CN113897599A - Production process and method of chemical copper - Google Patents
Production process and method of chemical copper Download PDFInfo
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- CN113897599A CN113897599A CN202110991837.7A CN202110991837A CN113897599A CN 113897599 A CN113897599 A CN 113897599A CN 202110991837 A CN202110991837 A CN 202110991837A CN 113897599 A CN113897599 A CN 113897599A
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- copper
- citric acid
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 52
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 52
- 239000010949 copper Substances 0.000 title claims abstract description 52
- 239000000126 substance Substances 0.000 title claims abstract description 45
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims abstract description 51
- 239000008139 complexing agent Substances 0.000 claims abstract description 25
- 239000003381 stabilizer Substances 0.000 claims abstract description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 25
- 102000016938 Catalase Human genes 0.000 claims abstract description 18
- 108010053835 Catalase Proteins 0.000 claims abstract description 18
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 claims abstract description 18
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910001379 sodium hypophosphite Inorganic materials 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 13
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 claims abstract description 11
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims abstract description 11
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims abstract description 11
- 239000006179 pH buffering agent Substances 0.000 claims abstract description 10
- 239000011259 mixed solution Substances 0.000 claims description 42
- 238000003756 stirring Methods 0.000 claims description 35
- 239000000243 solution Substances 0.000 claims description 26
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 24
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 15
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 14
- 239000000203 mixture Substances 0.000 claims description 12
- DGEZNRSVGBDHLK-UHFFFAOYSA-N [1,10]phenanthroline Chemical compound C1=CN=C2C3=NC=CC=C3C=CC2=C1 DGEZNRSVGBDHLK-UHFFFAOYSA-N 0.000 claims description 10
- WSMWHQNSUCKNNV-UHFFFAOYSA-L 2-hydroxypropane-1,2,3-tricarboxylic acid nickel(2+) sulfate Chemical compound C(CC(O)(C(=O)O)CC(=O)O)(=O)O.S(=O)(=O)([O-])[O-].[Ni+2] WSMWHQNSUCKNNV-UHFFFAOYSA-L 0.000 claims description 7
- 235000019270 ammonium chloride Nutrition 0.000 claims description 7
- 229910021538 borax Inorganic materials 0.000 claims description 7
- JXRVKYBCWUJJBP-UHFFFAOYSA-L calcium;hydrogen sulfate Chemical compound [Ca+2].OS([O-])(=O)=O.OS([O-])(=O)=O JXRVKYBCWUJJBP-UHFFFAOYSA-L 0.000 claims description 7
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 claims description 7
- 229910000388 diammonium phosphate Inorganic materials 0.000 claims description 7
- 235000019838 diammonium phosphate Nutrition 0.000 claims description 7
- 239000000276 potassium ferrocyanide Substances 0.000 claims description 7
- 235000019830 sodium polyphosphate Nutrition 0.000 claims description 7
- 235000010339 sodium tetraborate Nutrition 0.000 claims description 7
- XOGGUFAVLNCTRS-UHFFFAOYSA-N tetrapotassium;iron(2+);hexacyanide Chemical compound [K+].[K+].[K+].[K+].[Fe+2].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-] XOGGUFAVLNCTRS-UHFFFAOYSA-N 0.000 claims description 7
- BSVBQGMMJUBVOD-UHFFFAOYSA-N trisodium borate Chemical compound [Na+].[Na+].[Na+].[O-]B([O-])[O-] BSVBQGMMJUBVOD-UHFFFAOYSA-N 0.000 claims description 7
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical group N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 claims description 5
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 5
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 5
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 5
- ZNCPFRVNHGOPAG-UHFFFAOYSA-L sodium oxalate Chemical compound [Na+].[Na+].[O-]C(=O)C([O-])=O ZNCPFRVNHGOPAG-UHFFFAOYSA-L 0.000 claims description 5
- 229940039790 sodium oxalate Drugs 0.000 claims description 5
- 239000011975 tartaric acid Substances 0.000 claims description 5
- 235000002906 tartaric acid Nutrition 0.000 claims description 5
- IYRGXJIJGHOCFS-UHFFFAOYSA-N neocuproine Chemical compound C1=C(C)N=C2C3=NC(C)=CC=C3C=CC2=C1 IYRGXJIJGHOCFS-UHFFFAOYSA-N 0.000 claims description 4
- 239000006174 pH buffer Substances 0.000 claims description 4
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 claims description 3
- 238000007747 plating Methods 0.000 description 13
- 239000000872 buffer Substances 0.000 description 11
- -1 2' -quinoline Chemical compound 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000002932 luster Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 238000012824 chemical production Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- RSJOBNMOMQFPKQ-UHFFFAOYSA-L copper;2,3-dihydroxybutanedioate Chemical compound [Cu+2].[O-]C(=O)C(O)C(O)C([O-])=O RSJOBNMOMQFPKQ-UHFFFAOYSA-L 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Abstract
The invention discloses a process and a method for producing chemical copper, wherein the chemical copper comprises, by weight, 30-50 parts of copper sulfate pentahydrate, 4-10 parts of sodium hypophosphite, 1-3 parts of formaldehyde, 2-6 parts of a stabilizer, 5-15 parts of a pH buffering agent, 2-6 parts of a complexing agent, 2-5 parts of a catalase nickel sulfate, 3-8 parts of citric acid and 10-20 parts of water.
