CN113900303B

CN113900303B - Backlight module and display device

Info

Publication number: CN113900303B
Application number: CN202111229427.5A
Authority: CN
Inventors: 孙文波; 张启平; 许业顺
Original assignee: BOE Technology Group Co Ltd; Hefei BOE Display Lighting Co Ltd
Current assignee: BOE Technology Group Co Ltd; Hefei BOE Display Lighting Co Ltd
Priority date: 2021-10-21
Filing date: 2021-10-21
Publication date: 2024-05-10
Anticipated expiration: 2041-10-21
Also published as: CN113900303A

Abstract

The embodiment of the disclosure provides a backlight module and a display device. A backlight module, comprising: the backboard comprises a bottom wall and a first side wall extending along one side edge of the bottom wall, and the first side wall is smoothly connected with one side edge of the bottom wall through a first curved connecting wall; the backlight source assembly is positioned on the inner side of the backboard and comprises a strip-shaped circuit board and a plurality of LED light sources, wherein the strip-shaped circuit board and the LED light sources extend along a first direction, the circuit board comprises a first part and a pre-bending part which are sequentially connected along a second direction, the LED light sources are arranged on the first part, the first direction is the extending direction of the first side wall, and the second direction is the direction perpendicular to the first direction; the pre-bending part is bent and is attached to the inner side surface of the first curved connecting wall, and the first part of the circuit board is arranged on the bottom wall. According to the technical scheme, the gap between the LED light source and the first side wall can be reduced, and the narrow frame is facilitated to be realized.

Description

Backlight module and display device

Technical Field

The disclosure relates to the technical field of display, in particular to a backlight module and a display device.

Background

In the prior art, the larger the display area, the better, and further the smaller the thickness of the back plate and the thinner the edge of the frame are required to realize the narrow frame design. In the prior art, the minimum thickness of the backboard can be 0.15mm, and the wall thickness of the edge of the frame can be 0.5mm. Based on the prior art, it is difficult to further realize a narrower bezel of the display device.

Disclosure of Invention

Embodiments of the present disclosure provide a backlight module and a display device, so as to solve or alleviate one or more technical problems in the prior art.

As a first aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a backlight module, including:

the backboard comprises a bottom wall and a first side wall extending along one side edge of the bottom wall, and the first side wall is smoothly connected with one side edge of the bottom wall through a first curved connecting wall;

The backlight source assembly is positioned on the inner side of the backboard and comprises a strip-shaped circuit board and a plurality of LED light sources, wherein the strip-shaped circuit board and the LED light sources extend along a first direction, the circuit board comprises a first part and a pre-bending part which are sequentially connected along a second direction, the LED light sources are arranged on the first part, the first direction is the extending direction of the first side wall, and the second direction is the direction perpendicular to the first direction;

The first part of the circuit board is arranged on the bottom wall, and the pre-bent part is bent and is attached to the inner side surface of the first bent arc connecting wall.

In some possible implementations, the circuit board further includes a second portion located on a side of the pre-curved portion away from the first portion and connected to the pre-curved portion, and the backlight assembly further includes at least one electrostatic protection device disposed on the second portion and the second portion is disposed on the first sidewall.

In some possible implementations, the plurality of LED light sources are arranged sequentially in the first direction on the first portion, the number of the electrostatic protection devices is plural, and the plurality of electrostatic protection devices are arranged sequentially in the first direction on the second portion.

In some possible implementations, the radius of curvature of the inner surface of the first curved connecting wall is greater than or equal to 0.5mm.

In some possible implementations, the thickness of the pre-curved portion is less than the thickness of the first portion such that the pre-curved portion is able to bend and conform to the inside surface of the first curved connecting wall.

In some possible implementations, the circuit board includes a first insulating layer, a conductive layer, and a second insulating layer stacked in this order in a thickness direction, and a thickness of the second insulating layer at the pre-bent portion is smaller than a thickness of the second insulating layer at the first portion.

