CN1139492C - Single-spar making method of ink jet printing head wafer and ink jet printing head - Google Patents

Single-spar making method of ink jet printing head wafer and ink jet printing head Download PDF

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Publication number
CN1139492C
CN1139492C CNB981183972A CN98118397A CN1139492C CN 1139492 C CN1139492 C CN 1139492C CN B981183972 A CNB981183972 A CN B981183972A CN 98118397 A CN98118397 A CN 98118397A CN 1139492 C CN1139492 C CN 1139492C
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China
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ink
printing head
jet printing
polymer material
material layer
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CN1245753A (en
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胡纪平
吴义勇
蓝元亮
赖怡绚
王惠芳
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Institute for Information Industry
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Industrial Technology Research Institute ITRI
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Abstract

The present invention relates to a method for making a single spar of a wafer of an ink jet print head and an ink jet print head. After a thick film or a thick dry film layer are deposited on an ink jet wafer with a braking element, an ink chamber zone is not first etched, but a jet hole sheet layer which serves as a jet hole sheet is first deposited. The jet hole sheet layer is made form material with high molecules, which has the similar expansion coefficient to the material of the thick film or the dry film layer, which serves as an obstruction layer. Then, jet holes are etched in the jet hole sheet layer, and simultaneously the jet hole sheet is formed.

