CN113899464A - Method for measuring temperature by using self characteristics of ROPUF (remote optical fiber) chip - Google Patents
Method for measuring temperature by using self characteristics of ROPUF (remote optical fiber) chip Download PDFInfo
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- CN113899464A CN113899464A CN202110992744.6A CN202110992744A CN113899464A CN 113899464 A CN113899464 A CN 113899464A CN 202110992744 A CN202110992744 A CN 202110992744A CN 113899464 A CN113899464 A CN 113899464A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/32—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using change of resonant frequency of a crystal
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K2213/00—Temperature mapping
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Abstract
The invention discloses a method for measuring temperature by utilizing the self characteristics of an ROPUF chip, which can detect the real-time temperature of the position of the ROPUF chip on line. The method realizes temperature measurement by establishing the self characteristic of the ROPUF chip, namely the linear relation between the internal oscillation frequency and the temperature. Firstly, electrifying and configuring the ROPUF chip and placing the ROPUF chip in an incubator, and measuring the oscillation frequency of an internal ring oscillator of the ROPUF chip at corresponding temperature by setting different temperatures; secondly, performing linear fitting on the relationship between the oscillation frequency and the temperature to obtain a temperature correction curve related to the oscillation frequency; then, in the actual working condition of the chip, the oscillation frequency in the ROPUF chip is collected, the frequency is substituted into the fitting result according to the temperature calibration curve obtained by fitting in the past, and the real-time temperature of the ROPUF chip is calculated. By using the method, the ROPUF chip can be used for temperature measurement, so that extra temperature monitoring load can be effectively reduced, and real-time temperature measurement can be realized.
Description
Technical Field
The ROPUF chip is mainly used for temperature measurement, the other function of the ROPUF (ring oscillator physical unclonable function) chip is realized, and the ROPUF chip belongs to the field of electronic device testing.
Background
With the rapid development of integrated circuit technology and the widespread use of biometric identification technology, the concept of Physically Unclonable Functions (PUFs) has come to light. The physical unclonable function is a security primitive, and the object faced by the physical entity is a physical entity, and the physical entity is authenticated and identified by using internal random physical characteristics. PUFs are increasingly used in cryptographic protocols and security architectures, such as key storage, hardware encryption, and login verification, which are unique to each device due to the fact that they are functions based on physical characteristics. It takes advantage of local mismatches and differences between the physical characteristics of the devices that arise during the manufacturing process to produce unpredictable outputs. The concept of a PUF is based on these random variations, which cannot be controlled during the manufacturing process, since they are generated by random and irreversible influences. Thus, it is not possible to generate two identical devices. The rogpuf (ring Oscillator Physical allowable functions) generates random output by comparing output frequencies of a ring Oscillator, and a rogpuf chip is a chip having such a function, and thus the rogpuf chip can be used for hardware encryption, key storage, and the like.
According to the Arrhenius model, the service life of the product is reduced by half when the temperature rises by 10 ℃, so that the monitoring of the temperature of the product is particularly important in the actual working condition of the product. In general, a temperature measuring module is added in a product to measure the real-time temperature of the current product. The same problem exists for the practical application of ROPUF chips, which requires attention to the actual temperature of the product. If an additional temperature measuring module is adopted, the load is inevitably increased, unnecessary resource waste is caused, and meanwhile, the additional load also generates redundant heat, so that the reliability and the service life of the product are influenced.
Disclosure of Invention
In order to solve the problems, the invention provides a method for measuring temperature by using the self characteristics of an ROPUF (ring oscillator physical unclonable function) chip, which can realize temperature measurement of the position of the ROPUF chip by using the self characteristics of the ROPUF chip without adding an additional temperature measuring module.