In some possible implementations, the back plate further includes a shielding wall disposed along an edge of a side of the first sidewall away from the bottom wall, the shielding wall being located on a side of the plurality of LED light sources away from the bottom wall, a gap between the shielding wall and the bottom wall being H, and a bending radius of an inner surface of the first curved connecting wall being greater than or equal to 0.5H.

In some possible implementations, the backlight module further includes a reflective tape attached to a surface of the shielding wall facing the LED light source.

In some possible implementations, the back plate further includes a protective side wall extending along other edges of the bottom wall, the protective side wall is connected with edges of the bottom wall through a second curved connecting wall, the protective side wall, the first side wall and the bottom wall enclose to form a groove, and the backlight module further includes a light guide plate located in the groove, the light guide plate being located on one side of the plurality of LED light sources far away from the first side wall.

In some possible implementations, the second curved connecting wall has the same radius of curvature as the first curved connecting wall.

In some possible implementations, the backlight module further includes a reflective sheet and an optical film assembly, the reflective sheet is located between the light guide plate and the bottom wall, and the optical film assembly is located on a side of the light guide plate facing away from the bottom wall.

As a second aspect of embodiments of the present disclosure, embodiments of the present disclosure provide a display device, including a backlight module in any one of the embodiments of the present disclosure.

According to the technical scheme, the pre-bending part is bent and is attached to the inner surface of the first curved connecting wall, the occupied width of the circuit board in the second direction is reduced, so that the occupied size of the pre-bending part between the LED light source and the first side wall can be reduced, the gap between the LED light source and the first side wall is reduced, and the narrow frame is facilitated to be realized.

The foregoing summary is for the purpose of the specification only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present disclosure will become apparent by reference to the drawings and the following detailed description.

Drawings

In the drawings, the same reference numerals refer to the same or similar parts or elements throughout the several views unless otherwise specified. The figures are not necessarily drawn to scale. It is appreciated that these drawings depict only some embodiments according to the disclosure and are not to be considered limiting of its scope.

FIG. 1 is a schematic diagram of a backlight module of a liquid crystal display device;

FIG. 2a is a schematic view of the cross-sectional structure A-A in FIG. 1;

FIG. 2B is a schematic view of the cross-sectional B-B structure of FIG. 1;

FIG. 2C is a schematic view of the cross-sectional C-C structure of FIG. 1;

FIG. 3 is a schematic diagram of a backlight assembly;

FIG. 4 is a schematic diagram of another backlight assembly;

FIG. 5 is a schematic view of a structure of a backlight assembly;

FIG. 6 is a schematic view of a cross-sectional A-A structure of a backlight module according to an embodiment of the disclosure;

FIG. 7a is a schematic structural view of the back plate of FIG. 6;

FIG. 7b is a schematic diagram of the backlight assembly of FIG. 6;

FIG. 7c is a schematic top view of a backlight assembly according to one embodiment of the present disclosure;

Fig. 8 is a schematic structural diagram of a backlight module according to another embodiment of the disclosure;

FIG. 9a is a schematic view of a B-B cross-sectional structure of a backlight module according to an embodiment of the disclosure;

fig. 9b is a schematic diagram of a C-C cross-sectional structure of a backlight module according to an embodiment of the disclosure.

Reference numerals illustrate:

10. A frame; 20. a back plate; 21. a bottom wall; 22. a sidewall; 23. a first curved connecting wall; 24. a shielding wall; 25. a second curved connecting wall; 221. a first sidewall; 30. a backlight assembly; 31. an electrostatic protection device; 32. an LED light source; 33. a circuit board; 331. a first portion; 332. a pre-curved portion; 333. a second portion; 40. a light guide plate; 50. a reflective tape; 60. an optical film group; 61. a first diffusion sheet; 62. a first prism sheet; 63. a second prism sheet; 64. and a second diffusion sheet.

