CN113928655B - Control method applied to efficient transmission monitoring device for anti-static packaging of circuit board - Google Patents
Control method applied to efficient transmission monitoring device for anti-static packaging of circuit board Download PDFInfo
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- CN113928655B CN113928655B CN202111149292.1A CN202111149292A CN113928655B CN 113928655 B CN113928655 B CN 113928655B CN 202111149292 A CN202111149292 A CN 202111149292A CN 113928655 B CN113928655 B CN 113928655B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B57/00—Automatic control, checking, warning, or safety devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B57/00—Automatic control, checking, warning, or safety devices
- B65B57/10—Automatic control, checking, warning, or safety devices responsive to absence, presence, abnormal feed, or misplacement of articles or materials to be packaged
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/001—Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing
- G01R31/002—Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing where the device under test is an electronic circuit
Abstract
The invention belongs to the field of circuit boards, and particularly relates to a control method of an efficient transmission monitoring device applied to anti-static packaging of a circuit board, which comprises the following steps: acquiring information of a circuit board to be packaged on a production line; and training an anti-static result prediction model according to the packaging history condition table by an SVM classification algorithm, acquiring circuit board information of a packaging circuit board to be transmitted when the circuit board to be packaged needs to be packaged and transmitted, and selecting packaging parameters for packaging on the premise of achieving good anti-static effect by combining with the demand condition.
Description
[ technical field ] A
The invention relates to the field of circuit boards, in particular to a control method of an efficient transmission monitoring device applied to anti-static packaging of a circuit board.
[ background of the invention ]
The circuit board is an article formed by fixing a fixed circuit on a plate or a flexible material, and plays a role in mass production of electric appliances.
Due to the structure of the circuit board, the circuit board is easy to damage under the adverse environment, and the element is more and more sensitive to the damage of electrostatic discharge due to the development of new technology; losses due to electrostatic discharge can reach over several million dollars per year; the circuit board has the characteristics of high density and high precision, and the trend circuit board is more sensitive in the future, the electromagnetic induction between the circuit boards can cause static accumulation, the energy of electrostatic discharge pulse of electronic components of the circuit board can cause heating, and even weak voltage can also breakdown the components to cause the damage of the components; therefore, a control method applied to the efficient transmission monitoring device for the anti-static package of the circuit board is provided for solving the above problems.
[ summary of the invention ]
In order to make up for the deficiency of the prior art, solve because of the structure reason of the breadboard itself, when in the unfavorable environment, cause the damage of the breadboard very easily, because the development of the new technology causes the component to be more and more sensitive to the damage of the electrostatic discharge; losses due to electrostatic discharge can reach over several million dollars per year; the invention has the characteristics of high density and high precision, and solves the mechanism problems that the circuit boards are more sensitive in the future, the electromagnetic induction between the circuit boards can cause static accumulation, the energy of electrostatic discharge pulse of electronic components of the circuit boards can cause heating, and even weak voltage can also breakdown the components to cause component damage.
The technical scheme adopted by the invention for solving the technical problems is as follows: the control method of the high-efficiency transmission monitoring device applied to the anti-static packaging of the circuit board comprises the steps of improving the transmission efficiency of the circuit board and preventing the circuit board from being in electrostatic contact in the packaging process.
Preferably, the impedance amount of the circuit board, the information of the circuit board, the transmission distance, the anti-static effect, the packaging mode, the packaging material and the data of whether the anti-static effect is good or not are used for establishing a packaging history condition table and passing the packaging history condition table; changing packaging parameters corresponding to the circuit board information with poor anti-static effect after packaging by combining a clustering algorithm and an image similarity method, and updating the packaging historical condition table again according to the result;
preferably, the anti-static result prediction model is trained according to the packaging history condition table through an SVM classification algorithm, the input characteristics of the model are packaging parameters and circuit board information of the packaging history condition table, and the output result of model prediction is a packaging anti-static result; when the circuit board to be packaged needs to be packaged and transmitted, the circuit board information of the packaging circuit board to be transmitted is acquired, the packaging parameters are determined according to the requirement condition on the premise that the anti-static effect is good, the anti-static packaging efficient transmission monitoring device is controlled, and the determined packaging parameters are utilized for packaging.
Preferably, the information of the circuit board includes: the type of the circuit board, the image of the circuit board and the contact position of the circuit board;
the types of the circuit board include: a rigid wiring board and a flexible wiring board;
image of the circuit board: the size of the circuit board, the existence of components on the circuit board, the pitch of the circuit board with the components and the arrangement direction of the circuit board;
the circuit board component comprises: the method comprises the following steps: electrostatic discharge sensitive components and electrostatic discharge insensitive components; the printing version number comprises: integrating voltage stabilization ICs and voltage transformation ICs; the pitch of the circuit board is as follows: the distance between the parts of the circuit board on which the components are arranged;
the circuit board placing direction is as follows: one surface on which the components are mounted and one surface on which the components are not mounted;
the circuit board image is obtained through machine vision system image processing in artificial intelligent computer vision;
the contact position of the circuit board is obtained by two categories:
a, detecting common circuit boards of different types by a camera target;
b, customizing circuit boards of different types, and extracting image features of the circuit boards through an image recognition technology to obtain the internal features of the circuit boards:
the internal features include: line width and line distance, and contact position;
sending and storing the circuit board information into a database of an industrial personal computer;
preferably, the impedance of the circuit board is detected by using a loop resistance tester in combination with the antistatic parameters of the circuit board, and the transmission pitch within the tolerance range +/-10% of the impedance is obtained to obtain the critical value of the transmission pitch, wherein the transmission pitch parameters include: critical values of the same type and different placing directions, which do not cause electromagnetic induction, and critical values of the different type and different placing directions, which do not cause electromagnetic induction; the transmission distance parameters between the circuit boards are preset or generated at any time, and correspond to different parameters according to different circuit board information.
