CN113901663B - Electromechanical thermal coupling design method for tile-type phased array antenna - Google Patents
Electromechanical thermal coupling design method for tile-type phased array antenna Download PDFInfo
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Abstract
The invention discloses an electromechanical thermal coupling design method of a tile-type phased array antenna, which belongs to the technical field of active phased array antenna design and comprises the following steps: s1: constructing an antenna multidisciplinary design model; s2: constructing an antenna multidisciplinary design model fusing knowledge; s3: constructing a field road collaborative analysis model; s4: and (4) evaluating the electromechanical thermal coupling performance. The method realizes the matching and transmission of the multi-physical-field performance simulation data of the antenna on the electromechanical common characteristics of the model by carrying out characteristic classification, simplification and matching recombination on the initial model of the structure and telecommunication specialty, realizes the rapid reconstruction of a multidisciplinary design model of an antenna system by carrying out parameterization processing on key characteristic variables of the model, and improves the accuracy and the efficiency of electromechanical thermal coupling analysis of the active tile type phased array antenna; and the design and analysis of the influence of the service load of the array surface and the temperature change of the transceiving component on the scattering characteristic of the antenna system are realized, and a design method suitable for engineering is provided for the electromechanical thermal coupling performance evaluation of the active tile type phased array antenna.
Description
Technical Field
The invention relates to the technical field of active phased array antenna design, in particular to an electromechanical thermal coupling design method of a tile-type phased array antenna.
Background
The tile type phased array antenna has the characteristics of low section, high integration level, strong designability and the like, and is widely used in the fields of airborne and satellite-borne antennas and the like. With the continuous improvement of the requirements on the power, weight and environmental adaptability of the antenna, the system integration level, the working power and the complexity of the service environment of the tile-type phased array antenna are increased, and particularly, the telecommunication performance of the antenna is very sensitive to array surface deformation and component heat consumption of the tile-type antenna with high frequency band and high power. The close coupling among the electromagnetic field, the displacement field and the temperature field is directly related to the comprehensive performance of the tile-type phased array antenna and must be considered in the design stage of the scheme.
At present, the antenna design in engineering mainly adopts a separation mode of telecommunication design leading, structure and heat dissipation design lagging, the structure and the telecommunication model are independent, performance analysis data lack direct interaction boundary, the influence of deformation and heat dissipation performance on the telecommunication index of the antenna in a service environment is difficult to accurately evaluate in a scheme stage, and especially for a high-frequency-band and high-power tile type antenna, the performance deviation amplitude and the repeated iteration cycle of the antenna brought by the design mode are unacceptable in engineering design.
Aiming at the electromechanical thermal coupling design requirements of a high-integration and high-power tile-type phased array antenna, represented by the Anthrasia and Siemens software company, a Workbench and Simcenter multidisciplinary simulation platform is respectively established, a basic tool is provided for the electromechanical thermal coupling design of the antenna, but an electromechanical thermal coupling design method of the tile-type phased array antenna is not provided. He Qingjiang and the like of institute of electronics and technology 10 of china provide a cross-section design architecture of a highly integrated tile-type phased array antenna, but no specific electromechanical thermal coupling design method is provided. Zhou Jinzhu of the university of west ann electronic technology, etc. cooperates with the institute of electronic technology of china, institute of technology 38, develops cooperative research on the theory and technology of multi-field coupling of microwave antennas, develops a multi-field coupling analysis method for antenna arrays and transceiving components, and applies for the following related patents.
The patent applied by the university of electronic technology in Xian is named as a multi-field coupling analysis method and a computer program of a phased array antenna, the application date is 2017, 10 and 20 months, and the application number is 201710997073.6. The method can realize automatic and accurate reconstruction of the deformed antenna model, and carry out coupling analysis of the structural displacement field and the electromagnetic field on the antenna array surface. This patent suffers from certain deficiencies, such as: 1) The related object is an antenna array surface which cannot cover a tile-type phased array antenna comprising the antenna array surface and a transceiving component; 2) The proposed method is limited in that the command stream is difficult to adapt to tile phased array antennas with complex structures; 3) Multidisciplinary modeling and service environment knowledge modeling of tile-type phased array antennas are not involved.
