CN113889326A - Circuit board implanted magnetic powder molded inductor and preparation method thereof - Google Patents
Circuit board implanted magnetic powder molded inductor and preparation method thereof Download PDFInfo
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- CN113889326A CN113889326A CN202111166503.2A CN202111166503A CN113889326A CN 113889326 A CN113889326 A CN 113889326A CN 202111166503 A CN202111166503 A CN 202111166503A CN 113889326 A CN113889326 A CN 113889326A
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- circuit board
- pedestal
- magnetic powder
- base
- inductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/0206—Manufacturing of magnetic cores by mechanical means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
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Abstract
The invention provides a circuit board implanted magnetic powder molded inductor and a preparation method thereof, wherein the circuit board implanted magnetic powder molded inductor comprises the following steps: the circuit board is printed with an annular inductance coil, the center of the annular inductance coil is provided with a hollow area, and a through hole is formed in the circuit board corresponding to the hollow area; the first seat body is formed by magnetic powder die-casting, and a first groove is formed in the first seat body; the second pedestal, the second pedestal is the die-casting of magnetic powder, and one side towards the first pedestal of second pedestal is equipped with a protruding magnetic core corresponding to through-hole and first recess, and first pedestal lid is located first pedestal top, and the circuit board sets up between first pedestal and second pedestal, and protruding magnetic core passes through the through-hole in proper order and the hollow region is located in the first recess card. The beneficial effects are that need not to carry out secondary die-casting to annular inductance coils, reduced the requirement to the shaping technique, effectively promote the inductance yields and effectively promote preparation efficiency.
Description
Technical Field
The invention relates to the technical field of inductor preparation, in particular to a circuit board implanted magnetic powder molded inductor and a preparation method thereof.
Background
The integrated inductor can be used in most of electronic products, and the electronic products can not be easily damaged due to current problems only when the inductor is installed. With the development of the inductor industry, the manufacturing technology and the research and development technology are continuously improved, the inductor products are also continuously improved, upgraded and updated, the integrally formed inductor is a novel product which is updated and updated, the application range is wider, and the integrally formed inductor is accepted by the market.
The existing integrated into one piece inductance includes pedestal and winding, and the pedestal needs to bury the winding body and the people magnetic powder is interior pressure cast and is formed, and is very high to the shaping technical requirement: if the pressure of the forming machine is too high, the coil is damaged, the product is easy to crack, and if the pressure is too low, the product is not full enough, and the strength of the product cannot be achieved.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a circuit board implanted magnetic powder molding inductor, which comprises:
the circuit board is printed with an annular inductance coil, the center of the annular inductance coil is provided with a hollow area, and a through hole is formed in the circuit board corresponding to the hollow area;
the first seat body is formed by magnetic powder die-casting, and a first groove is formed in the first seat body;
the second pedestal, the second pedestal is the magnetic powder die-casting shaping, the orientation of second pedestal one side of first pedestal is equipped with corresponding to the through-hole with a protruding magnetic core of first recess, first pedestal lid is located first pedestal top, the circuit board set up in first pedestal with between the second pedestal, just protruding magnetic core passes in proper order the through-hole with hollow region is located and the card is located in the first recess.
Preferably, the annular inductance coil is formed by winding and printing at least one conducting wire on a plane of the circuit board.
Preferably, the number of the conducting wires is two, and the two conducting wires are wound and printed side by side to form the annular inductance coil.
Preferably, the two wires form different inductances.
Preferably, the annular inductance coil has a first outgoing line end and a second outgoing line end, and the first outgoing line end and the second outgoing line end are led out of the first base body and the second base body by the circuit board.
Preferably, the first seat body is provided with lead grooves respectively corresponding to the first lead-out wire end and the second lead-out wire end, and/or the second seat body is provided with lead grooves respectively corresponding to the first lead-out wire end and the second lead-out wire end.
Preferably, at least one positioning hole is arranged on the circuit board in a penetrating way,
a positioning column corresponding to the positioning hole is arranged on the first seat body, and a positioning groove corresponding to the positioning column is arranged on one side of the second seat body facing the first seat body; or
The second seat body is provided with a positioning column corresponding to the positioning hole, and one side of the first seat body facing the second seat body is provided with a positioning groove corresponding to the positioning column.
Preferably, the first base body or the second base body is provided with a receiving groove for placing the circuit board.
The invention also provides a preparation method of the circuit board implanted magnetic powder molded inductor, which is used for preparing the circuit board implanted magnetic powder molded inductor and comprises the following steps:
step S1, preparing a first base and a second base respectively, and printing on a circuit board to form a ring-shaped inductance coil;
step S2, assembling the circuit board printed with the annular inductance coil, so that the circuit board is clamped between the first seat and the second seat;
step S3, adding glue at the joint of the first base and the second base and then curing to obtain the circuit board embedded magnetic powder molded inductor.
Preferably, in step S1, the first seat body and the second seat body are prepared by die-casting and baking magnetic powder and resin particles.