Description
Technical Field
The invention relates to the technical field of chemical copper production, in particular to a production process and a method of chemical copper.
Background
The first time that electroless copper was first published in 1957 by Kahill (Cahill) as a modern electroless copper plating solution, which was an alkaline copper tartrate solution and formaldehyde as a reducing agent, was widely used in chemical production. The development of printed circuit boards at the end of the 50 s has provided a huge market for the development of electroless copper plating technology. But chemical copper technology has developed relatively slowly. The chemical deposition rate has been slow.
Generally, the higher the plating rate, the more difficult the stability is to control. The better the stability, the more difficult the plating speed is to be increased. Therefore, how to coordinate the stability and plating speed of the electroless copper plating solution and obtain the rapid and high-stability electroless copper plating solution is always the research direction in the field of electroless copper plating.
Disclosure of Invention
The present invention is directed to a process and method for producing chemical copper, which solves the above-mentioned problems of the prior art.
In order to achieve the purpose, the invention provides the following technical scheme: the chemical copper comprises, by weight, 30-50 parts of copper sulfate pentahydrate, 4-10 parts of sodium hypophosphite, 1-3 parts of formaldehyde, 2-6 parts of a stabilizer, 5-15 parts of a PH buffer, 2-6 parts of a complexing agent, 2-5 parts of a catalase nickel sulfate, 3-8 parts of citric acid and 10-20 parts of water.
Preferably, the chemical copper component preferably comprises 40 parts of copper sulfate pentahydrate, 7 parts of hypophosphorous acid, 2 parts of formaldehyde, 4 parts of stabilizer, 10 parts of pH buffer, 4 parts of complexing agent, 4 parts of catalase nickel sulfate, 5 parts of citric acid and 15 parts of water.
Preferably, the stabilizer is one or more of 2,2 '-bipyridine, potassium ferrocyanide, methanol, phenanthroline (1, 10 phenanthroline), 2' -quinoline and 2, 9-dimethyl phenanthroline.
Preferably, the PH buffering agent comprises, by weight, 30% calcium hydrogen sulfate, 10% diammonium hydrogen phosphate, 10% sodium borate solution, 30% ammonium chloride solution, and 20% sodium polyphosphate.
Preferably, the complexing agent is composed of one or more of EDTA, sodium oxalate, tartaric acid and citric acid.
Preferably, the production process and method of chemical copper comprise the following steps:
A. firstly, adding copper sulfate pentahydrate, sodium hypophosphite, formaldehyde and water into a stirring tank, and stirring at a low speed to obtain a mixed solution A;
B. adding a pH buffering agent and a complexing agent into the mixed solution A to adjust the pH value of the mixed solution A, and then standing for a period of time to obtain a mixed solution B;
C. sequentially adding a stabilizer and a catalase nickel sulfate citric acid into the mixed solution B, and fully stirring until the solution is clear to obtain a mixed solution C;
D. and (4) adding water to a constant volume to obtain the high-speed stable chemical copper.
Preferably, the stirring speed in the step A is 80-100 rpm, and the time is 8-10 min.
Preferably, the standing time in the step B is 30-40 min.
Preferably, the stirring speed in the step C is 400-600 rpm.
