CN113925242A - Novel cooling glove - Google Patents
Novel cooling glove Download PDFInfo
- Publication number
- CN113925242A CN113925242A CN202111242141.0A CN202111242141A CN113925242A CN 113925242 A CN113925242 A CN 113925242A CN 202111242141 A CN202111242141 A CN 202111242141A CN 113925242 A CN113925242 A CN 113925242A
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- China
- Prior art keywords
- layer
- glove
- novel cooling
- conducting metal
- cold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 34
- 239000004065 semiconductor Substances 0.000 claims abstract description 54
- 229910052751 metal Inorganic materials 0.000 claims abstract description 45
- 239000002184 metal Substances 0.000 claims abstract description 45
- 239000011248 coating agent Substances 0.000 claims abstract description 44
- 238000000576 coating method Methods 0.000 claims abstract description 44
- 230000017525 heat dissipation Effects 0.000 claims abstract description 39
- 238000005057 refrigeration Methods 0.000 claims abstract description 36
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000000741 silica gel Substances 0.000 claims abstract description 7
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 7
- DZKDPOPGYFUOGI-UHFFFAOYSA-N tungsten(iv) oxide Chemical compound O=[W]=O DZKDPOPGYFUOGI-UHFFFAOYSA-N 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000004952 Polyamide Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000012544 monitoring process Methods 0.000 claims description 6
- 229920002647 polyamide Polymers 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 4
- 229920006389 polyphenyl polymer Polymers 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 239000011527 polyurethane coating Substances 0.000 claims description 3
- 239000008187 granular material Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 3
- 238000004321 preservation Methods 0.000 description 15
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 239000003973 paint Substances 0.000 description 5
- 238000009529 body temperature measurement Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000005679 Peltier effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 241000894006 Bacteria Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 238000009940 knitting Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000009958 sewing Methods 0.000 description 1
- 230000000638 stimulation Effects 0.000 description 1
- 210000004243 sweat Anatomy 0.000 description 1
- 230000035900 sweating Effects 0.000 description 1
Classifications
-
- A—HUMAN NECESSITIES
- A41—WEARING APPAREL
- A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
- A41D19/00—Gloves
- A41D19/015—Protective gloves
- A41D19/01529—Protective gloves with thermal or fire protection
- A41D19/01541—Cooled gloves
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Textile Engineering (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention discloses a novel cooling glove, which comprises a glove body; the glove body is provided with an inner layer and a heat dissipation outer layer positioned outside the inner layer; a cold conducting metal layer is arranged between the inner layer and the heat dissipation outer layer on the back of the hand; a semiconductor refrigerating sheet is arranged between the cold conducting metal layer and the heat dissipation outer layer; and all the layers of structures are mutually attached and fixed. The cold end surface of the semiconductor refrigeration sheet is attached to the outer surface of the cold conducting metal layer, and the outer side of the hot end surface is provided with a radiating fin. The outer surface of the radiating fin is attached to the inner surface of the radiating outer layer; the heat dissipation outer layer is provided with a porous gauze layer and an outer sleeve layer. And the outer surface of the cold conducting metal layer is coated with a heat-insulating coating. The inner layer is a silica gel layer. A temperature control device and a controller are arranged outside the glove body; the temperature control device is electrically connected with the semiconductor refrigerating sheet. The semiconductor refrigerating plate is connected with the controller in parallel and then electrically connected with an external direct current power supply. The glove provided by the invention has the advantages of simple structure, flexibility, comfort, good effect, difficult temperature rise due to the influence of ambient temperature and strong practicability.
Description
Technical Field
The invention relates to a functional glove, in particular to a novel cooling glove.
Background
The hand is one of the finest and compact organs of the human body, people use both hands to complete various operations, the gloves are used more and more in many occasions as hand protection articles, and people are also often used to wear the gloves in order to improve the holding comfort when working. The gloves are divided into sewing, knitting, dipping and the like according to the manufacturing method. The functions are mainly used for labor protection, industrial protection, medical treatment and bacterium prevention, warm keeping or decoration and the like. However, if the gloves are in high-temperature weather or working environment, the gloves are affected by ambient temperature, and have the problems of quick temperature rise, easy sweating, uncomfortable wearing for a long time and the like.