Description

The single-spar making method of crystal wafer for ink jet printing head and ink-jet printing head
The present invention relates to a kind of ink-jet printer, the single-spar making method and the ink-jet printing head of crystal wafer for ink jet printing head in particularly a kind of ink-jet printer.
Ink-jet printer (ink-jet printer) is subjected to using very widely on present market.The braking member (transducer) of ink in the ink gun in process seal head, as heater (heater), the ink heating evaporation is become ink droplet, and thermal power transfer is become kinetic energy, make ink droplet to spray the work of finishing printing by the spray orifice between spray nozzle sheet.Penetrate in formula (top shooter) ink-jet printing head at existing face, the making of its spray nozzle sheet needs extra spray nozzle sheet element to be fitted on the ink jet crystal plate.
Existing correlation technique is just like United States Patent (USP) the 4th, 913, No. 405 utilize radium-shine processing (laser cutting) method, and as United States Patent (USP) the 4th, 791, No. 436 electroforming (electroforming) production method that utilizes is made spray nozzle sheet.Shown in Figure 1 is existing spray nozzle sheet to be fitted in a kind of schematic diagram on the ink jet crystal plate, and the ink-jet printing head among the figure comprises crystal wafer for ink jet printing head 10, and there are braking member (transducer) 12 and barrier layer (barrier layer) 14 in its top.Braking member 12 is the elements that a kind of physical quantity converted to another kind of physical quantity, it can be heating element heater (heater) or piezoelectricity (piezoelectric) element, for to convert heat energy or strain energy to kinetic energy, make evaporation of ink in the ink container become ink droplet and spray orifice ejection from spray nozzle sheet at this.Inkjet plate 16 is extra element,, and above inkjet plate, exerts pressure or heats along applying direction 20 in the mode of fitting with direction 22, or pressurized, heated simultaneously, make inkjet plate 16 paste on barrier layer 14.So far, just form whole ink-jet printing head.Each braking member 12 must accurately be aimed at a spray orifice 18 as can be seen from Figure 1.
Yet the spray nozzle sheet after the processing may be in manufacture process, as radium-shine processing or electroforming mode, cause residual residual stress down on the spray nozzle sheet, makes that spray nozzle sheet is crooked and can not use.In addition, in the process of fitting, if the pressure of pressurization is crossed and may well be caused the barrier layer distortion and can't fit; Too small if exert pressure, then can make spray nozzle sheet come off easily again and cause mixed color phenomenon.Moreover metal spray nozzle sheet and barrier layer expansion coefficient difference between the two is big.Ceng Yinwei is subjected to heat problem to make metal spray nozzle sheet and barrier layer interface easy deformation and peeling off between the two during the life cycle of ink-jet printing head.
In sum, existing spray nozzle sheet coating technique needs extra alignment procedures to make to aim between spray orifice and the brake.Spray nozzle sheet can't guarantee that during fabrication each spray nozzle sheet of being produced can not be out of shape.This all can cause the increase of production cost and reduce the competitiveness of product.
Moreover metal spray nozzle sheet and barrier layer expansion coefficient difference between the two greatly also causes the service life of ink-jet printing head too short, needs often to change ink gun.
Therefore main purpose of the present invention is to provide a kind of single-spar making method of crystal wafer for ink jet printing head, and it is a kind of single wafer process technology, and spray nozzle sheet does not need other manufacturing, so be suitable for producing to reduce cost in a large number.
Another object of the present invention is to provide a kind of single-spar making method of crystal wafer for ink jet printing head, it directly finishes spray nozzle sheet on crystal wafer for ink jet printing head, so the attached outstanding power of spray nozzle sheet is preferable, and does not have excessive with the not enough problem of pressurization.
A further object of the present invention is to provide a kind of single-spar making method and ink-jet printing head of crystal wafer for ink jet printing head, therefore the coefficient of expansion of employed material of its spray nozzle sheet and barrier layer is close, does not have metal spray nozzle sheet and barrier layer interface easy deformation and the problem peeled off between the two.
The object of the present invention is achieved like this, a kind of single-spar making method of crystal wafer for ink jet printing head promptly is provided, be used on the ink jet crystal plate with several braking members, described manufacture method comprises: form one first polymer material layer in described ink jet crystal plate top, as the ink barrier layer; Form one second polymer material layer, in described first polymer material layer top, as the spray orifice lamella of described ink-jet printing head; The described spray orifice lamella that etching is positioned at described braking member top forms ink chamber to form several spray orifices and etching.
The present invention also provides a kind of single-spar making method of crystal wafer for ink jet printing head, is used on the ink jet crystal plate with several braking members, and described manufacture method comprises: form one first polymer material layer in described ink jet crystal plate top, as the ink barrier layer; Define several ink chamber and ink channel pattern on described first polymer material layer; Form one second macromolecular material in described first polymer material layer top, as the spray orifice lamella of described ink-jet printing head, the material coefficient of expansion of described second and first polymer material layer is close; Etching is positioned at the described spray orifice lamella of described braking member top to form several spray orifices; Etching forms described ink chamber and ink channel.