The patent applied to 38 th research institute of China electronics and technology group, entitled "multidisciplinary modeling and design method of a multichannel sheet type TR component", with the application date of 2018, 1 month and 30 days and the application number of 201810089043.X, discloses a multidisciplinary modeling and design method of a multichannel sheet type TR component. This patent also has certain disadvantages, such as: 1) The related object is a transmitting and receiving component and cannot cover a tile-type phased array antenna comprising an antenna array surface and the transmitting and receiving component; 2) The multidisciplinary modeling method can realize that the transceiver component carries out rapid modeling of the structure and various circuit characteristics in the same software, but does not provide the multidisciplinary modeling method of the tile-type phased array antenna based on the problem that the structure and the telecommunication model lack direct performance interaction boundary.
The patent applied by the university of western ' an electronic technology is named as ' method and system for analyzing electrical property of an active phased array antenna integrating temperature knowledge ', the application date is 3 and 19 in 2018, and the application number is 201810226315.6. The patent also has certain disadvantages, such as: 1) A specific method for evaluating the influence of the temperature of the component on the electrical property of the phased array antenna is provided from the circuit analysis angle, but the design content of the electromechanical thermal coupling of the complete tile-type phased array antenna cannot be covered; 2) The components adopted in the method are simple models of ideal circuit element combination, and do not relate to the actual receiving and transmitting component models of engineering; 3) Multidisciplinary modeling of tiled phased array antennas is not involved.
In summary, the above patents relate to a multidisciplinary collaborative analysis method for an antenna array plane, a transceiver component and an antenna system cascade circuit, but the related objects cannot cover a complete tile-type phased array antenna, and the related multidisciplinary modeling method and analysis method cannot simply combine to solve the electromechanical and thermal coupling design problem of the tile-type phased array antenna, so that a complete tile-type phased array antenna multidisciplinary collaborative design method including antenna multidisciplinary modeling, service environment knowledge modeling and field coupling performance analysis is lacked from the top design perspective, and rapid and accurate design and evaluation of high-integration and high-power tile-type phased array antenna, electrical and thermal performances are difficult to achieve in the engineering scheme stage. Therefore, an electromechanical thermal coupling design method of the tile-type phased array antenna is provided.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the method provides a tile-type phased array antenna multidisciplinary collaborative design method comprising antenna multidisciplinary modeling, service environment knowledge modeling and field coupling performance analysis from the top design angle, and realizes quick and accurate design and evaluation of mechanical, electrical and thermal performances of a high-integration and high-power tile-type phased array antenna in an engineering scheme stage.
The invention solves the technical problems through the following technical scheme, and the invention comprises the following steps:
s1: building antenna multidisciplinary design model
According to an antenna initial model provided by the structure specialty and the telecommunication specialty, an antenna array electromechanical coupling model and a receiving and transmitting assembly thermoelectric coupling model are generated through classification, simplification, matching and recombination of model features, parameterization processing is carried out on key feature variables, and finally an active tile type phased array antenna multidisciplinary design model is formed;
s2: multi-disciplinary design model for constructing tile-type phased array antenna with fusion knowledge
Completing knowledge modeling of service load and radio frequency device temperature performance parameters of the active tile type phased array antenna by adopting theoretical modeling and data modeling modes, establishing a mapping relation between a knowledge model and analysis boundary conditions of the active tile type phased array antenna multidisciplinary design model in the step S1, and forming an active tile type phased array antenna multidisciplinary design model fusing knowledge;
s3: field-path collaborative analysis model for constructing tile-type phased-array antenna
For the multidisciplinary design model of the active tile-type phased array antenna with knowledge fused in the step S2, a multidisciplinary analysis platform tool is utilized to cooperatively solve the antenna array surface-machine electric coupling model and the receiving and transmitting assembly thermoelectric coupling model, and a circuit cooperative analysis model of the active tile-type phased array antenna is constructed based on the solved scattering characteristic data;
s4: electromechanical thermal coupling performance evaluation
And (3) finishing the evaluation of antenna array surface deformation and component temperature distribution factors on the telecommunication performance of the active tile type phased array antenna in a service environment, optimizing the key characteristic dimension and the analysis boundary condition in the step (S1) when the telecommunication index requirement is not met, updating the multidisciplinary design model of the active tile type phased array antenna, and performing iterative analysis in the step (S3) until the telecommunication performance of the antenna meets the index requirement.
Further, in step S1, the model features are classified, that is, the model features are classified according to disciplinary relevance and are classified into structural features, telecommunication features and electromechanical common features according to whether the features can be ignored during the antenna structure and telecommunication single-discipline performance analysis.