Detailed Description

Hereinafter, only certain exemplary embodiments are briefly described. As will be recognized by those of skill in the pertinent art, the described embodiments may be modified in various different ways without departing from the spirit or scope of the present disclosure. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive.

Fig. 1 is a schematic structural diagram of a backlight module of a liquid crystal display device, fig. 2a is a schematic structural diagram of a section A-A in fig. 1, fig. 2B is a schematic structural diagram of a section B-B in fig. 1, and fig. 2C is a schematic structural diagram of a section C-C in fig. 1. As shown in fig. 2a, the backlight module includes a frame 10, a back plate 20, a backlight assembly 30, and a light guide plate 40. The back plate 20 includes a bottom wall 21 and side walls 22 provided along the circumferential edge of the bottom wall 21, the bottom wall 21 and the side walls 22 forming grooves. The backlight assembly 30 is disposed within the recess proximate a first one 221 of the sidewalls 22. The backlight module 30 includes a wiring board 33 having a band shape, and a plurality of LED light sources 32 provided on the wiring board 33. The wiring board 33 is disposed along the extending direction of the first side wall 221, the plurality of LED light sources 32 are arranged along the extending direction of the first side wall 221, and a gap between the LED light sources 32 and the first side wall 221 is d.

It should be noted that, as shown in fig. 1, fig. 2a is a schematic cross-sectional structure of a lower frame of the backlight module, fig. 2b is a schematic cross-sectional structure of an upper frame of the backlight module, fig. 2c is a schematic cross-sectional structure of a left frame of the backlight module, and a schematic cross-sectional structure of a right frame of the backlight module may be the same as a cross-sectional structure of the left frame.

Fig. 3 is a schematic diagram of a backlight assembly. With the continuous development of liquid crystal modules, higher requirements are put on the liquid crystal display device, for example, high brightness, narrow frame and larger screen duty ratio are required. High brightness is increasingly demanded of the brightness of the backlight, and thus, the number of LED light sources in the backlight assembly is increasing. In the backlight assembly shown in fig. 3, the number of LED light sources in the backlight assembly has been distributed over the entire length, and the interval between two adjacent LED light sources is small. To achieve a narrow bezel, the effective light emitting area is increased, and the gap d between the LED light source and the first sidewall 221 of the back plate 20 is gradually reduced, as shown in fig. 2 a.

Fig. 4 is a schematic structural view of another backlight assembly, and fig. 5 is a schematic structural view of yet another backlight assembly. In some display products, the antistatic capability (ESD capability) of the backlight assembly is required to satisfy 15KV, but the antistatic capability of a single LED is only around 2KV, and thus, it is necessary to provide an electrostatic protection device 31, such as a transient diode (TRANSIENT VOLTAGE SUPPRESSOR, abbreviated as TVS), in the backlight assembly, and the electrostatic protection device 31 cannot affect the brightness and light emission of the LED light source. In one embodiment, as shown in fig. 4, the electrostatic protection device 31 may be disposed at a side of the LED light source facing the first sidewall 221. In another embodiment, as shown in fig. 5, the electrostatic protection device 31 is disposed at a gap position between adjacent LED light sources. The backlight assembly shown in fig. 4 can meet the requirement of high brightness, but the electrostatic protection device 31 occupies a certain width, resulting in an increase in the width of the circuit board 33 compared to fig. 3, increasing the gap d between the LED light source and the first sidewall 221, which is disadvantageous for realizing a narrow frame. Although the backlight assembly shown in fig. 5 can maintain the width of the circuit board 33, compared with fig. 3, the gap d between the LED light source and the first sidewall 221 is not increased, which is beneficial to realizing a narrow frame, but the electrostatic protection device 31 occupies the length of the backlight assembly, and cannot set more LED light sources, which cannot meet the requirement of high brightness. Therefore, how to achieve the reduction of the gap d between the LED light source and the first sidewall in the case where the width of the circuit board is increased is a technical problem to be solved. Note that, in fig. 3 to 5, "width of the wiring board" refers to a dimension of the wiring board 33 in the vertical direction.

Fig. 6 is a schematic A-A cross-sectional structure of a backlight module according to an embodiment of the disclosure, fig. 7a is a schematic structural diagram of the back plate in fig. 6, and fig. 7b is a schematic diagram of the backlight assembly in fig. 6. The backlight module is shown in fig. 1, and as shown in fig. 6, the backlight module may include a back plate 20 and a backlight assembly 30. As shown in fig. 6 and 7a, the back plate 20 includes a bottom wall 21 and a first sidewall 221 extending along one side edge of the bottom wall 21, and the first sidewall 221 is smoothly connected to one side edge of the bottom wall 21 by a first curved connecting wall 23. The backlight assembly 30 is located inside the back plate 20, and as shown in fig. 6 and 7b, the backlight assembly 30 includes a circuit board 33 in a strip shape and a plurality of LED light sources 32. The strip-shaped wiring board 33 extends in a first direction, which is the extending direction of the first side wall 221. The circuit board 33 includes a first portion 331 and a pre-bent portion 332 connected along a second direction Y, which is a direction perpendicular to the first direction, in which the plurality of LED light sources are disposed in the first portion 331. As shown in fig. 6, the pre-bent portion 332 is bent and attached to the inner side surface of the first curved connecting wall 23, and the first portion 331 of the circuit board is disposed on the bottom wall 21.

In the backlight module of the embodiment of the disclosure, the first side wall 221 is smoothly connected with one side edge of the bottom wall 21 through the first curved connecting wall 23, the wider circuit board may include a first portion 331 and a pre-curved portion 332, when the backlight assembly 30 is disposed inside the back plate 20, the pre-curved portion 332 of the circuit board may be curved, so that the pre-curved portion 332 is attached to the inner side surface of the first curved connecting wall 23 after being curved, and the first portion 331 of the circuit board is disposed on the bottom wall 21. Although the width of the circuit board increases, since the pre-bent portion 332 is bent, the width occupied by the circuit board 33 in the second direction is reduced, so that the size occupied by the pre-bent portion 332 between the LED light source 32 and the first sidewall 221 can be reduced, the gap between the LED light source 32 and the first sidewall 221 is reduced, a narrow bezel is facilitated, and the effective light emitting area of the backlight assembly inside the back plate is increased.

In the backlight module of the embodiment of the disclosure, the plurality of LED light sources 32 are disposed in the first portion 331, so, compared with the backlight module of the related art as shown in fig. 2, the positions of the plurality of LED light sources 32 are not changed, so that the performance of the backlight module is not affected.

In one embodiment, the first sidewall 221 is perpendicular to the bottom wall 21, and the gap between the LED light source 32 and the first sidewall 221 can be further reduced.

In one embodiment, as shown in fig. 6 and 7b, the circuit board 33 may further include a second portion 333, where the second portion 333 is located on a side of the pre-bent portion 332 away from the first portion 331 and is connected to the pre-bent portion 332. The backlight assembly 30 may further include at least one electrostatic protection device 31, and the at least one electrostatic protection device 31 may be disposed at the second portion 333, and the second portion 333 may be disposed at the first sidewall 221. Illustratively, the electrostatic protection device 31 may be a transient diode (TVS).

By providing the electrostatic protection device 31 on the wiring board 33, the antistatic ability of the LED light source 32 can be improved, and thus the antistatic performance of the backlight assembly can be improved. Those skilled in the art will appreciate that the electrostatic protection device 31, such as a TVS, has a relatively large length-to-width dimension and a relatively small thickness. The electrostatic protection device 31 is disposed on the second portion 333, and the second portion 333 is disposed to be connected to the other side of the pre-curved portion 332, so that, when the pre-curved portion 332 is curved and is adhered to the inner side surface of the first curved connecting wall 23, the second portion 333 is located on the surface of the first sidewall 221, as shown in fig. 6, because the thickness of the electrostatic protection device 31 is smaller, the electrostatic protection device 31 occupies a smaller size in the second direction Y, and compared with the manner of disposing the electrostatic protection device 31 in fig. 2, the electrostatic protection device 31 occupies a smaller size between the LED light source 32 and the first sidewall 221, so as to ensure a smaller gap between the LED light source 32 and the first sidewall 221, which is beneficial for realizing a narrow frame.

In addition, the electrostatic protection device 31 is disposed on the second portion 333, and the electrostatic protection device 31 does not occupy the length of the first portion where the LED light sources are disposed, so that more LED light sources can be disposed along the length direction of the first portion, and the high brightness requirement of the backlight assembly can be satisfied.

Fig. 7c is a schematic top view of a backlight assembly according to an embodiment of the present disclosure. In one embodiment, as shown in fig. 7c, the number of the electrostatic protection devices 31 may be plural, and the plural electrostatic protection devices 31 are sequentially arranged in the first direction on the second portion 333. The plurality of LED light sources 32 are sequentially arranged along the first direction X on the first portion 331. By such an arrangement, the size of the wiring board 33 in the second direction Y can be further reduced, thereby further reducing the gap between the LED light source 32 and the first sidewall 221, and realizing a narrow frame.

In one embodiment, as shown in fig. 6, the radius of curvature of the inner surface of the first curved connecting wall 23 is greater than or equal to 0.5mm. It should be noted that, although the pre-bent portion 332 of the circuit board may be bent, the bending radius of the pre-bent portion 332 is limited due to the process, and the bending radius of the inner surface of the first curved connecting wall 23 is set to be greater than or equal to 0.5mm, so that the pre-bent portion 332 can be bonded to the inner surface of the first curved connecting wall 23 after being bent under the condition of meeting the manufacturing process of the circuit board, and the installation firmness of the circuit board is ensured.

In one embodiment, as shown in fig. 7b, the thickness of the pre-bent portion 332 is smaller than the thickness of the first portion 331, and the thickness of the second portion 333 may be the same as the thickness of the first portion 331, so that the pre-bent portion 332 has better flexibility than the first portion 331 and the second portion 333, and may have a smaller bending radius so that the pre-bent portion 332 can be bent and fit the inner side surface of the first curved connecting wall 23. The "thickness of a" herein is the dimension of a in the direction perpendicular to the surface thereof.

In one embodiment, the wiring board 33 may include a first insulating layer, a conductive layer, and a second insulating layer laminated in this order in a thickness direction thereof, and the LED light source and the electrostatic protection device are each disposed on one side surface of the second insulating layer. To improve the bending performance of the pre-bent portion 332, the thickness of the second insulating layer at the pre-bent portion 332 may be smaller than the thickness of the second insulating layer at the first and second portions. This results in a relatively small thickness of the pre-bent portion 332 and better flexibility of the pre-bent portion 332. In a specific implementation, in the process of manufacturing the circuit board 33, after the circuit board 33 is manufactured, as shown in fig. 7c, a windowing process may be performed between the left leg of the LED light source 32 and the right leg of the electrostatic protection device 31, so as to thin a film layer between the LED light source 32 and the electrostatic protection device 31, for example, thin a thickness of the second insulating layer, and the area where the thickness is thinned forms the pre-bent portion 332.

In one embodiment, as shown in fig. 6, the back plate 20 may further include a shielding wall 24, where the shielding wall 24 is disposed along an edge of the first side wall 22 away from the bottom wall 21, and the shielding wall 24 is located on a side of the plurality of LED light sources 32 away from the bottom wall 21. In one embodiment, the shielding wall 24 may be parallel to the bottom wall 21, the gap between the shielding wall 24 and the bottom wall 21 is H, and the radius of curvature of the inner surface of the first curved connecting wall 23 is greater than or equal to 0.5H. The bending radius of the inner surface of the first curved connecting wall 23 is set to be greater than or equal to 0.5H, so that the bending radius of the pre-bent portion can be increased to the maximum extent, and the difficulty of the manufacturing process of the circuit board can be reduced.