The technical scheme has the following advantages or beneficial effects: through printing annular inductance coils on the circuit board to and die-casting shaping preparation in advance obtains first pedestal and the second pedestal that can hold the circuit board, make in the inductance preparation process, with circuit board, first pedestal and second pedestal carry out simple equipment can, need not to carry out secondary die-casting to annular inductance coils, reduced the requirement to molding technique, effectively promote the inductance yields and effectively promote preparation efficiency.
Drawings
Fig. 1 is a schematic structural diagram of an inductor formed by implanting magnetic powder into a circuit board according to a preferred embodiment of the present invention;
fig. 2 is a schematic structural diagram of an inductor formed by implanting magnetic powder into a circuit board according to a preferred embodiment of the present invention;
FIG. 3 is a schematic diagram of a toroidal inductor formed by winding two wires side by side according to a preferred embodiment of the present invention;
fig. 4 is a schematic flow chart of a method for manufacturing an inductor by implanting magnetic powder into a circuit board according to a preferred embodiment of the invention.
Detailed Description
The invention is described in detail below with reference to the figures and specific embodiments. The present invention is not limited to the embodiment, and other embodiments may be included in the scope of the present invention as long as the gist of the present invention is satisfied.
In a preferred embodiment of the present invention, based on the above problems in the prior art, there is provided an inductor formed by implanting magnetic powder into a circuit board, as shown in fig. 1 to 3, including:
the circuit board comprises a circuit board 1, wherein a ring-shaped inductance coil 11 is printed on the circuit board 1, the center of the ring-shaped inductance coil 11 is provided with a hollow area, and a through hole 12 is arranged in the circuit board 1 corresponding to the hollow area;
the first seat body 2, the first seat body 2 is formed by magnetic powder die-casting, and a first groove 21 is arranged on the first seat body 2;
the second pedestal 3, the second pedestal 3 is the magnetic powder die-casting shaping, and one side towards the first pedestal 2 of second pedestal 3 is equipped with a protruding magnetic core 31 corresponding to through-hole and first recess 21, and first pedestal 3 lid is located first pedestal 2 top, and circuit board 1 sets up between first pedestal 2 and second pedestal 3, and protruding magnetic core 31 passes through-hole 12 and hollow region in proper order and the card is located in first recess 21.
Specifically, in the present embodiment, a loop inductance coil 11 is printed on the circuit board 1 by a circuit printing method, a hollow area is left in the center of the loop inductance coil 11 for the magnetic core to pass through, since the loop inductance coil 11 is printed on the circuit board 1, a through hole 12 needs to be opened in the center of the circuit board 1 as a carrier of the loop inductance coil 11, the through hole 12 corresponds to the hollow area, and preferably, the through hole 12 and the hollow area are concentric circles and have the same radius.
Further, the first seat body 2 and the second seat body 3 prepared in advance are fixing components of the circuit board 1 carrying the toroidal inductor 11, the first seat body 2 and the second seat body 3 are oppositely arranged and cover to form a closed space, and the circuit board 1 is assembled in the closed space. Wherein, a protruding magnetic core 31 is provided on the second seat 3, the circuit board 1 is sleeved on the protruding magnetic core 31 through the through hole 12, so that the protruding magnetic core 31 passes through the annular inductance coil 11 and the central axis of the protruding magnetic core 31 is perpendicular to the plane of the annular inductance coil 11. Correspondingly, the first groove 21 capable of accommodating one end of the convex magnetic core 31 far away from the second seat 3 is arranged on one side of the first seat 2 facing the second seat 3, so that the placing stability of the circuit board 1 is further ensured.
Furthermore, the first base body 2 and the second base body 3 are prepared in advance through magnetic powder die-casting molding, when the circuit board is implanted with magnetic powder molding inductance, a plurality of groups of the first base body 2 and the second base body 3 can be prepared in advance, and meanwhile, the circuit board 1 is printed to form the annular inductance coil 11, and then the annular inductance coil is assembled without secondary die-casting, so that the requirement on the molding technology is reduced, the inductance yield is effectively improved, and the preparation efficiency is effectively improved.
In the preferred embodiment of the present invention, the toroidal inductor 11 is formed by winding and printing at least one conductive wire on a plane of the circuit board 1.
In the preferred embodiment of the present invention, two wires are used, and the two wires are printed side by side to form the toroidal inductor 11.
In the preferred embodiment of the present invention, the two conductive lines form different inductance values.
Specifically, in this embodiment, the number of the wires can be configured as required, and each wire forms different inductance values, that is, different inductance values can be obtained by connecting the corresponding outgoing line end, so that different scene requirements can be met by one-time preparation.
In the preferred embodiment of the present invention, the annular inductor 11 has a first outgoing line terminal 111 and a second outgoing line terminal 112, and the first outgoing line terminal 111 and the second outgoing line terminal 112 are led out of the first base body 2 and the second base body 3 through the circuit board.
In a preferred embodiment of the present invention, the first base 2 is provided with a lead groove 100 corresponding to the first lead terminal 111 and the second lead terminal 112, respectively, and/or the second base 3 is provided with a lead groove 113 corresponding to the first lead terminal 111 and the second lead terminal 112, respectively.