Preferably, prevent static contact effect, through electron beam induced current measuring device, acquire electromagnetic induction numerical value, obtain the packing result, judge whether the circuit board has static contact, specifically include: training a circuit board static detection model, obtaining a packed circuit board, obtaining an induced current value through an electron beam induced current measuring device, judging that the anti-static effect is not good if the induced current value exists, and judging that the anti-static effect is good if the induced current value does not exist; the judging the electrostatic effect includes: constructing an induced current model; calculating the induced current of the circuit board according to the induced current model to obtain a calculated value; measuring an actual value by using an electron beam induced current measuring device; obtaining the distribution characteristics of the induction current according to the induction current model; judging whether each numerical value is greater than or equal to the maximum limit value of the induction current, if the numerical value is less than or equal to the maximum limit value, the anti-static effect is good, and if the numerical value is greater than the maximum limit value, the anti-static effect does not meet the requirement;
the electron beam induced current measurement specifically comprises: and collecting an electron beam induced current signal to obtain IV curve information, and detecting to obtain an electromagnetic induction value.
Preferably, the circuit board image set is clustered by using a neighbor domain algorithm to obtain K circuit board image cluster clusters and K cluster centers corresponding to the K circuit board image cluster clusters, wherein K is a natural number; calculating the similarity of the circuit board images and each clustering center, and dividing the circuit board images into circuit board image clustering clusters corresponding to the clustering centers with the highest similarity with the circuit board images; updating the clustering centers of the K circuit board image clustering clusters; obtaining the circuit board information data with the poor packing effect, determining the packing parameters of the circuit board with the poor packing effect, calculating the similarity of the circuit board image in the circuit board information with the circuit board information in each other circuit board image cluster, and judging whether the clustering center of each circuit board image cluster meets the preset convergence condition or not: if the image similarity is within a first threshold value, packing the circuit board within the obtained transmission distance range; when a new circuit board exists, calculating the similarity between the circuit board image and each other circuit board image in the circuit board information and packaging condition history table, and when other circuit board images with the similarity higher than a first threshold cannot be found, acquiring other circuit board images with the highest similarity, and executing steps S21-S22 on the other circuit board images;
preferably, the anti-static result prediction model is trained according to the packaging historical condition table through an SVM classification algorithm, the input characteristics of the model are packaging parameters and circuit board information of the packaging historical condition table, and the output result of model prediction is a packaging anti-static result; wherein 90% of the data of the packaging historical condition table is used as a training set, and 10% of the data is used as a test set;
preferably, when waiting that the packing circuit board need pack the conveying, acquire wait to convey the circuit board information of packing circuit board, combine the demand condition, under the good prerequisite of antistatic effect, select the packing parameter and pack, specifically include:
traversing the packaging history condition table, obtaining n pieces of circuit board information with the highest similarity with the circuit board information of the circuit board to be packaged in the packaging history condition table and n pieces of packaging parameters corresponding to the n pieces of circuit board information, sending each packaging parameter in the n pieces of packaging parameters into the anti-static result prediction model in combination with the circuit board information of the circuit board to be packaged, and keeping k packaging parameters with good anti-static effect as candidate packaging parameter sets, wherein k < = n.
The demand situation includes:
A. the packaging strategy in packaging comprises the following steps: judging whether the circuit board is a circuit board with components or a circuit board without components according to the circuit board information acquired by image recognition, and forming a stacking and packaging mode of components-without components-with components when the circuit board with components and the circuit board without components are packaged together; when circuit boards with components are packaged, when the circuit board information is given to a common circuit board, the distribution condition of the components is obtained according to the circuit board information, the X axis and the Y axis of the two circuit board components are determined by image recognition, the fit degree between the two circuit boards is determined by virtual assembly, the fit degree is the density which is staggered and does not rub between the components, the fit degree is 100%, the component distribution area is staggered according to the X axis and the Y axis of the components, a packaging mode that the two circuit board components with the components face towards each other is adopted, when the fit degree is less than 100% or the circuit board with special requirements, the circuit boards of the components face upwards and are packaged at intervals of a foam board; when all circuit boards without components are packed together, directly packing the circuit boards;
B. the packaged circuit board in the shortest time comprises: when the information of the circuit board to be packaged is identified by the image, no component exists, the electromagnetic induction value detection step is directly skipped, the shortest transmission interval is selected in the packaging parameter set for transmission and packaging, and when the component exists, the component is packaged according to the steps of S2-S3;
C. the range protection to key components includes: 1: using an end-to-end network model to determine dense areas of components in a circuit board image, 2: constructing key component characteristics of the key component dense area by utilizing a deep neural network to perform self-adaptive characteristic extraction, and 3: and extracting key components and the areas thereof by using a multi-layer pyramid-based feature extraction algorithm. 4: and (5) making adjustment of packaging parameters for the extracted areas, and packaging the areas with more materials when packaging the areas, and returning to the steps S22-S23 for packaging.
Preferably, after the circuit board is packaged and delivered from the factory, whether the circuit board is damaged or not is detected, damaged circuit board information of the component is obtained, and packaging parameters are updated in time, the packaging strategy adopted in packaging is checked through image recognition, a binocular camera is arranged above the transmission monitoring device, whether different types of foam boards are arranged on the circuit board or not is recognized, the foam boards serve as target detection objects of the binocular camera, when the foam boards are detected by the binocular camera, the circuit board stacking and packaging mode is a circuit board with the component, the foam board with the component, the extruded thickness of the target detection objects is measured through an image target detection technology, the material type of the foam boards is adjusted according to the extruded thickness, the foam boards are recognized to be embedded, materials of the foam boards are changed, the packaging parameters are updated, and the circuit board damage caused in the transportation process is classified; identifying that the circuit board is not embedded into the foam board, wherein the extruded thickness of the foam board is more than fifty percent of the natural state of the original foam board, changing the material of the foam board, updating the packing parameters, and classifying the circuit board damage caused in the transportation process; when the existence of the foam board is not detected, the method is a stacking and packaging mode of a circuit board with components, a circuit board without components and a circuit board with components, or a stacking and packaging mode of a circuit board with components and a circuit board with components, and is classified into a mode of circuit board damage caused by problems in the packaging stage, information of the circuit board with components in the stacking and packaging mode of the circuit board with components, the circuit board without components and the circuit board with components is identified by images, the circuit board information with the problem of electrostatic damage is written into a database, packaging parameters are updated, and then the stacking and packaging mode of the circuit board with components, the circuit board without components, the foam board with components and the circuit board with components is adopted; the stacking and packaging mode of the components and the circuit boards with the components is adopted, the distribution area of the components is determined, whether damaged components are staggered or not is verified, according to a distance measuring and calculating method, four parameters are respectively specified as x1, x2, y1 and y2, the unit is mm, the x1, x2, y1 and y2 are respectively the distance from the original point of the components to the four sides of the rectangle of the circuit boards, the accurate positions of the components are determined, the positions of the circuit boards and the components relative to the components are consistent, the information of the bonding degree of the two circuit boards and the components is modified to be less than 100%, packaging parameters are updated, then adopting a stacking and packaging mode of a circuit board with components, a foam board and a circuit board with components, wherein the positions of the components of the two circuit boards are not consistent, adopting a stacking and packaging mode of a circuit board with components, a circuit board without components and a circuit board with components to detect whether electrostatic damage exists, if no electrostatic damage exists, updating packaging parameters, then adopting a stacking and packaging mode of a circuit board with components, a circuit board without components and a circuit board with components, if the stacking and packaging mode has electrostatic damage, then adopting a stacking and packaging mode of a circuit board with components, a foam board and a circuit board with components.