The technical scheme adopted by the invention is as follows:
and at different temperatures, carrying out power-on configuration on the ROPUF chip, acquiring the frequency of the current oscillation signal by using a high-precision signal oscilloscope, recording the frequency of the signal and the temperature at the moment in a one-to-one correspondence manner, and carrying out linear fitting on the data by using software such as matlab or origin and the like so as to obtain a corresponding relation between the frequency and the temperature. And then, the corresponding temperature can be obtained only by measuring the oscillation frequency inside the current ROPUF chip.
The device for realizing the method comprises a tested ROPUF chip 1, a chip configuration circuit 2, a high-precision signal oscilloscope 3 and an incubator 4; the incubator 4 is used for warming the ROPUF chip 1 and the chip configuration circuit 2, and the high-precision signal oscilloscope 3 is used for collecting the oscillation frequency of the ROPUF chip 1.
The invention also comprises the following steps:
the method comprises the following steps: the ROPUF chip 1 is powered on and configured through a chip configuration circuit 2, so that an internal oscillator generates oscillation;
step two: placing the ROPUF chip 1 and the chip configuration circuit 2 in the incubator 4, and setting the temperature of the incubator 4 to carry out temperature setting on the ROPUF chip 1;
step three: and setting the initial temperature of the incubator 4, and after the temperature of the incubator 4 is stabilized for a certain time, enabling the ROPUF chip 1 to reach the stable temperature.
Step four: when the temperature of the incubator 4 and the ROPUF chip 1 reaches a temperature balance, acquiring the oscillation frequency of the ROPUF chip 1 at the moment by using the high-precision signal oscilloscope 3 and recording the oscillation frequency;
step five: changing the temperature of the incubator 4 according to a certain step length, and repeating the frequency acquisition in the fourth step to obtain the frequency responses of the ROPUF chip 1 at different temperatures;
step six: performing linear fitting on the recorded temperature and frequency to obtain a temperature correction curve and a linear fitting type about the frequency;
step seven: and based on the linear fitting type obtained in the sixth step, acquiring the oscillation frequency of the ROPUF chip 1, and substituting the frequency into the linear fitting type to obtain the real-time temperature of the ROPUF chip 1 at the moment.
The ROPUF chip 1 is used for measuring the temperature through internal self-oscillation, real-time temperature measurement can be achieved, an additional temperature measuring module does not need to be added, and the temperature measuring function can be achieved only through the self characteristics of the ROPUF chip 1.
In the temperature setting process in the second step, the ROPUF chip 1 is allowed to reach the temperature set by the incubator after the temperature is stable enough for a period of time.
In the fourth step, when the high-precision signal oscilloscope 3 is used for collecting signals of the ROPUF chip 1, the oscillation frequency of the ring oscillator is unstable, and the oscillation signal frequency jumps in an interval. Therefore, the duration of multiple periods of the oscillation signal must be collected, wherein the duration of a single period is determined by the time between two peaks, and the average period of the oscillation signal at that time is calculated after counting the time of multiple periods, so as to obtain the oscillation frequency of the ROPUF chip 1. Wherein the relationship between the period (T) and the frequency (f) is:
and the linear fitting between the frequency and the temperature in the step six can be realized by Origin or matlab and other software, and a frequency-temperature relational expression is obtained.
And seventhly, measuring the temperature by substituting the real-time frequency of the ROPUF chip 1 into the frequency-temperature relation in the sixth step to obtain the real-time temperature of the ROPUF chip 1 at the moment.
The invention has the beneficial effects that: the method effectively utilizes the characteristics of the ROPUF chip, avoids the use of an additional temperature measurement module, and can realize temperature measurement efficiently, simply and conveniently.
Drawings
FIG. 1: the invention relates to a schematic diagram of a testing device, wherein: 1-ROPUF chip, 2-chip configuration circuit, 3-high precision signal oscilloscope and 4-incubator;
FIG. 2: a flow chart of a method to which the present invention relates;
FIG. 3: frequency-temperature calibration curve fitting graph
FIG. 4: actual measurement and fitting contrast map
Detailed Description
The present invention will be described in more detail below with reference to the accompanying drawings and specific embodiments.