The present invention also provides a kind of ink-jet printing head, and it comprises: a crystal wafer for ink jet printing head, and it has braking member; One ink barrier layer is made of one first macromolecular material, is positioned at described crystal wafer for ink jet printing head top, and forms several ink chamber; One spray nozzle sheet is made of one second macromolecular material, lays respectively at the top of described barrier layer, and the coefficient of expansion of described second macromolecular material and first macromolecular material is approaching.
Below in conjunction with accompanying drawing, embodiments of the invention are described, wherein:
Fig. 1 is the schematic diagram of prior art;
Fig. 2 A is a manufacturing flow chart according to a preferred embodiment of the present invention to 2E.
The present invention makes the spray nozzle sheet of ink-jet printing head for a kind of single stone technology of single processing procedure.One contain on the ink jet crystal plate of braking member deposition one thick film or universe thickness layer after, do not etch the ink chamber zone earlier, and earlier deposition one deck as the spray orifice lamella of the usefulness of spray nozzle sheet.Simultaneously, this spray orifice lamella uses the material that the close coefficient of expansion is arranged with the material as the thick film of the usefulness of barrier layer or universe thickness layer.Afterwards, just etch spray orifice, and form spray nozzle sheet simultaneously at the spray orifice lamella.Below just describe the manufacture method of spray nozzle sheet in the ink-jet printing head of the present invention in detail with an embodiment.
Please refer to Fig. 2 A to shown in the 2E according to the manufacturing flow chart of the spray nozzle sheet of a kind of ink-jet printing head of one embodiment of the invention.
Because the present invention is spray nozzle sheet emphatically, so the detailed construction of crystal wafer for ink jet printing head is not drawn among the figure.This method for making is applicable to various ink-jet printing head.
At first please refer to Fig. 2 A, above a crystal wafer for ink jet printing head 200, has braking member 202, wherein braking member 202 is for converting a kind of physical quantity to the element of another kind of physical quantity, it can be heating element heater (heater) or piezoelectric element, converts heat energy or strain energy to kinetic energy at this and makes the spray orifice ejection of ink droplet from spray nozzle sheet with the ink in the pressurized ink groove.Deposition one deck is as the thick film photoresistance or the universe rete 204 of barrier layer and sacrifice layer on whole crystal wafer for ink jet printing head 200, it is used for forming ink chamber and ink barrier layer, and its material matter is the photosensitive polymer material, and its deposit thickness approximately between 5 μ m between the 200 μ m.
Then please refer to Fig. 2 B.Come with light shield 206 pattern that defines ink chamber and ink channel zone 204a and ink barrier layer 204b that on barrier layer 204, exposes.At this, thick film photoresistance 204 can adopt positive photoresistance or negative photoresistance.When using positive photoresistance, ink chamber and ink channel zone 204a are the exposure area; And when photoresistance was born in use, ink chamber and ink channel zone 204a were unexposed area.
Please refer to Fig. 2 C, after exposure imaging defines the pattern of ink chamber and ink channel zone 204a and ink barrier layer 204b, just on thick film photoresistance 204, cover the spray orifice lamella 208 of one deck as spray nozzle sheet.This spray orifice lamella 208 uses macromolecular material, as pi (polyimide), polystyrene (polystyrene), Merlon (polycarbonate), polymethyl methacrylate (polymethylmethaerylate), epoxides (epoxy), phenolic resins (novolac), polyester (polyester) and polysulfones materials such as (polysulfone).And its deposit thickness between about 5 μ m between the 200 μ m.What pay special attention to is that spray orifice lamella 208 is close with the coefficient of expansion of thick film photoresistance 204 two-layer employed macromolecular materials, therefore when ink-jet printing head is heated, spray orifice lamella 208 can not differ too many with the expansion of thick film photoresistance 204 each other with contraction, thereby can not cause the situation of peeling off that takes place between the two-layer interface as prior art.
Then please refer to Fig. 2 D, the spray orifice lamella 208 above braking member 202 etches spray orifice 212, makes ink chamber and ink channel zone 204a come out, and forms spray nozzle sheet 210 simultaneously.In this step, can utilize as technology such as universe formula etching method, wet etching and radium-shine processing spray orifice 212 etchings are come out.
Please refer to Fig. 2 E, ink chamber that will expose and ink channel zone 204a remove the photoresistance among ink chamber and the ink channel zone 204a with the developer of thick film photoresistance or universe film, and braking member 202 is come out, and so far finish the manufacturing of whole ink-jet printing head.
Therefore, feature of the present invention is with single manufacturing process technology spray nozzle sheet directly to be finished on crystal wafer for ink jet printing head, and it not only exempts extra spray nozzle sheet manufacturing step, and the tack of spray nozzle sheet is also preferable.
Another feature of the present invention is that the material of spray nozzle sheet and barrier layer is the close macromolecular material of the coefficient of expansion, so do not have the shortcoming of peeling off easily when being heated.
A feature more of the present invention is single processing procedure mode, so method of the present invention is applicable to batch process, therefore more can reduce manufacturing cost.

