etching-resistant ink product through an innovative formula technology, and expands the application range of the ink-jet printing etching-resistant ink.
The foregoing is directed to the preferred embodiment of the present invention and it is understood that various modifications may be made by those skilled in the art without departing from the spirit and scope of the invention.
Claims (10)
1. An ink-jet printing etching-resistant ink is characterized by being prepared from the following components in parts by weight:
photosensitive functional material: 50-70 parts by mass;
temperature-sensitive monomers: 5-15 parts by mass;
light-curing resin: 1-10 parts by mass;
photopolymerization initiator: 1-5 parts by mass;
ultra-fine synthesis of barium sulfate: 0.1-1 parts by mass;
organic dye: 0.1-0.5 parts by mass;
the actual dissolving temperature of the etching-resistant ink consisting of the photosensitive functional material, the temperature-sensitive monomer, the photocuring resin, the photopolymerization initiator, the superfine synthetic barium sulfate and the organic dye is more than 35 ℃.
2. The ink-jet printing etching-resistant ink as claimed in claim 1, wherein the etching-resistant ink has a dynamic viscosity of 50cps or less at 25 ℃.
3. The ink-jet printing etching-resistant ink as claimed in claim 1, wherein the photosensitive functional material is one or more of N, N-diethyl acetoacetamide, N-diethyl acetoacetamide polymer and o-nitrobenzyl acrylate.
4. The ink-jet printing etching-resistant ink as claimed in claim 1, wherein the temperature-sensitive monomer is one or more of N-isopropylacrylamide, dimethylaminoethyl methacrylate, oligo (ethylene glycol) methyl ether methacrylate, N-vinylcaprolactam, methyltetrahydrofuran methacrylamide and methyltetrahydrofuran acrylamide.
5. The ink-jet printing etching-resistant ink as claimed in claim 1, wherein the photo-curable resin is a photo-curable resin containing an acryloyl group, a carboxyl group or an epoxy group in a molecule.
6. The ink-jet printing etching-resistant ink as claimed in claim 5, wherein the photo-curing resin is one or a combination of more of 2-acryloyl-methyl propane sulfonic acid epoxy resin, polyurethane acrylic resin, methacrylate and special acrylate oligomer, the molecule of which contains acryloyl; the light-cured resin containing carboxyl in the molecule is maleic anhydride copolymer resin; the light-cured resin containing epoxy groups in molecules is one or a combination of bisphenol A epoxy acrylate, acrylate epoxy resin, phenol novolac epoxy resin, o-cresol novolac epoxy resin and bisphenol F type epoxy resin.
7. The ink-jet printing etching-resistant ink as claimed in claim 1, wherein the photopolymerization initiator is one or more selected from hydroxy ketone derivatives, amino ketone derivatives and acyl phosphorus oxides.
8. The ink-jet printing etching-resistant ink as claimed in claim 1, wherein the ultrafine synthetic barium sulfate is barium sulfate with a D50 particle size less than or equal to 100 nm.
9. An ink-jet printing etch-resistant ink as claimed in claim 1, wherein said organic dye is one of oil-soluble green, oil-soluble blue and oil-soluble yellow dyes.