The test apparatus according to the present invention is shown in fig. 1. The chip comprises an ROPUF chip 1, a chip configuration circuit 2, a high-precision signal oscilloscope 3 and an incubator 4. The high-precision signal oscilloscope 3 employs rig al DS 4024E. The incubator 4 adopts a Dongguan Bell incubator with the model of BTKS-150C.
The flow chart of the method of the invention is shown in fig. 2, and comprises the following steps:
the method comprises the following steps: the ROPUF chip is placed on a chip configuration circuit, the whole circuit is powered on, and the ROPUF chip is configured by software, so that a ring oscillator inside the ROPUF chip generates self oscillation.
Step two: and putting the ROPUF chip configuration circuit into a warm box together, and leading the oscillation signal of the ROPUF chip to an interface of a high-precision signal oscilloscope through a lead. The temperature of the incubator is set to-20 ℃, and then the temperature is increased by 10 ℃ each time until the temperature reaches 50 ℃.
Step three: when the temperature of the incubator reaches-20 ℃, the temperature inside the ROPUF chip is considered to be consistent with the incubator when the temperature is stabilized for 10 minutes. And at the moment, observing the output waveform of the high-precision signal oscilloscope, and acquiring and recording signals.
Step four: and (3) heating the incubator by 10 ℃, repeating the operation in the third step after the temperature reaches a set value, and sequentially obtaining the internal oscillation signal frequency of the ROPUF chip at-10 ℃, 0 ℃, 10 ℃, 20 ℃, … and 50 ℃.
Step five: and performing linear fitting on the frequency and the temperature to obtain a relational expression between the frequency and the temperature. When the temperature of the ROPUF chip needs to be measured, the temperature of the ROPUF chip at the moment can be obtained only by using a high-precision signal oscilloscope to collect the oscillation frequency at the moment and substituting the frequency into the previous relational expression.
Claims (6)
1. A method for measuring temperature by utilizing the self characteristics of an ROPUF chip comprises a tested ROPUF chip (1), a chip configuration circuit (2), a high-precision signal oscilloscope (3) and an incubator (4); the incubator (4) is used for warming the ROPUF chip (1) and the chip configuration circuit (2), and the high-precision signal oscilloscope (3) is used for collecting the oscillation frequency of the ROPUF chip (1); the specific implementation method comprises the following steps:
the method comprises the following steps: the ROPUF chip (1) is powered on and configured through a chip configuration circuit (2), and an internal oscillator of the ROPUF chip is made to generate oscillation;
step two: placing the ROPUF chip (1) and a chip configuration circuit (2) in the incubator (4), and carrying out temperature setting on the ROPUF chip (1) by setting the temperature of the incubator (4);
step three: setting the initial temperature of the incubator (4), and after the temperature of the incubator (4) is stabilized for a certain time, enabling the ROPUF chip (1) to reach a stable temperature.
Step four: when the temperature of the incubator (4) and the ROPUF chip (1) reach temperature balance, acquiring and recording the oscillation frequency of the ROPUF chip (1) at the moment by using the high-precision signal oscilloscope (3);
step five: changing the temperature of the incubator (4) according to a certain step length, and repeating the frequency acquisition in the fourth step to obtain the frequency response of the ROPUF chip (1) at different temperatures;
step six: performing linear fitting on the recorded temperature and frequency to obtain a temperature correction curve and a linear fitting type about the frequency;
step seven: and based on the linear fitting type obtained in the sixth step, acquiring the oscillation frequency of the ROPUF chip (1), and substituting the frequency into the linear fitting type to obtain the real-time temperature of the ROPUF chip (1) at the moment.