Compared with the prior art, the invention has the beneficial effects that: the invention has simple production process and stable chemical copper
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides the following technical scheme: the chemical copper comprises, by weight, 30-50 parts of copper sulfate pentahydrate, 4-10 parts of sodium hypophosphite, 1-3 parts of formaldehyde, 2-6 parts of a stabilizer, 5-15 parts of a PH buffer, 2-6 parts of a complexing agent, 2-5 parts of a catalase nickel sulfate, 3-8 parts of citric acid and 10-20 parts of water.
The first embodiment is as follows:
the chemical copper component comprises 30 parts of copper sulfate pentahydrate, 4 parts of sodium hypophosphite, 1 part of formaldehyde, 2 parts of stabilizer, 5 parts of PH buffer, 2 parts of complexing agent, 2 parts of catalase nickel sulfate, 3 parts of citric acid and 10 parts of water in parts by weight.
In this example, a mixture of 2, 2' -bipyridine and potassium ferrocyanide was used as the stabilizer.
In this example, the PH buffer comprises, by weight, 30% calcium hydrogen sulfate, 10% diammonium hydrogen phosphate, 10% sodium borate solution, 30% ammonium chloride solution, and 20% sodium polyphosphate.
In this embodiment, the complexing agent is composed of a mixture of EDTA and sodium oxalate.
In this embodiment, a process and a method for producing chemical copper includes the following steps:
A. firstly, adding copper sulfate pentahydrate, sodium hypophosphite, formaldehyde and water into a stirring tank, and stirring at a low speed to obtain a mixed solution A;
B. adding a pH buffering agent and a complexing agent into the mixed solution A to adjust the pH value of the mixed solution A, and then standing for a period of time to obtain a mixed solution B;
C. sequentially adding a stabilizer and a catalase nickel sulfate citric acid into the mixed solution B, and fully stirring until the solution is clear to obtain a mixed solution C;
D. and (4) adding water to a constant volume to obtain the high-speed stable chemical copper.
In this example, the stirring speed in step A was 80 rpm for 8 min.
In this example, the standing time in step B was 30 min.
In this example, the stirring rate in step C was 400 rpm.
Example two:
the chemical copper component comprises 50 parts of copper sulfate pentahydrate, 10 parts of sodium hypophosphite, 3 parts of formaldehyde, 6 parts of stabilizer, 15 parts of PH buffer, 6 parts of complexing agent, 5 parts of catalase nickel sulfate, 8 parts of citric acid and 20 parts of water in parts by weight.
In this example, a mixture of 2, 2' -bipyridine, potassium ferrocyanide and methanol was used as the stabilizer.
In this example, the PH buffer comprises, by weight, 30% calcium hydrogen sulfate, 10% diammonium hydrogen phosphate, 10% sodium borate solution, 30% ammonium chloride solution, and 20% sodium polyphosphate.
In this example, the complexing agent consists of a mixture of tartaric acid and citric acid.
In this embodiment, a process and a method for producing chemical copper includes the following steps:
A. firstly, adding copper sulfate pentahydrate, sodium hypophosphite, formaldehyde and water into a stirring tank, and stirring at a low speed to obtain a mixed solution A;
B. adding a pH buffering agent and a complexing agent into the mixed solution A to adjust the pH value of the mixed solution A, and then standing for a period of time to obtain a mixed solution B;
C. sequentially adding a stabilizer and a catalase nickel sulfate citric acid into the mixed solution B, and fully stirring until the solution is clear to obtain a mixed solution C;
D. and (4) adding water to a constant volume to obtain the high-speed stable chemical copper.
In this example, the stirring speed in step A was 100 rpm for 10 min.
In this example, the standing time in step B was 40 min.
In this example, the stirring rate in step C was 600 rpm.
Example three:
the chemical copper component comprises 35 parts of copper sulfate pentahydrate, 5 parts of sodium hypophosphite, 2 parts of formaldehyde, 3 parts of stabilizer, 7 parts of PH buffer, 3 parts of complexing agent, 3 parts of catalase nickel sulfate, 4 parts of citric acid and 12 parts of water in parts by weight.
In this example, potassium ferrocyanide, methanol, phenanthroline (1, 10-phenanthroline), or a mixture is used as the stabilizer.
In this example, the PH buffer comprises, by weight, 30% calcium hydrogen sulfate, 10% diammonium hydrogen phosphate, 10% sodium borate solution, 30% ammonium chloride solution, and 20% sodium polyphosphate.