The invention has the advantages that:
1. according to the invention, through the structural design of the packing device and the electron beam induced current device, the functions of preventing the circuit board from electrostatic contact, saving packing materials and time for conveying the circuit board are realized, the problem of electrostatic contact damage in the process of conveying and packing the circuit board is solved, and the conveying efficiency of the circuit board is improved;
2. according to the invention, through the structural design of the fixed base, the rotating support shaft, the conveyor belt, the driving wheel, the driving motor, the automatic packaging machine, the horizontal baffle plate, the vertical baffle plate, the rotating motor, the monitoring cover, the slide rail, the first slide block, the electron beam induced current measuring machine, the second slide block, the laser engraving machine, the third slide block, the vision sensor and the industrial personal computer, the placing direction of the circuit board is controlled, the circuit board is packaged and electromagnetic induction data of the circuit board is detected, so that the function of the transmission distance of the circuit board is controlled, the problems that the traditional packaging equipment is only packaged, the electrostatic discharge pulse energy of electronic components is easy to cause heating, and the components are broken even by weak voltage, so that the components are damaged are solved, and the safety and the efficiency of packaging the circuit board are improved.
[ description of the drawings ]
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
FIG. 1 is a schematic sectional view of the first embodiment in front view;
FIG. 2 is a schematic top view of a cross-sectional structure according to a first embodiment;
FIG. 3 is a schematic side view of the first embodiment;
FIG. 4 is a partial perspective view of the first embodiment;
fig. 5 is a schematic rear view structure diagram of the second embodiment.
In the figure: 1. a fixed base; 2. rotating the support shaft; 3. a conveyor belt; 4. a drive wheel; 5. a drive motor; 6. an automatic packing machine; 7. a horizontal baffle; 8. a vertical baffle; 9. rotating the motor; 10. a monitoring shield; 11. a slide rail; 12. a first slider; 13. an electron beam induced current measuring machine; 14. a second slider; 15. a laser engraving machine; 16. a third slider; 17. a vision sensor; 18. an industrial personal computer; 19. a harness slot; 20. and a roller.
[ detailed description ] embodiments
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
S1: and acquiring the information of the circuit board to be packaged on the production line.
Obtaining circuit board information on a production line, wherein the circuit board information comprises: the type of the circuit board, the image of the circuit board and the contact position of the circuit board;
the types of the circuit board include: rigid circuit boards and flexible circuit boards;
image of the circuit board: the size of the circuit board, the existence of components on the circuit board, the pitch of the circuit board with the components and the arrangement direction of the circuit board;
the circuit board component includes: electrostatic discharge sensitive components and electrostatic discharge insensitive components; the printing version number comprises: integrating voltage-stabilizing ICs and voltage-transforming ICs; the circuit board placing direction is as follows: one surface on which components are mounted and one surface on which components are not mounted;
the circuit board image is obtained through machine vision system image processing in artificial intelligent computer vision;
the contact position of the circuit board is obtained by two categories:
a, detecting common circuit boards of different types by a camera target;
b, customizing different types of circuit boards, and extracting image features of the circuit boards through an image recognition technology to obtain the internal features of the circuit boards.
The internal features include: line width and line distance, and contact position;
sending and storing the circuit board information into a database of an industrial personal computer;
s2: detecting the impedance of the circuit board by using a loop resistance tester according to the information of the circuit board and in combination with the anti-static parameters of the circuit board, and obtaining the transmission distance within the impedance tolerance range +/-10% to obtain the critical value of the transmission distance; the method comprises the following steps:
the transfer pitch parameter includes: a critical value that the transmission intervals in the same type and different placing directions do not cause electromagnetic induction, b critical value that the transmission intervals in the same placing direction and different types do not cause electromagnetic induction, and c critical value that the transmission intervals in different placing directions and different types do not cause electromagnetic induction;
the transmission distance parameters between the circuit boards are preset or generated at any time, and correspond to different parameters according to different circuit board information;
s21: packaging the circuit board within the transmission distance range obtained in the step S2, and adjusting a packaging mode, a transmission distance and packaging materials according to the anti-static parameters;
the packaging mode comprises the following steps: single-channel, double-channel, cross-shaped and multi-channel crossing modes;
the transfer pitch, comprising: the distance between different circuit boards and the same circuit board on the conveyor belt;
the packaging material comprises: the length of the packing belt and the type of the packing belt;
the antistatic parameters further include a packaging strategy under special conditions, and specifically include: acquiring the circuit board information, and acquiring the brittleness of the contact position of the electronic component circuit board in the circuit board information; when the brittleness is larger than a threshold value, the protection is brought to the bundling of a corresponding area by one more layer;
s22: through electron beam induced current measuring device, acquire the electromagnetic induction numerical value, obtain the packing result, judge whether the circuit board has electrostatic contact, specifically include: training a circuit board static detection model, obtaining a packed circuit board, obtaining an induced current value through an electron beam induced current measuring device, judging that the anti-static effect is not good if the induced current value exists, and judging that the anti-static effect is good if the induced current value does not exist;
the judging the electrostatic effect includes: constructing an induced current model; calculating the induced current of the circuit board according to the induced current model to obtain a calculated value; measuring an actual value by using an electron beam induced current measuring device; obtaining the distribution characteristics of the induction current according to the induction current model; judging whether each numerical value is greater than or equal to the maximum limit value of the induction current, if so, indicating that the anti-static effect is good, and if so, indicating that the anti-static effect does not meet the requirement;
the electron beam induced current measurement specifically comprises: and collecting an electron beam induced current signal to obtain IV curve information, and detecting to obtain an electromagnetic induction value.