Further, in the step S1, model features are simplified, that is, the classified model features are simplified according to modeling rules for antenna structure and telecommunication literature performance analysis.
Furthermore, in the step S1, model features are matched and regrouped, that is, electromechanical common features are used as a matching interface for electromechanical thermal coupling analysis, and the simplified model features are recombined.
Furthermore, a dielectric plate of the microstrip antenna and a back cavity of the antenna framework are used as matching interfaces of electromechanical coupling analysis to construct an antenna array electromechanical coupling model, and a multilayer dielectric plate and channel separation ribs of the transceiving component are used as matching interfaces of the thermoelectric coupling analysis to construct the transceiving component thermoelectric coupling model.
Furthermore, in step S1, a parameterization process is performed on the key characteristic variables, that is, the key characteristic variables in the planar-electromechanical coupling model and the transceiver module thermoelectric coupling model of the antenna array are determined according to the sensitivity of the characteristic variables on the antenna performance and the manufacturing realizability, and then the parameterization modeling is performed on the characteristic variables.
Furthermore, in step S2, the vibration power spectral density envelope model is used as a boundary condition for the planar electromechanical coupling analysis of the antenna array, and the data model of the variation of the scattering characteristic of the radio frequency device with temperature is used as a boundary condition for the thermoelectric coupling analysis of the transceiver module.
Furthermore, in the step S3, a force and electromagnetic performance coupling solution is performed on the antenna array plane electromechanical coupling model to obtain a data packet of antenna array plane deformation and antenna scattering characteristics in a service environment; and carrying out coupling solution on the thermal and electromagnetic properties of the receiving and transmitting assembly thermoelectric coupling model to obtain a data packet of the device temperature change on the scattering characteristics of the receiving and transmitting assembly radio frequency channel.
Furthermore, in the step S3, the antenna scattering characteristic data considering deformation in the service environment and the receiving and transmitting component radio frequency channel scattering characteristic data considering device temperature change are subjected to system circuit set connection to obtain a tile-type phased array antenna field collaborative analysis model.
Furthermore, in step S4, the directivity coefficient and the port standing wave of the antenna system after the antenna array deformation and the temperature change of the transceiver module are extracted as the telecommunication index requirements.
Compared with the prior art, the invention has the following advantages:
(1) The established tile-type phased-array antenna multidisciplinary design model can realize the matching and transmission of antenna multi-physics field performance simulation data on the electromechanical common characteristics of the model by carrying out characteristic classification, simplification and matching recombination on the initial model of structure and telecommunication specialty, and meanwhile, the parameterization processing on the key characteristic variable of the model can realize the rapid reconstruction of the antenna system multidisciplinary design model, thereby improving the accuracy and efficiency of electromechanical thermal coupling analysis of the tile-type phased-array antenna;
(2) The multidisciplinary design method of the tile-type phased array antenna with the knowledge fused can realize rapid design and analysis of influences of service load of the array surface and temperature changes of the transceiving component on scattering characteristics of the whole active antenna system, and provides a design method suitable for engineering for evaluation of electromechanical thermal coupling performance of the tile-type phased array antenna.
Drawings
FIG. 1 is a flow chart of an electromechanical thermal coupling design method of a tile-type phased array antenna in an embodiment of the present invention;
fig. 2 (a) is a schematic front view of a tile-type phased array antenna according to an embodiment of the present invention;
fig. 2 (b) is a schematic cross-sectional structure diagram of a tile-type phased array antenna according to an embodiment of the present invention;
fig. 3 (a) is a schematic diagram of an antenna array structure model provided by structure specialties in the embodiment of the present invention;
FIG. 3 (b) is a diagram illustrating an antenna array telecommunication model provided by telecommunication specialties in an embodiment of the present invention;
fig. 3 (c) is a schematic diagram of a structural model of a transceiver module provided by structural specialties in the embodiment of the present invention;
FIG. 3 (d) is a schematic diagram of a telecommunication model of a transceiver module provided by telecommunication specialties in the embodiment of the present invention;
FIG. 4 (a) is a simplified schematic diagram of a feature of a connector in an embodiment of the present invention;
FIG. 4 (b) is a simplified diagram of a multi-layer dielectric slab according to an embodiment of the present invention;
FIG. 5 (a) is a schematic diagram of a planar electromechanical coupling model of an antenna array in an embodiment of the present invention;
FIG. 5 (b) is a schematic view of an embodiment of the invention in the form of a thermocouple assembly;
FIG. 6 is a diagram illustrating a multidisciplinary design model of a tile-type phased array antenna according to an embodiment of the present invention;
FIG. 7 is a power spectral density weighted decomposition model diagram used for service load knowledge modeling in an embodiment of the present invention;
fig. 8 is a schematic diagram of a tile-type phased array antenna field collaborative analysis model in the embodiment of the present invention.