Disclosure of Invention
The invention aims to provide a functional glove, which aims to solve the problems in the prior art and has the characteristics of simple structure, wearing comfort, difficulty in temperature rise due to the influence of ambient temperature and the like.
In order to achieve the purpose, the invention provides a novel cooling glove, wherein the novel cooling glove comprises a glove body; the glove body is provided with an inner layer and a heat dissipation outer layer positioned outside the inner layer; a cold conducting metal layer is arranged between the inner layer and the heat dissipation outer layer on the back of the hand of the glove body; a semiconductor refrigerating sheet is arranged between the cold conducting metal layer and the heat dissipation outer layer; and all the layers of structures are mutually attached and fixed.
In the novel cooling glove, the inward surface of the semiconductor refrigeration sheet is a cold end surface, and the outward surface of the semiconductor refrigeration sheet is a hot end surface; the cold end face is fixedly attached to the outer surface of the cold conducting metal layer, and the outer side of the hot end face is provided with a fixed radiating fin; the cold conducting metal layer is made of tungsten dioxide.
In the novel cooling glove, the outer surface of the radiating fin is fixedly attached to the inner surface of the radiating outer layer; the radiating fins are made of metal copper sheets.
In the novel cooling glove, the heat dissipation outer layer is provided with the porous gauze layer and the outer jacket layer, the outer jacket layer is covered outside the porous gauze layer and fixed with the porous gauze layer, the heat dissipation fins are fixedly arranged on the inner surface of the porous gauze layer, and the outer jacket layer is provided with a plurality of heat dissipation ports; the outer sleeve layer is made of polyamide; the porous gauze layer is made of PET.
In the novel cooling glove, the outer surface of the cold conducting metal layer is coated with the heat preservation coating, the thickness of the heat preservation coating is 1-3 mm, and the cold end surface of the semiconductor refrigeration piece is attached to the heat preservation coating.
In the novel cooling glove, the heat-insulating coating is formed by coating any one of ceramic powder coating, acrylic coating, polyurethane coating, polyphenyl particle coating and diatomite coating.
In the novel cooling glove, the inner layer is a silica gel layer.
In the novel cooling glove, the glove body is also provided with a temperature control device and a controller; the temperature control device is electrically connected with the semiconductor refrigerating sheet.
The novel cooling glove is characterized in that the temperature control device adopts a temperature monitoring sensor which is provided with a temperature measuring digital display screen and ranges from 0 ℃ to 45 ℃.
In the novel cooling glove, the semiconductor refrigeration piece is connected with the controller in parallel and then electrically connected with an external direct-current power supply, the semiconductor refrigeration piece is connected with the direct-current power supply to generate the cold end face and the hot end face, and the direct-current power supply adopts the direct-current power supply with the voltage of 6-12 v.
The novel cooling glove provided by the invention has the following advantages:
the cooling gloves provided by the invention can solve the technical problems that the temperature of the gloves is quickly raised due to the influence of ambient temperature, the gloves are easy to sweat and uncomfortable to wear for a long time, and the protective gloves have small effect on reducing the stimulation of medicines during experimental operation, so that the gloves are not enough to be protected, and the like. And the structure is simple, the realization is easy, the flexibility and the comfort are realized, the effect is good, and the practicability is strong.
Detailed Description
The following further describes embodiments of the present invention.
The invention provides a novel cooling glove, which comprises a glove body; the glove body is provided with an inner layer and a heat dissipation outer layer positioned outside the inner layer; a cold conducting metal layer is arranged between the inner layer and the heat dissipation outer layer on the back of the hand of the glove body; a semiconductor refrigerating sheet is arranged between the cold conducting metal layer and the heat dissipation outer layer; and all the layers of structures are mutually attached and fixed.
The inward surface of the semiconductor refrigeration sheet is a cold end surface, and the outward surface of the semiconductor refrigeration sheet is a hot end surface; the cold end face is fixedly attached to the outer surface of the cold conducting metal layer, and the outer side of the hot end face is provided with a fixed radiating fin; the cold conducting metal layer is made of tungsten dioxide. The cold conducting metal layer is preferably disposed on the back of the hand of the glove body.
The semiconductor refrigerating sheet is also called as a thermoelectric refrigerating sheet, and by utilizing the Peltier effect of semiconductor materials, when direct current passes through a galvanic couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the galvanic couple respectively, so that the aim of refrigeration can be fulfilled. The refrigerating technology which generates negative thermal resistance is characterized by no moving parts and higher reliability. The Peltier effect means that when a current passes through a circuit composed of different conductors, heat absorption and heat release phenomena occur at joints of the different conductors along with the difference of current directions, in addition to irreversible joule heat generation.
The outer surface of the radiating fin is fixedly attached to the inner surface of the radiating outer layer; the radiating fins are made of metal copper sheets.
The heat dissipation outer layer is provided with a porous gauze layer and an outer jacket layer, the outer jacket layer is covered outside the porous gauze layer and fixed with the porous gauze layer, the heat dissipation fins are fixedly arranged on the inner surface of the porous gauze layer, and the outer jacket layer is provided with a plurality of heat dissipation ports; the outer sleeve layer is made of polyamide; the material adopted by the porous gauze layer is PET (polyethylene terephthalate).
The outer surface of the cold conducting metal layer is also coated with a heat preservation coating, the thickness of the heat preservation coating is 1 mm-3 mm, and the cold end surface of the semiconductor refrigeration sheet is attached to the heat preservation coating.
The heat-insulating coating is formed by coating any one of ceramic powder coating, acrylic coating, polyurethane coating, polyphenyl granule coating and diatomite coating.
The inner layer is a silica gel layer.
The glove body is also provided with a temperature control device and a controller; the temperature control device is electrically connected with the semiconductor refrigerating sheet.
The temperature control device adopts a temperature monitoring sensor which is provided with a temperature measurement digital display screen and has the temperature range of 0-45 ℃.
The semiconductor refrigeration piece is electrically connected with an external direct current power supply after being connected with the controller in parallel, the semiconductor refrigeration piece is connected with the direct current power supply to generate a cold end face and a hot end face, and the direct current power supply adopts a direct current power supply with the voltage of 6-12 v.
The novel cooling glove provided by the invention is further described by combining the embodiment.
Example 1
A novel cooling glove comprises a glove body.
The glove body is provided with an inner layer and a heat dissipation outer layer positioned outside the inner layer; a cold conducting metal layer is arranged between the inner layer and the heat dissipation outer layer on the back of the hand of the glove body; a semiconductor refrigerating sheet is arranged between the cold conducting metal layer and the heat dissipation outer layer; and all the layers of structures are mutually attached and fixed.
Preferably, the inward surface of the semiconductor refrigeration piece is a cold end surface, and the outward surface of the semiconductor refrigeration piece is a hot end surface; the cold end face is fixed on the outer surface of the cold conducting metal layer in a fitting mode, and the outer side of the hot end face is provided with a fixed radiating fin.
The outer surface of the radiating fin is fixedly attached to the inner surface of the radiating outer layer; the radiating fins are made of metal copper sheets.
The heat dissipation outer layer is provided with a porous gauze layer and an outer jacket layer, the outer jacket layer is covered outside the porous gauze layer and fixed with the porous gauze layer, the heat dissipation fins are fixedly arranged on the inner surface of the porous gauze layer, and the outer jacket layer is provided with a plurality of heat dissipation ports; the outer sleeve layer is made of polyamide; the porous gauze layer is made of PET.
The cold conducting metal layer is made of tungsten dioxide.
The outer surface of the cold conducting metal layer is also coated with a heat preservation coating, the thickness of the heat preservation coating is 1 mm-3 mm, and the cold end surface of the semiconductor refrigeration sheet is attached to the heat preservation coating.
The heat-insulating coating is formed by coating ceramic powder paint.
The inner layer of the glove body is a silica gel layer.
The glove body is also provided with a temperature control device and a controller; the temperature control device is electrically connected with the semiconductor refrigerating sheet. The temperature control device adopts a temperature monitoring sensor which is provided with a temperature measurement digital display screen and has the temperature range of 0-45 ℃.
The semiconductor refrigeration piece is electrically connected with an external direct current power supply after being connected with the controller in parallel, the semiconductor refrigeration piece is connected with the direct current power supply to generate a cold end face and a hot end face, and the direct current power supply adopts a direct current power supply with the voltage of 6-12 v.
Example 2
A novel cooling glove comprises a glove body.
The glove body is provided with an inner layer and a heat dissipation outer layer positioned outside the inner layer; a cold conducting metal layer is arranged between the inner layer and the heat dissipation outer layer on the back of the hand of the glove body; a semiconductor refrigerating sheet is arranged between the cold conducting metal layer and the heat dissipation outer layer; and all the layers of structures are mutually attached and fixed.
Preferably, the inward surface of the semiconductor refrigeration piece is a cold end surface, and the outward surface of the semiconductor refrigeration piece is a hot end surface; the cold end face is fixed on the outer surface of the cold conducting metal layer in a fitting mode, and the outer side of the hot end face is provided with a fixed radiating fin.
The outer surface of the radiating fin is fixedly attached to the inner surface of the radiating outer layer; the radiating fins are made of metal copper sheets.
The heat dissipation outer layer is provided with a porous gauze layer and an outer jacket layer, the outer jacket layer is covered outside the porous gauze layer and fixed with the porous gauze layer, the heat dissipation fins are fixedly arranged on the inner surface of the porous gauze layer, and the outer jacket layer is provided with a plurality of heat dissipation ports; the outer sleeve layer is made of polyamide; the porous gauze layer is made of PET.
The cold conducting metal layer is made of tungsten dioxide.
The outer surface of the cold conducting metal layer is also coated with a heat preservation coating, the thickness of the heat preservation coating is 1 mm-3 mm, and the cold end surface of the semiconductor refrigeration sheet is attached to the heat preservation coating.
The heat-insulating coating is formed by coating acrylic paint or polyurethane paint.
The inner layer of the glove body is a silica gel layer.
The glove body is also provided with a temperature control device and a controller; the temperature control device is electrically connected with the semiconductor refrigerating sheet. The temperature control device adopts a temperature monitoring sensor which is provided with a temperature measurement digital display screen and has the temperature range of 0-45 ℃.
The semiconductor refrigeration piece is electrically connected with an external direct current power supply after being connected with the controller in parallel, the semiconductor refrigeration piece is connected with the direct current power supply to generate a cold end face and a hot end face, and the direct current power supply adopts a direct current power supply with the voltage of 6-12 v.
Example 3
A novel cooling glove comprises a glove body.
The glove body is provided with an inner layer and a heat dissipation outer layer positioned outside the inner layer; a cold conducting metal layer is arranged between the inner layer and the heat dissipation outer layer on the back of the hand of the glove body; a semiconductor refrigerating sheet is arranged between the cold conducting metal layer and the heat dissipation outer layer; and all the layers of structures are mutually attached and fixed.
Preferably, the inward surface of the semiconductor refrigeration piece is a cold end surface, and the outward surface of the semiconductor refrigeration piece is a hot end surface; the cold end face is fixed on the outer surface of the cold conducting metal layer in a fitting mode, and the outer side of the hot end face is provided with a fixed radiating fin.
The outer surface of the radiating fin is fixedly attached to the inner surface of the radiating outer layer; the radiating fins are made of metal copper sheets.
The heat dissipation outer layer is provided with a porous gauze layer and an outer jacket layer, the outer jacket layer is covered outside the porous gauze layer and fixed with the porous gauze layer, the heat dissipation fins are fixedly arranged on the inner surface of the porous gauze layer, and the outer jacket layer is provided with a plurality of heat dissipation ports; the outer sleeve layer is made of polyamide; the porous gauze layer is made of PET.