S23: obtaining data for obtaining whether the impedance quantity of the circuit board, the information of the circuit board, the transmission distance, the anti-static effect, the packaging mode, the packaging material and the anti-static effect are good or not according to the method of the steps s21-s22 for many times, establishing a packaging historical condition table and uploading the packaging historical condition table to a database;
s3: changing packaging parameters corresponding to the circuit board information with poor anti-static effect after packaging through a packaging history condition table in combination with a clustering algorithm and an image similarity method, packaging again by using the same circuit board in combination with the methods of the steps s21-s22, and updating the packaging history condition table again according to the result;
s31: the clustering method and the image similarity method comprise the following steps: clustering the circuit board image set by using a nearest neighbor domain algorithm to obtain K circuit board image cluster clusters and K cluster centers corresponding to the K circuit board image cluster clusters, wherein K is a natural number; calculating the similarity of the circuit board images and each clustering center, and dividing the circuit board images into circuit board image clustering clusters corresponding to the clustering centers with the highest similarity with the circuit board images; updating the clustering centers of the K circuit board image clustering clusters; the method comprises the steps of obtaining circuit board information data with a poor packing effect, determining packing parameters of the circuit board with the poor packing effect, calculating similarity of circuit board images in the circuit board information with the circuit board information, and judging whether a clustering center of each circuit board image clustering cluster meets a preset convergence condition or not according to similarity of each other circuit board images in the circuit board type cluster where the circuit board information is located: if the image similarity is within a first threshold value, packing the circuit board within the obtained transmission distance range; when a new circuit board exists, calculating the similarity between the circuit board image and each other circuit board image in the circuit board information and packaging condition history table, and when other circuit board images with the similarity higher than a first threshold cannot be found, acquiring other circuit board images with the highest similarity, and executing the steps S21-S22 on the other circuit board images;
s32: when a new circuit board exists, calculating the similarity between the circuit board image and each other circuit board image in the circuit board information and packaging condition history table, when other circuit board images with the similarity higher than a first threshold cannot be found, acquiring other circuit board images with the highest similarity, and executing the steps S21-S22 on the other circuit board images;
s4: training an anti-static result prediction model according to the packaging history condition table by an SVM classification algorithm, wherein the input characteristics of the model are packaging parameters and circuit board information of the packaging history condition table, and the output result of model prediction is a packaging anti-static result;
wherein 90% of the data of the packaging historical condition table is used as a training set, and 10% of the data is used as a test set;
s5: when waiting to pack the circuit board and need pack the conveying, acquire wait to transmit the circuit board information of packing circuit board, combine the demand condition, under the good prerequisite of antistatic effect, select the packing parameter and pack, specifically include:
traversing the packaging history condition table, acquiring n pieces of circuit board information with the highest similarity to the circuit board information of the circuit board to be packaged and n corresponding packaging parameters in the packaging history condition table, sending each packaging parameter in the n pieces of packaging parameters into the anti-static result prediction model by combining the circuit board information of the circuit board to be packaged, and keeping k pieces of packaging parameters with good anti-static effect as candidate packaging parameter sets, wherein k < = n; the demand situation includes: a, packaging strategy in packaging includes: judging whether the circuit board is a circuit board with components or a circuit board without components according to the circuit board information acquired by image recognition, and forming a stacking and packaging mode of components-without components-with components when the circuit board with components and the circuit board without components are packaged together; when circuit boards with components are packaged and the given circuit board of circuit board information is a common circuit board, the distribution condition of the components is obtained according to the circuit board information, the X axis and the Y axis of the two circuit board components are determined by image recognition, the fit degree between the two circuit boards is determined by virtual assembly, the fit degree is the density of staggering the components without friction, the fit degree is 100%, the distribution area of the components is staggered according to the X axis and the Y axis of the components, a packaging mode that the two circuit boards with the components face to each other is adopted, when the fit degree is less than 100% or the circuit board with special requirements, the circuit boards face to each other and are packaged by a foam board at intervals; when all circuit boards without components are packed together, directly packing the circuit boards;
and B, packaging the finished circuit board in the shortest time, comprising: when the information of the circuit board to be packaged is identified by the image, no component exists, the electromagnetic induction value detection step is directly skipped, the shortest transmission interval is selected in the packaging parameter set for transmission and packaging, and when the component exists, the circuit board is packaged according to the obtained transmission interval range; and C, protecting the range of the counterweight component.
1: determining a component dense area in a circuit board image by using an end-to-end network model, 2: constructing key region characteristics of key component characteristics extraction for the component dense region by utilizing a deep neural network to perform self-adaptive characteristic extraction, 3: extracting key components and regions thereof by using a multi-layer pyramid-based feature extraction algorithm, 4: and adjusting the packaging parameters of the extracted area, and packaging the material by one layer when packaging and returning to the steps S22-S23.