In fig. 2 (a): 21: a microstrip antenna; 22. an antenna framework; 23. a feed board; 24. a heat dissipation cold plate; 25. a transceiver component; 26. a multifunctional plate;
in fig. 5 (a): 501. a framework column; 502. a back cavity of the framework 503, a feed connector; 504. a microstrip antenna dielectric plate; 505. a microstrip antenna patch;
in fig. 5 (b): 511. a radio frequency stripline; 512. a feed connector; 513. a multilayer dielectric plate; 514. channel spacer ribs; 515. a cover plate; 516. a housing; 517. a heat dissipating cold plate.
Detailed Description
The following examples are given for the detailed implementation and specific operation of the present invention, but the scope of the present invention is not limited to the following examples.
The embodiment provides a technical scheme: an electromechanical thermal coupling design method for a tile-type phased array antenna, which adopts the flow steps shown in fig. 1 to carry out electromechanical thermal coupling design on an active tile-type phased array antenna shown in fig. 2 (a) and fig. 2 (b), includes the following steps:
step S1: the initial antenna model provided by the architecture specialty and the telecommunication specialty includes the antenna array structure model shown in fig. 3 (a), the antenna array telecommunication model shown in fig. 3 (b), the transceiver module structure model shown in fig. 3 (c), and the transceiver module telecommunication model shown in fig. 3 (d); through classifying, simplifying, matching and recombining model features, an antenna array surface-electromechanical coupling model and a receiving-transmitting assembly thermoelectric coupling model are generated, and key feature variables are parameterized to finally form a tile-type phased array antenna multidisciplinary design model;
classifying the characteristics of the initial model, wherein the structural characteristics comprise an upright post of an antenna framework, a shell, a cover plate, a chip, a welding layer and a heat dissipation cold plate of a transceiving assembly; the telecommunication characteristic comprises a patch of a microstrip antenna, a radio frequency strip line of a receiving and transmitting component, an antenna and a feed connector of the receiving and transmitting component; the electromechanical common characteristics comprise a dielectric plate of the microstrip antenna and a back cavity of the antenna framework; the multilayer dielectric plate and the channel spacer bar of the transceiving component;
simplifying the classified model characteristics, wherein the structural characteristic simplification comprises removing chamfers and screw holes and simplifying the appearance of a chip; the telecommunication feature simplification includes simplifying the connector profile, as shown in fig. 4 (a); the simplification of the electromechanical common features requires consideration of the influence on the structure and the telecommunication performance, the adjacent low-frequency layers of the multilayer dielectric plate are combined, the feed through hole of the multilayer dielectric plate is reserved, and the heat dissipation hole and the isolation hole with a short distance are removed, as shown in fig. 4 (b);
and matching and recombining the simplified model characteristics, and constructing a coupling analysis model by taking the electromechanical common characteristics in the antenna model as a matching interface of electromechanical coupling analysis. In this embodiment, a dielectric plate of a microstrip antenna and a back cavity of an antenna framework are selected as a matching interface for planar-electromechanical coupling analysis of an antenna array, and a planar-electromechanical coupling model of the antenna array is constructed, as shown in fig. 5 (a); selecting a multilayer dielectric plate and a channel spacer bar as a matching interface for the thermoelectric coupling analysis of the transceiving component, and constructing a thermoelectric coupling model of the transceiving component, as shown in fig. 5 (b);
carrying out parameterization processing on key characteristic variables of the coupling model, wherein the key characteristic variables of the antenna array electromechanical coupling model comprise the thickness of a dielectric plate of a microstrip antenna, the wall thickness of a back cavity of an antenna framework and the shape and the size of the section of an upright post; the key characteristic variables of the transceiving assembly thermoelectric coupling model comprise equivalent heat transfer coefficients of a heat dissipation cold plate, material and thickness of a welding layer of a chip, shape and size of a gold bonding wire, diameter of a feed through hole and distance of heat dissipation holes;
the multidisciplinary design model of the tile-type phased array antenna is finally formed as shown in fig. 6.