The shielding wall 24 is not limited to being parallel to the bottom wall 21, and the shielding wall 24 may be at a certain angle to the bottom wall 21, and may have the same technical effect.

Fig. 8 is a schematic structural diagram of a backlight module according to another embodiment of the disclosure. As shown in fig. 6 and 8, the backlight module may further include a reflective tape 50, and the reflective tape 50 is attached to a surface of the shielding wall 24 facing the LED light source 32.

Fig. 9a is a schematic B-B cross-sectional structure of a backlight module according to an embodiment of the disclosure, and fig. 9B is a schematic C-C cross-sectional structure of a backlight module according to an embodiment of the disclosure. In one embodiment, the back plate may further comprise a protective side wall 222 extending along the other edge of the bottom wall 21, the protective side wall 222 being connected to the edge of the bottom wall 21 by a second curved connecting wall 25, as shown in fig. 9a and 9 b. The protective side wall 222, the first side wall 221 and the bottom wall 21 enclose a recess. The backlight module may further include a light guide plate 40 disposed in the groove, where the light guide plate 40 is disposed at a side of the plurality of LED light sources 32 away from the first sidewall 221.

In such a backlight module, the upward light generated by the LED light source 32 can be reflected by the reflective tape 50 and enter the light guide plate 40 to provide energy efficiency. Light entering the light guide plate 40 is transmitted within the light guide plate to provide uniform backlight to the display panel.

In one embodiment, the second curved connecting wall 25 has the same radius of curvature as the first curved connecting wall 23. Therefore, the second curved connecting wall 25 and the first curved connecting wall 23 can be integrally formed, and the manufacturing difficulty of the backboard is reduced. The bending radius of the second curved connecting wall 25 is not limited to be the same as that of the first curved connecting wall 25, and the bending radius of the second curved connecting wall 25 may be set as needed since the backlight assembly is not required to be provided at the second curved connecting wall 25. In one embodiment, the side wall opposite to the first side wall may be connected to the edge of the bottom wall by a second curved connecting wall 25, the second curved connecting wall 25 being the same radius of curvature as the first curved connecting wall 23, and the other two side walls may be connected to the bottom wall in the same manner as in fig. 2 c.

In one embodiment, the backlight module may further include a frame 10, and the frame 10 is matched with the back plate 20, as shown in fig. 8, 9a and 9 b.

As shown in fig. 8, the backlight module may further include a reflective sheet 50 and an optical film assembly 60, where the reflective sheet 50 is located between the light guide plate 40 and the bottom wall 21, and the optical film assembly 60 is located on a side of the light guide plate 40 facing away from the bottom wall 21, as shown in fig. 8. The reflecting sheet 50 can reflect the light emitted from the light guide plate 40 into the light guide plate 40 again for use, further improving the energy efficiency, and the optical film set 60 diffuses and uniformly distributes the light emitted from the upper side of the light guide plate 40, thereby further improving the light emitting uniformity of the backlight module.

Illustratively, the optical film material group 60 may include a first diffusion sheet 61, a first prism sheet 62, a second prism sheet 63, and a second diffusion sheet 64, and the first diffusion sheet 61, the first prism sheet 62, the second prism sheet 63, and the second diffusion sheet 64 are sequentially stacked from the light guide plate 40 toward a direction away from the light guide plate 40.

Based on the inventive concept of the foregoing embodiments, the embodiments of the present disclosure further provide a display device including the backlight module adopting the foregoing embodiments. The display device may further include a liquid crystal display panel disposed on a side of the optical film set 60 facing away from the light guide plate 40.