10. An ink-jet printed etch-resistant ink as claimed in any one of claims 1 to 9 for use in ink-jet printing to form a circuit pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111501060.8A CN113956715A (en) | 2021-12-10 | 2021-12-10 | Anti-etching ink for ink-jet printing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111501060.8A CN113956715A (en) | 2021-12-10 | 2021-12-10 | Anti-etching ink for ink-jet printing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113956715A true CN113956715A (en) | 2022-01-21 |
Family
ID=79473106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111501060.8A Pending CN113956715A (en) | 2021-12-10 | 2021-12-10 | Anti-etching ink for ink-jet printing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113956715A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101762970A (en) * | 2008-12-25 | 2010-06-30 | 东京应化工业株式会社 | Manufacturing method of etched substrate and light-sensitive resin composition |
| US20110236647A1 (en) * | 2008-06-05 | 2011-09-29 | Sakata Inx Corp. | Photocurable inkjet printing ink composition and print |
| JP2016102138A (en) * | 2014-11-27 | 2016-06-02 | 互応化学工業株式会社 | Ultraviolet-curable composition for inkjet etching resist |
| CN107629552A (en) * | 2017-10-30 | 2018-01-26 | 赵金泉 | Temperature becomes photosensitive-ink and preparation method thereof, antifalsification label and preparation method thereof |
| CN109180860A (en) * | 2018-07-27 | 2019-01-11 | 深圳大学 | A kind of polymer-based nano gel and preparation method and application |
| CN112625504A (en) * | 2020-12-29 | 2021-04-09 | 江苏海田电子材料有限公司 | Anti-etching ink for ink-jet printing |
-
2021
- 2021-12-10 CN CN202111501060.8A patent/CN113956715A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110236647A1 (en) * | 2008-06-05 | 2011-09-29 | Sakata Inx Corp. | Photocurable inkjet printing ink composition and print |
| CN101762970A (en) * | 2008-12-25 | 2010-06-30 | 东京应化工业株式会社 | Manufacturing method of etched substrate and light-sensitive resin composition |
| JP2016102138A (en) * | 2014-11-27 | 2016-06-02 | 互応化学工業株式会社 | Ultraviolet-curable composition for inkjet etching resist |
| CN107629552A (en) * | 2017-10-30 | 2018-01-26 | 赵金泉 | Temperature becomes photosensitive-ink and preparation method thereof, antifalsification label and preparation method thereof |
| CN109180860A (en) * | 2018-07-27 | 2019-01-11 | 深圳大学 | A kind of polymer-based nano gel and preparation method and application |
| CN112625504A (en) * | 2020-12-29 | 2021-04-09 | 江苏海田电子材料有限公司 | Anti-etching ink for ink-jet printing |
Non-Patent Citations (2)
| Title |
|---|
| 林昕等: "光响应温敏嵌段共聚物的合成及其低临界溶解温度的后调控研究", 《厦门大学学报(自然科学版)》 * |
| 许明标等: "《聚合物在油气田开采中的应用》", 31 January 2010 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0659039B1 (en) | Process for producing a printed wiring board making use of an ultraviolet-curing composition | |
| CN101103057B (en) | Curable resin composition for ink-jet printing, cured object obtained therefrom, and printed wiring board using the same | |
| TWI420239B (en) | Improved hot melt compositions | |
| CN108359312B (en) | High-temperature-resistant UV-LED ink-jet printing solder resist ink and preparation method and application thereof | |
| CN101415502B (en) | Process for creating a pattern on a copper surface | |
| CN111073388B (en) | High-flexibility white hole plugging ink and preparation method thereof | |
| GB2419238A (en) | Process for making a PCB | |
| WO2002046323A2 (en) | Uv curable ink-jet legend ink for printing on printed circuit boards | |
| CN112011223A (en) | UV (ultraviolet) curing spray printing ink for filling PCB (printed circuit board) substrate and PCB | |
| CN113025114A (en) | Drilling ink and application thereof | |
| CN106905759B (en) | Photocuring printing ink resistant to gold-plating liquid medicine and application thereof | |
| CN112063226A (en) | Photocuring PCB circuit board protective ink | |
| CN113956715A (en) | Anti-etching ink for ink-jet printing | |
| CN101432375A (en) | Paste composition for printing | |
| WO2008156523A1 (en) | Uv inkjet resist | |
| US7314573B2 (en) | Plating process | |
| CN109486283A (en) | The anti-etching ink jet ink composition of radical cation hybrid UV-curing | |
| CN106433294A (en) | Tin-coating-resistant and welding-resistant material and preparation method thereof | |
| CN113480892A (en) | Etching-resistant ink-jet ink and preparation method thereof | |
| CN112020234A (en) | Preparation method of PCB and PCB | |
| CN114686041A (en) | UV (ultraviolet) curing character printing ink and preparation method thereof | |
| JPS63252777A (en) | Resist pattern forming method | |
| JPS63264686A (en) | Resist ink | |
| CN111796483B (en) | Resin composition, mixture, dry film resist and corresponding element | |
| CN114716868B (en) | Photo-curing ink for printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |