CN113916774A - Adhesion force determination method and device, electronic equipment and storage medium - Google Patents
Adhesion force determination method and device, electronic equipment and storage medium Download PDFInfo
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Abstract
The invention provides an adhesion force determination method, an adhesion force determination device, an electronic device and a storage medium. The method comprises the following steps: acquiring a target image; obtaining a profile envelope line corresponding to the target image based on the target image; obtaining a coordinate parameter of the profile envelope line under a preset coordinate system; determining the adhesion force based on the corresponding relation between the coordinate parameters and the adhesion force. The method can reduce the cost and improve the operability.
Description
Technical Field
The invention relates to the technical field of interface chemistry, in particular to an adhesion force determination method and device, electronic equipment and a storage medium.
Background
With the development of interfacial chemistry technology, the research on adhesion has become more and more important in many fields, such as chemistry, chemical engineering, petrochemical engineering, medicine or food. Adhesion refers to the ability of a material to adhere to the surface of another material. For example, the adhering material is a fluid, the adhered body is a solid, and the force of the fluid adhering to the surface of the solid is adhesion force. The research on the adhesion is more and more important in the field, because the adhesion directly affects the wetting performance of the fluid on the solid surface and has an important influence on the flow behavior of the multiphase fluid in the chemical equipment; for macroscopic equipment, the remaining fraction and the size distribution of the two-phase fluid near the solid surface can be greatly influenced, and for micro equipment with the characteristic size below a millimeter level, the flow form of the fluid can be directly determined, so that the equipment performance is greatly influenced.
In recent years, atomic force microscopes are developed and applied to accurate measurement of tiny acting force between liquid drops and other objects, however, the method relates to expensive precise instruments, and is high in research cost, complex in operation and high in popularization difficulty. Therefore, the method for measuring the adhesion between the liquid drop and the solid surface, which has the advantages of low development cost, simple operation and easy popularization, has important significance for promoting the research and development in the field.
Disclosure of Invention
The invention provides an adhesion force determination method, an adhesion force determination device, electronic equipment and a storage medium, which are used for solving the defects of high cost and complex operation of equipment in the prior art and achieving the purposes of low cost and easy operability of adhesion force determination.
The invention provides an adhesion force determination method, which comprises the following steps: acquiring a target image; obtaining a profile envelope line corresponding to the target image based on the target image; obtaining a coordinate parameter of the profile envelope line under a preset coordinate system; determining the adhesion force based on the corresponding relation between the coordinate parameters and the adhesion force.
The invention provides an adhesion force determining method, wherein the preset coordinate system comprises a cylindrical coordinate system, and the obtaining of coordinate parameters of the contour envelope line under the preset coordinate system comprises the following steps: obtaining a cylinder height value corresponding to the profile envelope curve under the cylindrical coordinate system; the determining the adhesion force based on the correspondence of the coordinate parameter to the adhesion force comprises: determining the adhesion radius value according to the cylinder height value; determining the adhesion force according to the adhesion radius value and the column height value.
The invention provides an adhesion force determination method, wherein the determination of the adhesion radius value according to the column height value comprises the following steps: determining a functional relationship of a cylinder height value and the adhesion radius value; and determining the adhesion radius value by using the cylinder height value according to the functional relation.
The invention provides an adhesion determination method, wherein the determination of the functional relationship between the cylinder height value and the adhesion radius value comprises the following steps: under the cylindrical coordinate system, the contour envelope is divided to obtain a sub-envelope sequence; in the sub-envelope sequence, acquiring a sub-cylinder height value and a sub-adhesion radius value corresponding to each sub-envelope, wherein the sub-cylinder height value and the sub-adhesion radius value have a one-to-one correspondence relationship; obtaining a sub-cylinder height value sequence and a sub-adhesion radius value sequence corresponding to the sub-envelope sequence according to the sub-cylinder height value and the sub-adhesion radius value; and according to the corresponding relation, performing function fitting on each sub-column height value in the sub-column height value sequence and each sub-adhesion radius value in the sub-adhesion radius value sequence to determine the functional relation.
The invention provides an adhesion force determination method, wherein the coordinate parameter comprises a curvature radius value, and the determining the adhesion force based on the corresponding relation between the coordinate parameter and the adhesion force comprises the following steps: determining the adhesion force based on a correlation of the curvature radius value and the adhesion force.
The invention provides an adhesion force determining method, wherein the step of obtaining a contour envelope corresponding to a target image based on the target image comprises the following steps: determining an edge image corresponding to the target image; and performing curve fitting on the coordinate values of all the pixel points in the edge image to obtain the profile envelope curve.
According to the present invention, there is provided an adhesion determination device comprising: the image acquisition module is used for acquiring a target image; a contour envelope acquiring module, configured to obtain a contour envelope corresponding to the target image based on the target image; the coordinate parameter obtaining module is used for obtaining the coordinate parameters of the contour envelope line under a preset coordinate system; and the adhesion force determining module is used for determining the adhesion force based on the corresponding relation between the coordinate parameters and the adhesion force.
According to an adhesion determination apparatus provided by the present invention, the coordinate parameter obtaining module includes: a cylinder height value obtaining unit, configured to obtain a cylinder height value corresponding to the profile envelope curve in the cylindrical coordinate system; the adhesion force determination module comprises an adhesion radius value determination unit for determining the adhesion radius value from the cylinder height value; an adhesion force determination unit for determining the adhesion force based on the adhesion radius value and the cylinder height value.
The present invention also provides an electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, the processor implementing the steps of the adhesion determination method as described in any of the above when executing the program.
The invention also provides a non-transitory computer-readable storage medium having stored thereon a computer program which, when executed by a processor, carries out the steps of the adhesion determination method as described in any of the above.
According to the adhesion force determining method, a target image is obtained, a profile envelope curve corresponding to the target image is obtained on the basis of the target image, and coordinate parameters of the profile envelope curve are obtained under a preset coordinate system; determining the adhesion force based on the corresponding relation between the coordinate parameters and the adhesion force; the adhesion force can be determined by obtaining a coordinate parameter through a process of parameterizing the image, and by a correspondence relationship between the coordinate parameter and the adhesion force.
Drawings
In order to more clearly illustrate the technical solutions of the present invention or the prior art, the drawings needed for the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 is one of the application diagrams of the scenario of the adhesion determination method provided by the present invention;
FIG. 2 is a schematic flow chart of a method for determining adhesion provided by the present invention;
FIG. 3 is a second schematic flow chart of the adhesion determination method provided by the present invention;
FIG. 4 is a third schematic flow chart of the adhesion determination method provided by the present invention;
FIG. 5 is a second diagram of the application of the method for determining adhesion provided by the present invention;
FIG. 6 is a schematic of a fitted curve for the adhesion determination method provided by the present invention;
FIG. 7 is a schematic view of the structure of an adhesion determination device provided by the present invention;
fig. 8 is a schematic structural diagram of an electronic device provided in the present invention.
Reference numerals:
1: a light source; 2: a solid; 3: a liquid drop fixing probe;
4: a transparent container; 5: a microscope; 6: an online camera;
7: a display screen.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The adhesion force determination method provided by the application can be applied to the application environment shown in fig. 1, and is particularly applied to an adhesion force determination system. The adhesion determination system includes a server 102 and an image capture device 104, wherein the server 102 is coupled to the image capture device 104. The server 102 executes an adhesion determination method, and specifically, the server 102 acquires a target image from the image acquisition device 104; obtaining a profile envelope line corresponding to the target image based on the target image; obtaining a coordinate parameter of the profile envelope line under a preset coordinate system; and determining the adhesion force based on the corresponding relation between the coordinate parameters and the adhesion force. The image capturing device 104 may be, but is not limited to, various devices with image capturing functions, such as: the image capture device 104 may be a variety of cameras, scanners, various cameras, image capture cards. It can be understood that the image processing method provided by the embodiment of the present application may also be executed by a terminal. The server 102 may be implemented as a stand-alone server or as a server cluster comprised of multiple servers.
The adhesion determination method of the present invention is described below with reference to fig. 2 to 4.
In one embodiment, as shown in fig. 2, an adhesion determination method is provided, which is described by taking the method as an example applied to the server in fig. 1, and includes the following steps:
step 202, a target image is acquired.
Specifically, an image stored locally or transmitted to a server in real time may be acquired as the target image.
In one embodiment, after the server receives the adhesion force determining instruction, the adhesion force determining instruction carries an image identifier of the target image, and the terminal can acquire the target image from the locally stored image through the image identifier.
In one embodiment, the target image may be acquired by an image acquisition device. The image acquisition equipment is connected with the server, when the image acquisition equipment receives an image acquisition instruction of the server, the acquired real-time image or the image locally stored by the image acquisition equipment is transmitted to the terminal, and the terminal takes the received image as a target image to perform image processing. The image acquisition equipment comprises various cameras, scanners, various cameras, image acquisition cards and the like. It can be understood that the target image can be displayed through the display device connected with the server, so that the condition of the collected target image can be visually checked.
In one embodiment, the image acquisition device may sequentially or batch-wise transmit the acquired target images to the server according to a certain time interval, and the server may store the acquired images locally for later use, or perform real-time processing after receiving the images. So as to collect target images generated at different times and perform dynamic analysis on the target images.
And 204, obtaining a corresponding contour envelope curve of the target image based on the target image.
The contour envelope is a curve or a straight line that can envelop the target image. For example, the image is a circular image, and a circular curve enveloping the circular image is a contour envelope of the circular image.
Specifically, after acquiring a target image, the server performs image processing on the target image to obtain a profile envelope corresponding to the target image.
In one embodiment, after a server acquires a target image, edge extraction is performed on the target image to obtain an edge image corresponding to the target image, and a fitting tool is used to perform curve fitting on the edge image to obtain a profile envelope corresponding to the target image.
In an embodiment, in the process of performing curve fitting on the edge image by using the fitting tool, the coordinate value of each pixel point on the edge image is extracted, and the coordinate value of each pixel point is subjected to curve fitting to obtain a profile envelope corresponding to the target image.
And step 206, obtaining the coordinate parameters of the profile envelope curve in a preset coordinate system.
The coordinate parameter refers to a parameter related to a coordinate of the profile envelope in a preset coordinate system. For example, the height of the envelope of the profile, the radius of curvature of the lowermost end of the envelope, or the like.
Specifically, after obtaining the profile envelope, the server converts the profile envelope into a profile envelope in a preset coordinate system.
In one embodiment, the preset coordinate system may be a cylindrical coordinate system, and the profile envelope is converted into a representation in the cylindrical coordinate system, so that each coordinate parameter of the profile envelope in the cylindrical coordinate system may be obtained.
And step 208, determining the adhesion force based on the corresponding relation between the coordinate parameters and the adhesion force.
Wherein adhesion refers to the ability of one material to adhere to the surface of another material. For example, the ability of a certain droplet to adhere to a solid surface. The adhesion may be expressed in numerical form, for example, adhesion of 1000 newtons.
Specifically, after obtaining the coordinate parameters of the profile envelope, the server determines the adhesion force by using one or more of the coordinate parameters based on the correspondence between the coordinate parameters and the adhesion force.
In one embodiment, the coordinate parameter includes a curvature radius value, and the adhesion force is determined based on a correlation of the curvature radius value and the adhesion force.
In one embodiment, under a cylindrical coordinate system, a curvature radius value of the lowest end of the profile envelope in the vertical direction is obtained, and the adhesion is determined by utilizing the correlation relationship between the curvature radius value and the adhesion.
In one embodiment, the above-mentioned curvature radius value is denoted by b, and the adhesion force is denoted by F, and the adhesion force F can be obtained by the curvature radius value b using the correlation between the curvature radius value b and the adhesion force F. Taking the attachment as a liquid drop and the attached object as a solid surface as an example, the density difference between the fluid in the liquid drop and the external fluid is represented as Δ ρ, the gravitational acceleration is represented as g, the interfacial (surface) tension between the liquid drop and the external fluid is represented as σ, the action range between the liquid drop and the solid surface is represented as a, the function expression of the outline curve of the liquid drop is represented as r, and the relationship among the function r, the adhesive forces F and b can be represented as the following formula:
in the adhesion force determining method, a target image is obtained, a profile envelope curve corresponding to the target image is obtained based on the target image, and coordinate parameters of the profile envelope curve are obtained in a preset coordinate system; determining the adhesion force based on the corresponding relation between the coordinate parameters and the adhesion force; the coordinate parameters can be obtained through the parameterization processing of the image, and the adhesion force is determined through the corresponding relation between the coordinate parameters and the adhesion force, so that the accuracy of the adhesion force determination is improved.
In one embodiment, the predetermined coordinate system includes a cylindrical coordinate system, and the obtaining of the coordinate parameter of the profile envelope under the predetermined coordinate system includes: obtaining a cylinder height value corresponding to the profile envelope curve under the cylindrical coordinate system; determining the adhesion force based on the correspondence of the coordinate parameter to the adhesion force comprises: determining an adhesion radius value according to the height value of the column; and determining the adhesion force according to the adhesion radius value and the column height value.
The cylindrical coordinate system is a coordinate system in which a plane polar coordinate and a Z-direction distance value are used to define a spatial coordinate of the profile envelope. The cylinder height value is a height value expressed by the profile envelope in the cylindrical coordinate system. The height value is the same as the above-mentioned Z-direction distance value. The sticking radius value is a distance from an origin represented by the contour envelope to a projected point of a certain point on the cylinder plane on the plane xoy in the cylindrical coordinate system.
Specifically, coordinate system conversion is performed on the contour envelope under a cylindrical coordinate system to obtain a Z-direction distance value, and assuming that the cylinder height value is represented as Z and the distance value is represented as d, the distance value d is taken as the cylinder height value Z.
In one embodiment, taking the attachment as a liquid droplet and the attached object as a solid surface as an example, the density difference between the fluid inside the liquid droplet and the fluid outside the liquid droplet is represented as Δ ρ, the gravitational acceleration is represented as g, the surface tension between the liquid droplet and the fluid outside the liquid droplet is represented as σ, the random parameter is represented as a, the attachment radius value of the liquid droplet is represented as r, and the adhesion force is represented as F, then the adhesion force F can be obtained according to the adhesion radius value r and the cylinder height value z, and the adhesion force F is represented as the formula:
in the embodiment, a cylinder height value corresponding to the profile envelope is obtained in the cylindrical coordinate system, and an adhesion radius value is determined according to the cylinder height value; and determining the adhesion force according to the adhesion radius value and the column height value. The method can achieve the aim of accurately determining the adhesion force under the condition of knowing the adhesion radius value and the column height value, and improves the accuracy of determining the adhesion force by using a differential geometric method.
In one embodiment, determining the stick radius value from the cylinder height value comprises: determining a functional relationship between the cylinder height value and the adhesion radius value; and determining the adhesion radius value by using the cylinder height value according to the functional relation between the cylinder height value and the adhesion radius value.
The functional relationship is a certain determined relationship which is presented by the change of the height value of the column, the change of the adhering radius value and the change of the height value of the column.
Specifically, after the server obtains the column height value, the server may obtain the adhesion radius value corresponding to the column height value through a functional relationship between the column height value and the adhesion radius value.
In this embodiment, the adhesion radius value is determined by using the column height value through the functional relationship between the column height value and the adhesion radius value, so that the purpose of accurately obtaining the adhesion radius value by using the functional relationship under the condition that the column height value is known can be achieved, and further, more accurate adhesion can be obtained by using the adhesion radius value and the column height value.
In one embodiment, as shown in FIG. 3, determining a functional relationship of a cylinder height value to an adhesion radius value comprises:
and step 302, dividing the profile envelope curve in a cylindrical coordinate system to obtain a subconscious circle line sequence.
The sub-envelope sequence is a sequence of sub-envelopes obtained by cutting the contour envelope in a certain direction, for example, transversely or longitudinally. For example, the contour envelope is divided in a cylindrical coordinate system to obtain a sub-envelope sequence having an initial contour envelope order.
In one embodiment, the contour envelope may be divided vertically, and the divided sub-packet lines are sorted from small to large according to the size of the vertical coordinate to obtain a sequence of sub-packet lines.
And 304, acquiring a sub-cylinder height value and a sub-adhesion radius value corresponding to each sub-envelope in the sub-envelope sequence, wherein the sub-cylinder height value and the sub-adhesion radius value have a one-to-one correspondence relationship.
Specifically, after obtaining the sub-envelope sequence, the server includes at least one sub-envelope in the sub-envelope sequence, and each sub-envelope includes a respective sub-pillar height value and a sub-adhesion radius value, so as to obtain a sub-pillar height value and a sub-adhesion radius value corresponding to each sub-envelope. And the height value of the sub-cylinder and the value of the sub-adhesion radius of the same envelope line have a one-to-one correspondence relationship.
And step 306, obtaining a sub-cylinder height value sequence and a sub-adhesion radius value sequence corresponding to the sub-envelope sequence according to the sub-cylinder height value and the sub-adhesion radius value.