The cold conducting metal layer is made of tungsten dioxide.
The outer surface of the cold conducting metal layer is also coated with a heat preservation coating, the thickness of the heat preservation coating is 1 mm-3 mm, and the cold end surface of the semiconductor refrigeration sheet is attached to the heat preservation coating.
The heat-insulating coating is formed by coating polyphenyl particle paint or diatomite paint.
The inner layer of the glove body is a silica gel layer.
The glove body is also provided with a temperature control device and a controller; the temperature control device is electrically connected with the semiconductor refrigerating sheet. The temperature control device adopts a temperature monitoring sensor which is provided with a temperature measurement digital display screen and has the temperature range of 0-45 ℃.
The semiconductor refrigeration piece is electrically connected with an external direct current power supply after being connected with the controller in parallel, the semiconductor refrigeration piece is connected with the direct current power supply to generate a cold end face and a hot end face, and the direct current power supply adopts a direct current power supply with the voltage of 6-12 v.
The novel cooling glove provided by the invention comprises a glove body, wherein a temperature control device and a controller are also arranged outside the glove body; the glove body comprises an inner layer, a cold conducting metal layer and a heat dissipation outer layer which are sequentially arranged from inside to outside, a semiconductor refrigeration sheet is arranged between the cold conducting metal layer and the heat dissipation outer layer, the cold end surface of the semiconductor refrigeration sheet is attached to the outer surface of the cold conducting metal layer, and the outer surface of the cold conducting metal layer is also coated with a heat insulation coating; the outer side of the hot end surface of the semiconductor refrigerating sheet is provided with a radiating fin which is arranged on the inner surface of the radiating outer layer; the temperature control device is electrically connected with the semiconductor refrigeration piece, and the semiconductor refrigeration piece is electrically connected with the direct-current power supply after being connected with the controller in parallel. The glove has the characteristics of simple structure, wearing comfort, being not easy to be influenced by the ambient temperature to heat and the like.
While the present invention has been described in detail with reference to the preferred embodiments, it should be understood that the above description should not be taken as limiting the invention. Various modifications and alterations to this invention will become apparent to those skilled in the art upon reading the foregoing description. Accordingly, the scope of the invention should be determined from the following claims.
Claims (10)
1. A novel cooling glove is characterized in that the novel cooling glove comprises a glove body; the glove body is provided with an inner layer and a heat dissipation outer layer positioned outside the inner layer; a cold conducting metal layer is arranged between the inner layer and the heat dissipation outer layer on the back of the hand of the glove body; a semiconductor refrigerating sheet is arranged between the cold conducting metal layer and the heat dissipation outer layer; and all the layers of structures are mutually attached and fixed.
2. The novel cooling glove as claimed in claim 1, wherein the inward side of the semiconductor refrigeration sheet is a cold side, and the outward side of the semiconductor refrigeration sheet is a hot side; the cold end face is fixedly attached to the outer surface of the cold conducting metal layer, and the outer side of the hot end face is provided with a fixed radiating fin; the cold conducting metal layer is made of tungsten dioxide.
3. The novel cooling glove as claimed in claim 2, wherein the outer surface of the heat sink is fixedly attached to the inner surface of the heat sink outer layer; the radiating fins are made of metal copper sheets.
4. The novel cooling glove as claimed in claim 3, wherein the heat-dissipating outer layer is provided with a porous gauze layer and an outer cover layer, the outer cover layer is covered and fixed on the outer part of the porous gauze layer, the heat-dissipating fins are fixedly arranged on the inner surface of the porous gauze layer, and the outer cover layer is provided with a plurality of heat-dissipating ports; the outer sleeve layer is made of polyamide; the porous gauze layer is made of PET.
5. The novel cooling glove as claimed in claim 2, wherein the outer surface of the cold conducting metal layer is coated with a heat insulating coating, the thickness of the heat insulating coating is 1 mm-3 mm, and the cold end surface of the semiconductor refrigeration sheet is attached to the heat insulating coating.