S6, after the circuit board packing is dispatched from the factory, whether the detection circuit board has the damage condition, acquire the components and parts circuit board information of damage to in time update the packing parameter, include:
checking a packaging strategy adopted during packaging through image identification, arranging a binocular camera above the conveying monitoring device, identifying whether a circuit board is provided with foam boards with different types, wherein the foam boards are used as target detection objects of the binocular camera, when the binocular camera detects that the foam boards exist, the circuit board stacking and packaging mode is a circuit board with components, a foam board and a circuit board with components, measuring the extruded thickness of a target detection object through an image target detection technology, adjusting the material type of the foam board according to the extruded thickness, and if the identification circuit board is embedded into the foam board, changing the material of the foam board, updating packaging parameters and classifying the packaging parameters into circuit board damage caused by the transportation process; identifying that the circuit board is not embedded into the foam board, wherein the extruded thickness of the foam board is more than fifty percent of the natural state of the original foam board, changing the material of the foam board, updating packaging parameters, and classifying the foam board as circuit board damage caused in the transportation process; when the existence of the foam board is not detected, the method is a stacking and packaging mode of a circuit board with components, a circuit board without components and a circuit board with components, or a stacking and packaging mode of a circuit board with components and a circuit board with components, and is classified into a mode of circuit board damage caused by problems in the packaging stage, information of the circuit board with components in the stacking and packaging mode of the circuit board with components, the circuit board without components and the circuit board with components is identified by images, the circuit board information is written into a database, packaging parameters are updated, and then the stacking and packaging mode of the circuit board with components, the circuit board without components, the foam board with components and the circuit board with components is adopted; the stacking and packaging method of the circuit board with the components and the circuit board with the components is characterized in that the distribution area of the components is determined, whether the damaged components are staggered or not is verified, according to a distance measuring and calculating method, four parameters are specified to be x1, x2, y1 and y2, the unit is mm, the x1, x2, y1 and y2 are distances from the original point of the components to four sides of the rectangle of the circuit board, the accurate positions of the components are determined, the positions of the circuit board components relative to the components are consistent, the information of the attaching degree of the two circuit board components is modified to be less than 100%, packaging parameters are updated, and then adopting a stacking and packaging mode of a circuit board with components, a foam board and a circuit board with components, wherein the positions of the two circuit boards are not consistent, adopting the stacking and packaging mode of the circuit board with components, the circuit board without components and the circuit board with components to detect whether electrostatic damage exists, updating packaging parameters if no electrostatic damage exists, then adopting the stacking and packaging mode of the circuit board with components, the circuit board without components and the circuit board with components, and then adopting the stacking and packaging mode of the circuit board with components, the foam board and the circuit board with components if the stacking and packaging mode has electrostatic damage.
Referring to fig. 1-4, a control method for an efficient transmission monitoring device for anti-static packaging of a circuit board includes a fixing base (1), a monitoring cover (10), an industrial personal computer (18) and a transmission unit; the fixed base (1) is connected with a monitoring cover (10) in a buckling manner; an industrial personal computer (18) is fixedly connected in the fixed base (1); a plurality of conveying units are arranged on the fixed base (1); the conveying unit comprises a rotating supporting shaft (2), a conveying belt (3) and a driving wheel (4); the plurality of rotating support shafts (2) are rotatably connected to the fixed base (1); the rotating support shaft (2) is in tensioning sleeve connection with a conveyor belt (3); the inner surface of the conveyor belt (3) is connected with a driving wheel (4) in a meshing transmission way; the driving wheel (4) is fixedly connected to an output shaft of the driving motor (9); the driving motor (9) is fixedly connected in the fixed base (1); an automatic packing machine (6) is fixedly connected between the conveying units in the fixed base (1); when the circuit board packaging machine works, the driving wheel (4) can be driven to rotate through the rotation of the driving motor (9), so that the conveying belt (3) is driven to rotate, circuit boards on the conveying belt (3) can be moved in a relay mode, and meanwhile, the distances among different circuit boards can be controlled through the rotating speeds of the driving motors (9) with different holes, so that the packaging safety of the circuit boards is better;
a slide rail (11) is fixedly connected in the monitoring cover (10); the sliding rail (11) is connected with a first sliding block (12), a second sliding block (14) and a third sliding block (16) in a buckling manner; an electron beam induced current measuring machine (13) is detachably and fixedly connected in the first sliding block (12); a laser engraving machine (15) is detachably and fixedly connected in the second sliding block (14); visual sensors (17) are detachably and fixedly connected in the first sliding block (12), the second sliding block (14) and the third sliding block (16); when the laser engraving machine works, the slide rail (11) is connected with the first slide block (12), the second slide block (14) and the third slide block (16) in a buckling manner, so that the positions of the electron beam induced current measuring machine (13), the laser engraving machine (15) and the vision sensor (17) on the first slide block (12), the second slide block (14) and the third slide block (16) can be conveniently adjusted, and accurate positions can be conveniently obtained through debugging;
a horizontal baffle (7) is horizontally and fixedly connected to the inner wall of the fixed base (1) corresponding to the conveyor belt (3); a rotating motor (9) is fixedly connected to the horizontal baffle (7); the output end of the rotating motor (9) is fixedly connected with a vertical baffle (8); the vertical baffle (8) is hinged at the tail end of the horizontal baffle (7); when the automatic packaging machine works, the circuit board is contacted with the vertical baffle (8) in the moving process of the conveyor belt (3) through the vertical baffle (8) of the vertical fixing base (1), horizontal positioning can be completed, after the positioning is completed, the conveyor belt (3) rotates reversely, the circuit board is moved into the automatic packaging machine (6) to be packaged, when the direction of the circuit board needs to be converted, the rotating motor (9) is driven to rotate, the vertical baffle (8) is perpendicular to the horizontal baffle (7), so that the circuit board is turned, after the positioning is completed, the conveyor belt (3) rotates reversely, and the circuit board is moved into the automatic packaging machine (6) to be packaged;
rubber strips are fixedly connected to the side faces of the horizontal baffle (7) and the vertical baffle (8); the number of the transmission units is at least five; during operation makes this device can once adjust the distance between five circuit boards through five at least conveying unit to realize efficient transmission efficiency, through the rubber strip, make the circuit board can not cause the damage striking when the transmission redirecting.
Example two
Referring to fig. 5, in a first comparative example, as another embodiment of the present invention, a cable trough (19) is formed on a side wall of the fixing base (1); the bottom surface of the fixed base (1) is fixedly connected with a roller (20); when the automatic packaging machine works, the power lines and the signal lines of the plurality of driving motors 5, the rotating motor 9, the automatic packaging machine 6, the electron beam induced current measuring machine 13, the laser engraving machine 15 and the vision sensor 17 can be gathered and electrically connected with the industrial personal computer 18 through the beam slot (19), so that the industrial personal computer and input signals can be operated through an external display screen and a keyboard and can be put into a machine vision system program for operation, the type of the circuit board can be automatically judged, meanwhile, the industrial personal computer 18 controls the laser engraving machine 15 to engrave characters on the circuit board to determine classification index marks, meanwhile, the industrial personal computer 18 controls the electron beam induced current measuring machine 13 to detect the electromagnetic induction values of the circuit board, so that whether the distances among the circuit boards are proper or not is judged, the rotating speeds of the plurality of driving motors 5 are changed, the distances among the plurality of circuit boards are accurately controlled, the electromagnetic induction values of the industrial personal computer are always kept in a safe range value in the moving and packaging process, the range value of the transmission distance is merged into a total database 18 together with data parameters of image detection, and the numerical values which correspond to different conditions of the transmission distance and do not cause electrostatic induction are recorded.