Specifically, after obtaining the sub-cylinder height value and the sub-adhesion radius value corresponding to each sub-wrap line in the sub-wrap line sequence, the server obtains the sub-cylinder height value sequence and the sub-adhesion radius value sequence corresponding to the sub-wrap line sequence according to the arrangement sequence of the sub-wrap lines in the sub-wrap line sequence. The height values of the sub-columns and the sub-adhesion radius values have a one-to-one correspondence relationship, and the height value sequences of the sub-columns and the sub-adhesion radius value sequences also have a one-to-one correspondence relationship. For example, the sequence of sub-envelopes is { x1, x2, … … xn }, assuming that the height value of the sub-column corresponding to the sub-envelope x1 of the sub-envelope sequence is z1 and the sub-adhesion radius value r1, the height value of the sub-column corresponding to the sub-envelope x2 of the sub-envelope sequence is z2 and the sub-adhesion radius value r2, and so on, the height value of the sub-column corresponding to the sub-envelope x xn of the sub-envelope sequence is zn and the sub-adhesion radius value rn is obtained, so that the sequence of height values of the sub-column { z1, z2, … … zn }, and the sequence of sub-adhesion radius values { r1, r2, … … rn } are obtained. And the numerical values at the same sequence numbers in the sequence of sub-column height values { z1, z2, … … zn } have a one-to-one correspondence with the numerical values at the same sequence numbers in the sequence of sub-adhesion radius values { r1, r2, … … rn }, for example, the sub-adhesion radius value r1 has a one-to-one correspondence with the sub-column height value z1, the sub-adhesion radius value rn has a one-to-one correspondence with the sub-column height value zn, and so on.
And 308, performing function fitting on each sub-column height value in the sub-column height value sequence and each sub-adhesion radius value in the sub-adhesion radius value sequence according to the corresponding relation to determine a functional relation.
Wherein, the function fitting means that a data point set consisting of each sub-column height value and the sub-adhesion radius value is used for fitting the data point set into a function; for example, a fitting curve may be formed using a data point set composed of each sub-cylinder height value and sub-adhesion radius value, the fitting curve may be represented using a function, and a function capable of representing the fitting curve may represent a functional relationship between each sub-cylinder height value and sub-adhesion radius value.
In one embodiment, after obtaining the sequence of sub-cylinder height values and the sequence of sub-stick radius values, the server may form a set of corresponding value pairs by the sub-cylinder height values and the sub-stick radius values at each corresponding identical sequence position in the sequence, and perform function fitting through each value pair in the set to obtain the functional relationship. For example, the set of value pairs consisting of each sub-column height value and sub-adhesion radius value is { { r1, z1} { r2, z2} … … { rn, zn } }, and a functional fit is performed through each value pair in the set to obtain a functional relationship between the sub-column height value and the sub-adhesion radius value, which can be expressed as:
r＝f(z)
in this embodiment, the contour envelope is segmented in a cylindrical coordinate system to obtain a sub-wrap-around line sequence, a sub-cylinder height value sequence and a sub-adhesion radius value sequence corresponding to each sub-wrap-around line are obtained in the sub-wrap-around line sequence, and according to the corresponding relationship, the function fitting is performed on each sub-cylinder height value and each sub-adhesion radius value to obtain a functional relationship, so that the purpose of accurately obtaining the functional relationship between the cylinder height value and the adhesion radius value can be achieved.
In one embodiment, the coordinate parameter includes a curvature radius value, and determining the adhesion force based on the correspondence of the coordinate parameter to the adhesion force includes: the adhesion force is determined based on the correlation of the curvature radius value and the adhesion force.
The curvature refers to a rotation rate of a tangent direction angle to an arc length at a certain point on the contour envelope, and can represent the bending degree of the contour envelope, and the larger the curvature is, the larger the bending degree of the contour envelope is; similarly, a smaller curvature means a smaller degree of curvature of the profile envelope. The curvature radius value refers to the inverse of the curvature.
Specifically, there is a correlation between the curvature radius value and the adhesion force, and the larger the curvature radius value is, the smaller the adhesion force is, and similarly, the smaller the curvature radius value is, the larger the adhesion force is. The adherent is a liquid droplet, and the adherent is a solid surface. Assuming that a curvature radius value is represented by b, a density difference between the fluid inside the droplet and the fluid outside is represented by Δ ρ, gravitational acceleration is represented by g, surface tension between the droplet and the fluid outside is represented by σ, a random parameter is represented by a, an adhesion radius value of the droplet is represented by r, and adhesion force is represented by F, the adhesion force F is represented by the formula:
in this embodiment, through the correlation between the curvature radius value and the adhesion force, the purpose of accurately determining the adhesion force according to the curvature radius value by using the correlation can be achieved.