6. The novel cooling glove as claimed in claim 5, wherein the heat-insulating coating is formed by coating any one of ceramic powder coating, acrylic coating, polyurethane coating, polyphenyl granule coating and diatomite coating.
7. The novel cooling glove as claimed in claim 1, wherein the inner layer is a silica gel layer.
8. The novel cooling glove as claimed in claim 1, wherein a temperature control device and a controller are further arranged outside the glove body; the temperature control device is electrically connected with the semiconductor refrigerating sheet.
9. The novel cooling glove as claimed in claim 8, wherein the temperature control device adopts a temperature monitoring sensor with a digital temperature display screen in the range of 0-45 ℃.
10. The novel cooling glove as claimed in claim 8, wherein the semiconductor refrigeration sheet is electrically connected to an external DC power supply after being connected in parallel with the controller, the semiconductor refrigeration sheet generates a cold end surface and a hot end surface by being connected to the DC power supply, and the DC power supply adopts a DC power supply with a voltage of 6-12 v.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111242141.0A CN113925242A (en) | 2021-10-25 | 2021-10-25 | Novel cooling glove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111242141.0A CN113925242A (en) | 2021-10-25 | 2021-10-25 | Novel cooling glove |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113925242A true CN113925242A (en) | 2022-01-14 |
Family
ID=79284176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111242141.0A Pending CN113925242A (en) | 2021-10-25 | 2021-10-25 | Novel cooling glove |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113925242A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115127696A (en) * | 2022-06-28 | 2022-09-30 | 东莞市一群智汇电子科技有限公司 | Infant body temperature detection and automatic cooling equipment and control method thereof |
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| CN201995714U (en) * | 2011-02-28 | 2011-10-05 | 杭州澳凌制冷设备有限公司 | Semiconductor refrigeration sheet heating warmth-keeping shoe |
| KR20110127802A (en) * | 2010-05-20 | 2011-11-28 | 호서대학교 산학협력단 | A multifunctional glove |
| CN106617405A (en) * | 2016-11-17 | 2017-05-10 | 成都朵猫文化传播有限公司 | Heat-dissipation fire protection glove |
| CN108813762A (en) * | 2018-08-06 | 2018-11-16 | 广东电网有限责任公司 | A kind of production method for the insulating glove that cools down |
| CN209677435U (en) * | 2019-01-14 | 2019-11-26 | 世目特种防护用品科技（江苏）有限公司 | A kind of creeping chill gloves |
| CN211608297U (en) * | 2019-12-09 | 2020-10-02 | 中山大学孙逸仙纪念医院 | Cooling gloves |
| CN213154276U (en) * | 2020-09-29 | 2021-05-11 | 成都职业技术学院 | Solar refrigeration helmet |
-
2021
- 2021-10-25 CN CN202111242141.0A patent/CN113925242A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110127802A (en) * | 2010-05-20 | 2011-11-28 | 호서대학교 산학협력단 | A multifunctional glove |
| CN201995714U (en) * | 2011-02-28 | 2011-10-05 | 杭州澳凌制冷设备有限公司 | Semiconductor refrigeration sheet heating warmth-keeping shoe |
| CN106617405A (en) * | 2016-11-17 | 2017-05-10 | 成都朵猫文化传播有限公司 | Heat-dissipation fire protection glove |
| CN108813762A (en) * | 2018-08-06 | 2018-11-16 | 广东电网有限责任公司 | A kind of production method for the insulating glove that cools down |
| CN209677435U (en) * | 2019-01-14 | 2019-11-26 | 世目特种防护用品科技（江苏）有限公司 | A kind of creeping chill gloves |
| CN211608297U (en) * | 2019-12-09 | 2020-10-02 | 中山大学孙逸仙纪念医院 | Cooling gloves |
| CN213154276U (en) * | 2020-09-29 | 2021-05-11 | 成都职业技术学院 | Solar refrigeration helmet |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115127696A (en) * | 2022-06-28 | 2022-09-30 | 东莞市一群智汇电子科技有限公司 | Infant body temperature detection and automatic cooling equipment and control method thereof |
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