The working principle is that a plurality of circuit boards are placed on the conveyor belt 3 one by one at positions corresponding to the vertical baffle plates 8, the rotation of the driving motor 5 is controlled, the driving wheel 4 and the conveyor belt 3 are driven to rotate, so that the circuit boards are driven to move forwards, at the moment, the types of the circuit boards can be judged by matching the vision sensor 17 with the industrial personal computer 18 and a database in the industrial personal computer 18, the circuit boards are etched and classified by the laser engraving machine 15 after being judged, and in the process that the circuit boards continue to move forwards, electromagnetic induction values are detected by the electron beam induction current measuring machine 13 through the lower part of the electron beam induction current measuring machine 13, whether the circuit boards are dangerous or not is judged, so that the rotating speed of the driving motor 5 in front is controlled, the distance between the circuit board below the electron beam induction current measuring machine 13 and the nearest circuit board is changed, and the safety of the circuit boards is protected; after passing through the automatic packing machine 6, the automatic packing machine 6 does not work, the circuit board is continuously contacted with the vertical baffle 8 under the transmission of the conveyor belt 3 to finish the correction in the horizontal direction, and at the moment, the conveyor belt 3 is reversed, so that the circuit board is moved into the automatic packing machine 6 for packing; after passing through the automatic packing machine 6, the automatic packing machine 6 does not work, the circuit board is continuously contacted with the vertical baffle 8 under the transmission of the conveyor belt 3, the rotating motor 9 works at the moment, the vertical baffle 8 is perpendicular to the horizontal baffle 7, the vertical correction of the circuit board is completed, and the conveyor belt 3 is reversed at the moment, so that the circuit board is moved into the automatic packing machine 6 for packing; all the automatic judgments are controlled by the industrial personal computer 18 and an artificial intelligence program.
In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing shows and describes the general principles, principal features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are given by way of illustration of the principles of the present invention, but that various changes and modifications may be made without departing from the spirit and scope of the invention, and such changes and modifications are within the scope of the invention as claimed.
Claims (8)
1. A control method applied to a circuit board anti-static packaging efficient transmission monitoring device is characterized by comprising the following steps:
obtaining circuit board information to be packaged on a production line;
according to the circuit board information, combining with the antistatic parameters of the circuit board, detecting the impedance quantity of the circuit board by using a loop resistance tester, and obtaining the transmission distance when the impedance tolerance range is +/-10%, so as to obtain the critical value of the transmission distance, wherein the parameters of the transmission distance comprise:
critical values of the same type and different placing directions, which do not cause electromagnetic induction, and critical values of the different type and different placing directions, which do not cause electromagnetic induction; the transmission distance parameters between the circuit boards are preset or generated at any time, and correspond to different parameters according to different circuit board information; packaging the circuit board within the obtained conveying distance range, and adjusting a packaging mode, a conveying distance and packaging materials according to the anti-static parameters; the packaging mode comprises the following steps: single-channel, double-channel, cross-shaped and multi-channel crossing modes;
the transfer pitch includes: the distance between different circuit boards and the same circuit board on the conveyor belt; the packaging material comprises: the length of the packing belt and the type of the packing belt; the antistatic parameters further comprise a packing strategy under special conditions, and specifically comprise: obtaining the circuit board information, and obtaining the brittleness of the contact position of the electronic component circuit board in the circuit board information; when the brittleness is larger than a threshold value, the protection is brought to the packing of one more layer of the corresponding area;
acquiring impedance of a circuit board, information of the circuit board, the transmission distance, the anti-static effect, a packaging mode, packaging materials and data of whether the anti-static effect is good or not, and establishing a packaging historical condition table;
changing packaging parameters corresponding to the circuit board information with poor anti-static effect after packaging by combining the clustering algorithm and the image similarity method through the packaging history condition table, and updating the packaging history condition table again according to the result;
training an anti-static result prediction model according to the packaging historical condition table by an SVM classification algorithm, wherein the input characteristics of the model are packaging parameters and circuit board information of the packaging historical condition table, and the model prediction output result is a packaging anti-static result;
when the circuit board to be packaged needs to be packaged and transmitted, circuit board information of the packaging circuit board to be transmitted is obtained, packaging parameters are determined according to the requirement condition on the premise that the anti-static effect is good, the anti-static packaging efficient transmission monitoring device is controlled, and the determined packaging parameters are used for packaging;
after the circuit board is packaged and delivered from a factory, whether the circuit board has a damaged condition or not is detected, damaged circuit board information of the component is obtained, and packaging parameters are updated in time.
2. The control method applied to the efficient transmission monitoring device for the anti-static packaging of the circuit board as claimed in claim 1, wherein: obtaining circuit board information to be packed on a production line, comprising:
acquiring the type of a circuit board, the image of the circuit board and the contact position of the circuit board; the types of the circuit boards comprise: rigid circuit boards and flexible circuit boards; image of the circuit board: the size of the circuit board, the existence of components on the circuit board, the pitch of the circuit board with the components and the arrangement direction of the circuit board; a circuit board component comprising: electrostatic discharge sensitive components and electrostatic discharge insensitive components; distinguishing the components by using the printing version numbers on the image recognition components; the printing version number comprises: integrating voltage-stabilizing ICs and voltage-transforming ICs; according to the printing version number, classifying the components printed with integrated voltage-stabilizing IC version numbers as electrostatic discharge sensitive components, and classifying the components printed with variable-voltage IC printing version numbers as electrostatic discharge insensitive components; pitch of the wiring board: the distance between the parts of the circuit board on which the components are arranged; the circuit board placing direction is as follows: one surface on which the components are mounted and one surface on which the components are not mounted; the image of the circuit board is obtained through the image processing of a machine vision system in the artificial intelligent computer vision; the contact position of the circuit board is obtained by two categories: the method comprises the following steps that common different types of circuit boards are detected and customized by means of a camera target, and image features of the circuit boards are extracted through an image recognition technology to obtain internal features of the circuit boards; the internal features, including: line width and line distance, and contact position; and sending and storing the circuit board information into a database of an industrial personal computer.