In one embodiment, as shown in fig. 4, obtaining the profile envelope corresponding to the target image based on the target image includes:
step 402, determining an edge image corresponding to the target image.
The edge image is an image obtained by extracting an edge of a target image.
In one embodiment, the target image may be processed using an edge extraction algorithm to obtain an edge image. For example, the target image may be processed by a differential method, a fitting method, a wavelet transform, an artificial intelligence algorithm, or the like to obtain an edge image.
And step 404, performing curve fitting on the coordinate values of all the pixel points in the edge image to obtain a profile envelope curve.
The curve fitting means that discrete points are connected by a continuous curve to form an approximate curve.
Specifically, each pixel point on the edge image has a coordinate value, and the pixel points are sequentially connected according to the sequence of the coordinate values from small to large or from large to small to form an approximate curve, which can be regarded as a profile envelope curve.
In this embodiment, the edge image corresponding to the target image is determined, and the coordinate values of the pixel points in the edge image are subjected to curve fitting to obtain the profile envelope, so that the purpose of obtaining the accurate profile envelope can be achieved.
In one embodiment, as shown in FIG. 5, the adhesion determination system includes a light source 1, a solid body 2, a liquid drop fixing probe 3, a transparent container 4, a microscope 5, an online camera 6, and a display 7. The microscope 5 is connected with the online camera 6, the liquid drop image to be shot can be viewed by the microscope 5, the liquid drop image is shot by the online camera 6 and is transmitted to the server connected with the online camera 6 through the online camera 6, and the liquid drop image is displayed on the display screen 7 in a visual mode. It will be appreciated that when the microscope 5 views the droplet image, the light source 1 is required in order to make the edges of the viewed image more sharp. The shot liquid drop is present in the transparent container 4, the liquid drop adheres to the surface of the solid 2, the other end of the liquid drop adheres by the liquid drop fixing probe 3, and the liquid drop fixing probe 3 is moved upward so as to be slowly separated from the surface 2 of the solid 2, thereby generating adhesion between the liquid drop and the surface of the solid 2.
In one embodiment, the image processing is performed on the droplet image to obtain an edge image corresponding to the droplet image, the edge image is subjected to curve fitting of the edge to obtain a curve corresponding to the droplet image, the curve is as shown in fig. 6, the curve is converted into a cylindrical coordinate system, and the adhesion between the droplet and the solid surface is obtained through at least one coordinate parameter of the curve in the cylindrical coordinate system. Assuming that the coordinate parameters include a curvature radius at the lowermost end of the curve denoted by b, a density difference between the fluid in the droplet and the external fluid denoted by Δ ρ, a gravitational acceleration denoted by g, a surface tension between the droplet and the external fluid denoted by σ, a random parameter denoted by a, an adhesion radius of the droplet denoted by r, and an adhesion force denoted by F, the adhesion force F is expressed as a formula:
it is understood that the random parameter a may be determined by empirical values or other reasonable values, and may be one random parameter a corresponding to one adhesion force F, multiple random parameters a corresponding to one adhesion force F or multiple adhesion forces F. For example, the adhesion of pure water droplets to the surface of stainless steel in an n-octane solution is determined, n-octane is charged into a transparent container, a stainless steel sheet is placed in the bottom of the container, a pure water droplet is placed on the surface of the stainless steel, the droplet is 2 mm in horizontal diameter, then a stainless steel needle is used as a droplet fixing probe to be adhered above the droplet, the probe is moved upward at a speed of 0.1 μm/sec, the adhesion of the droplet to the surface of the stainless steel is measured when the droplet is decomposed into a state of being detached from and not detached from the surface of the stainless steel, and the adhesion between the droplet and the surface of the solid is 5.7X 10-6Newton. As another example, the interaction force between n-dodecanol droplets in pure water and the glass surface was measured: pure water is filled in a transparent container, a glass sheet is preset at the bottom of the container, a n-dodecanol liquid drop is placed on the surface of the glass, the liquid drop is a liquid drop with the horizontal diameter of 1 mm, a polytetrafluoroethylene needle head is used as a liquid drop fixing probe to be adhered above the liquid drop, the probe moves upwards at the speed of 0.2 microns per second, and the adhesion force of the liquid drop is measured immediately before the liquid drop is separated from the surface of the glass. Comparing the picture of the liquid drop with the outline of the liquid drop, and when the calculated curve is in perfect conformity with the outline of the liquid drop obtained by shooting, the adhesion force obtained by regression is 3.7 multiplied by 10-7N。
In the embodiment, the adhesion force between the liquid drop and the solid surface can be obtained through the liquid drop image by a mathematical analysis method, so that the measurement precision can reach 10 while the cost is reduced and the operation difficulty is reduced-7Thereby improving the accuracy of adhesion determination.