In this example, the complexing agent consists of a mixture of EDTA and citric acid.
In this embodiment, a process and a method for producing chemical copper includes the following steps:
A. firstly, adding copper sulfate pentahydrate, sodium hypophosphite, formaldehyde and water into a stirring tank, and stirring at a low speed to obtain a mixed solution A;
B. adding a pH buffering agent and a complexing agent into the mixed solution A to adjust the pH value of the mixed solution A, and then standing for a period of time to obtain a mixed solution B;
C. sequentially adding a stabilizer and a catalase nickel sulfate citric acid into the mixed solution B, and fully stirring until the solution is clear to obtain a mixed solution C;
D. and (4) adding water to a constant volume to obtain the high-speed stable chemical copper.
In this example, the stirring speed in step A was 95 rpm for 8 min.
In this example, the standing time in step B was 37 min.
In this example, the stirring rate in step C was 450 rpm.
Example four:
the chemical copper component comprises 45 parts of copper sulfate pentahydrate, 8 parts of sodium hypophosphite, 2 parts of formaldehyde, 5 parts of stabilizer, 12 parts of PH buffer, 5 parts of complexing agent, 4 parts of catalase nickel sulfate, 7 parts of citric acid and 18 parts of water according to parts by weight.
In this example, the stabilizer is a mixture of potassium ferrocyanide, phenanthroline (1, 10-phenanthroline), 2' -quinoline, and 2, 9-dimethyl phenanthroline.
In this example, the PH buffer comprises, by weight, 30% calcium hydrogen sulfate, 10% diammonium hydrogen phosphate, 10% sodium borate solution, 30% ammonium chloride solution, and 20% sodium polyphosphate.
In this embodiment, the complexing agent is composed of a mixture of sodium oxalate, tartaric acid, and citric acid.
In this embodiment, a process and a method for producing chemical copper includes the following steps:
A. firstly, adding copper sulfate pentahydrate, sodium hypophosphite, formaldehyde and water into a stirring tank, and stirring at a low speed to obtain a mixed solution A;
B. adding a pH buffering agent and a complexing agent into the mixed solution A to adjust the pH value of the mixed solution A, and then standing for a period of time to obtain a mixed solution B;
C. sequentially adding a stabilizer and a catalase nickel sulfate citric acid into the mixed solution B, and fully stirring until the solution is clear to obtain a mixed solution C;
D. and (4) adding water to a constant volume to obtain the high-speed stable chemical copper.
In this example, the stirring speed in step A was 92 rpm for 9 min.
In this example, the standing time in step B was 36 min.
In this example, the stirring rate in step C was 480 rpm.
Example five:
the chemical copper component comprises, by weight, 40 parts of copper sulfate pentahydrate, 7 parts of hypophosphorous acid, 2 parts of formaldehyde, 4 parts of a stabilizer, 10 parts of a pH buffer, 4 parts of a complexing agent, 4 parts of a catalase nickel sulfate, 5 parts of citric acid and 15 parts of water.
In this example, the stabilizer is a mixture of 2,2 '-bipyridine, potassium ferrocyanide, methanol, phenanthroline (1, 10-phenanthroline), 2' -quinoline, and 2, 9-dimethyl phenanthroline.
In this example, the PH buffer comprises, by weight, 30% calcium hydrogen sulfate, 10% diammonium hydrogen phosphate, 10% sodium borate solution, 30% ammonium chloride solution, and 20% sodium polyphosphate.
In this embodiment, the complexing agent is composed of a mixture of EDTA, sodium oxalate, tartaric acid, and citric acid.
In this embodiment, a process and a method for producing chemical copper includes the following steps:
A. firstly, adding copper sulfate pentahydrate, sodium hypophosphite, formaldehyde and water into a stirring tank, and stirring at a low speed to obtain a mixed solution A;
B. adding a pH buffering agent and a complexing agent into the mixed solution A to adjust the pH value of the mixed solution A, and then standing for a period of time to obtain a mixed solution B;
C. sequentially adding a stabilizer and a catalase nickel sulfate citric acid into the mixed solution B, and fully stirring until the solution is clear to obtain a mixed solution C;
D. and (4) adding water to a constant volume to obtain the high-speed stable chemical copper.
In this example, the stirring speed in step A was 90 rpm for 9 min.