3. The control method applied to the efficient transmission monitoring device for the anti-static packaging of the circuit board as claimed in claim 1, wherein: the antistatic effect is determined as follows:
through electron beam induced current measuring device, acquire the electromagnetic induction numerical value, obtain the packing result, judge whether the circuit board has electrostatic contact, specifically include: training a circuit board static detection model, obtaining a packed circuit board, obtaining an induced current value through an electron beam induced current measuring device, judging that the anti-static effect is not good if the induced current value exists, and judging that the anti-static effect is good if the induced current value does not exist; the electrostatic effect judgment comprises the following steps: constructing an induced current model; calculating the induced current of the circuit board according to the induced current model to obtain a calculated value; measuring an actual value by using an electron beam induced current measuring device; obtaining the distribution characteristics of the induction current according to the induction current model; judging whether each numerical value is greater than or equal to the maximum limit value of the induction current, if the numerical value is less than or equal to the maximum limit value, the anti-static effect is good, and if the numerical value is greater than the maximum limit value, the anti-static effect does not meet the requirement; the measurement of the electron beam induced current specifically comprises the following steps: and collecting an electron beam induced current signal to obtain IV curve information, and detecting to obtain an electromagnetic induction value.
4. The control method applied to the efficient transmission monitoring device for the anti-static packaging of the circuit board as claimed in claim 1, wherein: changing packaging parameters corresponding to the circuit board information with poor anti-static effect after packaging by combining the clustering algorithm and the image similarity method through the packaging history condition table, and updating the packaging history condition table again according to the result; the clustering algorithm and the image similarity method comprise the following steps:
clustering a circuit board image set by using a neighbor domain algorithm to obtain K circuit board image cluster clusters and K cluster centers corresponding to the K circuit board image cluster clusters, wherein K is a natural number; calculating the similarity of the circuit board images and each clustering center, and dividing the circuit board images into circuit board image clustering clusters corresponding to the clustering centers with the highest similarity with the circuit board images; updating the clustering centers of the K circuit board image clustering clusters; obtain the not good circuit board information data of packing effect, confirm the packing parameter of the not good circuit board of packing effect calculates the circuit board image in the not good circuit board information of packing effect and the similarity of every other circuit board image in the circuit board type cluster that this circuit board information belongs to, judges whether the cluster center of every circuit board image cluster satisfies predetermined convergence condition: if the image similarity is within a first threshold value, packing the circuit board within the obtained transmission distance range; and when a new circuit board exists, calculating the similarity between the circuit board image and each other circuit board image in the circuit board information and packaging condition history table, and when other circuit board images with the similarity higher than a first threshold value cannot be found, acquiring other circuit board images with the highest similarity, and packaging the circuit board within the obtained transmission distance range.
5. The control method applied to the efficient transmission and monitoring device for the anti-static package of the circuit board as claimed in claim 1, wherein the control method comprises the following steps: training an anti-static result prediction model according to the packaging historical condition table through an SVM classification algorithm, wherein the input characteristics of the model are packaging parameters and circuit board information of the packaging historical condition table, and the model prediction output result is a packaging anti-static result and comprises the following steps:
and taking 90% of data of the packaging historical condition table as a training set and 10% of data as a test set.
6. The control method applied to the efficient transmission monitoring device for the anti-static packaging of the circuit board as claimed in claim 1, wherein: when waiting to pack the circuit board and need pack the conveying, obtain the circuit board information of waiting to convey the packing circuit board, combine the demand condition, under the good prerequisite of antistatic effect, select the packing parameter and pack, include:
traversing the packaging history condition table, acquiring n pieces of circuit board information with the highest similarity to the circuit board information of the circuit board to be packaged and n corresponding packaging parameters in the packaging history condition table, sending each packaging parameter in the n pieces of packaging parameters into the anti-static result prediction model by combining the circuit board information of the circuit board to be packaged, and keeping k pieces of packaging parameters with good anti-static effect as candidate packaging parameter sets, wherein k < = n; the demand situations include: a, packaging strategy in packaging includes: judging whether the circuit board is a circuit board with components or a circuit board without components according to the circuit board information acquired by image recognition, and forming a stacking and packaging mode of components-without components-with components when the circuit board with components and the circuit board without components are packaged together; when circuit boards with components are packaged, when the circuit board information is given to a common circuit board, the distribution condition of the components is obtained according to the circuit board information, the X axis and the Y axis of the two circuit board components are determined by image recognition, the fit degree between the two circuit boards is determined by virtual assembly, the fit degree is the density which is staggered and does not rub between the components, the fit degree is 100%, the component distribution area is staggered according to the X axis and the Y axis of the components, a packaging mode that the two circuit board components with the components face towards each other is adopted, when the fit degree is less than 100% or the circuit board with special requirements, the circuit boards of the components face upwards and are packaged at intervals of a foam board; when all circuit boards without components are packed together, directly packing the circuit boards;
and B, packaging the finished circuit board in the shortest time, comprising: when the information of the circuit board to be packaged is identified by the image, no component exists, the electromagnetic induction value detection step is directly skipped, the shortest transmission interval is selected in the packaging parameter set for transmission and packaging, and when the component exists, the circuit board is packaged according to the obtained transmission interval range; c, protecting the range of the counterweight component;
1: determining a component dense area in a circuit board image by using an end-to-end network model, 2: constructing key region characteristics of key component characteristics extraction for the component dense region by utilizing a deep neural network to perform self-adaptive characteristic extraction, 3: extracting key components and regions thereof by using a multi-layer pyramid-based feature extraction algorithm, 4: and adjusting the packaging parameters of the extracted area, adding one more layer of materials during packaging, and returning to the step of packaging the circuit board within the obtained conveying distance range for packaging.