The adhesion force determination device provided by the present invention is described below, and the adhesion force determination device described below and the adhesion force determination method described above may be referred to in correspondence with each other.
In one embodiment, as shown in fig. 7, there is provided an adhesion determination apparatus 700, comprising: an image acquisition module 702, a contour envelope acquisition module 704, a coordinate parameter derivation module 706, and an adhesion determination module 708, wherein: an image acquisition module 702, configured to acquire a target image; a contour envelope acquiring module 704, configured to obtain a contour envelope corresponding to a target image based on the target image; a coordinate parameter obtaining module 706, configured to obtain a coordinate parameter of the profile envelope in a preset coordinate system; an adhesion determination module 708 for determining the adhesion based on the correspondence of the coordinate parameter to the adhesion.
In one embodiment, the predetermined coordinate system comprises a cylindrical coordinate system, and the coordinate parameter obtaining module 706 comprises: a cylinder height value obtaining unit, configured to obtain a cylinder height value corresponding to the profile envelope curve in a cylindrical coordinate system; the adhesion force determining module comprises an adhesion radius value determining unit, a measuring unit and a control unit, wherein the adhesion radius value determining unit is used for determining an adhesion radius value according to the height value of the cylinder; and the adhesion force determining unit is used for determining the adhesion force according to the adhesion radius value and the column height value.
In an embodiment, the stick radius value determination unit is adapted to determine the stick radius value using the cylinder height value as a function of the cylinder height value and the stick radius value.
In one embodiment, the adhesion radius value determining unit is configured to segment the contour envelope in a cylindrical coordinate system to obtain a sub-envelope sequence; in the sub-envelope line sequence, acquiring a sub-cylinder height value sequence and a sub-adhesion radius value sequence corresponding to each sub-envelope line, wherein the sub-cylinder height value sequence and the sub-adhesion radius value sequence have a one-to-one correspondence relationship; obtaining a sub-cylinder height value sequence and a sub-adhesion radius value sequence corresponding to the sub-envelope sequence according to the sub-cylinder height value and the sub-adhesion radius value; and performing function fitting on each sub-column height value in the sub-column height value sequence and the sub-adhesion radius value in the sub-adhesion radius value sequence according to the corresponding relation to obtain a functional relation.
In one embodiment, the adhesion determination module is configured to determine the adhesion based on a correlation of the curvature radius value and the adhesion.
In one embodiment, the contour envelope obtaining module is configured to determine an edge image corresponding to a target image; and performing curve fitting on the coordinate values of all the pixel points in the edge image to obtain a profile envelope curve.
Fig. 8 illustrates a physical structure diagram of an electronic device, and as shown in fig. 8, the electronic device may include: a processor (processor)810, a communication Interface 820, a memory 830 and a communication bus 840, wherein the processor 810, the communication Interface 820 and the memory 830 communicate with each other via the communication bus 840. Processor 810 may invoke logic instructions in memory 830 to perform an adhesion determination method comprising: acquiring a target image; obtaining a profile envelope line corresponding to the target image based on the target image; obtaining a coordinate parameter of the profile envelope line under a preset coordinate system; determining the adhesion force based on the corresponding relation between the coordinate parameters and the adhesion force.
In addition, the logic instructions in the memory 830 may be implemented in software functional units and stored in a computer readable storage medium when the logic instructions are sold or used as independent products. Based on such understanding, the technical solution of the present invention may be embodied in the form of a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
In another aspect, the present invention also provides a computer program product comprising a computer program stored on a non-transitory computer-readable storage medium, the computer program comprising program instructions which, when executed by a computer, enable the computer to perform the adhesion determination method provided by the above methods, the method comprising: acquiring a target image; obtaining a profile envelope line corresponding to the target image based on the target image; obtaining a coordinate parameter of the profile envelope line under a preset coordinate system; determining the adhesion force based on the corresponding relation between the coordinate parameters and the adhesion force.