Claims (28)

1. the single-spar making method of a crystal wafer for ink jet printing head is used on the ink jet crystal plate with several braking members, it is characterized in that described manufacture method comprises: form one first polymer material layer in described ink jet crystal plate top, as the ink barrier layer; Form one second polymer material layer, in described first polymer material layer top, as the spray orifice lamella of described ink-jet printing head; The described spray orifice lamella that etching is positioned at described braking member top forms ink chamber to form several spray orifices and etching.
2. the method for claim 1 is characterized in that, described first macromolecular material is a photosensitive material.
3. method as claimed in claim 2 is characterized in that, described photosensitive material is the thick film photoresistance.
4. method as claimed in claim 2 is characterized in that, described photosensitive material is a universe film.
5. the method for claim 1 is characterized in that, described first and second polymer material layer forms with the rotation coating method.
6. the method for claim 1 is characterized in that, described first and second polymer material layer forms in the roll extrusion mode.
7. the method for claim 1 is characterized in that, the material coefficient of expansion of described first and second polymer material layer is close.
8. the method for claim 1, it is characterized in that described second polymer material layer is for being selected from the material in the set that is made of pi (polyimide), polystyrene (polystyrene), Merlon (polycarbonate), polymethyl methacrylate (polymethylmethacrylate), epoxides (epoxy), phenolic resins (novolac), polyester (polyester) and polysulfones (polysulfone).
9. the method for claim 1 is characterized in that, described spray orifice is processed to form with radium-shine.
10. the method for claim 1 is characterized in that, described spray orifice forms with the etching of universe formula.
11. the method for claim 1 is characterized in that, described spray orifice forms with Wet-type etching.
12. the single-spar making method of a crystal wafer for ink jet printing head is used on the ink jet crystal plate with several braking members, it is characterized in that described manufacture method comprises: form one first polymer material layer in described ink jet crystal plate top, as the ink barrier layer; Define several ink chamber and ink channel pattern on described first polymer material layer; Form one second macromolecular material in described first polymer material layer top, as the spray orifice lamella of described ink-jet printing head, the material coefficient of expansion of described second and first polymer material layer is close; Etching is positioned at the described spray orifice lamella of described braking member top to form several spray orifices; Etching forms described ink chamber and ink channel.
13. method as claimed in claim 12 is characterized in that, described first macromolecular material is a photosensitive material.
14. method as claimed in claim 13 is characterized in that, described photosensitive material is from positive photoresistance form and negative photoresistance form alternatively.
15. method as claimed in claim 13 is characterized in that, described photosensitive material is the thick film photoresistance.
16. method as claimed in claim 13 is characterized in that, described photosensitive material is a universe film.
17. method as claimed in claim 12, it is characterized in that described second polymer material layer is the material that is selected from the set that is made of pi, polystyrene, Merlon, polymethyl methacrylate, epoxides, phenolic resins, polyester and polysulfones.
18. method as claimed in claim 12 is characterized in that, described first and second polymer material layer forms with the rotation coating method.
19. method as claimed in claim 12 is characterized in that, described first and second polymer material layer forms in the roll extrusion mode.
20. method as claimed in claim 12 is characterized in that, the thickness of described first polymer material layer between 5 μ m between the 200 μ m.
21. method as claimed in claim 12 is characterized in that, the thickness of described second polymer material layer between 5 μ m between the 200 μ m.
22. method as claimed in claim 12 is characterized in that, described spray orifice is processed to form with radium-shine.
23. method as claimed in claim 12 is characterized in that, described spray orifice forms with the etching of universe formula.
24. method as claimed in claim 12 is characterized in that, described spray orifice forms with Wet-type etching.
25. an ink-jet printing head is characterized in that it comprises: a crystal wafer for ink jet printing head, it has braking member; One ink barrier layer is made of one first macromolecular material, is positioned at described crystal wafer for ink jet printing head top, and forms several ink chamber; One spray nozzle sheet is made of one second macromolecular material, lays respectively at the top of described barrier layer, and the coefficient of expansion of described second macromolecular material and first macromolecular material is approaching.
26. ink-jet printing head as claimed in claim 25 is characterized in that, described first macromolecular material is a photosensitive material.
27. ink-jet printing head as claimed in claim 26 is characterized in that, described photosensitive material is the thick film photoresistance.
28. ink-jet printing head as claimed in claim 25, it is characterized in that described second polymer material layer is the material that is selected from the set that is made of pi, polystyrene, Merlon, polymethyl methacrylate, epoxides, phenolic resins, polyester and polysulfones.
CNB981183972A 1998-08-21 1998-08-21 Single-spar making method of ink jet printing head wafer and ink jet printing head Expired - Fee Related CN1139492C (en)

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CNB981183972A CN1139492C (en) 1998-08-21 1998-08-21 Single-spar making method of ink jet printing head wafer and ink jet printing head

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KR100474423B1 (en) 2003-02-07 2005-03-09 삼성전자주식회사 bubble-ink jet print head and fabrication method therefor
TW580436B (en) 2003-06-27 2004-03-21 Benq Corp Ink-jet micro-injector device and fabrication method thereof

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