7. The control method applied to the efficient transmission and monitoring device for the anti-static package of the circuit board as claimed in claim 1, wherein the control method comprises the following steps: after the circuit board packing was dispatched from the factory, whether the detection circuit board had the damage condition, acquireed the components and parts circuit board information of damage to in time update the packing parameter, include:
checking a packaging strategy adopted during packaging through image identification, arranging a binocular camera above a conveying monitoring device, identifying whether a circuit board is provided with foam boards of different types or not, wherein the foam board is used as a target detection object of the binocular camera, when the existence of the foam board is detected by the binocular camera, the circuit board stacking and packaging mode is a circuit board with components, a foam board and a circuit board with components, measuring the extruded thickness of the target detection object through an image target detection technology, adjusting the material type of the foam board according to the extruded thickness, and if the foam board is embedded into the identification circuit board, changing the material of the foam board, updating packaging parameters and classifying the circuit board damage caused by the transportation process; identifying that the circuit board is not embedded into the foam board, wherein the extruded thickness of the foam board is more than fifty percent of the natural state of the original foam board, changing the material of the foam board, updating the packing parameters, and classifying the circuit board damage caused in the transportation process; when the existence of the foam board is not detected, the method is a stacking and packaging mode of a circuit board with components, a circuit board without components and a circuit board with components, or a stacking and packaging mode of a circuit board with components and a circuit board with components, and is classified into a mode of circuit board damage caused by problems in the packaging stage, information of the circuit board with components in the stacking and packaging mode of the circuit board with components, the circuit board without components and the circuit board with components is identified by images, the circuit board information with the problem of electrostatic damage is written into a database, packaging parameters are updated, and then the stacking and packaging mode of the circuit board with components, the circuit board without components, the foam board with components and the circuit board with components is adopted; the stacking and packaging method of the circuit board with the components and the circuit board with the components comprises the steps of determining distribution areas of the components, verifying whether the damaged components are staggered or not, specifying four parameters to be x1, x2, y1 and y2 according to a distance measuring and calculating method, wherein the four parameters are respectively x1, x2, y1 and y2, the unit is mm, the x1, x2, y1 and y2 are respectively the distances from the original points of the components to the four sides of the rectangular circuit board, determining the accurate positions of the components, obtaining that the positions of the components relative to the circuit board components are consistent, modifying the fitting degree information of the two circuit board components to be less than 100%, updating packaging parameters, then adopting a stacking and packaging method of the circuit board with the components, a foam board and the circuit board with the components, detecting whether the circuit board with the components is damaged or not, adopting a stacking method of the circuit board with the components, the circuit board without the components and the circuit board with the components, updating the packaging parameters if the stacking and the circuit board with the components, the foam board with the components, and the packaging method of the circuit board with the components.
8. The control method applied to the efficient transmission monitoring device for the anti-static packaging of the circuit board as claimed in claim 1, wherein: the anti-static transmission monitoring device comprises a fixed base (1), a monitoring cover (10), an industrial personal computer (18) and a transmission unit; the fixed base (1) is buckled and connected with a monitoring cover (10); an industrial personal computer (18) is fixedly connected in the fixed base (1); a plurality of conveying units are arranged on the fixed base (1); the conveying unit comprises a rotary supporting shaft (2), a conveying belt (3) and a driving wheel (4); the plurality of rotating support shafts (2) are rotatably connected to the fixed base (1); the rotating support shaft (2) is in tensioning sleeve connection with a conveyor belt (3); the inner surface of the conveyor belt (3) is connected with a driving wheel (4) in a meshing transmission way; the driving wheel (4) is fixedly connected to an output shaft of the driving motor (9); the driving motor (9) is fixedly connected in the fixed base (1); an automatic packing machine (6) is fixedly connected between the conveying units in the fixed base (1); when the automatic packaging machine works, the driving wheel (4) can be driven to rotate by the rotation of the driving motor (9), so that the conveying belt (3) is driven to rotate, the circuit boards on the conveying belt (3) are moved in a relay manner, and the rotating speeds of different driving motors (9) are controlled at the same time, so that the space between different circuit boards can be controlled, and the packaging safety of the circuit boards is better;
a slide rail (11) is fixedly connected in the monitoring cover (10); the sliding rail (11) is connected with a first sliding block (12), a second sliding block (14) and a third sliding block (16) in a buckling manner; an electron beam induced current measuring machine (13) is detachably and fixedly connected in the first sliding block (12); a laser engraving machine (15) is detachably and fixedly connected in the second sliding block (14); visual sensors (17) are detachably and fixedly connected in the first sliding block (12), the second sliding block (14) and the third sliding block (16); when the laser engraving machine works, the slide rail (11) is connected with the first slide block (12), the second slide block (14) and the third slide block (16) in a buckling manner, so that the positions of the electron beam induced current measuring machine (13), the laser engraving machine (15) and the vision sensor (17) on the first slide block (12), the second slide block (14) and the third slide block (16) can be conveniently adjusted, and accurate positions can be conveniently obtained through debugging;
a horizontal baffle (7) is horizontally and fixedly connected to the inner wall of the fixed base (1) corresponding to the conveyor belt (3); a rotating motor (9) is fixedly connected to the horizontal baffle (7); the output end of the rotating motor (9) is fixedly connected with a vertical baffle (8); the vertical baffle (8) is hinged at the tail end of the horizontal baffle (7); when the automatic packaging machine works, the circuit board is in contact with the vertical baffle (8) through the vertical baffle (8) of the vertical fixing base (1) in the moving process of the conveyor belt (3), so that horizontal positioning can be completed, after the positioning is completed, the conveyor belt (3) reverses, the circuit board is moved into the automatic packaging machine (6) to be packaged, when the direction of the circuit board needs to be converted, the rotating motor (9) is driven to rotate, the vertical baffle (8) is perpendicular to the horizontal baffle (7), so that the circuit board is turned, after the positioning is completed, the conveyor belt (3) reverses, and the circuit board is moved into the automatic packaging machine (6) to be packaged;
rubber strips are fixedly connected to the side faces of the horizontal baffle (7) and the vertical baffle (8); the number of said transfer units is at least five.
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| CN111556637A (en) * | 2020-05-07 | 2020-08-18 | 惠安畅悦工业产品设计有限公司 | Destaticizing structure of general equipment for packing of inverter device production |
| CN213847103U (en) * | 2020-12-22 | 2021-07-30 | 苏州易思若电子科技有限公司 | PCB circuit board removes electrostatic devices |
| CN112837513A (en) * | 2021-01-21 | 2021-05-25 | 深圳市永圣科技有限公司 | Infrared induction digital display antistatic monitor and system |
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