In this example, the standing time in step B was 35 min.
In this example, the stirring rate in step C was 500 rpm.
Experimental example:
the chemical copper prepared by the embodiments of the invention is used for plating experiments, and the obtained data is as follows:
| plating speed (um/h) | Quality of coating surface | |
| Example one | 20.2 | Level and bright |
| Example two | 21.2 | Level and bright |
| EXAMPLE III | 21.4 | Level and bright |
| Example four | 20.4 | Level and bright |
| EXAMPLE five | 20.5 | Level and bright |
In conclusion, the production process is simple, the chemical copper has good stability, and the plated coating has bright appearance and luster, metallic luster and little impurity content, and can accelerate the plating speed and further improve the production efficiency; the chemical copper of the invention is stable, the copper plating layer is flat and uniform, and the requirements of functional chemical copper plating are met.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. Chemical copper, characterized in that: the chemical copper component comprises, by weight, 30-50 parts of copper sulfate pentahydrate, 4-10 parts of sodium hypophosphite, 1-3 parts of formaldehyde, 2-6 parts of a stabilizer, 5-15 parts of a pH buffer, 2-6 parts of a complexing agent, 2-5 parts of a catalase nickel sulfate, 3-8 parts of citric acid and 10-20 parts of water.
2. A chemical copper according to claim 1, wherein: the preferable component proportion of the chemical copper component comprises 40 parts of copper sulfate pentahydrate, 7 parts of hypophosphorous acid, 2 parts of formaldehyde, 4 parts of stabilizing agent, 10 parts of PH buffering agent, 4 parts of complexing agent, 4 parts of catalase nickel sulfate, 5 parts of citric acid and 15 parts of water.
3. A chemical copper according to claim 1, wherein: the stabilizer is one or a mixture of 2,2 '-bipyridyl, potassium ferrocyanide, methanol, phenanthroline (1, 10 phenanthroline), 2' -quinoline and 2, 9-dimethyl phenanthroline.
4. A chemical copper according to claim 1, wherein: the pH buffer comprises 30% of calcium hydrogen sulfate, 10% of diammonium hydrogen phosphate, 10% of sodium borate solution, 30% of ammonium chloride solution and 20% of sodium polyphosphate according to weight proportion.
5. A chemical copper according to claim 1, wherein: the complexing agent is composed of one or a mixture of more of EDTA, sodium oxalate, tartaric acid and citric acid.
6. A production process and a method of chemical copper are characterized in that: the method comprises the following steps:
A. firstly, adding copper sulfate pentahydrate, sodium hypophosphite, formaldehyde and water into a stirring tank, and stirring at a low speed to obtain a mixed solution A;
B. adding a PH buffering agent and a complexing agent into the mixed solution A to adjust the PH value of the mixed solution A, and then standing for a period of time to obtain a mixed solution B;
C. sequentially adding a stabilizer and a catalase nickel sulfate citric acid into the mixed solution B, and fully stirring until the solution is clear to obtain a mixed solution C;
D. and (4) adding water to a constant volume to obtain the high-speed stable chemical copper.
7. The process and method for producing chemical copper according to claim 6, wherein: in the step A, the stirring speed is 80-100 rpm, and the time is 8-10 min.
8. The process and method for producing chemical copper according to claim 6, wherein: and the standing time in the step B is 30-40 min.
9. The process and method for producing chemical copper according to claim 6, wherein: the stirring speed in the step C is 400-600 rpm.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114774899A (en) * | 2022-04-28 | 2022-07-22 | 合肥工业大学 | Copper nanocrystalline thin film material and preparation method and application thereof |
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| CN108165959A (en) * | 2018-01-24 | 2018-06-15 | 永星化工(上海)有限公司 | Chemical bronze plating liquid |
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| CN102534583A (en) * | 2010-12-08 | 2012-07-04 | 比亚迪股份有限公司 | Chemical copper-plating solution and chemical copper-plating method |
| CN104651814A (en) * | 2014-11-28 | 2015-05-27 | 广东致卓精密金属科技有限公司 | Chemical copper plating solution and chemical copper plating method |
| CN108165959A (en) * | 2018-01-24 | 2018-06-15 | 永星化工(上海)有限公司 | Chemical bronze plating liquid |
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