2. The method for measuring the temperature by using the self-characteristics of the ROPUF chip as claimed in claim 1, wherein the self-oscillation inside the ROPUF chip (1) is used for temperature sensing, and the temperature of the ROPUF chip is measured in real time without adding an additional temperature measuring module, and the temperature measuring function can be realized by using the self-characteristics of the ROPUF chip (1).
3. The method for measuring the temperature by using the characteristics of the ROPUF chip as claimed in claim 1, wherein in the temperature setting process in the second step, the ROPUF chip (1) reaches the temperature set by the incubator after the temperature is stable enough for a period of time.
4. The method for measuring the temperature by using the characteristics of the ROPUF chip as claimed in claim 1, wherein in the fourth step, when the high-precision signal oscilloscope (3) is used for acquiring the signal of the ROPUF chip (1), the oscillation frequency of the ring oscillator is unstable, and the oscillation signal frequency jumps within an interval. Therefore, the duration of a plurality of periods of the oscillation signal is acquired, wherein the duration of a single period is determined by the time between two peaks, the average period of the oscillation signal at the moment is calculated after the time of the plurality of periods is counted, and the oscillation frequency of the ROPUF chip (1) is obtained.
5. The method according to claim 1, wherein the linear fitting between the frequency and the temperature in the sixth step is implemented by software such as Origin or matlab, and a frequency-temperature relation is obtained.
6. The method for measuring the temperature by using the characteristics of the ROPUF chip as claimed in claim 1, wherein the temperature measurement in the seventh step is performed by substituting the real-time frequency of the ROPUF chip (1) into the frequency-temperature relation in the sixth step, so as to obtain the real-time temperature of the ROPUF chip (1) at the moment.
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| CN202110992744.6A CN113899464A (en) | 2021-08-27 | 2021-08-27 | Method for measuring temperature by using self characteristics of ROPUF (remote optical fiber) chip |
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| CN202110992744.6A CN113899464A (en) | 2021-08-27 | 2021-08-27 | Method for measuring temperature by using self characteristics of ROPUF (remote optical fiber) chip |
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| CN103822731A (en) * | 2014-03-06 | 2014-05-28 | 北京工业大学 | Method for testing junction temperature of VDMOS (Vertical Double Diffusion Metal Oxide Semiconductor) device |
| CN107483180A (en) * | 2017-08-21 | 2017-12-15 | 湖南大学 | A kind of high stability physics unclonable function circuit and its response production method |
| CN107621599A (en) * | 2017-08-28 | 2018-01-23 | 北京工业大学 | A kind of method of measurement IGBT variations injunction temperatures in high temperature reverse bias experiment |
| CN110412447A (en) * | 2019-07-26 | 2019-11-05 | 北京工业大学 | A kind of method of highest chip temperature and minimum chip temperature in nondestructive measurement IGBT module parallel chip |
| CN111220295A (en) * | 2018-11-26 | 2020-06-02 | 中国科学院长春光学精密机械与物理研究所 | Automatic detection equipment and measurement method for non-contact measurement of junction temperature of LED lamp |
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2021
- 2021-08-27 CN CN202110992744.6A patent/CN113899464A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102829890A (en) * | 2012-08-07 | 2012-12-19 | 陕西科技大学 | Device and method for measuring junction temperature of LED (light emitting diode) |
| CN103759846A (en) * | 2014-01-09 | 2014-04-30 | 奇瑞汽车股份有限公司 | Method for measuring internal temperature of power battery |
| CN103822731A (en) * | 2014-03-06 | 2014-05-28 | 北京工业大学 | Method for testing junction temperature of VDMOS (Vertical Double Diffusion Metal Oxide Semiconductor) device |
| CN107483180A (en) * | 2017-08-21 | 2017-12-15 | 湖南大学 | A kind of high stability physics unclonable function circuit and its response production method |
| CN107621599A (en) * | 2017-08-28 | 2018-01-23 | 北京工业大学 | A kind of method of measurement IGBT variations injunction temperatures in high temperature reverse bias experiment |
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