In the preferred embodiment of the present invention, at least one positioning hole 13 is formed on the circuit board 1,
a positioning column 200 corresponding to the positioning hole 13 is disposed on the first seat 2, and a positioning groove 300 corresponding to the positioning column 200 is disposed on one side of the second seat 3 facing the first seat 2; or
The second seat 3 is provided with a positioning column 200 corresponding to the positioning hole 13, and one side of the first seat 2 facing the second seat 3 is provided with a positioning groove 300 corresponding to the positioning column 200.
Specifically, in this embodiment, through setting up locating hole 13 and making things convenient for placing of circuit board 1, when avoiding placing the position deviation, when first pedestal 2 and second pedestal 3 block each other, reference column 200 blocks locates in corresponding constant head tank 300, further promotes circuit board 1's the stability of placing.
In a preferred embodiment of the present invention, the first seat 2 or the second seat 3 is provided with a receiving groove 400 for placing the circuit board 1.
The invention also provides a preparation method of the circuit board implanted magnetic powder molded inductor, which is used for preparing the circuit board implanted magnetic powder molded inductor and comprises the following steps of:
step S1, preparing a first base and a second base respectively, and printing on a circuit board to form a ring-shaped inductance coil;
step S2, assembling the circuit board printed with the annular inductance coil, and enabling the circuit board to be clamped between the first seat body and the second seat body;
step S3, glue is added to the joint of the first base and the second base and then cured to obtain the molded inductor with circuit board implanted with magnetic powder.
In a preferred embodiment of the present invention, in step S1, the first seat and the second seat are prepared by die-casting and baking the magnetic powder and the resin particles.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (10)
1. The utility model provides a circuit board implantation magnetic powder shaping inductance which characterized in that includes:
the circuit board is printed with an annular inductance coil, the center of the annular inductance coil is provided with a hollow area, and a through hole is formed in the circuit board corresponding to the hollow area;
the first seat body is formed by magnetic powder die-casting, and a first groove is formed in the first seat body;
the second pedestal, the second pedestal is the magnetic powder die-casting shaping, the orientation of second pedestal one side of first pedestal is equipped with corresponding to the through-hole with a protruding magnetic core of first recess, first pedestal lid is located first pedestal top, the circuit board set up in first pedestal with between the second pedestal, just protruding magnetic core passes in proper order the through-hole with hollow region is located and the card is located in the first recess.
2. The inductor according to claim 1, wherein the annular inductor coil is formed by winding and printing at least one wire on a plane of the circuit board.
3. The inductor according to claim 2, wherein the number of the two wires is two, and the two wires are printed side by side to form the annular inductor coil.
4. The inductor according to claim 3, wherein the two wires form different inductance.
5. The inductor according to claim 1, wherein the annular inductor coil has a first outlet terminal and a second outlet terminal, and the first outlet terminal and the second outlet terminal are led out of the first base and the second base from the circuit board.
6. The inductor according to claim 5, wherein the first base has lead grooves corresponding to the first and second lead terminals, respectively, and/or the second base has lead grooves corresponding to the first and second lead terminals, respectively.
7. The inductor according to claim 1, wherein at least one positioning hole is formed through the circuit board,
a positioning column corresponding to the positioning hole is arranged on the first seat body, and a positioning groove corresponding to the positioning column is arranged on one side of the second seat body facing the first seat body; or
The second seat body is provided with a positioning column corresponding to the positioning hole, and one side of the first seat body facing the second seat body is provided with a positioning groove corresponding to the positioning column.
8. The inductor according to claim 1, wherein the first base or the second base has a receiving groove for receiving the circuit board.
9. A method for manufacturing a circuit board embedded magnetic powder molded inductor, which is used for manufacturing the circuit board embedded magnetic powder molded inductor according to any one of claims 1-8, the method comprising:
step S1, preparing a first base and a second base respectively, and printing on a circuit board to form a ring-shaped inductance coil;
step S2, assembling the circuit board printed with the annular inductance coil, so that the circuit board is clamped between the first seat and the second seat;
step S3, adding glue at the joint of the first base and the second base and then curing to obtain the circuit board embedded magnetic powder molded inductor.
10. The method for manufacturing an inductor by implanting magnetic powder into a circuit board according to claim 9, wherein in step S1, the first base and the second base are manufactured by molding magnetic powder and resin particles by die casting and baking.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111166503.2A CN113889326A (en) | 2021-09-30 | 2021-09-30 | Circuit board implanted magnetic powder molded inductor and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111166503.2A CN113889326A (en) | 2021-09-30 | 2021-09-30 | Circuit board implanted magnetic powder molded inductor and preparation method thereof |
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| Publication Number | Publication Date |
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| CN113889326A true CN113889326A (en) | 2022-01-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111166503.2A Pending CN113889326A (en) | 2021-09-30 | 2021-09-30 | Circuit board implanted magnetic powder molded inductor and preparation method thereof |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200986841Y (en) * | 2006-12-22 | 2007-12-05 | 联振电子(深圳)有限公司 | Choke coil |
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2021
- 2021-09-30 CN CN202111166503.2A patent/CN113889326A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200986841Y (en) * | 2006-12-22 | 2007-12-05 | 联振电子(深圳)有限公司 | Choke coil |
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