Step S2: and completing knowledge modeling of service load and temperature performance parameters of the radio frequency device of the tile-type phased array antenna by adopting theoretical modeling and data modeling modes. The service load of the tile-type phased array antenna is mainly vibration load, and knowledge modeling adopts a power spectral density weighted decomposition model, as shown in fig. 7; the performance parameters of the radio frequency device comprise scattering characteristic data of the multifunctional chip of the transceiving component and the power amplifier chip at different temperatures, and the knowledge modeling adopts data modeling;
and (3) establishing a mapping relation between the knowledge model and the analysis boundary conditions of the tile-type phased array antenna multidisciplinary design model in the step S1. The vibration power spectral density envelope model is used as a boundary condition for surface electromechanical coupling analysis of the antenna array, and a data model of the scattering characteristic of the radio frequency device changing along with the temperature is used as a boundary condition for thermoelectric coupling analysis of the transceiving component.
And step S3: aiming at the knowledge-fused tile-type phased-array antenna multidisciplinary optimization model generated in the steps S1 and S2, a geometrical modeling (Spacelimit), a Structural analysis (Structural) and an electromagnetic analysis (HFSS) module of a Workbech platform are adopted to carry out force and electromagnetic performance coupling solution on an antenna array electromechanical coupling model to obtain a data packet of antenna array surface deformation and antenna scattering characteristics in a service environment, and a geometrical modeling (Spacelimit), a steady-state Thermal analysis (Thermal), an electromagnetic analysis (HFSS) module and a circuit analysis (Designer) module are adopted to carry out Thermal and electromagnetic performance coupling solution on a receiving and transmitting assembly thermoelectric coupling model to obtain a data packet of device temperature and receiving assembly radio frequency channel scattering characteristics.
A field-path collaborative analysis model of the whole antenna system is constructed based on a data packet of antenna array surface deformation and antenna scattering characteristics and a data packet of device temperature and transceiving component radio frequency channel scattering characteristics in a service environment, and system circuit set connection is performed on antenna scattering characteristic data considering deformation in the service environment and transceiving component radio frequency channel scattering characteristic data considering device temperature change by utilizing an electromagnetic analysis (HFSS) module and a circuit analysis (Designer) module to obtain a tile-type phased array antenna field-path collaborative analysis model, as shown in fig. 8.
And step S4: and (4) analyzing the tile-type phased array antenna field collaborative analysis model in the step (S3), and evaluating the influence of antenna array surface deformation and temperature change of the transceiving component device on the scattering characteristics of the tile-type antenna system in the service environment. The directivity coefficient and the port standing wave of the antenna system after the antenna array surface deformation and the temperature change of the transceiving component are extracted, and the result shows that although the antenna gain and the port standing wave are changed, the index requirement is still met, and the antenna beam direction does not meet the index requirement.
The analysis reason is that the beam pointing deviation is large due to array face deformation, the antenna supporting rigidity needs to be enhanced, the size of the cross section of the strut of the back cavity framework is optimized in the step S1, the antenna multidisciplinary model is updated rapidly, then the iterative analysis in the step S3 is carried out, the influence of the updated antenna model array face deformation and the component temperature change on the scattering characteristic of the antenna system is evaluated, the result shows that the antenna gain, the beam pointing direction and the port standing wave change meet the index requirements, and the design process is finished.
Although embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are exemplary and not to be construed as limiting the present invention, and that changes, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.