In yet another aspect, the present invention also provides a non-transitory computer readable storage medium having stored thereon a computer program that when executed by a processor is implemented to perform the adhesion determination methods provided above, the method comprising: acquiring a target image; obtaining a profile envelope line corresponding to the target image based on the target image; obtaining a coordinate parameter of the profile envelope line under a preset coordinate system; determining the adhesion force based on the corresponding relation between the coordinate parameters and the adhesion force.
The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.
Through the above description of the embodiments, those skilled in the art will clearly understand that each embodiment can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware. With this understanding in mind, the above-described technical solutions may be embodied in the form of a software product, which can be stored in a computer-readable storage medium such as ROM/RAM, magnetic disk, optical disk, etc., and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the methods described in the embodiments or some parts of the embodiments.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. An adhesion determination method, comprising:
acquiring a target image;
obtaining a profile envelope line corresponding to the target image based on the target image;
obtaining a coordinate parameter of the profile envelope line under a preset coordinate system;
determining the adhesion force based on the corresponding relation between the coordinate parameters and the adhesion force.
2. The adhesion determination method of claim 1, wherein the predetermined coordinate system comprises a cylindrical coordinate system, and the obtaining the coordinate parameters of the profile envelope under the predetermined coordinate system comprises:
obtaining a cylinder height value corresponding to the profile envelope curve under the cylindrical coordinate system;
the determining the adhesion force based on the correspondence of the coordinate parameter to the adhesion force comprises:
determining the adhesion radius value according to the cylinder height value;
determining the adhesion force according to the adhesion radius value and the column height value.
3. The adhesion determination method of claim 2, wherein determining the adhesion radius value as a function of the cylinder height value comprises:
determining a functional relationship of the cylinder height value and the adhesion radius value;
and determining the adhesion radius value by using the cylinder height value according to the functional relation.
4. The adhesion determination method of claim 3, wherein the determining the functional relationship of the cylinder height value to the adhesion radius value comprises:
under the cylindrical coordinate system, the contour envelope is divided to obtain a sub-envelope sequence;
in the sub-wrap line sequence, acquiring a sub-cylinder height value and a sub-adhesion radius value corresponding to each sub-wrap line, wherein the sub-cylinder height value and the sub-adhesion radius value have a one-to-one correspondence relationship;
obtaining a sub-cylinder height value sequence and a sub-adhesion radius value sequence corresponding to the sub-envelope sequence according to the sub-cylinder height value and the sub-adhesion radius value;
and according to the corresponding relation, performing function fitting on each sub-column height value in the sub-column height value sequence and each sub-adhesion radius value in the sub-adhesion radius value sequence to determine the functional relation.
5. The adhesion determination method of claim 1, wherein the coordinate parameter comprises a curvature radius value; the determining the adhesion force based on the correspondence of the coordinate parameter to the adhesion force comprises:
determining the adhesion force based on a correlation of the curvature radius value and the adhesion force.
6. The method of claim 1, wherein the deriving a profile envelope corresponding to the target image based on the target image comprises:
determining an edge image corresponding to the target image;
and performing curve fitting on the coordinate values of all the pixel points in the edge image to obtain the profile envelope curve.
7. An adhesion determination device, comprising:
the image acquisition module is used for acquiring a target image;
a contour envelope acquiring module, configured to obtain a contour envelope corresponding to the target image based on the target image;
the coordinate parameter obtaining module is used for obtaining the coordinate parameters of the contour envelope line under a preset coordinate system;
and the adhesion force determining module is used for determining the adhesion force based on the corresponding relation between the coordinate parameters and the adhesion force.
8. The adhesion determination device of claim 7, wherein the predetermined coordinate system comprises a cylindrical coordinate system, and the coordinate parameter deriving module comprises:
a cylinder height value obtaining unit, configured to obtain a cylinder height value corresponding to the profile envelope curve in the cylindrical coordinate system;
the adhesion force determination module comprises an adhesion radius value determination unit for determining the adhesion radius value from the cylinder height value;
an adhesion force determination unit for determining the adhesion force based on the adhesion radius value and the cylinder height value.
9. An electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, characterized in that the processor implements the steps of the adhesion determination method according to any one of claims 1 to 6 when executing the program.
10. A non-transitory computer readable storage medium, having stored thereon a computer program, wherein the computer program, when executed by a processor, implements the steps of the adhesion determination method according to any one of claims 1 to 6.
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