The display device may be: any product or component with display function such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.

The display device in the embodiment of the disclosure adopts the backlight module in the embodiment of the disclosure, and can meet the requirements of narrow frame and high brightness of products.

In the description of the present specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present disclosure.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present disclosure, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the present disclosure, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; the device can be mechanically connected, electrically connected and communicated; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this disclosure will be understood by those of ordinary skill in the art as the case may be.

In this disclosure, unless expressly stated or limited otherwise, a first feature being "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other by way of additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is less level than the second feature.

The above disclosure provides many different embodiments or examples for implementing different structures of the disclosure. The components and arrangements of specific examples are described above in order to simplify the present disclosure. Of course, they are merely examples and are not intended to limit the present disclosure. Furthermore, the present disclosure may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed.

The above is merely a specific embodiment of the disclosure, but the protection scope of the disclosure is not limited thereto, and any person skilled in the art can easily think of various changes or substitutions within the technical scope of the disclosure, which should be covered in the protection scope of the disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. A backlight module, comprising:

The backboard comprises a bottom wall and a first side wall which is arranged along one side edge of the bottom wall in an extending way, and the first side wall is smoothly connected with one side edge of the bottom wall through a first curved connecting wall;

The first part of the circuit board is arranged on the bottom wall, and the pre-bent part is bent and is attached to the inner side surface of the first bent connecting wall.

2. The backlight module according to claim 1, wherein the circuit board further comprises a second portion, the second portion is located at a side of the pre-bent portion away from the first portion and is connected to the pre-bent portion, the backlight assembly further comprises at least one electrostatic protection device, the at least one electrostatic protection device is disposed at the second portion, and the second portion is disposed at the first sidewall.

3. A backlight module according to claim 2, wherein the plurality of LED light sources are arranged in sequence along the first direction on the first portion, the number of the electrostatic protection devices is plural, and the plurality of the electrostatic protection devices are arranged in sequence along the first direction on the second portion.

4. A backlight module according to claim 1, wherein the inner surface of the first curved connecting wall has a radius of curvature of greater than or equal to 0.5mm.

5. A backlight module according to claim 1, wherein the thickness of the pre-curved portion is smaller than the thickness of the first portion, such that the pre-curved portion is able to bend and conform to the inner side surface of the first curved connecting wall.

6. A backlight module according to claim 5, wherein the wiring board comprises a first insulating layer, a conductive layer and a second insulating layer laminated in this order in a thickness direction, and a thickness of the second insulating layer located at the pre-bent portion is smaller than a thickness of the second insulating layer located at the first portion.

7. A backlight module according to any one of claims 1 to 6, wherein the back plate further comprises a shielding wall arranged along an edge of a side of the first side wall away from the bottom wall, the shielding wall being located on a side of the plurality of LED light sources away from the bottom wall, a gap between the shielding wall and the bottom wall being H, and a bending radius of an inner surface of the first curved connecting wall being greater than or equal to 0.5H.

8. A backlight module according to claim 7, further comprising a reflective tape attached to a surface of the shielding wall facing the LED light source.

9. The backlight module of claim 7, wherein the back plate further comprises a protective side wall extending along other edges of the bottom wall, the protective side wall is connected with the edges of the bottom wall through a second curved connecting wall, the protective side wall, the first side wall and the bottom wall enclose a groove, and the backlight module further comprises a light guide plate positioned in the groove, and the light guide plate is positioned on one side of the plurality of LED light sources far away from the first side wall.

10. The backlight module according to claim 9, wherein the second curved connecting wall has the same radius of curvature as the first curved connecting wall.

11. The backlight module according to claim 9, further comprising a reflective sheet and an optical film assembly, wherein the reflective sheet is located between the light guide plate and the bottom wall, and the optical film assembly is located on a side of the light guide plate facing away from the bottom wall.

12. A display device comprising the backlight module of any one of claims 1 to 10.