Claims (10)
1. A tile-type phased-array antenna electromechanical thermal coupling design method is characterized by comprising the following steps:
s1: building antenna multidisciplinary design model
According to an antenna initial model provided by a structure specialty and a telecommunication specialty, an antenna array surface electromechanical coupling model and a receiving and transmitting assembly thermoelectric coupling model are generated by classifying, simplifying, matching and recombining model features, and key feature variables are parameterized to finally form an active tile type phased array antenna multidisciplinary design model;
s2: multi-disciplinary design model for constructing tile-type phased array antenna with fusion knowledge
Completing knowledge modeling of service load and radio frequency device temperature performance parameters of the active tile type phased array antenna by adopting theoretical modeling and data modeling modes, establishing a mapping relation between a knowledge model and analysis boundary conditions of the active tile type phased array antenna multidisciplinary design model in the step S1, and forming an active tile type phased array antenna multidisciplinary design model fusing knowledge;
s3: field-path collaborative analysis model for constructing tile-type phased-array antenna
For the multidisciplinary design model of the active tile-type phased array antenna with knowledge fused in the step S2, a multidisciplinary analysis platform tool is utilized to cooperatively solve the antenna array surface-machine electric coupling model and the receiving and transmitting assembly thermoelectric coupling model, and a circuit cooperative analysis model of the active tile-type phased array antenna is constructed based on the solved scattering characteristic data;
s4: electromechanical thermal coupling performance evaluation
And (3) finishing the evaluation of antenna array surface deformation and component temperature distribution factors on the telecommunication performance of the active tile type phased array antenna in a service environment, optimizing the key characteristic dimension and the analysis boundary condition in the step (S1) when the telecommunication index requirement is not met, updating the multidisciplinary design model of the active tile type phased array antenna, and performing iterative analysis in the step (S3) until the telecommunication performance of the antenna meets the index requirement.
2. The method for designing the electromechanical thermal coupling of the tile-type phased array antenna according to claim 1, wherein: in step S1, model features are classified, that is, the model features are classified according to disciplinary relevance and are classified into structural features, telecommunication features and electromechanical common features.
3. The method for designing the electromechanical thermal coupling of the tile-type phased array antenna according to claim 1, wherein: in the step S1, model features are simplified, that is, the classified model features are simplified according to modeling rules used in antenna structure and performance analysis of the telecommunication literature.
4. The method for designing the electromechanical thermal coupling of the tile-type phased array antenna according to claim 1, wherein: in step S1, model features are matched and recombined, that is, electromechanical common features are used as a matching interface for electromechanical thermal coupling analysis, and the simplified model features are recombined.
5. The method for designing the electromechanical thermal coupling of the tile-type phased array antenna according to claim 4, wherein the method comprises the following steps: the dielectric plate of the microstrip antenna and the back cavity of the antenna framework are used as matching interfaces of electromechanical coupling analysis to construct an antenna array electromechanical coupling model, and the multilayer dielectric plate and the channel spacer bars of the transceiving component are used as matching interfaces of the thermoelectric coupling analysis to construct the transceiving component thermoelectric coupling model.
6. The method for designing the electromechanical thermal coupling of the tile-type phased array antenna according to claim 1, wherein: in the step S1, a key characteristic variable is parameterized, that is, the key characteristic variable in the antenna array electromechanical coupling model and the transceiver module thermoelectric coupling model is determined according to the sensitivity of the characteristic variable on the antenna performance and the manufacturing realizability, and then the parametric modeling is performed on the characteristic variable.
7. The method for designing the electromechanical thermal coupling of the tile-type phased array antenna according to claim 1, wherein: in step S2, the vibration power spectral density envelope model is used as a boundary condition for the antenna array electromechanical coupling analysis, and the data model of the variation of the scattering characteristic of the rf device with temperature is used as a boundary condition for the transmit-receive assembly thermoelectric coupling analysis.
8. The method for designing the electromechanical thermal coupling of the tile-type phased array antenna according to claim 1, wherein: in the step S3, a force and electromagnetic performance coupling solution is performed on the antenna array surface electromechanical coupling model to obtain a data packet of antenna array surface deformation to antenna scattering characteristics in a service environment; and carrying out coupling solution on the thermal and electromagnetic properties of the receiving and transmitting assembly thermoelectric coupling model to obtain a data packet of the device temperature change on the scattering characteristics of the receiving and transmitting assembly radio frequency channel.
9. The method for designing the electromechanical thermal coupling of the tile-type phased array antenna according to claim 1, wherein: in the step S3, the antenna scattering characteristic data considering deformation in the service environment and the receiving and transmitting component radio frequency channel scattering characteristic data considering device temperature change are subjected to system circuit set connection to obtain a tile-type phased array antenna field collaborative analysis model.
10. The method for designing the electromechanical thermal coupling of the tile-type phased array antenna according to claim 1, wherein: in step S4, the directivity coefficient and the port standing wave of the antenna system after the antenna array surface deformation and the temperature change of the transceiver module are extracted as the telecommunication index requirements.
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